US Pat. No. 9,288,936

SHIELD CASE AND ANTENNA SET COMPRISING IT

LG INNOTEK CO., LTD., Se...

1. A shield case comprising:
a shield surface configured to shield electronic components which are disposed on a substrate;
a first antenna portion extended from a first corner of the shield surface; and
a second antenna portion extended from a second corner of the shield surface,
wherein each of the first and second antenna portions is positioned perpendicular to the shield surface,
wherein the first and second antenna portions face each other, and
wherein a first feeding point is disposed on a first connection portion where the shield surface and the first antenna portion
are connected, and a second feeding point is disposed on a second connection portion where the shield surface and the second
antenna portion are connected.

US Pat. No. 9,241,105

CAMERA MODULE AND METHOD FOR DRIVING THE SAME

LG INNOTEK CO., LTD., Se...

1. A method for controlling a camera module, the method comprising:
displaying a preview image obtained by the camera module on a display;
receiving at least first and second touch inputs on the preview image on the display;
determining an average luminance of a first luminance at a first area receiving the first touch input and a second luminance
at a second area receiving the second touch input; and

obtaining an image having the average luminance by the camera module.

US Pat. No. 9,244,209

DISPLAY DEVICE

LG INNOTEK CO., LTD., Se...

1. A display device comprising:
a circuit substrate;
a plurality of light sources electrically connected to the circuit substrate;
a light conversion member disposed on light emitting surfaces of the light sources and a side of the circuit substrate and
separated from the light sources, the light conversion member converting a wavelength of lights emitted from the light sources;

a light guide plate disposed at a front side of the light conversion member;
a first adhesion layer in direct physical contact with the light conversion member and the light guide plate; and
a second adhesion layer in direct physical contact with the light sources and the light conversion member,
wherein the first adhesion layer and the second adhesion layer each has a refractive index of from about 1.1 to about 1.6.

US Pat. No. 9,281,341

LIGHT EMITTING DEVICE AND FABRICATING METHOD THEREOF

LG INNOTEK CO., LTD., Se...

1. A light emitting device, comprising:
a bonding layer disposed on a support substrate;
an insulating layer having a first portion disposed at one side on the bonding layer;
a transistor unit disposed on the first portion of the insulating layer;
a light emitting device unit disposed at the other side on the bonding layer and including a first conductivity-type semiconductor
layer, an active layer and a second conductivity-type semiconductor layer, the light emitting device unit and the transistor
unit being isolated from each other in a first direction by a second portion of the insulating layer disposed between the
transistor unit and the light emitting device unit; and

at least one channel layer comprising first and second parts,
wherein the first part of the channel layer is disposed between the bonding layer and the second portion of the insulating
layer and between the bonding layer and the light emitting device in a second direction substantially perpendicular to the
first direction,

wherein the first art of the channel layer has a to surface located below a bottom surface of the light emitting device, and
wherein the second part of the channel layer is disposed between the bonding layer and the light emitting device unit in the
second direction.

US Pat. No. 9,445,500

EPOXY RESIN COMPOSITION AND PRINTED CIRCUIT BOARD USING SAME

LG INNOTEK CO., LTD., Se...

9. A printed circuit board comprising:
a metal plate;
an insulating layer formed on the metal plate; and
a circuit pattern formed on the insulating layer,
wherein the insulating layer is made of the epoxy resin composition defined in claim 1.

US Pat. No. 9,462,686

PRINTED CIRCUIT BOARD

LG INNOTEK CO., LTD., Se...

1. A printed circuit board, comprising:
a supporting substrate including a first region and a second region extending to be bent from the first region;
an insulating substrate on the supporting substrate;
a bending portion between the first region and the second region; and
an adhesive layer between the supporting substrate and the insulating substrate except for the bending portion;
wherein the insulation substrate has wrinkles in a region corresponding to the bending portion, and the wrinkles are received
in the bending portion.

US Pat. No. 9,257,626

LIGHT EMITTING DEVICE PACKAGE

LG Innotek Co., Ltd., Se...

21. A light emitting device package comprising:
a package body having a cavity composed of a side surface and a bottom, wherein the package body has a structure in which
a plurality of layers is laminated and the cavity is formed by the plurality of layers;

a heat radiating member disposed under the cavity of the package body;
a light emitting device disposed on the heat radiating member;
a bonding member disposed between the light emitting device and the heat radiating member;
a bonding member fixing layer disposed in the cavity and covering a side surfaces of the bonding member and the light emitting
device;

a connecting electrode disposed on one layer of the plurality of layers which is placed under the light emitting device and
electrically connecting to the heat radiating member;

an electrode layer disposed under the package body; and
a via contact passing through at least one of the plurality of layers and connecting the connecting electrode to the electrode
layer.

US Pat. No. 9,274,634

TOUCH PANEL

LG INNOTEK CO., LTD., Se...

1. A touch panel comprising:
a substrate including a view area and a dead area;
a bridge electrode on the view area of the substrate;
a print part on the dead area of the substrate;
a wire electrode formed on the printed part to make direct contact with the print part; and
a first insulation pattern on the bridge electrode and a second insulation pattern on the wire electrode,
wherein the first insulation pattern and the second insulation pattern are physically separated from each other, and
wherein the second insulation pattern makes direct contact with the print part.

US Pat. No. 9,281,448

LIGHT EMITTING APPARATUS

LG Innotek Co., Ltd., Se...

1. A light emitting device comprising:
a conductive support substrate;
a metal layer including a recess and on the conductive support substrate;
a light emitting structure layer on the metal layer;
a protection layer provided at a periphery of the conductive support substrate, and a portion of the protection layer is provided
between the metal layer and the light emitting structure layer; and

an electrode structure at least partially overlapping the protection layer and disposed on the light emitting structure layer,
wherein the electrode structure includes:
an outer electrode including a first part and a second part,
an inner electrode provided in a region between the first part and the second part of the outer electrode and extending to
electrically connect the first part of the outer electrode with the second part of the outer electrode, and

a pad electrically connected to at least one of the first part or the second part of the outer electrode,
wherein the outer electrode includes an outer side surface and an inner side surface with a width between the outer side surface
and the inner side surface,

wherein the outer side surface of the outer electrode is spaced apart from an outermost side of a top of the light emitting
structure layer,

wherein a first spaced distance of the outer side surface of the outer electrode is within 50 ?m from the outermost side of
the top of the light emitting structure layer, and

wherein the portion of the protection layer is interdisposed between the metal layer and the light emitting structure layer.

US Pat. No. 9,261,243

LIGHT EMITTING APPARATUS AND LIGHT EMITTING UNIT

LG INNOTEK CO., LTD., Se...

1. A light emitting unit comprising:
a first cover;
a second cover coupled to the first cover;
a light emitting module comprising a circuit board and a light emitting diode on the circuit board; and
a plurality of radiation pads disposed on the light emitting module;
wherein the first cover includes a support extending from an inner surface of the first cover,
wherein a bottom surface of the support is disposed on a top surface of the circuit board,
wherein the radiation pads comprise at least two radiation plates, and
wherein the at least two radiation plates are in contact with an inner circumference of the first cover.

US Pat. No. 9,252,112

SEMICONDUCTOR PACKAGE

LG INNOTEK CO., LTD., Se...

1. A semiconductor package, comprising:
a lower package to which a lower element is mounted and including a first seed pattern portion;
a second seed pattern portion formed on the first seed pattern portion;
a metal post connected to the lower package through the second seed pattern portion and including at least one metal material
portion; and

an upper package to which an upper element is mounted, and which is connected to the metal post via a solder ball;
wherein the second seed pattern portion is in direct physical contact with a side surface of the metal post.

US Pat. No. 9,064,773

LIGHT EMITTING DEVICE PACKAGE

LG INNOTEK CO., LTD., Se...

1. A light emitting device package comprising:
a package body having a top-opened cavity disposed in at least a portion thereof;
a first electrode layer electrically isolated from the package body with an insulating layer interposed between the first
electrode layer and package body, and a second electrode layer electrically isolated from the package body with the insulating
layer interposed between the second electrode layer and package body, the first electrode layer and the second electrode layer
being electrically isolated from each other at a bottom surface of the cavity;

a light emitting device placed on the bottom surface of the cavity configured to emit light through the open region of the
cavity; and

a photo sensor placed on at least a portion of the package body at the outside of the cavity configured to measure output
of the light emitting device,

wherein the photo sensor includes:
a photo sensor body;
a first insulating film;
a second insulating film placed on a first surface and a second surface of the photo sensor body; and
a third electrode layer,
wherein the third electrode layer includes a plurality of facing lines, the plurality of facing lines connected to one another
via a plurality of connectors, and

wherein the plurality of connectors are alternately located at both ends of the facing lines.

US Pat. No. 9,246,058

LIGHT EMITTING DEVICE

LG INNOTEK CO., LTD., Se...

1. A light emitting device comprising:
a first conductive semiconductor layer;
an AlxInyGa1-x-yN layer (0
an active layer on the AlxInyGa1-x-yN layer; and

a second conductive semiconductor layer on the active layer,
wherein the AlxInyGa1-x-yN layer has a lattice constant greater than a lattice constant of the first conductive semiconductor layer, and

wherein bandgap energy of the AlxInyGa1-x-yN layer is higher than bandgap energy of the active layer by 120 meV or more.

US Pat. No. 9,445,481

POWER SUPPLY DEVICE FOR LED AND LIGHT EMITTING DEVICE HAVING THE SAME

LG INNOTEK CO., LTD., Se...

1. A power supply device comprising:
a wired controller receiving AC power to generate a driving voltage, and outputting a lighting driving signal;
a wireless controller wirelessly receiving a lighting control signal and outputting the lighting control signal to the wired
controller; and

a standby power supply unit supplying the AC power to an AC/DC rectifying unit of the wired controller; wherein the standby
power supply unit receives a reference standby voltage based on the driving voltage from the wired controller, stores the
reference standby voltage in a capacitor, and supplies the reference standby voltage to the wireless controller as standby
power through a power control unit;

wherein the standby power supply unit comprises:
a switching unit supplying the reference standby voltage according to a switching signal that is transmitted from the wireless
controller; and

wherein the capacitor is charged with the reference standby voltage and is discharged by supplying the reference standby voltage
to the wireless controller;

wherein the switching unit comprises a first switch supplying the AC power to the wired controller, and a second switch supplying
the reference standby voltage to the capacitor;

wherein when a lighting unit is turned off and a voltage level of the capacitor is greater than a first reference voltage
and the capacitor is fully charged, the first switch and the second switch are turned off;

wherein when the lighting unit is turned on and the capacitor is in a discharge state, the first switch and the second switch
are turned on; and

wherein when the lighting unit is turned off and the capacitor is not charged and a voltage level of the capacitor is lower
than a second reference voltage, the first switch and the second switch are turned on.

US Pat. No. 9,265,161

METHOD OF MANUFACTURING AN EMBEDDED PRINTED CIRCUIT BOARD

LG INNOTEK CO., LTD., Se...

1. A method of manufacturing an embedded printed circuit board (PCB), comprising:
a first step of laser-patterning an insulating layer and a photoresist layer laminated on the insulating layer together to
form a circuit pattern region in which a part of the insulating layer is etched;

a second step of forming a metal seed layer on the insulating layer on which the circuit pattern region is formed, and filling
the circuit pattern region with a metal material;

a third step of removing the metal seed layer from a top face of a circuit pattern so that the metal seed layer is formed
on the remaining surface except for the top face of the circuit pattern, thereby forming a first printed circuit board; and

a fourth step of disposing the first printed circuit board on a first surface of an inner circuit board,
wherein the method further comprises: forming a second printed circuit board by the first through third steps; and disposing
the second printed circuit board on a second surface of the inner circuit board opposite to the first surface.

US Pat. No. 9,244,308

DISPLAY DEVICE

LG INNOTEK CO., LTD., Se...

1. A display device comprising:
a light source;
a wavelength conversion member adjacent to the light source;
a heat transfer part between the light source and the wavelength conversion member;
a heat dissipation part connected to the heat transfer part; and
a display panel to which light output from the wavelength conversion member is incident,
wherein the wavelength conversion member comprises:
an incident surface opposite to the light source;
an exit surface opposite to the incident surface; and
an inclined surface extending from the incident surface to the exit surface;
wherein the heat transfer part surrounds the wavelength conversion member.

US Pat. No. 9,491,866

METHOD FOR MANUFACTURING A PRINTED CIRCUIT BOARD

LG INNOTEK CO., LTD., Se...

1. A method for manufacturing a printed circuit board, the method comprising:
preparing an insulation board;
forming a first circuit pattern groove and a via hole by removing a surface of the insulation board by using a multi tone
mask or a gray tone mask, wherein the first circuit pattern groove has an edge;

forming a second circuit pattern groove by removing the edge of the first circuit pattern groove, wherein the second circuit
pattern groove is a final result of etching the edge of the first circuit pattern groove to form a curved shape; and

forming a circuit pattern and a via to fill the second circuit pattern groove and the via hole;
wherein the multi tone mask or the gray tone mask have a first region for forming an outer circumference of the via hole and
the first circuit pattern groove, a second region for forming a central area of the via hole, and a third region defined in
a region that is not etched;

wherein the first region comprises a first part spaced apart from the second region, and a second part surrounding the second
region;

wherein the first circuit pattern groove and the via hole are formed at the same time by using the first region, the second
region, and the third region of the multi tone mask or the gray tone mask; and

wherein the second circuit pattern groove has a semicircle cross-sectional shape.

US Pat. No. 9,295,135

POWER SUPPLY HAVING A PLURALITY OF LIGHT EMISSION UNITS

LG INNOTEK CO., LTD., Se...

1. A power supply comprising:
a plurality of light emission units connected in parallel, and comprising a plurality of Light Emitting Diodes (LEDs);
a power source supplying a Direct Current (DC) voltage to the light emission units;
a plurality of boards having at least one light emission mounted thereon;
a plurality of board resistors disposed in each of the boards, and electrically connected to each other; and
a feedback control unit varying a current supplied from the power source, according to sum of the board resistors which are
changed according to the number of connected boards,

wherein the feedback control unit comprises:
a resistor connected to a reference voltage;
a reference potential unit outputting a voltage-divided value which is obtained through voltage division by the resistor and
the board resistor; and

a comparator comparing an output of the reference potential unit and a value of an output terminal in each of the light emission
units to output a signal to the power source according to the compared result, thereby controlling an output current of the
power source.

US Pat. No. 9,253,381

CAMERA MODULE HAVING ROTATION PREVENTION MEANS

LG INNOTEK CO., LTD., Se...

1. A camera module, the camera module comprising:
a module part including a lens assembly formed with at least one lens, an image sensor having an image pickup device for converting
light concentrated through the lens to an electrical signal, and a PCB (Printed Circuit Board) mounted with the image sensor;

a case supporting the module part by accommodating the module part;
a driving part tilting the module part; and
a rotation prevention unit inhibiting the module part from rotating but allowing tilting with respect to the case,
wherein the rotation prevention unit includes protrusive prevention parts disposed on the case, a lug protrusively formed
at the module part and positioned between the protrusive prevention parts, and a groove part disposed on the case for the
lug to be inserted into.

US Pat. No. 9,257,043

LANE CORRECTION SYSTEM, LANE CORRECTION APPARATUS AND METHOD OF CORRECTING LANE

LG INNOTEK CO., LTD., Se...

1. A lane correction system comprising:
an image acquisition apparatus for acquiring a forward image in front of a vehicle;
a lane detection apparatus for receiving the forward image from the image acquisition apparatus to detect lane information
based on the forward image; and

a lane correction apparatus for receiving first lane information detected at a present time from the lane detection apparatus
and for sensing whether a fault detection of the first lane information exists by comparing the first lane information with
a second lane information which is previously stored,

wherein the lane correction apparatus corrects the first lane information when the fault detection is sensed in the first
lane information and transfers the corrected first lane information to the lane detection apparatus;

wherein the lane correction apparatus detects a feature of the first lane information by using the received first and second
lane information, and senses whether the fault detection of the first lane information exists by using the detected feature;
and

wherein the feature includes a degree of variation of a lane information as a function of time.

US Pat. No. 9,257,621

EPOXY RESIN COMPOSITION AND LIGHT-EMITTING DEVICE PACKAGE COMPRISING THE SAME

LG INNOTEK CO., LTD., Se...

1. An epoxy resin composition comprising: an epoxy resin; and 0.05-190 parts by weight, based on 10 parts by weight of the
epoxy resin, of a curing agent, wherein the epoxy resin comprises a triglycidylisocyanurate (TGIC) and a siloxane compound
containing an alicyclic epoxy group and a siloxane group,
wherein the curing agent comprises a compound of the following formula:

wherein R7 to R16 is each independently selected from H, Cl, Br, F, C1-C3 alkyl, C2-C3 alkene, and C2-C3 alkyne; and n is
an integer ranging from 1 to 3.

US Pat. No. 9,257,625

SEMICONDUCTOR LIGHT EMITTING DEVICE

LG Innotek Co., Ltd., Se...

1. A semiconductor light emitting device comprising:
a light emitting structure including a first conductive semiconductor layer, a second conductive semiconductor layer under
the first conductive semiconductor layer, and an active layer between the first and second semiconductor layers;

a metal support layer disposed under the second conductive semiconductor layer;
an insulating layer disposed between the second conductive semiconductor layer and the metal support layer; and
a stepped conductive layer disposed between the second conductive semiconductor layer and the metal support layer,
wherein the stepped conductive layer includes a plurality of lower parts spaced apart from each other and a plurality of upper
parts bent from at least one of the lower parts,

wherein the plurality of upper parts of the stepped conductive layer are directly contacted with the second conductive semiconductor
layer,

wherein the plurality of lower parts of the stepped conductive layer are disposed between the insulating layer and the metal
support layer,

wherein the insulating layer is disposed at a region between the plurality of upper parts, and
wherein the metal support layer includes a plurality protrusions protruded toward the plurality of upper parts.

US Pat. No. 9,280,221

CAPACITANCE TOUCH PANEL

LG INNOTEK CO., LTD., Se...

1. A capacitance touch panel, comprising:
a substrate;
a transparent electrode covering a partial area of the substrate;
an optical layer on the substrate and the transparent electrode, wherein a refractive index of the optical layer is different
from that of the transparent electrode; and

an under-coating layer between the substrate and the transparent electrode, the under-coating layer having a refractive index
greater than that of the substrate but smaller than that of the transparent electrode;

wherein the optical layer is formed with a uniform thickness on both a first area of the substrate where the transparent electrode
is formed and a second area of the substrate where the transparent electrode is not formed,

wherein the thickness of the optical layer is configured such that a first wavelength of first light reflected from the first
area and a second wavelength of second light reflected from the second area are interference-offset to reduce reflection of
both lights.

wherein the optical layer directly contacts both a top surface and a lateral surface of the transparent electrode, and wherein
the under-coating layer is formed of a material different from that of the optical layer.

US Pat. No. 9,269,776

SEMICONDUCTOR DEVICE AND METHOD FOR GROWING SEMICONDUCTOR CRYSTAL

LG INNOTEK CO., LTD., Se...

1. A semiconductor device comprising: a base substrate; patterns on the base substrate; a buffer layer on the base substrate;
and an epitaxial layer on the buffer layer; wherein the pattern is patterns are a-self-assembled patterns; and wherein the
base substrate, the patterns, the buffer layer, and the epitaxial layer each comprises a same material; wherein the buffer
layer is laterally grown between the patterns, wherein the buffer layer is horizontally grown on only the surfaces of the
base substrate exposed between the patterns to completely fill the spaces between the patterns, and wherein a height of each
of the patterns corresponds to a height of the buffer layer.

US Pat. No. 9,255,854

TORQUE SENSOR

LG INNOTEK CO., LTD., Se...

1. A torque sensor comprising:
a rotor section connected to a first shaft and comprising a rotor holder and a ring-shaped magnet mounted on an outer surface
of the rotor holder; and

a stator section connected to a second shaft and comprising a stator holder configured to fix a first stator ring and a second
stator ring,

wherein the rotor holder comprises a plurality of first coupling pieces protruding in an axial direction to be coupled to
the first shaft, and a first hog ring configured to pass through the plurality of first coupling pieces,

wherein the stator holder comprises a plurality of second coupling pieces protruding in an axial direction to be coupled to
the second shaft, and a second hog ring configured to pass through the plurality of second coupling pieces, and

wherein the plurality of second coupling pieces have through-holes, through which the second hog ring passes, formed in a
circumferential direction, and an inner, wall of the through-hole is adhered to the second hog ring.

US Pat. No. 9,112,420

CURRENT REGULATION APPARATUS

LG INNOTEK CO., LTD., Se...

1. A current regulation apparatus comprising:
a trans unit comprising an auxiliary winding unit;
a first switching unit controlling an operation of the trans unit;
an error voltage detection unit and a feedback unit connected to the auxiliary winding unit of the trans unit; and
a control unit adjusting a turn-on section of the first switching unit according to an output voltage of a voltage comparison
unit,

wherein the error voltage detection unit includes:
a voltage detection unit detecting a voltage induced to the auxiliary winding unit,
the voltage comparison unit comparing a voltage detected by the voltage detection unit and a reference voltage, and
the error voltage detection unit and the feedback unit are connected to both ends of the auxiliary winding unit, respectively.

US Pat. No. 9,287,736

WIRELESS POWER TRANSMITTER AND METHOD OF TRANSMITTING POWER THEREOF

LG INNOTEK CO., LTD., Se...

1. A wireless power transmitter to wirelessly transmit power to a wireless power receiver, the wireless power transmitter
comprising:
a transmission resonance unit to transmit the power to the wireless power receiver using resonance,
wherein the transmission resonance unit comprises a plurality of resonant coils,
wherein the plurality of resonant coils comprises:
an inner loop and
an outer loop connected to the inner loop while surrounding the inner loop;
a switch unit configured to select at least one of the plurality of resonant coils corresponding to a region in which the
wireless power receiver is detected; and

an inductor and a capacitor configured to constantly maintain a resonance frequency of the selected resonant coil for power
transmission to the wireless power receiver.

US Pat. No. 9,276,169

LIGHT EMITTING DEVICE, LIGHT EMITTING DEVICE PACKAGE, AND LIGHTING SYSTEM INCLUDING THE SAME

LG INNOTEK CO., LTD., Se...

1. A light emitting device comprising:
a second electrode layer;
a light emitting structure on the second electrode layer, the light emitting structure comprising a second conductive type
semiconductor layer, an active layer on the second conductive type semiconductor layer, and a first conductive type semiconductor
layer on the active layer;

a texture on at least one portion of the light emitting structure;
a current spreading layer formed directly on the light emitting structure provided with the texture;
a first electrode layer on the current spreading layer; and
a coating member on the upper side of the current spreading layer, wherein the texture is formed in an upper surface of the
first conductive type semiconductor layer,

wherein a vertical cross section of the texture comprises a first direction and a second direction being different from the
first direction,

wherein the first direction and the second direction are substantially perpendicular,
wherein the texture comprises a plurality of protruding portions and a plurality of groove portions,
wherein the plurality of protruding portions are connected to each other, wherein the coating member is disposed to surround
the first electrode layer, and wherein the coating member comprises phosphor, and

wherein a top surface of the first electrode layer is lower than a top surface of the coating member;
wherein the current spreading layer comprises a plurality of protruding portions and a plurality of groove portions.

US Pat. No. 9,257,957

IMPEDANCE MATCHING SYSTEM AND OPERATING METHOD THEREOF

LG INNOTEK CO., LTD., Se...

1. An impedance matching system comprising:
an impedance matching apparatus comprising an impedance matching circuit that comprises at least two variable capacitors connected
between a first impedance (Z1) and an antenna impedance (ZANT), the at least two variable capacitors comprising a first variable capacitor and a second
variable capacitor that are connected in parallel, wherein the impedance matching apparatus is configured to vary capacitance
values of the at least two variable capacitors according to an input voltage, and match impedances according to the varied
capacitance value; and

an impedance analysis apparatus configured to supply the input voltage to the impedance matching apparatus for varying the
capacitance values, determine an output impedance value from the impedance matching apparatus wherein the output impedance
value is changed in response to the input voltage to analyze characteristics of the at least two variable capacitors of the
impedance matching apparatus, store a value of the input voltage into a first entry of a lookup table, and store value of
the output impedance into a second entry of the lookup table, wherein the second entry corresponds to the first entry of the
lookup table;

wherein the impedance analysis apparatus is configured to continuously change the input voltage applied to the at least two
variable capacitors within an entire variable range of the at least two variable capacitors and generate the lookup table
by storing values of the continuously changed input voltage and values of the output impedance into corresponding entries
of the lookup table wherein the values of the output impedance are detected to be changed in response to the continuously
changed input voltage,

wherein a first end of a first variable capacitor of the at least two variable capacitors is directly connected to a first
end of the antenna impedance (ZANT) and a second end of the first variable capacitor is directly connected to a first end
of the first impedance (Z1),

wherein a first end of a second variable capacitor of the at least two variable capacitors is directly connected to a second
end of the antenna impedance (ZANT) and a second end of the second variable capacitor is directly connected to a second end
of the first impedance (Z1),

wherein the impedance matching apparatus comprises an impedance detector detecting an impedance value which is changed according
to a capacitance value supplied to the impedance matching circuit, and

wherein the impedance detector is connected to a junction of the second end of the first variable capacitor and the first
end of the first impedance (Z1).

US Pat. No. 9,247,114

CAMERA MODULE

LG Innotek Co., Ltd., Se...

1. A camera module, comprising:
a camera module housing including an upper surface and a lateral surface bent downwardly from the upper surface;
an opening formed at the upper surface of the camera module housing; and
a window member made of light transmission material and disposed in the opening,
wherein the window member includes a circular portion having a shape of a circle and a protrusion formed to extend outwardly
from the circular portion, and

wherein the opening includes a concave groove recessed from an inner circumferential surface of the upper surface of the camera
module housing forming the opening toward an external side of the camera module to have a shape corresponding to the protrusion
of the window member.

US Pat. No. 9,276,175

LIGHT EMITTING DEVICE, LIGHT EMITTING DEVICE PACKAGE

LG Innotek Co., Ltd., Se...

1. A light emitting device comprising:
a light emitting structure including a first conductive type semiconductor layer,
a second conductive type semiconductor layer, and an active layer between the first conductive type semiconductor layer and
the second conductive type semiconductor layer;

a support layer on the light emitting structure;
a filter layer on the support layer; and
an air gap inter-disposed between the light emitting structure and the filter layer,
wherein the filter layer comprises:
a first dielectric layer having a first refractive index; and
a second dielectric layer on the first dielectric layer, the second dielectric layer having a second refractive index different
from the first refractive index,

wherein an outer side surface of the support layer is vertically aligned with an outer side surface of the filter layer;
wherein a lateral width of the air gap is greater than a lateral width of the support layer, and
wherein all top surfaces of the support layer directly contact a bottom surface of the filter layer.

US Pat. No. 9,258,487

AUTO CALIBRATION METHOD AND OIS CAMERA USING THE SAME

LG INNOTEK CO., LTD., Se...

1. An auto calibration method having a gyroscope for sensing tremor and an actuator for compensating for tilting of a camera
when the tremor occurs, the method comprising:
removing a DC offset of the gyroscope;
applying a vibrator signal by operating a vibrator, and obtaining an actual measurement value of the gyroscope using the applied
vibrator signal;

calculating a first gain value for compensating for sensitivity of the gyroscope using the vibrator signal and the actual
measurement value of the gyroscope;

operating the actuator;
measuring a displacement of a pixel actually moving on an image under an operation of the actuator; and
calculating a second gain value for controlling a sensitivity variation of the actuator based on the displacement of the actually
moving pixel,

wherein the calculating of the second gain value includes determining the second gain value by dividing a reference coordinate
displacement by the displacement of the actually moving pixel.

US Pat. No. 9,252,340

PHOSPHOR AND LIGHT EMITTING DEVICE PACKAGE INCLUDING THE SAME

LG INNOTEK CO., LTD., Se...

1. A light emitting device package comprising:
a first electrode and a second electrode electrically isolated from each other;
at least one light emitting device electrically connected to each of the first electrode and the second electrode to emit
light having a first wavelength; and

phosphors excited by light having a blue wavelength emitted from the light emitting device to emit light having a second wavelength,
the phosphors including a silicate-based first phosphor emitting light having a yellow wavelength, a nitride-based second
phosphor emitting light having a green wavelength, and a nitride-based third phosphor emitting light having a red wavelength,
wherein a full width at half maximum of the spectrum of mixed light, emitted from the first phosphor to the third phosphor
as the phosphors are excited by light having a blue wavelength, is 110 nm or more.

US Pat. No. 9,246,054

LIGHT EMITTING DEVICE HAVING LIGHT EXTRACTION STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

LG INNOTEK CO., LTD., Se...

1. A light emitting device package, comprising:
a light emitting device;
a body comprising:
a top surface on which the light emitting device is disposed;
a bottom surface, a center of the bottom surface downwardly protruding to form a recess at a side of the bottom surface; and
a side surface disposed between the top surface and the bottom surface; and
a lead disposed on the top, side, and bottom surfaces of the body, an end of the lead being disposed on the recess of the
body,

wherein a portion of the lead is separated from the side surface of the body to form a gap therebetween, and
wherein the light emitting device comprises:
a semiconductor layer comprising a light emitting layer;
a light extracting structure arranged on the semiconductor layer; and
a reflective electrode disposed under the semiconductor layer, and
wherein a distance between the reflective electrode and a center of the light emitting layer falls within the ranges represented
by an odd multiple of ?/(4n)±?, wherein “?” represents a wavelength of light emitted from the light emitting layer, “n” represents
a refractive index of the semiconductor layer, and “?” represents 0.14 ?/n.

US Pat. No. 9,256,049

LENS DRIVING APPARATUS

LG INNOTEK CO., LTD., Se...

1. A lens driving apparatus comprising:
a base;
a yoke disposed on the base and including a horizontal plate having a polygonal shape and a vertical plate extended from the
horizontal plate;

a bobbin installed in the yoke;
a coil disposed around the bobbin and including a polygonal structure having at least eight outer peripheral surfaces;
an upper spring coupled to an upper portion of the bobbin;
a lower spring coupled to a lower portion of the bobbin; and
a magnet fixed to an inner surface of the vertical plate of the yoke,
wherein the magnet includes a plurality of magnets,
wherein the magnets are disposed at corners of the yoke,
wherein each magnet has a pillar structure having an angular horizontal cross-section, and
wherein, on an outer peripheral surface of the coil, an area facing the magnets is smaller than an area that does not face
the magnets.

US Pat. No. 9,282,637

EPOXY RESIN COMPOUND AND RADIANT HEAT CIRCUIT BOARD USING THE SAME

LG INNOTEK CO., LTD., Se...

1. An epoxy resin compound comprising an epoxy resin including a crystalline epoxy and an inorganic filler, the epoxy resin
compound satisfying the following condition i):
i) a thermal conductivity of 2.13 (W/m·K) or higher,
wherein the crystalline epoxy is represented by the following chemical formula 1:

wherein,
R1, R3, R5 and R7 each independently represent a single bond, or an aromatic ring structure having C6 to C24;

R2 and R6 each independently represent a single bond or a double bond (i.e., —CH?N—) of C and N, and at least any one of R2 and R6 represents a double bond (i.e., —CH?N—) of C and N;

R4 represents an oxygen atom, a sulfur atom, or a phosphorus atom; and

m and n are each independently an integer of 0 to 5 and when m or n is 0, it refers to a single bond;
in which hydrogen of each of R1 to R7 is substituted with at least one group selected from an alkyl group having C1 to C4, an aryl group having C6 to C18, and a
cyanide group.

US Pat. No. 9,357,621

LIGHTING CONTROL APPARATUS, LIGHTING CONTROL METHOD, AND LIGHTING CONTROL SYSTEM

LG INNOTEK CO., LTD., Se...

1. A lighting control system comprising:
lighting devices; and
a lighting control apparatus to transmit a registration request signal to the lighting devices, receive a response message
corresponding to the registration request signal from at least one of the lighting devices, and register at least one of the
lighting devices according to received signal strengths of the response message,

wherein the lighting control apparatus is configured to:
register one of the lighting devices as a reference lighting device; and
register at least one of the other lighting devices located around the reference lighting device by controlling the reference
lighting device,

wherein the reference lighting device is configured to:
transmit a peripheral search signal to the other lighting devices according to a command of the lighting control apparatus;
receive a peripheral response message corresponding to the peripheral search signal from at least one of the other lighting
devices; and

transmit the peripheral response message to the lighting control apparatus.

US Pat. No. 9,270,873

CAMERA MODULE INCLUDING CONDUCTIVE LAYER CORRESPONDING TO SHAPE OF ELECTRONIC CIRCUIT PATTERN LAYER

LG INNOTEK CO., LTD., Se...

1. A camera module, the camera module comprising:
a PCB (Printed Circuit Board);
an image sensor disposed on the PCB;
a housing including a base disposed at an upper surface of the PCB,
a holder disposed at an upper surface of the base and mounted with at least one lens;
an actuator disposed at the holder; and
an electronic circuit pattern layer formed on a surface of the housing, and connected to a terminal of the actuator and a
terminal of the PCB,

wherein the holder is integrally formed with the base, and
wherein the housing is nonconductive, and includes an impurity for changing a portion exposed to heat or light in order to
form the electronic circuit pattern layer.

US Pat. No. 9,269,864

LIGHT EMITTING DEVICE AND LIGHTING SYSTEM

LG INNOTEK CO., LTD., Se...

1. A light emitting device comprising:
a first electrode layer;
a second conductive semiconductor layer on the first electrode layer;
an active layer on the second conductive semiconductor layer;
a first conductive semiconductor layer on the active layer;
an AlyGa1-yN layer (where, 0y?1) on the first conductive semiconductor layer;

an InxGa1-xN pattern (where, 0x?1) on the AlyGa1-yN layer;

a gallium nitride semiconductor layer on the InxGa1-xN pattern; and

a pad electrode on the gallium nitride semiconductor layer.

US Pat. No. 9,369,618

CAMERA MODULE HAVING FOREIGN OBJECT BLOCKING STRUCTURE AND A METHOD FOR ASSEMBLING THE SAME

LG INNOTEK CO., LTD., Se...

1. A camera module having a foreign object blocking structure, the camera module comprising:
a base arranged on an upper surface of a Printed Circuit Board (PCB) mounted with an image sensor, and arranged with an Infrared
Cut Filter (IRCF) at a position corresponding to that of the image sensor;

a bobbin arranged over the base, and having a bobbin screw thread at an inner surface of the bobbin;
a lens barrel formed with a lens barrel screw thread at an outer surface for being screw-connected to the bobbin screw thread
of the bobbin and mounted with at least one lens; and

a foreign object blocking unit formed downstream of the lens barrel screw thread and upstream of a floor surface of the lens
barrel,

wherein the foreign object blocking unit protrudes toward the bobbin screw thread of the bobbin, and
wherein the foreign object blocking unit includes a foreign object prevention auxiliary screw thread formed between the floor
surface of the lens barrel and the screw thread of the lens barrel, the foreign object prevention auxiliary screw thread having
a size smaller than a size of the screw thread of the lens barrel.

US Pat. No. 9,285,083

LIGHT EMITTING DEVICE MODULE

LG INNOTEK CO., LTD., Se...

1. A light emitting device module comprising:
a light emitting device package having an upper surface and a lateral surface;
a printed circuit board on which the light emitting device package is arranged; and
a sealing member that surrounds the light emitting device package and the printed circuit board, the sealing member being
a sheet,

wherein the sealing member directly contacts the upper surface and an upper portion of the lateral surface and extends downward
while directly contacting the lateral surface of the light emitting device package, and

wherein the sealing member extends from the upper portion of the lateral surface of the light emitting device package to a
surface of the printed circuit board between the light emitting device package and another light emitting device package at
a prescribed distance from a lower portion of the light emitting device package to form a prescribed space between the light
emitting device package, the printed circuit board and the sealing member.

US Pat. No. 9,287,420

SOLAR CELL AND PASTE COMPOSITION FOR REAR ELECTRODE OF THE SAME

LG INNOTEK CO., LTD., Se...

1. A paste composition for a rear electrode of a solar cell, the paste composition comprising:
conductive powder;
an organic vehicle; and
an additive including silicon,
wherein the additive includes silicon oil;
wherein the silicon oil is selected from the group consisting of methyl phenyl silicon oil, cyclic polydimethylsiloxane, and
modified silicon oil;

wherein the paste composition includes 0.5 to 10 weight % of the additive; and
wherein the paste composition includes 50 to 90 weight % of the conductive powder, 10 to 50 weight % of the organic vehicle,
and 0 to 20 weight % glass frit.

US Pat. No. 9,281,437

LIGHT EMITTING DEVICE, AND METHOD FOR FABRICATING THE SAME

LG INNOTEK CO., LTD., Se...

1. A light emitting device comprising:
a first conductive semiconductor layer;
an active layer on the first conductive semiconductor layer;
an electron blocking layer on the active layer; and
a second conductive semiconductor layer on the electron blocking layer,
wherein the electron blocking layer comprises a first electron blocking layer and an interrupted diffusion layer on the first
electron blocking layer,

wherein a concentration of p type doping elements is maximum in the interrupted diffusion layer of the electron blocking layer,
and

wherein a plurality of interrupted diffusion layers are provided in the electron blocking layer, the concentration of the
p type doping elements has a maximum value in a second interrupted diffusion layer adjacent to the second conductive semiconductor
layer.

US Pat. No. 9,269,861

LIGHT EMITTING DEVICE PACKAGE AND LIGHTING DEVICE FOR VEHICLE INCLUDING THE SAME

LG INNOTEK CO., LTD., Se...

1. A light emitting device package comprising:
a package body;
a light emitting structure disposed on the package body, the light emitting structure including a first conductive semiconductor
layer, an active layer and a second conductive semiconductor layer, the light emitting structure being divided into at least
two light emitting cells;

a support substrate located between the package body and the light emitting structure;
a first electrode and a second electrode connected to each of the light emitting cells; and
fluorescent substances disposed on, and separated along, each of the light emitting cells,
wherein at least two layers among the first conductive semiconductor layer, the active layer and the second conductive semiconductor
layer included in each of the light emitting cells next to each other are electrically separated from each other.

US Pat. No. 9,269,879

LIGHT EMITTING DIODE PACKAGE HAVING FRAME WITH BOTTOM SURFACE HAVING TWO SURFACES DIFFERENT IN HEIGHT

LG INNOTEK CO., LTD., Se...

1. A light emitting device, comprising:
a substrate comprising a top and a bottom surfaces being substantially parallel to each other;
a light emitting diode chip on the substrate;
a frame disposed around the light emitting diode chip and configured to reflect light emitted from the light emitting diode
chip, the frame having an opening;

a first metal layer disposed on the top surface of the substrate;
a second metal layer disposed on the top surface of the substrate;
a third metal layer disposed on the bottom surface of the substrate;
a through hole connected between the first metal layer and the third metal layer;
a material being filled in the opening of the frame; and
a lens disposed on the material,
wherein the substrate and the frame are separate from each other, and
wherein the first metal layer comprises one part of the first metal layer disposed in the opening of the frame such that the
light emitting diode chip is disposed thereon and another part of the first metal layer disposed beneath the frame.

US Pat. No. 9,257,613

SEMICONDUCTOR LIGHT EMITTING DEVICE

LG INNOTEK CO., LTD., Se...

1. A light emitting device comprising:
a first semiconductor layer having nitride material;
a second semiconductor layer having nitride material;
an active layer between the first and second semiconductor layers;
an electrode layer on a central area of a surface of the second semiconductor layer;
a first electrode pad on the first semiconductor layer; and
a second electrode pad on a peripheral area of the surface of the second semiconductor layer,
wherein the first electrode pad includes a first adhesive layer, a first reflective layer, a second reflective layer, and
a first barrier layer between the first reflective layer and the second reflective layer,

wherein the second electrode pad includes a second adhesive layer, a third reflective layer, a fourth reflective layer, and
a second barrier layer between the third reflective layer and the fourth reflective layer,

wherein the electrode layer includes a light transmissive material,
wherein the active layer emits light, and
wherein a first portion of the light passes through the electrode layer and a second portion of the light is reflected by
the second electrode pad.

US Pat. No. 9,252,347

LIGHT EMITTING DEVICE PACKAGE AND LIGHT UNIT HAVING THE SAME

LG INNOTEK CO., LTD., Se...

1. A light emitting device package, comprising:
a package body including a first recess which is provided with a bottom face and a plurality of inner walls surrounding the
bottom face, the first recess having a depth of 250 micro meters to 700 micro meters, the plurality of inner walls including
a first inner wall and a second inner wall, which are opposing walls, a first angle between the first inner wall and the bottom
face being different from a second angle between the second inner wall and the bottom face;

a lead frame exposed at the bottom face of the package body, the lead frame having a thickness of 20 micro meters to 300 micro
meters, the lead frame including a bottom frame and a reflector exposed along one of the first inner wall and the second inner
wall, the reflector including an upper surface exposed in the first recess and a lower surface opposite to the upper surface
of the reflector, the bottom frame including a planar upper surface exposed at the bottom face of the package body and a planar
lower surface positioned lower than the lower surface of the reflector, the lead frame including a stepped portion between
the planar lower surface of the bottom frame and the lower surface of the reflector;

a light emitting element provided on the lead frame; and
a transparent material provided in the first recess of the package body to cover the light emitting element,
wherein the reflector extends from the bottom frame of the lead frame.

US Pat. No. 9,301,387

PRINTED CIRCUIT BOARD WITH BURR PREVENTION STRUCTURE

LG INNOTEK CO., LTD., Se...

1. A PCB with burr prevention structure, the PCB comprising:
a plurality of unit PCBs arrayed on the PCB;
a plurality of dummy PCBs arranged at a periphery of the unit PCBs;
a first sawing line formed among the plurality of unit PCBs; and
a second sawing line formed among the plurality of dummy PCBs and connected to the first sawing line,
wherein the second sawing line is formed with an ID (identification) mark for a sawing process of the PCB,
wherein the ID mark includes a conductive pad comprising a first laver formed with a Photo Solder Resistor (PSR) and a second
laver on which the PSR is removed at a predetermined area to open the conductive pad, and

wherein the first sawing line is formed at each corner of the plurality of unit PCBs with a hole to inhibit the corner of
the unit PCBs from being sharpened;

wherein the first sawing line includes grooves formed at an upper surface and a bottom surface of the PCB.

US Pat. No. 9,273,947

SENSING MAGNET APPARATUS FOR MOTOR

LG INNOTEK CO., LTD., Se...

1. A sensing magnet apparatus for a motor, the apparatus comprising:
a plate inserted by a rotation shaft;
a sensing magnet so installed as to surface-contact a surface of the plate, formed at a position near a periphery of a main
magnet, and formed at an inner side of the main magnet with a sub magnet; and

a separation inhibition unit physically coupling the plate and the sensing magnet to maintain a coupled state between the
plate and the sensing magnet,

wherein the separation inhibition unit includes a first grip unit formed with both the plate and the sensing magnet, and a
second grip unit formed with both the plate and the sensing magnet,

wherein the first grip unit includes a grip rib extensively formed at a periphery of the plate, the grip rib bent to a direction
facing the sensing magnet and formed thereinside with an accommodation groove unit; and a fixing protrusion formed at the
sensing magnet wherein the fixing protrusion is disposed to correspond to the grip rib to be inserted into the accommodation
groove unit; and

wherein the second grip unit includes a bending protrusion formed on the periphery of the plate at an opposite side of a formed
part of the grip rib, and a lug accommodation groove formed at a position corresponding to that of the bending protrusion
of the sensing magnet for the bending protrusion to be fixed and accommodated by being bent and caulked; and

wherein the first grip unit and the second grip unit are of different shapes.

US Pat. No. 9,301,370

POWER SUPPLY FOR LIGHT EMITTING DIODES (LEDS)

LG INNOTEK CO., LTD., Se...

1. A power supply comprising:
at least one light emission unit comprising a plurality of serially connected Light Emitting Diodes (LEDs);
a power source supplying a Direct Current (DC) voltage to the light emission unit;
an openness detection circuit varying a reference potential with a voltage which is detected from both ends of at least one
of the LEDs in the light emission unit; and

a feedback control unit regulating an output current of the power source according to the reference potential of the openness
detection circuit,

wherein the openness detection circuit comprises:
a voltage detector connected to both ends of the at least one LED;
a reference voltage regulator outputting a reference voltage;
a voltage comparator outputting at least one of outputs of the reference voltage regulator and voltage detector according
to the voltage detected by the voltage detector;

a switch turning on or off according to the output of the voltage comparator; and
a load detector outputting different reference potentials to the feedback control unit according to an operating state of
the switch.

US Pat. No. 9,294,661

CAMERA MODULE

LG INNOTEK CO., LTD., Se...

1. A camera module, the camera module comprising:
a Printed Circuit Board (PCB) mounted with an image sensor;
a base disposed on an upper side of the PCB;
a bobbin movably disposed on an upper side of the base;
a first driving unit fixed at the bobbin;
a second driving unit facing the first driving unit and configured to move the first driving unit in response to electromagnetic
interaction;

a bottom elastic member elastically supporting the bobbin; and
a shock absorption member disposed between the bobbin and the base;
wherein the shock absorption member includes a plurality of shock absorption units, the shock absorption units being spaced
apart from each other; and

wherein at least a portion of the bottom elastic member overlaps a space between the neighboring shock absorption units in
a vertical direction along or parallel to an optical axis of a lens.

US Pat. No. 9,281,342

LIGHT EMITTING DEVICE AND LIGHT EMITTING DEVICE PACKAGE

LG INNOTEK CO., LTD., Se...

1. A light emitting device, comprising:
a first electrode;
a light emitting structure including a first semiconductor layer, an active layer and a second semiconductor layer on the
first electrode;

a second electrode on the light emitting structure;
a control switch on and configured to control the light emitting structure, wherein the control switch includes a body including
a first dopant, and source and drain regions including a second dopant on the body, and wherein the second electrode extends
to one of the source and drain regions from a portion of the second semiconductor layer via a lateral side of the body.

US Pat. No. 9,273,845

LIGHTING DEVICE

LG INNOTEK CO., LTD., Se...

1. A lighting device comprising:
a printed circuit board mounted with a light source;
a frame portion being formed at a peripheral portion of an area where the light source is arranged; and
an inserting portion into which a diffusing plate and an optical plate are inserted, which is provided on an inside of the
frame portion;

wherein the diffusing plate is disposed above the optical plate, and
wherein the frame portion is disposed both above the diffusing plate and below the optical plate such that the frame portion
supports the diffusing plate and the optical plate from both above and below and inhibits the diffusing plate and the optical
plate from moving in an upward direction or a downward direction.

US Pat. No. 9,261,252

LIGHT EMITTING MODULE AND HEAD LAMP INCLUDING THE SAME

LG INNOTEK CO., LTD., Se...

1. A light emitting module comprising:
a circuit board having a cavity;
first conductive pattern disposed on a surface of the circuit board;
an insulation substrate disposed in the cavity, the insulation substrate comprising a second conductive pattern;
insulation layers disposed on the circuit board;
at least one light emitting device disposed on the insulation substrate, and electrically connected with the second conductive
pattern;

a supporting part disposed on the circuit board; and
a glass cover disposed on the supporting part,
wherein the first conductive pattern and the second conductive pattern are electrically connected with each other,
wherein the supporting part includes a first portion and a second portion, a height of the first portion being lower than
a height of the second portion,

wherein the first portion supports the glass cover,
wherein the insulation substrate is separated from the insulation layers,
wherein the insulation layers include a first surface and a second surface, the first surface including a first region and
a second region,

wherein the support part is disposed on the first region and the first conductive pattern is disposed on the second region,
and

wherein a height of the first region from a bottom of the cavity is a same as a height of the second region from the bottom
of the cavity.

US Pat. No. 9,195,277

TOUCH PANEL WITH PROXIMITY SENSOR

LG INNOTEK CO., LTD., Se...

1. A touch panel comprising:
a cover window with an active area and an inactive area;
a first sensing electrode having a first sensitivity in the active area; and
a second sensing electrode having a second sensitivity in the inactive area,
wherein the first sensitivity is different from the second sensitivity, and
wherein the second sensing electrode includes a same material as that of the first sensing electrode.

US Pat. No. 9,074,666

POWER TRANSMISSION APPARATUS

LG INNOTEK CO., LTD., Se...

1. A power transmission apparatus comprising:
a single rotary member having gear teeth located on one or both sides;
first and second gear sets provided with respective gears engaged with the gear teeth of the single rotary member;
a clutch interposed between the first and second gear sets and moved toward one of the first and second gear sets according
to a rotational direction thereof so as to be coupled with one of the first and second gear sets; and

a driving shaft providing power to the clutch.

US Pat. No. 9,287,421

SOLAR CELL MODULE AND METHOD OF FABRICATING THE SAME

LG INNOTEK CO., LTD., Se...

1. A solar cell module comprising:
a support substrate; and
a plurality of solar cells on the support substrate,
wherein each of the solar cells comprises:
a back electrode layer on the support substrate;
a light absorbing layer on the back electrode layer;
a buffer layer on the light absorbing layer;
a conductive layer on the buffer layer;
a front electrode layer on the conductive layer;
a first division pattern formed through the back electrode layer;
a second division pattern formed through the light absorbing layer, the buffer layer, and the conductive layer; and
a third division pattern formed through the light absorbing layer, the buffer layer, the conductive layer, and the front electrode
layer;

wherein the conductive layer includes a plurality of conductive wires extending among the solar cells in a first direction
parallel to a charge transfer direction, and

wherein each of the conductive wires has a width in a range of about 1 nm to about 30 nm.

US Pat. No. 9,287,460

LIGHT EMITTING DEVICE, LIGHT EMITTING DEVICE PACKAGE AND LIGHTING SYSTEM INCLUDING THE SAME

LG INNOTEK CO., LTD., Se...

1. A light emitting device comprising:
a light emitting structure including a first conductive type semiconductor layer, an active layer under the first conductive
type semiconductor layer, and a second conductive type semiconductor layer under the active layer;

a first electrode on an upper side of the light emitting structure;
a second electrode on an underside of the light emitting structure;
at least one cavity penetrating the second conductive type semiconductor layer and the active layer; and
an insulating layer disposed on the at least one cavity,
wherein the second electrode comprises:
a conductive layer; and
a reflective layer disposed between the insulating layer and the conductive layer,
wherein the insulating layer and the reflective layer fully fill the cavity, and wherein the reflective layer comprises at
least one protrusion in the cavity,

wherein the at least one protrusion comprises an upper portion and a lower portion having different sizes,
wherein the first electrode is vertically aligned with the at least one protrusion,
wherein a top surface of the reflective layer is higher than a top surface of the active layer in a portion vertically overlapping
the first electrode, and

wherein the top surface of the reflective layer comprises a flat top surface.

US Pat. No. 9,249,963

LIGHT EMITTING DEVICE

LG INNOTEK CO., LTD., Se...

1. A light emitting device comprising:
a body having a cavity;
a light emitting part in the cavity;
a light conversion part on a path of a light from the light emitting part;
a first capping part interposed between the light emitting part and the light conversion part; and
a heat transfer part in the first capping part,
wherein the light conversion part comprises:
a first light conversion lens part; and
a second light conversion lens part beside the first light conversion lens part, and
wherein the heat transfer part includes a light transmissive part.

US Pat. No. 9,357,630

EPOXY RESIN COMPOUND AND RADIANT HEAT CIRCUIT BOARD USING THE SAME

LG INNOTEK CO., LTD., Se...

1. An epoxy resin composition comprising
an epoxy resin comprising a crystalline epoxy resin and a non-crystalline epoxy resin,
a curing agent, and
an inorganic filler,
wherein the curing agent comprises epoxy adducts,
wherein the crystalline epoxy resin includes a mesogen structure,
wherein the epoxy resin comprises at least 50 w % of the crystalline epoxy resin,
wherein the epoxy resin composition comprises 0.5 w % to 5 w % of the epoxy adducts based on a total weight of the epoxy resin
composition, acid

wherein the epoxy adducts are represented by following chemical formula 1 or chemical formula 2:

US Pat. No. 9,307,596

LIGHT EMITTING MODULE

LG INNOTEK CO., LTD., Se...

1. A light emitting module comprising:
a plurality of light emitting device packages configured to be sequentially turned on or off according to the level of external
drive voltage and connected to one another in series,

wherein each of the plurality of light emitting device packages includes a light emitting cell having at least one light emitting
device, and an on/off controller configured to control to turn the light emitting cell on or off,

wherein each of the plurality of light emitting device packages is a Chip On Board (COB) type,
wherein each of the plurality of light emitting device packages includes:
a board; and
a molding member disposed to cover the light emitting device disposed on the board, and
wherein the board comprises:
a metal layer;
an insulating layer disposed on the metal layer; and
a wiring layer disposed on the insulating layer and electrically connected to the light emitting device.

US Pat. No. 9,287,466

LIGHT EMITTING DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

LG INNOTEK CO., LTD., Se...

1. A light emitting device package, comprising:
a substrate with a recess, the substrate including a border portion disposed around the recess, and a base portion including
a top surface forming a bottom of the recess, a bottom surface opposing the top surface of the base portion, and a side surface
disposed between the top surface of the base portion and the bottom surface of the base portion, the top surface of the base
portion being planar;

a metal layer on the top surface of the base portion including protrusions such that a top surface of the metal layer has
roughness, the metal layer extended to the bottom surface of the base portion; and

a light emitting device on the metal layer on the top surface of the base portion,
wherein an end of the metal layer on the bottom surface of the base portion is disposed between the light emitting device
and a top surface of the border portion of the substrate so as not to be disposed under the light emitting device.

US Pat. No. 9,347,658

LIGHTING DEVICE

LG Innotek Co., Ltd., Se...

1. A lighting device comprising:
a heat sink comprising a top surface, a bottom surface disposed below the top surface and coupling structures which comprise
a first coupling structure and a second coupling structure formed on a side surface disposed between the top surface and the
bottom surface, the side surface connecting the top surface and the bottom surface;

a light source disposed on the top surface of the heat sink;
a lens unit disposed on the light source and comprising a first coupling portion which is coupled to the first coupling structure
formed on the side surface of the heat sink; and

a cover unit comprising an optical member which is disposed on the lens unit, and a second coupling portion which is coupled
to the second coupling structure formed on the side surface of heat sink.

US Pat. No. 9,252,345

LIGHT EMITTING DEVICE AND LIGHTING SYSTEM

LG INNOTEK CO., LTD., Se...

1. A light emitting device comprising:
a conductive support member;
a first conductive layer disposed on the conductive support member;
a second conductive layer disposed on the first conductive layer;
a light emitting structure comprising a first semiconductor layer disposed on the second conductive layer, a second semiconductor
layer disposed between the first semiconductor layer and the second conductive layer, and an active layer disposed between
the first semiconductor layer and the second semiconductor layer; and

an insulation layer comprising a first insulation layer and a second insulation layer,
wherein the first conductive layer comprises:
a conductive part disposed on the conductive supporting member;
a first expansion part extending from the conductive part and penetrating through the second conductive layer, the second
semiconductor layer and the active layer; and

a second expansion part extending from the first expansion part and being disposed in the first semiconductor layer,
wherein first expansion part is disposed between the conductive part and second expansion part,
wherein the first insulation layer is disposed on the lateral surface of the first expansion part,
wherein the second insulation layer is disposed between the first conductive layer and the second conductive layer, and
wherein an area of a bottom surface of the second expansion part is greater than an area of a top surface of the first expansion
part.

US Pat. No. 9,253,413

WDR PIXEL ARRAY, WDR IMAGING APPARATUS INCLUDING THE SAME AND METHOD FOR OPERATING THE SAME

LG INNOTEK CO., LTD., Se...

1. An imaging apparatus comprising:
a photo-electro conversion unit on a substrate;
a transfer switching unit on the substrate at one side of the photo-electro conversion unit;
a storage region on the substrate at one side of the transfer switching unit;
a plurality of pixels including a reset switching unit on the substrate at one side of the storage region; and
a control circuit reading a signal level and a reset signal level and applying a signal to the transfer switching unit and
the reset switching unit,

wherein the control circuit reduces an integration time required for accumulating overflow charges generated from the photo-electro
conversion unit in the storage region, and reads an overflow level of the photo-electro conversion unit, and

wherein the overflow level read by the control circuit is used for calculating an actual overflow signal.

US Pat. No. 9,380,193

CAMERA MODULE

LG Innotek Co., Ltd., Se...

1. A camera module comprising:
a PCB (Printed Circuit Board) having an image sensor;
a base disposed on the PCB;
a bobbin disposed above the base;
a first driving unit disposed on the bobbin;
a second driving unit facing the first driving unit;
a bottom elastic member coupled to the bobbin and the base, and the bottom elastic member including an inner part coupled
to the bobbin, an outer part coupled to the base, a connection part connecting the inner part and the outer part, and a terminal
connection part extended from the outer part;

a terminal conductively connected to the bottom elastic member at a solder part conductively connecting the PCB and the terminal
connection part of the bottom elastic member;

a conductive member disposed on the terminal connection part and the terminal; and
a wall that upwardly protrudes from the base,
wherein the conductive member and the terminal connection part face one surface of the wall in a direction.

US Pat. No. 9,281,189

WAFER AND METHOD OF FABRICATING THE SAME

LG INNOTEK CO., LTD., Se...

1. A method of manufacturing a thin film, the method comprising:
growing an epitaxial layer on a surface of a wafer at a growth temperature,
wherein the growing of the epitaxial layer comprises controlling a defect present on the surface of the wafer, and
the controlling of the detect comprises maintaining the wafer at a first temperature higher than the growth temperature; and
maintaining the wafer at a second temperature lower than the growth temperature;
wherein the wafer includes silicon carbide;
wherein the epitaxial layer includes silicon carbide;
wherein the growing of the epitaxial layer comprises increasing a temperature of the wafer to the growth temperature before
the growing of the epitaxial layer, wherein the increasing of the temperature of the wafer comprises a first ramp-up and a
second ramp-up; and

wherein a temperature of the second ramp-up is higher than a temperature of the first ramp-up.

US Pat. No. 9,287,750

MOTOR

LG INNOTEK CO., LTD., Se...

1. A motor, the motor comprising:
a motor housing;
a stator fixedly coupled to the motor housing;
a rotor rotatably installed at a center of the stator by a rotation shaft;
upper and bottom bearings having an outer race fixed to the motor housing and an inner race coupled to the rotation shaft;
and

an output clutch contacting an inner race of the upper bearing:
wherein the output clutch includes a sintering member surface-contacting the inner race and press-fitted into the rotation
shaft, and a clutch member formed by being arranged at a center of the sintering member.

US Pat. No. 9,337,401

LIGHT EMITTING DEVICE PACKAGE

LG INNOTEK CO., LTD., Se...

1. A light emitting device package comprising:
a light source;
a lead frame to mount the light source thereon and being electrically connected to the light source, the lead frame comprising
first and second electrically conductive lead frames being spaced from each other;

a mold member disposed over the light source and including a sealing material, a fluorescent substance, and organic particles
over the lead frame, wherein the entire organic particle is organic, wherein each of the organic particles comprises a coating
layer to coat the organic particle, wherein the coating layer has an index of refraction different from that of the organic
particle,

wherein a proportion of the organic particles to the sealing material is in a range of 1 wt % to 20 wt %.

US Pat. No. 9,264,618

CAMERA MODULE

LG INNOTEK CO., LTD., Se...

1. A camera module, the camera module comprising:
an auto focusing module including a bobbin, a first coil disposed on the bobbin, a first housing, a first magnet disposed
on the first housing and configured to move the bobbin by interaction with the first coil, and a first elastic member coupled
to the bobbin and the first housing;

a handshake compensation module including a second coil and a second magnet configured to move the first housing;
a first circuit board electrically connected to the first coil and the second coil;
a bottom case supporting the first circuit board;
a second circuit board fixed to the bottom case and electrically connected to an image sensor and the first circuit board;
and

a spring unit arranged at a periphery of the second circuit board and having an opening having thereinside a gap spaced apart
at a predetermined distance.

US Pat. No. 9,250,414

LENS DRIVING APPARATUS

LG INNOTEK CO., LTD., Se...

1. A lens driving apparatus comprising:
a base;
a yoke installed on the base;
a bobbin disposed over the base and configured to be coupled with a lens module;
a coil disposed around the bobbin and including a curved surface;
a magnet provided at the yoke to face the curved surface of the coil, wherein the magnet includes a plurality of magnets,
and each magnet of the plurality of magnets has an angular column structure and is disposed at a corner of the yoke; and

at least one spring disposed on at least one of upper and lower portions of the yoke to support the bobbin,
wherein each of the plurality of magnets includes an upper surface, a lower surface, and side surfaces, wherein the side surfaces
include a first plane facing the curved surface of the coil and three flat planes not facing the coil and disposed between
the yoke and the curved surface of the coil in a horizontal direction, wherein the three flat planes face the yoke, and

wherein each magnet of the plurality of magnets is coupled to the yoke at the three flat planes thereof.

US Pat. No. 9,585,258

METHOD AND DEVICE OF MANUFACTURING PRINTED CIRCUIT BOARD HAVING A SOLID COMPONENT

LG INNOTEK CO., LTD., Se...

1. A printed circuit board, comprising:
an insulating substrate that includes a resin material in which a solid component is impregnated, and has a plurality of circuit
pattern grooves formed on an upper surface thereof;

a plurality of buried circuit patterns that are formed to bury the circuit pattern grooves; and
a metal layer disposed along the circuit pattern groove;
wherein the solid component includes a glass fiber and an inorganic filler,
wherein a diameter of the inorganic filler is in a range of from 0.15 ?m to 0.25 ?m, and
wherein a void generated by separation of the inorganic filler that remains at a surface of the insulating substrate has a
size of less than 1 ?m.

US Pat. No. 9,281,449

LIGHT EMITTING DEVICE

LG Innotek Co., Ltd., Se...

1. A light emitting device comprising:
a substrate;
a plurality of light emitting cells separated from each other and provided on the substrate, the plurality of light emitting
cells including a first light emitting cell and a second light emitting cell, said second light emitting cell neighboring
the first light emitting cell;

a plurality of conductive interconnection layers, wherein a first one of the plurality of conductive interconnection layers
electrically contacts the two neighboring light emitting cells,

wherein each of the plurality of light emitting cells includes a light emitting structure including a first conductivity-type
semiconductor layer, an active layer and a second conductivity-type semiconductor layer, a first electrode on the first conductivity-type
semiconductor layer, a second electrode on the second conductivity-type semiconductor layer, and an etching area, in which
the first conductivity-type semiconductor layer is exposed, formed by partially etching the light emitting structure, and

an insulating layer along a first side surface of the light emitting structure of the first light emitting cell and along
a second side surface of the light emitting structure of the second light emitting cell;

wherein the first one of the plurality of connective interconnect layers extends from the second electrode and along the first
side surface of the light emitting structure of the first light emitting cell while on the insulating layer, and the first
one of the plurality of conductive interconnect layers extends adjacent to the substrate and then along the second side surface
of the light emitting structure of the second light emitting cell while on the insulating layer,

wherein the light emitting structure of the first light emitting cell includes the first side surface adjacent to the second
electrode and parallel with the second electrode, and the light emitting structure of the second light emitting cell includes
the second side surface opposite to the first side surface of the first light emitting cell and contacting the etching area,
and when a width between the first side surface and the second side surface is defined as W from a top view, the second electrode
is provided in an area between a position separated from the first side surface of the light emitting structure by ? W and
a position separated from the first side surface of the light emitting structure by ½ W,

wherein the second electrode includes a first part disposed in a first direction parallel with the first side surface and
a second part disposed in a second direction differing from the first direction, wherein a length of the first part of the
second electrode is greater than a length of the second part of the second electrode.

US Pat. No. 9,281,454

THIN FILM LIGHT EMITTING DIODE

LG Innotek Co., Ltd., Se...

1. A light emitting device, comprising:
a substrate;
a semiconductor structure on the substrate, the semiconductor structure comprising:
a first-type semiconductor layer;
a second-type semiconductor layer; and
a light emitting layer between the first-type semiconductor layer and the second-type semiconductor layer,
wherein a bottom surface of the semiconductor structure is closest to the substrate and a top surface of the semiconductor
structure is opposite to the bottom surface, the top surface comprising:

an upper surface on one of the first-type semiconductor layer and the second-type semiconductor layer;
a lower surface stepped-down from the upper surface so as to be on the other of the first-type semiconductor layer and the
second-type semiconductor layer; and

a side surface connected between the upper surface and the lower surface such that a portion of the light emitting layer is
exposed thereon;

a transparent conductive layer on the upper surface of the top surface of the semiconductor structure;
a first electrode on the transparent conductive layer, the first electrode including platinum;
a second electrode on the lower surface of the top surface of the semiconductor structure, the second electrode including
chromium;

a passivation layer from the upper surface of the top surface of the semiconductor structure to the lower surface of the top
surface of the semiconductor structure so as to cover an entire side surface of the top surface of the semiconductor structure,
the passivation layer including an opening to accommodate one of the first electrode and the second electrode; and

a wavelength converting layer on the passivation layer so as to cover the light emitting structure,
wherein the passivation layer comprises:
an upper passivation portion on the upper surface of the top surface of the semiconductor structure;
a lower passivation portion on the lower surface of the top surface of the semiconductor structure; and
a side passivation portion between the upper passivation portion and the lower passivation portion, the side passivation portion
on the side surface of the top surface of the semiconductor structure, and

wherein the wavelength converting layer comprises:
an upper converting portion on the upper passivation portion;
a lower converting portion on the lower passivation portion; and
a side converting portion between the upper converting portion and the lower converting portion, the side converting portion
on the side passivation portion.

US Pat. No. 9,246,400

WIRELESS POWER RECEIVER AND WIRELESS POWER TRANSFERRING METHOD

LG INNOTEK CO., LTD., Se...

1. A wireless power receiver to transfer power wirelessly received from a wireless power transmitter to a load, the wireless
power receiver comprising:
a first reception induction coil coupled with a reception resonant coil to receive a positive AC power from the reception
resonant coil;

a first rectifying diode to rectify the positive AC power received through the first reception induction coil;
a second reception induction coil connected to the first reception induction coil and coupled with the reception resonant
coil to receive a negative AC power from the reception resonant coil; and

a second rectifying diode to rectify the negative AC power received through the second reception induction coil,
wherein the wireless power receiver changes a transferring path of the power provided to the load according to a polarity
variation of the AC power received through the first and second reception induction coils.

US Pat. No. 9,281,188

APPARATUS AND METHOD FOR FABRICATING WAFER

LG INNOTEK CO., LTD., Se...

1. A method for fabricating a wafer, the method comprising:
depositing an epi layer on a wafer in an epi deposition part;
transferring the wafer to an annealing part connected to the epi deposition part;
annealing the wafer in the annealing part;
transferring the wafer to a cooling part connected to the annealing part; and
cooling the wafer in the cooling part;
wherein the depositing of the wafer, the annealing of the wafer, and the cooling of the wafer are continuously performed;
wherein a passage between the epi disposition part and the annealing part is blocked by a first blocking member,
wherein a passage between the annealing part and the cooling part is blocked by a second blocking member,
wherein the epi layer is a silicon carbide epi layer,
wherein a growth temperature of the epi deposition part is in a range of from about 1300° C. to about 1700° C.,
wherein the epi deposition part deposits a silicon carbide epi layer,
wherein the wafer is transferred by a wafer transfer apparatus, and
wherein the wafer transfer apparatus is formed of a material that endures the growth temperature of the range of from about
1300° C. to about 1700° C.

US Pat. No. 9,282,247

CAMERA MODULE

LG INNOTEK CO., LTD., Se...

1. A camera module comprising:
a printed circuit board;
an image sensor disposed on the printed circuit board;
a housing including a first housing and a second housing coupled to the first housing;
a mover disposed inside the housing and including a bobbin, a magnet, and a lens, wherein the magnet includes a first magnet,
a second magnet, a third magnet and a fourth magnet fixed to the mover;

a coil including a first coil, a second coil, a third coil, and a fourth coil disposed to face the first magnet, the second
magnet, the third magnet, and the fourth magnet respectively; and

an elastic member supporting the mover;
wherein the mover is stationary at an initial position and a gap is formed between a bottom surface of the mover and an upper
surface of the first housing;

wherein the housing includes a terminal unit configured such that a driving signal is applied from the printed circuit board
to any one of the first to fourth coils via the terminal unit;

wherein the housing further includes a connector, and wherein opposite tails of each coil are soldered to the terminal unit;
wherein one end of the terminal unit is connected to the printed circuit board and the other end of the terminal unit is partially
exposed at the connector; and

wherein the first housing includes terminal insertion holes through which the terminal unit penetrates.

US Pat. No. 9,269,878

LIGHT EMITTING DEVICE AND LIGHT EMITTING APPARATUS

LG INNOTEK CO., LTD., Se...

1. A light emitting device comprising:
a support member having a first opening and a second opening, the support member including a thermal diffuser;
a first connection electrode provided in the first opening;
a first electrode on a top surface of the first connection electrode;
a second connection electrode provided in the second opening;
a second electrode on a top surface of the second connection electrode, wherein the support member to dissipate heat away
from the first electrode and the second electrode;

a reflective electrode layer provided over the second electrode and the support member;
an insulating layer between the support member and the reflective electrode layer; and
a light emitting structure provided over the reflective electrode layer and the first electrode, the light emitting structure
including a first conductive semiconductor layer, a second conductive semiconductor layer and an active layer between the
first conductive semiconductor layer and the second conductive semiconductor layer,

wherein the first electrode is connected to the first conductive semiconductor layer and the first connection electrode,
wherein the second electrode is connected to the second conductive semiconductor layer and the reflective electrode layer,
wherein an outer lateral surface of the insulating layer is exposed between an outer lateral surface of the support member
and a lateral surface of the light emitting structure,

wherein the support member includes a first support member around the first electrode and a second support member around the
second electrode, and a slot is provided between the first support member and the second support member,

wherein an area of a bottom surface of the second support member is greater than an area of a bottom surface of the first
support member, and

wherein the slot is provided to be closer to the first connection electrode than to the second connection electrode.

US Pat. No. 9,307,595

LIGHT EMITTING DEVICE DRIVING MODULE

LG INNOTEK CO., LTD., Se...

1. A light emitting device driving module comprising:
a light emitter comprising a first light emitter one or more second light emitters connected to the first light emitter;
a rectifier which receives an AC power and outputs a rectified voltage; and
a controller which receives the rectified voltage from the rectifier and controls currents of the first light emitter and
the one or more second light emitters in accordance with a magnitude of the rectified voltage,

wherein the controller controls the currents of the first light emitter and the one or more second light emitters by comparing
the rectified voltage with a threshold voltage of the light emitter,

wherein, when the rectified voltage is greater than the threshold voltage of the first light emitter, the controller causes
the first light emitter to be in an on-state, and

wherein, when the rectified voltage is greater than a sum of the threshold voltage of the first light emitter and the threshold
voltage of a predetermined number of the one or more second light emitters, the controller causes the predetermined number
of the one or more second light emitters to be in an on-state.

US Pat. No. 9,455,602

MOTOR

LG INNOTEK CO., LTD., Se...

1. A motor comprising:
a stator having a ring type structure; and
a rotor including a core with a plurality of permanent magnets circumferentially magnetized inside the stator around a rotation
shaft and a non-magnetic member between the core and the rotation shaft,

wherein the stator comprises:
a core having the ring type structure;
the plurality of teeth protruding from the inner surface of the core; and
the coils wound around the teeth, respectively,
wherein the rotor comprises:
the non-magnetic member between the rotor and the rotation shaft;
a plurality of protrusions protruding from the non-magnetic member; and
the plurality of permanent magnets between the protrusions,
wherein the non-magnetic member has a ring shape,
wherein the permanent magnet comprises a protrusion protruding to the non-magnetic member,
wherein the non-magnetic member comprises a receiving groove to receive an end of the permanent magnet, and
wherein a width d1 of the receiving groove is gradually reduced toward the rotation shaft.

US Pat. No. 9,285,632

LIGHT EMITTING DEVICE PACKAGE AND BACKLIGHT UNIT USING THE SAME

LG ELECTRONICS INC., Seo...

1. A light emitting device package, comprising:
a plurality of light emitting devices on a substrate; and
a plurality of optical lenses disposed over the plurality of light emitting devices,
wherein a respective optical lens comprises:
a body, the body comprising:
a recessed portion having a curved surface and inwardly recessing towards a respective light emitting device;
a rounded convex surface disposed around the recessed portion;
a bottom surface facing a top surface of the substrate; and
a lateral flat portion disposed between the rounded convex surface and the bottom surface, wherein the lateral flat portion
extends from a bottom point of the rounded convex surface in a first direction substantially parallel with a central axis
of the respective light emitting device; and

an extending member extending from the body of the respective optical lens, wherein the extending member comprises:
a first part laterally extending from the lateral flat portion of the body in a second direction substantially perpendicular
to the central axis of the respective light emitting device; and

a second part extending from the first part,
wherein each of outermost lateral surfaces of the first and second parts is positioned farther than the lateral flat portion
from the respective light emitting device,

wherein the second part is disposed between the top surface of the substrate and a plane comprising the bottom surface of
the body,

wherein the recessed portion is disposed at a center of a top surface of the body, and
wherein the second part is substantially symmetrical with respect to an axis that is spaced apart in the second direction
from the central axis of the respective light emitting device and substantially parallel with the central axis of the respective
light emitting device.

US Pat. No. 9,268,080

DISPLAY DEVICE HAVING LIGHT CONVERSION MEMBER INCLUDING LIGHT CONVERSION PARTICLES

LG INNOTEK CO., LTD., Se...

1. A display device comprising:
a light guide plate;
a light source disposed on a side surface of the light guide plate;
a light conversion member including a container and light conversion particles received therein, the light conversion member
disposed between the light source and the light guide plate;

a first adhesion member between the light guide plate and the light conversion member; and
a second adhesion member between the light source and the light conversion member,
wherein the first adhesion member makes direct contact with the ht guide plate and the light conversion member,
wherein the second adhesion member makes direct contact with the light source and the light conversion member,
wherein the light source comprises a filler,
wherein the first adhesion member has a reflective index within about ±0.1 with respect to a reflective index of the light
guide plate, and

wherein the second adhesion member has a reflective index within about ±0.1 with respect to a reflective index of the filler.

US Pat. No. 9,504,147

RESIN COMPOSITION, AND PRINTED CIRCUIT BOARD USING SAME

LG INNOTEK CO., LTD., Se...

1. A resin composition comprising:
a resin comprising an epoxy compound represented by the following Formula 1;
a curing agent comprising diaminodiphenylsulfone; and
an inorganic filler:

wherein each of R1 to R14 is independently selected from the group consisting of H, Cl, Br, F, a C1-C3 alkyl, a C2-C3 alkene, and a C2-C3 alkyne, and each of m and n is 1, 2 or 3,

wherein the inorganic filler includes at least three alumina (Al2O3) groups classified according to a particle size, a first alumina group having a particle size of 0.1 ?m or more and less
than 10 ?m a second alumina group having a article size of 10 ?m or more and less than 30 ?m, and a third alumina group having
a particle size of 30 ?m or more and 60 ?m or less, and

wherein a content ratio of the first alumina group and the second alumina group is in a range of 1:1 to 2, and a content ratio
of the first alumina group and the third alumina group is in a range of 1:1.5 to 5.5.

US Pat. No. 9,444,016

LIGHT EMITTING DEVICE

LG Innotek Co., Ltd., Se...

1. A light emitting device comprising:
a reflective layer, wherein a lower edge of the reflective layer has a protruding portion;
an ohmic layer disposed on the reflective layer, wherein the reflective layer is thicker than the ohmic layer, wherein a lower
edge of the ohmic layer has a protruding portion, and wherein the lower edge of the ohmic layer and the lower edge of the
reflective layer are not exposed;

a second conductive type semiconductor layer on the reflective layer, wherein the second conductive type semiconductor layer
is spaced apart from the reflective layer;

an active layer on the second conductive type semiconductor layer;
a first conductive type semiconductor layer on the active layer, wherein the first conductive type semiconductor layer includes
a recess portion and edge protruding portions on an edge surface, and wherein the recess portion includes a light extraction
pattern on a first top surface of the recess portion;

a pad electrode on a second top surface of the recess portion, and
a branch electrode on the first conductive type semiconductor layer,
wherein the reflective layer is on a bottom surface of the second conductive type semiconductor layer,
wherein the reflective layer comprises a predetermined pattern,
wherein all bottom surface of the pad electrode is vertically overlapped with the predetermined pattern of the reflective
layer,

wherein the branch electrode is on a third top surface of the first conductive type semiconductor layer, and the branch electrode
is physically connected to the pad electrode,

wherein the predetermined pattern is further disposed in a region where the predetermined pattern vertically overlaps the
branch electrode,

wherein the predetermined pattern is disposed below the ohmic layer, and
wherein the ohmic layer is between the predetermined pattern and the second conductive type semiconductor such that the predetermined
pattern is not in contact with the second conductive type semiconductor layer,

wherein the light extraction pattern is not vertically overlapped with the predetermined pattern of the reflective layer,
and

wherein a depth of the recess is greater than a depth of the light extraction pattern.

US Pat. No. 9,287,304

IMAGE SENSOR INCLUDING A PIXEL ARRAY EACH PIXEL COMPRISING A VARIABLE CAPACITOR AND A CAPACITOR

LG INNOTEK CO., LTD., Se...

1. A pixel comprising:
a plurality of photoelectric converters disposed on a substrate;
a capacitor connected to the photoelectric converters, and accumulating electric charges converted by the photoelectric converters;
a variable capacitor connected to the capacitor and connected directly to the substrate, and having capacitance varied according
to a potential of the capacitor; and

a switching element outputting the potential of the capacitor,
wherein the switching element comprises:
a transfer switching element provided between the photoelectric converters and the capacitor and between the photoelectric
converters and the variable capacitor to transfer the electric charges converted by the photoelectric converters to the capacitor;

a reset switching element provided between a power voltage line and the capacitor to reset the potential of the capacitor;
and

an output switching element connected to the power voltage line to output the potential of the capacitor, and
wherein the capacitor and the variable capacitor are connected to the output switching element.

US Pat. No. 9,279,572

LIGHT EMITTING MODULE

LG INNOTEK CO., LTD., Se...

1. A light emitting module comprising: a light emitting body; a gyro sensor detecting a tremor; and a light emitting body
tilt driving unit tilting the light emitting body in response to tremor information detected by the gyro sensor;
wherein the light emitting body is embedded with a light emitting device, wherein the light emitting device is any one of
an LED (Light Emitting Diode) and an electric bulb, and

wherein the light emitting body includes a reflective structure configured to reflect the light emitted from the light emitting
device to a target.

US Pat. No. 9,363,883

PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME

LG INNOTEK CO., LTD., Se...

1. A printed circuit board comprising;
an insulating layer;
a pad formed on the insulating layer;
a solder resist formed on the pad and having an opening section exposing an upper surface of the pad;
a bump connection section on the pad and filling the opening section of the solder resist;
a plating seed layer between an inner wall of the solder resist and a side surface of the bump connection section; and
a bump formed on the bump connection section, having a first portion protruded from an upper surface of the solder resist
at a predetermined height,

wherein the first portion of the bump has a narrower width than the opening section of the solder resist.

US Pat. No. 9,222,660

LIGHTING DEVICE

LG INNOTEK CO., LTD., Se...

1. A lighting device comprising:
a housing having a top opening and a bottom opening;
an optical plate disposed in the top opening;
a heat sink disposed in the bottom opening, wherein the heat sink includes a base and a projection at the base;
a driving unit received in the housing, the driving unit disposed between the optical plate and the heat sink, and the driving
unit to receive external electric power, wherein the driving unit includes a circuit board and a plurality of parts on the
circuit board;

a light source received in the housing, the light source disposed between the optical plate and the driving unit, and the
light source is electrically connected to the driving unit,

wherein the light source includes a substrate and a light emitting device on the substrate, and
a reflector received in the housing, the reflector being between the optical plate and the light source, wherein the reflector
includes:

a reflecting portion that reflects light from the light source to the optical plate, and
a support that supports the reflecting portion, the support extending from a surface of the reflector to the base of the heat
sink, the support to be provided adjacent to a side edge of the substrate, the support to pass through a hole of the circuit
board of the driving unit and the support to be provided at the base of the heat sink,

wherein the substrate of the light source is on the projection of the heat sink,
wherein the circuit board of the driving unit is disposed on the base of the heat sink,
wherein the housing is coupled to the base of the heat sink,
wherein the substrate of the light source is separated from the circuit board of the driving unit,
wherein a diameter of the projection is less than a diameter of the base,
wherein the projection is disposed between the plurality of parts of the driving unit, and
wherein the projection contacts a top surface of the base.

US Pat. No. 9,215,373

APPARATUS AND METHOD FOR COMPENSATING HAND BLUR

LG INNOTEK CO., LTD., Se...

1. An apparatus for compensating an image blur caused by hand blur of a camera module including a first actuator for AF (Auto
Focus)/zoom, and a second actuator for OIS (Optical Image Stabilizer), the apparatus comprising:
a controller configured to determine a first driving signal for driving the second actuator using angular velocity information
by tilt of the camera module;

a calculator configured to calculate a ratio of effective focal length relative to a lens moving distance, in a case a lens
focal length is changed by the first actuator; and

an amplifier configured to determine a second driving signal amplifying the first driving signal, using the ratio of effective
focal length relative to the lens moving distance.

US Pat. No. 9,113,586

DEVICE FOR BONDING FLEXIBLE PCB TO CAMERA MODULE

LG INNOTEK CO., LTD., Se...

1. A device for bonding a flexible printed circuit board (PCB) to a camera module, the device comprising:
a thermo-compression unit configured to apply heat and pressure to a conductive film between the camera module and the flexible
PCB, the conductive film including an insulating polymer resin and conductive particles;

an ultrasonic wave bonding unit configured to apply an ultrasonic wave to the conductive film;
a memory configured to store a first period for which the thermo-compression unit applies heat and pressure to the conductive
film and a second period for which the ultrasonic wave bonding unit applies the ultrasonic wave to the conductive film while
the thermo-compression unit maintains application of heat and pressure; and

a controller configured to:
control the thermo-compression unit to apply the heat and pressure to the conductive film for the first period;
control the ultrasonic wave bonding unit to apply the ultrasonic wave to the conductive film for the second period after the
first period while the thermo-compression unit maintains application of heat and pressure; and

control the thermo-compression unit to maintain application of the heat and pressure to the conductive film after the second
period until the insulating polymer resin of the conductive film is cured.

US Pat. No. 9,307,675

RADIANT HEAT CIRCUIT BOARD, METHOD OF MANUFACTURING THE SAME, HEAT GENERATING DEVICE PACKAGE HAVING THE SAME, AND BACKLIGHT

LG INNOTEK CO., LTD., Se...

15. A method of manufacturing a radiant heat circuit board for mounting a plurality of heat generating devices, the method
comprising:
forming an integrated metal projection for attaching the plurality of heat generating devices on a metal plate;
forming a first insulation layer exposing the metal projection on the metal plate;
forming a first circuit pattern on the first insulation layer;
forming a second insulation layer exposing the metal projection on the first insulation layer;
forming a second circuit pattern on the second insulation layer;
forming a first via hole exposing the first circuit pattern in the first and second insulation layers;
forming a second via hole exposing the second circuit pattern in the second insulation layer;
forming a first electrode pad connected to the first circuit pattern by the first via hole on the second insulation layer;
and

forming a second electrode pad connected to the second circuit pattern by the second via hole on the second insulation layer;
wherein the first electrode pad is disposed on a side of the integrated metal projection and the second electrode pad is disposed
on the side of the integrated metal projection in the same direction as that of the first electrode pad, and

wherein the first electrode pad receives a voltage from the first circuit pattern, and the second electrode pad receives a
voltage from the second circuit pattern.

US Pat. No. 9,609,736

TOUCH PANEL AND METHOD OF MANUFACTURING THE SAME

LG INNOTEK CO., LTD., Se...

1. A touch panel comprising:
a substrate including a first area and a second area on at least one side of the first area;
a sensing electrode disposed on the substrate to detect a position;
a wire connected to the sensing electrode;
a plurality of ground electrodes disposed closely to the sensing electrode; and
a pad part placed at one end of at least one of the ground electrodes and connected to a circuit board,
wherein a number of the pad parts is smaller than a number of the ground electrodes;
wherein the second area is formed at a top end or a bottom end of the first area;
wherein the sensing electrode is disposed in the first area;
wherein the wire is disposed in both the first area and the second area;
wherein one part of the wire comprises a transparent part and a remaining part of the wire comprises a metal part;
wherein the transparent part of the wire is disposed in the first area;
wherein the transparent part comprises a transparent conductive oxide;
wherein the metal part of the wire is disposed in the second area;
wherein the metal part comprises a metallic material;
wherein the pad part is disposed in the second area;
wherein an FPCB bonding part is disposed in the second area;
wherein a printing pattern is disposed in the second area;
wherein the ground electrodes are disposed in both the first area and the second area;
wherein each ground electrode disposed in the first area is transparent; and
wherein the printing pattern is disposed at a position corresponding to the metal part, the pad part, and the FPCB bonding
part.

US Pat. No. 9,172,015

LIGHT EMITTING DEVICE, LIGHT EMITTING DEVICE PACKAGE, AND LIGHTING SYSTEM

LG Innotek Co., Ltd., Se...

1. A light emitting device comprising:
a transmissive substrate;
a light emitting structure layer on the transmissive substrate, the light emitting structure layer comprising a first conductive
type semiconductor layer, an active layer on the first conductive type semiconductor layer, and a second conductive type semiconductor
layer on the active layer;

a second electrode on a top surface of the light emitting structure layer and connected to the second conductive type semiconductor
layer;

a plurality of first electrodes disposed in the transmissive substrate and extended from a lower part of the transmissive
substrate to a lower part of the first conductive type semiconductor layer, the plurality of first electrodes being disposed
under a region of the active layer; and

a first electrode layer disposed under the transmissive substrate and connected to the plurality of first electrodes,
wherein the plurality of first electrodes are overlapped with different regions of the second electrode in a vertical direction
and are connected to the first conductive type semiconductor layer,

wherein a top surface of the transmissive substrate includes a first region and a second region which are vertically overlapped
with the first electrode layer,

wherein the first region is vertically overlapped with the light emitting structure layer,
wherein the second region is not vertically overlapped with the light emitting structure layer,
wherein the second region is located at a position more on an outer side relative to the first region.

US Pat. No. 9,629,248

EMBEDDED PRINTED CIRCUIT BOARD

LG INNOTEK CO., LTD., Se...

1. An embedded printed circuit board, comprising:
a first insulating substrate including a first cavity in which a first element is mounted;
a second cavity separated from the first cavity and formed to pass through the first insulating substrate;
an adhesive layer disposed on the first insulating substrate to cover a part of the first cavity and a part of an upper portion
of the first element; and

a second insulating substrate formed on a bottom surface of the second cavity.

US Pat. No. 9,497,853

PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

LG INNOTEK CO., LTD., Se...

1. A printed circuit board comprising:
a first insulating layer;
a second insulating layer under the first insulating layer;
a metal substrate buried in the first insulating layer and the second insulating layer and including a first region and a
second region; and

an outer circuit layer on a top surface of the first insulating layer or a bottom surface of the second insulating layer;
wherein the metal substrate comprises:
at least one via formed through the first and second insulating layers and disposed in the first region of the metal substrate;
an inner circuit layer buried in the first and second insulating layers and disposed in the second region of the metal substrate;
and

an adhesive layer formed on the top surface of the first insulating layer or the bottom surface of the second insulating layer
to expose the via;

wherein the via includes a center part having a first width and a contact part having a second width, the contact part makes
contact with a surface of the first and second insulating layers, and the first width is larger than the second width;

wherein the inner circuit layer comprises:
a first circuit part buried in the first insulating layer; and
a second circuit part buried in the second insulating layer;
wherein a top surface of the via is exposed through the top surface of the first insulating layer, and a bottom surface of
the via is exposed through the bottom surface of the second insulating layer; and

wherein a sectional shape of the via is different from a sectional shape of the inner circuit layer.

US Pat. No. 9,356,197

SEMICONDUCTOR LIGHT EMITTING DEVICE

LG Innotek Co., Ltd., Se...

1. A semiconductor light emitting device comprising:
a substrate;
a light emitting structure on the substrate and comprising a first semiconductor layer, an active layer on the first semiconductor
layer, and a second semiconductor layer on the active layer;

a single electrode layer on the second semiconductor layer;
a first electrode on the first semiconductor layer; and
a second electrode on the single electrode layer,
wherein the single electrode layer has a transparent conductive oxide layer,
wherein the single electrode layer has a first top surface on which the second electrode is disposed and a second top surface
on which the second electrode is not disposed such that light from the active layer is emitted toward the outside through
the second top surface of the single electrode layer,

wherein the second electrode comprises a first p-type electrode and a second p-type electrode which are spaced apart from
each other,

wherein at least a portion of the first p-type electrode of the second electrode directly contacts the single electrode layer,
and

wherein the first electrode comprises a first n-type electrode and a second n-type electrode which are spaced apart from each
other.

US Pat. No. 9,629,217

LIGHTING CONTROL DEVICE AND METHOD

LG INNOTEK CO., LTD., Se...

1. A lighting control system, comprising:
a lighting device; and
a graphical user interface for controlling the lighting device and configured to be displayed on a touch screen of a lighting
control device,

wherein the graphical user interface comprises:
a first display region displaying a menu having two or more lighting control modes; and
a second display region displaying a current value of at least one of color temperature and brightness of the lighting device,
wherein control information of the two or more lighting control modes is preset, wherein the control information comprises
at least one of color temperature and brightness of the lighting device, and

wherein the second display region is configured to allow a user to manually change the current value of at least one of color
temperature and brightness of the lighting device;

wherein each lighting control mode on the menu of the first display region comprises an icon corresponding to said lighting
control mode; and

wherein the lighting control system is configured such that, when a lighting control mode of the two or more lighting control
modes is selected, the first display region highlights the icon of the selected lighting control mode on the menu, relative
to the icon or icons of the remaining, non-selected lighting control mode or modes, and the current value of at least one
of color temperature and brightness of the lighting device changes in the second display region according to the preset control
information of the selected lighting control mode.

US Pat. No. 9,356,338

ANTENNA APPARATUS AND FEEDING STRUCTURE THEREOF

LG INNOTEK CO., LTD., Se...

1. An antenna apparatus comprising:
a radiator;
a feeding structure including a feeding unit to provide a signal to the radiator, a ground unit to ground the radiator, and
a resonance applying part between the feeding unit and the ground unit; and

a contact part to connect the radiator with two out of the three following elements: the feeding unit, the ground unit, and
the resonance applying part.

US Pat. No. 9,337,383

LIGHT EMITTING DEVICE

LG Innotek Co., Ltd., Se...

1. A light emitting device comprising:
a first conductive type semiconductor layer;
a second conductive type semiconductor layer disposed on the first conductive type semiconductor layer; and
an active layer disposed between the first conductive type semiconductor layer and the second conductive type semiconductor
layer, the active layer comprising quantum well layers and quantum barrier layers,

wherein each of the quantum barrier layers includes first barrier layers and a second barrier layer disposed between the first
barrier layers,

an energy bandgap of the second barrier layer is larger than energy bandgaps of the quantum well layers and the energy bandgap
of the second barrier layer is smaller than energy bandgaps of the first barrier layers,

wherein a thickness of each of the first barrier layers is smaller than a thickness of the second barrier layer, and
wherein the thickness of the second barrier layer is 5 nm or less, and the thickness of each of the first barrier layers is
1 nm or less, and

wherein the energy bandgaps of the first barrier layers are larger than an energy bandgap of the first conductive type semiconductor
layer, and the energy bandgaps of the first barrier layers are larger than an energy bandgap of the second conductive type
semiconductor layer.

US Pat. No. 9,480,152

CARRIER TAPE FOR TAB-PACKAGE AND MANUFACTURING METHOD THEREOF

LG INNOTEK CO., LTD., Se...

1. A tape comprising:
a circuit pattern region having a circuit pattern formed on a base film; and
a convey region including sprocket holes formed at both sides of the base film and a line type metal pattern on a top surface
of the base film,

wherein a thickness of the base film in a region where the base film is exposed in the circuit pattern region and a thickness
of the base film in a region where the base film is exposed in the convey region are both thinner than that of a region where
the base film is not exposed in the circuit pattern region and in the convey region,

wherein the top surface of the base film in the region where the base film is exposed in the convey region lies in a first
plane, and the top surface of the base film in the region where the base film is not exposed in the convey region lies in
a second plane different from the first plane,

wherein the metal pattern is disposed on the top surface of the base film in the region where the base film is not exposed
in the convey region,

wherein the top surface of the base film has a concave portion in the circuit pattern region where the base film is exposed,
and

wherein the base film is an insulating film.

US Pat. No. 9,468,096

EPOXY RESIN COMPOSITION, AND PRINTED CIRCUIT BOARD USING SAME

LG INNOTEK CO., LTD., Se...

9. A printed circuit board comprising:
a metal plate;
an insulating layer formed on the metal plate; and
a circuit pattern formed on the insulating layer,
wherein the insulating layer is made of the epoxy resin composition defined in claim 1.

US Pat. No. 9,454,275

TOUCH PANEL

LG INNOTEK CO., LTD., Se...

1. A touch panel comprising:
a cover substrate comprising an active area and an inactive area;
a sensing electrode on the active area; and
a wire electrode on the inactive area,
wherein the wire electrode comprises a material the same as a material constituting the sensing electrode,
wherein the wire electrode comprises:
a first wire electrode;
a second wire electrode on the first wire electrode; and
a second insulating layer between the first and second wire electrodes, and
wherein the first and second wire electrodes comprise materials the same as the material constituting the sensing electrode.

US Pat. No. 9,418,794

MEMS VARIABLE CAPACITOR

LG INNOTEK CO., LTD., Se...

1. A MEMS (micro-electromechanical system) variable capacitor, the capacitor characterized by: a first electrode;
a second electrode that is floated on the first electrode; and
a fixed third electrode configured to variably adjust a capacitance value of the MEMS variable capacitor, wherein when a voltage
is applied to the third electrode, a distance between the first electrode and the second electrode is increased in response
to the applied voltage;

wherein the second electrode is vertically disposed between the first electrode and the third electrode, and
wherein a radio frequency (RF) signal is transmitted from the third electrode to the second electrode.

US Pat. No. 9,373,745

LUMINOUS ELEMENT

LG INNOTEK CO., LTD., Se...

1. A light emitting device comprising:
a first conductive semiconductor layer;
an active layer over the first conductive semiconductor layer;
a second conductive semiconductor layer over the active layer;
a first bonding layer on the second conductive semiconductor layer;
a second bonding layer on the first bonding layer;
a schottky diode layer on the second bonding layer;
an insulating layer including a first and a second insulating layer, wherein the first insulating layer covers portions of
an upper surface of the schottky diode layer, a side surface of the schottky diode layer and an upper surface of the second
bonding layer,

wherein the second insulating layer covers a lateral side of the schottky diode layer and lateral sides of the first and the
second bonding layers;

a first electrode layer disposed on a portion of an upper surface of the first insulating layer, a side surface of the second
insulating layer and a portion of the upper surface of the schottky diode layer; and

a second electrode layer disposed on the upper surface of the first insulating layer and the upper surface of the second bonding
layer.

US Pat. No. 9,128,225

LIGHT GUIDE PLATE HAVING SAG CONTROL PATTERNS AND BACK LIGHT UNIT USING THE SAME

LG INNOTEK CO., LTD., Se...

1. A light guiding plate with sag control patterns, comprising:
one surface emitting ht and another surface opposite to the light emitting surface, the another surface being formed with
one or more optical patterns, wherein sags of the one or more optical patterns increase as the optical patterns become more
distant from a light source,

wherein each of the optical patterns is a concave pattern formed in a depth direction of the light guide plate.

US Pat. No. 9,054,258

SEMICONDUCTOR LIGHT EMITTING DEVICE

LG INNOTEK CO., LTD., Se...

5. A semiconductor light emitting device comprising:
a substrate;
a light emitting structure on the substrate comprising a first semiconductor layer including a first portion and a second
portion, an active layer on the first portion of the first semiconductor layer, and a second semiconductor layer on the active
layer;

a transparent electrode layer on the second semiconductor layer of the light emitting structure;
a first electrode on a second portion of the first semiconductor layer; and
a second electrode comprising two or more divided parts, the divided parts of the second electrode configured to electrically
interconnect to each other,

wherein the transparent electrode layer includes an ITO material, wherein at least portions of the two or more divided parts
of the second electrode are configured to directly contact the transparent electrode layer, and

wherein the divided parts of the second electrode comprise a metal layer and a reflective electrode disposed on the metal
layer, the metal layer directly contacting at least a portion of a top surface of the transparent electrode layer,

wherein the first electrode includes two or more divided parts,
wherein at least portions of the two or more divided parts of the first electrode are spaced apart from each other, and
wherein at least portions of the two or more divided parts of the second electrode are spaced apart from each other.

US Pat. No. 9,516,233

MICRO ELECTRO MECHANICAL SYSTEMS DEVICE AND APPARATUS FOR COMPENSATING TREMBLE

LG INNOTEK CO., LTD., Se...

1. A MEMS device comprising:
a substrate;
a driven member moving relative to the substrate;
an elastic member connected to the driven member and the substrate;
a driving member fixed to the substrate for driving the driven member;
a dynamic stopper fixed to the substrate and latched to the driven member;
an insulation layer coated on an entire surface of the dynamic stopper;
wherein the driven member comprises a latch groove,
wherein the dynamic stopper is inserted into the latch groove to fix the driven member, and
wherein the insulation layer is interposed between the dynamic stopper and an inner wall of the latch groove and inserted
into the latch groove when the driven member is not being driven by the driving member; and

wherein the dynamic stopper is entirely spaced apart from the inner wall of the latch groove by the insulation layer.

US Pat. No. 9,491,856

LIGHT EMITTING DEVICE ARRAY AND LIGHT SYSTEM

LG INNOTEK CO., LTD., Se...

1. A light system comprising:
a printed circuit board including a base layer, a first protection layer which is in contact with at least one surface of
the base layer, an insulating layer disposed on the base layer, a conduction layer disposed on the insulating layer, and a
second protection layer contacting at least one side surface of the base layer; and

a light emitting device package mounted on the conduction layer,
wherein the base layer includes iron (Fe),
wherein the first protection layer includes at least one of aluminum (Al), silicon (Si), and zinc (Zn),
wherein the second protection layer includes an oxide film,
wherein the base layer has a smaller thermal resistance than the first protection layer, and
wherein a width of the conduction layer is equal to a width of the insulating layer.

US Pat. No. 9,478,703

LIGHT EMITTING DEVICE

LG INNOTEK CO., LTD., Se...

1. A light emitting device comprising:
a substrate; and
a light extraction layer provided over the substrate, the light extraction layer having a refraction index higher than a refraction
index of the substrate and lower than a refraction index of a light emitting structure and including a first surface contacting
the substrate and a second surface provided opposite to the first surface, wherein the first surface has a greater area than
an area of the second surface, wherein the light extraction layer includes first, second, and third layers, wherein the first,
second, and third layers each contact a continuous substantially planar upper surface of the substrate, wherein the first
layer is provided over the second layer and has a side surface contacting a side surface of the second layer, wherein the
second layer is provided over the third layer and has a side surface contacting a side surface of the third layer, wherein
the light emitting structure is provided over the light extraction layer, wherein the first, second, and third layers include
a plurality of light extraction structures, and wherein at least one of the light extraction structures has a tetrahedral
shape, and wherein the light emitting structure includes a first conductive type semiconductor layer, a second conductive
type semiconductor layer, and an active layer therebetween.

US Pat. No. 9,445,499

EPOXY RESIN COMPOSITION, AND PRINTED CIRCUIT BOARD USING SAME

LG INNOTEK CO., LTD., Se...

8. A printed circuit board comprising:
a metal plate,
an insulating layer formed on the metal plate; and
a circuit pattern formed on the insulating layer,
wherein the insulating layer is made of the epoxy resin composition defined in claim 1.

US Pat. No. 9,439,271

LIGHTING CONTROL METHOD AND LIGHTING CONTROL SYSTEM

LG INNOTEK CO., LTD., Se...

1. A lighting control system comprising:
lighting devices; and
a lighting control apparatus for registering at least one of the lighting devices and for controlling the registered lighting
device;

wherein the lighting control apparatus registers at least one of the lighting devices as a reference lighting device and registers
at least one of other lighting devices by using the reference lighting device;

wherein the reference lighting device transmits a peripheral search signal to the other lighting devices according to a command
of the lighting control apparatus, receives a response message corresponding to the peripheral search signal from at least
one of the other lighting devices, and notifies the response message to the lighting control apparatus;

wherein each lighting device has intrinsic identification data; and
wherein the at least one of the other lighting devices transmits the response message including the intrinsic identification
according to the peripheral search signal.

US Pat. No. 9,224,922

LIGHT EMITTING DEVICE

LG INNOTEK CO., LTD., Se...

1. A light emitting device comprising:
a substrate;
a light emitting structure on the substrate and including a first conductive semiconductor layer, an active layer, and a second
conductive semiconductor layer;

a reflective electrode on the second conductive semiconductor layer;
a second bump over the reflective electrode; and
a first prevention layer provided between the reflective electrode and the second bump to prevent a delamination of the reflective
electrode; and

a second electrode pad and a second bump pad between the first prevention layer and the second bump, wherein the second electrode
pad covers the first prevention layer.

US Pat. No. 9,214,868

POWER SUPPLY DEVICE

LG INNOTEK CO., LTD., Se...

1. A power supply device comprising:
a half bridge circuit configured to include a first switch connected to a first node and a third node, a second switch connected
to a second node and the third node, a first capacitor connected to the first node and a fourth node, and a second capacitor
connected to the second node and the fourth node;

a full bridge circuit configured to include a third switch connected to a fifth node and a seventh node, a fourth switch connected
to a sixth node and the seventh node, a fifth switch connected to the fifth node and an eighth node, and a sixth switch connected
to the sixth node and the eighth node;

a transformer configured to include a first winding connected to the third node and the fourth node, and a second winding
connected to the seventh node and the eighth node;

first to sixth diodes configured to be connected to the first to sixth switches, respectively;
wherein during a load mode, a turn-off state of the third to sixth switches is maintained when a first input voltage between
the first node and the second node is converted to a first output voltage between the fifth node and the sixth node; and

wherein during a power mode, a turn-off state of the first and second switches is maintained when a second input voltage between
the fifth node and the sixth node is converted to a second output voltage between the first node and the second node.

US Pat. No. 9,146,413

TOUCH WINDOW

LG INNOTEK CO., LTD., Se...

1. A touch window comprising:
a cover window where a view area and a dead area surrounding the view area are defined;
an electrode in the view area, the electrode sensing a touch position;
an electrode substrate on which the electrode is formed;
a sensor part in the dead area, the sensor part including a light receiving part and a light emitting part; and
a scattered-reflection control part between the cover window and the sensor part.

US Pat. No. 9,112,114

LIGHT EMITTING DEVICE WITH METAL ELECTRODE LAYER HAVING PROTRUSION PORTIONS

LG INNOTEK CO., LTD., Se...

1. A light emitting device comprising:
a conductive substrate;
a first electrode layer disposed on the conductive substrate;
a light emitting structure disposed on the first electrode layer, the light emitting structure including a first semiconductor
layer, a second semiconductor layer, and an active layer disposed between the first semiconductor layer and the second semiconductor
layer; and

a second electrode layer electrically connected to the second semiconductor layer,
wherein the first electrode layer comprises:
a metal electrode layer disposed on the conductive substrate;
a transparent electrode layer disposed on the metal electrode layer; and
a plurality of contact portions extending from the metal electrode layer, the contact portions vertically passing through
the transparent electrode layer and contacting the light emitting structure,

wherein the contact portions are spaced from one another by a predetermined distance, and
wherein the contact portion comprises AuBe.

US Pat. No. 9,105,761

LIGHT EMITTING DIODE AND METHOD FOR MANUFACTURING THE SAME

LG INNOTEK CO., LTD., Se...

1. A light emitting device, comprising:
a substrate; and
a light emitting structure on the substrate, comprising a first semiconductor layer, a second semiconductor layer on the first
semiconductor layer, and an active layer between the first and second semiconductor layers,

wherein the substrate has at least one side surface extending outwardly as the substrate extends in a direction from a bottom
surface of the substrate to a top surface of the substrate,

wherein the at least one side surface includes a first portion, a transition portion connected to the first portion, and a
second portion connected to the transition portion, the first portion provides a first obtuse inclination angle with reference
to the bottom surface of the substrate and the transition portion provides a second obtuse inclination angle with reference
to the bottom surface of the substrate, the second obtuse inclination angle is larger than the first obtuse inclination angle,
and

wherein the second portion includes a vertical side surface with reference to the bottom surface of the substrate.

US Pat. No. 9,054,747

MOBILE TERMINAL AND POWER CONTROL METHOD THEREOF

LG INNOTEK CO., LTD., Se...

1. A mobile terminal comprising:
a receiving unit to wirelessly receive power from a wireless power transmitter; and
a sensing unit to sense a call signal,
wherein, when the call signal is sensed, the mobile terminal transmits a transmission power control signal, for controlling
transmission power of the wireless power transmitter, to the wireless power transmitter;

wherein, when the call signal is sensed, the mobile terminal transmits a transmission power blocking signal for blocking the
transmission power to the wireless power transmitter; and

wherein the mobile terminal transmits a transmission power resuming signal to the wireless power transmitter to resume the
power transmission when the measured call reception sensitivity is equal to or more than a threshold value after the transmission
power blocking signal is transmitted.

US Pat. No. 9,490,677

MOTOR

LG INNOTEK CO., LTD., Se...

1. A motor with rotation prevention of a terminal housing, comprising:
an insulator body coupled to a stator core wound with a plurality of coils applied with an electric power having mutually
different polarities;

a terminal housing coupling unit integrally formed with the insulator body, protruded in a circumferential direction; and
a terminal housing coupled to the terminal housing coupling unit to supply an electric power to the motor;
wherein the terminal housing coupling unit includes a hook member comprising a regulation protrusion protrusively formed at
opposite ends of the terminal housing coupling unit,

wherein the terminal housing includes a side guide plate formed at each distal end of the terminal housing,
wherein each side guide plate is formed with an elongated channel for slidably passing the hook member and a hook portion
at an upper end of the channel to be coupled with the hook member; and

wherein the hook portion includes a through hole having an arc-shaped inner surface thereof and communicably connected to
the upper end of the elongated channel, and a regulation slit slantly formed at the arc-shaped inner surface, such that the
regulation protrusion is slidably inserted into the regulation slit to inhibit a rotation of the terminal housing.

US Pat. No. 9,462,689

EPOXY RESIN COMPOSITION AND PRINTED CIRCUIT BOARD INCLUDING INSULATING LAYER USING THE EPOXY RESIN COMPOSITION

LG INNOTEK CO., LTD., Se...

11. A printed circuit board, comprising:
a metal plate;
an insulating layer formed on the metal plate; and
a circuit pattern formed on the insulating layer,
wherein the insulating layer includes an epoxy resin composition having an epoxy compound including an epoxy compound of the
following Chemical Formula 1, a curing agent including diaminodiphenyl sulfone, and an inorganic filler:


wherein each of R1 to R14 is selected from the group consisting of H, Cl, Br, F, an alkyl group having 1 to 3 carbon atoms, an alkene group having 2
to 3 carbon atoms, and an alkyne group having 2 to 3 carbon atoms, where each of m and n is 2 or 3.

US Pat. No. 9,353,914

LIGHTING DEVICE

LG Innotek Co., Ltd., Se...

1. A lighting device comprising:
a heat sink that includes a body and a member, the body having a first surface, and the member extending from the first surface
of the body in a first direction, the first surface of the body being planar, the member having a plurality of side surfaces
and a top surface;

a substrate on one of the plurality of side surfaces of the member, the substrate having a top surface and a bottom surface,
the bottom surface of the substrate being closer to the first surface of the body than the top surface of the substrate;

a first plurality of light emitting devices on the substrate,
wherein the member has a one-third point and a two-thirds point in the first direction from the first surface of the body
to the top surface of the member,

wherein a center point of the first plurality of light emitting devices is higher than the two-thirds point of the member,
wherein the bottom surface of the substrate is higher than the one-third point of the member,
wherein a center point of the substrate between the top surface of the substrate and the bottom surface of the substrate is
higher than the two-thirds point of the member, and

wherein the top surface of the substrate is higher than the two-thirds point of the member.

US Pat. No. 9,297,513

DISPLAY APPARATUS HAVING ILLUMINATION UNIT WITH SPECIFIC BRACKET

LG INNOTEK CO., LTD., Se...

1. An illumination unit, comprising:
first and second reflectors;
at least one light source module located between the first and second reflectors; and
a bracket configured to support the light source module,
wherein the bracket includes:
a first segment on which the light source module is placed;
a second segment disposed at one side of the second reflector;
a third segment disposed between the first and second segments; and
fastening members disposed respectively at the first, second and third segments.

US Pat. No. 9,188,308

LIGHT EMITTING DEVICE PACKAGE AND ILLUMINATION APPARATUS

LG INNOTEK CO., LTD., Se...

1. A light emitting device package comprising:
a body;
a light emitting device on the body; and
a lens disposed on the light emitting device,
wherein the lens comprises:
a lower surface portion;
an upper surface portion parallel to the lower surface portion; and
a lateral surface portion positioned between the lower surface portion and the upper surface portion,
wherein the lateral surface portion has a plurality of lateral surfaces,
wherein the plurality of lateral surfaces is formed in a shape of a parabola, and
wherein each of the lateral surfaces comprises:
first to k-th regions divided in a column direction; and
a recess having a predetermined curvature in at least one of the first to k-th regions,
wherein the first region is adjacent to the upper surface portion and the k-th region is adjacent to the lower surface portion,
and

wherein the column direction is directed from the upper surface portion to the lower surface portion.

US Pat. No. 9,115,881

LIGHTING LAMP

LG INNOTEK CO., LTD., Se...

1. A lighting lamp comprising:
a light emission module provided with at least one light emission element;
a heat sink housing the light emission module, having a first heat transfer flow path on an outer peripheral surface thereof
and emitting heat energy of the light emission module; and

a globe connected to the heat sink to cover the light emission module exposed on the heat sink and provided with a second
heat transfer flow path on an outer peripheral surface thereof to guide air heated by the light emission module toward the
outer peripheral surface of the heat sink.

US Pat. No. 9,070,613

LIGHT EMITTING DEVICE

LG INNOTEK CO., LTD., Se...

1. A light emitting device comprising:
a light emitting structure comprising a first section and a second section, wherein the first section comprises a first semiconductor
layer doped with a first dopant, a second semiconductor layer doped with a second dopant, and a first active layer between
the first and second semiconductor layers, and wherein the second section comprises a third semiconductor layer disposed on
the first section and doped with the first dopant, the third semiconductor layer having an exposed region, a fourth semiconductor
layer disposed on the third semiconductor layer except for the exposed region and doped with the second dopant, and a second
active layer between the third and fourth semiconductor layers;

a first electrode disposed on the first semiconductor layer;
a second electrode disposed on the fourth semiconductor layer; and
a third electrode inserted into a hole penetrating the exposed region of the third semiconductor vertically so as to be disposed
on the exposed region and the second semiconductor layer, the third electrode electrically connected to the second and third
semiconductor layers,

wherein the second semiconductor layer and the third semiconductor layer are directly contacted with each other.

US Pat. No. 9,362,454

GALLIUM NITRIDE BASED LIGHT EMITTING DIODE

LG Innotek Co., Ltd., Se...

1. A light emitting diode comprising:
an un-doped GaN layer having a thickness of 1 ?m ˜3 ?m;
a first conductive type semiconductor layer on the un-doped GaN layer;
at least one InxGa1?xN layer (0
at least one GaN layer having a thickness of 10 Ř30 Šdirectly on the at least one InxGa1?xN layer(0
an active layer directly on the at least one GaN layer;
a second conductive type semiconductor layer on the active layer; and
a transparent ITO (Indium-Tin-Oxide) layer on the second conductive type semiconductor layer;
wherein the active layer comprises a well layer including an InGaN and a barrier layer including a GaN,
wherein a thickness of the barrier layer is greater than a thickness of the well layer, and
wherein a thickness of the at least one InxGa1?x N layer (0

US Pat. No. 9,285,563

IMAGING LENS

LG INNOTEK CO., LTD., Se...

1. An imaging lens, the imaging lens comprising, in an ordered way from an object side:
a first lens having positive (+) refractive power;
a second lens having negative (?) refractive power;
a third lens having positive (+) refractive power and having an image side surface taking a convexly formed meniscus shape;
a fourth lens having positive (+) refractive power and having an image side surface taking a convexly formed meniscus shape;
and

fifth lens having negative (?) refractive power,
wherein the fifth lens is convexly formed at an object side surface, and the imaging lens meets a conditional expression of
20 number of the fourth lens is V4, and Abbe's number of the fifth lens is V5.

US Pat. No. 9,209,363

LIGHT EMITTING DEVICE WITH IMPROVED CURRENT SPREADING PERFORMANCE AND LIGHTING APPARATUS INCLUDING THE SAME

LG INNOTEK CO., LTD., Se...

1. A light emitting device, comprising:
a light emitting structure comprising a first conductivity type semiconductor layer, a second conductivity type semiconductor
layer, and an active layer disposed between the first conductivity type semiconductor layer and the second conductivity type
semiconductor layer;

a first electrode disposed on the first conductivity type semiconductor layer; and
a second electrode disposed on the second conductivity type semiconductor layer,
wherein the light emitting structure comprises a mesa etching region where the second conductivity type semiconductor layer,
the active layer, and the first conductivity type semiconductor layer are etched, thereby exposing a portion of the first
conductivity type semiconductor layer in the mesa etching region, and the first electrode is disposed on the exposed portion
of the first conductivity type semiconductor layer in the mesa etching region,

wherein a first electrode layer is disposed between the second conductivity type semiconductor layer and the second electrode,
and a second electrode layer is disposed between portions of the first electrode layer spaced from each other at opposite
sides of the mesa etching region, and

wherein opposite ends of the second electrode layer are disposed directly on the first electrode layer.

US Pat. No. 9,190,566

LIGHT EMITTING DEVICE

LG INNOTEK CO., LTD., Se...

1. A light emitting device comprising:
a substrate;
a first buffer layer on the substrate;
a first insulating layer on the first buffer layer;
a second buffer layer on the first insulating layer;
a second insulating layer on the second buffer layer;
a third buffer layer around the second buffer layer and the second insulating layer; and
a light emitting structure on the third buffer layer.

US Pat. No. 9,127,827

LIGHTING DEVICE

LG INNOTEK CO., LTD., Se...

1. A lighting device comprising:
an optically transmissive enclosure having a hollow interior;
a heat sink including
a base coupled to the enclosure, the base having a body with a planar upper surface, and
an extension extending from the upper planar surface of the base into the hollow interior of the optically transmissive enclosure
in a first direction, which is perpendicular to the upper planar surface, the extension including a lower end proximate to
an upper end of the base, an upper end, and a plurality of side walls provided between the lower end and the upper end, the
plurality of side walls having first and second walls, which are opposing walls, a first distance in a second direction between
upper ends of the first and second walls is less than a second distance between lower ends of the first and second walls,
the second direction being perpendicular to the first direction; and

a first light source provided on a first surface provided between the upper and lower ends of the first wall and a second
light source provided on a second surface between the upper and lower ends of the second wall, each of the first and second
light sources includes a plurality of light emitting devices provided on a substrate having a rectangular shape and a first
lens module having the rectangular shape provided over the light emitting devices and the substrate of the first light source
and a second lens module having the rectangular shape provided over the light emitting devices and the substrate of the second
light source.

US Pat. No. 9,081,205

CAMERA MODULE AND OPTICAL IMAGE STABILIZING UNIT

LG Innotek Co., Ltd., Se...

1. An OIS (Optical Image Stabilization) unit, comprising:
a housing unit including a first housing and a second housing disposed on the first housing and centrally formed with an opening;
a holder module including an outer blade spaced upwardly apart from the first housing at a predetermined distance, a bobbin
disposed inside the outer blade, and a spring member arranged at the outer blade and supporting a movement of the bobbin in
a direction along an optical axis;

an autofocus driving unit including an autofocus coil arranged at a periphery of the bobbin, and a magnet that interacts with
the autofocus coil;

an OIS driving unit including the magnet and an OIS coil, the magnet and the OIS coil being discretely arranged on the housing
unit and the holder module;

a wire that supports a movement of the holder module to a direction perpendicular to the optical axis by the OIS driving unit
while being spaced apart from the first housing at a predetermined distance, and electrically connected to the autofocus coil
through the spring member configured to provide a current to the autofocus coil; and

a buffering portion disposed near to a connection portion connecting the wire to the holder module or the housing unit.

US Pat. No. 9,591,727

LIGHTING SYSTEM AND METHOD OF CONTROLLING THE SAME

LG INNOTEK CO., LTD., Se...

1. A lighting system comprising:
a lighting device; and
a graphic user interface displayed on a touch screen of a lighting control device to control the lighting device,
wherein the graphic user interface comprises:
a first region to display a map for an installation space of the lighting device and a lighting icon corresponding to the
lighting device in the map, and

a second region to display a menu for setting a control condition of the lighting device corresponding to the lighting icon,
and

wherein the map comprises a plurality of division spaces obtained by dividing the installation space into a plurality of regions
and the lighting icon is displayed in a specific division space corresponding to an actual installation portion of the lighting
device;

wherein the lighting icon comprises:
a first type lighting icon to represent the lighting device under on-state, and
a second type lighting icon to represent the lighting device under off-state;
wherein the graphic user interface further comprises a third region to display a menu for changing an operation state of the
lighting device corresponding to a second-selected lighting icon as a specific lighting icon is second-selected from among
lighting icons displayed in the first region, and

wherein the menu displayed in the third region comprises:
a first menu to change a state of a power source of the lighting device corresponding to the second-selected lighting icon,
and

a second menu to change a brightness of the lighting device corresponding to the second-selected lighting icon.

US Pat. No. 9,489,101

TOUCH PANEL AND TOUCH DEVICE WITH THE SAME

LG INNOTEK CO., LTD., Se...

1. A touch panel comprising:
a substrate comprising an active area to detect a position of an input device and an inactive area provided at a peripheral
portion of the active area;

a sensing electrode with a plurality of conductive patterns on the substrate;
a top buffer layer disposed on a top surface of the sensing electrode; and
a bottom buffer layer disposed at a bottom surface of the sensing electrode;
wherein the sensing electrode is arranged with a shape of a mesh;
wherein the sensing electrode comprises a metal;
wherein a line width of the top buffer layer is greater than a line width of the sensing electrode;
wherein a ratio of the line width of the sensing electrode to the line width of the top buffer layer is in a range of 1:1.3
to 1:2;

wherein a line width of the bottom buffer layer is greater than the line width of the sensing electrode;
wherein the top buffer layer comprises a first reflection prevention part and a second reflection prevention part surrounding
the first reflection prevention part, and the second reflection prevention part is disposed on a lateral side of the sensing
electrode;

wherein the top buffer layer and the bottom buffer layer each comprises a darkening layer;
wherein the second reflection prevention part is spaced apart from the lateral side of the sensing electrode;
wherein an end of the top buffer layer is disposed at a level lower than a height of the top surface of the sensing electrode;
wherein the second reflection prevention part is formed with an acute inclination angle with respect to the lateral side of
the sensing electrode,

wherein the second reflection prevention part is bent toward the substrate from the first reflection prevention part,
wherein the bottom buffer layer is formed with a vertical inclination angle with respect to the lateral side of the sensing
electrode,

wherein the substrate is exposed between adjacent conductive patterns of the plurality of conductive patterns,
wherein the sensing electrode is disposed on the active area of the substrate, and
wherein the top buffer layer comprises material of a different etching rate in reaction to an etching than does the sensing
electrode.

US Pat. No. 9,482,846

IMAGING LENS

LG INNOTEK CO., LTD., Se...

1. An imaging lens, the imaging lens comprising:
in an ordered way from an object side,
a first lens having positive (+) refractive power;
a second lens having negative (?) refractive power;
a third lens having negative (?) refractive power;
a fourth lens having positive (+) refractive power; and
a fifth lens having negative (?) refractive power,
meeting a conditional expression of 0.6 meeting a conditional expression of 0.8 lens to an image-forming surface, and FLD is a distance from an optical axis to a maximum image height.

US Pat. No. 9,484,776

MOTOR

LG INNOTEK CO., LTD., Se...

1. A rotor of a motor, the rotor comprising:
a first rotor comprising a first rotor core and a plurality of first magnets that is coupled to an outer circumferential surface
of the first rotor core;

a second rotor comprising a second rotor core and a plurality of second magnets that is coupled to an outer circumferential
surface of the second rotor core; and

a third rotor stacked between the first rotor and the second rotor, and comprising a third rotor core and a plurality of third
magnets that is coupled to an outer circumferential surface of the third rotor core,

wherein magnetic fluxes of the plurality of third magnets are less than magnetic fluxes of the plurality of first magnets
or second magnets;

wherein the plurality of third magnets comprises materials having magnetic fluxes that are less than the magnetic fluxes of
the plurality of first magnets or second magnets; and

wherein the plurality of first magnets is skewed at a first skew angle with respect to the plurality of third magnets, and
the plurality of second magnets is skewed at a second skew angle with respect to the plurality of third magnets.

US Pat. No. 9,478,710

LIGHT-EMITTING DEVICE, LIGHT-EMITTING DEVICE PACKAGE, AND LIGHT UNIT

LG INNOTEK CO., LTD., Se...

1. A light-emitting device comprising:
a light-emitting structure comprising a first conductive semiconductor layer, an active layer under the first conductive semiconductor
layer, and a second conductive semiconductor layer under the active layer;

a reflective electrode arranged under the light-emitting structure and comprising a first region under the second conductive
semiconductor layer and a second region extending from the first region to pass through the second conductive semiconductor
layer and the active layer;

an electrode electrically connected to the first conductive semiconductor layer; and
a metal layer making contact with the second region of the reflective electrode, wherein a first region of the metal layer
is located higher than the active layer,

wherein an uppermost surface of the reflective electrode, which extends from the second region of the reflective electrode,
overlaps with the electrode in a vertical direction,

wherein a second region of the metal layer makes contact with a bottom surface of the second conductive semiconductor layer
and a third region of the metal layer extends outward from the second region of the metal layer,

wherein the third region of the metal layer is exposed to a lower peripheral portion of the light-emitting structure, and
wherein the metal layer is disposed around a lower portion of the light-emitting structure to form a metal channel layer.

US Pat. No. 9,442,613

TOUCH WINDOW

LG INNOTEK CO., LTD., Se...

1. A touch window comprising:
a substrate; and
an electrode part on the substrate,
wherein the electrode part comprises:
a first sub-pattern;
an electrode layer on the first sub-pattern;
a second sub-pattern adjacent to the first sub-pattern; and
a third sub-pattern on a top surface of the first sub-pattern,
wherein the third sub-pattern comprises a plurality of protrusions,
wherein the electrode layer is provided on the third sub-pattern,
wherein the electrode layer is provided in a shape of a mesh,
wherein the third sub-pattern has a height lower than a height of the second sub-pattern; and
wherein the electrode layer includes Cu, Au, Ag, Al, Ti, Ni, or an alloy thereof.

US Pat. No. 9,419,184

LIGHT-EMITTING DEVICE, LIGHT-EMITTING DEVICE PACKAGE, AND LIGHT UNIT

LG INNOTEK CO., LTD., Se...

1. A light emitting device comprising:
a substrate;
a bonding layer disposed on the substrate;
a metal layer disposed on the bonding layer;
a reflective electrode disposed on the metal layer;
an ohmic contact layer disposed on the reflective electrode layer;
a light emitting structure disposed on the ohmic contact layer and comprising a first conductive semiconductor layer, an active
layer and a second conductive semiconductor layer;

an electrode disposed in the first conductive semiconductor layer; and
a pad disposed on the electrode,
wherein the ohmic contact layer is in contact with the second conductive semiconductor layer,
wherein the metal layer has a first region and a second region adjacent to the first region,
wherein the first region is disposed under the light emitting structure,
wherein the second portion is extended outwardly from the first region and is exposed to a lower outer peripheral portion
of the light emitting structure, and

wherein a light extraction pattern is provided on a top surface of the light emitting structure and a top surface of the electrode.

US Pat. No. 9,323,094

TOUCH PANEL

LG INNOTEK CO., LTD., Se...

1. A touch panel comprising:
a substrate;
a sensor part on the substrate;
an insulating layer on the substrate; and
a connection electrode to connect the sensor part on the substrate;
wherein the insulating layer comprises first and second insulating layers, and the first and second insulating layers are
provided while interposing the connection electrode therebetween;

wherein the first insulating layer is disposed on the sensor part and the connection electrode;
wherein the first insulating layer comprises a hole to connect the connection electrode with the sensor part, and
wherein the second insulating layer has a width that is less than a width of the connection electrode or corresponds to the
width of the connection electrode.

US Pat. No. 9,223,076

SEMICONDUCTOR LIGHT EMITTING DEVICE PACKAGE

LG INNOTEK CO., LTD., Se...

1. A semiconductor light emitting device package, comprising:
a body;
a first reflective cup and a second reflective cup provided at a top surface of the body and spaced apart from each other;
a first connection pad provided at the top surface of the body and spaced apart from the first reflective cup and the second
reflective cup;

a second connection pad provided at the top surface of the body and spaced apart from the first reflective cup, the second
reflective cup and the first connection pad;

a first semiconductor light emitting device disposed in the first reflective cup; and
a second semiconductor light emitting device disposed in the second reflective cup, wherein each of the first connection pad
and the second connection pad includes:

an upper portion exposed from top surface of the body; and
a lead frame connected to the upper portion while extending through a side wall of the body so as to be exposed to an outside
of the body, wherein the lead frame includes:

a bent portion bent from the upper portion toward a bottom surface of the body; and
a horizontal portion connected to the bent portion and extending in parallel to the upper portion, and wherein a portion of
the horizontal portion is exposed from the side of the body and the bottom surface of the body.

US Pat. No. 9,190,580

PHOSPHOR AND LIGHT EMITTING DEVICE HAVING THE SAME

LG INNOTEK CO., LTD., Se...

1. A phosphor expressed by a composition formula of LaxOySi6Al4N12:Ce3+z,
wherein O comprises oxygen, and
the x is in a range of 2?x?8, the y is in a range of 3?y?12, and the z is in a range of 0 in the blue range.

US Pat. No. 9,184,349

LIGHT EMITTING DEVICE, ADHESIVE HAVING SURFACE ROUGHNESS, AND LIGHTING SYSTEM HAVING THE SAME

LG INNOTEK CO., LTD., Se...

1. A light emitting device comprising:
a body having a cavity;
first and second lead frames spaced apart from each other in the cavity;
a gap part disposed between the first and second lead frames;
an adhesive material extending from at least one of lateral sides of the cavity to a top surface of at least one of the first
and second lead frames;

a light emitting chip disposed on at least one of the first and second lead frames; and
a molding member adhering to the adhesive material in the cavity,
wherein a portion of the adhesive material has a surface roughness in a range of 0.116 ?m to 0.290 ?m.

US Pat. No. 9,184,634

WIRELESS POWER TRANSMITTER AND WIRELESS POWER TRANSMISSION METHOD

LG INNOTEK CO., LTD., Se...

1. A wireless power transmitter which wirelessly transmits power to a wireless power receiver, the wireless power transmitter
comprising:
a power source configured to supply the power to the wireless power transmitter;
a transmission resonance coil capable of generating a magnetic field and transmitting the power using resonance to the wireless
power receiver that has a resonant frequency value equal to that of the wireless power transmitter;

a detector configured to measure an intensity of the magnetic field; and
a controller configured to determine an existence state of the wireless power receiver based on the measured intensity of
the magnetic field and to control a transmission pattern of the magnetic field according to the determined existence state
of the wireless power receiver,

wherein the controller controls to generate the transmission pattern of the magnetic field that is pulsed at a predetermined
time interval for a specific time if the wireless power receiver does not exist and to generate the transmission pattern of
the magnetic field that is continuous if the wireless power receiver exists, and

wherein the controller further controls a power intensity of the magnetic field to vary during the continuous generation of
the transmission pattern based on a power requirement of the wireless power receiver.

US Pat. No. 9,166,078

SOLAR CELL APPARATUS AND METHOD FOR MANUFACTURING THE SAME

LG INNOTEK CO., LTD., Se...

1. A solar cell apparatus comprising:
a substrate including a cell region and an outer peripheral region surrounding the cell region;
a cell in the cell region; and
a connection electrode connected to the cell and provided in the outer peripheral region,
wherein the cell comprises:
a back electrode on the substrate;
a light absorbing part on the back electrode; and
a front electrode on the light absorbing part;
wherein the connection electrode in the outer peripheral region is formed as an extension of the back electrode disposed in
the cell region,

wherein the connection electrode is integrally formed with the back electrode, and
wherein a thickness of the connection electrode is same as a thickness of the back electrode.

US Pat. No. 9,136,451

LIGHT EMITTING DEVICE PACKAGE AND LIGHT UNIT INCLUDING THE SAME

LG INNOTEK CO., LTD., Se...

1. A light emitting device package comprising:
a body formed of an insulating material and having a recess;
a first lead frame having a first cavity in the recess of the body;
a second lead frame having a second cavity in the recess of the body;
a first bonding part connected to the first lead frame on a bottom of the recess;
a second bonding part connected to the second lead frame on a bottom of the recess;
a first light emitting device in the first cavity;
a second light emitting device in the second cavity;
a third cavity spaced apart from the first and second cavities and disposed in the recess;
a first protective device disposed in the third cavity and connected to at least one of first and second light emitting devices;
and

a molding member disposed in the recess.

US Pat. No. 9,089,015

LIGHT EMITTING MODULE

LG INNOTEK CO., LTD., Se...

1. A light emitting module, comprising:
a body;
a plurality of light emitting devices disposed on the body; and
a turn-on controller configured to control turn-on of the plurality of light emitting devices,
wherein at least some neighboring light emitting devices among the plurality of light emitting devices are spaced apart from
one another by different distances,

wherein each of the plurality of light emitting devices includes
a light emitting cell configured to emit light, and
n1 and n2 lead frames (here, 1?n?N) disposed on the body so as to be electrically connected to the light emitting cell and electrically
spaced apart from each other.

US Pat. No. 9,560,253

CAMERA MODULE HAVING A SEALING MEMBER

LG INNOTEK CO., LTD., Se...

1. A camera module comprising:
a printed circuit board mounted with an image sensor;
a base disposed on an upper surface of the printed circuit board;
a cover member coupled to the base;
a housing disposed between the base and the cover member;
a first driving unit disposed on the housing;
a bobbin disposed at an inner side of the housing;
a second driving unit disposed on the bobbin and facing the first driving unit; and
a first sealing member disposed between the base and the cover member,
wherein at least a portion of the first sealing member is accommodated in a concave groove formed on an outer lateral surface
of the base.

US Pat. No. 9,504,146

HEAT RADIATION PRINTED CIRCUIT BOARD, METHOD OF MANUFACTURING THE SAME, BACKLIGHT UNIT INCLUDING THE SAME, AND LIQUID CRYSTAL DISPLAY DEVICE

LG INNOTEK CO., LTD., Se...

1. A heat radiation printed circuit board, comprising:
a metal substrate including a first area and a second area, wherein the first area and the second area form a continuous structure;
and

a circuit layer comprising an insulating layer, a circuit pattern, and a solder resist that is formed only on the first area
of one surface of a metal substrate;

wherein the insulating layer is formed only on the first area of the metal substrate, the circuit pattern is formed on the
insulating layer, and a solder resist is applied among the circuit patterns;

wherein the circuit layer is separated from the second area; and
wherein the metal substrate includes a bending part that connects the first area and the second area, and wherein the bending
part includes a groove or a hole.

US Pat. No. 9,478,718

LIGHT EMITTING DEVICE

LG INNOTEK CO., LTD., Se...

1. A light emitting device, comprising:
a substrate;
a light emitting structure comprising a first conductive type semiconductor layer, an active layer, and a second conductive
type semiconductor layer provided on the substrate;

a first electrode layer provided over the first conductive type semiconductor layer;
and
a second electrode layer provided over the second conductive type semiconductor layer, the second electrode layer having an
energy band gap wider than an energy band gap of the active layer,

wherein the second electrode layer and the second conductive type semiconductor layer form an integrated single layer structure,
wherein an energy band gap of the second electrode layer is the same as an energy band gap of the second conductive type semiconductor
layer,

wherein the second conductivity type semiconductor layer comprises a semiconductor material containing aluminum, and
wherein aluminum contained in the second conductive type semiconductor layer has a concentration gradient which increases
as a distance from the active layer increases.

US Pat. No. 9,472,727

VERTICAL STRUCTURE LEDS

LG INNOTEK CO., LTD., Se...

1. A light-emitting device, comprising:
a support structure of metal;
a GaN-based semiconductor structure on the support structure, the GaN-based semiconductor structure including a p-type GaN-based
layer, a GaN-based active layer, and an n-type GaN-based layer,

wherein the GaN-based semiconductor structure has a first surface, a side surface, and a second surface,
wherein the first surface, relative to the second surface, is proximate to the support structure, and
wherein the second surface is opposite to the first surface;
a p-type electrode on the support structure; and
an n-type electrode on the second surface of the GaN-based semiconductor structure; and
a passivation layer on the side surface of the GaN-based semiconductor structure,
wherein the passivation layer extends from the side surface of the GaN-based semiconductor structure to cover the second surface
of the GaN-based semiconductor structure and a side surface and an upper surface of the n-type electrode, and

wherein a portion of the passivation layer is between the semiconductor structure and the support structure.

US Pat. No. 9,293,672

LIGHT EMITTING DEVICE PACKAGE

LG Innotek Co., Ltd., Se...

1. A light emitting device package comprising:
a package body including a first cavity;
an electrode layer including a first electrode and a second electrode that are electrically isolated from each other;
a light emitting device electrically connected to the electrode layer on the package body;
a protective device disposed in a second cavity formed at the package body and electrically connected to the electrode layer;
a reflective layer on the protective device; and
a molding part on the light emitting device,
wherein at least one of the first electrode and the second electrode is disposed on the package body,
wherein the second cavity has a shape that is concaved down from a bottom surface of the first cavity,
the reflective layer is disposed on the second cavity, and
wherein the protective device is disposed on the first electrode that is disposed at a lower portion of the second cavity.

US Pat. No. 9,249,957

LIGHT EMITTING DEVICE AND LIGHTING SYSTEM INCLUDING THE SAME

LG INNOTEK CO., LTD., Se...

1. A light emitting device comprising:
a body including a cavity having first to fourth inner sides;
a first lead frame extending from a bottom of the cavity under the first inner side of the cavity;
a second lead frame extending from the bottom of the cavity under the second inner side of the cavity;
a gap part disposed in the bottom of the cavity and disposed between the first and second lead frames;
a light emitting chip disposed on the first lead frame;
a protective chip disposed on the second lead frame;
a recess region being convex outward of the body on at least one of the third and fourth inner sides of the cavity; and
a first wire connected to the protective chip and the second lead frame and including a part disposed between the light emitting
chip and a sidewall of the recess region,

wherein the recess region has a smaller width than a width of the light emitting chip,
wherein each of the third and fourth inner sides has a length longer than a length of each of the first and second inner sides
of the cavity,

wherein the recess region is formed in the third inner side,
wherein the first lead frame has a first region having a first thickness and a second region having a second thickness thinner
than the first thickness,

wherein the light emitting chip is overlapped with the first region and the second region in a vertical direction,
wherein the first lead frame and the light emitting chip are electrically connected to an electrical conductive adhesive member
which is disposed between the first lead frame and the light emitting chip, and

wherein a length of the light emitting chip is ½ times or greater than a length of the first lead frame and is ½ times or
greater than a length of the third inner side of the cavity.

US Pat. No. 9,190,567

NITRIDE SEMICONDUCTOR LIGHT EMITTING DEVICE AND FABRICATION METHOD THEREOF

LG INNOTEK CO., LTD., Se...

1. A light emitting device comprising:
a first conductive type semiconductor layer;
an active layer on the first conductive type semiconductor layer; and
a second conductive type semiconductor layer on the active layer;
wherein the second conductive type semiconductor layer comprises a delta doped delta-doped p-type semiconductor layer on the
active layer,

wherein the delta-doped p-type semiconductor layer includes at least a first p-type nitride semiconductor layer near the active
layer and at least a delta-doped second p-type nitride semiconductor layer that goes away from the active layer, and

wherein the first conductive type semiconductor layer comprises a GaN layer and the delta doped second p-type nitride semiconductor
layer comprises a GaN layer.

US Pat. No. 9,140,426

BACKLIGHT UNIT AND DISPLAY APPARATUS USING THE SAME

LG INNOTEK CO., LTD., Se...

1. A backlight unit comprising:
a first reflector;
a second reflector partially provided with an inclined surface;
a light source module arranged between the first reflector and the second reflector; and
an optical member spaced apart from the second reflector by a predetermined distance, the optical member including a reflective
layer and a light scattering layer disposed at a partial inner surface of the optical member,

wherein the light source module includes a lens having at least one first surface, and an incidence angle of the first surface
is equal to or greater than a critical angle, and at least one second surface, and an incidence angle of the second surface
is less than the critical angle.

US Pat. No. 9,136,424

DIODE HAVING HIGH BRIGHTNESS AND METHOD THEREOF

LG INNOTEK CO., LTD., Se...

1. A light emitting device, comprising:
a light emitting structure comprising:
a first-type semiconductor layer;
a second-type semiconductor layer; and
an active layer between the first-type semiconductor layer and the second-type semiconductor layer,
wherein the active layer is a multiple quantum well layer;
a first electrode electrically connected to the first-type semiconductor layer, the first electrode including a material selected
from the group consisting of titanium, aluminum, and gold;

a second electrode electrically connected to the second-type semiconductor layer, the second electrode including platinum;
and

a substrate comprising:
a flat top surface proximate to the light emitting structure;
a flat bottom surface facing the flat top surface; and
a body between the flat top surface and the flat bottom surface,
wherein the body comprises:
a first portion proximate to the flat top surface; and
a second portion,
wherein a side surface of the first portion of the body is perpendicular to the flat top surface of the substrate,
wherein a side surface of the second portion of the body is inclined with reference to the flat bottom surface of the substrate,
and

wherein an inclination angle between the side surface of the second portion of the body and the flat bottom surface is an
obtuse angle.

US Pat. No. 9,445,498

EPOXY RESIN COMPOSITION AND PRINTED CIRCUIT BOARD

LG INNOTEK CO., LTD., Se...

15. The printed circuit board of claim 14, wherein the inorganic filler comprises a first alumina group having an average particle diameter of 0.3 ?m to 1.0 ?m, a
second alumina group having an average particle diameter of 3.0 ?m to 10.0 ?m, and a third alumina group having an average
particle diameter of 15.0 ?m to 50.0 ?m.

US Pat. No. 9,401,405

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

LG INNOTEK CO., LTD., Se...

1. A semiconductor device, comprising:
a silicon substrate;
an initial buffer layer provided on the silicon substrate and including aluminum nitride (AlN);
a semiconductor device layer provided on the initial buffer layer and having a semiconductor compound, and
a transition layer provided between the initial buffer layer and the semiconductor device layer, wherein the initial buffer
layer includes an ultrathin Al film deposited on the silicon substrate, and a silicon lattice of the silicon substrate directly
contacts a lattice of the initial buffer layer, and wherein the transition layer includes a plurality of AlN/AlxGa1-xN superlattice unit layers.

US Pat. No. 9,196,814

LIGHT EMITTING DEVICE PACKAGE AND LIGHT UNIT

LG Innotek Co., Ltd., Se...

1. A light emitting device package comprising:
a housing having a through-hole;
a heat sink portion in the through-hole, wherein the heat sink portion includes an alloy layer; and
a light emitting device on the heat sink portion.

US Pat. No. 9,144,136

METHOD FOR CONTROLLING A LIGHTING APPARATUS BY USING COLOR COORDINATES

LG INNOTEK CO., LTD., Se...

1. A method for controlling a lighting apparatus comprising a first light source unit, a second light source unit and a third
light source unit, the method comprising:
outputting an R component signal, a G component signal and a B component signal, each of which respectively corresponds to
light quantities of an R component, a G component and a B component of lights outputted from the first light source unit,
the second light source unit and the third light source unit;

receiving the R component signal, the G component signal and the B component signal and generating a comparative color coordinate;
and

comparing the comparative color coordinate with a standard color coordinate located within an area formed by the respective
color coordinates of the first, the second and the third light source units, and controlling light quantities of the first,
the second and the third light source units to reduce an error value between the standard color coordinate and the comparative
color coordinate,

wherein the standard color coordinate or the comparative color coordinate is generated by measuring the R component, the G
component and the B component of the light emitted from the first, second and third light source units, by calculating a tristimulus
value in correspondence with the light quantities of the measured R component, G component and B component, and by calculating
the standard color coordinate or the comparative color coordinate by using the tristimulus value.

US Pat. No. 9,105,631

CARRIER TAPE FOR TAB-PACKAGE AND MANUFACTURING METHOD THEREOF

LG INNOTEK CO., LTD., Se...

1. A TAB tape, comprising:
a base film having a central area and edge areas at both directions of the central area;
a wiring pattern formed at the central area of the base film;
a transfer area formed at the edge area of the base film and including an exposure area exposing the base film;
a plurality of sprocket holes arranged in a row on the transfer area; and
a metal pattern discretely formed from the wiring pattern, and formed in the transfer area,
wherein the metal pattern is formed with a paired structure formed at both sides of the plurality of sprocket holes, and
wherein the exposure area is continuous between the sprocket holes such that the base film is exposed continuously between
each sprocket hole and its adjacent sprocket holes.

US Pat. No. 9,098,151

INPUT DEVICE

LG INNOTEK CO., LTD., Se...

1. An input device, the device comprising:
a first main electrode extended to a first direction;
a plurality of first diverging electrodes, each extended from the first main electrode to a second direction, having a different
area based on position, and gradually increasing in width as advancing in the first direction;

a second main electrode extended to the first direction and arranged in parallel with the first main electrode;
a plurality of second diverging electrodes, each extended from the second main electrode to the first main electrode, disposed
alternately with the first diverging electrodes, and gradually decreasing in width as advancing in the first direction;

a first lead electrode electrically connected to the first main electrode;
a second lead electrode electrically connected to the second main electrode;
a first connection electrode arranged in the second direction and configured to connect the first main electrode and the first
lead electrode; and

a second connection electrode arranged in the second direction and configured to connect the second main electrode and the
second lead electrode;

wherein the first main electrode, the first diverging electrodes, the second main electrode, and the second diverging electrodes
are directly on and in physical contact with the same planar surface, and

wherein an x position and a y position are determined by signals output from the first diverging electrodes and the second
diverging electrodes.

US Pat. No. 9,706,652

PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME

LG INNOTEK CO., LTD., Se...

1. A printed circuit board, comprising:
an insulating layer;
at least one circuit pattern or pad formed on the insulating layer;
a solder resist having an opening section exposing an upper surface of the at least one circuit pattern or pad and formed
on the insulating layer;

a seed layer formed at a side surface of the solder resist exposing the upper surface of the at least one circuit pattern
or pad, and protruded over a surface of the solder resist; and

a bump formed on the pad exposed through the opening section of the solder resist and seed layer, and protruded over the surface
of the solder resist;

wherein the seed layer is disposed between the side surface of the solder resist and a side surface of the bump,
wherein the seed layer has an upper surface and a lower surface opposite to the upper surface,
wherein an area of the upper surface of the seed layer is the same as that of the lower surface of the seed layer,
wherein a height of the seed layer is the same as a height of the bump,
wherein the upper surface of the protruded seed layer lies in a same plane as an upper surface of the protruded bump,
wherein the bump comprises:
a first bump on the at least one circuit pattern or pad exposed through the opening section of the solder resist and formed
with an alloy containing copper; and

a second bump on the first bump, formed with an alloy containing tin and protruded over an upper surface of the solder resist,
wherein the upper surface of the protruded seed layer lies in a same plane as an upper surface of the second bump,

wherein an upper surface of the first bump is higher than the upper surface of the solder resist,
wherein the seed layer is contacted with side surfaces of the first bump and the second bump,
wherein an area of an upper surface of the first bump is the same as that of a lower surface of the first bump,
wherein an area of an upper surface of the second bump is the same as that of a lower surface of the second bump, and
wherein the area of the upper surface of the first bump is the same as that of the upper surface of the second bump.

US Pat. No. 9,532,462

PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

LG INNOTEK CO., LTD., Se...

1. A method of manufacturing a printed circuit board, the method comprising:
(a) forming a circuit pattern on an insulating layer, wherein a seed layer is formed between the circuit pattern and the insulating
layer;

(b) embedding the circuit pattern and the seed layer into the insulating layer by a press method such that the seed layer
is embedded only at a lower surface of the circuit pattern, and the embedded circuit pattern comprises a top surface with
a diameter greater than a diameter of a bottom surface and lateral surfaces directly contacting the insulating layer without
contacting a surface of the seed layer; and

(c) removing the seed layer;
wherein the seed layer is made of a material different from that of the circuit pattern, and
wherein the seed layer comprises a top surface having a diameter same as a diameter of the bottom surface of the embedded
circuit pattern and lateral surfaces directly contacting the insulating layer without contacting a surface of the embedded
circuit pattern.

US Pat. No. 9,468,088

CONDUCTIVE FILM WITH HIGH TRANSMITTANCE HAVING A NUMBER OF ANTI REFLECTION COATINGS, TOUCH PANEL USING THE SAME AND MANUFACTURING METHOD THEREOF

LG INNOTEK CO., LTD., Se...

1. A conductive film comprising:
a film;
a transparent electrode pattern on a surface of the film; and
a plurality of anti-reflection (AR) films on at least one surface of the film,
wherein the plurality of AR films includes:
a first Al2O3 film on the at least one surface of the film,
a first titanium dioxide film on the first Al2O3 film,
a second Al2O3 film on the first titanium dioxide film,
a second titanium dioxide film on the second Al2O3 film, and
a third Al2O3 film on the second titanium dioxide film, and
wherein the first Al2O3 film has a thickness in a range of 970 Å to 1030 Å, the first titanium dioxide film has a thickness
in a range of 220 Å to 260 Å, the second Al2O3 film has a thickness in a range of 190 Å to 230 Å, the second titanium dioxide
film has a thickness in a range of 550 Å to 610 Å, and the third Al2O3 film has a thickness in a range of 760 Å to 820 Å.

US Pat. No. 9,437,791

LIGHT EMITTING DEVICE PACKAGE

LG INNOTEK CO., LTD., Se...

1. A light emitting device package comprising:
a package body including at least one electrode pad disposed on a surface thereof, the package body including at least one
ceramic layer;

a via hole electrode passing through the package body;
a heat dissipation portion disposed in the package body;
an anti-crack portion disposed on the heat dissipation portion and the at least one ceramic layer; and
a light emitting device disposed on the package body, the light emitting device being electrically connected to the electrode
pad through a wire,

wherein the wire forms a stitch on at least one of the light emitting device and the electrode pad, and a bonding ball is
disposed on the stitch,

wherein the heat dissipation portion is made of a material different from a material of the package body,
wherein a width of an upper surface of the heat dissipation portion is bigger than a width of a lower surface of the heat
dissipation portion,

wherein the package body includes a first ceramic layer, a second ceramic layer, and a third ceramic layer,
wherein the second ceramic layer is the anti-crack portion,
wherein the second ceramic layer is disposed with an opening on the third ceramic layer,
wherein the light emitting device is disposed on an exposed region of the third ceramic layer,
wherein the third ceramic layer is disposed between the first ceramic layer and the anti-crack portion,
wherein a lower surface of the third ceramic layer contacts the heat dissipation portion and the first ceramic layer, and
wherein an upper surface of the third ceramic layer contacts the anti-crack portion and the light emitting device.

US Pat. No. 9,398,271

APPARATUS AND METHOD OF ALTERNATELY CAPTURING IMAGES WITH ROTATING PRISM

LG INNOTEK CO., LTD., Se...

1. A network camera comprising:
a lens module comprising a plurality of lenses comprising a first lens and a second lens, the plurality of lenses having incident
paths different from each other, the incident paths comprising a first incident path corresponding to the first lens and a
second incident lens corresponding to the second lens;

a prism provided at a point at which the first incident path crosses the second incident path for reflecting light incident
through respective ones of the plurality of lenses of the lens module;

a prism driving module rotating the prism for reflecting the light incident through the first lens during a first time, and
rotating the prism for reflecting the light incident through the second lens during a second time, which is not being overlapped
with the first time; and

a controller controlling the prism through the prism driving module, wherein the prism reflects lights incident through the
first and second incident paths different from each other by performing a rotation operation, wherein

the first and second lenses having narrower angles of view than angles of view of fisheye lenses and are integrally formed
with each other to construct Y shape structures, and wherein incident degree of the first incident path and the second incident
path is more than 90 degree, respectively.

US Pat. No. 9,356,172

SOLAR CELL AND METHOD FOR MANUFACTURING SAME

LG INNOTEK CO., LTD., Se...

1. A solar cell comprising:
a support substrate;
a barrier layer on the support substrate; and
a photo-electro conversion part on the barrier layer,
wherein the barrier layer comprises first and second barrier layers having porosities different from each other;
wherein the support substrate includes a flexible metallic substrate;
wherein the photo-electro conversion part includes a first electrode layer, a light absorbing layer, and a second electrode
layer;

wherein the first and second barrier layers are in direct physical contact with each other;
wherein the second barrier layer is in direct physical contact with the first electrode layer;
wherein the first electrode layer includes at least one of molybdenum (Mo), copper (Cu), nickel (Ni), aluminum, and an alloy
thereof;

wherein the porosity of the second barrier layer is higher than the porosity of the first barrier layer; and
wherein the porosity of the second barrier layer is in a range of 20% to 40%.

US Pat. No. 9,224,530

POWER SUPPLY APPARATUS

LG Innotek Co., Ltd., Se...

1. A power supply apparatus comprising:
a first magnetic core;
a second magnetic core separated from the first magnetic core, having a shape symmetrical to a shape of the first magnetic
core, and disposed symmetrically to the first magnetic core;

a third magnetic core between a right side surface of the first magnetic core and a left side surface of the second magnetic
core;

a first coil wound around the first magnetic core; and
a second coil wound around the second magnetic core,
wherein the first and second magnetic cores are powder cores, and the third core is a ferrite core,
wherein an upper surface of the first magnetic core and an upper surface of the second magnetic core lie in the same plane
as an upper surface of the third magnetic core,

wherein a right side surface of the first magnetic core is directly contacted with a left side surface of the third magnetic
core,

wherein a left side surface of the second magnetic core is directly contacted with a right side surface of the third magnetic
core,

wherein the first magnetic core has a shape of a ‘U’, and the second magnetic core is symmetrical to the first magnetic core
about the third magnetic core,

wherein each of the first and second magnetic cores comprises:
a first core part;
a second core part extending from one end of the first core part vertically to a length direction of the first core part;
and

a third core part extending from an opposite end of the first core part vertically to the length direction of the first core
part,

wherein the first coil is wound to the second core part of the first magnetic core; and
wherein the second coil is wound to the second core part of the second magnetic core which is symmetrical to the second core
part of the first magnetic core.

US Pat. No. 9,127,817

LIGHTING DEVICE WITH REMOVABLE HEAT SINK HOUSING A POWER SUPPLY

LG Innotek Co., Ltd., Se...

1. A lighting device comprising:
a cover;
a light source coupled to the cover and including:
a member that includes a first placement portion and a second placement portion;
a light source module that is disposed in the first placement portion;
a first terminal disposed at a bottom surface of the second placement portion and is electrically connected to the light source
module; and

a guide disposed between the first placement portion and the second placement portion; and
a heat sink including:
a first receiver having a flat surface and an extending part to extend from the flat surface of the first receiver, the second
placement portion of the member provided on the flat surface of the first receiver, wherein the first receiver is defined
by the flat surface and the extending part, and the extending part including heat radiating fins on an outside of the lighting
device;

a second receiver in which a circuitry is disposed; and
a second terminal disposed at the flat surface of the first receiver to correspond to the first terminal of the light source,
wherein the guide is disposed between the cover and the heat sink, wherein a first portion of the guide to couple to the cover
and a second portion of the guide to couple to the heat radiating fins of the heat sink,

wherein the guide is spaced apart from the flat surface of the first receiver, the guide contacts the heat radiating fins,
and the guide is disposed on the heat radiating fins.

US Pat. No. 9,110,211

LIGHT GUIDE PLATE FOR PLANE LIGHT SOURCE, METHOD FOR MANUFACTURING THE SAME, AND PLANE LIGHT SOURCE UNIT USING THE SAME

LG INNOTEK CO., LTD., Se...

1. A light guide plate for a plane light source unit, comprising:
a first plurality of unit pattern regions each having a plurality of optical patterns disposed on a first surface of the light
guide plate;

wherein a sag value of a unit pattern region of the first plurality of unit pattern regions disposed more proximate to a center
of the light guide plate is greater than a sag value of a unit pattern region of the first plurality of unit pattern regions
disposed less proximate to the center of the light guide plate, wherein the sag value is a ratio between a height and a lens
size of an optical pattern.

US Pat. No. 9,478,526

LIGHT EMITTING MODULE

LG INNOTEK CO., LTD., Se...

1. A light emitting module comprising:
a circuit board having a first region and a second region, the first region having a cavity and the second region having a
circuit pattern;

an insulation substrate disposed on the circuit board;
at least one pad disposed on the insulation substrate;
at least one light emitting device disposed on the pad;
a pad island disposed on an edge region of the insulation substrate; and
a conductive pad connecting the circuit pattern and the pad island,
wherein an upper surface of the pad island and an upper surface of the circuit pattern are substantially coplanar,
wherein a lower surface of the conductive pad contacts with the upper surface of the pad island and the upper surface of the
circuit pattern, and

wherein a joining structure is disposed between a surface of the circuit board and a bottom surface of the insulation substrate.

US Pat. No. 9,464,954

TORQUE SENSOR

LG INNOTEK CO., LTD., Se...

1. A torque sensor comprising:
a rotor section; and
a stator section comprising a stator holder,
wherein the stator holder comprises a plurality of coupling pieces protruding in an axial direction, and a hog ring coupled
to pass through the plurality of coupling pieces,

wherein the plurality of coupling pieces have through-holes formed in a circumferential direction and an inner wall of the
through-hole is adhered to the hog ring.

US Pat. No. 9,392,147

CAMERA MODULE HAVING ELASTIC STIFFENING MATERIAL FOR EFFICIENT SHOCK ABSORBING PROPERTY AND METHOD FOR MANUFACTURING THE SAME

LG INNOTEK CO., LTD., Se...

1. A camera module, the camera module comprising:
a PCB (Printed Circuit Board), an image sensor mounted on the PCB;
a housing, a bottom end of the housing fixed to an upper surface of the PCB, and the housing being a case formed with a lens
hole at an upper wall and having a bottom-opened inner space;

a lens assembly having at least one lens aligned to the lens hole, wherein the lens assembly is fixed to and contacted with
an upper surface of the image sensor and accommodated at the inner space of the housing;

and an elastic stiffening material disposed between the housing and the lens assembly;
wherein an upper surface of the elastic stiffening material is contacted with an inner surface of the upper wall of the housing,
and a bottom surface of the elastic stiffening material is contacted with an upper surface of the lens assembly.

US Pat. No. 9,353,915

LIGHTING DEVICE

LG Innotek Co., Ltd., Se...

1. A lighting device comprising:
a heat sink that includes a receiving recess;
a light source module that includes a substrate on the heat sink and a light emitting device on the substrate;
a power supplier that is provided in the receiving recess of the heat sink; and
an inner case provided in the receiving recess of the heat sink and in which the power supplier and a molding part having
a molding material are provided,

wherein the inner case includes an opening into which the molding material is injected and a packing that blocks the opening,
wherein the power supplier includes a wire electrically connected to a socket through the opening of the inner case, and
wherein the packing includes a gap in which the wire is provided.

US Pat. No. 9,112,092

LIGHT EMITTING DEVICE AND LIGHT EMITTING DEVICE PACKAGE

LG INNOTEK CO., LTD., Se...

1. A light emitting device comprising:
a substrate;
a first conductive semiconductor layer on the substrate;
an active layer on the first conductive semiconductor layer; and
a second conductive semiconductor layer on the active layer,
wherein the active layer comprises:
a plurality of barrier layers; and
a plurality of well layers between the barrier layers,
wherein at least two of the barrier layers have different energy bandgaps and different thicknesses, and
wherein differences in refractive indexes between the well layers and the barrier layers gradually decrease toward the second
conductive semiconductor layer from the first conductive semiconductor layer, and

wherein the active layer comprises a first barrier layer most adjacent to the second semiconductor layer and a second barrier
layer most adjacent to the first barrier layer have the same energy bandgaps and refractive index.

US Pat. No. 9,142,718

LIGHT EMITTING DEVICE

LG Innotek Co., Ltd., Se...

1. A light emitting device, comprising:
a light emitting structure including a first conductive semiconductor layer, an active layer disposed under the first conductive
semiconductor layer, and a second conductive semiconductor layer disposed under the active layer;

a trench in the light emitting structure;
a current barrier layer in the trench;
a first electrode on an upper side of the light emitting structure; and
a second electrode on a bottom side of the light emitting structure,
wherein the second electrode comprises a protruding portion extending into the light emitting structure and the protruding
portion is in the trench,

wherein a substantially central portion of the protruding portion spatially overlaps with a substantially central portion
of the first electrode,

wherein a length of the first electrode is shorter than that of a top surface of the protruding portion in a cross section,
and

wherein the second electrode further comprises:
a substrate; and
a reflection layer disposed between the current barrier layer and the substrate, the reflection layer being formed in a structure
partially filling the trench, and a portion of the substrate being formed in a structure filling a remainder of the trench.