US Pat. No. 9,210,778

INTEGRATED WIRELESS AND WIRED LIGHT CONTROL SYSTEM

LEXTAR ELECTRONICS CORPOR...

1. An integrated wired and wireless light control system, comprising:
a wired control device comprising a first user interface and a first wired communication protocol interface;
a wireless control device comprising a second user interface and a first wireless communication protocol interface;
a communication module comprising a second wired communication protocol interface and a second wireless communication protocol
interface; and

N light devices, each of the light devices comprising a third wired communication protocol interface, and each of the light
devices performing data exchange with the third wired communication protocol interface of another one of the light devices
by a network cable that is connected to the third wired communication protocol interface, wherein N is a natural number larger
than 1,

wherein the first wired communication protocol interface directly performs data exchange with the second wired communication
protocol interface, and the first wireless communication protocol interface directly performs data exchange with the second
wireless communication protocol interface.

US Pat. No. 9,055,626

DIMMER CIRCUIT AND LIGHTING APPARATUS USING THE SAME

LEXTAR ELECTRONICS CORPOR...

1. A dimmer circuit, comprising:
a dimmer coupled to an alternating current (AC) for modulating the AC into an AC light modulating signal, wherein the AC light
modulating signal contains a plurality of wave pulses each having a conduction angle;

a rectifier coupling the dimmer and the AC for converting the AC light modulating signal into a direct current (DC) light
modulating signal having a plurality of positive wave pulses;

a sample-and-hold unit coupled to the rectifier for continuously sampling the positive wave pulses of the DC light modulating
signal to obtain an average positive wave pulse;

an integral unit coupled to the sample-and-hold unit for integrating the average positive wave pulse to generate a DC voltage;
and

a current holding circuit, wherein one end of the current holding circuit is coupled to the sample-and-hold unit and the rectifier,
the other end of the current holding circuit is coupled to the integral unit, and the current holding circuit comprises:

a bleeder; and
a switch coupled to the bleeder;
wherein, the current holding circuit determines on state or off state of the switch according to a comparison between the
DC voltage and a reference voltage, such that the DC light modulating signal passes through the bleeder or the switch.

US Pat. No. 9,190,568

LIGHT EMITTING DIODE STRUCTURE

LEXTAR ELECTRONICS CORPOR...

1. A light emitting diode structure, comprising:
a substrate;
a first semiconductor layer formed on the substrate;
an active layer covering a portion of the first semiconductor layer and exposing another portion of the first semiconductor
layer;

a second semiconductor layer formed on the active layer;
a current resisting layer covering a portion of the second semiconductor layer and exposing another portion of the second
semiconductor layer;

a current spreading layer covering the second semiconductor layer and the current resisting layer, wherein the current spreading
layer is formed with a reverse trapezoidal concave over a top of the current resisting layer;

a first electrode disposed on the first semiconductor layer; and
a second electrode disposed within the reverse trapezoidal concave.

US Pat. No. 9,054,277

LIGHT-EMITTING DIODE WITH SIDE-WALL BUMP STRUCTURE AND MOUNTING STRUCTURE HAVING THE SAME

LEXTAR ELECTRONICS CORPOR...

1. A light-emitting diode (LED), comprising:
a substrate having a top surface, a first side surface and at least one inclined surface, wherein the top surface and the
first side surface are perpendicular to each other, and the inclined surface is disposed between and connects the top surface
and the first side surface;

an epitaxial structure disposed on the top surface of the substrate, comprising:
a N-type semiconductor layer disposed on the substrate;
a light-emitting layer disposed on the N-type semiconductor layer;
a P-type semiconductor layer disposed on the light-emitting layer and having an opening exposing a portion of the N-type semiconductor
layer;

a transparent conductive layer disposed on the P-type semiconductor layer;
a P-electrode disposed on the P-type semiconductor layer; and
a N-electrode disposed on the exposed portion of the N-type semiconductor layer;
a first conductive bump disposed on the first side surface;
a second conductive bump disposed on the same first side surface as the first conductive bump;
a first extended electrode connecting the P-electrode, extending through the inclined surface, and electrically connecting
the first conductive bump disposed on the first side surface; and

a second extended electrode connecting the N-electrode, extending through the inclined surface, and electrically connecting
the second conductive bump disposed on the first side surface.

US Pat. No. 9,148,751

WIRELESS CONTROL SYSTEM AND WIRELESS NETWORK EXPANSION METHOD APPLIED THERETO

LEXTAR ELECTRONICS CORPOR...

1. A wireless control system, comprising:
a plurality of wireless devices each switching between a peripheral and broadcaster role and a central and observer role at
a predetermined time interval; and

a mobile platform for scanning the plurality of wireless devices to link to any wireless device serving the peripheral and
broadcaster role and then send a control command to the corresponding wireless device, which accordingly broadcasts the control
command to be received by at least one wireless device serving the central and observer role;

wherein, the plurality of wireless devices cyclically switch between the peripheral and broadcaster role and the central and
observer role to continuously broadcast the control command to other wireless devices serving the central and observer role,
so that all of the plurality of wireless devices can finally receive the control command from the mobile platform.

US Pat. No. 9,203,000

LIGHT-EMITTING DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME

Lextar Electronics Corpor...

7. A method for manufacturing a light-emitting device package, comprising:
providing a metal substrate;
forming an insulating layer on the metal substrate, wherein the insulating layer has at least one opening to expose the metal
substrate;

covering a sidewall of the at least one opening of the insulating layer with an optical spacer, wherein the step of covering
the sidewall of the at least one opening of the insulating layer comprises:

filling the at least one opening of the insulating layer with a photoresist material; and
removing a portion of the photoresist material by a lithographic process, such that the optical spacer composed of the photoresist
material is formed on the sidewall of the at least one opening of the insulating layer; and

forming at least one light-emitting device in the at least one opening of the insulating layer.

US Pat. No. 9,368,705

LED PACKAGING STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

LEXTAR ELECTRONICS CORPOR...

1. A light-emitting diode (LED) packaging structure, comprising:
a LED stacked layer comprising a first type semiconductor layer, a second type semiconductor layer beneath the first type
semiconductor layer and a light-emitting layer between the first type semiconductor layer and the second type semiconductor
layer;

a first silicon substrate disposed on the first type semiconductor layer and electrically connected to the LED stacked layer,
wherein the first silicon substrate has at least one first hollow portion through the first silicon substrate to expose a
surface of a portion of the first type semiconductor layer; and

a second silicon substrate disposed beneath the second type semiconductor layer and electrically connected to the LED stacked
layer, wherein the second silicon substrate has at least one second hollow portion through the second silicon substrate to
expose a surface of a portion of the second type semiconductor layer,

wherein the LED stacked layer is between the first silicon substrate and the second silicon substrate, and light emitted by
the light-emitting layer goes out through the first and second hollow portions.

US Pat. No. 9,320,092

ILLUMINATION DEVICE AND LED DIMMING CIRCUIT THEREOF

LEXTAR ELECTRONICS CORPOR...

1. A light-emitting diode (LED) dimming circuit, comprising:
a power converting module for receiving a mains supply and generating a driving voltage to drive a LED;
a sensing unit for converting a driving current flowing through the LED to a sensing voltage signal; and
a dimming module, comprising:
an amplifier for amplifying the sensing voltage signal to output an amplified sensing voltage signal;
an input interface for receiving a dimming control signal inputted from external;
a filter for converting the dimming control signal into a DC reference voltage signal;
a dimming signal generator for outputting a first feedback signal based on the amplified sensing voltage signal and the DC
reference voltage signal, wherein the dimming signal generator is a comparator; when an electric potential of the DC reference
voltage signal is higher than an electric potential of the amplified sensing voltage signal, an electric potential of the
first feedback signal outputted by the comparator is increased; when an electric potential of the DC reference voltage signal
is lower than an electric potential of the amplified sensing voltage signal, the electric potential of the first feedback
signal outputted by the comparator is reduced; and

an isolating unit electrically connected between the dimming signal generator and the power converting module, and configured
for receiving the first feedback signal and outputting a second feedback signal to the power converting module, thereby feedback-controlling
the driving current,

wherein the comparator has a first input directly connected to the filter and configured to receive the DC reference voltage
signal from the filter, a second input directly connected to the amplifier and configured to receive the amplified sensing
voltage signal, and an output directly connected to the isolating unit and configured to output the first feedback signal
to the isolating unit.

US Pat. No. 9,054,289

LIGHT-EMITTING DIODE PACKAGE AND METHOD FOR MANUFACTURING THE SAME

Lextar Electronics Corpor...

1. A light-emitting diode package, comprising:
a carrier;
a light-emitting diode chip disposed over the carrier and electrically connected to the carrier, wherein the light-emitting
diode chip comprises at least two recesses at corners located on a diagonal line of the light-emitting diode chip;

a eutectic layer disposed between the light-emitting diode chip and the carrier, wherein the eutectic layer comprises at least
two metal pillars embedded into the at least two recesses respectively, wherein an upper portion of the metal pillars covers
a portion of a top surface of the light-emitting diode chip.

US Pat. No. 9,055,625

CONTROL METHOD OF LAMP

LEXTAR ELECTRONICS CORPOR...

1. A control method of a lamp, comprising:
whether a touch event occurs in a control device is determined;
obtaining a coordinate of a touch point if the touch event occurs;
whether the touch point occurs in a color control area of a Graphical User Interface (GUI) of the control device is determined;
responding to a color temperature set and a brightness set from the control device, generating a first pulse width modulation
(PWM) and a second PWM;

whether the lamp connects with the control device is determined;
package the first PWM and the second PWM in a color control package;
opening a transmission thread, comprising:
whether the value of a transmission flag is equal to 1 is determined;
transmitting the color control package to the lamp by wireless technology if the value of the transmission flag is equal to
1;

setting the value of a responding flag to 0; and
whether the value of the responding flag is set to 0 within a time interval is determined;
opening a receiving thread, comprising:
whether a lamp package from the lamp is received is determined;
whether the lamp package is a responding package is determined if the lamp package from the lamp is received;
setting the value of the responding package to 1 and the value of the transmission flag to 0 if the lamp package is the responding
package;

US Pat. No. 9,398,671

CONTROL DEVICE WITH LIGHT ADJUSTMENT FUNCTION

Lextar Electronics Corpor...

1. A control device with a light-adjustment function coupled between a power supply and a lighting load, comprising:
a first switch coupled to the power supply, wherein when the first switch is turned on by a user, a power signal generated
by the power supply is transmitted to the lighting load via the first switch, and the brightness of the lighting load is gradually
increased or reduced as time increases;

a timing setting switch configured to set a time value by the user independently of the first switch;
a control unit coupled to the timing setting switch, wherein when the first switch is turned on, the control unit executes
a countdown according to the time value during which time the brightness of the lighting load is gradually increased or reduced,
and upon finishing the countdown, the control unit generates a trigger signal and simultaneously the brightness of the lighting
load is at a set value; and

a second switch coupled between the control unit, the first switch and the lighting load, wherein when the second switch receives
the trigger signal, the second switch automatically stops transmitting the power signal from the first switch to the lighting
load, and then immediately transmits the power signal from the first switch to the lighting load such that the brightness
of the lighting load is at the set value.

US Pat. No. 9,212,790

LIGHT EMITTING DIODE BULB

LEXTAR ELECTRONICS CORPOR...

1. A light emitting diode (LED) bulb, comprising:
an electrical connecting base,
a lamp holder having a first end and a second end opposite to each other, in which the first end is connected to the electrical
connecting base, the second end is configured as a supporting surface, and an accommodation space is formed by the electrical
connecting base and the lamp holder;

a power driving module disposed inside the accommodation space;
an adapter plate having a first surface and a second surface opposite to each other, in which the first surface is connected
to the supporting surface and the second surface includes a first connector which has a plugging direction parallel to the
second surface, wherein the adapter plate comprises a side wall, and the side wall is extended from an peripheral edge of
the second surface and protrudes from the second surface to encircle the second surface; and

a lamp plate equipped with a LED and a second connector detachably plugged to the first connector along the plugging direction
so that the lamp plate is disposed on the adapter plate, wherein the lamp plate is composed of a first half-face and a second
half-face, and the second connector is disposed on an edge of the second half-face, in which the first half-face is connected
with the second half-face, and an area of the first half-face is greater than an area of the second half-face such that two
end surfaces of the first half-face are exposed.

US Pat. No. 9,054,286

LIGHT EMITTING DIODE MODULE

LEXTAR ELECTRONICS CORPOR...

1. A light emitting diode module, comprising:
a lead frame having a die-bonding surface and at least one side wall together defining an accommodating recess;
a first light emitting diode chip and a second light emitting diode chip separately disposed on the die-bonding surface of
the lead frame;

an encapsulant filled in the accommodating recess and covering the first and the second light emitting diode chips; and
a lens structure disposed on the lead frame, the lens structure having a first light emitting curved surface, a second light
emitting curved surface, a third light emitting curved surface, a fourth light emitting curved surface, a bottom surface,
and at least one reflective surface, wherein the first, the second, the third, and the fourth light emitting curved surfaces
are disposed opposite to the bottom surface; an adjacent position among the first, the second, the third, and the fourth light
emitting curved surfaces is a lowest point nearest to the bottom surface; the first and the second light emitting curved surfaces
are symmetric with respect to the lowest point; the third and the fourth light emitting curved surfaces are symmetric with
respect to the lowest point; the third light emitting curved surface is adjacent to the first and the second light emitting
curved surfaces and the fourth light emitting curved surface is adjacent to the first and the second light emitting curved
surfaces, wherein the reflective surface is connected to the first, the second, the third, the fourth light emitting curved
surfaces, and edges of the bottom surface,

wherein the first and the second light emitting diode chips are respectively disposed at projections of the first and the
second light emitting curved surfaces on the die-bonding surface, and a projection of the lowest point on the die-bonding
surface is between the first and the second light emitting diode chips.

US Pat. No. 9,538,594

LAMP

LEXTAR ELECTRONICS CORPOR...

1. A lamp, comprising:
a lamp tube having a lamp chamber therein;
at least one end cap covering an end of the lamp tube;
a carrier accommodated in the lamp chamber of the lamp tube;
a light bar circuit board disposed on a portion surface of the carrier and accommodated in the lamp chamber;
a driver circuit board disposed on the other portion surface of the carrier and physically adjoining the light bar circuit
board, the driver circuit board being accommodated in the lamp chamber and adjacent to the end cap;

a plurality of first luminous elements disposed on the light bar circuit board to emit light through the lamp tube; and
a plurality of second luminous element groups, each second luminous element group connected in parallel and disposed on the
driver circuit board in the lamp chamber, to emit light through the lamp tube; and

at least one driving element disposed on the driver circuit board and between two of the second luminous element groups from
the plurality of second luminous element groups.

US Pat. No. 9,202,771

SEMICONDUCTOR CHIP STRUCTURE

Lextar Electronics Corpor...

1. A semiconductor chip structure, comprising:
a semiconductor chip having a pair of electrodes, wherein the electrodes have different conductivity types for electrical
connection; and

a thermoelectric cooling material layer disposed within each of the pair of electrodes;
wherein an operating current Iopt applied to each of the thermoelectric cooling material layers is in a range of


 and wherein L represents a length of the thermoelectric cooling material layer, A represents a contact area of the thermoelectric
cooling material layer, Tc represents a cold-end temperature, Th represents a hot-end temperature, ? represents a seeback coefficient, ? represents a resistivity of the thermoelectric cooling
material layer, k represents a thermal conductivity of the thermoelectric cooling material layer, and ?T represents a temperature
difference between Tc and Th.

US Pat. No. 9,184,348

LIGHT EMITTING DIODE STRUCTURE

Lextar Electronics Corpor...

1. An LED structure comprising:
a substrate;
an emitting multilayer structure disposed on the substrate;
a plurality of microstructures spaced apart from each other on the emitting multilayer structure, and each microstructure
comprising a first concave-convex surface, wherein the first concave-convex surface has a surface roughness ranging from 0.1
nm to 1.1 nm;

a transparent conductive layer conformably formed on a first overall upper surface of the emitting multilayer structure and
the microstructures so as to form a second overall upper surface with a plurality of second concave-convex surfaces, each
second concave-convex surface is aligned with a corresponding one of the first concave-convex surfaces; and

a first type electrode formed on the transparent conductive layer, wherein a bottom surface of the microstructure is getting
larger when being closer to the first type electrode.

US Pat. No. 9,287,461

LIGHT-EMITTING DIODE AND METHOD FOR MANUFACTURING THE SAME

LEXTAR ELECTRONICS CORPOR...

1. A light-emitting diode comprising:
an N-type metal electrode;
an N-type semiconductor layer contacting the N-type metal electrode;
a P-type semiconductor layer;
a light-emitting layer sandwiched between the N-type semiconductor layer and the P-type semiconductor layer;
a low-contact-resistance material layer positioned on a part of the P-type semiconductor layer;
a transparent conductive layer covering the low-contact-resistance material layer and the P-type semiconductor layer;
a P-type metal electrode positioned on the transparent conductive layer; and
a metal-indium contact layer positioned between the P-type semiconductor layer and the transparent conductive layer, wherein
the low-contact-resistance material layer is embedded in the metal-indium contact layer and protrudes above a surface of the
metal-indium contact layer into the transparent conductive layer.

US Pat. No. 9,231,165

LIGHT-EMITTING DIODE CHIP

Lextar Electronics Corpor...

1. A light-emitting diode chip, comprising:
a substrate;
a light-emitting diode stack formed on the substrate, wherein the light-emitting diode stack includes:
a first-type semiconductor layer formed on the substrate;
an active layer covering a portion of the first-type semiconductor layer and exposing another portion of the first-type semiconductor
layer; and

a second-type semiconductor layer formed on the active layer;
a current-spreading layer formed on the second-type semiconductor layer;
a first electrode formed on the exposed portion of the first-type semiconductor layer; and
a second electrode formed on the current-spreading layer;
wherein the current-spreading layer includes:
a first portion having a first thickness, wherein the second electrode is directly above and contacts a top surface of the
first portion; and

a second portion having a second thickness, wherein a vertical projection of the second portion onto the first-type semiconductor
layer surrounds a vertical projection of a portion of the first electrode onto the first-type semiconductor layer;

wherein the first thickness is greater than the second thickness.

US Pat. No. 9,274,261

LIGHT EMITTING DEVICE, FLAT LIGHT AND FLAT PANEL DISPLAY

LEXTAR ELECTRONICS CORPOR...

1. A light emitting device, comprising:
a first frame whose inner side has a groove, wherein the groove is strip and has a bottom plane, two inner walls perpendicular
to two sides of the bottom plane, and an opening;

a light bar disposed in the groove, wherein the light bar comprises a substrate having a lower surface and an upper surface
opposite to the lower surface, the lower surface is attached to the bottom plane of the groove, and the upper surface has
a plurality of light sources; and

a light guide plate having a light emitting surface and a light incident surface, wherein the light incident surface is positioned
on one side of the light guide plate and perpendicular and adjoining to the light emitting surface, and the light guide plate
has several protruded abutting portions, the side of the light guide plate having the light incident surface is inserted to
the groove via the opening, the emitting light of the light source entering the light guide plate via the light incident surface
first is guided by the light guide plate to be emitted off the light emitting surface, and the abutting portions of the light
guide plate abut to the upper surface of the substrate or the light sources, so that the light bar is fixed in the groove
and does not slide;

wherein the abutting portions and the light guide plate are integrally formed in one piece by different materials by way of
double plastic injection.

US Pat. No. 9,229,152

INFORMATION EXHIBITION SYSTEM

LEXTAR ELECTRONICS CORPOR...

1. An information exhibition system, comprising:
an exhibition cabinet used to exhibit at least one object; and
an information display device positioned on the exhibition cabinet, the information display device comprising:
a display panel having a front surface and a back surface opposite to the front surface, wherein the front surface is used
to show information;

an illumination module positioned on the back surface of the display panel for emitting a light into the display panel through
the back surface and illuminating the object on the backside of the display panel;

a light guide plate having a first light outgoing surface, a second light outgoing surface opposite to the first light outgoing
surface, and a first lateral light incident surface adjacent to the first light outgoing surface and the second light outgoing
surface, wherein the first light outgoing surface is adjacent to the back surface of the display panel; and

a first light source disposed on the first lateral light incident surface for emitting first lights into the light guide plate
through the first lateral light incident surface, so that the first lights are respectively emitted out of the first light
outgoing surface and the second light outgoing surface, and respectively go to the back surface of the display panel through
the first light outgoing surface and to the object on the backside of the display panel through the second light outgoing
surface.

US Pat. No. 9,538,595

ILLUMINATION DEVICE AND LIGHT-EMITTING DIODE CIRCUIT

LEXTAR ELECTRONICS CORPOR...

1. An illumination device, comprising:
a rectifier circuit having a positive output terminal and an negative output terminal, the rectifier circuit being configured
to generate a driving voltage between the positive output terminal and the negative output terminal according to an input
power;

M light-emitting modules coupled between the positive output terminal and the negative output terminal, wherein each of the
M light-emitting modules has a conduction voltage, and comprises a light-emitting unit that comprises at least one light-emitting
diode; and

a control module coupled between the rectifier circuit and the M light-emitting modules, and configured to control the M light-emitting
modules to dynamically form a plurality of light-emitting diode strings coupled in parallel with each other,

wherein a number of the light-emitting units in each of the light-emitting diode strings is N, and a number of the light-emitting
diode strings is S, and

wherein when the driving voltage is changed from one time as much as the conduction voltage to (Q+q) times as much as the
conduction voltage, the N is changed from one to Q and the S is changed from M to M/Q with the change of the driving voltage,
where S×N=M, and M, S, N, Q are positive integers, and 0

US Pat. No. 9,257,609

LIGHT-EMITTING DIODE CHIP

Lextar Electronics Corpor...

1. A light-emitting diode (LED) chip, comprising:
an LED; and
an electrode layer disposed on the LED and comprising a reflective metal layer, wherein the reflective metal layer comprises:
a first composition comprising Al or Ag; and
a second composition comprising Cu, Si, Sn, Pt, Au or a combination thereof,
wherein a weight percentage of the second composition is greater than 0% and less than 20%, and
wherein the electrode layer comprises:
a first adhesive layer;
a second adhesive layer disposed on the first adhesive layer;
a diffusion barrier layer disposed on the second adhesive layer; and
a bonding layer disposed on the diffusion barrier layer,
wherein the reflective metal layer is disposed between the first adhesive layer and the second adhesive layer.

US Pat. No. 9,166,125

COMPREHENSIVE LIGHT-EMITTING DIODE DEVICE AND LIGHTING-MODULE

Lextar Electronics Corpor...

1. A comprehensive light-emitting diode device, comprising:
a translucent substrate comprising a first surface and a second surface opposite to the first surface;
a light-emitting diode chip disposed on the first surface;
a reflective layer disposed on the first surface and the light-emitting diode chip being surrounded by the reflective layer,
wherein a distance between the light-emitting diode chip and the reflective layer is 50 to 100 ?m;

a first wavelength conversion layer disposed on the first surface, and the light-emitting diode chip and the reflective layer
being covered by the first wavelength conversion layer; and

a second wavelength conversion layer disposed on the second surface, wherein a vertical projection of the light-emitting diode
chip is located in an area of the second wavelength conversion layer.

US Pat. No. 9,153,733

LIGHT EMITTING DIODE SUBSTRATE

LEXTAR ELECTRONICS CORPOR...

1. A method of manufacturing a light emitting diode (LED) substrate, the method comprising:
providing a nano-patterned substrate having a plurality of convex portions and a plurality of first concave portions that
are spaced apart from each other, wherein each first concave portion has a first depth (d1);

forming a plurality of protection structures to cover each of the convex portions, and exposing a bottom surface of each of
first concave portions, wherein at least one of the protection structures is formed as a part of a sphere or an ellipsoid
covering a top surface and a plurality of lateral surfaces of one of the convex portions; and

performing an anisotropic etching process to etch the bottom surface of each of the first concave portions which is not covered
by the protection structure so as to form a plurality of second concave portions having a second depth (d2), wherein d2 is
greater than d1, wherein at least one of the second concave portions is formed in a cone shape having a vertex, wherein the
protection structures are formed using a maskless pendeo-epitaxy process.

US Pat. No. 9,153,736

LIGHT-EMITTING DIODE DEVICE AND METHOD FOR FABRICATING THE SAME

Lextar Electronics Corpor...

1. A method for fabricating a light-emitting diode device, comprising:
providing a first-type semiconductor substrate having a first surface and a second surface opposite to the first surface;
growing a light-emitting layer and a second-type semiconductor layer on the first surface of the first-type semiconductor
substrate in sequence to form a light-emitting diode structure;

providing a metal substrate for the light-emitting diode structure to bond on through the second-type semiconductor layer;
forming a first mask pattern on a portion of the second surface of the first-type semiconductor substrate;
forming a plurality of metal nano balls on the second surface of the first-type semiconductor substrate not covered by the
first mask pattern;

performing a three-dimensional implantation process using the first mask pattern and the plurality of metal nano balls collectively
as a mask, so that a dopant is implanted into the first-type semiconductor substrate through the second surface and a sidewall
adjacent to the second surface, which are not covered by the first mask pattern and the plurality of metal nano balls;

removing the first mask pattern and the plurality of metal nano balls; and
forming a conductive pattern on the second surface of the first-type semiconductor substrate.

US Pat. No. 9,064,998

LIGHT EMITTING DIODE AND METHOD FOR MANUFACTURING THE SAME

LEXTAR ELECTRONICS CORPOR...

1. A method for manufacturing a light emitting diode, comprising:
providing a substrate;
forming a first-type semiconductor layer on the substrate;
forming a quantum well layer on the first-type semiconductor layer;
forming a second-type semiconductor layer on the quantum well layer;
patterning the quantum well layer and the second-type semiconductor layer to form a plurality of nanorods;
filling a transparent planar material into a space between the nanorods, wherein a top portion of each of the nanorods is
exposed out of the transparent planar material;

removing a portion of the second-type semiconductor layer, a part of the nanorods, a portion of the first-type semiconductor
layer and a portion of the transparent planar material to form a trapezoid sidewall structure such that a portion of the first-type
semiconductor layer is exposed; and

forming a transparent electrode layer to cover the transparent planar material and the top portion.

US Pat. No. 9,245,877

LED DEVICE AND LED LAMP USING THE SAME

LEXTAR ELECTRONICS CORPOR...

1. A light emitting diode (LED) device, comprising:
a frame comprising a first lead frame and a second lead frame which are disposed along a first direction and isolated from
each other, wherein the first direction is substantially parallel to an edge of the second lead frame;

a housing partially covering the first and second lead frames and having a receiving portion exposing parts of surfaces of
the first and second lead frames;

a LED chip disposed in the receiving portion on the exposed surface of the first lead frame and electrically connected to
the first and second lead frames; and

a protection component disposed on a surface of the second lead frame, wherein the protection component is covered by the
housing and electrically connected to the first lead frame, and none of the sides of a vertical projection of the protection
component on the second lead frame is parallel or perpendicular to the first direction.

US Pat. No. 9,059,376

ILLUMINATING DEVICE

Lextar Electronics Corpor...

1. An illuminating device, comprising:
a substrate having an upper surface, a die bond area located at the upper surface, and a groove around the die bond area;
a light-emitting diode element disposed on the die bond area;
a first electrode element having a first electrical-connection portion, a second electrical-connection portion, and a first
retaining slot located between the first and second electrical-connection portions, wherein the first retaining slot is disposed
in the groove, and the first and second electrical-connection portions are electrically connected to the die bond area and
an external power source;

a second electrode element having a third electrical-connection portion, a fourth electrical-connection portion, and a second
retaining slot located between the third and fourth electrical-connection portions, wherein the second retaining slot is disposed
in the groove, and the third and fourth electrical-connection portions are electrically connected to the die bond area and
the external power source; and

a sealing ring embedded in a portion of the groove and the first and second retaining slots to keep the first and second electrode
elements retained in the groove.

US Pat. No. 9,534,742

LIGHT BAR STRUCTURE

Lextar Electronics Corpor...

1. A light bar structure, comprising:
a longitudinal circuit board, comprising a first segment, a second segment, and a third segment arranged along a longitudinal
axis of the circuit board, wherein the second segment is between the first segment and the third segment, and wherein the
first segment, the second segment, and the third segment have substantially the same dimensions and are integrally formed
in one piece;

a plurality of light-emitting elements, disposed on the first segment, the second segment, and the third segment of the circuit
board;

a plurality of wires disposed on the first segment, the second segment, and the third segment of the circuit board, connecting
the plurality of light-emitting elements in parallel; and

a single power-input terminal, disposed in a middle position of the second segment of the circuit board and electrically connected
to the plurality of light-emitting elements in parallel through the wires so as to provide electric energy to the plurality
of light-emitting elements.

US Pat. No. 9,230,945

LIGHT-EMITTING DEVICE

LEXTAR ELECTRONICS CORPOR...

1. A light-emitting device, comprising:
a substrate formed by a conductive material and having an upper surface and a lower surface opposite to the upper surface,
the substrate comprising:

a first variable resistor and a second variable resistor, each of the first variable resistor and the second variable resistor
comprising a metal oxide;

an insulation portion located between the first variable resistor and the second variable resistor; and
a carrier surrounded by the insulation portion; and
a light-emitting element disposed on the carrier and the upper surface;
wherein, the first variable resistor, the second variable resistor and the insulation portion respectively penetrate to the
lower surface from the upper surface of the substrate.

US Pat. No. 9,461,213

LED SUB-MOUNT AND METHOD FOR MANUFACTURING LIGHT EMITTING DEVICE USING THE SUB-MOUNT

Lextar Electronics Corpor...

1. A light emitting diode device comprising:
a substrate body having a first surface;
a plurality of first electrical-conductive layers disposed on the first surface of the substrate body, wherein the first surface
between every adjacent two of the first electrical-conductive layers has an adhesive-filling groove, and the adjacent two
of the first electrical-conductive layers are in direct contact with an outer side surface of the adhesive-filling groove
and not in direct contact with an inner side surface of the adhesive-filling groove;

an LED chip mounted on the first surface by a flip-chip way, the LED chip having both two electrodes confronting and being
in direct contact with the adjacent two of the first electrical-conductive layers; and

a cured glue disposed within the adhesive-filling groove and being aligned immediately below the LED chip, and the cured glue
being sandwiched between and in direct contact with both the LED chip and the substrate body.

US Pat. No. 9,240,521

ELECTRODE STRUCTURE AND LIGHT EMITTING DIODE USING THE SAME

LEXTAR ELECTRONICS CORPOR...

1. An electrode structure disposed on a semiconductor, comprising:
a first diffusion barrier layer disposed on the semiconductor;
an aluminum reflective layer formed over the first diffusion barrier layer, wherein a thickness of the aluminum reflective
layer is in a range from about 500 to less than about 2,000 angstroms;

a second diffusion barrier layer formed over the aluminum reflective layer;
an electrode layer overlying the second diffusion barrier layer; and
a solder ball disposed on the electrode layer.

US Pat. No. 9,228,734

LIGHT-EMITTING DEVICE

LEXTAR ELECTRONICS CORPOR...

1. A light-emitting device, comprising:
a lamp casing, wherein a first opening and a second opening are formed on an upper end and a lower end of the lamp casing,
a received space is formed between the first opening and the second opening, and an edge of the lamp casing adjacent to the
first opening is bended inward to form a bending portion;

a heat dissipation element disposed within the received space, wherein the heat dissipation element has a plurality of carrying
portions separated from each other and arranged in radial-shape and a plurality of fins perpendicular to the carrying portions,
and each fin is bended downward and vertically from an edge of the corresponding carrying portion and extended toward the
second opening;

a light-emitting module comprising a substrate and a plurality of light-emitting elements disposed on the substrate, wherein
the light-emitting module is disposed on the carrying portions of the heat dissipation element and an edge of the substrate
leans against the bending portion, such that the light-emitting module is sandwiched between the carrying portions of the
heat dissipation element and the bending portion of the lamp casing;

wherein an edge of the substrate of the light-emitting module has a plurality of second air holes, and the vertical prosection
of the second air holes and the vertical projection of the carrying surfaces do not overlap with each other.

US Pat. No. 9,198,265

ILLUMINATION APPARATUS AUTOMATICALLY ADJUSTED WITH TIME

LEXTAR ELECTRONICS CORPOR...

1. An illumination apparatus automatically adjusted with time, comprising:
a timing module for setting the time into N sessions, and generating an ith timing signal according to an ith session corresponding to the current time, wherein i and N are natural numbers and i?N;

a control module for reading the ith timing signal from the timing module and correspondingly outputting an ith control signal;

a first power conversion module, coupled to an AC power supply, the control module and a first light source, for converting
a received AC power supply signal into a DC power signal and outputting the DC power signal to the control module, and correspondingly
outputting an ith DC driving signal to drive the first light source to emit light of an ith situation after receiving the ith control signal from the control module; and

a switch detection module coupled between a switch module and the control module for detecting the number of switching the
switch module within a period, wherein when the user turns on the switch module and then immediately turns off the switch
module and turns on the switch module again within the period, the control module stops reading the ith timing signal outputted from the timing module, and correspondingly generates a switch signal according to the number of switching,
such that the control module outputs a control signal corresponding to a predetermined lighting situation to the first power
conversion module according to the switch signal and the first power conversion module correspondingly outputs a driving current
to the first light source.

US Pat. No. 9,166,128

LIGHT-EMITTING ASSEMBLY AND METHOD FOR MANUFACTURING THE SAME

Lextar Electronics Corpor...

1. A method for manufacturing a light-emitting assembly, comprising:
providing a circuit board;
forming a plurality of optical microstructures on the circuit board; and
providing a light-emitting element on the circuit board, wherein the optical microstructures are adjacent to the light-emitting
element for absorbing or guiding a portion of light emitted from the light-emitting element, and the optical microstructures
are made from an ink comprising light-absorbing or light reflecting material.

US Pat. No. 9,117,959

LIGHT EMITTING DIODE STRUCTURE

LEXTAR ELECTRONICS CORPOR...

1. A light emitting diode structure, comprising:
a substrate;
a light emitting multi-layer structure formed on the substrate by way of stacking;
a first current blocking layer formed on part of the light emitting multi-layer structure;
a second current blocking layer formed on part of the first current blocking layer; and
a first current spreading layer covering the first current blocking layer, the second current blocking layer and the light
emitting multi-layer structure.

US Pat. No. 9,444,005

LIGHT EMITTING DIODE STRUCTURE

LEXTAR ELECTRONICS CORPOR...

1. A light emitting diode structure, comprising:
a substrate;
a light emitting multi-layer structure formed on the substrate by way of stacking;
a first current blocking layer formed on part of the light emitting multi-layer structure;
a first current spreading layer covering the first current blocking layer and the light emitting multi-layer structure; and
a second current blocking layer formed on part of the first current spreading layer, wherein an orthogonal projection of the
second current blocking layer is disposed in an orthogonal projection of the first current blocking layer; and

a second current spreading layer covering the second current blocking layer and the first current spreading layer.

US Pat. No. 9,307,614

COLOR TEMPERATURE AND ILLUMINATION ADJUSTING SYSTEM, AND METHOD THEREOF

Lextar Electronics Corpor...

1. A temperature and illumination adjusting system, comprising:
a temperature and illumination adjusting device, comprising:
a central processing unit, receiving an illumination value and a color-temperature value, and generating a first PWM value
and a second PWM value according to a first formula and a second formula;

a memory unit, storing the first formula and the second formula, wherein the first formula indicates the correlation between
the first PWM value, the second PWM value and the illumination value, and wherein the second formula indicates the correlation
between the first PWM value, the second PWM value and the color-temperature value; and

a communication unit, outputting the first PWM value and the second PWM value; and
a lamp device, comprising:
a lamp communication unit, receiving the first PWM value and the second PWM value;
a first light module;
a second light module;
a first PWM driving unit, driving the first light module by the first PWM value; and
a second PWM driving unit, driving the second light module by the second PWM value,
wherein the outputs of the first light module and the second light module have different color temperatures;
wherein the second formula is PWM2/PWM1=c1*e?CCT/c2+c3; and

wherein PWM1 is the first PWM value, PWM2 is the second PWM value, c1, c2, c3 are constants, and e is a mathematical constant.

US Pat. No. 9,252,332

LIGHT EMITTING DIODE STRUCTURE AND LIGHT EMITTING DIODE MODULE

Lextar Electronics Corpor...

1. A light emitting diode structure, comprising:
a first contact electrode comprising a first protruding portion;
a first insulating layer covering the first contact electrode and exposing a top of the first protruding portion;
a second contact electrode located on the first insulating layer and comprising a second protruding portion;
a second insulating layer covering the second contact electrode and exposing a top of the second protruding portion;
a first barrier layer located on the second insulating layer and electrically connected to the second contact electrode;
a second barrier layer located on the second insulating layer;
a first illuminant epitaxial structure located on the second insulating layer and comprising:
a first P-type semiconductor layer covering the first barrier layer;
a first light emitting layer; and
a first N-type semiconductor layer, wherein the first light emitting layer and the first N-type semiconductor layer are sequentially
stacked on the first P-type semiconductor layer, and a portion of the first insulating layer passes through the first P-type
semiconductor layer and the light emitting layer, such that the top of the first protruding portion is located in the first
N-type semiconductor layer; and

a second illuminant epitaxial structure located on the second insulating layer and comprising:
a second P-type semiconductor layer covering a portion of the second barrier layer;
a second light emitting layer; and
a second N-type semiconductor layer, wherein the second light emitting layer and the second N-type semiconductor layer are
sequentially stacked on the second P-type semiconductor layer, and a portion of the second insulating layer passes through
the second P-type semiconductor layer and the light emitting layer, such that the top of the second protruding portion is
located in the second N-type semiconductor layer.

US Pat. No. 9,130,108

LIGHT-EMITTING DIODE AND METHOD FOR MANUFACTURING THEREOF

LEXTAR ELECTRONICS CORPOR...

10. A method for manufacturing a light-emitting diode, comprising:
providing a substrate;
forming a first type semiconductor layer on the substrate;
forming a light-emitting layer on the first type semiconductor layer;
forming a second type semiconductor layer on the light-emitting layer, the second type semiconductor layer having a current
spreading area and a current blocking area, and having a first surface and a second surface opposite to the first surface,
wherein the first surface is in contact with the light-emitting layer;

forming a first current spreading layer over the current spreading area of the second surface and exposing the current blocking
area of the second surface; and

forming a second current spreading layer over the first current spreading layer and the exposed current blocking area of the
second surface, and transforming the exposed current blocking area of the second surface into a current blocking layer with
a plurality of nitrogen vacancies.

US Pat. No. 9,717,127

LED DEVICE AND DIMMING SYSTEM AND METHOD THEREOF

LEXTAR ELECTRONICS CORPOR...

1. A dimming system for controlling a luminance of a light emitting diode (LED) device, wherein the dimming system comprises:
a signal generating circuit configured to generate a driving signal according to an input signal and switch the driving signal
among a plurality of states according to a switch signal; and

a first dimming circuit configured to generate a dimming signal according to the driving signal for adjusting the luminance
of the LED device, wherein when the driving signal switches from a first state to a second state of the plurality of states,
the first dimming circuit correspondingly changes the dimming signal, such that the luminance of the LED device is adjusted
from a first luminance level to a second luminance level; and

a second dimming circuit configured to adjust the input signal according to a control signal, such that the dimming signal
is adjusted correspondingly and the luminance of the LED device is between the first luminance level and a minimum luminance
level or between the second luminance level and the minimum luminance level.

US Pat. No. 9,326,341

LIGHT-EMITTING MODULE, LED DRIVING CIRCUIT, AND LED DRIVING METHOD

LEXTAR ELECTRONICS CORPOR...

1. A light-emitting diode (LED) driving circuit configured for driving at least one group of LEDs, wherein the LED driving
circuit comprises:
a constant current source configured for generating a current signal with a constant current value;
a pulse width modulation (PWM) element electrically connected to the constant current source and configured for modulating
the current signal to generate a PWM signal corresponding to the current signal, wherein the PWM signal comprises a plurality
of pulses identical in width; and

at least one pulse frequency modulation (PFM) element electrically connected between the PWM element and the at least one
group of LEDs and configured for modulating a frequency width of the PWM signal to generate at least one PFM signal for driving
the at least one group of LEDs;

wherein when the at least one PFM element modulates the frequency width of the PWM signal, the at least one PFM signal is
changed, and light-emitting frequencies of the at least one group of LEDs are also changed.

US Pat. No. 9,238,317

LIGHTING APPARATUS, LED MOUNTING SUBSTRATE AND MOLD FOR MANUFACTURING THE SAME

Lextar Electronics Corpor...

1. An LED mounting substrate, comprising:
a lead frame;
a base disposed on the lead frame and having a cavity, a bottom of the cavity having an opening for exposing a portion of
the lead frame, a cross-sectional area of the cavity increasing along a direction from the lead frame to a top surface of
the base; and

a residue of injection molding material disposed on one of outer walls of the base surrounding the cavity, a cross-sectional
area of the residue of injection molding material decreasing along a direction from the lead frame to the top surface of the
base,

wherein a cross section of the cavity is asymmetrical about a central line of the outer wall that the residue of injection
molding material is disposed on, and the central line crosses the residue of injection molding material, and a cross section
of the residue of injection molding material is asymmetrical,

wherein a cross section of the cavity is divided as a first area and a second area by the central line of the outer wall that
the residue of injection molding material is disposed on, and a cross section of the residue of injection molding material
is divided as a third area and a fourth area by the central line of the outer wall that the residue of injection molding material
is disposed on, wherein the first area and the third area are positioned on one side of the central line, and the second area
and the fourth area are positioned on another side of the central line, wherein the first area is greater than the second
area, and the fourth area is greater than the third area.

US Pat. No. 9,214,443

EUTECTIC SOLDER STRUCTURE FOR CHIP

Lextar Electronics Corpor...

1. A eutectic solder structure for a chip, comprising:
a substrate;
a solder structure on the substrate, wherein the solder structure includes an alternate lamination of a plurality of first
metal layers and a plurality of second metal layers, wherein each second metal layer has a continuous region and a plurality
of openings, and the melting point of the plurality of second metal layers is higher than that of the plurality of first metal
layers, and wherein the orthographic projections of the openings of different second metal layers on the substrate are misaligned
with each other; and

a chip on the solder structure, wherein the chip is bonded to the substrate by an eutectic reaction of the solder structure.

US Pat. No. 9,107,255

LIGHT-EMITTING DIODE LIGHT TUBE DRIVING CIRCUIT

LEXTAR ELECTRONICS CORPOR...

1. A light-emitting diode light tube driving circuit used in a lamp socket with a ballast, the light-emitting diode light
tube driving circuit comprising:
a light-emitting diode driver configured for receiving an operating voltage to drive at least one light-emitting diode; and
a rectifier unit having a first input/output terminal and a second input/output terminal, and electrically coupled to an external
alternating-current power source selectively through the first input/output terminal and the second input/output terminal,
and configured for providing the operating voltage to the light-emitting diode driver, the rectifier unit comprising:

a first rectifier diode, an anode of the first rectifier diode being electrically coupled to the light-emitting diode driver,
a cathode of the first rectifier diode being electrically and directly coupled to the first input/output terminal and the
second input/output terminal; and

a second rectifier diode, an anode of the second rectifier diode being electrically and directly coupled to the cathode of
the first rectifier diode, the first input/output terminal and the second input/output terminal, and a cathode of the second
rectifier diode being electrically coupled to the light-emitting diode driver.

US Pat. No. 9,472,733

LED DISPLAY AND MANUFACTURING METHOD THEREOF

LEXTAR ELECTRONICS CORPOR...

1. A LED display, comprising:
a first transparent substrate;
a plurality of pixels formed on the first transparent substrate, wherein each of the pixels comprises:
a first sub-pixel, a second sub-pixel and a third sub-pixel respectively surrounded by a light-insulating structure;
a first wavelength transition layer formed in the first sub-pixel;
a second wavelength transition layer formed in the second sub-pixel;
a third wavelength transition layer formed in the third sub-pixel;
an adhesive layer disposed on the first, second and third wavelength transition layers; and
a first LED chip, a second LED chip and a third LED chip disposed on the adhesive layer in the first, second and third sub-pixels,
respectively;

a packaging material filled into the first sub-pixels, the second sub-pixels and the third sub-pixels of each of the pixels;
and

a second transparent substrate opposite and parallel to the first transparent substrate, wherein the second transparent substrate
is bonded to the first, second and third LED chips by the packaging material.

US Pat. No. 9,093,611

LIGHT-EMITTING DIODE CHIP

Lextar Electronics Corpor...

1. A LED chip, comprising:
a substrate, wherein an orthographic projection of the substrate comprises five or more edges;
a semiconductor element, comprising a first-type semiconductor layer, a light-emitting layer, and a second-type semiconductor
layer stacked in order from the substrate, wherein a recess is formed on the second-type semiconductor layer, and a portion
of the first-type semiconductor layer is exposed to the environment by the recess;

a conductive layer, disposed on the second-type semiconductor layer;
a first electrode, disposed on the portion of the first-type semiconductor layer that is exposed by the recess;
a second electrode, disposed on the conductive layer; and
a first circular electrode, disposed on the conductive layer, wherein the first circular electrode extends along the edges
of the substrate and is electrically connected to the second electrode so as to form a closed loop circuit.

US Pat. No. 9,065,027

LIGHT EMITTING DIODE PACKAGE STRUCTURE

LEXTAR ELECTRONICS CORPOR...

1. A light emitting diode package structure with adjustable light-emitting profile comprising:
a base portion having an upper surface and a lower surface opposite to the upper surface, the upper surface having a die-bonding
area;

at least one light-emitting chip emitting a light with a first wavelength and being disposed on the die-bonding area;
a cup portion being disposed on the base portion and being disposed to surround the die-bonding area to form a recess having
an opening above the die-bonding area; and

an encapsulating glue being filled into the recess, the encapsulating glue having a wavelength conversion material configured
to convert part of the light with the first wavelength into a light with a second wavelength, the light with the second wavelength
mixed with the remaining light with the first light wavelength to form a white light;

wherein the cup portion comprises an electro chromic layer electrically connected to a first external power and a transmittance
of the electro chromic layer is changed in accordance with an input voltage of the first external power, so as to adjust the
light profile of the light-emitting chip.

US Pat. No. 9,484,506

LED DISPLAY AND MANUFACTURING METHOD THEREOF

LEXTAR ELECTRONICS CORPOR...

1. A manufacturing method of a light emitting diode (LED) display, comprising:
providing a temporary substrate having a first adhesive layer and a plurality of first, second and third LED chips mounted
on the first adhesive layer;

providing a first transparent substrate having a plurality of pixels disposed thereon, wherein each of the pixels comprises
a first sub-pixel, a second sub-pixel and a third sub-pixel respectively surrounded by a light-insulating structure;

bonding the temporary substrate to the first transparent substrate, such that each of the first, second and third LED chips
is correspondingly mounted in each of the first sub-pixels, second sub-pixels and third sub-pixels; and

removing the temporary substrate.

US Pat. No. 9,447,959

HEAT SINK FOR ELECTRICAL ELEMENTS AND LIGHT-EMITTING DEVICE CONTAINING THEREOF

LEXTAR ELECTRONICS CORPOR...

1. A heat sink for electrical elements, comprising:
a thermal conductive substrate; and
at least one hollow ventilation channel horizontally embedded in the thermal conductive substrate, the hollow ventilation
channel having a roughened surface formed on the inner wall of the hollow ventilation channel and two openings respectively
on the same side or two different sides of the thermal conductive substrate, so as to flow air in the hollow ventilation channel
and take away the heat of the thermal conductive substrate.

US Pat. No. 9,397,263

LIGHT-EMITTING DIODES

Lextar Electronics Corpor...

1. A light-emitting diode, comprising:
an N-type semiconductor layer;
a light-emitting layer disposed on a portion of the N-type semiconductor layer to expose another portion of the N-type semiconductor
layer;

a P-type semiconductor layer disposed on the light-emitting layer;
a P-type electrode including a first body part and a first extension part, wherein the first body part is disposed on a corner
of an upper surface of the P-type semiconductor layer and the first extension part extends from the first body part onto the
exposed portion of the N-type semiconductor layer along a sidewall of the P-type semiconductor layer adjacent to the exposed
portion of the N-type semiconductor layer;

an N-type electrode disposed on the exposed portion of the N-type semiconductor layer;
a current blocking layer disposed on a part of the P-type semiconductor layer under the P-type electrode and on a part of
N-type semiconductor layer under the P-type electrode; and

a transparent conductive layer disposed on a partial upper surface of the P-type semiconductor layer, and a part of the transparent
conductive layer disposed between the current blocking layer and the P-type electrode.

US Pat. No. 9,474,115

DIMMING CIRCUIT

LEXTAR ELECTRONICS CORPOR...

1. A dimming circuit, comprising:
a control voltage receiving module configured to output a reference voltage according to a control voltage; and
a driving module electrically connected to the control voltage receiving module, the driving module comprising:
a driving transistor configured to provide a driving current to drive a lighting module;
a first transistor configured to control the driving transistor with feedback according to the reference voltage; and
a feedback circuit electrically connected between the driving transistor and the first transistor, the feedback circuit being
configured to determine an operating state of the first transistor according to the driving current.

US Pat. No. 9,324,909

LIGHT EMITTING DIODE AND METHOD OF FABRICATING THE SAME

LEXTAR ELECTRONICS CORPOR...

1. A method for fabricating a light emitting diode, comprising the steps of:
providing a substrate comprising a first area and a second area;
forming, by an epitaxial growth process, a cushion layer, a first-type semiconductor layer, a light emitting layer and a second-type
semiconductor layer sequentially on the substrate;

defining, by a photolithography and an etching processes, the first-type semiconductor layer, the light emitting layer and
the second-type semiconductor layer for exposing the first-type semiconductor layer in the first area, and forming a platform
having the first-type semiconductor layer, the light emitting layer and the second-type semiconductor layer in a position
other than the first area;

forming a plurality of nano-scale masks spaced regularly on the platform;
forming a cross-sectional trapezoid hard mask on the platform to cover the nano-scale masks where a light emitting diode stacked
structure to be formed;

removing, by an anisotropic etching process, the platform without covered by the cross-sectional trapezoid hard mask and the
nano-scale masks, and forming the light emitting diode stacked structure having a trapezoid sidewall and nano columns, wherein
the trapezoid sidewall has an inclined surface, a portion of the nano columns extends from the inclined surface in regular
arrangement, and the first-type semiconductor layer is as an etching endpoint;

removing the cross-sectional trapezoid hard mask and the nano-scale masks;
forming a transparent conductive layer on the second-type semiconductor layer of the light emitting diode stacked structure
having a trapezoid sidewall;

forming a first contact pad on the first portion of the first-type semiconductor layer in the first area; and
forming a second contact pad on the transparent conductive layer.

US Pat. No. 9,093,858

ILLUMINATION SYSTEM AND ILLUMINATION DRIVING METHOD

LEXTAR ELECTRONICS CORPOR...

1. An illumination system, comprising
a light-emitting device;
a first switch element electrically connected to an external power source, the first switch element configured for receiving
an external voltage supplied by the external power source;

a driving device electrically connected between the light-emitting device and the first switch element, the driving device
configured for converting the external voltage to a direct-current power signal for driving the light-emitting device to emit
light when the first switch element is switched on;

a detecting circuit connected across both ends of the first switch element, the detecting circuit configured for detecting
a voltage across the first switch element and converting the voltage to a detecting signal;

an arithmetic unit electrically connected to the driving device and the detecting circuit, the arithmetic unit configured
for performing an arithmetic operation on the direct-current power signal and the detecting signal to generate a control signal;
and

a power supply unit electrically connected to the arithmetic unit, the power supply unit configured for supplying power for
the light-emitting device according to the control signal and configured for driving the light-emitting device to emit light
when the external power source is interrupted.

US Pat. No. 9,089,022

LIGHT ADJUSTING DEVICE WITH SWITCHING ELEMENT

LEXTAR ELECTRONICS CORPOR...

1. A light adjusting device for rectifying the luminance of a light source, comprising:
a full-wave bridge rectifier for receiving an AC signal from a first power node and a second power node, and rectifying the
AC signal to output a driving signal to the light source;

a first switch element coupled to the first power node;
a second switch element coupled to the second power node; and
a pulse width modulation (PWM) signal generator for outputting a control signal to the first and second switch elements to
control the conduction states of the first and second switch elements, wherein the first and second switch elements are turned
off when the control signal is at a low level, and the first and second switch elements are turned on when the control signal
is at a high level;

wherein, when the first and second switch elements are turned on, the driving signal provided to the light source is interrupted;
wherein one terminal of the full-wave bridge rectifier and one terminal of the light source are coupled to a common first
node, the other terminal of the full-wave bridge rectifier and the other terminal of the light source are coupled to a common
second node, the driving signal flows to the common second node from the common first node, and the first and second switch
elements are coupled to the common second node.

US Pat. No. 9,052,068

DUAL-USE LIGHT FIXTURE HAVING AC AND DC LEDS

LEXTAR ELECTRONICS CORPOR...

1. A dual-use light fixture having AC and DC LEDs comprising:
a heat-dissipating housing having a first end and a second end, wherein the first end has a first opening and the second end
has a second opening, and a diameter of the first opening is greater than a diameter of the second opening;

a printed circuit board located on the first end of the heat-dissipating housing;
at least one DC LED chip disposed on the printed circuit board;
at least one AC LED chip disposed on the printed circuit board; and
a power supply pedestal coupled to the second end of the heat-dissipating housing, wherein an accommodating space is formed
by the power supply pedestal and the heat-dissipating housing, and the power supply pedestal comprises:

an AC plug electrically connected to the printed circuit board for inserting into an AC outlet to provide an AC power, wherein
the AC power drives the AC LED chip to emit light;

a DC driving unit located in the accommodating space and electrically connected to the printed circuit board; and
a thread connector coupled to another AC power, wherein another AC power is converted into a DC power by the DC driving unit
for driving the DC LED chip to emit light.

US Pat. No. 9,441,797

LENS DEVICE AND LIGHT SOURCE MODULE USING THE SAME

LEXTAR ELECTRONICS CORPOR...

1. A lens device, comprising:
a lens having a middle light emitting surface and a periphery light emitting surface, wherein the periphery light emitting
surface surrounds the middle light emitting surface; and

a patterned light shielding layer formed on the periphery light emitting surface of the lens and separated from a boundary
of the periphery light emitting surface;

wherein the patterned light shielding layer has an annular shape and has a plurality of hollowed spots arranged as at least
an annular pattern.

US Pat. No. 9,093,613

ELECTRODE STRUCTURE AND LIGHT EMITTING DIODE STRUCTURE HAVING THE SAME

LEXTAR ELECTRONICS CORPOR...

1. An electrode structure comprising:
at least one reflection layer, wherein the reflection layer comprises a first reflection layer and a second reflection layer,
or the reflection layer is formed by a plurality of first and second reflection layers alternately stacked, wherein the first
and second reflection layers are made of different metal materials or different alloy materials;

a barrier layer comprising a first barrier layer and a second barrier layer, wherein the first and second barrier layers are
stacked on the reflection layer in sequence, and the first and second barrier layers are made of different materials; and

a conductive pad located on the barrier layer.

US Pat. No. 9,048,381

METHOD FOR FABRICATING LIGHT-EMITTING DIODE DEVICE

Lextar Electronics Corpor...

1. A method for fabricating a light-emitting diode device, comprising:
providing a carrier having a first surface and a second surface on opposite sides of the carrier, wherein the first surface
has a plurality of insulating micro patterns, and wherein the carrier and the plurality of insulating micro patterns are formed
by different materials;

growing a buffer layer, a first-type semiconductor layer, a light-emitting layer and a second-type semiconductor layer on
the first surface of the carrier in sequence to form a light-emitting lamination layer;

providing a substrate for the second-type semiconductor layer of the light-emitting lamination layer to bond on;
performing a laser lift-off process to lift off the carrier from the light-emitting lamination layer, and surfaces of the
plurality of insulating micro patterns and a surface of the buffer layer between the plurality of insulating micro patterns
are exposed;

removing the plurality of insulating micro patterns and the buffer layer to form a plurality of recess structures on the first-type
semiconductor layer; and

performing a surface-roughing process on a plurality of surfaces of the plurality of recess structures.

US Pat. No. 9,087,960

LIGHT EMITTING DIODE AND METHOD OF FABRICATING THE SAME

LEXTAR ELECTRONICS CORPOR...

1. A light emitting diode comprising:
a substrate having a surface with a cushion layer thereon with a first area and a second area;
a first-type semiconductor layer comprising a first portion and a second portion located in the first area and the second
area, respectively;

a structural layer disposed on the second area of the cushion layer, comprising:
the second portion of the first-type semiconductor layer;
a light emitting layer disposed on the second portion of the first-type semiconductor layer; and
a second-type semiconductor layer disposed on the light emitting layer, wherein the structural layer is composed of a stacked
structure having a trapezoid sidewall and nano columns, the trapezoid sidewall has an inclined surface, and a portion of the
nano columns extends from the inclined surface in regular arrangement;

a transparent conductive layer disposed on the stacked structure of the structural layer in the second area of the cushion
layer;

a first contact pad disposed on the first portion of the first-type semiconductor layer in the first area of the cushion layer;
and

a second contact pad disposed on the transparent conductive layer.

US Pat. No. 9,366,390

LIGHT EMITTING DIODE DEVICE AND LIGHT EMITTING DIODE LAMP

LEXTAR ELECTRONICS CORPOR...

1. A light emitting diode (LED) device, comprising:
a transparent substrate comprising a first surface and a second surface opposite to the first surface, wherein the first surface
has a first reflection zone, a second reflection zone and a transparent zone outside of the first reflection zone and the
second reflection zone thereon;

a first and a second reflection layers disposed on the first and the second reflection zones respectively;
a first and a second LED chips electrically connected with each other and disposed on the first and the second reflection
layers respectively, wherein an orthographic projection of the first LED chip onto the transparent substrate is located within
the first reflection zone and an orthographic projection of the second LED chip onto the transparent substrate is located
within the second reflection zone;

a positive electrode and a negative electrode disposed on an end of the transparent substrate and electrically connected to
the first and the second LED chips respectively; and

a wavelength-converting layer at least covering the first and the second reflection layers and the first and the second LED
chips,

wherein the first and the second reflection layers respectively reflect a portion of light beams emitted from the first and
the second LED chips to the wavelength-converting layer.

US Pat. No. 9,560,701

DRIVING CIRCUIT AND LAMPS

LEXTAR ELECTRONICS CORPOR...

1. A driving circuit, comprising:
a first bridge circuit, wherein the first bridge circuit is coupled to an AC voltage source to output a first voltage, and
the first bridge circuit comprises a first positive input terminal, a first negative input terminal, a first positive output
terminal and a first negative output terminal;

a second bridge circuit, wherein the second bridge circuit is coupled to the AC voltage source to output a second voltage,
and the second bridge circuit comprises a second positive input terminal, a second negative input terminal, a second positive
output terminal and a second negative output terminal, wherein the second negative output terminal and the first negative
output terminal are coupled to the same ground potential;

a first protection device coupled between the second positive input terminal and the AC voltage source, wherein the first
protection device comprises a first capacitor and a first diode connected to the first capacitor; and

a second protection device coupled between the second negative input terminal and the AC voltage source, wherein the second
protection device comprises a second capacitor and a second diode connected to the second capacitor,

wherein the first capacitor and the second capacitor are polarized, a cathode of the first capacitor is directly connected
to an anode of the first diode and the second positive input terminal of the second bridge circuit, an anode of the first
capacitor is directly connected to a cathode of the first diode, a cathode of the second capacitor is directly connected to
an anode of the second diode and the second negative input terminal of the second bridge circuit, and an anode of the second
capacitor is directly connected to a cathode of the second diode;

wherein the first protection device and the second protection device are configured for avoiding that an input current inputted
from the first positive input terminal or the first negative input terminal of the first bridge circuit is fed back to the
second positive input terminal or the second negative input terminal of the second bridge circuit.

US Pat. No. 9,441,794

LAMP TUBE

Lextar Electronics Corpor...

1. A lamp tube, comprising:
a cover, including a first connection portion and a second connection portion opposite to each other;
a heat sink, including a base, a first supporting portion, and a second supporting portion extended upwardly from the base,
wherein the first and second supporting portions respectively include a first recess and a second recess formed on the outer
sides thereof, and the cover is joined with the heat sink to form a tube structure by respectively engaging the first and
second connection portions with the first and second recesses; and

a light bar, disposed on a surface formed by a first end and a second end of the first and second supporting portions which
are distant from the base.

US Pat. No. 9,253,836

LIGHT-EMITTING DEVICE

LEXTAR ELECTRONICS CORPOR...

1. A light-emitting device comprising:
a power module for rectifying an AC voltage to provide a driving voltage, wherein the driving voltage is periodic;
a first light-emitting module;
a second light-emitting module, wherein the first light-emitting module and the second light-emitting module are electrically
connected to each other in series; and

a control module for making the first light-emitting module and the second light-emitting module be driven by the driving
voltage in response to different driving stages in one cycle period of the driving voltage,

wherein, in a first driving stage of the driving stages in the one cycle period of the driving voltage, the control module
makes the first light-emitting module being driven by the driving voltage, and provides a first driving current to the first
light-emitting module, and a first cross voltage is present across the first light-emitting module;

in a second driving stage of the driving stages in the one cycle period of the driving voltage, the control module makes the
first light-emitting module and the second light-emitting module being driven by the driving voltage, and provides a second
driving current to the first light-emitting module and the second light-emitting module, and a second cross voltage is present
across the first light-emitting module and the second light-emitting module, and the first driving current is different from
the second driving current; and

a product of the first cross voltage and the first driving current and a product of the second cross voltage and the second
driving current are substantially identical, such that luminous fluxes of the first light-emitting module and the second light-emitting
module in the first driving stage and the second driving stage are substantially identical.

US Pat. No. 9,634,194

LIGHT-EMITTING DIODE CHIP

Lextar Electronics Corpor...

1. A light-emitting diode (LED) chip, comprising:
an LED; and
an electrode layer disposed on the LED, wherein the electrode layer comprises a reflective metal layer, a diffusion barrier
layer disposed on the reflective metal layer, and an adhesive layer between the LED and the reflective metal layer, wherein
the diffusion barrier layer has an interface with the reflective metal layer, and wherein each of the reflective metal layer
and the diffusion barrier layer comprises:

a first composition comprising Al or Ag; and
a second composition comprising Cu, Si, Sn, Pt, Au or a combination thereof,
wherein a weight percentage of the second composition is greater than 0% and less than 20%.

US Pat. No. 9,635,792

DIE-POSITIONING DEVICE, DIE-POSITIONING SYSTEM HAVING THE SAME, AND DIE-POSITIONING METHOD OF LED DISPLAY BOARD

LEXTAR ELECTRONICS CORPOR...

1. A die-positioning device for positioning a plurality of dies on at least one die-disposing region of a substrate, wherein
the die-positioning device comprises:
a roller body having a plurality of chambers therein, and comprising a gas transmission pipe and a plurality of baffle boards,
wherein the chambers are separated from each other, and the baffle boards are located in the roller body and surround the
gas transmission pipe with intervals therebetween to form the chambers;

a plurality of die-suction portions located on a surface of the roller body in columns, wherein the die-suction portions for
each column correspond to one of the chambers, and each of the die-suction portions has a die suction region and a gas channel
passing through the die suction region; and

at least one gas control device connected to the chambers and disposed on the roller body, wherein the gas transmission pipe
is located in the roller body for communicating the gas control device and the chambers, and the gas control device selectively
sucks the air from a specific chamber, such that each of the die-suction portions on the specific chamber sucks one of the
dies by the corresponding gas channel, and when the gas control device stops sucking the air from the specific chamber, the
sucked die is released to a predetermined position.

US Pat. No. 9,237,631

LIGHT EMITTING CHIP AND LIGHT EMITTING DEVICE HAVING THE SAME

LEXTAR ELECTRONICS CORPOR...

1. A light emitting chip, operating under a DC power supply, comprising:
a substrate;
a plurality of light emitting elements, electrically connected to each other and arranged on the substrate, having same or
different area sizes, and sectionally driven by a plurality of driving voltages, wherein the light emitting elements are divided
into a first light emitting element group and a second light emitting element group; and

a first external electrical contact and a plurality of second external electrical contacts disposed on light emitting elements
for receiving the driving voltages, wherein when a first-section driving voltage is applied to the first light emitting element
group, the first light emitting element group is conducted between the first external electrical contact and one of the second
external electrical contacts; when a second-section voltage is applied to the first light emitting element group and the second
light emitting element group, both of the first and second light emitting element groups are conducted between the first external
electrical contact and another of the second external electrical contacts, wherein the first external electrical contact is
a positive contact and the second external electrical contacts are negative contacts electrically connected in series.

US Pat. No. 9,341,319

LAMP TUBE

Lextar Electronics Corpor...

1. A lamp tube, comprising:
a cover;
a heat sink, joined with the cover to form a tube body extended along a first direction, wherein the heat sink includes a
first portion and a second portion substantially symmetrical to a reference plane that is parallel to the first direction
and intersects both the cover and the heat sink;

a reflecting structure, disposed above the second portion of the heat sink, comprising:
a reflecting surface, tilted with respect to the reference plane at a first angle;
a first extended wall, connected to a joint between the first and second portions; and
a second extended wall, connected to an edge of the second portion that is distant from the first portion;
wherein the reflecting structure and the second portion of the heat sink define a receiving space;
a light bar, disposed on the first portion of the heat sink, wherein a normal line of the light bar is tilted with respect
to the reference plane at a second angle; and

a driving circuit, disposed in the receiving space.

US Pat. No. 9,570,653

LIGHT-EMITTING SEMICONDUCTOR STRUCTURE AND METHOD FOR FABRICATING LIGHT-EMITTING DIODE DEVICE

LEXTAR ELECTRONICS CORPOR...

1. A light-emitting semiconductor structure, comprising: a substrate; a dielectric layer in contact with the substrate, wherein
the dielectric layer is a single-layer or multiple-layer spherical structure having a plurality of spheres defining voids,
between the plurality of spheres and the substrate, that are not filled with any material; a buffer layer on the dielectric
layer; a first conductive type semiconductor layer on the buffer layer; a multiple quantum well on the first conductive type
semiconductor layer; and a second conductive type semiconductor layer on the multiple quantum well, wherein the voids are
disposed between the multiple quantum well and the substrate and separated from the multiple quantum well by the buffer layer.

US Pat. No. 9,551,823

BACKLIGHT MODULE

Lextar Electronics Corpor...

1. A backlight module, comprising:
a circuit board;
a plurality of light-emitting elements, disposed on the circuit board and separated from each other;
a frame, including a base plate and two lateral plates extended from the base plate, wherein the circuit board is disposed
on the base plate;

a plurality of first and second reflecting portions disposed on the two lateral plates and arranged in a staggered manner,
wherein the first reflecting portions are closer to the light-emitting elements than the second reflecting portions, and the
reflectivity of the second reflecting portions exceeds that of the first reflecting portions; and

a light-guide plate disposed between the two lateral plates of the frame, and the light-guide plate includes a light-incident
surface and a light-emitting surface perpendicular thereto, wherein the light from the light-emitting elements enters the
light-guide plate from the light-incident surface and exits by the light-emitting surface, and the entirety of both the first
reflecting portions and the second reflecting portions on both of the two lateral plates are respectively separated from the
entirety of the light-guide plate by a gap.

US Pat. No. 9,601,661

EPITAXIAL STRUCTURE AND EPITAXIAL GROWTH METHOD FOR FORMING EPITAXIAL LAYER WITH CAVITIES

LEXTAR ELECTRONICS CORPOR...

1. An epitaxial structure, comprises:
a substrate having a surface;
a first epitaxial layer disposed over the substrate and comprising a portion of a plurality of stepped air voids and an opening
over each said portion of the stepped air voids; and

a second epitaxial layer disposed on the first epitaxial layer and collectively defining the stepped air voids with the surface
and the first epitaxial layer.

US Pat. No. 9,586,286

APPARATUS AND METHOD FOR FABRICATING PERIODIC MICRO-PATTERN BY LASER BEAMS

Lextar Electronics Corpor...

17. A method for fabricating a periodic micro-pattern by laser beam, comprising:
generating an output laser beam by an ultrafast laser light source;
the output laser beam being incident to a diffraction optical element to be divided into a plurality of diffractive laser
beams;

the plurality of diffractive laser beams being incident to a confocal system to be focused on a focal point, so that the plurality
of diffractive laser beams produces an interference light beam with interference phenomena, wherein the confocal system comprises:

a first lens configured for the plurality of diffractive laser beams being incident thereto to produce a plurality of first
collimated laser beams;

a light shielding mask having a plurality of holes, configured for the plurality of first collimated laser beams being incident
thereto to produce a plurality of second collimated laser beams; and

a second lens configured to focus the plurality of second collimated laser beams to a focal point of the second lens,
wherein the first lens, the second lens and the light shielding mask are arranged along an optical axis of the output laser
beam, and the light shielding mask is disposed between the first lens and the second lens, so that the plurality of diffractive
laser beams passes through the first lens, the light shielding mask and the second lens in sequence,

disposing an element on the focal point of the second lens, so that the interference light beam ablates a surface of the element
to fabricate a periodic micro-pattern on the surface of the element.

US Pat. No. 9,900,940

LIGHT-EMITTING DIODE DEVICE

LEXTAR ELECTRONICS CORPOR...

1. A light-emitting diode (LED) device, comprising:
an LED module, comprising:
a voltage sensing module configured to generate a reference voltage; and
an LED;
a driver, comprising:
a power converting module configured to receive and convert an alternating current (AC) into a driving current for driving
the LED to emit light;

a current processing module configured to convert the driving current into a sensing voltage;
a feedback module configured to compare the sensing voltage with a reference voltage and output a level signal according to
a magnitude relationship of the sensing voltage and the reference voltage; and

a controller module configured to output a pulse width modulation (PWM) signal to the power converting module according to
the level signal;

wherein the power converting module is further configured to control a magnitude of the driving current according to the PWM
signal; and

wherein the driver and the LED module are disposed separately, the LED module comprises a circuit board on which the voltage
sensing module and the LED are disposed, and the driver is disposed outside the circuit board.

US Pat. No. 9,967,938

SOLID STATE LIGHT SOURCE DEVICE AND DIMMING CIRCUIT THEREOF

Lextar Electronics Corpor...

1. A dimming circuit configured to dim a lighting module, comprising:a rectifier circuit configured to convert an AC voltage signal to a rectified voltage signal;
a switch unit electrically connected between the rectifier circuit and the lighting module and configured to undergo switching according to a pulse width modulation signal to connect or disconnect the rectifier circuit and the lighting module;
a control unit electrically connected to the switch unit and configured to generate the pulse width modulation signal to control the switch unit; and
a voltage detecting unit electrically connected to the rectifier circuit and the control unit, and configured to detect the rectified voltage signal outputted by the rectifier circuit and to output a detecting signal to the control unit when the rectified voltage signal is lower than a predetermined level;
wherein the control unit is configured to control the switch unit to disconnect when the control unit receives the detecting signal;
wherein the voltage detecting unit is a zero-voltage detecting unit configured to detect the rectified voltage signal and to output the detecting signal to the control unit when the rectified voltage signal is substantially zero.

US Pat. No. 9,640,520

PHOTOCOUPLER PACKAGE

Lextar Electronics Corpor...

1. A photocoupler package, comprising:
a light-emitting diode (LED) chip mounted on a first lead frame, electrically connected to the first lead frame;
a photodetector chip mounted on a second lead frame, electrically connected to the second lead frame;
a first insulating material disposed on the first lead frame, surrounding the LED chip;
a second insulating material disposed on the second lead frame, surrounding the photodetector, wherein an isolation capability
of the first insulating material and/or an isolation capability of the second insulating material is greater than or equal
to 5 kV/mil;

a third insulating material encapsulating the first insulating material and the LED chip, wherein the third insulating material
also encapsulates the second insulating material and the photodetector chip; and

a fourth insulating material encapsulating the LED chip and the photodetector chip, wherein the first insulating material
and/or the second insulating material is conformally disposed on a first surface of the fourth insulating material.

US Pat. No. 9,659,914

LIGHT-EMITTING DIODE CHIP PACKAGE

Lextar Electronics Corpor...

1. A light-emitting diode chip package, comprising:
a substrate;
a light-emitting diode chip set (LED chip set) disposed over the substrate, wherein the LED chip set is formed by a plurality
of light-emitting diode chips (LED chips) in one piece, wherein the LED chip set comprises a semiconductor substrate and the
plurality of LED chips formed in the semiconductor substrate;

at least two electrodes disposed over the substrate and electrically connected to the LED chip set; and
a fluorescent sheet disposed over the LED chip set.

US Pat. No. 9,812,614

LIGHT-EMITTING DEVICE

Lextar Electronics Corpor...

1. A light-emitting device, comprising:
a substrate;
a reflective layer disposed on the substrate;
a patterned contact layer disposed on the reflective layer;
a light-emitting unit disposed on the patterned contact layer;
a first electrode disposed on an upper surface of the light-emitting unit; and
a second electrode directly disposed on a rear surface of the substrate, wherein a projection of the first electrode and a
projection of the patterned contact layer on the substrate are complementary to each other, wherein a part of the reflective
layer is disposed across the patterned contact layer and directly contacting the light-emitting unit.

US Pat. No. 9,728,682

LIGHT-EMITTING ELEMENT AND LIGHT-EMITTING DEVICE CONTAINING THE SAME

Lextar Electronics Corpor...

1. A light-emitting element, comprising:
a light-emitting unit sequentially comprising a first-type semiconductor layer, a light-emitting layer and a second-type semiconductor
layer, wherein the light-emitting unit has an opening through the second-type semiconductor layer and the light-emitting layer
to expose a portion of the first-type semiconductor layer;

a current-conduction layer disposed on the second-type semiconductor layer;
a first electrode disposed on the current-conduction layer and exposing a portion thereof;
a distributed Bragg reflector disposed on the first electrode and covering the exposed portion of the current-conduction layer;
a second electrode disposed on the distributed Bragg reflector and filling the opening to electrically connect to the first-type
semiconductor layer; and

a barrier layer disposed on the distributed Bragg reflector and through the distributed Bragg reflector to connect to the
first electrode.

US Pat. No. 10,062,729

LIGHT-EMITTING DIODE CHIP

LEXTAR ELECTRONICS CORPOR...

1. A light-emitting diode (LED) chip, comprising:a substrate;
a light-emitting component disposed on the substrate and comprising a first semiconductor layer, a first quantum well layer, and a second semiconductor layer, wherein the first semiconductor layer is disposed between the substrate and the second semiconductor layer, and the first quantum well layer is disposed between the first and second semiconductor layers;
an electrical static discharge (ESD) protection component disposed on the substrate, wherein at least one gap exists between the light-emitting component and the ESD protection component, the ESD protection component comprises a third semiconductor layer, a second quantum well layer, and a fourth semiconductor layer, wherein the third semiconductor layer is disposed between the substrate and the fourth semiconductor layer, and the second quantum well layer is disposed between the third semiconductor layer and the fourth semiconductor layer, wherein each of the first semiconductor layer and the third semiconductor layer has a first type dopant, and each of the second semiconductor layer and the fourth semiconductor layer has a second type dopant; and
a conductive layer, wherein the first semiconductor layer and the fourth semiconductor layer are electrically connected with each other through the conductive layer, and the second semiconductor layer and the third semiconductor layer are electrically isolated from each other before packaging the LED chip.

US Pat. No. 9,812,432

LED CHIP PACKAGE

Lextar Electronics Corpor...

1. An LED chip package, comprising:
a first substrate having a metal terminal; and
an LED chip set formed by a wafer level chip scale packaging, wherein the LED chip set comprises a second substrate having
a plurality of electrically connected LED chips formed in one piece thereon and singulated so as to produce a plurality of
light-emitting areas separate from each other, and the LED chip set is disposed on the first substrate and electrically connected
to the metal terminal.

US Pat. No. 9,867,241

DIMMING MODULE AND SOLID STATE LIGHTING DEVICE

Lextar Electronics Corpor...

1. A dimming module, comprising:
a rectifying circuit, configured to convert an ac voltage to a rectified voltage;
a first driving circuit, configured to receive the rectified voltage to provide a first current to drive a first lighting
module, wherein the first driving circuit comprises a first switch, and the first switch is configured to be on or off according
to a first control voltage signal selectively to control the first current; and

a processing circuit, configured to receive a dimming command and adjust the first control voltage signal according to the
dimming command, wherein the first control voltage signal is configured to control a phase delay angle of the first current
and a duty cycle of the first current;

wherein the processing circuit comprises:
a zero-crossing detecting unit, electrically coupled to the rectifying circuit and configured to detect a zero crossing point
of the rectified voltage, such that the first control voltage signal output by the processing circuit is synchronized with
the rectified voltage.

US Pat. No. 9,732,940

LIGHTING APPARATUS AND WAVELENGTH CONVERTING APPARATUS THEREOF

LEXTAR ELECTRONICS CORPOR...

1. A lighting apparatus, comprising:
a light emitting diode element for emitting a first light with a wavelength ?1 along a lighting path;
a wavelength converting apparatus disposed on the lighting path, wherein the wavelength converting apparatus comprises a hollow
tube and a wavelength converting material, the hollow tube has an accommodating chamber, and the wavelength converting material
is positioned in the accommodating chamber, wherein a portion of the first light is converted to be a second light with a
wavelength ?2 after the portion of the first light goes through the wavelength converting material in the wavelength converting
apparatus, wherein the first light and the second light are mixed to be a third light with a wavelength range covering the
wavelength ?1 and the wavelength ?2; and

a light diffusing plate, wherein the wavelength converting apparatus is positioned between the light diffusing plate and the
light emitting diode element.

US Pat. No. 9,673,353

EPITAXIAL STRUCTURE AND EPITAXIAL GROWTH METHOD FOR FORMING EPITAXIAL LAYER WITH CAVITIES

Lextar Electronics Corpor...

1. An epitaxial structure, comprises:
a substrate having a surface;
a first epitaxial layer disposed over the substrate, wherein the first epitaxial layer includes a plurality of cavities that
exposes the surface; and

a second epitaxial layer disposed on the first epitaxial layer, wherein the second epitaxial layer has a plurality of concave
portions, and each of the cavities and each of the concave portions are aligned to define an air void in a shape of trapezoid
with the surface.

US Pat. No. 9,831,404

LIGHT EMITTING DIODE PACKAGE

LEXTAR ELECTRONICS CORPOR...

1. A light emitting diode package, comprising:
a light element;
a packaging cup for accommodating the light element, the packaging cup having an opening;
a light transferring layer disposed on the packaging cup and sealing the opening to define a closed space therebetween, the
light transferring layer having a light outlet face, a light inlet side opposite to the light outlet face and a peripheral
side, and the light inlet face facing to the light element;

a packaging layer enclosing the light transferring layer, the packaging layer covering the light outlet face, the light inlet
face and the peripheral side of the light transferring layer;

a white wall disposed on the packaging cup and surrounding the packaging layer corresponding to the peripheral side of the
light transferring layer, the white wall having a thickness the same as a combined thickness of the packaging layer and the
light transferring layer; and

a diffusion film disposed on the packaging layer and white wall.

US Pat. No. 9,867,248

DIMMING MODULE, SOLID STATE LIGHTING DEVICE, AND DIMMING METHOD

LEXTAR ELECTRONICS CORPOR...

1. A dimming module, comprising:
a rectifying circuit, configured to convert an input ac voltage to a rectified voltage signal;
a phase control circuit, configured to receive the rectified voltage signal and a dimming command, and output a control voltage
signal correspondingly, wherein the phase control circuit controls a phase delay angle of the control voltage signal according
to the dimming command;

a processing circuit, configured to receive the control voltage signal and adjust a first driving voltage signal according
to the phase delay angle; and

a first driving circuit, configured to receive the first driving voltage signal to drive a first lighting module;
wherein the phase control circuit outputs the non-full-phase control voltage signal with the phase delay angle to the processing
circuit in one or more cycles and then the phase control circuit outputs the full-wave rectified voltage with full waveform;
and

wherein when the dimming command corresponds to a first type of dimming instructions, the phase delay angle comprises a first
angle, and when the dimming command corresponds to a second type of dimming instructions different from the first type of
dimming instructions, the phase delay angle comprises a second angle different from the first angle.

US Pat. No. 9,818,915

LED DISPLAY AND MANUFACTURING METHOD THEREOF

LEXTAR ELECTRONICS CORPOR...

1. A LED display, comprising:
a first transparent substrate; and
a plurality of pixels formed on the first transparent substrate, wherein each of the pixels comprises:
a first sub-pixel, a second sub-pixel and a third sub-pixel respectively surrounded by a light-insulating structure;
a first wavelength transition layer formed in the first sub-pixel;
a second wavelength transition layer formed in the second sub-pixel;
a third wavelength transition layer formed in the third sub-pixel;
an adhesive layer disposed on the first, second and third wavelength transition layers; and
a first LED chip, a second LED chip and a third LED chip disposed on the adhesive layer in the first, second and third sub-pixels,
respectively;

wherein a length and a width of each of the first, second and third LED chips are less than or equal to 60 ?m, and a length
and a width of each of the pixels are less than or equal to 200 ?m.

US Pat. No. 9,903,553

LIGHT-GUIDING PILLAR AND VEHICLE LAMP USING THE SAME

Lextar Electronics Corpor...

1. A light-guiding pillar used in a vehicle lamp, comprising:
a major structure having a light incident surface, a light outgoing surface, and an upper surface and a bottom surface disposed
between the light incident surface and the light outgoing surface, wherein the upper surface and the bottom surface are opposite
to each other, and the major structure is configured to guide a portion of a light beam entering the major structure through
the light incident surface to the light outgoing surface; and

a light-guiding structure disposed on the upper surface, wherein a projection of the light-guiding structure on the upper
surface is smaller than the upper surface, and the light-guiding structure is configured to guide another portion of the light
beam entering the major structure through the light incident surface from the upper surface to the bottom surface with passing
through the bottom surface.

US Pat. No. 9,903,559

LIGHTING APPARATUS AND LENS STRUCTURE THEREOF

Lextar Electronics Corpor...

1. A lighting apparatus, comprising:
a circuit board;
a lighting element disposed on the circuit board, the lighting element comprising a lighting top surface and a lighting lateral
surface, the lighting lateral surface adjoined to the lighting top surface and the circuit board, the lighting top surface
having a center and an optical axis, the optical axis passing through the center; and

a lens structure covering the lighting element for receiving a light from the lighting element, the lens structure comprising
an outer surface, the outer surface comprising a total reflection portion and a light outgoing portion, the optical axis passing
through the total reflection portion, the light outgoing portion surrounding the total reflection portion, the total reflection
portion being configured to totally reflect a portion of light from the center, the light outgoing portion being configured
to allow another light from the center to leave away from the lens structure, wherein the total reflection portion of the
outer surface is rough,

wherein the light outgoing portion has a rough zone and a smooth zone, and the rough zone is adjoined between the smooth zone
and the total reflection portion, the center and a boundary between the rough zone and the smooth zone define an imaginary
connection line, the imaginary connection line and the optical axis define an included angle, the included angle is less than
36 degrees.

US Pat. No. 9,876,145

FLIP-CHIP LIGHT EMITTING DIODE CHIP

LEXTAR ELECTRONICS CORPOR...

1. A flip-chip light emitting diode chip, comprising:
a first semiconductor structure comprising:
a first P-type semiconductor layer, a first active layer, and a first N-type semiconductor layer, wherein the first active
layer is disposed between the first P-type semiconductor layer and the first N-type semiconductor layer;

a plurality of first openings penetrating through the first P-type semiconductor layer and the first active layer, and partially
penetrating the first N-type semiconductor layer, wherein a part of the first N-type semiconductor layer is exposed through
the first openings;

a first reflective layer disposed on the first P-type semiconductor layer;
a first barrier layer disposed on the first reflective layer, wherein an area of the first barrier layer is smaller than an
area of the first reflective layer, whereby the first reflective layer is exposed from the first barrier layer;

a passivation layer disposed on the first barrier layer and partially filling the first openings to cover exposed surfaces
of the first P-type semiconductor layer, the first active layer, the first N-type semiconductor layer, the first reflective
layer, and the first barrier layer, wherein the passivation layer is in contact with the exposed part of the first N-type
semiconductor layer; and

a first electrical contact layer disposed on the passivation layer and partially penetrating the passivation layer to be in
contact with the exposed part of the first N-type semiconductor layer.

US Pat. No. 9,773,944

LIGHT-EMITTING DIODE

Lextar Electronics Corpor...

1. A light-emitting diode, comprising:
a first type semiconductor layer;
a light-emitting layer positioned on the first type semiconductor layer;
a second type semiconductor layer positioned on the light-emitting layer;
a trapezoidal reflective layer positioned on part of the second type semiconductor layer, and exposing the other part of the
second type semiconductor layer without the trapezoidal reflective layer thereon, wherein an upper surface of the trapezoidal
reflective layer is smaller than a lower surface of the trapezoidal reflective layer;

a current blocking layer covering the reflective layer; and
a first current spreading layer covering the exposed second type semiconductor layer and the current blocking layer.

US Pat. No. 9,966,413

LIGHT-EMITTING DIODE MODULE AND LAMP USING THE SAME

Lextar Electronics Corpor...

1. A light-emitting diode (LED) module, comprising:a substrate; and
a plurality of light-emitting packages, each of the light-emitting packages including an optical wavelength conversion layer and a light-emitting diode (LED) having a first light-output surface, a bonding surface and a plurality of second light-output surfaces, wherein the bonding surface is opposite the first light-output surface and connected to the substrate by a flip-chip packaging, the second light-output surfaces are between and substantially perpendicular to the first light-output surface and the bonding surface, and the optical wavelength conversion layer is disposed on the LED and covers the first light-output surface and the second light-output surfaces thereof, wherein a distance between the bonding surface of the LED and a top surface of the optical wavelength conversion layer on the first light-output surface represents a light source thickness, and another distance between two adjacent light-emitting packages represents a spacing of light sources, wherein a ratio of the spacing of light sources to the light source thickness is between 1 and 6.3.

US Pat. No. 9,966,505

LIGHT EMITTING STRUCTURE, LIGHT DEVICE AND BACKLIGHT MODULE

Lextar Electronics Corpor...

1. A light device, comprising:a light bar, comprising:
a circuit board; and
at least one light emitting structure, disposed on and electrically connected to the circuit board, wherein the light emitting structure comprises:
a blue light source, having a light emitting surface, and
a fluorescent plastic material layer, covering the light emitting surface of the blue light source, wherein the fluorescent plastic material layer comprises a transparent plastic material and a first fluorescent material dispersed in the transparent plastic material, an excitation band of the first fluorescent material is a in blue wave band, and an emission band of the first fluorescent material is in a green wave band;
a fluorescent lampshade, covering the light bar, wherein the fluorescent lampshade comprises a lampshade body and a second fluorescent material dispersed in the lampshade body, an excitation band of the second fluorescent material is in the green wave band, and an emission band of the second fluorescent material is in a red wave band; and
a pair of conductive supporting members, electrically connected to the light emitting structure and the circuit board.

US Pat. No. 9,892,911

EPITAXIAL STRUCTURE WITH AIR VOIDS IN SHAPE OF TRAPEZOID

Lextar Electronics Corpor...

1. An epitaxial structure, comprises:
a substrate;
a buffer layer disposed on the substrate;
a first epitaxial layer disposed over the buffer layer, wherein the first epitaxial layer includes at least one cavity that
exposes a portion of the buffer layer; and

a second epitaxial layer disposed on the first epitaxial layer, wherein the second epitaxial layer has at least one concave
portion, and the cavity and the concave portion are aligned to define an air void in a shape of trapezoid on the buffer layer.

US Pat. No. 9,890,930

LIGHT SOURCE MODULE

LEXTAR ELECTRONICS CORPOR...

1. A light source module, comprising:
a substrate;
a first illumination element comprising a blue LED chip disposed on the substrate and a first wavelength converting layer
that covers the blue LED chip of the first illumination element, wherein blue light emitted from the blue LED chip of the
first illumination element is converted to light in the range of a first wavelength by the first wavelength converting layer;

a second illumination element comprising a blue LED chip disposed on the substrate and a second wavelength converting layer
that covers the blue LED chip of the second illumination element, wherein blue light emitted from the blue LED chip of the
second illumination element is converted to light in the range of a second wavelength by the second wavelength converting
layer;

a third illumination element comprising a blue LED chip; and
a plurality of separated optical absorptive layers, wherein the first illumination element, the second illumination element
and the third illumination element are separated by gaps, wherein the optical absorptive layers are placed in the gaps, and
wherein the height of the optical absorptive layers is not lower than the first wavelength converting layer, the second wavelength
converting layer and the blue LED chip of the third illumination element.

US Pat. No. 9,890,944

RECESSED LIGHT FIXTURE

Lextar Electronics Corpor...

1. A recessed light fixture, comprising:
a casing having an inner wall and an outer wall defining a space, wherein a first recess is disposed in the outer wall;
a front flange extending outwardly from the casing and surrounding the space, wherein the front flange has a top surface,
a bottom surface, and a second recess disposed on the top surface;

an intumescent material disposed in the first recess of the outer wall and/or disposed on the top surface of the front flange;
and

a barrier pad disposed in the second recess.

US Pat. No. 9,879,178

FLUORIDE PHOSPHOR, FABRICATING METHOD THEREOF, AND LIGHT-EMITTING APPARATUS AND BACKLIGHT MODULE EMPLOYING THE SAME

Lextar Electronics Corpor...

1. A method for fabricating a fluoride phosphor, comprising:
(a) providing a first solution, wherein the first solution is formed by dissolving potassium fluoride (KF) and either K2MnF6 or KMnO4 in a hydrofluoric acid solution;

(b) providing a second solution, wherein the second solution is formed by mixing a surfactant and a silane, and wherein the
surfactant comprises sodium dodecyl sulfate (SDS; NaC12H25SO4);

(c) mixing the first solution and the second solution to form a precipitate; and
(d) collecting the precipitate after step (c).

US Pat. No. 10,040,994

PHOSPHOR, FABRICATING METHOD THEREOF, AND LIGHT-EMITTING DEVICE AND BACKLIGHT MODULE EMPLOYING THE SAME

Lextar Electronics Corpor...

1. A phosphor represented by the following formula:K2[Ge1-xF6]:Mnx4+, wherein 0 wherein the phosphor has a hexagonal phase with a P63mc space group.

US Pat. No. 10,043,950

SEMICONDUCTOR LIGHT-EMITTING STRUCTURE WITH METAL LAYER AND DISTRIBUTED BRAGG REFLECTOR AND SEMICONDUCTOR PACKAGE STRUCTURE THEREOF

LEXTAR ELECTRONICS CORPOR...

1. A semiconductor light-emitting structure, comprising:a first-type semiconductor layer;
an active layer disposed on the first-type semiconductor layer;
a second-type semiconductor layer disposed on the active layer;
a metal layer disposed on the second-type semiconductor layer as a first reflective structure, wherein the metal layer has an opening portion;
a distributed Bragg reflector disposed on the metal layer and interposed into the opening portion as a second reflective structure;
a through hole penetrating the second-type semiconductor layer, the active layer and a part of the first-type semiconductor layer, wherein the distributed Bragg reflector covers a side wall of the through hole;
a contact layer disposed on the distributed Bragg reflector and extended to the through hole to be electrically connected with the first-type semiconductor layer, wherein the contact layer is electrically isolated from the metal layer via the distributed Bragg reflector;
a protection layer covering the contact layer and having a first recess and a second recess, wherein the first recess exposes the contact layer, and the second recess exposes the metal layer;
a first electrode disposed on the protection layer and extended to the first recess to be electrically connected with the contact layer; and
a second electrode disposed on the protection layer and extended to the second recess to be electrically connected with the metal layer;
wherein the first reflective structure and the second reflective structure together form a reflective surface on the second-type semiconductor layer.

US Pat. No. 10,023,794

FLUORIDE PHOSPHOR INCLUDING SHEET-LIKE CRYSTAL AND MANUFACTURING METHOD AND APPLICATION THEREOF

LEXTAR ELECTRONICS CORPOR...

1. A wavelength converting material, comprising a fluoride phosphor powderwith a Mn4+ as an activator, wherein the fluoride phosphor powder with the Mn4+ as the activator comprises a sheet-like crystal which has a chemical formula of A2[MF6]:Mn4+, wherein the A is Li, Na, K, Rb, Cs, NH4, or a combination thereof, and the M is Ge, Si, Sn, Ti, Zr, or a combination thereof, the sheet-like crystal has a thickness d, a crystal flat surface of the sheet-like crystal has a maximum length a, wherein the maximum length a is defined as a distance between two end points on an edge of the crystal flat surface and farthest from each other, and 8?a/d?35.

US Pat. No. 10,012,357

LIGHT EMITTING DIODE HEADLIGHT

LEXTAR ELECTRONICS CORPOR...

1. An LED headlight comprising:a lens comprising a focal length and a focal plane, wherein the focal plane extends from a focal point of the lens and is perpendicular to an optical axis of the lens;
a heat sink disposed along the optical axis of the lens, and a distance between the heat sink and the lens is greater than a distance between the focal point and the lens;
at least one LED module disposed along the optical axis of the lens and in contact with the heat sink, a distance between the LED module and the lens is greater than the distance between the focal point and the lens; and
a shelter disposed along the focal plane and configured to block part of light beams emitted from the LED module,
wherein the LED module has an light-emitting surface equipped with a maximum width, which satisfies:
0.0351FL?L?0.7279FL, wherein L represents the maximum width of the light-emitting surface, and FL represents the focal length of the lens,
wherein a virtual line is formed between a first intersection of an outermost emitted light of the LED module and the focal plane and a second intersection of an object principal plane and the optical axis of the lens, and an angle of intersection between the virtual line and the optical axis of the lens satisfies;
2FL tan ?=L+2d tan ?L
wherein ? represents half of the angle of intersection between the virtual line and the optical axis of the lens, ?L represents half of the viewing angle of the LED module, d represents a distance between the focal plane and the LED module,
wherein the distance (d) between the focal plane and the LED module satisfies:
(2FL tan ??L)/2 tan 65°?d?(2FL tan ??L)/2 tan 55°.

US Pat. No. 9,964,272

VEHICLE LAMP WITH COMPLEX LIGHTGUIDE

Lextar Electronics Corpor...

1. A vehicle lamp, comprising:a heat-dissipation base;
a light source disposed on the heat-dissipation base and configured to provide a light beam;
a light-guiding pillar disposed on the heat-dissipation base, and comprising:
a major structure having a light incident surface, a light outgoing surface, and an upper surface and a bottom surface disposed between the light incident surface and the light outgoing surface, wherein the upper surface and the bottom surface are opposite to each other, the light incident surface is configured to receive the light beam provided by the light source, and the major structure is configured to guide a portion of the light beam entering the major structure through the light incident surface to the light outgoing surface; and
a light-guiding structure disposed on the upper surface and configured to guide another portion of the light beam entering the major structure through the light incident surface from the upper surface to the bottom surface with passing through the bottom surface; and
a condenser lens configured to receive the light beam provided by the light outgoing surface and the bottom surface.

US Pat. No. 9,964,274

LIGHT EMITTING DIODE VEHICLE HEADLIGHT

LEXTAR ELECTRONICS CORPOR...

1. A light-emitting diode vehicle headlight comprising:a lens having a focal plane and an optical axis;
a reflector disposed at a side of the lens and below the optical axis of the lens, the reflector having a first focal point and a second focal point, wherein the second focal point is located on the focal plane;
a first light source having a first light-emitting surface confronting the lens;
a second light source having a second light-emitting surface confronting the reflector, the first focal point is located on the second light-emitting surface, and the reflector is configured to reflect and focus light beams emitted from the second light-emitting surface onto the second focal point, wherein the optical axis of the lens is placed in between the first light source and the second light source; and
a controller configured to:
turn on both the first light source and the second light source in a driving beam mode; and
turn on the first light source and turn off the second light source in a passing beam mode.

US Pat. No. 10,020,430

PHOSPHOR WITH PREFERRED ORIENTATION, FABRICATING METHOD THEREOF, AND LIGHT-EMITTING ELEMENT PACKAGE STRUCTURE EMPLOYING THE SAME

LEXTAR ELECTRONICS CORPOR...

1. A phosphor with a preferred orientation represented by the following formula:A2[MF6]:Mn4+,
wherein A is selected from a group consisting of Li, Na, K, Rb, Cs, and NH4, M is selected from a group consisting of Ge, Si, Sn, Ti, and Zr, wherein an intensity measured by an X-ray powder diffractometer of (001) oriented crystal surfaces is greater than that of (011) oriented crystal surfaces in the preferred orientation of the phosphor.

US Pat. No. 10,172,205

DIMMING MODULE, DIMMING METHOD AND LIGHTING DEVICE

LEXTAR ELECTRONICS CORPOR...

1. A dimming module, comprising:a triggering circuit configured to control a trigger delay angle of an ac input voltage according to a dimming command, so as to output a first voltage signal correspondingly;
a control signal generating circuit configured to output a control voltage according to the first voltage signal;
a voltage converting circuit configured to output a dc operating voltage having an operating level according to the first voltage signal, and output the dc operating voltage to a lighting module, wherein the lighting module comprises a light-emitting diode;
a linear driving circuit, configured to drive the lighting module according to the control voltage; and
a rectifying circuit configured to rectify the first voltage signal, so as to output a second voltage signal;
wherein the control signal generating circuit is configured to receive the second voltage signal and output the control voltage according to the second voltage signal, and the control signal generating circuit comprises:
a first resistor, wherein a first terminal of the first resistor is configured to receive the second voltage signal;
a second resistor, wherein a first terminal of the second resistor is electrically coupled to a second terminal of the first resistor and a second terminal of the second resistor is electrically coupled to a around terminal; and
a first capacitor, wherein a first terminal of the first capacitor is electrically coupled to the first terminal of the second resistor, and a second terminal of the first capacitor is electrically coupled to the second terminal of the second resistor.

US Pat. No. 10,141,476

LIGHT EMITTING DIODE CHIP SCALE PACKAGING STRUCTURE

LEXTAR ELECTRONICS CORPOR...

1. A light emitting diode chip scale packaging structure, comprising:a light emitting unit comprising a light emitting diode chip; and
a lens covering the light emitting diode chip, wherein a curve of an outer surface of the lens in a cross-section view substantially complies with a polynomial of:
z=?0.0005y6?0.0059y5+0.0871y4?0.3718y3+0.5658y2?0.0709y+2.5046,
z is a variable of vertical axis of the curve, y is a variable of horizontal axis of the curve, a center point of the curve corresponding to the light emitting diode chip is a coordinate where y is 0 and z is 2.5046, wherein a correlation coefficient calculated from fitting the curve to the polynomial is larger than or equal to 0.995, the outer surface has a concave structure, the center point of the curve is the lowest point of the concave structure, the lens is in contact with the light emitting unit, and no air gap is between the lens and the light emitting unit.

US Pat. No. 10,211,598

SIDE-VIEW LIGHT EMITTING LASER ELEMENT

LEXTAR ELECTRONICS CORPOR...

1. A side-view light emitting laser element, comprising:a support substrate;
a first electrode layer disposed on the support substrate, wherein one surface of the first electrode layer opposite to the support substrate is partially formed with a first extending portion, the first extending portion has a first light reflection surface which is disposed on one surface of the first extending portion opposite to the support substrate;
a second electrode layer disposed on the first electrode layer;
a light emitting multilayer unit sandwiched between the first electrode layer and the second electrode layer, and the second electrode layer fully covering the light emitting multilayer unit, the light emitting multilayer unit comprising a first semiconductor layer, a second semiconductor layer and an activating layer sandwiched between the first semiconductor layer and the second semiconductor layer,
a first insulation layer disposed between the first electrode layer and the first semiconductor layer, and formed with a first interval space, wherein the first light reflection surface is received in the first interval space; and
a second insulation layer disposed between the second electrode layer and the second semiconductor layer, and formed with a second interval space,
wherein one surface of the second electrode layer facing towards the light emitting multilayer unit is partially formed with a second extending portion, the first extending portion and the second extending portion respectively extend towards the light emitting multilayer unit, the second extending portion has a second light reflection surface which is received in the second interval space, and disposed on one surface of the second extending portion facing towards the support substrate, and a first orthographic projection of the first light reflection surface to the support substrate is overlapped with a second orthographic projection of the second light reflection surface to the support substrate, and a resonant cavity is defined between the second light reflection surface and the first light reflection surface for confining light waves and repeatedly oscillating the light waves so as to convert and discharge laser lights from the resonant cavity outwardly, wherein a first refractive index of the first electrode layer and a second refractive index of the second electrode layer are between 1 and 0, respectively.

US Pat. No. 10,229,976

COMPOUND SEMICONDUCTOR FILM STRUCTURE

LEXTAR ELECTRONICS CORPOR...

1. A compound semiconductor film structure, comprising:a substrate having a top surface without patterned holes or protrusions;
a first compound semiconductor epitaxial layer formed on the top surface, wherein an epitaxial interface is disposed one side of the first compound semiconductor epitaxial layer opposite to one side of the first compound semiconductor epitaxial layer facing the top surface, and at least one recess is formed in the first compound semiconductor epitaxial layer; and
a second compound semiconductor epitaxial layer formed on the epitaxial interface to cover the at least one recess but not completely fill up the at least one recess;
wherein the top surface and a bottom of the recess are separated by a distance substantially ranging between 0.8 and 1.3 micrometers (?m).

US Pat. No. 10,146,001

LIGHTING SYSTEM

LEXTAR ELECTRONICS CORPOR...

1. A lighting system, comprising:an LED light source;
a convex lens; and
a light guide post disposed between the LED light source and the convex lens, the light guide post comprising:
a light emitting portion having a light guide post-light emitting surface facing the convex lens; and
a light collecting portion connected to the light emitting portion, wherein the light collecting portion has an internal reflective surface, the internal reflective surface comprises at least an elliptical surface having a first focal point and a second focal point, the second focal point is located between the first focal point and the convex lens, and the second focal point is located inside the light guide post; wherein the lighting system has an optical axis, the light emitting portion has a first maximum cross-sectional width along a direction perpendicular to the optical axis, the light collecting portion has a second maximum cross-sectional width along the direction perpendicular to the optical axis, the first maximum cross-sectional width is larger than the second maximum cross-sectional width, and the first maximum cross-sectional width is less than three times the second maximum cross-sectional width.

US Pat. No. 9,472,733

LED DISPLAY AND MANUFACTURING METHOD THEREOF

LEXTAR ELECTRONICS CORPOR...

1. A LED display, comprising:
a first transparent substrate;
a plurality of pixels formed on the first transparent substrate, wherein each of the pixels comprises:
a first sub-pixel, a second sub-pixel and a third sub-pixel respectively surrounded by a light-insulating structure;
a first wavelength transition layer formed in the first sub-pixel;
a second wavelength transition layer formed in the second sub-pixel;
a third wavelength transition layer formed in the third sub-pixel;
an adhesive layer disposed on the first, second and third wavelength transition layers; and
a first LED chip, a second LED chip and a third LED chip disposed on the adhesive layer in the first, second and third sub-pixels,
respectively;

a packaging material filled into the first sub-pixels, the second sub-pixels and the third sub-pixels of each of the pixels;
and

a second transparent substrate opposite and parallel to the first transparent substrate, wherein the second transparent substrate
is bonded to the first, second and third LED chips by the packaging material.

US Pat. No. 9,474,115

DIMMING CIRCUIT

LEXTAR ELECTRONICS CORPOR...

1. A dimming circuit, comprising:
a control voltage receiving module configured to output a reference voltage according to a control voltage; and
a driving module electrically connected to the control voltage receiving module, the driving module comprising:
a driving transistor configured to provide a driving current to drive a lighting module;
a first transistor configured to control the driving transistor with feedback according to the reference voltage; and
a feedback circuit electrically connected between the driving transistor and the first transistor, the feedback circuit being
configured to determine an operating state of the first transistor according to the driving current.