US Pat. No. 9,588,006

SYSTEMS AND METHODS FOR PRESSURE SENSOR CALIBRATION

InvenSense, Inc., San Jo...

1. A method for calibrating a pressure sensor associated with a mobile device comprising:
determining location information for the mobile device;
receiving reference pressure information from an external source based at least in part on the determined location information;
measuring pressure with the pressure sensor; and
calibrating the pressure sensor using the measured pressure and the reference pressure information; wherein the reference
pressure information and the measured pressure correspond to different time periods.

US Pat. No. 9,596,547

MEMS MICROPHONE WITH SPRING SUSPENDED BACKPLATE

INVENSENSE, INC., San Jo...

1. A MEMS microphone comprising:
a base;
a diaphragm supported by diaphragm springs;
a backplate having a static backplate, springs and trenches, the trenches configured to create an active sensing area located
radially inward from the trenches, the trenches effectively isolating the active sensing area from the static backplate and
the backplate springs, the backplate springs configured to support the backplate on the base;

a diaphragm having diaphragm springs,wherein the backplate springs are fabricated so that the backplate remains substantially unaffected upon receipt of an anticipated
incident audio signal of normal intensity, where a spring constant of the backplate springs is substantially greater than
a spring constant of the diaphragm springs or a collective spring constant of the backplate springs is greater than a collective
spring constant of the diaphragm springs.

US Pat. No. 9,661,433

ELECTRICAL TESTING AND FEEDTHROUGH CANCELLATION FOR AN ACOUSTIC SENSOR

INVENSENSE, INC., San Jo...

1. A method for testing an acoustic sensor, the method comprising:
using electro-mechanical features of the acoustic sensor to measure characteristics of the acoustic sensor to facilitate the
testing of the acoustic sensor; and

utilizing electrical feedthrough cancellation to cancel out a portion of an electrical signal that is an electrical feedthrough
signal, wherein the electrical signal facilitates the testing of the acoustic sensor.

US Pat. No. 9,136,165

METHODS FOR STICTION REDUCTION IN MEMS SENSORS

INVENSENSE, INC., San Jo...

1. A MEMS device comprising:
a MEMS actuator;
a substrate opposing the MEMS actuator; and
a bump stop formed on the substrate to limit motion of the MEMS actuator,
wherein the bump stop is formed from a dielectric material and covered with a first conductive layer, a conductive path formed
by the first conductive layer thereby substantially reducing electric charge collected on the bump stop.

US Pat. No. 9,438,300

SENSOR FUSION FOR ANTENNA TUNING

Invensense, Inc., San Jo...

1. A system, comprising:
a sensor management component that receives sensor information from a set of sensor components associated with a mobile device,
wherein the sensor information indicates at least one of a position or an orientation of the mobile device in relation to
a user of the mobile device, and wherein the sensor management component dynamically determines a proximity of the mobile
device to the user based at least in part on the sensor information; and

a tuner management component that determines a tuning setting for a set of antennas of the mobile device, based at least in
part on the proximity of the mobile device to the user, to facilitate tuning the set of antennas.

US Pat. No. 9,407,997

MICROPHONE PACKAGE WITH EMBEDDED ASIC

INVENSENSE, INC., San Jo...

1. A microphone carrier comprising:
laminate base having an aperture extending through the laminate base uninterrupted;
a microphone comprising:
a microphone substrate disposed on top of the laminate base and comprising a backside cavity;
a diaphragm suspended from the microphone substrate and spanning the backside cavity;
an integrated circuit chip (IC) comprising a first IC chip side and a second IC chip side, and an IC chip aperture disposed
between the first IC chip side and the second IC chip side, the IC chip being embedded in the laminate base, in its entirety,
and the IC chip aperture being aligned with the aperture extending through the laminate base uninterrupted so as to allow
audio signals to enter the aligned IC aperture and the aperture.

US Pat. No. 9,097,524

MEMS DEVICE WITH IMPROVED SPRING SYSTEM

INVENSENSE, INC., San Jo...

1. A gyroscope that detects angular velocity comprising:
a first structure including a first proof mass wherein the first proof mass oscillates in a driving direction, wherein a Coriolis
force acts on the first proof mass in a sensing direction that is orthogonal to the driving direction when the gyroscope is
rotated with an angular velocity about an input axis orthogonal to the driving and sensing directions;

a spring system compliant in a first direction of motion, coupled to the first structure, the spring system comprising a first
flexible element; a rigid element coupled to the first flexible element; and a second flexible element coupled to the rigid
element, wherein the first flexible element and the second flexible element, each has a longitudinal axis parallel to the
first direction of motion, wherein the first structure and spring system are disposed substantially in a plane; wherein when
a force is applied to the spring system, the first and second flexible elements deflect and the rigid element rotates; and

a transducer responsive to the Coriolis force acting on the first proof mass.

US Pat. No. 9,296,607

APPARATUS AND METHOD FOR REDUCED STRAIN ON MEMS DEVICES

INVENSENSE, INC., San Jo...

1. A device, comprising:
a substrate with a conductor disposed over the substrate; and
a MEMS device adhered to the substrate, through a second elastomer,
wherein the second elastomer has an uncured phase and a cured phase and the MEMS device is disposed over the first elastomer
after the second elastomer has switched from the uncured phase to the cured phase; and a first elastomer adheres the MEMS
device to the substrate, wherein a wire bond electrically connects the MEMS device to the conductor.

US Pat. No. 9,139,428

METHOD OF FABRICATION OF AL/GE BONDING IN A WAFER PACKAGING ENVIRONMENT AND A PRODUCT PRODUCED THEREFROM

INVENSENSE, INC., San Jo...

1. A MEMS device comprising:
a first substrate including a microelectromechanical systems (MEMS) feature and a patterned germanium layer; and
a second substrate, including a patterned aluminum layer, wherein the germanium of the patterned germanium layer of the first
substrate is in direct contact with and matched to the aluminum of the patterned aluminum layer of the second substrate to
form a contact area, wherein in the contact area the patterned aluminum layer is properly patterned to match patterned germanium
layer.

US Pat. No. 9,392,376

MICROPHONE ON PRINTED CIRCUIT BOARD (PCB)

INVENSENSE, INC., San Jo...

1. A MEMS device comprising:
a MEMS-CMOS module including a CMOS chip and a MEMS chip, wherein the MEMS chip includes a port exposed to the environment;
and

a printed circuit board (PCB) having an aperture, at least one of the MEMS and CMOS chips of the MEMS-CMOS module disposed
on the PCB and aperture or within the aperture of the PCB,

wherein at least one of the MEMS and CMOS chips of the MEMS-CMOS module being directly mounted on top of the PCB or within
the aperture of the PCB,

further wherein an intermediate layer is absent between the MEMS chip or the CMOS chip and the top of the PCB in the case
where the MEMS chip or the CMOS chip is directly mounted to the PCB.

US Pat. No. 9,338,538

MULTI-MICROPHONE SYSTEM

INVENSENSE, INC., San Jo...

1. An apparatus comprising:
a microphone die having a conductive backplate with a plurality of holes,
the microphone die also having an electrical interconnect coupled with the backplate to transmit electric signals,
the microphone die supporting a plurality of diaphragms, the backplate being spaced from the plurality of diaphragms to form
a corresponding number of variable capacitances with the plurality of diaphragms, each of the diaphragms being substantially
independently movably secured to the die, wherein the backplate spans the plurality of diaphragms, each diaphragm being movable
relative to the backplate, the backplate forming a separate microphone with each diaphragm; a plurality of springs configured
to support each of the diaphragms relative to the die, wherein each one of the plurality of springs extends between a support
structure of the die and one of the diaphragms, each diaphragm being spaced from the support structure.

US Pat. No. 9,071,214

AUDIO SIGNAL CONTROLLER

INVENSENSE, INC., San Jo...

1. A microphone device comprising a microphone transducer element, adapted to execute the steps of:
receiving an audio input signal from the microphone transducer element;
attenuating the audio input signal from the microphone transducer element;
generating a first and second digital audio signal from the audio input signal;
estimating a signal feature of the first digital audio signal or the second digital audio signal,
monitoring the first and second digital audio signals and detecting respective zero-crossings of the first and the second
digital audio signal,

detecting a simultaneous zero-crossing of the first and second digital audio signals,
comparing the estimated signal feature with a predetermined feature criterion, wherein the predetermined feature criterion
comprises a level of the first digital audio signal or a level of the second digital audio signal or a combination of levels
of the first and second digital audio signals,

switching from transmitting the first digital audio signal to transmitting the second digital audio signal to a controller
output, or vice versa, only at the simultaneous zero-crossing of the first and second digital audio signals based on the comparison
between the estimated signal feature and the predetermined feature criterion by:

initializing a peak tracking variable, MaxPeak, representing a maximum absolute value of the first or the second digital audio
signal between a pair of consecutive zero-crossings of the first or second digital audio signal, to an initial value;

comparing an absolute value of a current audio signal sample, ABS x(n), of the first digital audio signal or the second digital
audio signal with a current level estimate, Yp(n?1);

computing an updated level estimate, Yp(n), with a first time constant if the absolute value of the current audio signal sample
is larger than the current level estimate, Yp(n?1), or

computing the updated level estimate, Yp(n), with a second time constant if the absolute value of the current audio signal
sample is smaller than the current level estimate, Yp(n?1);

comparing the value of peak tracking variable, MaxPeak, with the updated level estimate, Yp(n);
wherein if the updated level estimate, Yp(n), is larger than the peak tracking variable, MaxPeak, updating the value of MaxPeak
to Yp(n), and

if the updated level estimate, Yp(n), is smaller than the peak tracking variable, MaxPeak, retaining a current value of MaxPeak;
detecting a zero-crossing of the first digital audio signal and the second digital audio signal, and comparing the value of
MaxPeak to a first predetermined threshold level when a zero-crossing is detected;

wherein if the value of MaxPeak is larger than the first predetermined threshold level: switching from transmitting the first
digital audio signal to transmitting the second digital audio signal to the controller output or continuing transmission of
the second digital audio signal to the controller output; and

if the value of MaxPeak is smaller than the first predetermined threshold level: switching from transmitting the second digital
audio signal to transmitting the first digital audio signal to the controller output or continuing transmission of the first
digital audio signal to the controller output.

US Pat. No. 9,634,567

SENSOR DATA ACQUISITION SYSTEM WITH INTEGRATED POWER MANAGEMENT

INVENSENSE, INC., San Jo...

1. An application specific integrated circuit, comprising:
a switching regulator that receives a power supply at a first voltage and outputs a power output at a second voltage different
than the first voltage;

an analog to digital converter that converts an analog electrical signal into a digital signal, wherein the analog to digital
converter receives the power output via the switching regulator; and

a timing circuit that controls a switching frequency of the switching regulator and a sampling frequency of the analog to
digital converter such that the switching frequency and sampling frequency are harmonically related.

US Pat. No. 9,414,165

ACOUSTIC SENSOR RESONANT PEAK REDUCTION

INVENSENSE, INC., San Jo...

1. A Micro-Electro-Mechanical Systems (MEMS) acoustic sensor comprising:
a MEMS transducer having a mechanical resonance and having a first frequency response with a gain peak at a resonant frequency
of the mechanical resonance; and

a peak reduction circuit with a second frequency response and coupled to the MEMS transducer, wherein the second frequency
response of the peak reduction circuit is operable to cause attenuation of the gain peak of the MEMS transducer, and wherein
the peak reduction circuit comprises a filter with at least one adjustable parameter operable to compensate for shifts in
the gain peak.

US Pat. No. 9,282,389

MICROELECTROMECHANICAL SYSTEMS DEVICE OPTIMIZED FOR FLIP-CHIP ASSEMBLY AND METHOD OF ATTACHING THE SAME

INVENSENSE, INC., San Jo...

10. An electroacoustic package, comprising:
a substrate;
a flexible acoustic seal; and
an electroacoustic transducer comprising an acoustic area, an acoustic seal area that surrounds the acoustic area and includes
the acoustic seal, and an electrical interconnect area that is located outside of the acoustic seal area and is attached to
at least one of the substrate or an application-specific integrated circuit (ASIC) using at least one bond pad.

US Pat. No. 9,258,634

MICROPHONE SYSTEM WITH OFFSET APERTURES

INVENSENSE, INC., San Jo...

1. A microphone system comprising:
a base;
a lid coupled to the base to form a package having an interior chamber, the package having an inlet aperture;
a member coupled with the base within the interior chamber, the member having a member aperture, the member including a circuit
die with a circuit die aperture; and

a microphone die connected to a substrate and having a diaphragm and coupled to the member within the interior chamber, the
member being between the base and the microphone die,

the member aperture and inlet aperture being laterally offset,
the member aperture, member, and base forming an acoustic path between the inlet aperture and the microphone die,
wherein acoustic signals enter the inlet aperture and travel laterally between the circuit die and the substrate and in direct,
lateral and simultaneous contact with the circuit die and the substrate, through an acoustic channel, the acoustic channel
formed laterally between the member aperture and the inlet aperture and positioned directly below the circuit die and further
wherein, the acoustic signals travel from the acoustic channel through the circuit die aperture in a direction toward the
diaphragm and contact the diaphragm.

US Pat. No. 9,207,099

METHOD AND SYSTEM FOR ESTIMATING OFFSET IN ENVIRONMENTS WITH LIMITED MEMORY SPACE

INVENSENSE, INC., San Jo...

1. A computer implemented method for correcting a measurement of at least one sensor by estimating an offset of the at least
one sensor, the method comprises:
calculating combinations of running sums of temperature that are received from a temperature sensor and an associated offset
that is derived from data received from the at least one sensor to compute one or more slopes for the at least one sensor,
wherein the one or more slopes indicates how the estimated offset of the at least one sensor changes with temperature; wherein
the calculating includes computing an average slope for a set of data from the at least one sensor that contains a fourth
order equation of the distance along a temperature axis for all combination of pairs of points by using running sums of various
powers of the data; and wherein the estimated offset is subtracted from the measurement of the at least one sensor to provide
a corrected measurement by the at least one sensor.

US Pat. No. 9,426,581

TOP PORT MICROELECTROMECHANICAL SYSTEMS MICROPHONE

INVENSENSE, INC., San Jo...

1. A device, comprising:
a substrate;
a micro-electro-mechanical system (MEMS) acoustic sensor mechanically attached to the substrate utilizing a plurality of anchors
comprising a die attach material that is external to the MEMS acoustic sensor, wherein spaces between the plurality of anchors
connect a first back volume corresponding to a bottom portion of the MEMS acoustic sensor with a second back volume to form
a combined back volume, and wherein the plurality of anchors are mechanically attached to the substrate and to opposite sides
of the MEMS acoustic sensor at a periphery of the MEMS acoustic sensor;

an acoustic seal placed on the MEMS acoustic sensor; and
an enclosure placed on the acoustic seal and secured to the substrate, wherein the acoustic seal isolates a first portion
of the enclosure corresponding to a front volume from a second portion of the enclosure corresponding to the combined back
volume, wherein the first portion of the enclosure comprises an opening adapted to receive acoustic waves into the front volume,
and wherein the front volume is acoustically coupled to a top portion of the MEMS acoustic sensor.

US Pat. No. 9,235,377

MULTIPLE, PER SENSOR CONFIGURABLE FIFOS IN A SINGLE STATIC RANDOM ACCESS MEMORY (SRAM) STRUCTURE

INVENSENSE, INC., San Jo...

1. A device comprising:
one or more sensors, each having a bandwidth associated therewith;
one or more processors;
a memory coupled to the one or more sensors and the one or more processors and having a first portion, a second portion, and
a third portion, the first, second, and third portions being contiguous, the third portion being a first-in-first-out (FIFO)
having one or more FIFO portions, the first portion allocated to store instructions for execution by a processor of the one
or more processors, the second portion allocated to store data generated by the processor, and the third portion allocated
to store data from the one or more sensors wherein the sizes of the first, second and third portions of the memory are based
on the bandwidth of the one or more sensors; and

control logic coupled to the memory and operable to dynamically allocate the first, second and third portions of the memory,
wherein each of one or more FIFO portions is allocated to each of the one or more sensors.

US Pat. No. 9,114,977

MEMS DEVICE AND PROCESS FOR RF AND LOW RESISTANCE APPLICATIONS

INVENSENSE, INC., San Jo...

1. A MEMS device comprising:
a MEMS substrate comprising:
a handle layer with a first surface and a second surface,
a device layer having a third surface and a fourth surface,
a first insulating layer disposed between the second surface of the handle layer and the third surface of the device layer,
wherein the second surface of the handle layer and the third surface of the device layer are bonded to the insulating layer,

a piezoelectric layer deposited on the fourth surface of the device layer;
a first metal conductive layer deposited on the piezoelectric layer; and
a bond layer deposited on the first metal conductive layer;
wherein the MEMS substrate is bonded to a CMOS substrate;
wherein the CMOS substrate comprises two or more metal layers and one or more insulation layers therebetween; the CMOS substrate
comprising at least one metal electrode, such that an electrical connection is formed between the first metal conductive layer
and an at least one metal electrode through the bond layer.

US Pat. No. 9,488,480

METHOD AND APPARATUS FOR IMPROVED NAVIGATION OF A MOVING PLATFORM

InvenSense, Inc., San Jo...

1. A method of producing a navigation solution for a moving platform, the method comprising:
providing a processor for processing and filtering absolute navigational information, sensor readings and substantially uninterrupted
speed information to produce the navigation solution,

utilizing the speed information to decouple motion of the platform from the sensor readings, and utilizing advanced models
of stochastic errors in the sensor readings for producing the navigation solution.

US Pat. No. 9,452,925

METHOD OF INCREASING MEMS ENCLOSURE PRESSURE USING OUTGASSING MATERIAL

InvenSense, Inc., Sunnyv...

1. A manufacturing method, comprising:
providing a first substrate having a first passivation layer disposed above a patterned top-level metal layer, and further
having a second passivation layer disposed over the first passivation layer, the second passivation layer having a top surface;

forming an opening in a first portion of the second passivation layer, the opening exposing a portion of a surface of the
first passivation layer;

patterning the second and first passivation layers to expose portions of the patterned top-level metal layer; and
bonding a second substrate and the first substrate to each other;
wherein the bonding occurs within a temperature range in which at least the exposed portion of the first passivation layer
undergoes outgassing.

US Pat. No. 9,227,842

METHOD FOR MEMS STRUCTURE WITH DUAL-LEVEL STRUCTURAL LAYER AND ACOUSTIC PORT

INVENSENSE, INC., San Jo...

1. A method for fabricating a MEMS device comprising:
forming a silicon-on-insulator (SOI) wafer, the SOI wafer comprising a handle layer, a device layer and oxide formed between
the handle layer and the device layer;

depositing an oxide layer on the SOI wafer and patterning the deposited oxide layer;
depositing polysilicon on the patterned oxide layer;
depositing a conductive layer on the polysilicon;
after depositing the conductive layer on top of the polysilicon, patterning and etching the polysilicon and the conductive
layer;

further etching the device layer;
removing the patterned oxide layer thereby forming a MEMS substrate;
bonding the MEMS substrate to the CMOS wafer, the CMOS wafer having at least one metal layer;
forming an electrical connection between the MEMS substrate and the at least one metal layer;
thinning the handle layer;
patterning the handle layer;
partially removing the oxide layer deposited between the handle layer and the device layer.

US Pat. No. 9,162,872

PRE-MOLDED MEMS DEVICE PACKAGE HAVING CONDUCTIVE COLUMN COUPLED TO LEADFRAME AND COVER

INVENSENSE, INC., San Jo...

1. A package for a MEMS device comprising:
a lead frame including a die-bonding area;
a mold body forming a cavity and an exterior surface, the mold body partially encapsulating the lead frame and having an interior
window area in the cavity to expose the die-bonding area;

a MEMS device mounted in the cavity;
a conductive cover, the conductive cover physically coupled to the mold body and completely covering the cavity so as to form
an enclosed chamber within the package; and

a conductive column, the conductive column comprising a hole within the mold body and an electrically conductive material
within the hole, the electrically conductive material electrically and physically coupled to the lead frame and to the conductive
cover.

US Pat. No. 9,098,098

CURVATURE-CORRECTED BANDGAP REFERENCE

INVENSENSE, INC., San Jo...

1. A curvature-corrected bandgap reference, comprising:
a Brokaw bandgap circuit; the Brokaw bandgap circuit including an output node providing a reference voltage;
the Brokaw bandgap circuit further comprising a first BJT device including a first base terminal coupled to the output node
and a first emitter terminal, wherein the first BJT device operates at a first current density that is substantially proportional
to absolute temperature;

a second BJT device including a second base terminal coupled to the output node and a second emitter terminal, wherein the
second BJT device operates at a second current density that is substantially independent of temperature;

a correction voltage proportional to a voltage difference of the first and second emitter terminals, wherein the correction
voltage substantially cancels a curvature of the reference voltage; and

a first circuit operable to force the second current density to be substantially proportional to the reference voltage; wherein
the Brokaw bandgap circuit further comprises a third BJT device operating at a third current density that is substantially
proportional to absolute temperature, the third current density being less than the first current density by a fixed ratio;
wherein the first circuit further includes a resistor coupled to the reference voltage; a current mirror coupled to the resistor
and to a collector of the second BJT device; and a base current compensation block coupled to the collector of the second
BJT device which diverts a current nominally equal to that contributed by base currents of the first second and third BJT
devices such that the second current density is nominally independent of the base currents of the first, second and third
BJT devices, wherein accuracy of curvature correction is thereby improved.

US Pat. No. 9,357,296

SWITCHABLE ATTENUATION CIRCUIT FOR MEMS MICROPHONE SYSTEMS

INVENSENSE, INC., San Jo...

1. A microphone system comprising:
a movable structure movable in response to an acoustic signal establishing a variable MEMS capacitance with respect to an
electrode, the movable structure and the electrode forming a MEMS microphone, the movement of the movable structure causing
a signal to be generated, the signal being carried on a conductive line;

a circuit configured to process the signal;
a capacitor coupling the conductive line to ground upon detection of the processed signal exceeding a criterion by the circuit;
and

a switch selectively operable to connect to the conductive line so as to attenuate the signal before the signal is processed
by the circuit,

wherein the capacitor has associated therewith a capacitance that in combination with the variable MEMS capacitance serves
as a signal divider causing the signal on the conductive line to be attenuated.

US Pat. No. 9,221,676

INTERNAL ELECTRICAL CONTACT FOR ENCLOSED MEMS DEVICES

INVENSENSE, INC., San Jo...

1. A MEMS device comprising:
a MEMS substrate, the MEMS substrate includes a first semiconductor layer, a second semiconductor layer and a dielectric layer
in between, the first semiconductor layer has a first and second surfaces, wherein the first surface is in contact with the
dielectric layer;

wherein MEMS structures are formed from the second semiconductor layer and
includes a plurality of first conductive pads;
a base substrate which includes a plurality of second conductive pads thereon; wherein the second conductive pads are connected
to the first conductive pads; and

a conductive connector formed through only the dielectric layer, the second semiconductor layer and the first surface of the
first semiconductor layer to provide electrical coupling between the first semiconductor layer and the second semiconductor
layer, whereby the base substrate is electrically connected to the second semiconductor layer and the first semiconductor
layer.

US Pat. No. 9,143,870

MICROPHONE SYSTEM WITH MECHANICALLY-COUPLED DIAPHRAGMS

INVENSENSE, INC., San Jo...

1. A microphone system for detecting an acoustic signal, the microphone system comprising:
a micromachined device comprising a backplate;
a primary diaphragm separated from the backplate by a variable primary gap, the primary diaphragm and the backplate forming
a variable primary capacitance across the primary gap, the primary capacitance varying in response to the acoustic signal
impinging on the primary diaphragm;

a reference electrode situated such as to avoid impingement of the acoustic signal;
a reference diaphragm separated from the reference electrode by a variable reference gap, the reference diaphragm forming
a variable reference capacitance with the reference electrode across the variable reference gap; and

a mechanical coupler coupling the primary diaphragm to the reference, diaphragm,
the mechanical coupler being configured to vary the reference gap inversely and proportionately to the primary gap, the mechanical
coupler also being configured to vary the reference capacitance inversely and proportionately to the primary capacitance.

US Pat. No. 9,046,937

HIGH FIDELITY REMOTE CONTROLLER DEVICE FOR DIGITAL LIVING ROOM

INVENSENSE, INC., San Jo...

1. A handheld remote control device, comprising:
at least one three axis gyroscope that senses a rotational movement of the handheld remote control device and provides a first
measurement output in response to an occurrence of a first input condition;

at least one three axis accelerometer that senses gravity and linear movement of the handheld remote control device and provides
a second measurement output in response to the occurrence of the first input condition; and

a processing unit that uses the first and second measurement outputs to generate information associated with cursor location;
wherein,

the at least one three axis accelerometer, the at least one three axis gyroscope and the processing unit are integrated in
a single integrated circuit chip; wherein the processing unit calculates a three dimensional orientation corresponding to
a hand motion with a high accuracy.

US Pat. No. 9,422,156

INTEGRATED CMOS AND MEMS SENSOR FABRICATION METHOD AND STRUCTURE

INVENSENSE, INC., San Jo...

1. A method comprising:
patterning a first top metal layer on a microelectromechanical system (MEMS) actuator layer and a second top metal layer on
a complementary metal-oxide semiconductor (CMOS) substrate to generate a patterned first top metal layer and a patterned second
top metal layer, wherein the MEMS actuator layer and the CMOS substrate have respective oxide layers on the MEMS actuator
layer and the CMOS substrate;

etching respective portions of the respective oxide layers on the MEMS actuator layer and the CMOS substrate;
bonding the patterned first top metal layer to the patterned second top metal layer;
etching the MEMS actuator layer to cause release of a movable structure; and
bonding the MEMS actuator layer to a MEMS handle substrate.

US Pat. No. 9,359,188

MEMS MICROPHONE WITH TENSIONED MEMBRANE

INVENSENSE, INC., San Jo...

1. A micro electro-mechanical system (MEMS) microphone configured to operate over a predetermined range of frequencies and
having a tensioned membrane preset at a tension amount selected to cause the MEMS microphone to operate at a predetermined
sensitivity level that is above a threshold sensitivity level,
wherein at least a portion of the tensioned membrane is sandwiched between a first conductive layer and a second conductive
layer configured to equalize stress of the tensioned membrane.

US Pat. No. 9,291,456

MICROMACHINED GYROSCOPE INCLUDING A GUIDED MASS SYSTEM

INVENSENSE, INC., San Jo...

1. A gyroscope comprising;
a substrate;
a guided mass system, the guided mass system comprising at least one proof-mass and at least one guiding arm; wherein the
proof-mass and the guiding arm are disposed in a plane parallel to the substrate; the at least one proof-mass being coupled
to the at least one guiding arm; the at least one guiding arm being coupled to the substrate through a coupling comprising
at least one flexible member; wherein the proof-mass vibrates in a first direction in the plane and the guiding arm rotates
in the plane;

wherein in response to angular velocity about a first input axis, an end of the guiding arm is able to rotate out of the plane
and the proof-mass is able to rotate out of the plane;

an actuator for rotating the guiding arm in the plane; and
a transducer for generating an output in response to the angular velocity of the at least one proof-mass.

US Pat. No. 9,174,123

HANDHELD COMPUTER SYSTEMS AND TECHNIQUES FOR CHARACTER AND COMMAND RECOGNITION RELATED TO HUMAN MOVEMENTS

INVENSENSE, INC., San Jo...

1. A handheld device, comprising:
inertial sensors comprising a gyroscope that generates gyroscope data representing a trajectory of a movement of the handheld
device and an accelerometer that generates accelerometer data representing a tilt of the handheld device relative to earth's
gravity; and

a processing component that:
determines the trajectory of the movement of the handheld device by combining the gyroscope data representing the trajectory
of the movement of the handheld device and the accelerometer data representing the tilt of the handheld device relative to
earth's gravity;

converts, via a training mode, a first portion of the data into a first set of values corresponding to a first plurality of
discrete features,

associates the first set of values with a character, stores the first set of values and information representing the character
in a training database,

converts, via a recognition mode, a second portion of the data into a second set of values corresponding to a second plurality
of discrete features, wherein a discrete feature of the first plurality of discrete features or the second plurality of discrete
features includes at least one of an angle of the trajectory, an inverse tangent of a change in a pitch associated with the
movement divided by a change in a yaw associated with the movement, a location of a crossing point associated with the character,
or a number of times in which the trajectory changes direction; and

in response to a determination that the second set of values matches the first set of values with respect to a defined condition,
displays the character.

US Pat. No. 9,173,024

NOISE MITIGATING MICROPHONE SYSTEM

INVENSENSE, INC., San Jo...

1. A microphone system comprising:
a package forming an interior chamber, the package also forming an inlet aperture for coupling the interior chamber with an
exterior environment outside of the interior chamber, the package includes,

a first microelectromechanical systems (MEMS) microphone within the interior chamber, the first MEMS microphone having a first
movable diaphragm and a first backplate, the first movable diaphragm and the first backplate forming a first variable capacitor,
the first MEMS microphone being in fluid communication with the inlet aperture, the first MEMS microphone configured to produce
a first signal in response to receipt of an incoming acoustic signal striking the first diaphragm;

a second MEMS microphone within the interior chamber, the second MEMS microphone having a second movable diaphragm and a second
backplate, the second movable diaphragm and the second backplate forming a second variable capacitor, the second MEMS microphone
being in fluid communication with the inlet aperture, the second MEMS microphone configured to produce a second signal in
response to receipt of the incoming acoustic signal striking the second diaphragm,

the first and second MEMS microphones being in a stacked relationship within the package,
the first and second diaphragms being positioned substantially the same distance from the inlet aperture,
wherein the interior chamber forms a back volume, both the first and second MEMS microphones being exposed to the back volume.

US Pat. No. 9,083,288

HIGH LEVEL CAPABLE AUDIO AMPLIFICATION CIRCUIT

INVENSENSE, INC., San Jo...

26. A method of amplifying audio signals comprising:
receiving an analogue audio input signal at an input terminal of an amplification circuit;
applying the analogue audio input signal to an input of a first preamplifier;
generating a first amplified output signal by the first preamplifier having a first signal amplification;
converting the first amplified output signal to a first digital audio signal;
substantially attenuating the analogue audio input signal with a predetermined amount;
applying the attenuated analogue audio signal to an input of a second preamplifier, the attenuating being performed in-between
the input terminal and the input of the second preamplifier; and

generating a second amplified audio signal by the second preamplifier having a second signal amplification, wherein the second
signal amplification is smaller than the first signal amplification and substantially attenuating the audio input signal to
the second preamplifier allows for processing of higher levels of the audio input signal without distortion,

wherein each of the first and second preamplifiers have an audio frequency amplification controlled by an impedance ratio
of two impedances,

wherein the amplification circuit is formed on a substrate.

US Pat. No. 9,380,211

IMAGE STABILIZATION USING LIGHT SENSORS

INVENSENSE, INC., San Jo...

1. An image stabilization system, comprising:
a first pair of light sensors placed along an axis relative to a first axis, each light sensor of the first pair of light
sensors configured to provide a signal indicative of intensity of light received by the light sensor;

a first directional light filter configured to selectively permit passage of incident light to each light sensor of the first
pair of light sensors based on an angle of the incident light with reference to the first axis; and

an image stabilization circuit configured to receive a pair of signals indicative of the intensity of light received from
the first pair of light sensors and generate a first signal indicative of a change in the angle of the incident light with
reference to the first axis, wherein the first signal indicative of a change in the angle of the incident light with reference
to the first axis is proportional to a quotient of a difference between the intensity of the pair of signals divided by a
sum of the intensity of the pair of signals.

US Pat. No. 9,299,671

INTEGRATED CMOS BACK CAVITY ACOUSTIC TRANSDUCER AND THE METHOD OF PRODUCING THE SAME

INVENSENSE, INC., San Jo...

1. A MEMS device comprising:
a MEMS substrate including a movable element;
a CMOS substrate having a cavity, the MEMS substrate disposed on top of the CMOS substrate, wherein the MEMS substrate includes
a handle wafer and at least one stud bump protrudes beyond a top surface of the handle wafer;

a cap layer disposed to cover the cavity, the cap layer being physically attached to the CMOS substrate; and
a back cavity connected to the CMOS substrate, the back cavity formed at least partially by the cavity in the CMOS substrate,
wherein the movable element is acoustically coupled to the back cavity.

US Pat. No. 9,296,606

MEMS DEVICE WITH A STRESS-ISOLATION STRUCTURE

INVENSENSE, INC., San Jo...

1. A MEMS device, comprising:
a free layer with a first portion and a second portion;
an underlying substrate, the free layer movably positioned relative to the underlying substrate,
wherein the first portion and the second portion of the free layer are coupled through at least one stress-isolation structure,
wherein a sense material is disposed over portions of the second portion,
wherein the second portion is divided into a plurality of paddles, with each paddle coupled to the first portion through at
least one stress-isolation structure; and

wherein at least one of the paddles has a plurality of strips of sense material disposed over the paddle and a gap between
a pair of adjacent strips define a non-material portion for the pair of adjacent strips.

US Pat. No. 9,086,730

SELECTABLE COMMUNICATION INTERFACE CONFIGURATIONS FOR MOTION SENSING DEVICE

INVENSENSE, INC., San Jo...

1. A module for a motion sensing device, the module comprising:
a device component including a motion processor and at least one first motion sensor, wherein the motion processor comprises
a microprocessor; wherein the motion processor processes a plurality of motion algorithms;

at least one second motion sensor connected to the device component; and
a host processor connected to the device component, where data from the at least one first motion sensor or data from the
at least second motion sensor is available to the host processor.

US Pat. No. 9,506,757

DUTY-CYCLED GYROSCOPE

INVENSENSE, INC., San Jo...

1. A gyroscope system comprising:
a MEMS gyroscope having a drive motion and producing an output signal proportional to a rate of rotation and to a velocity
of the drive motion;

a drive system for regulating the drive motion;
a sense system for receiving the output signal and producing a demodulated output signal;
a phase-locked loop (PLL) for receiving a reference clock (REFCLK) from the drive system and producing a system clock (CLK);
and

a controller operating on the system clock sets an operating state of the drive system and the sense system and also controls
a state of the PLL, wherein one or more system state variables are maintained in a substantially fixed state during a protect
mode thereby enabling rapid transitions between a low-power mode and a normal operating mode of the gyroscope system.

US Pat. No. 9,337,722

FAST POWER-UP BIAS VOLTAGE CIRCUIT

INVENSENSE, INC., San Jo...

1. A DC bias voltage circuit comprising:
a DC bias voltage generator adapted to supply a first DC voltage (Vpump);
a low-pass filter having an input operatively coupled to the first DC voltage to produce a second DC voltage at a low-pass
filter output, the low-pass filter having an adjustable switched capacitor resistor operable to set a cut-off frequency of
the low-pass filter, the cut-off frequency of the low-pass filter being adjusted in accordance with a first and a second state,
the first state being power-on and the second state being normal operation; and

a controller controlling a resistance of the adjustable switched capacitor resistor,
wherein during the first state, the low-pass filter output does not exceed the Vpump and during the second state, the low-pass
filter output is substantially the same as the Vpump.

US Pat. No. 9,451,359

PREAMPLIFIER FOR A MICROPHONE

INVENSENSE, INC., San Jo...

1. A system, comprising:
a microphone housing that comprises:
a microphone component contained in a cavity of the microphone housing; and
a preamplifier, contained in the cavity of the microphone housing, that comprises an input buffer configured to receive a
signal generated by the microphone component and to generate an output signal that comprises a direct current (DC) voltage
offset in comparison to the signal, wherein the preamplifier controls a degree of the DC voltage offset based on a control
signal.

US Pat. No. 9,395,183

MICROMACHINED GYROSCOPE INCLUDING A GUIDED MASS SYSTEM

INVENSENSE, INC., San Jo...

1. A gyroscope comprising;
a substrate;
a guided mass system, the guided mass system comprising at least one proof-mass and at least one guiding arm; wherein the
proof-mass and the guiding arm are disposed in a plane parallel to the substrate; the at least one proof-mass being coupled
to the at least one guiding arm; the at least one guiding arm being coupled to the substrate through a coupling comprising
at least one flexible member; wherein the proof-mass vibrates in a first direction in the plane and the guiding arm rotates
in the plane;

wherein in response to angular velocity about a first input axis, an end of the guiding arm is able to rotate out of the plane
and the proof-mass is able to rotate out of the plane;

an actuator for rotating the guiding arm in the plane; and
a transducer for generating an output in response to the angular velocity of the at least one proof-mass.

US Pat. No. 9,344,808

DIFFERENTIAL SENSING ACOUSTIC SENSOR

INVENSENSE, INC., San Jo...

1. A MEMS device comprising: a first plate with a first surface and a second surface; a second plate with a third surface
and a fourth surface, attached to the first plate;
a third plate with a fifth surface and a sixth surface embedded within one of the first plate or the second plate;
a suspension connecting a first substrate to one of the first plate or the second plate;
a linkage connecting the first plate and the second plate, where the first plate and second plate are displaced in the presence
of an acoustic pressure differential between the first and second surfaces;

wherein the first and second plate together comprise an acoustic plate and a perforated electrical plate coupled to the acoustic
plate;

wherein the first plate, the second plate, the third plate, the linkage and the suspension form a structure in the first substrate,
wherein the structure is bonded to a second substrate;

a first electrode formed on the third plate;
a second electrode formed on the second substrate;
a first gap formed between the second plate and the first electrode; and
a second gap formed between the second plate and the second electrode.

US Pat. No. 9,332,332

PACKAGED MICROPHONE WITH FRAME HAVING DIE MOUNTING CONCAVITY

INVENSENSE, INC., San Jo...

1. A packaged microphone comprising:
a molded cover including an inner cover surface;
a molded frame secured to the cover to form a lid structure, the frame having a frame surface with a concavity;
a microphone die secured within the concavity of the frame;
a substrate including an inner substrate surface and coupled with the lid structure and being electrically connected with
the microphone die, the substrate and lid structure forming a package having an interior volume containing the microphone
die within the concavity;

at least one of a bump and ball electrically connecting the substrate with the microphone die;
an aperture through the package; and
a seal proximate to the microphone die, the seal acoustically sealing the microphone and the aperture to form a front volume
and a back volume within the interior volume,

wherein the inner cover surface is generally parallel with the inner substrate surface, the frame surface being between the
inner cover surface and the inner substrate surface, the frame surface and inner cover surface forming at least a portion
of the back volume.

US Pat. No. 9,304,155

MODE-TUNING SENSE INTERFACE

INVENSENSE, INC., San Jo...

1. A MEMS capacitive sensing interface comprising:
a sense capacitor having a first terminal and a second terminal, the sense capacitor having associated therewith a first electrostatic
force;

a feedback capacitor having a third terminal and a fourth terminal, the feedback capacitor having associated therewith a second
electrostatic force, the second and the fourth terminals coupled mechanically and electrically to a movable common mass, a
net electrostatic force comprising the first and second electrostatic forces acting on the common mass, wherein in response
to a change in position of the movable common mass, the sense capacitor being operable to output a signal indicative of the
change in position and the feedback capacitor being responsive to the output signal; and

a capacitance measurement circuit operable to measure the sense capacitance and to couple the first terminal and the third
terminal, the capacitance measurement circuit, the sense capacitor, and the feedback capacitor defining a feedback loop operable
to substantially eliminate dependence of the net electrostatic force on a position of the movable common mass.

US Pat. No. 9,212,052

PACKAGED MICROPHONE WITH MULTIPLE MOUNTING ORIENTATIONS

INVENSENSE, INC., San Jo...

1. A packaged microphone comprising:
a base and a lid that at least in part form a package having an interior chamber and a plurality of exterior sides;
a flexible substrate having a first portion within the interior chamber and a second portion extending from the interior chamber;
and

a MEMS microphone die mounted to the first portion of the flexible substrate,
the second portion of the flexible substrate having at least two sets of pads, each set of pads being in electrical communication
with the microphone die, one set of pads being on a first exterior side of the package, the first exterior side being substantially
perpendicular to a second exterior side, and a second set of pads being on the second exterior side of the package.

US Pat. No. 9,215,519

REDUCED FOOTPRINT MICROPHONE SYSTEM WITH SPACER MEMBER HAVING THROUGH-HOLE

INVENSENSE, INC., San Jo...

1. A microphone system comprising:
a base;
a chip system coupled to the base, the chip system comprising a microphone chip and a circuit chip in a stacked relationship,
the circuit chip having a body, the circuit chip and microphone chip being configured to electrically communicate,
the microphone chip having a diaphragm configured to move, relative to the backplate, upon receipt of an incident audio signal,
the backplate having a plurality of backplate holes, the circuit chip having at least one through hole directly through the
circuit chip body forming at least a part of the audio channel to permit audio signals to contact the diaphragm therefore
audibly coupled with the diaphragm of the microphone;
a filtering material covering the through hole; and
a nonconductive epoxy film formed about the periphery of the at least one through hole of the circuit chip, securing the microphone
chip to the circuit chip and having a plurality of holes that effectively form another filter for and inside the audio channel,

the through hole having a top opening on one side of the circuit chip, the through hole having a bottom opening on the opposite
side of the circuit chip, the top opening and the bottom opening having substantially identical dimensions.

US Pat. No. 9,170,107

MICROMACHINED GYROSCOPE INCLUDING A GUIDED MASS SYSTEM

INVENSENSE, INC., San Jo...

1. A gyroscope comprising;
a substrate;
a guided mass system, the guided mass system comprising at least one first proof-mass, at least one second proof-mass, and
at least one guiding arm;

wherein the at least one first proof-mass, the at least one second proof-mass and the at least one guiding arm are disposed
in a plane parallel to the substrate;

wherein the at least one first proof mass is coupled to the at least one guiding arm through at least one first spring;
wherein the at least one second proof-mass is coupled to the at least one first proof-mass through at least one second spring;
wherein the at least one guiding arm is coupled to the substrate through at least one third spring;
wherein the at least one second proof-mass is coupled to the substrate through at least one fourth spring;
an actuator that causes the at least one first proof-mass to vibrate in a first direction and causes the at least one second
proof-mass and the at least one guiding arm to rotate in the plane; and

at least one transducer for sensing motion of a portion of the guided mass system out of the plane in response to angular
velocity about a first input axis that is in the plane.

US Pat. No. 9,173,015

MICROPHONE MODULE WITH SOUND PIPE

INVENSENSE, INC., San Jo...

1. A microphone module comprising:
a substrate having a first side, and a second side opposite the first side, the substrate having an aperture extending from
the first side to the second side to allow sound waves to pass through the substrate;

a lid directly contacting the first side, the first side and the lid defining a first interior volume;
a microphone mounted to the first side and within the first interior volume;
a housing coupled to the second side and covering the aperture, the housing having a top and at least one sidewall, the housing
and second side forming a second interior volume, the housing including an acoustic port, the acoustic port being disposed
through the top of the housing and configured to allow sound to enter the second interior volume;

a pipe extending from an outside surface of the housing, the pipe having an open end to receive sound waves and direct them
to an inside of the housing; and

at least one exterior interface pad on the second side and outside of the second interior volume, the at least one exterior
interface pad electrically coupled to the microphone.

US Pat. No. 9,079,760

INTEGRATED MICROPHONE PACKAGE

INVENSENSE, INC., San Jo...

1. An apparatus comprising:
a packaged microphone having a base and a lid that at least in part form an interior chamber containing a microphone die,
the base having a bottom surface and a base aperture extending through the bottom surface; a device housing having an internal
surface; a filter between the internal surface of the device housing and the bottom surface of the base; and a substrate having
a substrate opening, the filter extending through the substrate opening to contact both the internal surface of the device
housing and the bottom surface of the base wherein the substrate comprises a flexible substrate, the filter at least in part
structurally supporting the flexible substrate through the contact with the bottom surface of the base.

US Pat. No. 9,292,102

CONTROLLING AND ACCESSING CONTENT USING MOTION PROCESSING ON MOBILE DEVICES

INVENSENSE, INC., San Jo...

1. A handheld device comprising:
a first sub-module including a first sensor sensing rotational motion;
a second sub-module including a second sensor sensing linear acceleration;
an application processor, wherein the application processor implements different operating modes on the device;
a first bus coupling the first sub-module and the second sub-module, the bus enables direct communication of information between
the first and second sub-modules;

a motion processor for receiving data from the first and second sub-modules; and
a second bus coupling the motion processor to the application processor.

US Pat. No. 9,407,996

WIDE DYNAMIC RANGE MICROPHONE

INVENSENSE, INC., San Jo...

1. A method of operating a microphone system for processing an incident audio signal and generating a system output, the method
comprising:
generating a first un-delayed signal output by a first microphone, the first un-delayed signal having a first dynamic range,
wherein the first dynamic range has a first noise floor and a first top-end;

generating a second un-delayed signal output by a second microphone, the second un-delayed signal having a second dynamic
range, wherein the second dynamic range has a second noise floor and a second top-end, and wherein the first noise floor is
less than the second noise floor, the second top-end is greater than the first top end, and wherein the first dynamic range
overlaps the second dynamic range;

responsive to the first un-delayed signal, generating a first delayed signal, output by a first delay block and coupling the
first delayed signal onto the system output using a selector, the selector responsive to the first un-delayed signal and the
first delayed signal;

responsive to the second un-delayed signal, generating a second delayed signal, output by a second delay block and coupling
the second un-delayed signal and the second delayed signal to the selector;

comparing the first un-delayed signal to a first threshold;
as determined by the comparing step, using the selector, selecting to couple one of the first delayed signal and second delayed
signal to the system output; and

repeating the generating, comparing and selecting steps.

US Pat. No. 9,216,897

CAPACITIVE SENSING STRUCTURE WITH EMBEDDED ACOUSTIC CHANNELS

INVENSENSE, INC., San Jo...

1. A MEMS device comprising:
a dual membrane comprising a top membrane and a bottom membrane;
an electrode, wherein the bottom membrane is positioned between the top membrane and the electrode; and
an interconnecting structure defining a spacing between the top membrane and the bottom membrane, wherein the interconnecting
structure provides an electrical connection between the top and the bottom membranes.

US Pat. No. 9,439,002

INTEGRATED PACKAGE FORMING WIDE SENSE GAP MICRO ELECTRO-MECHANICAL SYSTEM MICROPHONE AND METHODOLOGIES FOR FABRICATING THE SAME

INVENSENSE, INC., San Jo...

1. A micro electro-mechanical system (MEMS) microphone, comprising:
a package substrate having a port disposed through the package substrate, wherein the port is configured to receive acoustic
waves;

a lid mounted to the package substrate and forming a package; and
a MEMS acoustic sensor disposed in the package and coupled to the package substrate, wherein the MEMS acoustic sensor is positioned
such that the acoustic waves receivable at the port are incident on the MEMS acoustic sensor, and wherein the MEMS acoustic
sensor comprises:

a back plate positioned over the port at a first location within the package; and
a diaphragm positioned at a second location within the package, wherein a distance between the first location and the second
location forms a defined sense gap, and wherein the MEMS microphone is designed to withstand a bias voltage between the diaphragm
and the back plate greater than 20 volts.

US Pat. No. 9,285,207

LINEAR CAPACITIVE DISPLACEMENT SENSOR

INVENSENSE, INC., San Jo...

1. A method for measuring displacement of a structure, comprising:
providing a first capacitance;
providing a second capacitance, wherein the first and second capacitances share a common terminal; wherein the second capacitance
is a rigid capacitance attached between the common terminal and the structure; and

determining a difference of the inverses of the value of the first and second capacitances when the structure is displaced;
wherein only the first capacitance varies in inverse relation to the displacement of the structure.

US Pat. No. 9,260,293

PRE-MOLDED MEMS DEVICE PACKAGE WITH CONDUCTIVE SHELL

INVENSENSE, INC., San Jo...

1. A MEMS lead frame package for mounting on a circuit board, the package comprising:
a lead frame comprising a bottom aperture, and a plurality of internal bond pads;
a mold body,
the mold body having an aperture surface on a first side of the mold body, and a connector surface on a second side of the
mold body, the second side being opposite the first side,

the mold body forming a cavity extending into the connector surface,
the mold body partially encapsulating the lead frame such that the plurality of internal bond pads are exposed in the cavity,
and a bottom aperture is exposed at the aperture surface;

a conductive shell having an acoustic aperture and a connection window, the conductive shell electrically coupled to the lead
frame and residing within the cavity such that the acoustic aperture aligns with the bottom aperture, and such that the connection
window aligns with the plurality of internal bond pads;

a MEMS device mounted to the conductive shell, and electrically coupled to the plurality of internal bond pads through a plurality
of wire bonds;

a cover physically coupled to the connector surface so as to completely cover the conductive shell, the cover and the conductive
shell forming a chamber within the mold body and surrounding the microphone;

a plurality of conductive bumps on the connector surface, each of the conductive bumps spaced apart from the cover, the conductive
bumps extending above the cover; and

a plurality of through mold vias, each of the plurality of through mold vias coupled to the lead frame and a corresponding
one of the conductive bumps.

US Pat. No. 9,342,154

INTERFACING APPLICATION PROGRAMS AND MOTION SENSORS OF A DEVICE

InvenSense, Inc., San Jo...

1. A motion processing unit comprising:
at least one gyroscope configured to sense angular velocity for a plurality of axes;
at least one accelerometer configured to sense acceleration for a plurality of axes;
a plurality of registers;
a motion processor configured to receive sensor data from the at least one gyroscope and the at least one accelerometer, read
the values of one or more of the plurality of registers to identify settings that set up one or more motion algorithms to
run in the background, and process the sensor data based on the one or more motion algorithms, wherein the settings indicate
to the motion processor which of the one or more motion algorithms should run, which of the sensor data should be processed
using the one or more motion algorithms, and which of the one or more motion algorithms provide information to one or more
of the plurality of registers.

US Pat. No. 9,078,069

MEMS MICROPHONE WITH SPRINGS AND INTERIOR SUPPORT

INVENSENSE, INC., San Jo...

1. A MEMS microphone comprising:
a backplate having a plurality of apertures;
a diaphragm spaced from the backplate and having an outer periphery, the diaphragm and backplate forming a variable capacitor;
a post disposed between the diaphragm and the backplate by physically extending from the diaphragm and permanently connecting
to the backplate, the post being near a general centroid of the diaphragm and positioned substantially equidistant between
two opposing edges of the diaphragm;

a first set of springs securing the post to the diaphragm; and
a second set of springs securing the outer periphery to a fixed area, the fixed area being unmovable relative to the backplate.

US Pat. No. 9,052,194

EXTENSION-MODE ANGULAR VELOCITY SENSOR

INVENSENSE, INC., San Jo...

1. An angular rate sensor comprising:
a base;
first, second, third and fourth substantially planar masses disposed substantially in a plane parallel to and above the base,
the four substantially planar masses configured to move in an extension mode;

wherein in the extension mode the four substantially planar masses move in the plane simultaneously away from or simultaneously
towards a point;

a first Z-axis capacitive sensor coupled to the first mass;
a second Z-axis capacitive sensor coupled to the second mass and configured to move independently of the first mass and the
first Z-axis capacitive sensor;

an X-axis capacitive sensor including an electrode formed on the base and a portion of at least one of the four substantially
planar masses;

a Y-axis capacitive sensor including an electrode formed on the base and a portion of at least one of the four substantially
planar masses; wherein,

the X-axis capacitive sensor, the Y-axis capacitive sensor, and the first and second Z-axis capacitive sensors are configured
to sense angular velocity of the angular rate sensor about three different input axes of the angular rate sensor.

US Pat. No. 9,511,994

ALUMINUM NITRIDE (ALN) DEVICES WITH INFRARED ABSORPTION STRUCTURAL LAYER

INVENSENSE, INC., San Jo...

1. A micro-electro-mechanical system device, comprising:
a first silicon substrate comprising:
a handle layer comprising a first surface and a second surface, the second surface comprises a cavity;
an insulating layer deposited over the second surface of the handle layer;
a device layer having a third surface bonded to the insulating layer and a fourth surface;
a piezoelectric layer deposited over the fourth surface of the device layer;
a metal conductivity layer disposed over the piezoelectric layer;
a bond layer disposed over a portion of the metal conductivity layer; and
a stand-off formed on the first silicon substrate;
wherein the first silicon substrate is bonded to a complementary metal-oxide-semiconductor (CMOS) substrate, comprising:
a metal electrode configured to form an electrical connection between the metal conductivity layer formed on the first silicon
substrate and the CMOS substrate.

US Pat. No. 9,226,052

MICROPHONE SYSTEM WITH NON-ORTHOGONALLY MOUNTED MICROPHONE DIE

INVENSENSE, INC., San Jo...

1. A microphone system comprising:
a base having a primary portion and a ramped portion, the ramped portion forming an obtuse angle “OB” with the primary portion
and having a channel;

a lid coupled with the base to form a package with an interior chamber, the package having a top, a bottom, and a plurality
of sides;

a microphone die positioned within the interior chamber, and being secured to the ramped portion;
at least one of the sides having a portion with a substantially planar surface forming an opening for receiving an acoustic
signal, the channel being acoustically coupled with the opening and guiding the acoustic signal therethrough, the acoustic
signal making contact with the microphone die orthogonally;

the microphone die being positioned at a non-orthogonal, non-zero angle with regard to the opening in the at least one side.

US Pat. No. 9,505,609

CMOS-MEMS INTEGRATED DEVICE WITH SELECTIVE BOND PAD PROTECTION

INVENSENSE, INC., San Jo...

1. A method for preparing a semiconductor wafer, the method comprising:
providing a passivation layer over a patterned top metal on the semiconductor wafer;
etching the passivation layer to open a bond pad in the semiconductor wafer using a first mask;
depositing a protection layer on the semiconductor wafer;
patterning the protection layer using a second mask;
further etching the passivation layer to open other electrodes in the semiconductor wafer using a third mask; and
etching an anti-reflection layer to open both the bond pad and the other electrodes.

US Pat. No. 9,428,379

MEMS ACOUSTIC SENSOR WITH INTEGRATED BACK CAVITY

INVENSENSE, INC., Sunnyv...

1. An acoustic sensing device comprising:
a structure with a first surface and a second surface attached to a first substrate;
wherein the structure is contained in an enclosure formed by the first substrate and a second substrate;
wherein the first substrate or the second substrate contains an opening to expose the structure to the environment; and
a variable capacitor, wherein a first electrode of the variable capacitor is formed by a conductive layer on the second substrate
and a second electrode of the variable capacitor is formed on the structure;

wherein the structure is displaced in the presence of an acoustic pressure differential between the first and second surfaces
of the structure.

US Pat. No. 9,368,550

APPLICATION SPECIFIC INTEGRATED CIRCUIT WITH INTEGRATED MAGNETIC SENSOR

Invensense, Inc., San Jo...

1. A device, comprising:
an integrated circuit substrate;
a magnetic sensor with at least one magnetic sensor element, the magnetic sensor element including a permanent magnet, the
magnetic sensor disposed over the integrated circuit substrate; and

a plurality of magnetic storage elements, each with at least one permanent magnet, the plurality of magnetic storage elements
disposed over the integrated circuit substrate,

wherein the magnetic sensor includes at least a pair of magnetic sensor elements, an orientation of the permanent magnet of
one of the magnetic sensor element is orthogonal to an orientation of the permanent magnet of the other one of the magnetic
sensor element;

wherein the permanent magnets of the magnetic sensor elements include at least a pair of ferromagnetic (FM) layer and antiferromagnetic
(AFM) layer, wherein a blocking temperature of the AFM layer of one of the magnetic sensor element is higher than a blocking
temperature of the AFM layer of the other one of the magnetic sensor element; and

wherein all of the permanent magnets having a plurality of alternating layers of FM layer and AFM layer, wherein each of the
FM layer and the AFM layer has a thickness between about 10 angstroms and about 1000 angstroms.

US Pat. No. 9,503,828

SOUND BASES NAVIGATION USING A PORTABLE COMMUNICATIONS DEVICE

INVENSENSE, INC., San Jo...

1. A portable communications device, comprising:
a speaker for generating a sound;
at least one microphone for receiving a reflection of the sound, wherein the reflection comprises an acoustic wave that has
been reflected from an object;

a timing component configured to determine a time of propagation of the acoustic wave from the speaker to the at least one
microphone;

a distance component configured to determine a determined distance of the object from the portable communications device based
on the time of propagation of the acoustic wave; and

a mapping component configured to:
receive distance information representing respective distances of the object from geographical locations of other portable
communication devices; and

create, based on the determined distance of the object from the portable communications device and the distance information
representing the respective distances of the object from the geographical locations of the other portable communication devices,
a map comprising the object.

US Pat. No. 9,219,963

DUAL SINGLE-CRYSTAL BACKPLATE MICROPHONE SYSTEM AND METHOD OF FABRICATING SAME

INVENSENSE, INC., San Jo...

1. A dual-backplate microphone comprising:
a first backplate layer comprising a first conductive, single-crystal backplate;
a second backplate layer comprising a second conductive, single-crystal backplate;
a conductive diaphragm movably sandwiched between and electrically isolated from the first and second backplates, wherein
the backplates and the conductive diaphragm form a stack such that the conductive diaphragm forms a first variable capacitor
with the first backplate and a second variable capacitor with the second backplate;

a first oxide layer physically and electrically separating the conductive diaphragm from the first backplate layer;
a second oxide layer physically and electrically separating the conductive diaphragm from the second backplate layer;
a first contact coupled to a first via, the first via configured to pass through the second backplate and electrically connect
to the diaphragm, the first via being insulated from the second backplate by the first oxide layer; and

a second contact coupled to a second via, the second via configured to pass through the second backplate and electrically
connect to the first backplate, the second via being insulated from the second backplate by the second oxide layer.

US Pat. No. 9,302,902

INTEGRATED HEATER ON MEMS CAP FOR WAFER SCALE PACKAGED MEMS SENSORS

INVENSENSE, INC., San Jo...

1. A system for controlling temperature of a MEMS sensor, the system comprising:
a silicon MEMS cap encapsulating the MEMS sensor; and
a heater integrated into the MEMS cap, wherein the integrated heater is activated to adjust the temperature of the MEMS sensor.

US Pat. No. 9,487,396

RELEASE CHEMICAL PROTECTION FOR INTEGRATED COMPLEMENTARY METAL-OXIDE-SEMICONDUCTOR (CMOS) AND MICRO-ELECTRO-MECHANICAL (MEMS) DEVICES

INVENSENSE, INC., San Jo...

1. A device, comprising:
an integrated circuit substrate comprising a passivation opening having a sidewall that exposes a portion of a dielectric
layer of the integrated circuit substrate;

a first barrier layer deposited on the sidewall that prohibits exposure of the dielectric layer to a release chemical employable
to release a micro-electro-mechanical (MEMS) device integrated with the integrated circuit substrate, wherein the first barrier
layer comprises a metal; and

a second barrier layer comprising an electrically insulating layer disposed directly over a part of the first barrier layer
that covers the portion of the dielectric layer that is exposed, wherein the second barrier layer is at least partially resistant
to the release chemical, and

wherein the first barrier layer is disposed between the second barrier layer and the dielectric layer.

US Pat. No. 9,544,673

MICROPHONE WITH BUILT-IN SPEAKER DRIVER

INVENSENSE, INC., San Jo...

1. A microphone package, comprising:
a microphone application-specific integrated circuit (ASIC), coupled to a microphone transducer, that generates a digital
audio output signal based on sensing an acoustical signal; and

a speaker driver that generates, based on a digital audio input signal, a drive signal employable to drive a speaker, wherein
a first frequency of a first charge pump utilized by the speaker driver is synchronized with a second frequency of a second
charge pump utilized by the microphone transducer.

US Pat. No. 9,459,274

ROUND-ROBIN SENSING DEVICE AND METHOD OF USE

INVENSENSE, INC., Sunnyv...

1. A round-robin sensing device comprising:
a MEMS device; wherein the MEMS device includes first and second sense electrodes;
a multiplexer coupled to the first and second sense electrodes;
at least one sense amplifier coupled to the multiplexer;
a demodulator coupled to the at least one sense amplifier;
an integrate and dump circuit coupled to the demodulator; and
an analog-to-digital converter (ADC) coupled to a de-multiplexer; wherein the multiplexer, the at least one sense amplifier
and the demodulator provide a continuous time sense path during amplification that is resettable and wherein the integrate
and dump circuit and the ADC provide a discrete time processing path when switching between the first and second sense electrodes.

US Pat. No. 9,078,068

MICROPHONE WITH ALIGNED APERTURES

INVENSENSE, INC., San Jo...

1. A MEMS microphone comprising:
a stationary support forming a backside cavity;
a backplate having a plurality of backplate apertures including a first set of backplate apertures and a second set of backplate
apertures, the first set of backplate apertures forming slots and the second set of backplate apertures forming round holes,
the first set of backplate apertures positioned generally at the outer perimeter of the backplate and the second set of backplate
apertures positioned generally toward the center of the backplate, the backplate being stationary relative to the stationary
support; and

a diaphragm having a plurality of apertures, each aperture forming a slot, the diaphragm forming a variable capacitor with
the backplate and having an off-center diaphragm aperture, at least one of the plurality of backplate apertures being aligned
with the off-center diaphragm aperture to form a straight, unobstructed vertical channel that extends through the backside
cavity.

US Pat. No. 9,510,106

MICROELECTROMECHANICAL SYSTEMS (MEMS) MICROPHONE HAVING TWO BACK CAVITIES SEPARATED BY A TUNING PORT

INVENSENSE, INC., San Jo...

10. A microphone, comprising:
a microelectromechanical systems (MEMS) microphone element comprising a diaphragm and a stationary electrode and associated
with a first back cavity, wherein the first back cavity comprises an enclosure having a tuning port situated between the MEMS
microphone element and a second back cavity, and wherein the tuning port comprises at least one opening in the enclosure and
is configured to restrict an airflow between the between the first back cavity and the second back cavity in response to an
acoustic impulse;

a microphone package enclosure comprising a microphone package substrate and a lid that houses the MEMS microphone element
and that forms the second back cavity, wherein the microphone package enclosure promotes direction of an acoustic pressure
through a port in the microphone package substrate that is adapted to direct the acoustic pressure to the MEMS microphone
element; and

an ASIC substrate communicatively coupled to the MEMS microphone element, wherein the MEMS microphone element is configured
to operate at a predetermined resonance frequency.

US Pat. No. 9,356,567

INTEGRATED AUDIO AMPLIFICATION CIRCUIT WITH MULTI-FUNCTIONAL EXTERNAL TERMINALS

INVENSENSE, INC., San Jo...

1. An integrated audio amplification circuit comprising:
an input terminal for receipt of an input signal from a transducer, a signal processor operatively coupled to the input terminal
for receipt and processing of the input signal to generate a processed digital audio signal in accordance with a programmable
configuration setting of the signal processor, a serial data transmission interface configured for receipt of the processed
digital audio signal and generation of a corresponding digital audio stream at an output terminal of the integrated audio
amplification circuit,

a controller configured to adjust one of the programmable configuration setting of the signal processor and a format of the
digital audio stream in accordance with first configuration data received through the serial data receipt interface; wherein
in a first state the controller is responsive to a logic state of the externally accessible configuration terminal to control
at least one of the format of the digital audio stream and the programmable configuration setting,

in a second state the controller is configured for receipt and reading of the first configuration data through the externally
accessible configuration terminal and serial data receipt interface,

wherein the controller is configured to select the first state for a predetermined time period in response to power-on of
the integrated audio amplification circuit and automatically switch to the second state after expiry of the predetermined
time period,

further wherein the controller is configured to read double-edge pulse density modulated configuration data through the serial
data receipt interface, a leading edge or a trailing edge of the double-edge pulse density modulated configuration data used
to encode the first configuration data for the integrated audio amplification circuit, and

an opposite edge of the dual-edge pulse density modulated configuration data used to encode second configuration data for
another integrated audio amplification circuit connectable to the output terminal for receipt of the digital audio stream.

US Pat. No. 9,340,409

MEMS CAVITY SUBSTRATE

InvenSense, Inc.

1. A micro-electro-mechanical system (MEMS) device comprising:
a substrate comprising a top side and a bottom side;
an integrated circuit (IC) die comprising a top side and a bottom side, where the bottom side of the IC die is coupled to
the top side of the substrate; and

a MEMS die coupled to the top side of the IC die,
wherein there is a cavity positioned between the IC die and the substrate.

US Pat. No. 9,338,559

MICROPHONE SYSTEM WITH A STOP MEMBER

INVENSENSE, INC., San Jo...

1. A microphone system comprising:
a package having an interior chamber and an inlet aperture for receiving an acoustic signal;
a single backplate microphone die having a single backplate and a diaphragm that together form a single plate variable capacitance,
the single backplate microphone die being positioned to form a front volume between the diaphragm and the inlet aperture within
the package interior, the single backplate microphone die being positioned to form a back volume defined in part by the diaphragm
within the interior chamber;

a stop member positioned in the back volume and generally over the moveable portion of the diaphragm, the diaphragm being
between the stop member and the backplate, wherein the diaphragm has a generally planar top surface, the stop member being
spaced a given distance from the top surface of the diaphragm to limit orthogonal movement of the diaphragm in a direction
that is generally normal to the top surface of the diaphragm, the maximum orthogonal movement being about the given distance,
the diaphragm and backplate being spaced a second distance apart, the given distance being different from the second distance.

US Pat. No. 9,540,228

MEMS-CMOS DEVICE THAT MINIMIZES OUTGASSING AND METHODS OF MANUFACTURE

INVENSENSE, INC., San Jo...

1. A MEMS device comprising:
a first substrate having at least one structure formed within the first substrate and comprising at least one first conductive
pad on the first substrate; and

a second substrate having a passivation layer, wherein the passivation layer comprises a plurality of layers, wherein a top
layer of the plurality of layers comprises an outgassing barrier layer, wherein at least one second conductive pad and at
least one electrode are coupled to the top layer, wherein the at least one first conductive pad is coupled to the at least
one second conductive pad, and wherein the first substrate comprises a MEMS substrate and the second substrate comprises a
CMOS substrate.

US Pat. No. 9,452,920

MICROELECTROMECHANICAL SYSTEM DEVICE WITH INTERNAL DIRECT ELECTRIC COUPLING

INVENSENSE, INC., San Jo...

1. A microelectromechanical system (MEMS) device comprising:
a MEMS substrate comprising:
a first semiconductor layer with a first portion and a second portion, a second semiconductor layer and a dielectric layer
between the first semiconductor layer and the second semiconductor layer, wherein MEMS structures are formed from the second
semiconductor layer, and wherein the MEMS structures comprise one or more first conductive pads;

a base substrate having one or more second conductive pads on the base substrate, wherein the one or more second conductive
pads are connected to the one or more first conductive pads; and

a conductive connector formed through the dielectric layer of the MEMS substrate to provide electrical coupling between the
first semiconductor layer and the second semiconductor layer, wherein the base substrate is electrically connected to the
second semiconductor layer and the first portion of the first semiconductor layer.

US Pat. No. 9,602,924

MICROPHONE WITH PROGRAMMABLE FREQUENCY RESPONSE

INVENSENSE, INC., San Jo...

1. A MEMS microphone system comprising:
a MEMS microphone element operable to generate a MEMS microphone element signal and responsive to a bias signal with a voltage
bias terminal, Vbias terminal;

a processing circuit responsive to the MEMS microphone element signal and operable to generate a MEMS microphone system output,
the MEMS microphone system output generally being an attenuated version of the MEMS microphone element signal;

a corrective signal generator responsive to one of either the MEMS microphone element signal or MEMS microphone element output
and operable to generate a corrective signal;

a charge pump operable to generate a charge pump output; and
a filter responsive to the corrective signal and a charge pump output and operable to generate the bias signal, the filter
having associated therewith a filter corner so as to substantially eliminate as much noise from a charge pump as possible,
the corrective signal generally being in an audio frequency range thereby driving a terminal of the filter, the corrective
signal essentially unattenuated or only marginally attenuated at the Vbias terminal, the corrective signal being essentially subtracted from the MEMS microphone element signal.

US Pat. No. 9,872,112

NOISE MITIGATING MICROPHONE SYSTEM

INVENSENSE, INC., San Jo...

1. A microphone package comprising:
a lid with side walls, each side wall having an inner surface, one of the side walls of the lid having a specially-shaped
contour to receive a complementary upwardly extending portion of a base, the upwardly extending portion of the base forming
a portion of an audio input port;

an interior chamber; and
the base and the lid forming the interior chamber,
wherein the audio input port enables ingress of audio signals into the interior chamber, the base having,
a circuit die,
a plurality of location protrusions, each positioned along an edge of the base to precisely guide and position the lid onto
the base.

US Pat. No. 9,809,448

SYSTEMS AND APPARATUS HAVING MEMS ACOUSTIC SENSORS AND OTHER MEMS SENSORS AND METHODS OF FABRICATION OF THE SAME

INVENSENSE, INC., San Jo...

1. A micro electro-mechanical system (MEMS) device, comprising:
a substrate having a first surface and a second surface, wherein the first surface is exposed to an environment outside the
MEMS device;

a MEMS microphone disposed at a first location on the second surface of the substrate and having a diaphragm positioned such
that acoustic waves received at the MEMS microphone are incident on the diaphragm;

an integrated circuit disposed at a second location on the second surface of the substrate, wherein the integrated circuit
is electrically coupled to the MEMS microphone; and

a MEMS measurement device disposed at a third location, wherein the first location and the second location are distinct locations
on the second surface of the substrate, wherein the MEMS microphone is located distinct from the integrated circuit on the
second surface of the substrate, and wherein the MEMS measurement device comprises a motion sensor.

US Pat. No. 9,761,557

CMOS-MEMS INTEGRATION BY SEQUENTIAL BONDING METHOD

INVENSENSE, INC., San Jo...

1. A method for bonding a first wafer and a second wafer, comprising:
depositing a bond pad on a metal on the first wafer, the first surface of the bond pad in contact with the metal, the first
wafer including an integrated circuit, and the second wafer including a MEMS device, wherein the bond pad comprises a germanium
bond pad and the metal comprises aluminum;

positioning the second wafer in direct contact with a second surface of the bond pad opposite the first surface; and
sequentially bonding the first wafer to the second wafer utilizing first and second temperatures, wherein the second wafer
is bonded to the bond pad at the first temperature and wherein the bond pad and the metal are bonded at the second temperature,
wherein the bond between the germanium bond pad and the aluminum comprises a eutectic bond, and wherein a high temperature
appealing of the second wafer is provided in a hydrogen environment before the second bonding step.

US Pat. No. 9,581,512

PRESSURE SENSOR WITH DEFORMABLE MEMBRANE AND METHOD OF MANUFACTURE

INVENSENSE, INC., Sunnyv...

1. A pressure sensor, comprising
a first substrate,
a cap attached to the first substrate wherein the cap includes a processing circuit, a cavity and a deformable membrane separating
the cavity and a port open to an outside of the pressure sensor, and

sensing means for sensing a deformation of the deformable membrane in response to pressure at the port, converting the sensed
deformation into a signal and supplying said signal to the processing circuit for processing by the processing circuit,

wherein the cap is attached to the first substrate such that the deformable membrane faces the first substrate and such that
a gap is provided between the deformable membrane and the first substrate which gap contributes to the port,

wherein the first substrate comprises a support portion the cap is attached to, a contact portion for electrically connecting
the pressure sensor to an external device, and one or more suspension elements for suspending the support portion from the
contact portion.

US Pat. No. 9,573,800

PRE-MOLDED MEMS DEVICE PACKAGE HAVING CONDUCTIVE COLUMN COUPLED TO LEADFRAME AND COVER

INVENSENSE, INC., San Jo...

1. A method of packaging comprising:
installing a MEMS device in a mold body;
adding conductive material to form a conductive column extending from a lead frame to an integrated circuit situated above
the MEMS device and below a conductive cover;

using the mold body, partially encapsulating the lead frame with an interior window area in a cavity to expose a die-bonding
area;

physically coupling the conductive cover to the mold body to form a package;
using the cavity, forming an enclosed chamber within the package; and
physically and electrically coupling the lead frame to the conductive cover.

US Pat. No. 9,802,815

METHOD FOR MEMS STRUCTURE WITH DUAL-LEVEL STRUCTURAL LAYER AND ACOUSTIC PORT

INVENSENSE, INC., San Jo...

1. A method for fabricating a MEMS device comprising:
forming a first silicon wafer with a first cavity;
after forming the forming the first silicon wafer, forming a first oxide layer lining the first cavity;
forming a second silicon wafer, the second silicon wafer comprising a handle wafer, a device wafer, and oxide disposed between
the second silicon wafer and the handle wafer;

bonding the first silicon wafer to the second silicon wafer;
depositing a second oxide layer on top of the second silicon wafer;
removing the handle wafer of the second silicon wafer leaving the second oxide layer on the second silicon wafer;
patterning the second oxide layer;
depositing a polysilicon layer on the patterned second oxide layer;
planarizing the polysilicon layer and stopping the planarizing at the second oxide layer;
removing the second oxide layer;
depositing and patterning a conductive layer; and
bonding the second silicon wafer with an electrical connection.

US Pat. No. 9,754,922

3D INTEGRATION USING AL—GE EUTECTIC BOND INTERCONNECT

InvenSense, Inc., San Jo...

1. An apparatus comprising:
a first CMOS wafer;
a second CMOS wafer including a depression within a surface of the second CMOS wafer, wherein the depression includes an aluminum
surface; and

a eutectic bond connecting the first CMOS wafer to the second CMOS wafer, wherein
the eutectic bond includes aluminum and germanium,
the eutectic bond has a melting point which is lower than the melting point of aluminum and the melting point of germanium,
and

the eutectic bond includes the aluminum surface.

US Pat. No. 9,513,346

MAGNETIC SENSORS WITH PERMANENT MAGNETS MAGNETIZED IN DIFFERENT DIRECTIONS

INVENSENSE, INC., San Jo...

1. A device, comprising:
a magnetic sensor including a plurality of sensing elements, a first permanent magnet and a second permanent magnet, wherein,
the first permanent magnet is deposited on a movable actuator and the second permanent magnet is deposited on another movable
actuator,

the first permanent magnet deposited with at least one alternating ferromagnetic (FM) layer and antiferromagnetic (AFM) layer
and the second permanent magnet deposited with at least one alternating FM layer and AFM layer; and

the first permanent magnet is magnetized in a first direction and the second permanent magnet is magnetized in a second direction
which is substantially orthogonal to the first direction, wherein the blocking temperature of the AFM layer of the first permanent
magnet is higher than the blocking temperature of the AFM layer of the second permanent magnet; and wherein,

a subset of the plurality of sensing elements including at least one electrode configured to move relative to the subset of
the plurality of sensing elements, based upon a movement of the first permanent magnet deposited on the movable actuator;
and

another subset of the plurality of sensing elements including at least another one electrode configured to move relative to
the another subset of the plurality of sensing elements, based upon a movement of the second permanent magnet deposited on
the another movable actuator.

US Pat. No. 9,731,963

METHOD OF INCREASING MEMS ENCLOSURE PRESSURE USING OUTGASSING MATERIAL

Invensense, Inc., Sunnyv...

1. A manufacturing method, comprising:
providing a first substrate having a first passivation layer disposed above a patterned top-level metal layer, and further
having a second passivation layer disposed over the first passivation layer, the second passivation layer having a top surface;

forming an opening in a first portion of the second passivation layer, the opening exposing a portion of a surface of the
first passivation layer;

forming a conformal layer of material over the top surface of the second passivation layer and over the exposed portion of
the first passivation layer;
removing a portion of the conformal layer of material;
patterning the second and first passivation layers to expose portions of the patterned top-level metal layer; and
bonding a second substrate and the first substrate to each other;
wherein the bonding occurs within a temperature range in which at least the exposed portion of the material undergoes outgassing.

US Pat. No. 9,809,451

CAPACITIVE SENSING STRUCTURE WITH EMBEDDED ACOUSTIC CHANNELS

INVENSENSE, INC., San Jo...

1. A method of manufacturing a micro-electro-mechanical system (MEMS) device comprising:
forming an electrode on top of a complementary metal-oxide-semiconductor (CMOS) wafer;
forming a moveable dual-plate membrane with top and bottom membranes on top of the electrode, the moveable dual plate membrane
forming a MEMS device wafer;

forming an interconnecting structure, wherein the moveable dual-plate membrane and the interconnecting structure create a
MEMS on the MEMS device wafer, the interconnecting structure being positioned between the top and bottom membranes and

bonding the CMOS wafer to the MEMS device wafer and causing electrical connection between the CMOS wafer and the MEMS device
wafer, the interconnecting structure electrically connecting the top and the bottom membranes.

US Pat. No. 9,778,928

COMPRESSED FIRMWARE UPDATE

Invensense, Inc., San Jo...

1. A method of providing a firmware update to a payment reader of a payment system, the method comprising:
requesting, from a merchant device running a point-of-sale application, a firmware manifest from the payment reader, the firmware
manifest indicating one or more firmware versions of the payment reader;

generating, at the payment reader, the firmware manifest based on the firmware versions of the payment reader;
transmitting, from the payment reader through the merchant device, the firmware manifest to a payment server;
comparing, at the payment server, the firmware versions of the firmware manifest with available firmware for the payment reader;
determining, at the payment server, whether the firmware update is required based on the comparison;
accessing, at the payment server, a plurality of firmware update blocks, wherein the plurality of firmware update blocks collectively
comprise the firmware update;

compressing, at the payment server, each of the plurality of firmware update blocks to generate a plurality of compressed
firmware update blocks;

generating, at the payment server, an offset table, wherein the offset table associates each of a plurality of compressed
offsets associated with the compressed firmware update to a corresponding decompressed offset associated with a decompressed
version of the firmware update;

transmitting, from the payment server to the merchant device, the offset table and the plurality of compressed firmware update
blocks;

storing, at the merchant device, the offset table and the plurality of compressed firmware update blocks;
transmitting, from the merchant device, a first portion of the plurality of compressed firmware update blocks to the payment
reader;

decompressing, at the payment reader, the first portion of the plurality of compressed firmware update blocks;
determining, at the payment reader, a partial firmware offset associated with the decompressed first portion;
transmitting, from the payment reader to the merchant device, the partial firmware offset;
determining, at the merchant device, a second portion of the plurality of compressed firmware update blocks to send to the
payment reader, based on the partial firmware offset and the offsets stored in the offset table;

transmitting, from the merchant device, the second portion of the plurality of compressed firmware update blocks to payment
reader;

decompressing, at the payment reader, the second portion of the plurality of compressed firmware update blocks;
determining, at the payment reader, that the entire firmware update has been received based at least on the decompressed first
and second portions; and

updating the firmware of the payment reader based on the received firmware update.

US Pat. No. 9,846,175

MEMS ROTATION SENSOR WITH INTEGRATED ELECTRONICS

INVENSENSE, INC., San Jo...

1. A rotational sensor comprising:
a sense substrate;
at least two proof masses, each of the at least two proof masses being anchored to the sense substrate via at least one flexure
and electrically isolated from each other, wherein the at least two proof masses are configured to rotate in-plane about a
Z-axis relative to the sense substrate, and wherein the Z-axis is normal to the sense substrate; and

a first set of two transducers, wherein each of the first set of two transducers is configured to sense rotation of the each
of at least two proof masses with respect to the sense substrate in response to a rotation of the rotational sensor.

US Pat. No. 9,840,409

TRANSLATING Z AXIS ACCELEROMETER

InvenSense, Inc., San Jo...

1. A MEMS sensor, comprising:
a substrate;
an anchor region coupled to the substrate, wherein the anchor region comprises all anchoring to the substrate;
a first support arm coupled to the anchor region;
a second support arm coupled to the anchor region;
a first guiding arm coupled to the first support arm, wherein the first guiding arm moves relative to the first support arm;
a second guiding arm coupled to the second support arm, wherein the second guiding arm moves relative to the second support
arm;

a first plurality of sensing elements to measure motion of the first guiding arm and the second guiding arm relative to the
substrate; and

a proof mass system coupled to the first guiding arm via a first spring of a first set of springs and coupled to the second
guiding arm via a second spring of the first set of springs, wherein the proof mass system is disposed outside the anchor
region, the first support arm, the second support arm, the first guiding arm, the second guiding arm, the first set of springs,
and the first plurality of sensing elements.

US Pat. No. 9,611,137

MEMS SENSOR INTEGRATED WITH A FLIP CHIP

INVENSENSE, INC., San Jo...

1. A device comprising:
a microelectromechanical system (MEMS) structure;
a complementary metal-oxide semiconductor (CMOS) structure coupled to the MEMS structure, wherein the CMOS structure comprises
a silicon substrate coupled to a CMOS interconnect that is in contact with the MEMS structure;

at least one flip chip coupled to the silicon substrate, wherein the silicon substrate is located between the at least one
flip chip and the CMOS interconnect;

at least one through-silicon via (TSV) in direct contact with the CMOS interconnect at a first end and with the at least one
flip chip at a second end to provide an electrical connection between the at least one flip chip and the interconnect; and

at least one layer on a substrate of the MEMS structure, wherein the at least one layer provides electrical connections from
the at least one flip chip to at least one of package pins, another flip chip or an external component, wherein the at least
one flip chip comprises a plurality of flip chips and the at least one layer provides electrical connections from at least
one of the plurality of flip chips to at least one pad of the MEMS structure.

US Pat. No. 9,860,649

INTEGRATED PACKAGE FORMING WIDE SENSE GAP MICRO ELECTRO-MECHANICAL SYSTEM MICROPHONE AND METHODOLOGIES FOR FABRICATING THE SAME

INVENSENSE, INC., San Jo...

1. A micro electro-mechanical system (MEMS) microphone having a resonant frequency limited to between 20 kilohertz and 40
kilohertz and having a sensitivity factor limited to between ?38 decibel (dB) volts per pascal and ?42 dB volts per pascal,
wherein the MEMS microphone is comprised of a package having a port for receiving acoustic waves and comprising:
a MEMS acoustic sensor comprising a diaphragm and a back plate substantially parallel to the diaphragm and positioned such
that the acoustic waves are incident on the back plate and the diaphragm, wherein the MEMS microphone is configured to withstand
a bias voltage between the diaphragm and the back plate of greater than or equal to 25 volts.

US Pat. No. 9,766,264

ANCHOR-TILT CANCELLING ACCELEROMETER

INVENSENSE, INC., San Jo...

1. An accelerometer, comprising:
a mechanical structure, comprising:
a substrate;
an anchor coupled to the substrate;
a first proof mass coupled to the anchor by a first flexible member wherein the first proof mass rotates in response to an
acceleration of the accelerometer about a first axis; and

a second proof mass coupled to the anchor by a second flexible member, wherein the second proof mass rotates in response to
the acceleration of the accelerometer about a second axis, wherein the first and second axes are co-linear;

a first transducer configured to measure a first distance between a first reference area and a first portion of the first
proof mass;

a second transducer configured to measure a second distance between a second reference area and a second portion of the first
proof mass;

a third transducer configured to measure a third distance between a third reference area and a first portion of the second
proof mass;

a fourth transducer configured to measure a fourth distance between a fourth reference area and a second portion of the second
proof mass; and

a signal processing circuit coupled to the first transducer, the second transducer the third transducer, and the fourth transducer,
the signal processing circuit configured to provide an output related to the acceleration,

wherein the first and second flexible members provide torsional compliance about the first axis.

US Pat. No. 9,621,975

SYSTEMS AND APPARATUS HAVING TOP PORT INTEGRATED BACK CAVITY MICRO ELECTRO-MECHANICAL SYSTEM MICROPHONES AND METHODS OF FABRICATION OF THE SAME

INVENSENSE, INC., San Jo...

1. A micro electro-mechanical system (MEMS) device, comprising:
a first substrate having a first surface and a second surface, and a port disposed through the first substrate, wherein the
port is configured to receive acoustic waves and wherein the first surface is exposed to an environment outside the MEMS device;

a diaphragm coupled to and facing the second surface and configured to deflect in response to pressure differential at the
diaphragm in response to the received acoustic waves;

a second substrate having a third surface and a fourth surface opposite the third surface, wherein third surface of the second
substrate is coupled to and facing the diaphragm, and the second substrate includes circuitry, and wherein the second substrate
includes a recess region forming an integrated back cavity in the MEMS device;

an electrode on the second substrate and configured to measure displacement of the diaphragm, wherein the electrode is in
a back cavity of the MEMS device.

US Pat. No. 9,863,769

MEMS SENSOR WITH DECOUPLED DRIVE SYSTEM

INVENSENSE, INC., San Jo...

1. An angular rate sensor comprising:
a substrate;
first and second shear masses coupled to the substrate, the first and second shear masses flexibly coupled to each other;
a rotating structure coupled to the substrate;
a drive mass coupled to the substrate;
a flexible element coupling the drive mass and the rotating structure;
an actuator coupled to the rotating structure via the drive mass for driving the rotating structure into rotational oscillation
around a first axis normal to the substrate, the actuator driving the drive mass moving in a direction parallel to the substrate
in a first direction and driving the first and second shear masses in anti-phase in a second direction, wherein the second
direction is not parallel to the first direction;

a first transducer responsive to the rotational oscillation of the rotating structure during a drive mode; and
a second transducer which is responsive to angular velocity of the angular rate sensor.

US Pat. No. 9,738,515

TRANSDUCER WITH ENLARGED BACK VOLUME

INVENSENSE, INC., San Jo...

1. A packaged microphone comprising: a substrate having a first side and a second side; a MEMS microphone mounted to the first
side of the substrate; a first lid coupled with the first side of the substrate to form a first cavity, the MEMS microphone
being positioned within the first cavity; a second lid coupled with second side of the substrate to form a second cavity an
opening in the second lid; a first opening in the substrate configured to receive audio signals; and a second opening in the
substrate, the first and second cavities being fluidly connected via the second opening, wherein the substrate extends outside
of the first and second cavities to form a tail having a plurality of electrical contacts that electrically connect with the
MEMS microphone.

US Pat. No. 10,072,956

SYSTEMS AND METHODS FOR DETECTING AND HANDLING A MAGNETIC ANOMALY

InvenSense, Inc., San Jo...

1. A method for detecting a magnetic disturbance affecting sensor data comprising:providing a portable device having a magnetometer;
obtaining magnetometer sensor data from the device;
performing a plurality of magnetic disturbance detection algorithms in parallel on the sensor data;
performing a disturbance handling routine for the sensor data when at least one magnetic disturbance detection algorithm indicates an anomaly; and
determining an orientation of the portable device based at least in part on the disturbance handling routine.

US Pat. No. 9,718,679

INTEGRATED HEATER FOR GETTERING OR OUTGASSING ACTIVATION

INVENSENSE, INC., San Jo...

1. A microelectromechanical systems (MEMS) structure comprising:
a first substrate with cavities, bonded to a second substrate, that forms a plurality of hermetically sealed enclosures of
at least two types comprising at least a first hermetically sealed enclosure and a second hermetically sealed enclosure, wherein
each of the plurality of hermetically sealed enclosures is defined by the first substrate, the second substrate, and a seal-ring
material,

wherein a first enclosure type of the first hermetically sealed enclosure or the second hermetically sealed enclosure further
includes a gettering element configured to decrease cavity pressure in the first enclosure type or an outgassing element configured
to increase cavity pressure in the first enclosure type, and

wherein the first enclosure type further includes at least one heater integrated into the second substrate adjacent to the
gettering element or the outgassing element configured to adjust the temperature of the gettering element or the outgassing
element and configured to adjust a gas composition by temperature specific selective absorption or desorption of the gettering
element or the outgassing element, respectively, in the first enclosure type of the first hermetically sealed enclosure or
the second hermetically sealed enclosure.

US Pat. No. 9,703,397

HIGH FIDELITY REMOTE CONTROLLER DEVICE FOR DIGITAL LIVING ROOM

InvenSense, Inc., San Jo...

1. A handheld remote control device, comprising:
at least one three axis gyroscope that senses a first three-dimensional movement of the handheld remote control device and
provides a first three-dimensional data output;

at least one three axis accelerometer that senses a second three-dimensional movement of the handheld remote control device
and provides a second three-dimensional data output; and

a processing unit that uses the first and second three-dimensional data outputs to generate information associated with one
of cursor displacement for a cursor and cursor location for the cursor;

wherein, the at least one three axis accelerometer, the at least one three axis gyroscope and the processing unit are integrated
in a single integrated circuit chip.

US Pat. No. 9,683,865

IN-USE AUTOMATIC CALIBRATION METHODOLOGY FOR SENSORS IN MOBILE DEVICES

InvenSense, Inc., San Jo...

1. A method of calibrating an accelerometer in a portable device comprising:
receiving data from the accelerometer;
providing accelerometer samples from the data based upon one or more selection rules that adaptively selects data that satisfy
certain criteria; wherein the selection rules includes a rule wherein a variation of the linear acceleration is below a threshold
to select a small set of accelerometer samples at a plurality of orientations;

fitting the small set of accelerometer samples to a mathematical model to facilitate learning a bias of the accelerometer;
and

providing the bias based upon a center of the mathematical model;wherein the bias is calculated automatically as a user uses the portable device.

US Pat. No. 9,673,768

MULTIPATH DIGITAL MICROPHONES

INVENSENSE, INC., San Jo...

1. An apparatus, comprising:
a multipath digital audio combiner component comprising:
a plurality of digital audio filters operatively coupled to a plurality of analog-to-digital converters (ADCs) and configured
to receive a plurality of digital audio signals having different scaling factors of an associated audio signal and configured
to provide a plurality of filtered digital audio signals;

a gain and offset estimation component configured to estimate gain differences and offset differences between the plurality
of filtered digital audio signals, wherein the gain and offset estimation component is further configured to estimate the
offset differences on a continuous basis; and

a multiplexing component configured to switch from conveying one of a plurality of corrected digital audio signals to conveying
a second one of the plurality of corrected digital audio signals, wherein the multipath digital audio combiner component is
further configured to perform gain and offset correction for the plurality of filtered digital audio signals to provide the
plurality of corrected digital audio signals.

US Pat. No. 9,618,405

PIEZOELECTRIC ACOUSTIC RESONATOR BASED SENSOR

INVENSENSE, INC., San Jo...

1. A device, comprising:
an array of piezoelectric transducers; and
an array of cavities that has been attached to the array of piezoelectric transducers to form an array of resonators comprising
a fingerprint sensor, wherein a first resonator of the array of resonators corresponds to a first frequency response representing
the first resonator has been touched by a first ridge of a finger, and wherein a second resonator of the array of resonators
corresponds to a second frequency response representing the second resonator has not been touched by a second ridge of the
finger.

US Pat. No. 9,708,176

MEMS SENSOR WITH HIGH VOLTAGE SWITCH

Invensense, Inc., San Jo...

1. A MEMS sensor comprising:
an integrated circuit die comprising a transistor that operates in a range of voltages at or below a certain maximum operating
voltage, wherein the certain maximum operating voltage is a breakdown voltage of the transistor;

a MEMS sensor structure electrically coupled to the integrated circuit die; and
a MEMS switch electrically coupled to the integrated circuit die and operable to switch a signal applied to the MEMS sensor
structure, where the signal is characterized by a voltage that is above the certain maximum operating voltage of the transistor.

US Pat. No. 9,689,739

MICROELECTROMECHANICAL SYSTEMS SENSOR CONTROL INTERFACE

INVENSENSE, INC., San Jo...

1. A device, comprising:
a package comprising a microelectromechanical systems (MEMS) transducer associated with a clock signal;
at least one register associated with the MEMS transducer; and
a pin of the package configured to at least one of transmit or receive a signal, wherein the pin is further configured to
at least one of transmit or receive a control signal, wherein the control signal is configured to control the MEMS transducer
based on a determination that a control symbol included in the signal, and wherein the determination that the control symbol
is based on detection of a pulse width of a pulse associated with the signal and the clock signal, wherein the pulse is based
on the signal being at a high value or low value for a dynamic number of cycles of the clock signal.

US Pat. No. 9,533,880

METHOD OF FABRICATION OF AL/GE BONDING IN A WAFER PACKAGING ENVIRONMENT AND A PRODUCT PRODUCED THEREFROM

INVENSENSE, INC., San Jo...

1. A method for bonding a first substrate wafer and a second substrate wafer by creating an aluminum/germanium bond, a patterned
aluminum layer disposed on the first substrate wafer, a patterned germanium layer disposed on the second substrate wafer,
the method comprising:
placing the first substrate wafer in a first chuck; placing the second substrate wafer in a second chuck; aligning the first
substrate wafer and the second substrate wafer; and forming a eutectic bond between the patterned germanium layer and the
patterned aluminum layer, wherein the eutectic bond is formed by applying a force across the first chuck and the second chuck,
and ramping temperature of at least one of the first chuck or the second chuck over a eutectic temperature of the aluminum/germanium
bond to a predetermined temperature that is between the eutectic temperature of the aluminum/germanium bond and 450 degrees
Celsius (C.).

US Pat. No. 10,081,539

TWO DIFFERENT CONDUCTIVE BUMP STOPS ON CMOS-MEMS BONDED STRUCTURE

InvenSense, Inc., San Jo...

1. A method, comprising:forming a micro-electro-mechanical system (“MEMS”) wafer including a first MEMS device and a second MEMS device;
forming a complementary metal-oxide semiconductor (“CMOS”) wafer including a first electrically conductive via and a second electrically conductive via;
depositing a layer stack including a first conductive layer, a second conductive layer, and a bond layer over the first electrically conductive via and the second electrically conductive via;
etching the layer stack to define a first standoff, a second standoff, a third standoff, a first bump stop over the first electrically conductive via, and a second bump stop over the second electrically conductive via;
etching the first bump stop and the second bump stop to remove the bond layer;
further etching the first bump stop to remove the second conductive layer; and bonding the MEMS wafer to the CMOS wafer;
wherein the bonding the MEMS wafer to the CMOS wafer includes eutecticly bonding the first standoff, the second standoff, and the third standoff to the MEMS wafer;
wherein the eutecticly bonding the MEMS wafer to the CMOS wafer forms a first cavity surrounding the first MEMS device and the first bump stop, and a second cavity surrounding the second MEMS device and the second bump stop.

US Pat. No. 10,045,121

MICROELECTROMECHANICAL SYSTEMS (MEMS) MICROPHONE BIAS VOLTAGE

Invensense, Inc., San Jo...

1. A microelectromechanical systems (MEMS) microphone, comprising:a MEMS microphone element comprising a diaphragm and a backplate disposed in a microphone package; and
an application specific integrated circuit (ASIC) disposed in the microphone package comprising a first bias voltage generator and a second bias voltage generator, wherein the first bias voltage generator is operatively coupled to the diaphragm and configured to provide a first bias voltage to the diaphragm and the second bias voltage generator is operatively coupled to the backplate and configured to provide a second bias voltage to the backplate, and wherein the second bias voltage is of opposite polarity of the first bias voltage, wherein the ASIC is further configured to operate at least one of the first bias voltage generator or the second bias voltage generator in at least one of a set of modes based at least in part on power consumption, sound pressure level, or predetermined noise performance the MEMS microphone.

US Pat. No. 10,031,877

INCLUDING CONTROL DATA IN A SERIAL AUDIO STREAM

INVENSENSE, INC., San Jo...

1. A device, comprising:a clock pin;
a frame pin;
a data pin;
a clock component configured to send, via the clock pin, a bit clock signal directed to a slave device;
a frame component configured to send, via the frame pin, a frame clock signal directed to the slave device; and
a control component configured to
receive, from the slave device during a first portion of a first phase of a period of the frame clock signal that has been set to a defined logic level during an integrated interchip sound (I2S) audio word frame, first slave data on the data pin on a bit-by-bit basis based on the bit clock signal according to an I2S based protocol, and
send, during a second portion of the first phase of the period of the frame clock signal that has been set to the defined logic level during a previously unused portion of the I2S audio word frame, after the first portion of the first phase, a first part of a first set of control bits on the data pin directed to the slave device to facilitate a bi-directional use of the data pin while the frame clock signal has been set to the defined logic level during the previously unused portion of the I2S audio word frame, wherein the first part is directed to the slave device on the bit-by-bit basis based on the bit clock signal.

US Pat. No. 10,001,387

MODE-TUNING SENSE INTERFACE

Invensense, Inc., San Jo...

1. A method of reducing electrostatic spring softening, comprising:measuring a change in position of a mass subjected to a first force depending on the change in position,
applying a second force to the mass, the second force comprising a force proportional to the measured change in position, the constant of proportionality being selected so that the net force of the first and second forces has reduced dependence on the change in position.

US Pat. No. 9,809,450

CMOS-MEMS INTEGRATION USING METAL SILICIDE FORMATION

INVENSENSE, INC., San Jo...

1. A method for forming a MEMS device, wherein the MEMS device includes a MEMS substrate and a base substrate, wherein the
base substrate includes a top metal layer and the MEMS substrate includes a handle layer, a device layer, and an insulating
layer in between, the method comprising:
providing a conductive material over at least a portion of the top metal layer;
patterning the conductive material and the at least a portion of the top metal layer; and
bonding the conductive material with the device layer via metal silicide formation,wherein the metal silicide formation is amorphous.

US Pat. No. 9,787,267

INTEGRATED AUDIO AMPLIFICATION CIRCUIT WITH MULTI-FUNCTIONAL EXTERNAL TERMINALS

INVENSENSE, INC., San Jo...

1. An integrated audio amplification circuit comprising:
an input terminal for receipt of an input signal from a transducer,
a signal processor operatively coupled to the input terminal for receipt and processing of the input signal to generate a
first processed digital audio signal in accordance with a configuration setting of the signal processor,

a serial data receipt interface operatively coupled to a data input terminal for receipt of an incoming dual-channel data
stream formatted in accordance with a predetermined serial data protocol, wherein the configuration data comprises at least
one of first configuration data associated with the configuration setting of the signal processor and second configuration
data associated with a second configuration setting of a second signal processor of a second integrated audio amplification
circuit; said second integrated audio amplification circuit being connectable to the integrated audio amplification circuit
via a serial data transmission interface and a data output terminal;

the serial data transmission interface configured for transmission of an outgoing dual-channel digital audio stream formatted
in accordance with the predetermined serial data protocol;

a controller configured to enter one of a first channel mode and a second channel mode in accordance with a logic state of
the data input terminal at power-on of the integrated audio amplification circuit; said controller being further configured
to subsequently executing steps of:

reading the incoming dual-channel data stream received through the serial data receipt interface,
extracting the first and second configuration data from first and second data channels, respectively, of the incoming dual-channel
data stream,

writing one of the first and second configuration data to a configuration register of the integrated audio amplification circuit
in accordance with the selected channel mode,

encoding the first processed digital audio signal on the first data channel of the outgoing dual-channel digital audio stream,
encoding one of the second configuration data and the second processed digital audio signal on the second data channel of
the outgoing dual-channel digital audio stream circuit in accordance with the selected channel mode.

US Pat. No. 9,593,008

MEMS SENSOR INCLUDING AN OVER-TRAVEL STOP AND METHOD OF MANUFACTURE

InvenSense, Inc., San Jo...

1. A MEMS device comprising:
a MEMS structure;
a substrate coupled to the MEMS structure, the substrate comprising a layer of metal and a layer of dielectric material; wherein
the MEMS structure moves relative to the substrate in response to an excitation;

a first over-travel stop is formed on the substrate at a first distance from the MEMS structure;
a second over-travel stop on the substrate at a second distance from the MEMS structure; and
at least one electrode on the substrate at a third distance from the MEMS structure;
wherein the first, second and third distances are all different.

US Pat. No. 9,625,329

MEMS SENSOR OFFSET COMPENSATION WITH STRAIN GAUGE

INVENSENSE, INC., San Jo...

1. A system comprising:
a microelectromechanical system (MEMS) sensor operable to generate a sensor output signal that corresponds to a sensed condition;
a strain gauge operable to generate a strain measurement signal indicative of a strain on the MEMS sensor, wherein the strain
gauge and MEMS sensor are mechanically coupled via one or more anchor points; and

a strain compensation circuit, wherein the strain compensation circuit is operable to modify the sensor output signal to compensate
for the strain based on the strain measurement signal.

US Pat. No. 9,351,084

PACKAGING CONCEPT TO IMPROVE PERFORMANCE OF A MICRO-ELECTRO MECHANICAL (MEMS) MICROPHONE

INVENSENSE, INC., San Jo...

1. A device, comprising:
a micro-electro-mechanical (MEMS) microphone device; and
a substrate, coupled to the MEMS microphone device, having a top surface and a bottom surface,
wherein the MEMS microphone device is coupled to the top surface, the substrate comprises a port hole that has a first diameter
at a first position closer to the top surface and a second diameter at a second position closer to the bottom surface, and

wherein the first diameter is made larger than the second diameter to improve a performance of the MEMS microphone device.

US Pat. No. 9,961,506

SYSTEMS AND METHODS FOR DETERMINING POSITION USING A GEOFEATURE

InvenSense, Inc., San Jo...

1. A method for refining position information for a mobile sensor device associated with a user comprising:obtaining a coarse location of the mobile sensor device;
matching a pattern of sensor data detected by the mobile sensor device with a signature that is correlated with a first class of geofeatures, wherein a geofeature is any object having a known location that causes a mobile device associated with a user to detect a distinguishable pattern of sensor data when the user interacts with the object and wherein the sensor data comprises motion sensor data;
identifying a first geofeature based, at least in part, on proximity to the coarse location for the mobile sensor device, wherein the first geofeature is a member of the first class of geofeatures;
refining position information for the mobile sensor device using information associated with the first geofeature;
identifying a plurality of geofeatures having the signature, such that the plurality of geofeatures are members of the first class of geofeatures;
selecting the first geofeature using previously determined position information for the mobile sensor device; and
sequentially matching patterns of sensor data detected by the mobile sensor device with a plurality of signatures that are correlated with a plurality of geofeatures, wherein the plurality of geofeatures are known to be related.

US Pat. No. 9,749,736

SIGNAL PROCESSING FOR AN ACOUSTIC SENSOR BI-DIRECTIONAL COMMUNICATION CHANNEL

INVENSENSE, INC., San Jo...

1. An acoustic sensor, comprising:
a micro-electro-mechanical system (MEMS) transducer configured to generate, based on an acoustic pressure, an audio output;
a bi-directional communication component configured to at least one of send or receive data that has been superimposed on
the audio output using common mode signaling comprising a sum of a first voltage of a first pin and a second voltage of a
second pin, time division multiplexing, or frequency separation; and

a signal processing component configured to simultaneously
send, via the first pin and the second pin during a differential mode configuration, the audio output directed to an external
device utilizing differential mode signaling between the first pin and the second pin, and

send, via the first pin and the second pin during the differential mode configuration, the data directed to the external device
utilizing the common mode signaling comprising the sum of the first voltage and the second voltage.

US Pat. No. 9,740,229

CURVATURE-CORRECTED BANDGAP REFERENCE

InvenSense, Inc., San Jo...

1. A curvature-corrected bandgap reference, comprising:
a first current source proportional to absolute temperature;
a first resistor which conducts a first current from the first current source to generate a proportional to absolute temperature
voltage;

the curvature-corrected bandgap reference further comprising a first BJT device including a first base terminal coupled to
an output node and a first emitter terminal, wherein the first BJT device operates at a first current density that is substantially
proportional to absolute temperature;

a second BJT device including a second base terminal coupled to a second emitter terminal, wherein the second BJT device operates
at a second current density that is substantially independent of temperature;

a correction voltage proportional to a voltage difference of the first and second emitter terminals, wherein the correction
voltage substantially cancels a curvature of a reference voltage;

a circuit operable to force the second current density to be substantially proportional to the reference voltage;
wherein the circuit further includes a resistor coupled to the reference voltage;
a current mirror coupled to the resistor and to a collector of the second BJT device; and
a base current compensation block coupled to a collector of the first BJT device and to the collector of the second BJT device,
the base current compensation block diverts a current nominally equal to base currents of the first and second BJT devices
such that the first and second current densities are nominally independent of the base currents of the first and second BJT
devices, wherein accuracy of curvature correction is thereby improved.

US Pat. No. 9,958,349

PRESSURE SENSOR

INVENSENSE, INC., San Jo...

1. A pressure sensor, comprisinga deformable membrane deflecting in response to pressure applied,
a first stationary electrode and a second electrode coupled to the deformable membrane, for determining a change in a capacitance between the first and the second electrode in response to the pressure applied,
wherein the first stationary electrode comprises a getter material for collecting gas molecules wherein the first stationary electrode comprising the getter material comprises a first layer and a second layer, wherein the first layer comprises conducting material that is different from the getter material, and wherein the second layer is deposited on the first layer, and wherein the second layer faces a volume to collect the gas molecules from.

US Pat. No. 9,921,335

SYSTEMS AND METHODS FOR DETERMINING LINEAR ACCELERATION

InvenSense, Inc., San Jo...

1. A method for measuring linear acceleration for a device having an accelerometer comprising:
obtaining a plurality of data samples from the accelerometer;
iteratively determining a plurality of orientations of the device with respect to gravity using only sampled data from the
accelerometer;

determining a gravity vector with respect to a first data sample of the plurality of data samples using a determined orientation
corresponding to the first data sample; and

subtracting the determined gravity vector from the first sample of data from the accelerometer to derive linear acceleration.

US Pat. No. 9,919,920

SYSTEMS AND METHODS FOR MASK REDUCTION TECHNIQUES

INVENSENSE, INC., San Jo...

1. A method, comprising:
providing a first conductive layer over a pad of a microelectromechanical system (MEMS) sensor system;
providing a second conductive layer over the pad, over the outgassing layer, and over the bump stop structure;
performing a first etch to remove a portion of the second conductive layer over the pad; and
performing, using a single mask, a second etch to remove a portion of the first conductive layer over the pad and to remove
the second conductive layer over the outgassing layer.

US Pat. No. 9,811,174

INTERFACING APPLICATION PROGRAMS AND MOTION SENSORS OF A DEVICE

INVENSENSE, INC., San Jo...

1. A sensor package, comprising:
a first substrate including a three-axis microelectromechanical system (MEMS) gyroscope and a three-axis MEMS accelerometer;
and

a second substrate including a first processor, the second substrate connectively coupled to the first substrate, the three-axis
MEMS gyroscope configured to generate raw gyroscope data at a first rate and the first processor configured to receive the
raw gyroscope data at the first rate and integrate the raw gyroscope data with respect to time,

wherein the sensor package is configured to transmit the integrated gyroscope data at a second rate, wherein the second rate
is lower than the first rate, and wherein the sensor package is configured to transmit the integrated gyroscope data and the
three-axis MEMS accelerometer data to a second processor at the second rate for fusion of the integrated gyroscope data and
the three-axis MEMS accelerometer data by the second processor.

US Pat. No. 9,738,512

CMOS-MEMS INTEGRATED DEVICE INCLUDING MULTIPLE CAVITIES AT DIFFERENT CONTROLLED PRESSURES AND METHODS OF MANUFACTURE

INVENSENSE, INC., San Jo...

1. A method of preparing a first substrate comprising the steps:
depositing in a fixed location, a temperature-activated outgassing source layer comprising a non-gettering out-gassing substance
on the first substrate, and resulting in two cross-sections, wherein in one of the two cross-sections a top surface of the
temperature-activated outgassing source layer is exposed creating an exposed outgassing source layer and in the other of the
two cross-sections there is no exposed outgassing source layer, and wherein the non-gettering out-gassing substance is configured
to desorb one or more gases as a result of raising its temperature.

US Pat. No. 9,716,933

METHOD AND APPARATUS FOR IMPROVING PERFORMANCE OF DIGITAL MICROELECTROMECHANICAL SYSTEMS MICROPHONES

INVENSENSE, INC., San Jo...

1. A digital microphone device, comprising:
a microelectromechanical systems (MEMS) acoustic sensor configured to receive an acoustic signal;
an amplifier configured to receive a signal the MEMS acoustic sensor to create an amplified signal;
an analog-to-digital converter (ADC) that converts the amplified signal into a digital signal;
an automatic gain compensation (AGC) component configured for automatic gain control of at least one of an analog gain stage
or a digital gain stage associated with the MEMS acoustic sensor; and

a direct current (DC) offset cancellation component configured to compensate for at least one adjustment of the at least one
of the analog gain stage or the digital gain stage determined by the AGC component.

US Pat. No. 9,683,844

EXTENSION-MODE ANGULAR VELOCITY SENSOR

INVENSENSE, INC., San Jo...

1. An angular rate sensor, comprising:
at least three masses disposed substantially in a plane parallel to a base, wherein the at least three masses have a center
of mass;

at least one actuator that drives the at least three masses in an extension mode, wherein, in the extension mode, the at least
three masses move in the plane simultaneously away from the center of mass or simultaneously towards the center of mass;

a first transducer that senses a first Coriolis force resulting from a first rotation of the angular rate sensor about a first
input axis in the plane; and

a second transducer that senses a second Coriolis force resulting from a second rotation of the angular rate sensor about
a second input axis in the plane, wherein the second input axis is not parallel to the first input axis.

US Pat. No. 9,628,713

SYSTEMS AND METHODS FOR OPTICAL IMAGE STABILIZATION USING A DIGITAL INTERFACE

InvenSense, Inc., San Jo...

1. An optical image stabilization (OIS) system comprising:
a first camera unit including a lens, an image sensor and an actuator for moving the lens relative to the image sensor along
at least two orthogonal axes;

a motion sensor separate from the first camera unit including a gyroscope configured to sense angular velocity of the first
camera unit on at least the two orthogonal axes;

a motion processor configured to determine movement of the first camera unit based at least in part on output from the motion
sensor;

an OIS controller configured to output a signal corresponding to a compensating relative movement between the lens and image
sensor in response to the determined movement of the first camera unit;

an actuator circuit for translating the output signal to actuator movement along the at least two orthogonal axes;
a digital interface coupling the actuator circuit and the OIS controller; and
a host processor configured to run a process utilizing output from the motion sensor, wherein the motion processor is configured
to simultaneously provide output to the host processor and the OIS controller.

US Pat. No. 9,508,663

ASSEMBLY AND PACKAGING OF MEMS DEVICE

INVENSENSE, INC., San Jo...

11. A microelectromechanical systems (MEMS) device comprising:
a printed circuit board (PCB);
a plurality of solder bumps formed on a surface of the PCB;
a CMOS-MEMS die including a CMOS die and a MEMS die vertically stacked and attached to one another, wherein the MEMS die is
disposed between the PCB and the CMOS die; and

a plurality of stud bumps formed on the CMOS die, wherein the plurality of stud bumps and the plurality of solder bumps being
positioned between the PCB and the CMOS die and an upper-most surface of the semiconductor substrate is positioned below a
lower-most surface of the CMOS die and a lower-most surface of the MEMS die to define a height between the CMOS die and the
PCB,

further wherein the plurality of stud bumps and the plurality of solder bumps are in direct contact.

US Pat. No. 9,980,046

MICROPHONE DISTORTION REDUCTION

INVENSENSE, INC., San Jo...

1. A system, comprising:a processor; and
a memory that stores executable instructions that, when executed by the processor, facilitate performance of operations, comprising:
obtaining a pressure-in to signal-out transfer function representing a distortion of an output signal of a microphone corresponding to an input stimulus of a defined sound pressure level (SPL) that has been applied to the microphone;
creating an ideal sine wave stimulus based on an amplitude of a time domain waveform representing the output signal and a fundamental frequency of the time domain waveform;
generating, based on a defined relationship between the ideal sine wave stimulus and the time domain waveform, an equation representing the pressure-in to signal-out transfer function representing the distortion of the output signal; and
inverting the equation to obtain an inverse transfer function for facilitating an application, by the microphone, of the inverse transfer function to the output signal to obtain a linearized output representing the input stimulus.

US Pat. No. 9,769,562

MICROPHONE SYSTEM WITH NON-ORTHOGONALLY MOUNTED MICROPHONE DIE

INVENSENSE, INC., San Jo...

1. A microphone system comprising: a base having a top surface, a bottom surface, a primary portion and a ramped portion,
the primary portion being generally planar and substantially parallel to the bottom surface, the ramped portion generally
forming an obtuse angle “OB” with the primary portion, the base additionally having at least one side with an upwardly extending
portion, the OB formed between two base regions;
a lid coupled with the base to form a package with an interior chamber, the upwardly extending portion of the base forming
an audio input port, the audio input port positioned externally to the interior chamber for receiving an acoustic signal,
the upwardly extending portion and the ramped portion forming an opening through which the received acoustic signal is guided;
a microphone die positioned within the interior chamber and on top of the ramped portion at an angular position corresponding
to the OB of the ramped portion, wherein the ramped portion is positioned under the microphone die to support said microphone
die and forms a channel that directs the acoustic signal from the audio input port through a side face of the package to the
microphone die, wherein the base further has at least one location protrusion to position the lid on the top surface of the
base.

US Pat. No. 9,720,794

METHOD AND SYSTEM PROVIDING A SELF-TEST ON ONE OR MORE SENSORS COUPLED TO A DEVICE

InvenSense, Inc., San Jo...

1. A computer implemented method for providing a self-test on one or more sensors coupled to a device, wherein the one or
more sensors include any of an accelerometer, a gyroscope, a magnetometer and a pressure sensor, the method comprising: enabling
a hook in a user space of a memory, wherein the hook is in communication with a self-test mechanism; receiving a user input
via the hook; executing the self-test mechanism in a kernel space of the memory within the device; and returning the results
to the user space; wherein the returning step includes returning the results to the user.

US Pat. No. 9,663,349

MEMS DEVICE WITH ELECTRODES PERMEABLE TO OUTGASSING SPECIES

INVENSENSE, INC., San Jo...

1. A MEMS device comprising:
a first substrate;
a second substrate coupled to the first substrate forming a sealed enclosure;
a moveable structure within the sealed enclosure;
an outgassing layer formed on the first or second substrates and within the sealed enclosure; and
a first conductive layer disposed between the moveable structure and the outgassing layer, wherein the first conductive layer
allows outgassing species to pass through.

US Pat. No. 9,540,230

METHODS FOR CMOS-MEMS INTEGRATED DEVICES WITH MULTIPLE SEALED CAVITIES MAINTAINED AT VARIOUS PRESSURES

INVENSENSE, INC., San Jo...

1. A Microelectromechanical Systems (MEMS) device comprising:
a MEMS substrate with cavities bonded to a second substrate, forming a plurality of sealed enclosures, wherein each of the
plurality of sealed enclosures is defined by the MEMS substrate, the second substrate, and a seal-ring material, wherein one
of the plurality of sealed enclosures includes an inertial sensor;

wherein at least one of plurality of sealed enclosures further includes a non gettering out-gassing substance to desorb one
or more gases to increase cavity pressure in the at least one of the plurality of sealed enclosures and at least one other
of the plurality of sealed enclosures does not include the non gettering out-gassing substance;

wherein the at least one sealed enclosure with the non gettering out-gassing substance has a higher cavity pressure than the
at least one other of the plurality of sealed enclosures without the non gettering out-gassing substance.

US Pat. No. 9,885,577

REDUCING RESONANCE PEAKS AND DRIVE TONES FROM A MICRO-ELECTRO-MECHANICAL SYSTEM GYROSCOPE RESPONSE

INVENSENSE, INC., San Jo...

1. A micro-electro-mechanical system (MEMS) gyroscope, comprising:
a drive oscillation component configured to vibrate a sensor mass at a drive resonance frequency;
a sense circuit configured to:
detect a deflection of the sensor mass; and
generate, based on the deflection and the drive resonance frequency, a demodulated output; and
a signal processing component configured to:
receive a set of frequencies comprising a first value representing the drive resonance frequency, a second value corresponding
to a sense resonance frequency associated with the sense circuit, and tone values representing tones of the drive resonance
frequency, and

apply, based on the first value the second value, and the tone values, a notch filter to the demodulated output to obtain
a filtered output.

US Pat. No. 9,722,561

SYSTEMS AND APPARATUS PROVIDING FREQUENCY SHAPING FOR MICROPHONE DEVICES AND METHODS OF OPERATION OF THE SAME

INVENSENSE, INC., San Jo...

1. A device, comprising:
a sensor that causes an electrical signal to be generated in response to a sensor measurement;
clock frequency detection circuitry adapted to receive a clock signal, detect a frequency of the clock signal and generate
information representative of the frequency; and

digital filter circuitry coupled to the clock frequency detection circuitry and adapted to:
receive the clock signal and the information representative of the frequency;
access a first set of one or more digital filter coefficient values; and
selectively change the first set of the one or more digital filter coefficient values to a second set of one or more digital
filter coefficient values based on the information representative of the frequency, wherein the one or more digital filter
coefficient values are included within a plurality of digital filter coefficient values, and wherein the selectively changing
the first set of one or more digital filter coefficient values to the second set of one or more digital filter coefficient
values includes selectively changing the first set of one or more digital filter coefficient values to the second set of one
or more digital filter coefficient values to reduce or eliminate an effect of the frequency of the clock signal on a frequency
response of a digital filter.

US Pat. No. 9,556,019

CAVITY PRESSURE MODIFICATION USING LOCAL HEATING WITH A LASER

INVENSENSE, INC., San Jo...

1. A method for changing a pressure within at least one enclosure in a microelectromechanical systems (MEMS) device, the method
comprising:
applying a laser through one of at least two substrates onto a material that changes the pressure within at least one enclosure
when exposed to the laser, wherein the at least one enclosure is formed by a MEMS substrate and a complementary metal-oxide-semiconductor
(CMOS) substrate of the at least two substrates, and wherein the material is disposed on a metal layer of at least one of
the MEMS substrate or the CMOS substrate; and

reflecting at least a portion of incident laser light from the laser with the metal layer back onto the material.

US Pat. No. 10,045,126

MICROELECTROMECHANICAL MICROPHONE HAVING A STATIONARY INNER REGION

INVENSENSE, INC., San Jo...

1. A microelectromechanical microphone, comprising:a stationary plate comprising multiple openings; and
a movable plate comprising an outer portion and an inner opening that is substantially centered at a geometric center of the movable plate, wherein the movable plate is rigidly attached, via a hollow dielectric member comprising a circular region corresponding to the inner opening and extending from a first surface of the stationary plate to a second surface of the movable plate, to the stationary plate in a vicinity of the inner opening to facilitate a reduction in buckling instability, wherein the hollow dielectric member comprises a substantially centrosymmetric shell comprising a thickness and comprising a dielectric cross-section, and wherein a ratio between a width of the dielectric cross-section and the thickness is in a range from about 3 to about 300.

US Pat. No. 9,919,915

METHOD AND SYSTEM FOR MEMS DEVICES WITH DUAL DAMASCENE FORMED ELECTRODES

INVENSENSE, INC., San Jo...

1. A manufacturing method, the method comprising:
forming first and second dielectric layers on a semiconductor substrate, said semiconductor substrate comprising a conductive
layer at least partially covered by the first dielectric layer;

removing a defined portion of the second dielectric layer;
forming vias through the second dielectric layer, said via extending to the conductive layer, wherein the vias provide electrical
interconnections through the second dielectric layer between devices in the semiconductor substrate and the conductive layer;

forming electrodes by filling the vias, and the defined portion of the second dielectric layer, with a first metal; and
coupling a micro-electro-mechanical systems (MEMS) substrate to the semiconductor substrate;
forming a metal pad on the at least one electrode by depositing a second metal on the at least one electrode and removing
portions of the second metal, wherein a first gap between the semiconductor substrate and the MEMS substrate is between a
first electrode that does not have the metal pad and a standoff formed in the MEMS substrate.

US Pat. No. 9,628,929

BACK CAVITY LEAKAGE TEST FOR ACOUSTIC SENSOR

INVENSENSE, INC., San Jo...

1. An acoustic sensor system comprising:
an acoustic sensor with a cavity, a cavity leakage, and a cavity pressure; and
a test controller coupled to the acoustic sensor and configured to generate a change in the cavity pressure and to detect
a response of the acoustic sensor to the change in the cavity pressure, the pressure being in the form of an exponential decay,
wherein the test controller is configured to measure a motion of a moveable sense element in response to the change in cavity
pressure and to determine the cavity leakage from the measured motion.

US Pat. No. 10,142,718

INTEGRATED TEMPERATURE SENSOR IN MICROPHONE PACKAGE

Invensense, Inc., San Jo...

1. A device, comprising:a microphone sensor coupled to a first side of a substrate;
an acoustic port in the substrate that exposes a portion of the microphone sensor; and
a temperature sensor mounted on a second side of the substrate that overlays a portion of the port.

US Pat. No. 9,729,963

MULTI-FUNCTION PINS FOR A PROGRAMMABLE ACOUSTIC SENSOR

INVENSENSE, INC., San Jo...

1. A programmable acoustic sensor comprising:
a programmable circuitry coupled to a MEMS transducer, wherein the programmable circuitry includes a power pin, a ground pin,
and a signal conditioning circuit that processes output data generated by the MEMS transducer; and

a communication channel enabling a data exchange between the programmable circuitry and a host system, wherein the power pin
is utilized for the data exchange and the power pin receives, from the host system, data generated by the host system.

US Pat. No. 9,718,680

CMOS-MEMS INTEGRATED DEVICE INCLUDING A CONTACT LAYER AND METHODS OF MANUFACTURE

INVENSENSE, INC., San Jo...

1. A method for forming a MEMS device, wherein the MEMS device includes a MEMS substrate and a base substrate; wherein the
MEMS substrate includes a handle layer, a device layer and an insulating layer in between, the method comprising:
providing a standoff on the device layer;
etching a via through only the device layer and the insulating layer;
providing a contact layer within the via by depositing and patterning a first conductive material within the via to comprise
a liner within the via, wherein the contact layer provides a direct electrical connection between the device layer and the
handle layer, and wherein the first conductive material is deposited within the via over the device layer and the insulation
layer, and the first conductive material forms an electrical contact with the handle layer;

providing a bonding layer on the standoff; and
bonding the bonding layer to pads on the base substrate.

US Pat. No. 9,719,787

METHOD AND SYSTEM FOR MULTIPLE PASS SMOOTHING

InvenSense, Inc., San Jo...

1. A method configured to enhance a navigation solution for a device and a platform through multiple pass smoothing, wherein
the mobility of the device is constrained or unconstrained within the platform and wherein the device may be tilted to any
orientation, the method comprising:
a) obtaining input data comprising sensor data acquired from a sensor assembly integrated with the device and representing
motion of the device at a plurality of epochs from a first instant to a subsequent second instant;

b) performing forward processing of the input data to derive interim forward navigation solutions for the epochs;
c) performing backward processing of the input data to derive interim backward navigation solutions for the epochs;
d) combining at least one quantity of the navigation solution from the interim forward and backward navigation solutions to
obtain a smoothed version of the at least one combined quantity;

e) performing forward processing of the input data and the at least one combined quantity to derive enhanced interim forward
navigation solutions for the epochs;

f) performing backward processing of the input data and the at least one combined quantity to derive enhanced interim backward
navigation solutions for the epochs;

g) combining at least one uncombined quantity of the navigation solution from the enhanced interim forward and backward navigation
solutions to obtain an enhanced smoothed navigation solution; and

h) providing the enhanced smoothed navigation solution.

US Pat. No. 9,651,387

PORTABLE NAVIGATION SYSTEM

Invensense, Inc., San Jo...

1. A portable navigation system module within a moving body, the module comprising:
a) a receiver for receiving navigational information from an external source and producing an output of absolute navigational
information pertaining to the module;

b) an assembly of sensors in the module comprising an accelerometer and a gyroscope for generating navigational information
at the module and producing an output in the form of signals indicative thereof; and

c) a processor coupled to receive the outputs from the receiver and sensor assembly and operative to use the navigational
information provided thereby to establish a mode of conveyance of the module and a variable relative orientation between the
sensors and the moving body in the form of information indicative thereof,

wherein the relative orientation is a difference between a frame of the sensors in the module and a frame of the moving body
and is obtained from the accelerometer and the gyroscope, using an estimation filter with measurement updates from physical
constraints and the absolute navigational information,

wherein the mode of conveyance comprises the detection of on-foot mode or in-vehicle mode, wherein said detection of on-foot
mode or in-vehicle mode uses an analysis of the signals from the accelerometer and the gyroscope along with magnetometer information
and barometer information, said processor further being operative to use the outputs of navigational information derived from
the receiver and sensors, the mode of conveyance and the relative orientation to determine and produce a navigation solution
when the module is in a tethered condition and when the module is in an untethered condition.

US Pat. No. 9,664,750

IN-PLANE SENSING LORENTZ FORCE MAGNETOMETER

INVENSENSE, INC., San Jo...

1. A device comprising:
a magnetic field sensor including,
a driving element onto which a Lorentz force acts resulting in a torque about a first axis in response to a magnetic field
along a second axis, the direction of the magnetic field being substantially parallel to a plane of a substrate onto which
the driving element resides, the driving element being a coil through which an electric current flows;

a sensing element configured to rotate about the first axis substantially parallel to the plane of the substrate and in response
to the magnetic field,

wherein the sensing element and the driving element have a symmetric structure relative to each other about the first axis;
a coupling element mechanically coupling the driving element to the sensing element, the sensing element and the coupling
element being disposed in the plane, substantially parallel to the substrate; and

at least two anchors configured to connect the driving element, the sensing element, and the coupling element to the substrate.

US Pat. No. 9,617,141

MEMS DEVICE AND PROCESS FOR RF AND LOW RESISTANCE APPLICATIONS

INVENSENSE, INC., San Jo...

6. A MEMS device, comprising:
a MEMS substrate comprising a moveable portion and one or more stand-offs protruding from the MEMS substrate, an aluminum
layer deposited onto the one or more stand-offs, an electrically conductive diffusion barrier layer disposed on top of the
aluminum layer, and a germanium layer disposed on top of the electrically conductive diffusion barrier layer; and

a CMOS substrate coupled to the MEMS substrate, wherein the CMOS substrate contains at least one electrode and one or more
aluminum pads, and wherein the one or more stand-offs are bonded to the one or more aluminum pads by utilizing an aluminum-germanium
solder between the one or more aluminum pads and the germanium layer.

US Pat. No. 9,595,181

WEARABLE DEVICE ASSISTING SMART MEDIA APPLICATION AND VICE VERSA

INVENSENSE, INC., San Jo...

1. A system comprising:
a wearable device connected to and operable and configurable by a user; and
a smart media in remote communication with the wearable device, the wearable device being automatically and selectively operable
to detect a certain context associated with the user or being unable to detect a certain context without assistance and further
operable to transmit the same to the smart media, the smart media thereafter assuming the detected certain context to be accurate
when the wearable device detects the certain context associated with the user and based on the certain context, the smart
media being operable to execute a first application or when the wearable device is unable to detect the certain context associated
with the user without assistance, the smart media being configured to determine the certain context associated with the user,
based on information transmitted by the wearable device, the smart media further configured to transmit the identified certain
context to the wearable device and upon the wearable device communicating the same to the smart media, the smart media thereafter
assuming the detected certain context to be accurate, the wearable device through direct communication with the first application
and through execution of the first application, being configured to communicate the certain context to the smart media and
the smart media being operable to automatically access a second application related to the communicated certain context, wherein
the smart media is operable to selectively detect the certain context based on remote communication between the smart media
and the wearable device and an activity of the user, the wearable device assuming the detected and communicated certain context
to be accurate and based on the detected and communicated certain context, the first application being operable to automatically
access the second application, the second application being independent of the first application in that the second application
is unaware of a presence of the wearable device.

US Pat. No. 9,513,347

DEVICE WITH MAGNETIC SENSORS WITH PERMANENT MAGNETS

Invensense, Inc., San Jo...

1. A device, comprising:
a substrate, the substrate including a device layer;
a magnetic sensor formed on the device layer, the magnetic sensor including at least a first permanent magnet and a plurality
of sensing elements, wherein,

the first permanent magnet deposited on a movable actuator, the first permanent magnet deposited with at least one alternating
ferromagnetic (FM) layer and antiferromagnetic (AFM) layer, with a first barrier layer deposited between the FM layer and
the AFM layer; and

the first permanent magnet is magnetized in a first direction at a temperature higher than a blocking temperature of the AFM
layer of the first permanent magnet; and wherein,

the plurality of sensing elements including at least one electrode configured to move relative to the sensing elements, based
upon a movement of the first permanent magnet deposited on the movable actuator;

a plurality of device pads coupled to the magnetic sensor; and
an integrated circuit substrate with a plurality of IC pads, wherein the plurality of device pads are selectively eutectic
bonded to the plurality of IC pads at a bonding temperature greater than the blocking temperature of the first permanent magnet.

US Pat. No. 9,928,398

ALWAYS-ON SENSOR DEVICE FOR HUMAN TOUCH

INVENSENSE, INC., San Jo...

1. A device, comprising:always-on circuitry configured to implement a first stage comprising first operations including:
detecting touch of a specific area of a touch-screen display device, wherein the detecting is performed by a capacitor sensor, a pressure sensor, a force sensor or an accelerometer;
predicting that the touch is associated with a human finger based on a touch criterion; and
in response to the predicting,
generating a control signal configured to cause a system circuitry to wake-up from a power-off mode or a sleep mode; and
sending the control signal to the system circuitry; and the system circuitry configured to implement a second stage in response to the control signal, the second stage comprising second operations including:
analyzing biometric data of a human body associated with the human finger, and wherein the predicting further comprises determining that a first frequency response of a mass that causes the touch corresponds to a second frequency response of the human finger and determining that the specific area overlaps with a number of pixels of the touch-screen display device within a defined range.

US Pat. No. 9,880,185

METHOD TO REDUCE DATA RATES AND POWER CONSUMPTION USING DEVICE BASED ATTITUDE QUATERNION GENERATION

INVENSENSE, INC., San Jo...

1. A sensor device, comprising:
a sensor package including,
a first silicon substrate including a three-axis microelectromechanical system (MEMS) gyroscope and a three-axis MEMS accelerometer;
a second silicon substrate including a first processor, the second silicon substrate connectively and electrically coupled
to the first silicon substrate, the three-axis MEMS gyroscope configured to generate raw gyroscope data with a gyroscope bias,
the raw gyroscope data being a measurement output from the three-axis MEMS gyroscope, the first processor configured to receive
the raw gyroscope data and remove the gyroscope bias to generate an unbiased gyroscope data, and integrate the unbiased gyroscope
data into a gyroscope quaternion at a first rate,

wherein the first silicon substrate is vertically stacked and attached to the second silicon substrate within the sensor package,
further wherein the sensor package is configured to transmit the integrated gyroscope data at a second rate, the second rate
being lower than the first rate.

US Pat. No. 9,835,454

HIGH-Q MEMS GYROSCOPE

INVENSENSE, INC., San Jo...

1. A MEMS gyroscope comprising:
a proof mass;
a proof mass drive circuit operable to increase an oscillation amplitude of the proof mass during a first time period and
allow the oscillation amplitude of the proof mass to decrease during a second time period; and

a first sense circuit operable to determine a rotational velocity value during at least a portion of the second time period
and during at least a portion of the first time period, when the MEMS gyroscope is in a low power mode.

US Pat. No. 9,505,614

LOW FREQUENCY RESPONSE MICROPHONE DIAPHRAGM STRUCTURES AND METHODS FOR PRODUCING THE SAME

INVENSENSE, INC., San Jo...

1. A method of fabricating a microphone having a sealing layer, comprising:
providing a substrate wafer having a surface;
etching trenches into the surface of the substrate wafer, the trenches to be through holes of a backplate;
covering the surface of the substrate wafer with a sacrificial material, the sacrificial material filling the trenches;
depositing a seal layer on the sacrificial material, the seal layer having a thickness of not greater than 500 nanometers;
etching a seal aperture in the seal layer;
adding additional sacrificial material within the seal aperture such that the additional sacrificial material is contiguous
with the sacrificial material;

depositing a diaphragm layer on the seal layer;
etching a spring gap and springs into the diaphragm layer to define a diaphragm region in the diaphragm layer;
etching a backside cavity in the substrate wafer to expose the sacrificial material; and
removing the sacrificial material and the added sacrificial material to release the diaphragm layer such that the diaphragm
layer is suspended by the springs and is movable relative to the backplate

wherein the diaphragm layer and the backplate form a variable capacitor of a microphone, and the springs suspend the diaphragm
layer when the microphone is in operation, and the seal layer seals the diaphragm region except at the location of the seal
aperture.

US Pat. No. 10,302,432

COMPENSATING CIRCUIT FOR A MICROELECTROMECHANICAL (MEMS) RESONATOR

InvenSense, Inc., San Jo...

1. A circuit comprising:a microelectromechanical (MEMS) gyroscope; and
a gain circuit coupled with the MEMS gyroscope, the gain circuit configured to receive a digitized drive signal based at least in part on a digitized drive voltage amplitude of the MEMS gyroscope, the gain circuit configured to determine a percentage change in quality factor of the MEMS gyroscope based at least in part on the digitized drive signal and a stored trim value of the MEMS gyroscope, and the gain circuit configured to compensate for an effect of a change in the quality factor of the MEMS gyroscope based at least in part on the percentage change in quality factor.

US Pat. No. 9,880,063

PRESSURE SENSOR STABILIZATION

INVENSENSE, INC., San Jo...

1. A pressure sensor comprising:
a diaphragm, wherein the diaphragm is displaced responsive to pressure;
driving electrodes and a sensing electrode, wherein capacitance of the sensing electrode changes responsive to the diaphragm
displacement responsive to the pressure, wherein in displacement mode of the pressure sensor the pressure is determined and
wherein in frequency mode of the pressure sensor a natural frequency of the diaphragm is measured;

a phase shifter that forms a loop from an output of the sensing electrode to the driving electrodes to drive the diaphragm
when the pressure sensor is in the frequency mode, and wherein the phase shifter is configured to phase shift a signal received
from the sensing electrode to create an oscillation frequency within the loop, wherein the oscillation frequency is associated
with the natural frequency of the diaphragm; and

a frequency counter measuring the oscillation frequency within the loop when the pressure sensor is in the frequency mode,
wherein the determined pressure is adjusted based on the determined natural frequency to produce a compensated measurement
of the pressure.

US Pat. No. 9,797,727

METHOD AND APPARATUS FOR DETERMINATION OF MISALIGNMENT BETWEEN DEVICE AND VESSEL USING ACCELERATION/DECELERATION

InvenSense, Inc., San Jo...

1. A method for determining heading misalignment between a device and a platform using acceleration or deceleration of the
platform, wherein the device comprises sensors capable of providing sensor readings, wherein said sensors comprise at least
one accelerometer with at least two axes, the method comprising the steps of:
a) detecting acceleration or deceleration of the platform;
b) obtaining leveled horizontal components of acceleration readings along forward and lateral axes of the device from the
accelerometer; and

c) calculating a heading misalignment angle between the device and the platform using the leveled horizontal components of
acceleration readings along the forward and lateral axes of the device when acceleration or deceleration is detected.

US Pat. No. 9,796,580

CMOS-MEMS-CMOS PLATFORM

InvenSense, Inc., San Jo...

1. A sensor chip comprising:
a first substrate with a first surface and a second surface comprising at least one CMOS circuit;
a MEMS substrate with a first surface and a second surface on opposing sides of the MEMS substrate; and
a second substrate comprising at least one CMOS circuit;
wherein the first surface of the first substrate is attached to a packaging substrate and the second surface of the first
substrate is attached to the first surface of the MEMS substrate; and

wherein the second surface of the MEMS substrate is attached to the second CMOS substrate; and
wherein the first substrate, the MEMS substrate, the second substrate and the packaging substrate are mechanically attached
and provided with electrical interconnects.

US Pat. No. 9,731,961

MEMS-CMOS-MEMS PLATFORM

InvenSense, Inc., San Jo...

1. A package comprising:
a sensor chip comprising:
a first MEMS substrate;
a CMOS substrate with a first surface and a second surface, wherein the first MEMS substrate is attached to the first surface
of the CMOS substrate, and

a second MEMS substrate with a first surface and a second surface; wherein the first surface of the second MEMS substrate
is attached to the second surface of the CMOS substrate and the second surface of the second MEMS substrate is attached to
a packaging substrate, the second MEMS substrate comprising a first cavity within the first surface of the second MEMS substrate
and a second cavity within the second surface of the second MEMS substrate;

wherein the first MEMS substrate, the CMOS substrate, the second MEMS substrate and the packaging substrate are connected
through electrical interconnects.

US Pat. No. 9,617,144

INTEGRATED PACKAGE CONTAINING MEMS ACOUSTIC SENSOR AND ENVIRONMENTAL SENSOR AND METHODOLOGY FOR FABRICATING SAME

INVENSENSE, INC., San Jo...

1. A device comprising:
a package;
a MEMS acoustic sensing element comprising a diaphragm disposed in the package;
an integrated circuit (IC) disposed in the package and comprising an IC substrate having an environmental sensing material
of an environmental sensor disposed in the IC substrate, wherein the environmental sensor comprises the environmental sensing
material in a configuration sensitive to a change in an environmental characteristic independent of pressure experienced by
the environmental sensor, wherein the environmental sensor is comprised of a plurality of segments of the environmental sensing
material interspersed between and in direct contact with a plurality of metal electrodes, wherein the plurality of metal electrodes
are subjected to a variable electrical environment in response to the change in the environmental characteristic, and wherein
at least one of the plurality of metal electrodes comprises a heating element of the environmental sensor, and wherein the
IC is configured to process data generated by the MEMS acoustic sensing element and the environmental sensor; and

a port disposed in the package configured to receive acoustic waves for the MEMS acoustic sensing element and air for the
environmental sensor; wherein,

the package includes an acoustically sealed back cavity that encompasses the MEMS acoustic sensing element and the IC comprising
the environmental sensor.

US Pat. No. 9,606,191

MAGNETOMETER USING MAGNETIC MATERIALS ON ACCELEROMETER

INVENSENSE, INC., San Jo...

1. A MEMS device comprising:
a single proof mass that moves in a first direction, in response to an ambient acceleration along a first axis and rotates
about a second direction in response to an ambient magnetic field along a second axis,

a first magnetized magnetic material disposed partially on a surface of the single proof mass;
a first spring anchored to a substrate to support the single proof mass;
a first sensing element coupled to the single proof mass and responsive to the motion of the proof mass in the first direction
and responsive to the rotation of the proof mass about the second direction,

a second sensing element coupled to the single proof mass and responsive to the motion of the proof mass in the first direction,
and responsive to the rotation of the single proof mass about the second direction; and

a signal processor coupled to the first and second sensing elements and operable to generate a first output responsive to
the ambient magnetic field along the second axis.

US Pat. No. 10,006,824

MICROELECTROMECHANICAL SYSTEMS (MEMS) PRESSURE SENSOR HAVING A LEAKAGE PATH TO A CAVITY

INVENSENSE, INC., San Jo...

1. A microelectromechanical systems (MEMS) pressure sensor comprising:an enclosure comprising a back cavity, wherein the MEMS pressure sensor is configured to measure a pressure;
a movable membrane positioned between the back cavity and an ambient atmosphere external to the MEMS pressure sensor; and
at least one vent hole fluidly connecting the back cavity to the ambient atmosphere, wherein a vent hole of the at least one vent hole is dispersed at an acute or obtuse angle relative to the back cavity.

US Pat. No. 9,818,037

ESTIMATING HEADING MISALIGNMENT BETWEEN A DEVICE AND A PERSON USING OPTICAL SENSOR

InvenSense, Inc., San Jo...

1. A method for estimating heading misalignment between a device and a person, wherein the device comprises an optical sensor
capable of capturing an image, the method comprising:
capturing an image of the person by the optical sensor;
extracting at least one physical feature of the person from the image; and
estimating a fine misalignment angle between the device and the person using the at least one physical feature of the person
extracted from the image, the fine misalignment angle providing a value of the heading misalignment between the device and
the person, wherein the heading misalignment is a difference between a heading of the device and a direction of motion of
the person.

US Pat. No. 9,804,007

DEVICE AND METHOD FOR SENSOR CALIBRATION

Invensense, Inc., San Jo...

1. A device, comprising:
a MEMS device with at least one sensor;
a thermal element disposed adjacent the MEMS device, the thermal element configured to selectively adjust a temperature of
the MEMS device; and

an adhesive layer disposed adjacent to the MEMS device, the thermal element disposed within the adhesive layer and the adhesive
layer attaches the thermal element to the MEMS device.

US Pat. No. 9,725,305

DUAL CAVITY PRESSURE STRUCTURES

InvenSense, Inc., San Jo...

1. A method comprising:
forming a trench in a first side of a first silicon wafer;
forming a cavity connected to the trench in the first side of the first silicon wafer;
forming an oxide layer on the first side and in the trench;
bonding the first side of the first silicon wafer to a second silicon wafer;
forming a MEMS (micro-electro-mechanical systems) structure in the second silicon wafer;
bonding the second silicon wafer to a third silicon wafer,
removing a portion of a second side of the first silicon wafer, wherein the removing exposes the oxide layer;
setting a pressure within the trench and the cavity; and
forming a layer on the second side of the first silicon wafer, wherein the layer seals the trench, the cavity, and the MEMS
structure.

US Pat. No. 9,650,241

METHOD FOR PROVIDING A MEMS DEVICE WITH A PLURALITY OF SEALED ENCLOSURES HAVING UNEVEN STANDOFF STRUCTURES AND MEMS DEVICE THEREOF

INVENSENSE, INC., San Jo...

1. A method comprising:
coupling a microelectromechanical system (MEMS) substrate and a base substrate, wherein the MEMS substrate and the base substrate
contain at least two enclosures, wherein one of the at least two enclosures has a first vertical gap between the bonding surface
of the MEMS substrate and the bonding surface of the base substrate that is less than a second vertical gap between the bonding
surface of the MEMS substrate and the bonding surface of the base substrate to provide a height difference between the first
vertical gap and the second vertical gap, wherein the MEMS substrate include first and second sets of standoffs with bonding
surfaces on the first and second sets of standoffs, wherein the first and second sets of standoffs are etched from a same
level of a same device layer, and wherein a first length of the first set of standoffs is greater than a second length of
the second set of standoffs to result in the height difference between the first vertical gap and the second vertical gap;

bonding the bonding surfaces of the one of the two enclosures to provide a first sealed enclosure at a first pressure; and
bonding the bonding surfaces of the another of the two enclosures to provide a second sealed enclosure at a second pressure.

US Pat. No. 9,664,660

AIR SENSOR WITH AIR FLOW CONTROL

INVENSENSE, INC., San Jo...

1. An air sensor system comprising:
a speaker cavity;
a speaker positioned in the speaker cavity;
an air channel through which air flows to and/or from the speaker cavity;
a valve in the air channel; and
an air sensor positioned in the air channel.

US Pat. No. 9,926,192

METHODS FOR STICTION REDUCTION IN MEMS SENSORS

INVENSENSE, INC., San Jo...

1. A method of reducing stiction of a MEMS device comprising:depositing a conductive layer directly on top of a substrate;
depositing a dielectric material directly on the conductive layer, wherein the dielectric material is in direct contact with the conductive layer;
patterning the deposited dielectric material to form a bump stop; and
depositing a first conductive layer on the bump stop thereby forming a conductive path,
wherein the bump stop serves to prevent or reduce the effect of a movement by a MEMS actuator coming into contact with the substrate when the MEMS actuator moves towards the substrate and wherein the conductive path for electric charge is collected on the bump stop.

US Pat. No. 9,880,005

METHOD AND SYSTEM FOR PROVIDING A PLURALITY OF NAVIGATION SOLUTIONS

InvenSense, Inc., San Jo...

18. A system for providing a plurality of navigation solutions, comprising:
a) a portable sensor device associated with a user outputting sensor data indicative of movement of the user;
b) a first set of processing conditions configured to derive a first navigation solution using the sensor data, wherein the
first set of processing conditions are implemented by at least one of the portable sensor device, remote processing resources
and at least one additional device; and

c) a second set of processing conditions configured to derive a second navigation solution using the sensor data, wherein
the second set of processing conditions are implemented by at least one of the portable sensor device, remote processing resources
and at least one additional device, wherein the first navigation solution is provided in real time and the second navigation
solution is provided at a time subsequent to the first navigation solution, and wherein the second navigation solution is
refined as compared to the first navigation solution such that the second navigation solution is at least one of: i) more
complete than the first navigation solution and ii) more accurate than the first navigation solution with respect to at least
one quantity included in both the first navigation solution and the second navigation solution.

US Pat. No. 9,862,593

MEMS-CMOS DEVICE THAT MINIMIZES OUTGASSING AND METHODS OF MANUFACTURE

INVENSENSE, INC., San Jo...

1. A method of providing a microelectromechanical device comprising:
providing a passivation layer on a base substrate, wherein the passivation layer comprises an outgassing barrier;
providing at least one conductive via through the passivation layer;
providing a patterned metal layer on the passivation layer, wherein the patterned metal layer is electrically coupled to at
least one interconnect metal in the base substrate through the conductive via, and wherein the patterned metal layer includes
at least one conductive contact layer on the patterned metal layer.

US Pat. No. 9,751,752

METHOD OF FABRICATION OF AL/GE BONDING IN A WAFER PACKAGING ENVIRONMENT AND A PRODUCT PRODUCED THEREFROM

INVENSENSE, INC., San Jo...

1. A microelectromechanical systems (MEMS) device comprising:
a first substrate comprising a MEMS feature and a patterned germanium layer in direct contact with the first substrate; and
a second substrate comprising a patterned aluminum layer, wherein germanium of the patterned germanium layer of the first
substrate is in direct contact with and matched to aluminum of the patterned aluminum layer of the second substrate to form
a hermetic seal ring, wherein the patterned aluminum layer is properly patterned to match the patterned germanium layer in
the area of the hermetic seal ring.

US Pat. No. 9,611,133

FILM INDUCED INTERFACE ROUGHENING AND METHOD OF PRODUCING THE SAME

INVENSENSE, INC., San Jo...

1. A method for roughening a surface, comprising:
layering a first material over a first surface of a second material having a first roughness, wherein the first material and
the second material are different materials;

interdiffusing a portion of the first material and the second material at a predetermined temperature, wherein the interdiffusing
results in formation of a eutectic alloy layer formed between the first material and the second material; and

removing the first material, wherein the removing results in a second surface of the eutectic alloy layer having a second
roughness that is greater than the first roughness.

US Pat. No. 9,784,582

METHOD AND APPARATUS FOR NAVIGATION WITH NONLINEAR MODELS

InvenSense, Inc., San Jo...

1. A navigation module, for providing an integrated navigation solution for a device within a moving platform, the module
comprising:
a receiver for receiving absolute navigational information about the device from an external source, and producing an output
of navigational information indicative thereof,

an assembly of self-contained sensors comprising at least three accelerometers and at least three gyroscopes and capable of
obtaining readings relating to navigational information about the device and producing an output indicative thereof, wherein
said sensor readings may contain sensor errors, and

at least one processor, coupled to receive and integrate the output information from the receiver and the sensor assembly,
operative to produce a navigation solution for the device, wherein the navigation solution consists of estimated position,
velocity and attitude, and programmed to:

utilize a nonlinear error-state model, wherein the error-state model is without approximation, to reduce errors in the estimated
position, velocity and attitude, whereby the processor predicts the errors in the position, velocity and attitude, and the
sensor errors, and utilizes the nonlinear error-state model to relate: a) the errors in the estimated position and velocity,
and b) the errors in the estimated attitude and the sensor errors;

utilize the output information from the receiver to improve the estimation of the errors in the position and velocity, and
whereby the relation of a) and b) indirectly improves the estimation of the errors in the attitude and sensor errors, wherein
the device may be tethered or non-tethered to the moving platform; and

produce a navigation solution compensated by the nonlinear error-state model.

US Pat. No. 9,718,671

MEMS ACOUSTIC SENSOR COMPRISING A NON-PERIMETER FLEXIBLE MEMBER

INVENSENSE, INC., San Jo...

1. A microelectromechanical system (MEMS) acoustic sensor comprising:
a diaphragm disposed parallel to a backplate, the disposition effecting a variable capacitance as measured between the diaphragm
and the backplate as a function of a change in a distance between the diaphragm and the backplate resulting from an interaction
with an impinging pressure wave; and

a flexible spacer member having a first end and a second end opposite and distal from the first end, wherein the first end
of the flexible spacer member is disposed under and adjacent to the diaphragm and wherein the second end of the flexible spacer
member is disposed above and adjacent to the backplate, and wherein the flexible spacer member determines the change in the
distance between the diaphragm and the backplate.

US Pat. No. 9,695,040

MICROPHONE SYSTEM WITH INTEGRATED PASSIVE DEVICE DIE

INVENSENSE, INC., San Jo...

1. A microphone system comprising:
a package including a base and a lid collectively forming an interior chamber;
a MEMS microphone die secured within the interior chamber, the lid forming an aperture to allow acoustic access to the interior
chamber and the MEMS microphone die,
wherein the package comprises a substrate supporting the MEMS microphone die, and the lid is configured to mitigate electromagnetic
interference;
a primary circuit die located within the interior chamber and electrically connected to the MEMS microphone die and comprising
at least one active circuit element;

a secondary lid configured to secure the lid, sandwiching the base,wherein the lid and the secondary lid form the interior chamber,further wherein the MEMS microphone die is configured to receive acoustic signals through the aperture and from a channel
that directs the acoustic signals to the MEMS microphone die,wherein the channel begins at a side aperture located between a side of the lid and a side of the second lid, the side aperture
leading to the base aperture through the base; and
an integrated device die, with only passive circuit elements, electrically connected to the primary circuit die,
wherein the integrated device die is configured to perform at least one of radio frequency (RF) filtering and power supply
decoupling.

US Pat. No. 9,816,819

DEDUCED RECKONING NAVIGATION WITHOUT A CONSTRAINT RELATIONSHIP BETWEEN ORIENTATION OF A SENSOR PLATFORM AND A DIRECTION OF TRAVEL OF AN OBJECT

INVENSENSE, INC., San Jo...

1. A method of determining the direction of travel of an object comprising:
determining a p-frame of an object coupled to a user, an axis of the p-frame being aligned with gravity;
receiving sensor data from a sensor platform;
transforming the sensor data into the p-frame;
generating p-frame data; and
estimating by a system comprising a processor, a direction of travel of the object using the p-frame data.

US Pat. No. 10,564,778

DETERMINING FORCE APPLIED TO AN ULTRASONIC SENSOR

InvenSense, Inc., San Jo...

1. A method for determining force applied to a sensor, the method comprising:receiving a plurality of sensor signals from a sensor, the plurality of sensors signals from a finger interacting with the sensor;
comparing a first data based at least in part on a first sensor signal of the plurality of sensor signals captured at a first time with a second data based at least in part on a second sensor signal of the plurality of sensor signals captured at a second time;
determining a deformation of the finger during interaction with the sensor based on differences between the first data based at least in part on the first sensor signal and the second data based at least in part on the second sensor signal; and
determining a force applied by the finger to the sensor based at least in part on the deformation.