US Pat. No. 10,714,406

ELECTRONIC POWER MODULE AND ELECTRICAL POWER CONVERTER INCORPORATING SAME

INSTITUT VEDECOM, Versai...

1. Electronic power module having an architecture with 3D stacking, comprising first and second dielectric substrates that are intended to come into thermal contact with first and second heat sinks, respectively, at least one pair of first and second stacked electronic power switching chips and a common intermediate substrate, said first and second electronic power switching chips being sandwiched between said first dielectric substrate and said common intermediate substrate and between said common intermediate substrate and said second dielectric substrate, respectively, wherein said common intermediate substrate is a metal element formed as a single piece and comprises a central portion for implanting said electronic power switching chips, and a thermal conduction portion that is in thermal contact with said first dielectric substrate and/or said second dielectric substrate.

US Pat. No. 10,242,925

ENCAPSULATION OF ELECTRONIC COMPONENTS IN POLYMER MATERIALS

INSTITUT VEDECOM, Versai...

1. An electronic component comprising at least one semiconductor chip and at least one substrate, the semiconductor chip being encapsulated in a polyorganosiloxane-based resin, wherein:The polyorganosiloxane resin results from the curing of a composition comprising at least:
A part (A) comprising at least one polyorganosiloxane (A1) which contains at least two —CH?CH2 groups per molecule,
A part (B) comprising at least one polyorganosiloxane (B1) which comprises:
at least one polyorganosiloxane carrying at least two hydrosilyl Si—H reactive groups per molecule, number average molecular weight (Mn) ranging from 10,000 to 50,000 g/mol, and
at least one polyorganosiloxane carrying at least two hydrosilyl Si—H reactive groups per molecule, number average molecular weight (Mn) ranging from 200 to 5,000 g/mol,
at least one hydrosilylation catalyst (C1),
The components (A1) and (B1) being in quantities such that a molar ratio of Si—H/—CH?CH2 in the composition ranges from 0.5 to 1.4.

US Pat. No. 10,912,191

ELECTRONIC CARD WITH PRINTED CIRCUIT COMPRISING AN INTEGRATED DIFFRACTION STRUCTURE AND METHOD FOR THE PRODUCTION THEREOF

INSTITUT VEDECOM, Versai...

1. An electronic printed circuit board comprising at least one diffraction structure having a cavity and a diffraction plate, wherein said diffraction structure is integrated in the thickness of said electronic printed circuit board, where said cavity is formed in the thickness of said electronic printed circuit board by removal of material, and said diffraction plate is formed in a plate which is applied onto said electronic printed circuit board and which closes said cavity.

US Pat. No. 10,688,860

VEHICLE WITH ELECTRIC MOTOR CONTROLLED BY A POWER FOR SUCH A POWER MODULE

INSTITUT VEDECOM, Versai...

1. A motor vehicle comprising:an electric motor located in a motor compartment of the vehicle, said electric motor being arranged to propel the vehicle;
a passenger compartment of the vehicle separated from the motor compartment by a partition wall;
an energy storage device configured to supply electrical energy to the electric motor;
a power module located between the electric motor and the passenger compartment arranged to shape at least one electrical power signal configured to supply the electric motor;
wherein the vehicle comprises at least one air duct arranged to guide air along a guiding profile between an inlet mouth located on a front portion of said vehicle and an outlet mouth located at the power module.

US Pat. No. 11,032,951

ELECTRONIC SYSTEM COMPRISING AN ELECTRONIC MODULE

INSTITUT VEDECOM, Versai...

1. An electronic power system comprising:a first electronic module and a second electronic module, the first and the second electronic modules each comprising a first heat-conducting substrate, a second electrically conductive substrate, an electronic device arranged between the two substrates, at least one thermal bridge designed to transfer heat between the first substrate and the second substrate, the at least one thermal bridge being separate from the two substrates; and
a third substrate thermally; said third substrate being in the form of a plate sandwiched between the first and second electronic modules and being electrically coupled to:
the second substrate of the first electronic module; and
the second substrate of the second electronic module.

US Pat. No. 10,734,361

POWER SWITCHING MODULE, CONVERTER INTEGRATING THE LATTER AND MANUFACTURING METHOD

INSTITUT VEDECOM, Versai...

1. A power switching module having first and second subassemblies that are superimposed on top of each other to form a stack and respectively comprising first and second electronic power switches forming a bridge arm, the power switching module comprising a metal central sheet at the junction of the first and second subassemblies and first and second metal end sheets forming top and bottom ends of the stack, the first and second metal end sheets being arranged parallel and symmetrically relative to the central metal sheet and being able to be brought to first and second supply voltages (+Vht, ?Vht) of said bridge arm, and said central metal sheet being able to deliver a chopped voltage (VS) produced in said module, said power switching module further comprising first, second and third metal terminal rods that extend in the stack and emerge through at least one of the top and bottom ends of the stack, these first, second and third metal terminal rods being in electrical continuity respectively with the first and second metal end sheets and the central metal sheet.

US Pat. No. 10,734,368

PARALLELISABLE METHOD FOR INTEGRATING POWER CHIPS AND POWER ELECTRONICS

INSTITUT VEDECOM, Versai...

1. A procedure for integrating electronic power chips for the embodiment of a laminated sub-assembly to be used for an integrated electronic power device wherein the procedure includes:producing first and second blanks using space conservation means, each of said blanks being made by lamination of internal isolating and conductive layers on a plate forming a metallic base, at least one electronic chip installed in either of said first and second blanks, and said first and second blanks being made with raised stratification surfaces having complementary profiles;
stacking and interlocking said first and second blanks by their raised surfaces with the complementary profiles; and
press-fitting of said first and second blanks to produce said laminated sub-assembly (BBHS, BBLS).

US Pat. No. 10,530,206

ELECTRIC MACHINE COMPRISING A ROTOR WITH ANGLED INTERIOR PERMANENT MAGNETS

INSTITUT VEDECOM, Versai...

1. A brushless electric machine comprising a rotor with interior permanent magnets wherein the rotor comprises a tubular core having N pairs of longitudinal slots, the slots each having a trapezoidal cross-section, a width La, and a median length L; the two slots of a pair of slots extending on either side of a median radial plane of the rotor, at an angle of 7.5°±1.5°, the core having, in a region of convergence of each pair of slots, a longitudinal channel opening on either side of front ends of the core.

US Pat. No. 10,804,183

METHOD FOR THE INTEGRATION OF POWER CHIPS AND BUS-BARS FORMING HEAT SINKS

INSTITUT VEDECOM, Versai...

1. A method for integrating electronic power chips and bus-bars forming heat sinks for producing an electronic power circuit, characterized in that the method comprises:producing a preform comprising at least one electronic chip between insulating and/or conductive laminated internal layers;
mechanically securing metal bus-bar segments at given spaced-apart positions on opposing upper and lower faces of said preform, using dielectric portions of a resin prepreg; and
for each of said upper and lower opposing faces, electrodepositing a metal layer in order to interconnect bus-bar segments and an electrode of said electronic chip, thereby forming the electronic power circuit comprising bus-bars forming heat sinks.

US Pat. No. 10,994,677

BUSBAR INCLUDING A PLURALITY OF COAXIAL SLEEVES PROVIDED WITH ARMS ENDOWED WITH ELECTRICAL TRACKS

INSTITUT VEDECOM, Versai...

1. A busbar arranged to electrically connect at least one power electronic module from at least one electrical conductor to which the busbar is able to be connected, wherein the busbar includes a plurality of coaxial sleeves, each sleeve including a plurality of arms that are distributed peripherally and radially around an axis of the sleeves, said plurality of arms extending longitudinally parallel to the axis, each arm comprising at least one conductive track forming one of the buses of the busbar.

US Pat. No. 10,998,831

POWER SWITCHING MODULE AND ELECTRONIC POWER DEVICE INTEGRATING SAID MODULE

INSTITUT VEDECOM, Versai...

1. A power module comprising an electronic board in which at least one power switching branch, a capacitor, and at least a first DC supply busbar a second DC supply busbar, and a third DC supply busbar are integrated, wherein said electronic board is mounted between said first busbar and said second busbar, and said capacitor is mounted between said second busbar and said third busbar, and said electronic board, capacitor and busbars comprise electrical contact faces allowing for “press-pack” type mounting of the electronic board and the capacitor.

US Pat. No. 10,978,930

SLEEVE AND SHAFT FOR AN ELECTRICAL MACHINE

INSTITUT VEDECOM, Versai...

1. A sleeve providing a mechanical connection between a shaft of an electrical machine and a rotational bearing of the electrical machine comprising:a first portion arranged to cooperate with the shaft of the electrical machine, and
a second portion arranged to cooperate with the rotational bearing,wherein the first portion defines at least one internal chamber and comprises at least one means of communication between an environment surrounding the sleeve and the internal chamber.

US Pat. No. 10,950,513

METHOD FOR INTEGRATING POWER CHIPS AND POWER ELECTRONICS MODULES

INSTITUT VEDECOM, Versai...

1. A method for integrating electronic power chips for producing a laminated subassembly intended for an integrated electronic power device, the method comprising:producing first and second blanks, each of said blanks being made by laminating insulating and conductive inner layers on a plate forming a metal base, said insulating layer comprising a resin-containing stage B prepreg dielectric portions, at least one said electronic chip being implanted in one or the other of said first and second blanks, and said first and second blanks being made such that their upper lamination surfaces have matching profiles, the profiles of each of said first and second blanks defining at least one cavity which receive said integrated electronic power device;
stacking and fitting said first and second blanks via their upper surfaces with matching profiles, such that said integrated electronic power device is contained in part the at least one cavity of the first blank and in part by the at least one cavity of the second blank; and
press-fitting the first and second blanks in order to produce a laminated subassembly intended for the integrated electronic power device, said press-fitting step comprising maintaining pressure until finalization of the mechanical bonds by polymerization of the resin of the stage B prepreg dielectric portion and of the electrical bonds between the at least one electronic chip, said metal base-forming plates and said conductive inner layers.