US Pat. No. 10,485,092



1. A multilayer bus board comprising:a multilayer stacked assembly having a plurality of layers including a pair of electrically conductive layers and a dielectric layer disposed between and adjoining each of the conductive layers; and
a molded frame formed of an insulating polymer material, the frame having a peripheral portion encapsulating end portions of the dielectric layer and the conductive layers to maintain the conductive layers and the dielectric layer in position relative to each other, the frame defining an enlarged opening through which an external surface of an outer one of the layers is exposed.

US Pat. No. 9,155,200


Interplex Industries, Inc...

1. A method of fixing reflowable elements on electrical contacts, the method comprising:
providing a strip including a plurality of electrical contacts, each contact including a contact body and a tail portion extending
away from the contact body;

disposing each tail portion of the plurality of electrical contacts adjacent an elongate reflowable member;
moving the elongate reflowable member with respect to the contacts, such that at least a part of each tail portion is inserted
into the reflowable member;

cutting the elongate reflowable member into a plurality of separate reflowable elements, each reflowable element corresponding
to a respective tail portion; and

separating the electrical contacts from the strip.