US Pat. No. 10,798,823

METHOD FOR MANUFACTURING AN ELECTRONIC MODULE AND ELECTRONIC MODULE

IMBERATEK, LLC, Herndon,...

1. An electronic module, comprising:a first conductive pattern layer and a first insulating-material layer on at least one surface of the first conductive pattern layer,
at least one opening in the first insulating-material layer that extends through the first insulating-material layer,
a component having contact terminals, the component being arranged at least partially within the opening with its contact terminals electrically coupled to the first conductive pattern layer,
a second insulating-material layer provided on the first insulating-material layer, the component being embedded within the second insulating-material layer such that the second insulating-material layer surrounds the component on at least three sides
a second conductive pattern layer embedded between the first and second insulating-material layers, wherein the component extends through the second conductive pattern layer such that an upper surface of the component is higher than an upper surface of the second conductive pattern layer, and
a third conductive pattern layer on at least one surface of the second insulating-material layer.

US Pat. No. 10,765,006

ELECTRONIC MODULE

IMBERATEK, LLC, Herndon,...

1. An electronic module, comprising:a first conductive-pattern layer having a first surface,
a second conductive-pattern layer having a second surface,
a flexible insulating-material layer between the first surface of the first conductive-pattern layer and the second surface of the second conductive-pattern layer,
a component having contact zones between the first surface of the first conductive-pattern layer and the second surface of the second conductive-pattern layer, at least some of the contact zones being electrically connected to the first conductive-pattern layer by solderless and metallurgical connections, said connections each comprising at least one solid contact bump between the first conductive-pattern layer and the respective contact zone, and
a filler around the component, the filler securing the component mechanically to a flexible sheet,
wherein the component is located between the first surface of the first conductive-pattern layer and the second surface of the second conductive-pattern layer and wherein the component is separated from the second surface of the second conductive-pattern layer by the filler.