US Pat. No. 9,288,910

SUBSTRATE WITH BUILT-IN ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING SUBSTRATE WITH BUILT-IN ELECTRONIC COMPONENT

IBIDEN CO., LTD., Ogaki-...

1. A substrate with a built-in electronic component, comprising:
a plurality of resin insulating layers comprising a first resin insulating layer, a second resin insulating layer laminated
on the first resin insulating layer, a third resin insulating layer laminated on the second resin insulating layer, and a
fourth resin insulating layer laminated on the third resin insulating layer;

a plurality of conductor layers comprising a first conductor wiring layer formed on the first resin insulating layer and comprising
a first conductor pad, a second conductor wiring layer formed on the second resin insulating layer and comprising a second
conductor pad, and a third conductor wiring layer formed on the fourth resin insulating layer and comprising a third conductor
pad and a fourth conductor pad;

a plurality of via conductors including a first via conductor formed through the second resin insulating layer and connecting
the first conductor pad and the second conductor pad, a second via conductor formed through the third and fourth resin insulating
layers and connecting the second conductor pad and the third conductor pad, and a third via conductor formed through the fourth
resin insulating layer and connected to the fourth conductor pad; and

an electronic component having a terminal and positioned a cavity formed through the second resin insulating layer and the
third resin insulating layer such that the third via conductor is connecting the terminal of the electronic component and
the fourth conductor pad formed on the fourth resin insulating layer,

wherein the second via conductor comprises filled plating filling an opening portion formed through the third and fourth resin
insulating layers, and the third via conductor comprises filled plating filling an opening portion formed through the fourth
resin insulating layer.

US Pat. No. 9,284,874

SILICOALUMINOPHOSPHATE PARTICLES, HONEYCOMB STRUCTURE, METHOD FOR MANUFACTURING THE SAME AND EXHAUST GAS PURIFYING APPARATUS

IBIDEN CO., LTD., Gifu (...

1. Silicoaluminophosphate particles, wherein a ratio of an amount of Si to a sum of amounts of Al and P is in a range of 0.16
to 0.33, a specific surface area is in a range of 250 m2/g to 450 m2/g, and an external surface area is in a range of 10 m2/g to 35 m2/g.

US Pat. No. 9,257,217

INDUCTOR ELEMENT, METHOD FOR MANUFACTURING INDUCTOR ELEMENT, AND WIRING BOARD

IBIDEN CO., LTD., Ogaki-...

1. A wiring board, comprising:
a substrate having an opening portion; and
an inductor element positioned in the opening portion of the substrate and comprising a support layer, a first conductive
layer formed on the support layer and having a first inductor pattern and a first pad formed at one end portion of the first
inductor pattern, a first insulation layer formed on the support layer and the first conductive layer and comprising a magnetic
material layer and a resin layer, a second conductive layer formed on the first insulation layer and having a second inductor
pattern and a second pad formed at one end portion of the second inductor pattern, and a via conductor formed through the
resin layer of the first insulation layer and connecting the first conductive layer and the second conductive layer,

wherein the magnetic material layer of the first insulation layer is covering at least a portion of the first inductor pattern,
the resin layer of the first insulation layer is covering the first pad and has an opening portion exposing at least a portion
of the first pad, and the via conductor is formed in the opening portion of the resin layer of the first insulation layer
such that the via conductor is physically out of contact with the magnetic material layer.

US Pat. No. 9,282,635

MULTILAYER WIRING BOARD WITH BUILT-IN ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME

IBIDEN CO., LTD., Ogaki-...

1. A multilayer wiring board with a built-in electronic component, comprising: a substrate; a conductor layer formed on a
surface of the substrate; at least one electronic component positioned in a cavity formed through the substrate; an insulating
layer formed on the substrate such that the insulating layer is formed on the electronic component in the cavity of the substrate;
and a wiring layer formed on the insulating layer, wherein the conductor layer has an opening portion formed such that the
cavity of the substrate is formed in the opening portion of the conductor layer and that the conductor layer has a first side
in the opening portion and a second side in the opening portion on an opposite side across the cavity with respect to the
first side, and the cavity is formed in the opening portion of the conductor layer such that a ratio S1/S2 satisfies 1.0

US Pat. No. 9,232,656

WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

IBIDEN CO., LTD., Ogaki-...

1. A wiring board, comprising:
a substrate having an opening portion;
a plurality of electronic devices positioned in the opening portion such that the electronic devices are arrayed in a lateral
direction of each of the electronic devices; and

an insulation layer formed on the substrate such that the insulation layer covers the electronic devices in the opening portion
of the substrate,

wherein the substrate has a wall surface defining the opening portion such that the wall surface is partially partitioning
the opening portion and keeping the electronic devices from making contact with each other, and the wall surface of the substrate
has a pair of protrusions positioned such that tips of the protrusions face each other.

US Pat. No. 9,101,070

METHOD FOR MANUFACTURING MULTILAYER PRINTED WIRING BOARD

IBIDEN CO., LTD., Ogaki-...

12. A method for manufacturing a multilayer printed wiring board, comprising:
providing a core substrate;
laminating a resin insulation layer on the core substrate;
forming a capacitor section coupled to the resin insulation layer by:
providing a first electrode comprising a first metal,
providing a second electrode opposing the first electrode, the second electrode comprising a second metal having a smaller
ionization tendency than an ionization tendency of the first metal forming the first electrode, and

providing a dielectric layer interposed between the first and second electrode;
forming an outermost insulating layer over the capacitor section;
forming a ground pad on the outermost insulating layer and electrically connected to the first electrode; and
forming a power source pad on the outermost insulating layer and electrically connected to the second electrode, wherein said
forming a capacitor section comprises:

forming a sputter film by sputtering on an inner surface of the first electrode, and
forming a sol-gel film using a sol-gel method on an inner surface of the second electrode which opposes the inner surface
of the first electrode such that a dielectric layer is formed by the sputter film and the sol-gel film.

US Pat. No. 9,245,838

SEMICONDUCTOR ELEMENT

IBIDEN CO., LTD., Ogaki-...

1. A multilayer device, comprising:
a resin layer;
a semiconductor device positioned in the resin layer and comprising an electronic component and a passivation layer having
an opening exposing an electrode of the electronic component;

an intermediate layer comprising a plurality of metal layers and formed in the opening of the passivation layer such that
the intermediate layer is connected to the electrode of the electronic component; and

a buildup layer formed on the resin layer and comprising an insulating layer and a via conductor formed in the insulating
layer such that the via conductor is connected to the intermediate layer,

wherein the resin layer comprises at least one resin material selected from the group consisting of a thermosetting resin
material and a thermoplastic resin material.

US Pat. No. 9,156,743

CARBON COMPONENT AND METHOD FOR MANUFACTURING THE SAME

IBIDEN CO., LTD., Ogaki-...

1. A carbon component comprising:
a first carbon plate member having a first mating surface, a first outer surface other than the first mating surface, and
a first groove provided on the first mating surface; and

a second carbon plate member having a second mating surface, a second outer surface other than the second mating surface,
and a second groove provided on the second mating surface,

wherein the first carbon plate member is connected to the second carbon plate member so that the first mating surface is in
contact with the second mating surface and the fits groove and the second groove define a hole extending along the first mating
surface and the second mating surface between the first mating surface and the second mating surface, and

wherein the first outer surface, the second outer surface, and an inner surface of the hole are covered with a ceramic coating.

US Pat. No. 9,307,645

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD

IBIDEN Co., Ltd., Ogaki-...

1. A printed wiring board, comprising:
a core substrate;
a first buildup layer formed on a first surface of the core substrate and comprising an insulation layer and a conductive
layer;

a second buildup layer formed on a second surface of the core substrate on an opposite side with respect to the first buildup
layer and comprising an insulation layer and a conductive layer; and

an inductor device positioned in the second buildup layer and comprising a resin insulation layer and a coil layer formed
on the resin insulation layer,

wherein the second buildup layer has a cavity in which the inductor device is accommodated.

US Pat. No. 9,155,196

WIRING BOARD

IBIDEN CO., LTD., Ogaki-...

1. A wiring board, comprising:
a substrate having a laminated-inductor forming portion and comprising a plurality of first insulation layers and a second
insulation layer formed on a first side of the plurality of first insulation layers such that the plurality of first insulation
layers has the laminated-inductor forming portion; and

a planar conductor formed on the second insulation layer of the substrate and configured to shield electromagnetic force generated
from the laminated-inductor forming portion of the substrate,

wherein the laminated-inductor forming portion of the substrate has a plurality of inductor patterns formed on the first insulation
layers and a plurality of via conductors connecting the inductor patterns through the first insulation layers, and the plurality
of inductor patterns includes an uppermost inductor pattern formed between the second insulation layer and the plurality of
first insulation layers such that the uppermost inductor pattern has a distance of 100 ?m or more from the planar conductor.

US Pat. No. 9,258,897

WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

IBIDEN CO., LTD., Ogaki-...

1. A wiring board, comprising:
a laminated structure having a recessed portion on a first-surface side of the laminated structure and a solder resist layer
on a second-surface side of the laminated structure on an opposite side of the first-surface side,

wherein the laminated structure has a first-surface side pad formed on a bottom surface of the recessed portion and a second-surface
side pad formed on the second-surface side of the laminated structure, laminated structure has a first opening portion and
a second opening portion formed on the second-surface side, the first opening portion is exposing the second-surface side
pad, the second opening portion is formed on a back face of the recessed portion such that the back face of the recessed portion
does not include a pad on the second-surface side of the laminated structure, and the second opening portion has a depth which
is a same as or less than a thickness of the solder resist.

US Pat. No. 9,226,409

METHOD FOR MANUFACTURING A WIRING BOARD

IBIDEN CO., LTD., Ogaki-...

1. A method for manufacturing a wiring board, comprising:
forming a first penetrating hole in a substrate such that the first penetrating hole penetrates through the substrate between
a first surface of the substrate and a second surface of the substrate on an opposite side of the first substrate;

forming a first through-hole conductor on an inner wall of the first penetrating hole of the substrate;
forming a first conductive circuit on the first surface;
forming a second conductive circuit on the second surface of the substrate such that the second conductive circuit is connected
to the first conductive circuit by the first through-hole conductor;

filling a filler inside the first through-hole conductor;
forming a second penetrating hole in the filler;
forming a second through-hole conductor by filling a conductive material in the second penetrating hole;
forming an interlayer insulation layer on the substrate and one of the first conductive circuit and the second conductive
circuit;

forming a third conductive circuit on the interlayer insulation layer; and
forming at a position shifted from the center of the second through-hole conductor in a direction parallel to the first surface
of the substrate a via conductor in the interlayer insulation layer such that the second through-hole conductor and the third
conductive circuit are connected by the via conductor.

US Pat. No. 9,113,575

WIRING BOARD WITH BUILT-IN ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME

IBIDEN CO., LTD., Ogaki ...

1. A wiring board with a built-in electronic component, comprising:
a substrate having an accommodation portion;
an electronic component having an electrode and accommodated in the accommodation portion of the substrate;
an adhesive layer formed in the accommodation portion of the substrate such that the adhesive layer is positioning the electronic
component in the accommodation portion of the substrate;

a conductive layer having a wiring conductive pattern and a planar conductive pattern formed directly on a surface of the
substrate such that the planar conductive pattern is formed directly on a surface of the adhesive layer and extending over
the electrode of the electronic component; and

at least one via conductor formed in the adhesive layer such that the via conductor is connecting the planar conductive pattern
of the conductive layer and the electrode of the electronic component,

wherein the conductive layer is formed such that the wiring conductive pattern and the planar conductive pattern have a same
thickness, the electrode of the electronic component has a portion which faces the planar conductive pattern of the conductive
layer and which has a plurality of outer edges facing outward with respect to a surface of the electronic component on which
the portion of the electrode is formed, and the planar conductive pattern of the conductive layer has a portion positioned
directly over at least one of the outer edges of the electrode of the electronic component.

US Pat. No. 9,091,198

INSULATOR AND EXHAUST SYSTEM OF INTERNAL-COMBUSTION ENGINE

IBIDEN CO., LTD., Gifu (...

1. An insulator having an inner surface for covering an exhaust system of an internal-combustion engine, comprising:
a cover member having a surface;
a joint member formed on the surface of the cover member; and
a mat member made of material including at least one of ceramic fibers and glass fibers, the mat member being attached to
the cover member through binding of the fibers to the joint member, and the mat member being exposed to form the inner surface,

wherein the joint member includes one or more projections sticking out from the surface of the cover member, each of the projections
having a hook part mounted thereto,

wherein the mat member has needle traces where fibers of the needle traces are entangled with each other,
wherein the one or more projections and the hook part are entangled with the needle traces so as to securely fix the mat member
to the cover member, and

wherein the hook part is any one of triangular plate, a quadrangular plate, and a trapezoidal plate, and is fixed to the projection
by welding.

US Pat. No. 9,060,446

PRINTED CIRCUIT BOARD

IBIDEN CO., LTD., Ogaki-...

1. A printed circuit board, comprising:
a resin substrate having a penetrating opening portion formed through the resin substrate;
a chip capacitor device accommodated in the penetrating opening portion of the resin substrate; and
a buildup structure formed on the resin substrate such that the buildup structure covers the chip capacitor device in the
penetrating opening portion of the resin substrate,

wherein the buildup structure is configured to mount an IC chip device on a surface of the buildup structure such that the
IC chip device is mounted directly over the chip capacitor device, the chip capacitor device has a dielectric body having
a surface facing the buildup structure, a first electrode formed on the dielectric body and extending on the surface of the
dielectric body, and a second electrode formed on the dielectric body and extending on the surface of the dielectric body,
the dielectric body is interposed between the first electrode and the second electrode, and the buildup structure has a stacked
via structure comprising a plurality of filled via structures formed directly on one another such that the stacked via structure
is connected to one of the first electrode and the second electrode of the chip capacitor through the buildup structure.

US Pat. No. 9,084,381

METHOD FOR MANUFACTURING FLEX-RIGID WIRING BOARD

IBIDEN CO., LTD., Ogaki-...

1. A method for manufacturing a flex-rigid wiring board, comprising:
forming a structure comprising a rigid base material and a flexible substrate;
forming a separator over the rigid base material;
laminating a plurality of insulation layers over the rigid base material and flexible substrate of the structure such that
at least one insulation layer is formed over the separator on the rigid base material; and

removing the separator from the structure such that a portion of the insulation layer is removed together with the separator
from the structure and that a recessed portion configured to accommodate an electronic component is formed in the plurality
of insulation layers over the rigid base material of the structure,

wherein the separator is formed in one of the plurality of insulation layers over the rigid base material.

US Pat. No. 9,060,459

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING SAME

IBIDEN CO., LTD., Ogaki-...

1. A printed wiring board, comprising:
a plurality of conductive layers having a plurality of conductive circuits;
a plurality of resin insulation layers including an uppermost resin insulation layer positioned as an outermost layer of the
plurality of resin insulation layers;

a plurality of via conductors formed in the plurality of resin insulation layers, respectively, and connecting the plurality
of conductive circuits in the plurality of conductive layers; and

a plurality of component-loading pads each comprising a metal foil and positioned to load an electronic component,
wherein the resin insulation layers and the conductive layers are alternately laminated, and the component-loading pads are
formed on a roughened surface of the uppermost resin insulation layer and have top surfaces and side surfaces exposed over
the roughened surface of the uppermost resin insulation layer such that the top surfaces and side surfaces of the component-loading
pads are configured to mount a plurality of solder structures, respectively.

US Pat. No. 9,066,435

WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

IBIDEN CO., LTD., Ogaki-...

1. A wiring board, comprising:
a first insulation layer;
a second insulation layer formed on the first insulation layer;
a wiring structure interposed between the first insulation layer and the second insulation layer and comprising an insulation
layer and a plurality of conductive patterns formed on the insulation layer;

a plurality of conductive patterns formed on the second insulation layer; and
a via conductor formed through the second insulation layer and connected to one of the conductive patterns on the second insulation
layer,

wherein the wiring structure further comprises an outer insulation layer formed on the insulation layer and covering the conductive
patterns in the wiring structure, a via conductor penetrating through the outer insulation layer and a conductive pad connected
to the via conductor.

US Pat. No. 9,126,869

METHOD FOR MANUFACTURING ALUMINUM-TITANATE-BASED CERAMIC HONEYCOMB STRUCTURE

IBIDEN CO., LTD., Ogaki-...

1. A method for manufacturing a ceramic honeycomb structure, comprising:
kneading titania particles, alumina particles and a binder ingredient such that a raw material paste comprising the titania
particles, the alumina particles and the binder ingredient is prepared;

forming a body comprising the raw material paste and having a honeycomb structure such that the body has the honeycomb structure
having a plurality of through-holes extending in a longitudinal direction of the body and a plurality of partition portions
formed between the through-holes;

drying the body comprising the raw material paste and having the honeycomb structure at a drying temperature in a range of
50° C. to 250° C. such that the body maintains a temperature difference of from 5° C. to 20° C. between a surface temperature
at an outer surface of the body and a temperature at a central portion of the body and a dried body having the honeycomb structure
is formed prior to sintering; and

sintering the dried body having the honeycomb structure at a sintering temperature in a range of 1350° C. to 1650° C. such
that a ceramic body comprising aluminum titanate and having the honeycomb structure is formed,

wherein the drying of the body includes determining an output condition of heat to be applied to the body and controlling
an output of heat being applied to the body based on the output condition.

US Pat. No. 9,101,054

MULTILAYER PRINTED WIRING BOARD

IBIDEN Co., Ltd., Ogaki-...

1. A multilayer printed wiring board comprising:
a core substrate having a signal through-hole conductor formed through the core substrate;
an interlayer insulation layer formed on the core substrate and having a via conductor formed through the interlayer insulation
layer; and

a conductor layer formed on the interlayer insulation layer and connected to the via conductor in the interlayer insulation
layer,

wherein the core substrate comprises a multilayer insulation structure, an outer power conductor layer formed on a first surface
of the multilayer insulation structure, an outer ground conductor layer formed on a second surface of the multilayer insulation
structure, an inner power conductor layer formed inside the multilayer insulation structure and an inner ground conductor
layer formed inside the multilayer insulation structure, each of the inner ground conductor layer and the inner power conductor
layer has a tapered end portion having a tapered angle satisfying 2.8 substrate is penetrating through the inner ground conductor layer and the inner power conductor layer and insulated from the
inner ground conductor layer and the inner power conductor layer, and the inner power conductor layer and the inner ground
conductor layer are positioned between the outer power conductor layer and the outer ground conductor layer such that the
inner power conductor layer is positioned between the inner ground conductor layer and the outer ground conductor layer and
that the inner ground conductor layer is positioned between the outer power conductor layer and the inner power conductor
layer.

US Pat. No. 9,102,114

METHOD FOR MANUFACTURING ALUMINUM-TITANATE-BASED CERAMIC HONEYCOMB STRUCTURE

IBIDEN CO., LTD., Ogaki-...

1. A method for manufacturing a ceramic body having a honeycomb structure, comprising:
bringing titania particles, alumina particles and a sintering additive into contact with each other such that the sintering
additive, the titania particles and the alumina particles are adhered to each other and form a precursor comprising particles
comprising the sintering additive, the titania particles and the alumina particles;

combining the precursor with a binder material such that a raw material paste comprising the precursor and the binder material
is prepared;

forming a body comprising the raw material paste and having a honeycomb structure; and
sintering the body having the honeycomb structure such that a ceramic body having the honeycomb structure is formed,
wherein the sintering additive is mullite particles, the precursor has an amount-of-substance ratio of titania to alumina
such that the ceramic body comprises titania in an amount of 22 wt. % to 40 wt. % and alumina in an amount of 59.3 wt. % to
65 wt. % with respect to an entire weight of the ceramic body, and the amount-of-substance ratio of titania to alumina in
the precursor is derived based on a sum of alumina derived from the alumina particles and alumina derived from the mullite
particles.

US Pat. No. 9,401,320

COMBINED SUBSTRATE

IBIDEN CO., LTD., Ogaki ...

1. A combined substrate, comprising:
a first substrate having a plurality of first metal posts;
a second substrate having a plurality of second metal posts such that the plurality of second metal posts is positioned to
oppose the plurality of first metal posts, respectively;

a plurality of solder structures interposed between the plurality of first metal posts and the plurality of second metal posts,
respectively; and

a CPU device positioned in a space formed between the first substrate and the second substrate,
wherein at least one of the plurality of first metal posts and the plurality of second metal posts has a plurality of recessed
surfaces configured such that the plurality of solder structures is formed on the plurality of recessed surfaces, respectively,
the first substrate has a plurality of pads and a plurality of solder balls positioned such that the ads and solder balls
are mounting the CPU device on the first substrate, and the plurality of solder structures has a melting point which is lower
than a melting point of the plurality of solder balls.

US Pat. No. 9,074,705

EXHAUST PIPE AND METHOD FOR MANUFACTURING EXHAUST PIPE

IBIDEN CO., LTD., Ogaki-...

8. An exhaust pipe comprising:
a base material made of a metal;
a surface coating layer provided on a surface of said base material, the surface coating layer comprising an amorphous inorganic
material; and

an information display comprising a character portion and a background portion, at least one of said character portion and
said background portion being located in said surface coating laver,

wherein said surface coating layer includes a first. part of the surface coating layer in which the character portion is located
and a second part of the surface coating layer in which the background portion is located, and at least one of the first part
of the surface coating layer and the second part of the surface coating layer includes a crystalline inorganic material,

wherein a chemical composition of the first part of the surface coating layer is different from a chemical composition of
the second part of the surface coating layer, and

wherein one of the first part of the surface coating layer and the second surface coating layer has a composition comprising
the amorphous inorganic material and the crystalline inorganic, material, and another of the first part of the surface coating
layer and the second surface coating layer has a composition consisting of the amorphous inorganic material, or

the amorphous inorganic, material, the crystalline inorganic material, both of the amorphous inorganic material and the crystalline
inorganic material, or an amount of the crystalline inorganic material relative to an amount of the amorphous inorganic material
in said surface coating layer is different between the first part of the surface coating layer and the second part of the
surface coating layer.

US Pat. No. 9,439,289

WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

IBIDEN CO., LTD., Ogaki-...

1. A wiring board, comprising:
a substrate having an opening structure extending through the substrate such that the opening structure comprises a plurality
of opening portions and at least one boundary portion partitioning the opening portions arrayed and penetrating through the
substrate;

a through-hole conductor formed in the opening structure such that the through-hole conductor is penetrating through the boundary
portion of the opening structure in the substrate;

a plurality of electronic devices positioned in the opening structure such that the plurality of electronic devices is accommodated
in the plurality of opening portions of the opening structure, respectively;

a conductive pattern formed on a surface of the boundary portion; and
an insulation layer formed on the substrate such that the insulation layer is covering the conductive pattern on the boundary
portion and the plurality of electronic devices in the plurality of opening portions of the opening structure in the substrate,

wherein the conductive pattern on the boundary portion has an opening portion formed in the conductive pattern on the boundary
portion, and the through-hole conductor is formed in a position corresponding to the opening portion formed in the conductive
pattern on the boundary portion such that the through-hole conductor and the conductive pattern on the boundary portion are
electrically insulated from each other.

US Pat. No. 9,049,808

PRINTED WIRING BOARD AND A METHOD OF MANUFACTURING A PRINTED WIRING BOARD

IBIDEN CO., LTD., Ogaki-...

1. A printed wiring board, comprising:
a core substrate formed of a single layer having a thickness in a range of from about 0.06 mm to about 0.40 mm and a thermal
expansion coefficient ? in a range of from 5×10?6 to 8×10?6;

a first conductive circuit formed directly on a first surface of the core substrate;
a second conductive circuit formed directly on a second surface of the core substrate on an opposite side with respect to
the first surface;

a through-hole conductor formed in a penetrating hole extending from the first surface to the second surface of the core substrate
and connecting the first conductive circuit and the second conductive circuit;

at least one first interlayer insulation layer formed on the first surface of the core substrate; and
at least one second interlayer insulation layer formed on the second surface of the core substrate,
wherein the core substrate, the first interlayer insulation layer and the second interlayer insulation layer satisfy an equation,
?/(E×(a+b+c))=0.5×10?6˜2.5×10?6/GPa·mm·K, where the thermal expansion coefficient of the core substrate is set at ?, Young's modulus of the core substrate
is E, a thickness of the core substrate is a, a sum of a thickness of the first interlayer insulation layer is b, and a sum
of a thickness of the second interlayer insulation layer is c.

US Pat. No. 9,510,447

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

IBIDEN CO., LTD., Ogaki-...

1. A printed wiring board, comprising:
a resin insulation layer;
a first conductive layer formed on a first-surface side of the resin insulation layer such that the first conductive layer
is embedded into a first surface of the resin insulation layer;

a second conductive layer formed on a second-surface side of the resin insulation layer such that the second conductive layer
is formed on a second surface of the resin insulation layer;

a via conductor formed in the resin insulation layer such that the via conductor is penetrating through the resin insulation
layer and electrically connecting the first conductive layer and the second conductive layer; and

a solder-resist layer formed on the first surface of the resin insulation layer such that the solder-resist layer is covering
the first conductive layer and having an opening structure forming an exposed structure of the first conductive layer,

wherein the exposed structure of the first conductive layer is configured to connect an electronic component to the first
conductive layer, and the first conductive layer has a barrier-metal layer embedded into the first surface of the resin insulation
layer and a metal layer formed on the barrier-metal layer such that the barrier-metal layer is formed on a surface of the
first conductive layer and comprises a metal different from a metal forming the metal layer and that the metal layer is formed
on a surface of the barrier-metal layer in the exposed structure of the first conductive layer and protruding from the first
surface of the resin insulation layer.

US Pat. No. 9,265,158

INDUCTOR COMPONENT AND PRINTED WIRING BOARD INCORPORATING INDUCTOR COMPONENT AND METHOD FOR MANUFACTURING INDUCTOR COMPONENT

IBIDEN Co., Ltd., Ogaki-...

1. A printed wiring board, comprising:
a core substrate having a cavity portion;
an inductor component accommodated in the cavity portion of the core substrate;
a filler resin filling a gap formed between the core substrate and the inductor component in the cavity portion of the core
substrate; and

a first buildup layer formed on a first surface of the core substrate and on the inductor component,
wherein the inductor component comprises at least one coil layer forming a wiring pattern on a plane, at least one second
insulation layer formed on the coil layer and comprising an insulating resin material, a plurality of electrodes including
an input electrode and an output electrode and formed on the second insulation layer, and a plurality of via conductors formed
in the second insulation layer and connecting the coil layer and the electrodes, the inductor component is accommodated in
the cavity portion of the core substrate such that the plurality of electrodes faces the first surface of the core substrate,
and the first buildup layer includes a first interlayer resin insulation layer formed on the first surface of the core substrate
and on the inductor component, a conductive layer formed on the first interlayer resin insulation layer, and a plurality of
connection via conductors connecting the conductive layer and the electrodes in the inductor component.

US Pat. No. 9,215,811

METHOD FOR MANUFACTURING MULTI-PIECE SUBSTRATE AND MULTI-PIECE SUBSTRATE

IBIDEN CO., LTD., Ogaki-...

1. A multi-piece substrate, comprising:
a first frame having a connecting portion; and
a first piece substrate having a joint portion engaged with the connecting portion of the first frame and a joint conductive
pattern formed on a periphery portion of the joint portion of the first piece substrate such that the joint conductive pattern
formed on the periphery portion of the joint portion is positioned only along the periphery of the joint portion of the first
piece substrate,

wherein the joint portion of the first piece substrate is fitted into the connecting portion of the first frame and has a
contour corresponding to periphery of the connecting portion of the first frame.

US Pat. No. 9,055,668

METHOD OF FABRICATING A MULTI-PIECE BOARD

IBIDEN CO., LTD., Ogaki-...

1. A fabrication method for a multi-piece board, comprising:
forming a first recess in a joint portion connecting a defective piece and a frame of a first board;
separating the defective piece from the frame such that a first fitting portion having the first recess is formed in the frame
of the first board;

forming a second recess in a joint portion connecting a defect-free piece and a frame of a second board;
cutting out the defect-free piece from the frame of the second board such that the defect-free piece having a second fitting
portion including the second recess is separated from the second board;

positioning the defect-free piece to the frame of the first board such that the second fitting portion of the defect-free
piece fits in the first fitting portion in the frame of the first board and that the second recess of the defect-free piece
and the first recess in the frame of the first board form a third recess;

filling an adhesive material in the third recess formed of the first recess and the second recess; and
adhering the frame of the first board and the defect-free piece,
wherein the defective piece comprises a printed wiring board, and the defect-free piece comprises a printed wiring board.

US Pat. No. 9,232,638

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

IBIDEN CO., LTD., Ogaki-...

1. A printed wiring board, comprising:
a core substrate comprising a resin and an inorganic fiber;
a first buildup layer formed on a first surface of the core substrate and comprising a plurality of resin insulating layers
and a plurality of first conductive layers; and

a second buildup layer formed on a second surface of the core substrate on an opposite side of the core substrate with respect
to the first surface and comprising a plurality of resin insulating layers and a plurality of second conductive layers,

wherein the plurality of first conductive layers in the first buildup layer has a sum V1 of volumes which is greater than a sum V2 of volumes of the plurality of second conductive layers in the second buildup layer, the core substrate has a first-surface
side portion which has a resin amount greater than a resin amount of a second-surface side portion of the core substrate where
a boundary line between the first-surface side portion and second-surface side portion of the core substrate is set with respect
to a center line in a thickness direction of the core substrate, and the first and second buildup layers are formed such that
a ratio V1/V2 of the V1 to the V2 satisfies 1 of the core substrate is in a range of 10 wt % to 20 wt %.

US Pat. No. 9,287,034

PRINTED WIRING BOARD, INDUCTOR COMPONENT, AND METHOD FOR MANUFACTURING INDUCTOR COMPONENT

IBIDEN CO., LTD., Ogaki-...

19. A method for manufacturing an inductor component, comprising:
forming a support layer on a support substrate;
forming a first conductive pattern on the support layer;
forming on the support layer and the first conductive pattern a magnetic layer comprising a magnetic material and a resin
material and having a first penetrating hole penetrating through the magnetic layer such that the first penetrating hole extends
to the first conductive pattern;

forming a resin layer on the magnetic layer such that the resin layer covers the magnetic layer, that the resin layer fills
the first penetrating hole formed in the magnetic layer and that an interlayer insulation layer comprising the magnetic layer
and the resin layer is formed on the support layer;

forming a second penetrating hole penetrating through the resin layer such that the second penetrating hole passes through
the first penetrating hole in the magnetic layer and extends to the first conductive pattern;

forming a second conductive pattern on the resin layer of the interlayer insulation layer;
forming a via conductor in the second penetrating hole such that the via conductor connects the first conductive pattern and
the second conductive pattern and that the via conductor is not in contact with the magnetic layer of the interlayer insulation
layer; and

removing the support substrate from the support layer.

US Pat. No. 9,474,158

PRINTED WIRING BOARD

IBIDEN CO., LTD., Ogaki ...

1. A wiring board, comprising:
a first resin insulation layer;
an electronic component positioned on a first surface of the first resin insulation layer;
a second resin insulation layer formed on the first surface of the first resin insulation layer such that the second resin
insulation layer is embedding the electronic component on the first surface of the first resin insulation layer;

a conductive layer formed on the second resin insulation layer;
a third resin insulation layer formed on the conductive layer and the second resin insulation layer; and
a connection via conductor formed in the second resin insulation layer such that the connection via conductor is connecting
an electrode of the electronic component and the conductive layer on the second resin insulation layer,

wherein the first resin insulation layer has a pad structure formed on a second surface side of the first resin insulation
layer on an opposite side with respect to the first surface, and the first resin insulation layer has a coefficient of thermal
expansion which is set lower than a coefficient of thermal expansion of the second resin insulation layer and a coefficient
of thermal expansion of the third resin insulation layer.

US Pat. No. 9,226,382

PRINTED WIRING BOARD

IBIDEN CO., LTD., Ogaki-...

1. A printed wiring board, comprising:
a first resin insulation layer;
a second resin insulation layer formed on the first insulation layer and having an opening portion;
a second conductive layer formed on the second resin insulation layer;
a mounting conductive layer formed on the first resin insulation layer in the opening portion of the second resin insulation
layer such that the mounting conductive layer has a surface exposed by the opening portion;

an electronic component positioned in the opening portion of the second resin insulation layer such that the electronic component
is mounted on the surface of the mounting conductive layer;

a filler resin structure formed on the electronic component and the second resin insulation layer, the filler resin structure
comprising a resin material filling a space formed between the second resin insulation layer and the electronic component;

a third conductive layer formed on the filler resin structure;
a plurality of via conductors formed through the filler resin structure, the plurality of via conductors including a first
via conductor connected to an electrode of the electronic component and a second via conductor connecting the third conductive
layer formed on the filler resin structure and the second conductive layer formed on the second resin insulation layer; and

a heat-dissipating via conductor formed in the first resin insulation layer such that the heat-dissipating via conductor is
connected to the mounting conductive layer formed on the first resin insulation layer,

wherein the heat-dissipating via conductor is a filled via comprising a plated material filling an opening formed through
the first resin insulation layer, and the mounting conductive layer comprise a plated material same as the plated material
of the heat-dissipating via conductor.

US Pat. No. 9,420,697

METHOD FOR MANUFACTURING PRINTED WIRING BOARD

IBIDEN Co., Ltd., Ogaki-...

1. A method for manufacturing a printed wiring board, comprising:
forming an interlayer insulation layer on a conductive circuit;
applying laser to a portion of the interlayer insulation layer such that an opening reaching to the conductive circuit is
formed for a via conductor;

subjecting the opening to a plasma treatment using a processing gas which includes a reactive gas comprising a fluorovinyl
ether gas having a double bond of two carbon atoms and a fluoroalkyl ether group;

forming an upper conductive circuit on the interlayer insulation layer; and
forming a via conductor in the opening such that the via conductor connects the conductive circuit and the upper conductive
circuit,

wherein the plasma treatment is a 60-Hz non-equilibrium plasma treatment under an atmospheric pressure, and the reactive gas
is at least one of trifluorovinyl(pentafluoroallyl) ether and decafluoro-3-oxa-1,6-heptadiene.

US Pat. No. 9,161,445

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD

IBIDEN CO., LTD., Ogaki-...

1. A printed wiring board, comprising:
a resin layer;
a plurality of pads formed on the resin layer and positioned to be connected to an electronic component; and
a solder-resist layer formed on the resin layer and exposing upper surfaces of the pads and portions of side walls of the
pads,

wherein each of the pads has a metal layer such that the metal layer is formed on each of the upper surfaces of the pads and
each of the portions of the side walls of the pads exposed by the solder-resist layer, and the plurality of pads is positioned
such that the electronic component is wire-bonded to the pads.

US Pat. No. 9,526,168

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

IBIDEN CO., LTD., Ogaki ...

1. A printed wiring board, comprising:
an inner conductive-circuit layer;
an insulation layer structure comprising a first insulation layer laminated on the inner conductive-circuit layer and a second
insulation layer laminated on the first insulation layer; and

an outermost conductive-circuit layer laminated on the insulation layer structure and comprising a plurality of connection
portions such that the plurality of connection portions is positioned to mount a component on the insulation layer structure,

wherein the second insulation layer is interposed between the first insulation layer and the outermost conductive-circuit
layer and has a thickness which is smaller than a thickness of the first insulation layer such that an outer surface of the
second insulation layer on an outermost conductive-circuit-layer side is flatter than an inner surface of the second insulation
layer on a first insulation-layer side.

US Pat. No. 9,277,650

COMBINED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

IBIDEN CO., LTD., Ogaki-...

1. a combined wiring board, comprising: a plurality of wiring boards; and a connected metal frame comprising a plurality of
metal frames and at least one connecting portion such that the plurality of metal frames is connected each other by the connecting
portion and has a plurality of accommodation opening portions configured to accommodate the wiring boards, respectively, wherein
each of the metal frames has a coefficient of thermal expansion which is higher than a coefficient of thermal expansion of
each of the wiring boards with respect to a direction of main surfaces of the metal frames and a direction of main surfaces
of the wiring boards.

US Pat. No. 9,287,250

PACKAGE SUBSTRATE

IBIDEN CO., LTD., Ogaki-...

1. A package substrate, comprising:
an inner resin insulating interlayer;
a first conductor layer formed on the inner resin insulating interlayer;
a second conductor layer on which the inner resin insulating interlayer is formed;
an outermost resin insulating interlayer formed on the first conductor layer;
an outermost conductor layer formed on the outermost resin insulating interlayer and comprising a plurality of first pads
and a plurality of second pads such that the plurality of first pads is positioned to mount a first electronic component on
the outermost resin insulating interlayer and the plurality of second pads is positioned to mount a second electronic component
on the outermost resin insulating interlayer;

a plurality of outermost via conductors formed through the outermost resin insulating interlayer such that the plurality of
outermost via conductors is connecting the first conductor layer and the outermost conductor layer; and

a plurality of skip via conductors formed through the outermost resin insulating interlayer and the inner resin insulating
interlayer such that the plurality of skip via conductors is connecting the outermost conductor layer and the second conductor
layer,

wherein the first conductor layer includes a first conductor circuit connecting two of the outermost via conductors, and the
outermost conductor layer includes an outermost conductor circuit connecting one of the two of the outermost via conductors
and one of the skip via conductors such that the first conductor circuit, the two of the outermost via conductors, the outermost
conductor circuit and the one of the skip via conductors form a connection path connecting one of the second pads and the
second conductor layer.

US Pat. No. 9,326,377

PRINTED WIRING BOARD

IBIDEN Co., Ltd., Ogaki ...

1. A printed wiring board, comprising:
a first buildup layer comprising a first interlayer resin insulating layer and a second interlayer resin insulating layer;
and

a second buildup layer formed on the first buildup layer and comprising an outermost interlayer resin insulating layer and
an outermost conductive layer formed on the outermost interlayer resin insulating layer,

wherein the first buildup layer includes a first signal line interposed between the first interlayer resin insulating layer
and the second interlayer resin insulating layer, a first ground layer formed on a surface of the first interlayer resin insulating
layer, and a second ground layer formed on a surface of the second interlayer resin insulating layer such that the first signal
line is interposed between the first ground layer and the second ground layer, the first and second interlayer resin insulating
layers in the first buildup layer and the outermost interlayer resin insulating layer in the second buildup layer comprise
resin materials, respectively, such that each of the first and second interlayer resin insulating layers in the first buildup
layer comprises a single material, and the first and second interlayer resin insulating layers in the first buildup layer
are different in material, thickness or a combination thereof from the outermost interlayer resin insulating layer in the
second buildup layer.

US Pat. No. 9,320,153

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

IBIDEN CO., LTD., Ogaki-...

1. A printed wiring board, comprising:
an interlayer resin insulation layer having a penetrating hole;
a conductive circuit formed on a first surface of the interlayer resin insulation layer;
a filled via conductor formed in the penetrating hole of the interlayer resin insulation layer and connected to the conductive
circuit;

a first surface-treatment coating structure formed on a first surface of the filled via conductor and comprising an electroless
plating structure; and

a second surface-treatment coating structure formed on a second surface of the filled via conductor on an opposite side with
respect to the first surface-treatment coating structure and comprising an electroless plating structure,

wherein the filled via conductor comprises a first conductive layer formed on a side wall of the penetrating hole and a plated
material filling the penetrating hole, and the first surface-treatment coating structure has a thickness which is different
from a thickness of the second surface-treatment coating structure.

US Pat. No. 9,199,188

METHOD OF MANUFACTURING HONEYCOMB STRUCTURED BODY

IBIDEN CO., LTD., Ogaki-...

1. A method of manufacturing a honeycomb structured body, comprising:
forming a ceramic block by binding multiple pillar-shaped honeycomb fired bodies with adhesive layers interposed therebetween,
the multiple pillar-shaped honeycomb fired bodies each having cells longitudinally disposed in parallel with each other and
cell walls between the cells, each cell wall of the multiple pillar-shaped honeycomb fired bodies having a thickness of about
0.1 mm to about 0.2 mm and each peripheral wall of the multiple pillar-shaped honeycomb fired bodies having a thickness of
about 0.25 mm to about 0.5 mm, the forming the ceramic block comprising:

binding the multiple pillar-shaped honeycomb fired bodies on a support by piling up the multiple pillar-shaped honeycomb fired
bodies successively, the binding comprising:

determining a placing position where a primary honeycomb fired body is to be placed;
fixing a position of an end face of at least one secondary honeycomb fired body by applying force to the end face of the at
least one secondary honeycomb fired body, the at least one secondary honeycomb fired body being a honeycomb fired body whose
side face is to be opposite to a side face of the primary honeycomb fired body below the placing position;

placing the primary honeycomb fired body on the placing position with the position of the end face of the at least one secondary
honeycomb fired body being fixed; and

the fixing further comprising:
first positioning or second positioning based on a number of the at least one secondary honeycomb fired body before the fixing,
the at least one secondary honeycomb fired body each being placed on a position where a side face of the at least one secondary
honeycomb fired body is opposite to a side face of the primary honeycomb fired body to be placed; and

when the at least one secondary honeycomb fired body includes one secondary honeycomb fired body, the first positioning being
performed to fix a position of an end face of only the single secondary honeycomb fired body, or

when the at least one secondary honeycomb fired body includes multiple secondary honeycomb fired bodies, the second positioning
being performed to fix positions of first end faces of only the multiple secondary honeycomb fired bodies so as to align the
positions of the first end faces of the multiple secondary honeycomb fired bodies.

US Pat. No. 9,119,322

WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

IBIDEN CO., LTD., Ogaki-...

1. A wiring board, comprising:
a substrate having an opening portion;
a plurality of electronic components positioned in the opening portion of the substrate and including a first electronic component
and a second electronic component; and

an insulation layer formed over the substrate and the first electronic component and second electronic component of the plurality
of electronic components,

wherein the first electronic component has a first electrode having a side portion formed on a first side surface of the first
electronic component and a second electrode having a side portion formed on a second side surface of the first electronic
component on an opposite side of the first side surface of the first electronic component, the second electronic component
has a first electrode having a side portion formed on a first side surface of the second electronic component and a second
electrode having a side portion formed on a second side surface of the second electronic component on an opposite side of
the first side surface of the second electronic component, the first electrode of the first electronic component and the first
electrode of the second electronic component are set to have substantially a same electric potential, and the first electronic
component and the second electronic component are positioned in the opening portion of the substrate such that the side portion
of the first electrode of the first electronic component is beside the side portion of the first electrode of the second electronic
component.

US Pat. No. 9,113,574

WIRING BOARD WITH BUILT-IN ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME

IBIDEN CO., LTD., Ogaki-...

1. A wiring board with a built-in electronic component, comprising:
a core substrate having a cavity portion and at least one side wall forming the cavity portion, the at least one side wall
extending from a first surface of the core substrate to a second surface opposite to the first surface;

an electronic component accommodated in the cavity portion of the core substrate and comprising a body portion and a plurality
of conductive portions formed on a surface of the body portion;

a filling resin filling a space formed in the cavity portion having the electronic component positioned in the cavity portion;
and

a resin insulation layer formed on the core substrate such that the resin insulation layer is covering an opening of the cavity
portion and a surface of the electronic component,

wherein the core substrate has an inclination suppressing structure formed on the at least one side wall forming the cavity
portion such that a distance between the side wall forming the cavity portion and the electronic component varies in a first
portion of the side wall having the inclination suppressing structure and a second portion of the side wall other than the
first portion having the inclination suppressing structure, the inclination suppressing structure comprises a protrusion portion
protruding toward the electronic component from the side wall forming the cavity portion or a recess portion recessed away
from the electronic component; and the inclination suppressing structure is formed such that when one of the first and second
portions comes into contact with the electronic component, the other of the first and second portions is separated from the
electronic component by a gap which extends along the side wall from the first surface to the second surface of the core substrate.

US Pat. No. 9,402,318

PRINTED WIRING BOARD

IBIDEN CO., LTD., Ogaki ...

1. A wiring board, comprising: a first resin insulation layer; a conductive layer formed on the first resin insulation layer
and comprising a first conductive circuit and a second conductive circuit formed adjacent to the first conductive circuit
such that each of the first conductive circuit and the second conductive circuit has a bottom portion in contact with the
first resin insulation layer and an upper portion on the bottom portion; and
a second resin insulation layer formed on the first resin insulation layer such that the second resin insulation layer is
covering top end portions of the first conductive circuit and second conductive circuit and filling a space between the first
conductive circuit and the second conductive circuit, wherein the first conductive circuit and the second conductive circuit
are formed such that a distance between the first conductive circuit and the second conductive circuit is in a range of 10
um or less at the first resin insulation layer, each of the first conductive circuit and the second conductive circuit is
formed such that the upper portion has a roughened sidewall and the bottom portion has a sidewall which is not roughened,
the roughened sidewall of each of the first conductive circuit and the second conductive circuit has a length in a range of
T/3 to 2T/3, Where T is a thickness of the first conductive circuit, and each of the first conductive circuit and the second
conductive circuit has a line width increasing towards the first resin insulation layer.

US Pat. No. 9,655,249

SUBSTRATE WITH BUILT-IN CAPACITOR AND METHOD FOR MANUFACTURING SUBSTRATE WITH BUILT-IN CAPACITOR

IBIDEN CO., LTD., Ogaki-...

1. A substrate with a built-in capacitor, comprising:
an insulating base material layer;
a build-up layer formed on the insulating base material layer and comprising a conductor layer and an insulating layer; and
a multilayer ceramic capacitor positioned in an opening portion of the insulating base material layer and comprising a plurality
of internal electrodes, a plurality of ceramic dielectric layers and a pair of external electrodes,

wherein the multilayer ceramic capacitor has a cuboid shape having long sides and short sides, the pair of external electrodes
is formed on opposing long-side sides such that the external electrodes are separated by a distance in a range of 30 ?m to
200 ?m and that each of the external electrodes comprises a conductive paste layer connected to a respective group of the
internal electrodes and a copper plated layer covering the conductive paste layer, the conductive paste layer comprises one
of a Ni paste and a Cu paste including a glass component in a range of 5% to 40%, and the build-up layer has a plurality of
first via conductors and a plurality of second via conductors such that the first via conductors are connected to one of the
external electrodes of the multilayer ceramic capacitor and the second via conductors are connected to the other one of the
external electrodes of the multilayer ceramic capacitor.

US Pat. No. 9,313,901

PRINTED WIRING BOARD

IBIDEN CO., LTD., Ogaki ...

1. A printed wiring board, comprising:
an insulative resin substrate having a penetrating hole;
a first conductive layer formed on a first surface of the insulative resin substrate;
a second conductive layer formed on a second surface of the insulative resin substrate on an opposite side with respect to
the first surface; and

a through-hole conductor formed in the penetrating hole and connecting the first conductive layer and the second conductive
layer,

wherein the through-hole conductor includes a seed layer formed on an inner wall of the penetrating hole, a first electrolytic
plated layer formed on the seed layer such that the first electrolytic plated layer is filling a space formed by the seed
layer in the penetrating hole and forming recessed portions at end portions of the penetrating hole, respectively, and a plurality
of second electrolytic plated layers filling the recessed portions formed by the first electrolytic plated layer, respectively,
and the second electrolytic plated layers comprise electrolytic plating having an average crystalline particle diameter which
is greater than an average crystalline particle diameter of electrolytic plating forming the first electrolytic plated layer.

US Pat. No. 9,277,655

COMBINED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

IBIDEN CO., LTD., Ogaki-...

1. A combined wiring board, comprising: a wiring board set comprising a plurality of wiring boards and at least one adhesive
agent portion such that the wiring boards are connected each other by the adhesive agent portion;
and a metal frame having an accommodation opening portion configured to accommodate the wiring board set such that the wiring
board set is positioned in the accommodation opening portion of the metal frame, wherein the metal frame has a coefficient
of thermal expansion which is higher than a coefficient of thermal expansion of the wiring board set with respect to a direction
of a main surface of the metal frame and a direction of a main surface of the wiring board set.

US Pat. No. 9,271,405

FLEX-RIGID WIRING BOARD AND METHOD OF MANUFACTURING THE SAME

IBIDEN CO., LTD., Ogaki-...

1. A method for manufacturing a flex-rigid wiring board, comprising:
positioning a flexible board and a non-flexible substrate adjacent to each other;
forming a metal layer over the flexible board such that the metal layer is configured to stop laser irradiation from reaching
into the flexible board;

forming an insulating layer such that the insulating layer covers the metal layer, the flexible board and the non-flexible
substrate;

irradiating laser upon the insulating layer such that the metal layer and a portion of the insulating layer covering the metal
layer are cut; and

removing the metal layer and the portion of the insulating layer covering the metal layer from the flexible board such that
at least a portion of the flexible board is exposed,

wherein the flexible board and the non-flexible substrate are separate structures in the positioning, and the flexible board
has a flexible substrate and a conductor pattern formed over the flexible substrate.

US Pat. No. 9,192,045

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD

IBIDEN CO., LTD., Ogaki ...

1. A printed wiring board, comprising:
an insulative substrate having a penetrating hole;
a first conductive layer formed on a first surface of the insulative substrate;
a second conductive layer formed on a second surface of the insulative substrate; and
a through-hole conductor formed in the penetrating hole through the insulative substrate such that the through-hole conductor
is connecting the first conductive layer and the second conductive layer,

wherein the penetrating hole has a first opening portion formed on a first-surface side of the insulative substrate and a
second opening portion formed on a second-surface side of the insulative substrate such that the second opening portion has
a depth which is greater than a depth of the first opening portion and the second opening portion has a volume which is greater
than a volume of the first opening portion, and the through-hole conductor formed in the second opening portion includes a
void portion.

US Pat. No. 9,222,186

METHOD FOR MANUFACTURING PRINTED WIRING BOARD

IBIDEN CO., LTD., Ogaki-...

1. A method for manufacturing a printed wiring board, comprising:
forming a through hole in an insulating substrate such that the through hole extends from a first surface of the insulating
substrate to a second surface of the insulating substrate on an opposite side with respect to the first surface of the insulating
substrate;

forming a seed layer on the first surface of the insulating substrate, the second surface of the insulating substrate, and
a wall of the through hole; and

applying pulse plating to the insulating substrate via the seed layer such that a through-hole conductor is formed in the
through hole,

wherein the applying of the pulse plating includes flowing a forward current and a reverse current on the first surface of
the insulating substrate and flowing a forward current and a reverse current on the second surface of the insulating substrate
such that when the forward current flows on the first surface of the insulating substrate, the reverse current flows on the
second surface of the insulating substrate.

US Pat. No. 9,554,462

PRINTED WIRING BOARD

IBIDEN CO., LTD., Ogaki-...

1. A printed wiring board, comprising:
a multilayer core substrate;
a first buildup layer formed on a first surface of the multilayer core substrate and comprising an interlayer resin insulation
layer and a conductive layer;

a second buildup layer formed on a second surface of the multilayer core substrate and comprising an interlayer resin insulation
layer and a conductive layer; and

an end-surface through hole conductor formed along a side surface of the first buildup layer, a side surface of the multilayer
core substrate and a side surface of the second buildup layer such that the end-surface through hole conductor is connecting
the conductive layer of the first buildup layer and the conductive layer of the second buildup layer,

wherein the multilayer core substrate includes a first conductive layer, a middle conductive layer, a second conductive layer,
a first insulation layer interposed between the first conductive layer and the middle conductive layer and a second insulation
layer interposed between the second conductive layer and the middle conductive layer, and the middle conductive layer is connected
to the end-surface through-hole conductor and has a thickness which is greater than thicknesses of the first and second conductive
layers.

US Pat. No. 9,078,343

METHOD FOR MANUFACTURING PRINTED WIRING BOARD

IBIDEN CO., LTD., Ogaki-...

1. A method for manufacturing a printed wiring board, comprising:
preparing a core substrate;
forming a penetrating hole in the core substrate;
forming a first conductor on a first surface of the core substrate;
forming a second conductor on a second surface of the core substrate on an opposite side of the first surface of the core
substrate; and

filling a conductive material in the penetrating hole such that a through-hole conductor is formed in the penetrating hole
and the first conductor and the second conductor are connected via the through-hole conductor,

wherein the forming of the penetrating hole comprises forming a first opening portion in the first surface of the core substrate,
forming a second opening portion from a bottom portion of the first opening portion toward the second surface such that the
second opening portion forms a first bent portion connected to the first opening portion and has a diameter which is smaller
than a diameter of the first opening portion, forming a third opening portion in the second surface of the core substrate,
and forming a fourth opening portion from a bottom portion of the third opening portion toward the first surface such that
the fourth opening portion forms a second bent portion connected to the third opening portion and a third bend portion connected
to the second opening portion and has a diameter which is smaller than a diameter of the third opening portion, the first
opening portion inclines at an angle ?1 and the second opening portion inclines at an angle ?2 such that ?1>?2 is satisfied with respect to an axis normal to the first and second surfaces, and the third opening portion inclines at an
angle ?3 and the fourth opening portion inclines at an angle ?4 such that ?3>?4 is satisfied with respect to the axis normal to the first and second surfaces.

US Pat. No. 9,078,366

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

IBIDEN CO., LTD., Ogaki-...

1. A printed circuit board, comprising:
a core substrate;
a first conductive pattern formed on a first surface of the core substrate;
a second conductive pattern formed on a second surface of the core substrate on an opposite side of the core substrate with
respect to the first surface; and

a through hole conductor formed through the core substrate and comprising a plated material such that the through hole conductor
is connecting the first conductive pattern and the second conductive pattern,

wherein the plated material of the through hole conductor is formed in a through hole formed in the core substrate such that
the plated material is filling the through hole of the core substrate, the core substrate includes an insulation layer including
an inorganic fiber material and a resin material, a first resin layer formed on one surface of the insulation layer and having
the first surface of the core substrate, and a second resin layer formed on an opposite surface of the insulation layer and
having the second surface of the core substrate, the first and second resin layers are formed such that the first and second
resin layers do not contain an inorganic fiber material and a sum of thicknesses of the first and second resin layers is set
in a range of 20% or less of a thickness of the core substrate, the first resin layer of the core substrate includes an inorganic
filler material, the second resin layer of the core substrate includes an inorganic filler material, and the first resin layer
of the core substrate includes the inorganic filler material such that an amount of the inorganic filler material in the first
resin layer decreases from the insulation layer toward the first surface of the core substrate.

US Pat. No. 9,363,891

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

IBIDEN CO., LTD., Ogaki-...

1. A printed wiring board, comprising:
an outermost resin insulation layer having a first surface and a second surface on an opposite side with respect to the first
surface; and

a plurality of conducting structures formed in the outermost resin insulation layer such that the plurality of conducting
structures is positioned in an electronic component mounting region of the outermost resin insulation layer,

wherein each of the conducting structures is formed in an opening formed in the outermost resin insulation layer such that
each of the conducting structures extends from the first surface to the second surface of the outermost resin insulation layer,
each of the conducting structures comprises a pad comprising copper on a first surface side of the outermost resin insulation
layer, a conductive circuit formed on the second surface of the outermost resin insulation layer and a via conductor connecting
the pad and the conductive circuit, the pad comprises an embedded portion embedded in the outermost resin insulation layer
and a protruding portion protruding from the embedded portion beyond the first surface of the outermost resin insulation layer,
the embedded portion has an external shape which is greater than an external shape of the protruding portion such that the
embedded portion has an upper surface recessed from the first surface of the outermost resin insulating layer, and each of
the conducting structures comprises a plated-film formed on a surface of the protruding portion and the upper surface of the
embedded portion and has a thickness such that when a solder bump is reflowed on the pad, the plated-film is fused into the
solder bump and the solder bump is formed directly on the pad.

US Pat. No. 9,538,651

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

IBIDEN CO., LTD., Ogaki-...

1. A printed wiring board, comprising:
a resin insulating layer;
a first conductor layer embedded into a first surface of the resin insulating layer and comprising a plurality of connecting
portions positioned to connect an electronic component;

a second conductor layer projecting from a second surface of the resin insulating layer on an opposite side of the resin insulating
layer with respect to the first surface;

a solder resist layer formed on the first surface of the resin insulating layer such that the solder resist layer is covering
the first conductor layer and has an opening structure exposing the plurality of connecting portions of the first conductor
layer;

a barrier metal layer formed on the plurality of connecting portions of the first conductor layer such that the barrier metal
layer is projecting from the first surface of the resin insulating layer; and

a plurality of metal posts formed on the barrier metal layer such that the plurality of metal posts is positioned on the plurality
of connecting portions of the first conductor layer, respectively,

wherein the plurality of metal posts is formed such that each of the metal posts has a width which is greater than a width
of a respective one of the connecting portions, and the barrier metal layer comprises a metal material which is different
from a metal material forming the metal posts and a metal material forming the first conductor layer.

US Pat. No. 9,451,711

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD

IBIDEN CO., LTD., Ogaki ...

1. A printed wiring board, comprising:
an insulating substrate having a penetrating hole formed through the insulating substrate;
a first conductive pattern formed on a first surface of the insulating substrate;
a second conductive pattern formed on a second surface of the insulating substrate on an opposite side with respect to the
first surface of the insulating substrate; and

a through-hole conductor formed in the penetrating hole in the insulating substrate such that the through-hole conductor is
connecting the first conductive pattern on the first surface of the insulating substrate and the second conductive pattern
on the second surface of the insulating substrate,

wherein the penetrating hole has a first opening portion opening on the first surface of the insulating substrate, a second
opening portion opening on the second surface of the insulating substrate and a third opening portion connecting the first
opening portion and the second opening portion, the third opening portion has the maximum diameter which is greater than the
minimum diameter of the first opening portion and the minimum diameter of the second opening portion, and the insulating substrate
comprises a resin material and a plurality of sheets each comprising a reinforcement material.

US Pat. No. 9,357,660

PRINTED CIRCUIT BOARD, AND METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD

IBIDEN CO., LTD., Ogaki-...

1. A printed circuit board, comprising:
a core substrate;
an electronic component device comprising an inductor component and a passive component forming a low pulse filter for an
IC chip such that the low pulse filter is accommodated in a single opening portion formed in the core substrate;

a wiring structure connecting the inductor component and the passive component in the electronic component device;
a filler resin body filling a space formed between the core substrate and the electronic component device positioned in the
opening portion of the core substrate;

a first buildup layer comprising a first interlayer resin insulation layer formed on a first surface of the core substrate,
a first conductive layer formed on the first interlayer resin insulation layer, and a first via conductor formed in the first
interlayer resin insulation layer; and

a second buildup layer comprising a second interlayer resin insulation layer formed on a second surface of the core substrate
on an opposite side with respect to the first surface of the core substrate, a second conductive layer formed on the second
interlayer resin insulation layer, and a second via conductor formed in the second interlayer resin insulation layer,

wherein the wiring structure comprises a connection circuit portion formed on the first interlayer resin insulation layer
and a plurality of connection via conductors formed through the first interlayer resin insulation layer and connected to the
connection circuit portion such that a first connection via conductor of the connection via conductors is connected to an
output electrode of the inductor component and a second connection via conductor of the connection via conductors is connected
to a power source electrode of the passive component.

US Pat. No. 9,263,784

PACKAGE SUBSTRATE

IBIDEN CO., LTD., Ogaki-...

1. A package substrate, comprising:
a core substrate;
a first buildup layer formed on a first surface of the core substrate; and
a second buildup layer formed on a second surface of the core substrate on an opposite side with respect to the first surface
of the core substrate,

wherein the first buildup layer comprises an uppermost insulating resin interlayer, an upper inner insulating resin interlayer,
an uppermost conductive layer formed on the uppermost insulating resin interlayer and including a plurality of first pads
positioned to mount a first electronic component and a plurality of second pads positioned to mount a second electronic component,
an upper first conductive layer formed on the upper inner insulating resin interlayer, an upper second conductive layer formed
on the upper inner insulating resin interlayer on an opposite side with respect to the upper first conductive layer, a plurality
of conductive vias formed through the uppermost insulating resin interlayer such that the plurality of conductive vias is
connecting the upper first conductive layer and the second pads, and a plurality of conductive skip vias formed through the
uppermost insulating resin interlayer and the upper inner insulating resin interlayer such that the plurality of conductive
skip vias is connecting the uppermost conductive layer and the upper second conductive layer, and the second buildup layer
comprises a lowermost insulating resin interlayer, a lower inner insulating resin interlayer, a lowermost conductive layer
formed on the lowermost insulating resin interlayer and including a plurality of third pads, a lower first conductive layer
formed on the lower inner insulating resin interlayer, a lower second conductive layer formed on the lower inner insulating
resin interlayer on an opposite side with respect to the lower first conductive layer, a plurality of conductive vias formed
through the lowermost insulating resin interlayer such that the plurality of conductive vias is connecting the lower first
conductive layer and the third pads, and a plurality of conductive skip vias formed through the lowermost insulating resin
interlayer and the lower inner insulating resin interlayer such that the plurality of conductive skip vias is connecting the
lowermost conductive layer and the lower second conductive layer.

US Pat. No. 9,560,769

PRINTED WIRING BOARD

IBIDEN CO., LTD., Ogaki-...

1. A printed wiring board, comprising:
a core substrate having a first cavity and a second cavity;
a plurality of first electronic components accommodated in the first cavity of the core substrate;
a plurality of second electronic components accommodated in the second cavity of the core substrate; and
a build-up layer formed on the core substrate and comprising an insulating resin interlayer such that the insulating resin
interlayer is covering the first cavity and the second cavity,

wherein the core substrate has a first projection structure partitioning the first electronic components in the first cavity
and a second projection structure partitioning the second electronic components in the second cavity, and the first and second
cavities and the first and second projection structures are formed in the core substrate such that T1

US Pat. No. 9,044,830

METHOD FOR FORMING CAVITY, APPARATUS FOR FORMING CAVITY, METHOD FOR MANUFACTURING CIRCUIT BOARD, AND CIRCUIT BOARD

IBIDEN CO., LTD., Ogaki-...

1. A method for forming a cavity in a core substrate, comprising:
setting a start position on a closed loop line having a circumference L in ?m for a core substrate;
consecutively irradiating laser from a laser irradiating device upon a flat board for the core substrate such that a plurality
of laser-processed holes each having a diameter ? in ?m is formed in the flat board; and

moving the laser irradiating device in a loop from the start position of the closed loop line along the closed loop line such
that a penetrating hole penetrating through the flat board is formed in the flat board for the core substrate,

wherein the start position of a first loop by the laser irradiating device is set as a base position on the closed loop line,
the moving of the laser irradiating device includes shifting the start position by a distance d after each loop and controlling
the laser irradiating device such that the moving of the laser irradiating device in the loop satisfies p=?di, m?L/p and M=m×n, where i=1 to n, n represents a number of loops by the laser irradiating device and is a natural number
of 2 or greater, p represents a processing pitch of the laser-processed holes, m represents a number of the laser-processed
holes in each loop and is a natural number, ?di is a total distance shifted from the base position for the start position of the laser irradiating device after an i-th loop,
and M is a number of the laser-processed holes formed by the number of loops along the closed loop line and is a natural number.

US Pat. No. 9,332,657

MULTILAYER PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING MULTILAYER PRINTED WIRING BOARD

IBIDEN Co., Ltd., Ogaki-...

1. A multilayer printed wiring board, comprising: a core substrate comprising a metal member and having a first surface and
a second surface on an opposite side of the first surface; a first buildup structure comprising a first insulation layer formed
on the first surface of the core substrate, a first conductive circuit formed on the first insulation layer and a plurality
of interlayer insulation layers; a second buildup structure comprising a second insulation layer formed on the second surface
of the core substrate, a second conductive circuit formed on the second insulation layer and a plurality of interlayer insulation
layers; a through-hole conductor penetrating through the core substrate, the first insulation layer and the second insulation
layer such that the through-hole conductor is connecting the first conductive circuit and the second conductive circuit; and
an electronic component accommodated in an accommodation portion formed through the core substrate, the first insulation layer
and the second insulation layer, wherein the metal member of the core substrate has a side surface having a concave portion
which is recessed toward center of the metal member in a planar direction with respect to the core substrate, and the concave
portion is covered with a resin derived from at least one of the interlayer insulation layers, wherein: the plurality of interlayer
insulation layers of the first buildup structure includes a first interlayer insulation layer formed on the first insulation
layer such that the first interlayer insulation layer covers the first conductive circuit and the electronic component and
a third interlayer insulation layer formed on the first interlayer insulation layer; the plurality of interlayer insulation
layer of the second buildup structure includes a second interlayer insulation layer formed on the second insulation layer
such that the second interlayer insulation layer covers the second conductive circuit and the electronic component and a fourth
interlayer insulation layer formed on the second interlayer insulation layer; the metal member has a first penetrating hole,
a first filler filling the first penetrating hole, a second penetrating hole and a second filler filling the second penetrating
hole; the through-hole conductor is formed inside a third penetrating hole penetrating through the first insulation layer,
the second insulation layer and the first filler; the electronic component is accommodated in a fourth penetrating hole forming
the accommodation portion and penetrating through the first insulation layer, the second insulation layer and the second filler;
and the fourth penetrating hole is filled with a third filler such that the electronic component is secured in the accommodation
portion, wherein each of the first and second filler is a resin derived from at least one of the first insulation layer and
the second insulation layer, and the third filler is a resin derived from at least one of the first interlayer insulation
layer and the second interlayer insulation layer.

US Pat. No. 9,307,643

SUBSTRATE WITH BUILT-IN ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING SUBSTRATE WITH BUILT-IN ELECTRONIC COMPONENT

IBIDEN CO., LTD., Ogaki-...

1. A substrate having a built-in electronic component, comprising:
an insulating substrate having an opening portion;
a conductor pattern formed on the insulating substrate;
an electronic component accommodated in the opening portion of the insulating substrate and having a terminal;
an insulating layer formed on the insulating substrate such that the insulating layer is covering the conductor pattern on
the insulating substrate and the electronic component in the opening portion of the insulating substrate; and

a plurality of via conductors penetrating through the insulating layer and comprising a first via conductor reaching to the
conductor pattern on the insulating substrate and a second via conductor reaching to the terminal of the electronic component
in the opening portion of the insulating substrate,

wherein the conductive pattern has a recessed connecting portion connected to the first via conductor, the terminal of the
electronic component has a recessed connecting portion connected to the second via conductor, and the recessed connecting
portion of the conductor pattern has a depth which is greater than a depth of the recessed connecting portion of the terminal
of the electronic component.

US Pat. No. 9,113,569

WIRING BOARD AND METHOD FOR MANUFACTURING SAME

IBIDEN CO., LTD., Ogaki-...

1. A wiring board, comprising:
a core structure having a first surface and a second surface on an opposite side of the first surface;
a first buildup structure formed on the first surface of the core structure and comprising a plurality of insulation layers;
and

a second buildup structure formed on the second surface of the core structure and comprising a plurality of insulation layers
and an inductor device,

wherein the insulation layers in the second buildup structure have thicknesses which are thinner than thicknesses of the insulation
layers in the first buildup structure, and the inductor device in the second buildup structure is positioned on the second
surface of the core structure and includes at least a portion of a first conductive pattern of the core structure, a plurality
of conductive patterns formed on the insulation layers in the second buildup structure and a plurality of via conductors formed
in the insulation layers in the second buildup structure such that the conductive patterns of the inductor device on different
layers are connected by the via conductors.

US Pat. No. 9,510,450

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

IBIDEN CO., LTD., Ogaki-...

1. A printed wiring board, comprising:
a resin insulation layer;
a first conductive layer formed on a first-surface side of the resin insulation layer such that the first conductive layer
is embedded into a first surface of the resin insulation layer and has a surface exposed on the first surface of the resin
insulation layer;

a second conductive layer formed on a second-surface side of the resin insulation layer such that the second conductive layer
is formed on a second surface of the resin insulation layer and is protruding from the second surface of the resin insulation
layer;

a via conductor formed in the resin insulation layer such that the via conductor is penetrating through the resin insulation
layer and electrically connecting the first conductive layer and the second conductive layer;

a solder-resist layer formed on the first surface of the resin insulation layer such that the solder-resist layer is covering
the first conductive layer and has an opening structure forming an exposed structure of the first conductive layer; and

a metal layer formed on the exposed structure of the first conductive layer such that the metal layer is protruding from the
first surface of the resin insulation layer,

wherein the exposed structure of the first conductive layer comprises a plurality of pads positioned to mount an electronic
component to the first conductive layer, and the metal layer has a solder layer formed on the metal layer and having a flat
surface and has a side surface formed such that at least a portion of the side surface is receded inward with respect to a
side surface of the solder layer.

US Pat. No. 9,603,248

WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

IBIDEN CO., LTD., Ogaki-...

1. A wiring board, comprising:
a board structure comprising a core insulation layer, a first conductive layer formed on a first surface of the core insulation
layer, a first laminated structure formed over the first surface of the core insulation layer and the first conductive layer,
a second conductive layer formed on a second surface of the core insulation layer on an opposite side of the core insulation
layer with respect to the first surface of the core insulation layer, and a second laminated structure formed over the second
surface of the core insulation layer and the second conductive layer; and

a stacked conductor structure formed in the board structure and comprising a through-hole conductor penetrating through the
core insulation layer and a via conductor formed in the first laminated structure,

wherein the through-hole conductor has a though-hole portion formed in a through hole penetrating through the core insulation
layer and a first land portion formed on the first surface of the core insulation layer such that the through-hole portion
has a first end portion, a second end portion and a narrowed portion formed between the first end portion and the second end
portion, the first conductive layer includes the first land portion of the through-hole conductor, the first laminated structure
includes an interlayer insulation layer in which the via conductor is formed, the via conductor in the first laminated structure
is stacked on the first land portion of the through-hole conductor such that the stacked conductor structure comprising the
through-hole conductor and the via conductor is formed through the core insulation layer and the interlayer insulation layer
of the first laminated structure, the stacked conductor structure is formed such that the through-hole portion of the through-hole
conductor has the first end portion connected to the first land portion of the through-hole conductor, that the first end
portion of the through-hole portion has a width which is set greater than a width of a bottom surface of the via conductor
connected to the first land portion of the through-hole conductor and smaller than a width of a top surface of the via conductor
in the first laminated structure and that the narrowed portion has a width which is set smaller than the width of the bottom
surface of the via conductor connected to the first land portion of the through-hole conductor, the stacked conductor structure
comprises a plating material filling the through hole in the core insulation layer, the second laminated structure comprises
an interlayer insulation layer and a via conductor formed in the interlayer insulation layer of the second laminated structure,
the through-hole conductor has a second land portion formed on the second surface of the core insulation layer and connected
to the second end portion of the through-hole portion, the second conductive layer includes the second land portion of the
through-hole conductor, the through-hole portion of the through-hole conductor becomes narrower from the first end portion
toward the narrowed portion and from the second end portion toward the narrowed portion, the stacked conductor structure includes
the through-hole conductor, the via conductor in the first laminated structure stacked on the first land portion of the through-hole
conductor, and the via conductor in the second laminated structure stacked on the second land portion of the through-hole
conductor such that the narrowed portion has the width which is set smaller than the width of the bottom surface of the via
conductor connected to the second land portion of the through-hole conductor, and the second end portion of the through-hole
conductor has a width which is set greater than the width of the bottom surface of the via conductor connected to the second
land portion of the through-hole structure and smaller than a width of a top surface of the via conductor connected to the
second land portion of the through-hole structure.

US Pat. No. 9,655,242

PRINTED WIRING BOARD

IBIDEN CO., LTD., Ogaki-...

1. A printed wiring board, comprising:
a first resin insulating layer having a plurality of concave portions formed on a first surface of the first resin insulating
layer;

a first conductor layer comprising a plurality of first conductor circuits formed in the concave portions of the first resin
insulating layer, respectively;

a second conductor layer comprising a plurality of second conductor circuits formed on a second surface of the first resin
insulating layer on an opposite side with respect to the first surface of the first resin insulating layer;

a first via conductor formed in the first resin insulating layer such that the first via conductor is penetrating through
the first resin insulating layer and connecting the first conductor layer and the second conductor layer; and

a second resin insulating layer formed on the second surface of the first resin insulating layer such that the second resin
insulating layer is covering the second conductor layer,

wherein each of the first conductor circuits has an upper surface, a lower surface and two side surfaces between the upper
surface and the lower surface such that the upper surface is exposed from the first surface of the first resin insulating
layer and that the side surfaces and the lower surface are not roughened surfaces, each of the second conductor circuits has
a top surface, a back surface and two side surfaces between the top surface and the back surface such that the side surfaces
and the back surface are roughened surfaces, and the plurality of first conductor circuits includes a thinnest first conductor
circuit such that the thinnest first conductor circuit has a line width L1 which is smaller than a line width L2 of a thinnest second conductor circuit of the second conductor circuits.

US Pat. No. 9,723,728

WIRING BOARD WITH BUILT-IN ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME

IBIDEN CO., LTD., Ogaki ...

1. A wiring board with a built-in electronic component, comprising:
a substrate having a cavity;
an electronic component accommodated in the cavity of the substrate;
a conductive layer formed on the substrate such that the conductive layer is extending over the electronic component in the
cavity of the substrate; and

a solder-resist layer formed on the conductive layer and having a plurality of first opening portions and a plurality of second
opening portions such that the plurality of first opening portions is forming a plurality of first conductive pads comprising
the conductive layer exposed by the plurality of first opening portions and that the plurality of second opening portions
is forming a plurality of second conductive pads comprising the conductive layer exposed by the plurality of second opening
portions,

wherein the plurality of second conductive pads is formed such that the plurality of second conductive pads comprises a plurality
of portions of the conductive layer formed directly over the electronic component, respectively, and connected to the electronic
component, the plurality of first conductive pads is formed such that the plurality of first conductive pads comprises a plurality
of portions of the conductive layer formed on an outer side with respect to the electronic component, respectively, each of
the second opening portions has an opening diameter which is formed smaller than an opening diameter of each of the first
opening portions, each of the first opening portions has the opening diameter which is formed in a range of from 40 ?m to
80 ?m, and each of the second opening portions has the opening diameter which is formed in a range of from 20 ?m to 30 ?m.

US Pat. No. 9,723,729

PRINTED WIRING BOARD

IBIDEN CO., LTD., Ogaki-...

1. A printed wiring board, comprising:
a substrate;
a first conductor layer formed on a first surface of the substrate;
a second conductor layer formed on a second surface of the substrate;
a through-hole conductor penetrating through the substrate such that the through-hole conductor is connecting the first conductor
layer and the second conductor layer;

a build-up layer formed on the second surface of the substrate and comprising a plurality of conductor layers, a plurality
of insulating layers, and a plurality of via conductors connecting the conductor layers through the insulating layers; and

a first insulating layer formed on the first surface the substrate such that the first insulating layer is covering the first
conductor layer on the substrate,

wherein the substrate has a cavity penetrating through the first insulating layer and the substrate such that the cavity is
exposing a mounting area portion of the build-up layer on the second surface of the substrate, the build-up layer is formed
such that the plurality of via conductors includes a plurality of mounting via conductors positioned in the mounting area
portion and having a plurality of bottom portions exposed in the cavity, and the plurality of mounting via conductor is formed
such that each of the bottom portions of the mounting via conductors is recessed relative to a surface of a lowermost insulating
layer in the build-up layer at a bottom of the cavity.

US Pat. No. 9,635,765

COMBINED WIRING BOARD AND METHOD FOR MANUFACTURING COMBINED WIRING BOARD

IBIDEN CO., LTD., Ogaki-...

9. A combined wiring board, comprising:
a metal frame having a plurality of opening portions; and
a plurality of wiring boards accommodated in the plurality of opening portions, respectively,
wherein:
the metal frame has a plurality of crimped portions having plastic deformation such that sidewalls of the metal frame in the
opening portions are bonded to sidewalls of each of the wiring boards, and the plurality of crimped portions in the metal
frame have amounts of the plastic deformation which are different for positions of the crimped portions in the metal frame;
and

the plurality of crimped portions in the metal frame is positioned such that each of the wiring boards has a plurality of
corners each of which is interposed between two crimped portions of the plurality of crimped portions in the metal frame,
and one of the two crimped portions at each corner of a wiring board is positioned closer to the center of the wiring board
and has a larger amount of the plastic deformation with respect to the other one of the two crimped portions.

US Pat. No. 9,497,849

PRINTED WIRING BOARD

IBIDEN CO., LTD., Ogaki-...

1. A printed wiring board, comprising:
a core substrate;
a plurality of buildup structures including a first buildup structure formed on a first surface of the core substrate and
a second buildup structure formed on a second surface of the core substrate on an opposite side of the first surface of the
core substrate with respect to the first surface of the core substrate; and

a plurality of solder-resist layers including a first solder-resist layer formed on the first buildup structure and a second
solder-resist layer formed on the second buildup structure,

wherein the core substrate includes an insulative substrate including reinforcing material, a first conductive layer formed
on a first surface of the insulative substrate, a second conductive layer formed on a second surface of the insulative substrate,
and a through-hole conductor penetrating through the insulative substrate and connecting the first conductive layer and the
second conductive layer, the first buildup structure includes an outermost interlayer resin insulation layer and an outermost
conductive layer formed on the outermost interlayer resin insulation layer in the first buildup structure, the second buildup
structure includes an outermost interlayer resin insulation layer and an outermost conductive layer formed on the outermost
interlayer resin insulation layer in the second buildup structure, the insulative substrate of the core substrate has a thickness
in a range of 75 ?m to 290 ?m, a thickness between an outer surface of the first solder-resist layer and an outer surface
of the second solder-resist layer is set in a range of from 150 ?m or greater and less than 380 ?m, the insulative substrate
includes the reinforcing material such that the printed wiring board includes the reinforcing material in an amount in a range
of from 20 vol. % to 35 vol. %, the first and second buildup structures do not contain the reinforcing material, and the first
and the second solder-resist layers do not contain the reinforcing material.

US Pat. No. 9,048,229

PRINTED WIRING BOARD

IBIDEN CO., LTD., Ogaki-...

1. A printed wiring board, comprising:
a core substrate having a cavity portion;
an electronic component accommodated in the cavity portion of the core substrate;
a first buildup layer laminated on a first surface of the core substrate and comprising an outermost interlayer resin insulation
layer and an outermost conductive layer formed on the outermost interlayer resin insulation layer of the first buildup layer;
and

a second buildup layer laminated on a second surface of the core substrate on an opposite side of the first surface and comprising
an outermost interlayer resin insulation layer and an outermost conductive layer formed on the outermost interlayer resin
insulation layer of the second buildup layer,

wherein the outermost interlayer resin insulation layer of the first buildup layer has a thermal expansion coefficient which
is set lower than a thermal expansion coefficient of the outermost interlayer resin insulation layer of the second buildup
layer.

US Pat. No. 9,133,569

MAT, METHOD OF MANUFACTURING MAT, AND EXHAUST GAS PURIFICATION APPARATUS

IBIDEN CO., LTD., Ogaki-...

1. A mat comprising:
inorganic fibers;
a first main surface;
a second main surface;
a first interlaced part group including a plurality of first interlaced parts arranged in rows along the first main surface,
each of the plurality of first interlaced ports being constituted by interlacing the inorganic fibers with one another and
formed from a starting point on the first main surface to a finishing point present between the first main surface and the
second main surface, the plurality of first interlaced parts within each row of the first interlaced group being not arranged
on substantially straight lines, all of the plurality of first interlaced parts within each row of the first interlaced part
group being provided within respective first stripe regions each having a width of 6 mm, each first stripe region of the first
stripe regions being spaced apart by a first open region from each adjacent first stripe region of the first stripe regions
such that no first interlaced parts of the plurality of first interlaced parts are provided in the first oven region;

a second interlaced part group including a plurality of second interlaced parts arranged in rows alone the second main surface,
each of the plurality of second interlaced parts being constituted by interlacing the inorganic fibers with one another and
formed from a starting point on the second main surface to a finishing point present between the first main surface and the
second main surface, the plurality of second interlaced parts within each row of the second interlaced group being not arranged
on substantially straight lines, all of the plurality of second interlaced parts within each row of the second interlaced
part group being provided within respective second stripe regions each having a width of 6 mm, each second stripe region of
the second stripe regions being spaced apart by a second open region from each adjacent second stripe region of the second
stripe regions such that no second interlaced parts of the plurality of second interlaced parts are provided in the second
open region; and

a direction of rows formed by the first interlaced part group along the first main surface and a direction of rows formed
by the second interlaced part group along the second main surface being different from each other,

wherein an angle formed between the direction of the rows formed by the first interlaced part group and the direction of the
rows formed by the second interlaced part group is from about 60° to about 90° when viewed in a thickness direction of the
mat.

US Pat. No. 9,699,909

WIRING BOARD WITH BUILT-IN ELECTRONIC COMPONENT

IBIDEN CO., LTD., Ogaki-...

1. A wiring board with a built-in electronic component, comprising:
a core substrate;
an electronic component positioned in the core substrate and having a plurality of surface electrodes;
a first upper-layer structure formed on a first surface of the core substrate and comprising an upper wiring layer and an
upper insulation layer;

a second upper-layer structure formed on a second surface of the core substrate on an opposite side with respect to the first
surface of core substrate and comprising an upper wiring layer and an upper insulation layer;

a plurality of stacked via conductors formed in the core substrate and the first upper-layer structure such that the plurality
of stacked via conductors is connected to one of the surface electrodes of the electronic component; and

a through-stacked via structure comprising a plurality of via conductors such that the via conductors are formed in and stacked
through the core substrate, the first upper-layer structure and the second upper-layer structure,

wherein the core substrate has a component-accommodating layer, a first connection layer positioned on a first surface of
the component-accommodating layer, and a second connection layer positioned on a second surface on an opposite side with respect
to the first surface of the component-accommodating layer, the component-accommodating layer includes a plurality of inner
wiring layers and a plurality of inner insulation layers and has a cavity accommodating the electronic component, the first
connection layer includes an inner wiring layer and an inner insulation layer, the second connection layer includes a plurality
of inner wiring layers and a plurality of inner insulation layers such that the second connection layer includes a greater
number of inner wiring layers and a greater number of inner insulation layers than the first connection layer, and the plurality
of stacked via conductors is formed through the first connection layer of the core substrate and the first upper-layer structure.

US Pat. No. 9,185,799

PRINTED WIRING BOARD

IBIDEN CO., LTD., Ogaki-...

1. A printed wiring board, comprising:
a core substrate comprising an insulative substrate, a first conductive layer formed on a first surface of the insulative
substrate, and a second conductive layer formed on a second surface of the insulative substrate;

a first buildup layer laminated on a first surface of the core substrate and comprising an interlayer resin insulation layer,
a conductive layer formed on the interlayer resin insulation layer of the first buildup layer, and a via conductor penetrating
through the interlayer resin insulation layer of the first buildup layer and connected to the conductive layer of the first
buildup layer; and

a second buildup layer laminated on a second surface of the core substrate and comprising an interlayer resin insulation layer,
a conductive layer formed on the interlayer resin insulation layer of the second buildup layer, and a via conductor penetrating
through the interlayer resin insulation layer of the second buildup layer and connected to the conductive layer of the second
buildup layer,

wherein the interlayer resin insulation layer of the first buildup layer has a thermal expansion coefficient which is set
higher than a thermal expansion coefficient of the interlayer resin insulation layer of the second buildup layer, and the
thermal expansion coefficients of the interlayer resin insulation layers of the first and second buildup layers are set such
that the thermal expansion coefficient of the interlayer resin insulation layer of the first buildup layer divided by the
thermal expansion coefficient of the interlayer resin insulation layer of the second buildup layer is a value of greater than
1 but 1.5 or smaller, where the thermal expansion coefficients of the interlayer resin insulation layers of the first and
second buildup layers are values in X-Y directions obtained in a temperature range of 195 degrees to 280 degrees.

US Pat. No. 9,420,708

METHOD FOR MANUFACTURING MULTILAYER PRINTED WIRING BOARD

IBIDEN CO., LTD., Ogaki-...

1. A method for manufacturing a printed wiring board, comprising:
preparing a core substrate comprising a metal layer having a first penetrating hole and a plurality of insulation layers formed
on the metal layer such that the metal layer is interposed between the insulation layers;

forming in the core substrate a second penetrating hole having a first opening portion aligned with the first penetrating
hole on a first-surface side of the core substrate and a second opening portion aligned with the first penetrating hole on
a second-surface side of the core substrate;

forming a first conductor on a first surface of the core substrate;
forming a second conductor on a second surface of the core substrate on an opposite side of the first surface of the core
substrate; and

filling a conductive material in the second penetrating hole such that a through-hole conductor connecting the first conductor
and the second conductor is formed,

wherein the first penetrating hole of the metal layer has an inner wall such that the first penetrating hole has a diameter
which becomes greater toward a center portion of the metal layer in a thickness direction of the metal layer, the forming
of the second penetrating hole comprises setting a straight line passing through a gravity center of the first opening portion
and perpendicular to the first surface or second surface of the core substrate off a straight line passing through a gravity
center of the second opening portion and perpendicular to the first surface or second surface of the core substrate such that
the straight line with respect to passing through the gravity center of the first opening portion is not aligned with the
straight line passing through the gravity center of the second opening portion, and the forming of the second penetrating
hole comprises forming a juncture portion of the first opening portion and the second opening portion shifted to one of the
first-surface side and the second-surface side from a center portion of the metal layer in a thickness direction of the metal
layer.

US Pat. No. 9,756,735

METHOD FOR MANUFACTURING PRINTED WIRING BOARD

IBIDEN CO., LTD., Ogaki-...

1. The method for manufacturing a printed wiring board, comprising:
forming on a carrier a laminate structure comprising a second metal foil, a resin insulating layer laminated on the second
metal foil and a first metal foil laminated on the resin insulating layer;

irradiating laser upon the first metal foil such that an opening is formed through the first metal foil and the resin insulating
layer and exposes a surface of the second metal foil at a bottom of the opening;

plating the first metal foil such that a via conductor is formed in the opening and a first conductor layer comprising the
first metal foil and an electroplating film on the first metal foil is formed on a first surface of the resin insulating layer;

removing the carrier from the laminate structure;
patterning the first conductor layer formed on the resin insulating layer; and
patterning the second metal foil such that a second conductor layer comprising the second metal foil is formed on a second
surface of the resin insulating layer,

wherein the second metal foil has a thickness which is greater than a thickness of the first metal foil.

US Pat. No. 9,807,885

WIRING BOARD WITH BUILT-IN ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME

IBIDEN CO., LTD., Ogaki ...

1. A wiring board with a built-in electronic component, comprising:
a plurality of electronic components;
a multilayer core substrate comprising a plurality of insulating resin layers and a plurality of conductive layers such that
the plurality of insulating resin layers includes a central insulating resin layer formed in a center position of the multilayer
core substrate in a thickness direction of the multilayer core substrate;

a first build-up layer formed on a first surface of the multilayer core substrate and comprising an insulating resin layer
and a conductive layer such that the insulating resin layer in the first build-up layer has a resin composition which is different
from a resin composition of the insulating resin layers in the multilayer core substrate; and

a second build-up layer formed on a second surface of the multilayer core substrate and comprising an insulating resin layer
and a conductive layer such that the insulating resin layer in the second build-up layer has a resin composition which is
different from the resin composition of the insulating resin layers in the multilayer core substrate,

wherein the multilayer core substrate has a plurality of cavities accommodating the plurality of electronic components, respectively,
and including a first cavity and a second cavity such that the first and second cavities have different lengths in the thickness
direction of the multilayer core substrate and are penetrating through the central insulating resin layer at centers of the
first and second cavities in the thickness direction of the multilayer core substrate.

US Pat. No. 9,188,251

EXHAUST PIPE

IBIDEN CO., LTD., Ogaki-...

1. An exhaust pipe comprising:
a metal pipe having an outer circumferential surface;
a surface coating layer provided on the outer circumferential surface of the metal pipe, the surface coating layer containing
an inorganic glass base material and having concave portions and convex portions on an outer surface of the surface coating
layer, the concave portions and the convex portions being constructed using electrocoating with an electrocoating resin;

the concave portions having a virtually circular shape when seen in a direction perpendicular to the outer circumferential
surface of the metal pipe and being lower than a first reference surface, the first reference surface having an average height
of the outer surface of the surface coating layer; and

the convex portions being located on peripheral edge portions of the concave portions and surrounding the concave portions,
the convex portions being higher than the first reference surface.

US Pat. No. 9,854,669

PACKAGE SUBSTRATE

IBIDEN CO., LTD., Ogaki-...

1. A printed wiring board, comprising:
a first resin insulating layer;
a first conductor layer formed on a first surface of the first resin insulating layer;
a second conductor layer formed on a second surface of the first resin insulating layer;
a first via conductor structure formed in the first resin insulating layer such that the first via conductor structure is
connecting the first conductor layer and the second conductor layer;

a second resin insulating layer formed on the second surface of the first resin insulating layer such that the second conductor
layer is embedded into the second resin insulating layer and that the first resin insulating layer is covering the second
conductor layer;

a third conductor layer formed on the second resin insulating layer; and
a second via conductor structure formed in the second resin insulating layer such that the second via conductor structure
is connecting the second conductor layer and the third conductor layer,

wherein the first conductor layer is an outermost conductor layer and includes a plurality of primary pads and a plurality
of secondary pads such that the primary pads are positioned to mount a first electronic component on the first surface of
the first resin insulating layer and the secondary pads are positioned to mount a second electronic component on the first
surface of the first resin insulating layer, and the second conductor layer includes a dedicated wiring layer configured to
transmit data between the first and second electronic components to be mounted to the first surface of the first resin insulating
layer.

US Pat. No. 9,591,771

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD

IBIDEN Co., Ltd., Ogaki-...

1. A printed wiring board, comprising:
a plurality of resin insulation layers;
a plurality of conductive layers formed on the resin insulation layers respectively such that each of the conductive layers
is formed on a surface of each of the resin insulation layers; and

a plurality of via conductors penetrating through the resin insulation layers respectively such that the plurality of via
conductors is connecting the plurality of conductive layers through the resin insulation layers,

wherein the plurality of conductive layers and the plurality of via conductors are formed such that each of the conductive
layers and each of the via conductors comprise an electroless copper-plated film, an intermediate compound layer comprising
Cu3N+Cu(NH)x and formed on the electroless copper-plated film, and an electrolytic copper-plated film formed on the intermediate
compound layer.

US Pat. No. 9,066,439

WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

IBIDEN CO., LTD., Ogaki-...

1. A wiring board, comprising:
a first multilayer wiring board comprising a first solder-resist layer;
a second multilayer wiring board connected to the first multilayer wiring board and positioned in a first opening portion
formed in the first solder-resist layer of the first multilayer wiring board; and

a third multilayer wiring board connected to the first multilayer wiring board and positioned in a second opening portion
formed in the first solder-resist layer of the first multilayer wiring board such that the second multilayer wiring board
and the third multilayer wiring board are on a same side of the first multilayer wiring board,

wherein the first opening portion of the first multilayer wiring board has an opening area which is greater than a bottom
surface area of the second multilayer wiring board facing the first opening portion, and the second opening portion of the
first multilayer wiring board has an opening area which is greater than a bottom surface area of the third multilayer wiring
board facing the second opening portion.

US Pat. No. 9,781,840

SUBSTRATE FOR MOUNTING ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME

IBIDEN CO., LTD., Ogaki-...

1. A substrate for mounting an electronic component, comprising:
a base material comprising an insulating resin material;
a first conductor layer formed on a first surface of the base material;
a second conductor layer formed on a second surface of the base material on an opposite side with respect to the first surface
of the base material; and

a metal block inserted into a hole penetrating through the first conductor layer, the base material and the second conductor
layer such that the metal block is fitted in the hole,

wherein the base material has a bent portion in contact with the metal block in the hole such that the bent portion is bending
toward the second conductor layer, the metal block has a surface on a first conductor layer side such that the surface has
an outer peripheral portion having a curved-surface shape, and the hole is formed such that the hole has a first fitting inlet
on the first conductor layer side and a second fitting inlet on a second conductor layer side and that the metal block is
positioned in contact with the second fitting inlet.

US Pat. No. 9,113,562

MANUFACTURING METHOD FOR PRINTED WIRING BOARD

IBIDEN CO., LTD., Ogaki-...

1. A manufacturing method for a printed wiring board, comprising:
forming an electroless plated film on a roughened surface of an interlayer resin insulation layer;
forming on the electroless plated film a plating resist with an opening to expose a portion of the electroless plated film;
forming an electrolytic plated film on the portion of the electroless plated film exposed through the opening;
applying a resist-removing solution containing an amine and a strong alkali such that the resist-removing solution removes
the plating resist and reduces a thickness of a portion of the electroless plated film existing between adjacent portions
of the electrolytic plated film; and

applying an etchant such that the portion of the electroless plated film existing between the adjacent portions of the electrolytic
plated film is removed and a conductive pattern is formed.

US Pat. No. 9,338,883

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD

IBIDEN CO., Ltd., Ogaki-...

1. A printed wiring board, comprising:
a plurality of insulating layers laminated on each other and each comprising a resin material and a core material impregnated
with the resin material, the plurality of insulating layers having first-surface sides and second-surface sides on an opposite
side of the first-surface sides, respectively, and including a central insulating layer positioned in the center of the plurality
of insulating layers, a plurality of first insulating layers laminated on a first side of the central insulating layer, and
a plurality of second insulating layers laminated on a second side of the central insulating layer;

a plurality of first-surface-side conductive layers formed on the first-surface sides of the first insulating layers, respectively;
and

a plurality of second-surface-side conductive layers formed on the second-surface sides of the second insulating layers, respectively,
wherein the plurality of first insulating layers includes at least one first insulating layer having the core material positioned
such that the core material of the first insulating layer is shifted toward the first-surface side from the center of the
first insulating layer in a thickness direction of the first insulating layer, the plurality of second insulating layers includes
at least one second insulating layer having the core material positioned such that the core material of the second insulating
layer is shifted toward the first-surface side from the center of the second insulating layer in a thickness direction of
the second insulating layer, and the plurality of first-surface-side conductive layers and plurality of second-surface-side
conductive layers are formed such that the plurality of first-surface side conductive layers has the total area which is set
smaller than the total area of the plurality of second-surface-side conductive layers.

US Pat. No. 9,117,730

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD

IBIDEN Co., Ltd., Ogaki-...

1. A printed wiring board, comprising:
a core substrate;
a first conductive pattern formed on the core substrate;
an insulation structure comprising a first insulation layer and formed on the core substrate such that the first insulation
layer covers the first conductive pattern;

a second conductive pattern formed on the insulation structure; and
a second insulation layer formed on the insulation structure such that the second insulation layer covers the second conductive
pattern,

wherein the core substrate has a through hole conductor formed through the core substrate such that the through hole conductor
is connected to the first conductive pattern, the insulation structure has a via conductor formed on the through hole conductor
and connecting the first conductive pattern and the second conductive pattern through the first insulation layer, the first
insulation layer includes a first layer comprising a reinforcing fiber material and a second layer formed on the first layer
such that the first layer is positioned on a core substrate side and the second layer is positioned on a second insulation
layer side, the reinforcing fiber material in the first layer of the first insulation layer includes a portion penetrating
into the via conductor, and the second layer of the first insulation layer is made of an insulating material which is a same
material as an insulating material forming the second insulation layer.

US Pat. No. 9,180,406

EXHAUST GAS PROCESSING DEVICE

IBIDEN CO., LTD., Ogaki-...

1. An exhaust gas processing device comprising:
a cylindrical metallic member; and
an insulating layer having a thickness of about 20 ?m to about: 400 ?m and densely formed such that no through pores exist
in a thickness direction of the insulating layer, the insulating layer being provided on an inner surface of the cylindrical
metallic member.

US Pat. No. 9,226,397

MULTILAYER PRINTED WIRING BOARD HAVING MULTILAYER CORE SUBSTRATE

IBIDEN CO., LTD., Ogaki-...

1. A multilayer printed wiring board, comprising:
a multilayer core substrate including
two inner conductor layers having a plurality of conductor circuits, the inner conductor layers including an inner power supply
layer and an inner earth layer, and

two outer conductor layers having a plurality of conductor circuits, the outer conductor layers including an outer power supply
layer and an outer earth layer, and stacked outwardly of the inner conductor layers;

an interlayer insulating layer stacked over each of the outer conductor layers and filling a portion between the conductor
circuits in each of the outer conductor layers; and

a plurality of through hole structures formed through the multilayer core substrate, the plurality of through hole structures
including a first through hole structure and a second through hole structure, the first through hole structure electrically
connecting the inner power supply layer and the outer power supply layer, the second through hole structure electrically connecting
the inner earth layer and the outer earth layer,

wherein the outer power supply layer and the inner earth layer are formed over one another with an insulation layer formed
therebetween, the inner power supply layer and the outer earth layer are formed over one another with an insulation layer
formed therebetween, each of the inner conductor layers comprises a metallic foil layer, and each of the outer conductor layers
comprises a metallic foil layer and a plated layer and is formed such that the inner conductor layers are thicker than the
outer conductor layers, respectively.

US Pat. No. 9,204,552

PRINTED WIRING BOARD

IBIDEN Co., Ltd., Ogaki-...

1. A printed wiring board, comprising:
a core substrate;
an electronic component accommodated in the core substrate;
a first buildup structure formed on a first surface of the core substrate and comprising an interlayer resin insulation layer;
and

a second buildup structure formed on a second surface of the core substrate and comprising an interlayer resin insulation
layer,

wherein the core substrate includes a core material portion comprising a first resin layer, a second resin layer, a first
interlayer connection conductor formed in the first resin layer, a second interlayer connection conductor formed in the second
resin layer, a first conductive layer formed on a first surface of the core material portion and a second conductive layer
formed on a second surface of the core material portion on an opposite side of the first surface of the core material portion,
each of the first and second resin layers comprises a reinforcing material having a portion extending into a respective one
of the first and second interlayer connection conductors, the core material portion has an opening portion penetrating through
the resin layers and accommodating the electronic component in a space of the opening portion, the interlayer resin insulation
layer of the first buildup structure is positioned such that the opening portion of the core material portion is covered on
the first surface of the core material portion, the interlayer resin insulation layer of the second buildup structure is positioned
such that the opening portion of the core material portion is covered on the second surface of the core material portion,
and the first buildup structure has a plurality of pads positioned to mount an IC chip and a plurality of via conductors connecting
the plurality of pads to electrodes of the electronic component and to the first conductive layer on the first surface of
the core material portion.

US Pat. No. 9,200,391

MAT, METHOD FOR MANUFACTURING THE MAT, AND APPARATUS FOR PURIFYING EXHAUST GAS

IBIDEN CO., LTD., Ogaki-...

1. An apparatus for purifying exhaust gas comprising:
an exhaust gas treating body;
a casing supporting said exhaust gas treating body; and
a holding sealing material placed between said exhaust gas treating body and said casing,
wherein said holding sealing material uses a mat comprising:
a first principal face;
a second principal face opposite to the first principal face:
an organic binder;
entangled points provided by entangling inorganic fibers with one another;
entangled portions provided from said first principal face to said second principal face, the entangled portions being formed
by inserting barbed needles into the mat to entangle the inorganic fibers within the mat, a thickness of the mat at the entangled
portions is thinner than a thickness of the mat at a portion other than the entannled portions: and

unentangled portions provided from the first principal face to the second principal face, the unentangled portions being formed
by inserting barbless needles into the mat to form venting holes, the inorganic fibers being, not entangled with one another
and being arranged substantially parallel to one another in said unentangled portions,

wherein inorganic fibers forming said entangled portions are closely entangled with one another as compared with inorganic
fibers forming a portion other than the entangled portions, and

wherein most of said inorganic fibers are oriented along the direction substantially parallel to the first principal face
and the second principal face in the entangled points except for said entanaled portions.

US Pat. No. 9,883,592

WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

IBIDEN CO., LTD., Ogaki-...

1. A wiring board, comprising:
a substrate having a plurality of opening portions penetrating through the substrate and positioned such that the opening
portions form at least one boundary portion separating the opening portions and have edges defining a surface of the boundary
portion;

a plurality of electronic devices positioned in the plurality of opening portions of the substrate, respectively;
a conductive pattern formed on the surface of the boundary portion such that the conductive pattern is formed between the
edges of the opening portions and continuously extending along the edges of the opening portions on the surface of the boundary
portion;

an opposing conductive pattern formed on an opposite surface of the boundary portion with respect to the conductive pattern
on the surface of the boundary portion; and

an insulation layer formed on the substrate such that the insulation layer is covering and directly laid on the conductive
pattern on the boundary portion and the plurality of electronic devices in the plurality of opening portions of the substrate,

wherein the boundary portion has a width which is in a range of approximately 0.05 to approximately 2.0 mm, and the conductive
pattern is formed on the surface of the boundary portion such that the conductive pattern is covering substantially the width
of the boundary portion on the surface of the boundary portion.

US Pat. No. 9,480,156

METHOD FOR MANUFACTURING PRINTED WIRING BOARD

IBIDEN CO., LTD., Ogaki-...

1. A method for manufacturing a printed wiring board, comprising:
preparing an insulative board;
forming a metal film on a surface of the insulative board;
covering a portion of the metal film with a first plating resist;
forming a first plated-metal film on the metal film exposed from the first plating resist;
covering a portion of the first plated-metal film with a second plating resist;
forming a second plated-metal film on the first plated-metal film exposed from the second plating resist;
removing the first and second plating resists;
removing the metal film exposed by the first and second plated-metal films such that a wiring having a pad and a conductive
circuit thinner than the pad is formed;

forming a solder-resist layer on the surface of the insulative board and the wiring;
forming in the solder-resist layer an opening that exposes the pad and a portion of the conductive circuit contiguous to the
pad; and

forming a solder bump on the pad by a reflow.

US Pat. No. 9,370,101

METHOD FOR PLUG-IN BOARD REPLACEMENT AND METHOD FOR MANUFACTURING MULTI-PIECE BOARD

IBIDEN CO., LTD., Ogaki-...

1. A plug-in board replacement method, comprising:
preparing a board having a piece board;
forming a first conductive pattern on a first surface of the board;
forming a second conductive pattern on a second surface on an opposite side of the board with respect to the first surface
such that the second conductive pattern is positioned on the opposite side of the board with respect to the first conductive
pattern of the board;

irradiating laser upon the first surface and second surface of the board along the first conductive pattern and the second
conductive pattern such that the piece board is cut out from the board; and

fitting the piece board cut out from the board into another board,
wherein the irradiating of laser includes a first laser irradiation comprising irradiating laser upon the first surface of
the board along the first conductive pattern such that the laser is irradiated along a border between an edge portion of the
first conductive pattern and the first surface of the board and a second laser irradiation comprising irradiating laser upon
the second surface of the board along the second conductive pattern such that the laser is irradiated along a border between
an edge portion of the second conductive pattern and the second surface of the board such that the piece board is cut out
through the board.

US Pat. No. 9,189,572

SIMULATION DEVICE, SIMULATION SYSTEM, METHOD OF SIMULATION AND PROGRAM

IBIDEN CO., LTD., Ogaki-...

1. A simulation method, comprising:
processing a tomographic image of a sample such that an internal structure of the sample is modeled;
obtaining a minimum diameter of a pore of the sample which allows a predetermined liquid to enter at a predetermined pressure;
and

simulating a condition in which the liquid enters in the pore from a surface of the sample based on a diameter of the pore
of the modeled sample and the minimum diameter,

wherein the obtaining of the minimum diameter comprises obtaining a minimum diameter D0 of the pore which allows the liquid
to enter, based on a formula:

D0=?4×?×cos ?/P?q(H0)
where ? is a surface tension of the liquid, ? is a contact angle of the liquid with a wall surface of the pore, P is a pressure
of the liquid, H0 is a surface energy of the sample, and q is a function based on the surface energy of the sample.

US Pat. No. 9,056,440

HOLDING SEAL MATERIAL, EXHAUST GAS PURIFYING APPARATUS AND METHOD OF MANUFACTURING HOLDING SEAL MATERIAL

IBIDEN CO., LTD., Ogaki-...

1. A holding seal material comprising:
inorganic fibers;
skin layers provided around the inorganic fibers;
inorganic particles included in the skin layers;
a first main surface; and
a second main surface,
wherein thicknesses of the skin layers satisfy a following relational expression (1),
X>Y?Z  (1)
wherein X is a thickness of the skin layer of the inorganic fibers in a vicinity of the first main surface,
Y is a thickness of the skin layer of the inorganic fibers in a vicinity of a center of the holding seal material in a thickness
direction, and

Z is a thickness of the skin layer of the inorganic fibers in a vicinity of the second main surface.

US Pat. No. 9,391,044

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD

IBIDEN CO., LTD., Ogaki ...

1. A printed wiring board, comprising:
a first insulation layer;
an electronic component built into the first insulation layer;
a second insulation layer having a via conductor and formed on a first surface of the first insulation layer; and
a conductive film formed on the first insulation layer on an opposite side with respect to the first surface of the first
insulation layer such that the conductive film is positioned to face a back surface of the electronic component,

wherein the first insulation layer has a coefficient of thermal expansion which is set higher than a coefficient of thermal
expansion of the second insulation layer, and the first insulation layer has a first recessed portion and a second recessed
portion on a second surface of the first insulation layer on the opposite side with respect to the first surface of the first
insulation layer such that the first recessed portion is configured to accommodate the conductive film and the second recessed
portion is configured to accommodate an external connection pad.

US Pat. No. 9,320,148

PRINTED WIRING BOARD

IBIDEN CO., LTD., Ogaki-...

1. A printed wiring board, comprising:
a core substrate having a penetrating hole extending through the core substrate;
an electronic component accommodated in the penetrating hole of the core substrate;
a filler resin filling a clearance between the electronic component and the core substrate;
a first resin insulation layer formed on the electronic component and a first surface of the core substrate; and
a second resin insulation layer formed on the electronic component and a second surface of the core substrate on an opposite
side of the first surface of the core substrate,

wherein the electronic component is an IC chip including a substrate, a die pad formed on the substrate, and a rewiring layer
formed on the substrate, the rewiring layer includes a resin layer and a conductive layer which is connected to the die pad
by a via hole formed in the resin layer, the penetrating hole is configured such that a distance between an inner wall of
the penetrating hole and the electronic component is set in a range of from 50 ?m to 500 ?m, and that an area of the penetrating
hole on the first surface of the core substrate is in a range of from 50% to 70% of an area of an external shape of the first
surface of the core substrate, the filler resin has an elastic modulus which is set to be lower than 0.2 Gpa and a thermal
expansion coefficient which is set to be higher than 100 ppm and lower than 200 ppm, and the core substrate has an elastic
modulus which is set to be higher than 30 Gpa, and a thermal expansion coefficient which is set to be lower than 10 ppm.

US Pat. No. 9,226,399

WIRING BOARD WITH BUILT-IN CAPACITOR

IBIDEN CO., LTD., Ogaki-...

1. A wiring board with built-in capacitors, comprising:
a core substrate; and
a high dielectric sheet positioned on the core substrate and comprising a lower electrode layer, an upper electrode layer
and a dielectric layer, the dielectric layer comprising a single sintered ceramic body in a form of a single film and sandwiched
between the lower electrode layer and the upper electrode layer, at least one of the lower electrode layer and the upper electrode
layer being partitioned into a plurality of electrodes such that the high dielectric sheet has a plurality of capacitors,

wherein one of the lower electrode layer and the upper electrode layer is connected to a ground line and the other one of
the lower electrode layer and the upper electrode layer is connected to a power line such that the capacitors are electrically
connected in parallel.

US Pat. No. 9,443,800

PACKAGE SUBSTRATE AND METHOD FOR MANUFACTURING PACKAGE SUBSTRATE

IBIDEN CO., LTD., Ogaki-...

1. A package substrate, comprising:
a plurality of interlayer resin insulating layers comprising an outermost interlayer resin insulating layer and an inner-layer
interlayer resin insulating layer;

a plurality of conductor layers comprising an outermost conductor layer formed on the outermost interlayer resin insulating
layer, a first conductor layer formed between the outermost interlayer resin insulating layer and the inner-layer interlayer
resin insulating layer, and a second conductor layer on which the inner-layer interlayer resin insulating layer is formed;

a plurality of via conductors comprising a plurality of first via conductors formed through the outermost interlayer resin
insulating layer and a plurality of second via conductors formed through the outermost interlayer resin insulating layer;
and

a plurality of skip via conductors formed through the outermost interlayer resin insulating layer and the inner-layer interlayer
resin insulating layer such that the skip via conductors are connecting the outermost conductor layer and the second conductor
layer,

wherein the outermost conductor layer includes a plurality of first pads positioned to mount a first electronic component
on the outermost interlayer resin insulating layer and a plurality of second pads positioned to mount a second electronic
component on the outermost interlayer resin insulating layer, the plurality of first via conductors is positioned such that
the first via conductors are connecting the first conductor layer and the first pads, the plurality of second via conductors
is positioned such that the second via conductors are connecting the first conductor layer and the second pads, and the first
conductor layer is formed such that the first conductor layer has an area on a surface of the inner-layer interlayer resin
insulating layer which is in a range of 3% to 15% of an area of the surface of the inner-layer interlayer resin insulating
layer.

US Pat. No. 9,220,168

WIRING BOARD WITH BUILT-IN ELECTRONIC COMPONENT

IBIDEN CO., LTD., Ogaki-...

1. A wiring board with a built-in electronic component, comprising:
a core substrate having a thickness not exceeding 300 ?m and having a cavity having an opening on a surface of the core substrate
and a second opening on a second surface on an opposite side of the core substrate with respect to the surface;

an electronic component having a thickness not exceeding 300 ?m and accommodated in the cavity of the core substrate;
a laminated structure formed on the surface of the core substrate and comprising an insulation resin layer and a wiring layer
such that the laminated structure is covering the opening of the cavity of the core substrate and the electronic component
accommodated in the cavity of the core substrate; and

a second laminated structure formed on the second surface of the core substrate and comprising an insulation resin layer such
that the second laminated structure is covering the second opening of the cavity of the core substrate and the electronic
component accommodated in the cavity of the core substrate,

wherein the electronic component has an insulation material body and an electrode formed on a surface of the insulation material
body, the wiring layer of the laminated structure is formed such that a thickness of the wiring layer is set smaller than
a thickness of the electrode, the laminated structure has a filled via structure connected to the electrode of the electronic
component, and the second laminated structure has a recessed via structure connected to a second electrode of the electronic
component on a second surface of the insulation material body on an opposite side with respect to the surface having the electrode.

US Pat. No. 9,986,642

METHOD FOR MANUFACTURING PRINTED WIRING BOARD AND PRINTED WIRING BOARD

IBIDEN CO., LTD., Ogaki ...

1. A method for manufacturing a printed wiring board, comprising:forming, on a surface of an insulating layer, a patterned catalyst film comprising a catalyst for electroless plating such that the patterned catalyst film has a pattern corresponding to a conductor circuit; and
applying electroless plating on the patterned catalyst film such that a conductor metal is deposited on the patterned catalyst film and that the conductor circuit is formed on the surface of the insulating layer such that the conductor metal is formed on upper and side surfaces of the patterned catalyst film and that the conductor metal has deposition amounts that are greater on the upper surface of the patterned catalyst film than the side surface of the patterned catalyst film,
wherein the forming of the patterned catalyst film comprises forming the patterned catalyst film on the surface of the insulating layer and in a via hole opening formed in the insulating layer, and the applying of electroless plating comprises applying electroless plating on the patterned catalyst film such that the conductor metal is deposited on the patterned catalyst film and that the conductor circuit is formed on the surface of the insulating layer and a via hole conductor is formed in the via hole opening in the insulating layer.

US Pat. No. 9,538,663

COMBINED WIRING BOARD AND METHOD FOR MANUFACTURING COMBINED WIRING BOARD

IBIDEN CO., LTD., Ogaki-...

1. A method for manufacturing a combined wiring board, comprising:
providing a metal frame having an accommodation opening portion;
positioning a wiring board in the accommodation opening portion of the metal frame; and
subjecting the metal frame to plastic deformation such that a sidewall of the wiring board is connected to a sidewall of the
metal frame inside the accommodation opening portion of the metal frame and that the wiring board is fixed to the metal frame
inside the accommodation opening portion of the metal frame,

wherein the metal frame does not have an adhesive agent fixing the wiring board inside the accommodation opening portion.

US Pat. No. 9,433,097

CIRCUIT SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME

IBIDEN CO., LTD., Ogaki ...

1. A circuit substrate, comprising:
a core substrate having a cavity;
a plurality of metal blocks accommodated in the cavity of the core substrate;
a first build-up layer comprising an insulating resin layer and laminated on a first side of the core substrate such that
the insulating resin layer is covering the cavity of the core substrate;

a second build-up layer comprising an insulating resin layer and laminated on a second side of the core substrate such that
the insulating resin layer is covering the cavity of the core substrate; and

a filling resin filling a gap formed between the cavity and the metal blocks positioned in the cavity of the core substrate,
wherein the cavity of the core substrate is penetrating through the core substrate, the core substrate has an intracavity
projection structure projecting from at least one side surface of the cavity such that the intracavity projection structure
is positioned between the metal blocks and separating the metal blocks from contacting each other in the cavity of the core
substrate, the first build-up layer has a plurality of first conductors connected to the plurality of metal blocks, respectively,
such that each of the first conductors conducts one of electricity and heat, and the second build-up layer has a plurality
of second conductors connected to the plurality of metal blocks, respectively, such that each of the second conductors conducts
one of electricity and heat.

US Pat. No. 9,338,891

PRINTED WIRING BOARD

IBIDEN CO., LTD., Ogaki-...

1. A printed wiring board, comprising:
a core substrate having a cavity;
a plurality of electronic components accommodated in the cavity of the core substrate; and
a build-up layer formed on the core substrate and comprising an insulating resin interlayer such that the insulating resin
interlayer is covering the cavity,

wherein the plurality of electronic components includes a first electronic component, a second electronic component and a
third electronic component, the core substrate has a first projection structure partitioning the first and second electronic
components in the cavity and a second projection structure partitioning the second and third electronic components in the
cavity, and the cavity and the first and second projection structures are formed in the core substrate such that T1

US Pat. No. 9,603,238

COMBINED WIRING BOARD

IBIDEN CO., LTD., Ogaki-...

1. A combined wiring board, comprising:
a plurality of piece components each comprising a wiring board; and
a frame component having an accommodation opening structure and holding the plurality of piece components in the accommodation
opening structure such that each of the piece components is fixed to the frame component in contact at an outer rim of each
of the piece components,

wherein the frame component has a thermal expansion coefficient in a planar direction which is set higher than a thermal expansion
coefficient of the wiring board in each of the piece components in the planar direction.

US Pat. No. 9,059,187

ELECTRONIC COMPONENT HAVING ENCAPSULATED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

IBIDEN CO., LTD., Ogaki-...

13. A method for manufacturing an electronic component, comprising:
preparing a support material;
forming on the support material a laminated structure comprising a plurality of interlayer insulation layers, a plurality
of conductive patterns, a plurality of bumps and a plurality of via conductors;

forming a groove in the laminated body such that a portion of the laminated body is surrounded by the groove;
mounting on the portion of the laminated body a semiconductor element through the bumps on a conductive pattern formed on
a surface of the laminated body;

filling an encapsulating resin in the groove and over the portion of the laminated body such that the semiconductor element
and at least a portion of the laminated body is encapsulated by the encapsulating resin;

removing the support material from the laminated body;
forming a plurality of second bumps on a surface of the laminated body exposed by the removing of the support material such
that the second bumps are formed on end portions of the via conductors exposed by the removing of the support material and
connected to one of the conductive patterns through the via conductors in the laminated body, respectively; and

cutting through the encapsulating resin along the groove after curing the encapsulating resin such that the portion of the
laminated body is cut out and the encapsulating resin encapsulates at least a portion of a side surface of the laminated body,

wherein the forming of the laminated body includes forming the plurality of via conductors having a tapered column shape with
a diameter decreasing toward the support material and penetrating through one of the interlayer insulation layers such that
the via conductors are interposed between the support material and the one of the conductive patterns.

US Pat. No. 9,888,581

METHOD FOR MANUFACTURING WIRING BOARD

IBIDEN CO., LTD., Ogaki-...

1. A method for manufacturing a wiring board, comprising:
preparing a core structure;
forming on a first surface of the core structure a first buildup structure comprising a plurality of insulation layers; and
forming on a second surface of the core structure on an opposite side of the first surface of the core structure a second
buildup structure comprising a plurality of insulation layers and an inductor device,

wherein the insulation layers in the second buildup structure have thicknesses which are thinner than thicknesses of the insulation
layers in the first buildup structure, and the forming of the second buildup structure comprises forming the inductor device
in the second buildup structure on the second surface of the core structure such that at least a portion of a conductive pattern
formed in the core structure is included as a portion of the inductor device.

US Pat. No. 9,425,159

WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

IBIDEN CO., LTD., Ogaki-...

1. A wiring board, comprising:
a first insulation layer;
a plurality of first conductive patterns formed on the first insulation layer and including a plurality of first mounting
pads positioned to mount a first semiconductor element and a second semiconductor element on the first insulation layer;

a wiring structure positioned in the first insulation layer and comprising a second insulation layer, a plurality of second
conductive patterns formed on the second insulation layer, and a plurality of second mounting pads connected to the second
conductive patterns; and

a plurality of third mounting pads formed on the first insulation layer above the second mounting pads and connected to the
second mounting pads, the plurality of third mounting pads is positioned to mount the first semiconductor element and the
second semiconductor element on the first insulation layer such that a plurality of first pads of the third mounting pads
is shifted away from the plurality of second mounting pads in a horizontal direction perpendicular to a lamination direction
and positioned to face a plurality of conductive pads of the first semiconductor element, respectively, and a plurality of
second pads of the third mounting pads is shifted away from the plurality of second mounting pads in the horizontal direction
and positioned to face a plurality of conductive pads of the second semiconductor element, respectively.

US Pat. No. 9,410,463

COMPOSITE PARTICLES, HONEYCOMB STRUCTURE, METHOD FOR MANUFACTURING HONEYCOMB STRUCTURE, AND EXHAUST GAS PURIFYING APPARATUS

IBIDEN CO., LTD., Gifu (...

1. Composite particles having a metallic oxide attached to silicoaluminophosphate particles with a ratio of an amount of Si
to a sum of amounts of Al and P in a range of 0.16 to 0.33, wherein a specific surface area is in a range of 250 m2/g to 450 m2/g, and an external surface area is in a range of 30 m2/g to 90 m2/g.

US Pat. No. 9,486,728

HONEYCOMB FILTER AND PRODUCTION METHOD FOR HONEYCOMB FILTER

IBIDEN CO., LTD., Ogaki-...

1. A honeycomb filter comprising:
a ceramic honeycomb substrate having cell walls provided along a longitudinal direction of the ceramic honeycomb substrate
to define cells through which fluid is to pass and which have a fluid inlet end and a fluid outlet end opposite to the fluid
inlet end along the longitudinal direction, the cells including first cells and second cells, each of the first cells including
an inlet opening end at the fluid inlet end and an outlet closed end at the fluid outlet end, each of the second cells including
an inlet closed end at the fluid inlet end and an outlet opening end at the fluid outlet end;

an auxiliary filter layer provided on first surfaces of first cell walls of the first cells;
an SCR catalyst supported on second surfaces of second cell walls of the second cells, the second surfaces substantially corresponding
to the first surfaces; and

a portion that satisfies a “a” (?m) represents an average pore diameter of pores of the auxiliary filter layer, and
“b” (?m) represents an average particle diameter of particles constituting the SCR catalyst.

US Pat. No. 9,433,085

ELECTRONIC COMPONENT, METHOD FOR MANUFACTURING THE SAME AND METHOD FOR MANUFACTURING MULTILAYER PRINTED WIRING BOARD

IBIDEN CO., LTD., Ogaki-...

1. An electronic component, comprising:
an insulation layer comprising an optically transparent resin material;
a conductive layer formed on a first surface of the insulation layer and patterned such that the conductive layer comprises
an alignment mark and a wiring layer formed on the first surface of the insulation layer; and

an adhesive layer comprising an adhesive resin material and an optically opaque agent and formed on a second surface of the
insulation layer on an opposite side with respect to the first surface of the insulation layer,

wherein the adhesive layer has an opening portion formed at a position corresponding to the alignment mark such that the opening
portion exposes the alignment mark through the insulation layer.

US Pat. No. 9,425,137

WIRING BOARD

IBIDEN CO., LTD., Ogaki-...

1. A wiring board, comprising:
a plurality of insulating layers comprising a first insulation layer, a second insulation layer, a third insulation layer,
a fourth insulation layer and a fifth insulation layer laminated in an order of the first insulation layer, the second insulation
layer, the third insulation layer, the fourth insulation layer and the fifth insulation layer, wherein the first insulation
layer has a first hole which penetrates through the first insulation layer and includes a first conductor comprising a plating
formed in the first hole in the first insulation layer, the second insulation layer has a second hole which penetrates through
the second insulation layer and includes a second conductor comprising a plating formed in the second hole in the second insulation
layer, the third insulation layer has a third hole which penetrates through the third insulation layer and includes a third
conductor comprising a conductive paste filled in the third hole of the third insulation layer, the fourth insulation layer
has a fourth hole which penetrates through the fourth insulation layer and includes a fourth conductor comprising a plating
formed in the fourth hole in the fourth insulation layer, the fifth insulation layer has a fifth hole which penetrates through
the fifth insulation layer and includes a fifth conductor comprising a plating formed in the fifth hole in the fifth insulation
layer, and the first conductor, the second conductor, the third conductor, the fourth conductor and the fifth conductor are
formed along a same axis and are electrically continuous with each other;

a first land connected to the second conductor and the third conductor and formed in the third insulation layer; and
a second land connected to the third conductor and the fourth conductor and formed in the third insulation layer,
wherein the first land has a recess formed in a central portion of the first land, the second land has a recess formed in
a central portion of the second land, and the conductive paste is filled in the recess of the first land and the recess of
the second land.

US Pat. No. 9,185,806

METHOD FOR MANUFACTURING PRINTED WIRING BOARD AND PRINTED WIRING BOARD

IBIDEN CO., LTD., Ogaki-...

1. A printed wiring board, comprising:
an interlayer resin insulation layer;
a pad structure formed on the interlayer resin insulation layer and positioned to mount a semiconductor device; and
a solder-resist layer formed on the interlayer resin insulation layer and having an opening portion exposing a portion of
the pad structure from the solder-resist layer,

wherein the opening portion of the solder-resist layer has a bottom surface such that the bottom surface of the opening portion
is exposing an upper surface and a portion of a side surface of the pad structure, and the opening portion of the solder-resist
layer has a first opening section and a second opening section formed inside the first opening section.

US Pat. No. 9,717,151

FLEX-RIGID WIRING BOARD

IBIDEN CO., LTD., Ogaki ...

1. A flex-rigid wiring board, comprising:
a flexible substrate;
a first non-flexible substrate positioned on a first side of the flexible substrate;
a second non-flexible substrate positioned on a second side of the flexible substrate;
a first insulation layer laminated on first surfaces of the flexible substrate and first and second non-flexible substrates;
and

a second insulation layer laminated on second surfaces of the flexible substrate and first and second non-flexible substrates,
wherein each of the first and second insulation layers has an opening portion exposing a portion of the flexible substrate
such that the portion of the flexible substrate forms a flexible section connecting non-flexible rigid sections, and at least
one of the first and second non-flexible substrates includes a non-flexible intermediate substrate and a heat dissipating
portion comprising a heat dissipating material having thermal conductivity which is higher than thermal conductivity of the
first and second insulation layers such that the heat dissipating portion is positioned in an opening portion formed in the
non-flexible intermediate substrate.

US Pat. No. 9,480,157

WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

IBIDEN CO., LTD., Ogaki-...

1. A wiring board, comprising:
a first interlayer insulation layer;
a second interlayer insulation layer formed on the first interlayer insulation layer and having an opening portion;
a plurality of first conductive pads formed on the second interlayer insulation layer;
a conductive plane layer formed on the first interlayer insulation layer such that the conductive plane layer is exposed by
the opening portion of the second interlayer insulation layer;

a wiring structure positioned directly on the conductive plane layer such that the wiring structure is accommodated in the
opening portion of the second interlayer insulation layer; and

a plurality of second conductive pads formed on the wiring structure such that the plurality of first conductive pads and
the plurality of second conductive pads are set to be positioned on a same plane.

US Pat. No. 9,431,347

WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

IBIDEN CO., LTD., Ogaki-...

1. A wiring board, comprising: a first insulation layer;
a plurality of first conductive patterns formed on the first insulation layer and including a plurality of first mounting
pads positioned to mount a semiconductor element;

a wiring structure positioned in the first insulation layer and comprising a second insulation layer, a plurality of second
conductive patterns formed on the second insulation layer, and a plurality of second mounting pads connected to the second
conductive patterns; and

a plurality of third mounting pads formed on the first insulation layer above the second mounting pads and connected to the
second mounting pads such that the plurality of third mounting pads is positioned to mount the semiconductor element and forms
a distance L4 between adjacent first and third mounting pads which is greater than a distance L1 between adjacent first mounting
pads or a distance L5 between adjacent first and third mounting pads which is greater than a distance L2 between adjacent
first mounting pads, wherein the plurality of third mounting pads is positioned such that the third mounting pads are horizontally
shifted in a same direction from the plurality of second mounting pads toward the semiconductor element.

US Pat. No. 9,321,189

METHOD FOR MANUFACTURING CERAMIC HONEYCOMB STRUCTURE

IBIDEN CO., LTD., Ogaki-...

1. A method for manufacturing a ceramic honeycomb structure, comprising:
kneading inorganic particles and a binder ingredient such that a raw material paste comprising the inorganic particles and
the binder ingredient is prepared;

forming a body comprising the raw material paste and having a honeycomb structure such that the body has the honeycomb structure
having a plurality of through-holes extending in a longitudinal direction of the body and a plurality of partition portions
formed between the through-holes;

degreasing the body comprising heating the body comprising the raw material paste in an atmosphere maintaining an oxygen concentration
of 0.2% or less in a first heating and heating the body comprising the raw material paste in an atmosphere having an oxygen
concentration which is higher than the oxygen concentration of the first heating in a second heating such that a degreased
body having the honeycomb structure is formed; and

sintering the degreased body having the honeycomb structure at a temperature in a range of 1350° C. to 1650° C. such that
a ceramic body having the honeycomb structure is formed,

wherein the degreasing comprises maintaining a surface temperature of the body in a range of 400° C. to 600° C. in the first
heating and the second heating.

US Pat. No. 9,322,315

PARTICULATE COLLECTION FILTER STATE DETECTION DEVICE

IBIDEN CO., LTD., Ogaki-...

1. A filter state detection device, comprising:
a first pressure detection part configured to detect a first pressure at an upstream side of a filter on an exhaust gas flow
path;

a second pressure detection part configured to detect a second pressure at a downstream side of the filter on the exhaust
gas flow path; and

a filter state determination part configured to include an operation part and a storage part, the storage part being configured
to store values of the first and second pressures and transmit the values of the first and second pressures to the operation
part, the operation part being configured to apply Fourier transformation to each of the values of the first and second pressures
to obtain first and second spectral intensities and/or phases at a zero frequency and first and second spectral intensities
and/or phases at a predetermined frequency and configured to compare the first spectral intensity and/or phase at a zero frequency
and the first spectral intensity and/or phase at the predetermined frequency as a first group against the second spectral
intensity and/or phase at a zero frequency and the second spectral intensity and/or phase at the predetermined frequency as
a second group to determine a state of the filter,

wherein the operation part is further configured to include a first sum calculation part configured to calculate a first sum
of the first spectral intensity and/or phase at a zero frequency and the first spectral intensity and/or phase at the predetermined
frequency, a second sum calculation part configured to calculate a second sum of the second spectral intensity and/or phase
at a zero frequency and the second spectral intensity and/or phase at the predetermined frequency, and a difference calculation
part configured to calculate a difference between the first sum and the second sum, and wherein the filter state determination
part is further configured to determine a state of the filter based on the difference.

US Pat. No. 9,215,805

WIRING BOARD WITH BUILT-IN ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME

IBIDEN CO., LTD., Ogaki-...

1. A wiring board, comprising:
a substrate having an opening portion penetrating from a first surface of the substrate to a second surface of the substrate
on an opposite side with respect to the first surface of the substrate;

an electronic component positioned in the opening portion and having a first side electrode and a second side electrode such
that the first side electrode and the second side electrode extend from a first surface of the electronic component to a second
surface of the electronic component on an opposite side with respect to the first surface of the electronic component;

a plurality of insulation layers including a first insulation layer formed over the first surface of the substrate and the
first surface of the electronic component and a second insulation layer formed over the second surface of the substrate and
the second surface of the electronic component; and

a plurality of via conductors including a first via conductor formed in the first insulation layer and having a bottom surface
connected to the first side electrode, a second via conductor formed in the first insulation layer and having a bottom surface
connected to the second side electrode, a third via conductor formed in the second insulation layer and having a bottom surface
connected to the first side electrode, and a fourth via conductor formed in the second insulation layer and having a bottom
surface connected to the second side electrode,

wherein the first via conductor has a length which is set longer than a length of the third via conductor, the bottom surface
of the first via conductor has a width which is formed greater than a width of the bottom surface of the third via conductor,
the second via conductor has a length which is set longer than a length of the fourth via conductor, the bottom surface of
the second via conductor has a width which is greater than a width of the bottom surface of the fourth via conductor, each
of the first via conductor, the second via conductor, the third via conductor and the fourth via conductor is made of a filled
plated material, each of the first via conductor, the second via conductor, the third via conductor and the fourth via conductor
has a land portion having a recessed portion, the recessed portion of the third via conductor has a depth which is set smaller
than a depth of the recessed portion of the first via conductor, and the recessed portion of the fourth via conductor has
a depth which is set smaller than a depth of the recessed portion of the second via conductor.

US Pat. No. 10,098,243

PRINTED WIRING BOARD AND SEMICONDUCTOR PACKAGE

IBIDEN CO., LTD., Ogaki-...

1. A printed wiring board, comprising:a core laminate body comprising a plurality of insulating layers, a plurality of conductor layers including a first conductor layer and a second conductor layer, and a plurality of via conductors having end surfaces formed smaller than opposite end surfaces and connected to the first conductor layer at the end surfaces formed smaller than the opposite end surfaces;
a first build-up layer formed on a first surface of the core laminate body and comprising a first interlayer resin insulating layer, a third conductor layer laminated on the first interlayer resin insulating layer and a plurality of first via conductors having end surfaces formed smaller than opposite end surfaces and connected to the first conductor layer of the core laminate body at the end surfaces formed smaller than the opposite end surfaces; and
a second build-up layer formed on a second surface of the core laminate body and comprising a second interlayer resin insulating layer and a fourth conductor layer laminated on the second interlayer resin insulating layer,
wherein the first conductor layer is embedded such that the first conductor layer has an exposed surface on the first surface of the core laminate body and that the exposed surface of the first conductor layer is in contact with the first via conductors of the first build-up layer at the end surfaces formed smaller than the opposite end surfaces, the second conductor layer is formed such that the second conductor layer is on the second surface of the core laminate body, each of the conductor layers in the core laminated body, the third conductor layer in the first build-up layer and the fourth conductor layer in the second build-up layer have a wiring pattern such that the wiring pattern of the first conductor layer has a minimum width which is the smallest among minimum widths of the wiring patterns of the conductor layers formed in the core laminate body and the third conductor layer in the first build-up layer and the fourth conductor layer in the second build-up layer, the plurality of via conductors formed in the core laminate body is tapering toward the first conductor layer such that the end surfaces of the via conductors are connected to the first conductor layer, and the plurality of first via conductors formed in the first interlayer resin insulating layer of the first build-up layer is tapering toward the first conductor layer such that the end surfaces of the first via conductors are connected to the first conductor layer.

US Pat. No. 9,374,903

MULTILAYER PRINTED WIRING BOARD FOR MOUNTING SEMICONDUCTOR ELEMENT

IBIDEN CO., LTD., Ogaki-...

1. A multilayer printed wiring board for mounting a semiconductor element, comprising:
a core substrate;
a first laminated structure laminated on a first surface of the core substrate and comprising a conductive circuit layer formed
on the first surface of the core substrate, an interlayer resin insulating layer and an outermost conductive circuit layer;
and

a second laminated structure laminated on a second surface of the core substrate on an opposite side of the core substrate
with respect to the first surface and comprising a conductive circuit layer formed on the second surface of the core substrate,
an interlayer resin insulating layer and an outermost conductive circuit layer,

wherein the outermost conductive circuit layer in the first laminated structure has a plurality of first solder pads positioned
to mount a semiconductor element and a plurality of second solder pads positioned to mount a package substrate, the outermost
conductive circuit layer in the second laminated structure has a plurality of solder pads positioned to mount a printed substrate,
the outermost conductive circuit layer in the first laminated structure has a thickness which is formed greater than a thickness
of the conductive circuit layer on the first surface of the core substrate, the outermost conductive circuit layer in the
second laminated structure has a thicknesses which is formed greater than a thickness of the conductive circuit layer on the
second surface of the core substrate, the thickness of the outermost conductive circuit layer in the first laminated structure
is formed greater than the thickness of the outermost conductive circuit layer in the second laminated structure, and the
first and second solder pads in the outermost conductive circuit layer in the first laminated structure are formed such that
the first and second solder pads have contact portions configured to contact with solder bumps and non-contact portions configured
not to contact with the solder bumps, respectively, and that the contact portions of the first and second solder pads and
the non-contact portions of the first and second solder pads satisfy b/a>2.0 where a represents thicknesses of the contact
portions and b represents thicknesses of the non-contact portions.

US Pat. No. 9,338,886

SUBSTRATE FOR MOUNTING SEMICONDUCTOR, SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

IBIDEN CO., LTD., Ogaki-...

1. A substrate for mounting a semiconductor, comprising:
a first insulation layer having a penetrating hole penetrating through the first insulation layer;
a first conductive pattern formed on a first surface of the first insulation layer;
an electrode formed in the penetrating hole in the first insulation layer and connected to the first conductive pattern; and
a second insulation layer formed on the first surface of the first insulation layer and the first conductive pattern,
wherein the electrode has a protruding portion protruding from a second surface of the first insulation layer on an opposite
side with respect to the first surface of the first insulation layer and comprising a first conductive film and a second conductive
film such that the first conductive film is coating the second conductive film.

US Pat. No. 9,578,755

PRINTED WIRING BOARD HAVING BUILDUP LAYERS AND MULTILAYER CORE SUBSTRATE WITH DOUBLE-SIDED BOARD

IBIDEN CO., LTD., Ogaki-...

1. A printed wiring board, comprising:
a multilayer core substrate comprising a first insulation layer, a second insulation layer and a double-sided board interposed
between the first insulation layer and the second insulation layer;

a first buildup layer formed on a first surface of the multilayer core substrate; and
a second buildup layer formed on a second surface of the multilayer core substrate,
wherein the multilayer core substrate has a first conductive layer formed on the first insulation layer, a second conductive
layer formed between the first insulation layer and the double-sided board, a third conductive layer formed between the second
insulation layer and the double-sided board, a fourth conductive layer formed on the second insulation layer, and a cylindrical
through-hole structure comprising a cylindrical conductor formed on a wall of a penetrating hole penetrating through the first
insulation layer, the double-sided board and the second insulation layer such that the cylindrical conductor is connecting
the first conductive layer and the fourth conductive layer, a resin filler filling a space formed inside the cylindrical conductor
and a plurality of covering circuits covering the resin filler at end portions of the cylindrical conductor, respectively,
the first conductive layer includes a first through-hole land formed around one of the end portions of the cylindrical through-hole
structure such that the first through-hole land is directly connected to the cylindrical conductor, the first through-hole
land includes a first electroless plated film, a first electrolytic plated film formed on the first electroless plated film,
a second electroless plated film formed on the first electrolytic plated film and a second electrolytic plated film formed
on the second electroless plated film, and the cylindrical conductor is comprising the second electroless plated film and
the second electrolytic plated film formed on the second electroless plated film such that the second electroless plated film
is in contact with side walls of the first electroless plated film and first electrolytic plated film exposed by the penetrating
hole of the multilayer core substrate.

US Pat. No. 9,458,747

ELECTRICALLY HEATED CATALYTIC CONVERTER

IBIDEN CO., LTD., Ogaki-...

1. An electrically heated catalytic converter for purifying exhaust gas, the electrically heated catalytic converter comprising:
a catalyst carrier supporting a catalyst and configured to generate heat by energization;
a case for accommodating the catalyst carrier; and
an electrical insulation mat interposed between the catalyst carrier and the case,
wherein the case comprises an outer tube disposed at the outermost side and an inner tube disposed inside the outer tube;
in a cross section upstream of the catalyst carrier taken along a plane including the central axis of the case,
the inner tube comprises a first curved portion and a second curved portion formed in this order from the side closer to the
catalyst carrier,

the first curved portion is curved so as to outwardly project and the second curved portion is curved in the direction opposite
to the curvature of the first curved portion so as to project toward the central axis,

the second curved portion has a curvature radius larger than that of the first curved portion, and
an insulation layer is formed on at least one portion of the inner tube.

US Pat. No. 9,538,642

WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

IBIDEN CO., LTD., Ogaki-...

1. A wiring board, comprising:
a core structure comprising a core substrate; and
a buildup structure formed on the core structure and comprising an interlayer insulating layer and a conductive layer,
wherein the interlayer insulating layer does not contain inorganic fiber and comprises a resin component and an inorganic
filler such that the interlayer insulating layer comprises a filler layer including the inorganic filler and a resin layer
formed on the filler layer and that the inorganic filler is not exposed on a surface of the resin layer, the conductive layer
is formed on the interlayer insulating layer such that the conductive layer is formed on the surface of the resin layer and
is not in contact with the inorganic filler in the interlayer insulating layer, and the resin layer of the interlayer insulating
layer does not contain the inorganic filler or includes the inorganic filler such that the filler layer of the interlayer
insulating layer includes the inorganic filler in an amount which is greater than an amount of the inorganic filler in the
resin layer of the interlayer insulating layer.

US Pat. No. 9,532,468

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD

IBIDEN CO., LTD., Ogaki-...

1. A wiring board, comprising:
a first resin insulating layer;
a plurality of conductor pads formed on the first resin insulating layer and comprising a first conductor pad and a second
conductor pad;

a second resin insulating layer formed on the first resin insulating layer such that the second resin insulating layer is
covering the first conductor pad and the second conductor pad;

an outermost surface conductor wiring layer formed on the second resin insulating layer and comprising a first outermost surface
conductor wiring layer and a second outermost surface conductor wiring layer;

a plurality of via conductors penetrating through the second resin insulating layer and comprising a first via conductor connecting
the first outermost surface conductor wiring layer and the first conductor pad and a second via conductor connecting the second
outermost surface conductor wiring layer and the second conductor pad; and

a solder resist layer formed on the second resin insulating layer such that the solder resist layer is covering the first
outermost surface conductor wiring layer and has at least one opening portion exposing the second outermost surface conductor
wiring layer,

wherein the first via conductor and the first outermost surface conductor wiring layer comprise a first main metal, and the
second via conductor and the second outermost surface conductor wiring layer comprise a second main metal which is different
from the first main metal of the first via conductor and first outermost surface conductor wiring layer.

US Pat. No. 9,486,739

HOLDING SEAL MATERIAL, MANUFACTURING METHOD FOR HOLDING SEAL MATERIAL, EXHAUST GAS PURIFICATION APPARATUS AND MANUFACTURING METHOD FOR EXHAUST GAS PURIFICATION APPARATUS

IBIDEN CO., LTD., Gifu (...

1. A holding seal material made of a laminated mat configured by laminating a plurality of mats containing an inorganic fiber
and having a rectangular planar shape so that longitudinal-direction lengths of the respective mats sequentially increase
as the mats are laminated,
wherein a film is attached to, out of principal surfaces of the mat configuring the laminated mat and having a longest longitudinal-direction
length, a principal surface of the mat having a longest longitudinal-direction length on an opposite side to a side on which
the mat having the longest longitudinal-direction length is in contact with other mats and longitudinal-direction side surfaces
of the mat having the longest longitudinal-direction length, and

the film is attached to a principal surface of the mat having the longest longitudinal-direction length on the side on which
the mat having the longest longitudinal-direction length is in contact with other mats in a state in which a part of the principal
surface is exposed,

wherein the film is continuously wound once in a direction perpendicular to the longitudinal direction of the mat having the
longest longitudinal-direction length and is attached to the surfaces of the mat, a winding start section and a winding end
section of the film are present on the principal surface on the side on which the mat having the longest longitudinal-direction
length is in contact with other mats, and the winding start section and the winding end section are separated from each other.

US Pat. No. 9,433,106

METHOD FOR MANUFACTURING PRINTED WIRING BOARD

IBIDEN Co., Ltd., Ogaki-...

1. A method for manufacturing a printed wiring board, comprising:
forming on a support sheet an intermediate body comprising a first insulation layer, a second insulation layer and a first
conductive layer interposed between the first insulation layer and the second insulation layer;

separating the support sheet from the intermediate body comprising the first insulation layer, the first conductive layer
and the second insulation layer such that the intermediate body is detached from the support sheet;

forming a first opening portion in the first insulation layer such that the first opening portion penetrates through the first
insulation layer and reaches the first conductive layer;

forming a second opening portion in the second insulation layer such that the second opening portion penetrates through the
second insulation layer and reaches the first conductive layer;

forming a second conductive layer on the first insulation layer;
forming a third conductive layer on the second insulation layer;
forming a first via conductor in the first opening portion such that the first via conductor connects the first conductive
layer and the second conductive layer; and

forming a second via conductor in the second opening portion such that the second via conductor connects the first conductive
layer and the third conductive layer,

wherein the forming of the intermediate body includes forming the first insulation layer on the support sheet, forming the
first conductive layer on the first insulation layer, and forming the second insulation layer on the first insulation layer
and the first conductive layer such that the intermediate body comprising the first insulation layer, the second insulation
layer and the first conductive layer interposed between the first insulation layer and the second insulation layer is formed.

US Pat. No. 9,351,396

PRINTED WIRING BOARD

IBIDEN CO., LTD., Ogaki-...

1. A printed wiring board, comprising:
a core insulation layer comprising a resin and having a via conductor comprising a plating material filling a hole formed
through the core insulation layer;

a first laminated structure formed on a first surface of the core insulation layer and comprising a first conductive layer,
an interlayer insulation layer and a second conductive layer; and

a second laminated structure formed on a second surface of the core insulation layer on an opposite side of the first surface
of the core insulation layer and comprising a first conductive layer, an interlayer insulation layer and a second conductive
layer,

wherein the first conductive layer of the first laminated structure is formed on the first surface of the core insulation
layer, the interlayer insulation layer of the first laminated structure is formed on the first conductive layer of the first
laminated structure, comprises a resin and has a via conductor comprising a plating material filling a hole formed through
the interlayer insulation layer of the first laminated structure, the second conductive layer of the first laminated structure
is formed on the interlayer insulation layer of the first laminated structure, the first conductive layer of the second laminated
structure is formed on the second surface of the core insulation layer, the interlayer insulation layer of the second laminated
structure is formed on the first conductive layer of the second laminated structure, comprises a resin and has a via conductor
comprising a plating material filling a hole formed through the interlayer insulation layer of the second laminated structure,
the second conductive layer of the second structure is formed on the interlayer insulation layer of the second laminated structure,
each of the first conductive layers of the first and second laminated structures includes a conductive circuit, each of the
second conductive layers of the first and second laminated structures has a conductive circuit connected to the conductive
circuit in a respective one of the first conductive layers of the first and second laminated structures through the via conductor
in a respective one of the interlayer insulation layers of the first and second laminated structures, each of the core insulation
layer and the interlayer insulation layers has a dielectric constant of 4.0 or lower at a signal frequency of 1 GHz and a
thermal expansion coefficient of 85 ppm/° C. or lower at or below Tg, the via conductor in the interlayer insulation layer
of the first laminated structure is positioned such that the via conductor in the interlayer in the interlayer insulation
layer of the second laminated structure is positioned such that the via conductor in the interlayer insulation layer of the
second laminated structure is stacked on the via conductor in the core insulation layer, and the via conductor in the interlayer
insulation layer of the first laminated structure and the via conductor in the core insulation layer are tapered in a direction
opposite to a tapering direction of the via conductor in the interlayer insulation layer of the second laminated structure.

US Pat. No. 9,536,801

ELECTRONIC COMPONENT HAVING ENCAPSULATED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

IBIDEN CO., LTD., Ogaki-...

1. An electronic component, comprising:
a wiring board comprising a plurality of interlayer insulation layers and a plurality of conductive patterns;
a plurality of first bumps formed on a first conductive pattern of the conductive patterns positioned on a first surface of
the wiring board;

a semiconductor element mounted on the first surface of the wiring board through the first bumps;
an encapsulating resin encapsulating the semiconductor element and the wiring board such that the encapsulating resin covers
side surfaces of the interlayer insulation layers and exposes a second surface of the wiring board on an opposite side with
respect to the first surface of the wiring board; and

a plurality of second bumps formed on the second surface of the wiring board and connected to a second conductive pattern
of the conductive patterns in the wiring board,

wherein the semiconductor element, encapsulating resin and wiring board satisfy a relationship C1 such that a portion of the encapsulating resin covering the side surfaces of the interlayer insulation layers has a thickness
in a range of 0.1 ?m to 0.5 ?m.

US Pat. No. 9,736,945

PRINTED WIRING BOARD

IBIDEN CO., LTD., Ogaki-...

1. A printed wiring board, comprising:
an insulation layer comprising an insulative material;
a plurality of conductive pads formed on the insulation layer such that the plurality of conductive pads is positioned to
connect an electronic component; and

a conductive wiring pattern comprising a first conductive pattern and a second conductive pattern and formed on the insulation
layer such that the conductive wiring pattern is extending between the conductive pads, the first conductive pattern comprising
a plurality of first wiring lines, the second conductive pattern comprising a plurality of second wiring lines,

wherein the first conductive pattern and the second conductive pattern are formed such that the first wiring lines and the
second wiring lines are alternately arrayed on the insulation layer, each of the first wiring lines comprises a first metal
layer formed on an interface with the insulation layer, each of the second wiring lines comprises a second metal layer formed
on an interface with the insulation layer, and the first metal layer comprises a metal material which is different from a
metal material forming the second metal layer.

US Pat. No. 9,661,762

PRINTED WIRING BOARD

IBIDEN CO., LTD., Ogaki ...

1. A printed wiring board, comprising:
a core substrate comprising a resin insulating layer and a plurality of conductor layers;
a first wiring structure formed on a first surface of the core substrate and comprising a conductor layer and a resin insulating
layer such that the conductor layer in the first wiring structure includes a plurality of pads positioned to mount an electronic
component on the first wiring structure; and

a second wiring structure formed on a second surface of the core substrate and comprising a conductor layer and a resin insulating
layer such that the conductor layer in the second wiring structure includes a plurality of pads positioned to mount a mother
board to the second wiring structure,

wherein the core substrate is interposed between the first wiring structure and the second wiring structure such that the
resin insulating layers and conductor layers in the core substrate, first wiring structure and second wiring structure are
alternately laminated, the resin insulating layer in the first wiring structure has a vol % of resin which is larger than
a vol % of resin in the resin insulating layer in the second wiring structure such that a difference in the vol % of resin
in the first and second wiring structures is in a range of from 0.5% to 5.0% and that a coefficient of thermal expansion of
the resin insulating layer in the first wiring structure is larger than a coefficient of thermal expansion of the resin insulating
layer in the second wiring structure, the resin insulating layer in the core substrate comprises a first resin layer and a
second resin layer such that the first resin layer has a thickness which is substantially equal to a thickness of the second
resin layer, the first wiring structure includes an outermost resin insulating layer and an outermost conductor layer formed
on the outermost resin insulating layer, the outermost conductor layer in the first wiring structure includes the plurality
of pads positioned to mount the electronic component on the first wiring structure, and the coefficient of thermal expansion
of the resin insulating layer in the first wiring structure is larger than the coefficient of thermal expansion of the resin
insulating layer in the second wiring structure within the difference in the vol % of resin in the range of from 0.5% to 5.0%
such that the printed wiring board forms a convex warpage with respect to a mounting surface of the first wiring structure
at a mounting temperature of the electronic component.

US Pat. No. 9,484,276

SEMICONDUCTOR MOUNTING DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR MOUNTING DEVICE

IBIDEN CO., LTD., Ogaki-...

1. A semiconductor mounting device, comprising:
a first substrate comprising a plurality of insulation layers, a plurality of conductor layers formed on the insulation layers,
and a plurality of via conductors connecting the conductor layers;

a second substrate comprising a plurality of insulation layers and a plurality of conductor layers formed on the insulation
layers of the second substrate;

a plurality of first bumps connecting the first substrate and the second substrate and formed on an outermost conductor layer
of the first substrate formed on an outermost insulation layer of the first substrate;

a plurality of second bumps positioned to mount a semiconductor element to the second substrate and formed on an outermost
conductor layer of the second substrate formed on an outermost insulation layer of the second substrate;

a solder resist layer formed on the outermost conductor layer and the outermost insulation layer of the first substrate such
that the solder resist layer has a plurality of opening portions forming a plurality of exposed portions of the outermost
conductor layer of the first substrate; and

a plurality of metal layers formed on the exposed portions of the outermost conductor layer of the first substrate, respectively,
wherein the second substrate has a thickness which is greater than a thickness of the first substrate.

US Pat. No. 9,480,173

FLEX-RIGID WIRING BOARD AND METHOD FOR MANUFACTURING FLEX-RIGID WIRING BOARD

IBIDEN CO., LTD., Ogaki-...

1. A flex-rigid wiring board, comprising:
a flexible substrate comprising a base material layer; and
a non-flexible substrate comprising an insulating substrate and positioned such that the insulating substrate of the non-flexible
substrate is extending in a horizontal direction of the base material layer of the flexible substrate,

wherein the flexible substrate and non-flexible substrate comprise a first wiring layer comprising a plurality of non-embedded
wirings formed on a first surface of the insulating substrate in the non-flexible substrate and extending on the base material
layer of the flexible substrate, and a second wiring layer comprising a plurality of embedded wirings embedded in a second
surface of the insulating substrate in the non-flexible substrate and extending on the base material layer of the flexible
substrate, the non-flexible substrate comprises a first insulating layer formed on the first surface of the insulating substrate
in the non-flexible substrate and having an opening portion exposing at least a portion of the first wiring layer on the base
material layer in the flexible substrate, and a second insulating layer formed on the second surface of the insulating substrate
in the non-flexible substrate and having an opening portion exposing at least a portion of the second wiring layer on the
base material layer in the flexible substrate.

US Pat. No. 10,111,335

PRINTED WIRING BOARD

IBIDEN CO., LTD., Ogaki ...

1. A printed wiring board, comprising:a central resin insulating layer comprising a first layer and a second layer;
an electronic component embedded in the central resin insulating layer;
a first resin insulating layer formed on a first surface side of the central resin insulating layer;
a second resin insulating layer formed on a second surface side of the central resin insulating layer on an opposite side with respect to the first surface side;
a plurality of via conductors formed in the central resin insulating layer such that the plurality of via conductors is formed toward the first surface side; and
a plurality of metal posts formed in the central resin insulating layer such that the plurality of metal posts is formed toward the second surface side,
wherein the central resin insulating layer does not contain a core material, one of the first resin insulating layer and the second resin insulating layer includes a core material and the other one of the first resin insulating layer and the second resin insulating layer does not contain a core material, the central resin insulating layer comprises the first layer on the first surface side and the second layer on the second surface side formed such that the second layer has a thermal expansion coefficient that is greater than a thermal expansion coefficient of the first layer and that the first layer has a thickness that is smaller than a thickness of the second layer, the plurality of via conductors includes a group of via conductors connected with the plurality of metal posts respectively such that a via conductor and a respective metal post connected to the via conductor is connecting a first surface of the central resin insulating layer and a second surface of the central resin insulating layer on an opposite side, and the plurality of meal posts is formed such that each of the metal posts has a diameter that is at least twice as large as a bottom diameter of each via conductor in the group of the via conductors connected with the metal posts.

US Pat. No. 9,719,385

HONEYCOMB FILTER

IBIDEN CO., LTD., Ogaki-...

1. A honeycomb filter comprising:
a ceramic honeycomb base material in which a multitude of cells through which a fluid flows are disposed in parallel in a
longitudinal direction and are separated by cell walls, each cell being sealed at an end section at either a fluid inlet side
or a fluid outlet side, and

a filter layer which, among surfaces of the cell walls, is formed on a surface of the cell walls of those cells in which the
end section at the fluid inlet side is open and the end section at the fluid outlet side is sealed by a sealing material,
wherein

the filter layer comprises spherical ceramic particles, and an average particle size of the spherical ceramic particles increases
gradually from the fluid inlet side toward the fluid outlet side.

US Pat. No. 9,650,928

HONEYCOMB FILTER

IBIDEN CO., LTD., Ogaki-...

1. A honeycomb filter comprising:
a plurality of cells through which exhaust gas is to flow and which include exhaust gas introduction cells and exhaust gas
emission cells, the exhaust gas introduction cells each having an open end at an exhaust gas introduction side and a plugged
end at an exhaust gas emission side, the exhaust gas emission cells each having an open end at the exhaust gas emission side
and a plugged end at the exhaust gas introduction side;

porous cell walls defining rims of the plurality of cells, the porous cell walls each having a porosity of 55% or more but
not more than 70%, the porous cell walls including pores with a pore diameter of 40 ?m or more which have a pore volume occupying
10% or more of a total pore volume of the porous cell walls, the porous cell walls being free from pores with a pore diameter
of 10 ?m or less or including pores with the pore diameter of 10 ?m or less which have a pore volume occupying 10% or less
of the total pore volume;

the exhaust gas introduction cells and the exhaust gas emission cells each having a uniform cross sectional shape except for
a plugged portion in a cross section perpendicular to a longitudinal direction of the plurality of cells thoroughly from the
exhaust gas introduction side to the exhaust gas emission side;

the exhaust gas emission cells having an average cross sectional area larger than an average cross sectional area of the exhaust
gas introduction cells in the cross section perpendicular to the longitudinal direction of the plurality of cells; and

a total volume of the exhaust gas introduction cells being larger than a total volume of the exhaust gas emission cells,
wherein each of the exhaust gas emission cells is adjacently surrounded fully by the exhaust gas introduction cells across
the porous cell walls,

wherein the exhaust gas introduction cells include first exhaust as introduction cells and second exhaust as introduction
cells the second exhaust as introduction cells each having a cross sectional area larger than a cross sectional area of each
of the first exhaust gas introduction cells in the cross section perpendicular to the longitudinal direction of the plurality
of cells,

wherein each of the exhaust gas emission cells has a cross sectional area equal to or larger than the cross sectional area
of each of the second exhaust gas introduction cells in the cross section perpendicular to the longitudinal direction of the
plurality of cells, and

wherein, in the cross section perpendicular to the longitudinal direction of the plurality of cells, the exhaust gas introduction
cells and the exhaust gas emission cells each have a polygonal shape, and

wherein, in the cross section perpendicular to the longitudinal direction of the plurality of cells,
a side forming a cross sectional shape of each of the first exhaust gas introduction cells faces one of the exhaust gas emission
cells, a side forming a cross sectional shape of each of the second exhaust gas introduction cells faces one of the exhaust
gas emission cells, and the side of each of the first exhaust gas introduction cells is longer than the side of each of the
second exhaust gas introduction cells, or

a side forming a cross sectional shape of each of the first exhaust gas introduction cells faces one of the exhaust gas emission
cells, and none of sides forming a cross sectional shape of each of the second exhaust gas introduction cells faces the exhaust
gas emission cells.

US Pat. No. 9,601,422

PRINTED WIRING BOARD, SEMICONDUCTOR PACKAGE, AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD

IBIDEN CO., LTD., Ogaki-...

1. A printed wiring board, comprising:
a first resin insulation interlayer;
a first conductive layer formed on a first-surface side of the first resin insulation interlayer;
a second conductive layer formed on a second-surface side of the first resin insulation interlayer on an opposite side with
respect to the first-surface side;

a first buildup layer comprising a plurality of resin insulation interlayers and a plurality of conductive layers and formed
on a first surface of the first resin insulation interlayer such that the first buildup layer is formed on the first conductive
layer; and

a second buildup layer comprising a plurality of resin insulation interlayers and a plurality of conductive layers and formed
on a second surface of the first resin insulation interlayer such that the second buildup layer is formed on the second conductive
layer,

wherein the first conductive layer is formed such that the first conductive layer is embedded in the first resin insulation
interlayer and exposing a surface on the first surface of the first resin insulation interlayer, the second conductive layer
is formed on the second surface of the first resin insulation interlayer, and the plurality of resin insulation interlayers
in the first buildup layer includes a second resin insulation interlayer positioned adjacent to the first conductive layer
and having the greatest thickness among the first resin insulation interlayer, resin insulation interlayers in the first buildup
layer, and resin insulation interlayers in the second buildup layer.

US Pat. No. 9,578,745

PRINTED WIRING BOARD, METHOD FOR MANUFACTURING PRINTED WIRING BOARD AND PACKAGE-ON-PACKAGE

IBIDEN CO., LTD., Ogaki-...

6. A printed wiring board, comprising:
an interlayer resin insulation layer;
a plurality of first pads formed on the interlayer resin insulation layer such that the first pads are positioned in a central
portion of the interlayer resin insulation layer and configured to mount an IC chip;

a plurality of second pads formed on the interlayer resin insulation layer such that the second pads are positioned in a peripheral
portion of the interlayer resin insulation layer and configured to connect to a second substrate;

a resin insulation layer formed on the interlayer resin insulation layer and the first and second pads such that the resin
insulation layer has a cavity portion exposing the first pads in the central portion of the interlayer resin insulation layer
and a plurality of opening portions exposing the second pads in the peripheral portion of the interlayer resin insulation
layer;

a plurality of metal posts formed on the second pads in the peripheral portion of the interlayer resin insulation layer, respectively,
and comprising electrolytic plated material such that each of the metal posts has a first portion formed in a respective one
of the opening portions in the resin insulation layer and a second portion exposed from the resin insulation layer and that
the second portion has a diameter which is greater than a diameter of the first portion; and

a plurality of solder plating films formed on end portions of the metal posts, respectively,
wherein the second portion of each of the metal posts has a curved side-wall portion forming a narrowed portion between an
end portion and an opposite end portion of the second portion of the metal posts.

US Pat. No. 9,565,756

WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

IBIDEN CO., LTD., Ogaki-...

1. A wiring board, comprising:
a first insulation layer;
a plurality of first conductive patterns formed on the first insulation layer;
a second insulation layer formed on the first insulation layer and the first conductive patterns and having an opening portion;
a wiring structure accommodated in the opening portion of the second insulation layer and comprising an insulation layer and
a plurality of conductive patterns on the insulation layer;

a plurality of second conductive patterns formed on the second insulation layer;
a via conductor formed in the second insulation layer and connecting one of the first conductive patterns and one of the second
conductive patterns;

a third insulation layer formed on the conductive patterns in the wiring structure;
a plurality of conductive pads formed on the third insulation layer; and
a plurality of mounting pads connected to the conductive pads, respectively,
wherein the plurality of mounting pads include a plurality of first pads positioned to be connected to a first semiconductor
element and a plurality of second pads positioned to be connected to a second semiconductor element, and the plurality of
mounting pads is formed such that a distance set between the first pads is set smaller than a distance set between the second
pads.

US Pat. No. 9,499,442

METHOD FOR MANUFACTURING ALUMINUM-TITANATE-BASED CERAMIC HONEYCOMB STRUCTURE

IBIDEN CO., LTD., Ogaki-...

1. A method for manufacturing a ceramic honeycomb structure, comprising:
kneading titania particles, alumina particles and a binder ingredient such that a raw material paste comprising the titania
particles, the alumina particles and the binder ingredient is prepared;

forming a body comprising the raw material paste and having a honeycomb structure such that the body has the honeycomb structure
having a plurality of through-holes extending in a longitudinal direction of the body and a plurality of partition portions
formed between the through-holes;

sintering the body comprising the raw material paste and having the honeycomb structure at a temperature in a range of from
1350° C. to 1650° C. such that a ceramic body comprising aluminum titanate and having the honeycomb structure is formed;

applying a sealant comprising titania particles and alumina particles to one end of each of the through-holes of the ceramic
body in the longitudinal direction such that each of the through-holes of the ceramic body is sealed at the one end; and

heating the sealant sealing the one end of each of the through-holes of the ceramic body at a temperature which is 1000° C.
or higher and lower than the temperature of the sintering of the body such that the ceramic body having a cured sealant at
the one end of each of the through-holes in the honeycomb structure is formed without sintering the cured sealant at the one
end of each of the through-holes in the honeycomb structure,

wherein the heating of the sealant comprises heating both end surfaces of the ceramic body.

US Pat. No. 9,480,170

PRINTED WIRING BOARD AND A METHOD OF MANUFACTURING A PRINTED WIRING BOARD

IBIDEN Co., Ltd., Ogaki-...

1. A multilayer printed wiring board, comprising:
a substrate having a first side and a second side opposing the first side;
a first laminated structure formed on the first side of the substrate and including alternately laminated interlayer resin
insulating layers and conductor layers;

a solder-resist layer formed on the first laminated structure and having a plurality of apertures exposing a plurality of
portions of an outermost conductor layer of the first laminated structure, respectively, such that the plurality of apertures
includes at least one first aperture having a first size and at least one second aperture having a second size which is larger
than the first size; and

a plurality of solder bumps formed in the plurality of apertures respectively and having substantially equal volumes and substantially
equal heights such that a difference in height of no greater than 10 ?m is formed between a solder bump in a first aperture
and a solder bump in a second aperture.

US Pat. No. 9,578,756

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD

IBIDEN Co., Ltd., Ogaki-...

1. A printed wiring board, comprising:
a plurality of resin insulation layers;
a plurality of conductive layers formed on the resin insulation layers respectively such that each of the conductive layers
is formed on a surface of each of the resin insulation layers; and

a plurality of via conductors penetrating through the resin insulation layers respectively such that the plurality of via
conductors is connecting the plurality of conductive layers through the resin insulation layers,

wherein each of the resin insulation layers includes a modified resin layer formed by plasma treatment such that the modified
resin layer is forming the surface of each of the resin insulation layers, each of the conductive layers includes a modified
conductive layer formed by the plasma treatment such that the modified conductive layer is forming the surface of each of
the conductive layers, the modified resin layer has a surface modification different from a surface modification of the modified
conductive layer, the plurality of resin insulation layers has a main component comprising a resin selected from the group
consisting of an epoxy resin, a phenolic resin, a polyimide resin, a polyphenylene resin, a polyolefin resin and a fluororesin,
the modified resin layer of each of the resin insulation layers has C?N, C—NH2 and —COOH, the plurality of conductive layers comprises copper plating, and the modified conductive layer of each of the conductive
layers has Cu3N+Cu(NH)x.

US Pat. No. 9,564,392

PRINTED WIRING BOARD AND SEMICONDUCTOR PACKAGE

IBIDEN CO., LTD., Ogaki-...

1. A printed wiring board, comprising:
a resin insulating layer;
a wiring conductor layer embedded in the resin insulating layer such that the wiring conductor layer has a first surface exposed
on a first surface side of the resin insulating layer; and

a conductor post formed on a second surface of the wiring conductor layer on an opposite side with respect to the first surface
such that the conductor post has a side surface covered by the resin insulating layer,

wherein the conductor post has an end surface on an opposite with respect to the wiring conductor layer such that the end
surface of the conductor post is exposed on a second surface side of the resin insulating layer, and the conductor post has
an end portion on a wiring conductor layer side such that the side surface in the end portion is a curved side surface which
is bending outward increasingly toward from the wiring conductor layer.

US Pat. No. 9,520,222

WIRING BOARD AND METHOD FOR MANUFACTURING WIRING BOARD

IBIDEN CO., LTD., Ogaki-...

1. A wiring board, comprising:
a substrate comprising a plurality of first insulation layers, a plurality of second insulation layers formed on the outermost
first insulation layers of the first insulation layers, respectively, a plurality of third insulation layers formed on the
second insulation layers, respectively, and a plurality of plain conductors formed on the third insulation layers, respectively,

wherein the substrate has an inductor forming portion in which a plurality of inductor patterns is formed on the plurality
of first insulation layers, respectively, and a plurality of first via conductors formed in the first insulation layers, respectively,
such that the first via conductors are connecting the inductor patterns through the first insulation layers, the substrate
has a plurality of land structures formed on the second insulation layers, respectively, and a plurality of second via conductors
formed in the second insulation layers, respectively, such that the plurality of second via conductors is connecting the land
structures and the outermost inductor patterns of the inductor patterns, respectively, the substrate has a plurality of third
via conductors formed in the third insulation layers, respectively, such that the plurality of third via conductors is connecting
the plain conductors and the land structures, respectively, and each has a central axis passing through the center of each
of the third via conductors inside a projected region of a respective one of the second via conductors and that the plurality
of outermost inductor patterns of the inductor patterns is formed in the substrate such that the outermost inductor patterns
are separated 100 ?m or more from the plain conductors, respectively.

US Pat. No. 9,508,483

INDUCTOR DEVICE, METHOD FOR MANUFACTURING THE SAME AND PRINTED WIRING BOARD

Ibiden Co., Ltd., Ogaki-...

1. An inductor device for a printed wiring board, comprising:
an insulation layer having a first penetrating hole penetrating through the insulation layer such that the first penetrating
hole is extending from a first surface of the insulation layer to a second surface of the insulation layer on an opposite
side with respect to the first surface;

a magnetic core structure comprising a magnetic material filled in the first penetrating hole through the insulation layer
such that the magnetic core structure comprising a first magnetic body layer formed in the first penetrating hole is formed
through the insulation layer and extending from the first surface to the second surface of the insulation layer;

a conductor layer formed on the first surface of the insulation layer and having an inductor pattern such that the inductor
pattern is surrounding a circumference of an end portion of the magnetic core structure on the first surface of the insulation
layer; and

a second magnetic body layer formed on the inductor pattern such that the second magnetic body layer is covering the inductor
pattern of the conductor layer,

wherein the magnetic material forming the magnetic core structure comprises a resin material and magnetic particles included
in the resin material.

US Pat. No. 9,394,814

HONEYCOMB FILTER

IBIDEN CO., LTD., Ogaki ...

1. A honeycomb filter comprising:
a plurality of cells through which exhaust gas is to flow and which include exhaust gas introduction cells and exhaust gas
emission cells, the exhaust gas introduction cells each having an open end at an exhaust gas introduction side and a plugged
end at an exhaust gas emission side, the exhaust gas emission cells each having an open end at the exhaust gas emission side
and a plugged end at the exhaust gas introduction side, the exhaust gas introduction cells and the exhaust gas emission cells
each hawing a uniform cross sectional shape except for a plugged portion in a cross section perpendicular to a longitudinal
direction of the plurality of cells thoroughly from the exhaust gas introduction side to the exhaust gas emission side;

porous cell walls defining rims of the plurality of cells, the porous cell walls supporting an SCR catalyst;
each of the exhaust gas emission cells being adjacently surrounded fully by the exhaust gas introduction cells across the
porous cell walls;

the exhaust gas emission cells having an average cross sectional area larger than an average cross sectional area of the exhaust
gas introduction cells in the cress section perpendicular to the longitudinal direction of the plurality of cells;

the exhaust gas introduction cells have a total volume larger than a total volume of the exhaust gas emission cells;
the exhaust gas introduction cells including first exhaust gas introduction cells and second exhaust gas introduction cells,
the second exhaust gas introduction cells each having a cross sectional area larger than a cross sectional area of each of
the first exhaust gas introduction cells in the cross section perpendicular to the longitudinal direction of the plurality
of cells;

each of the exhaust gas emission cells having a cross sectional area equal to or larger than the cross sectional area of each
of the second exhaust gas introduction cells in the cross section perpendicular to the longitudinal direction of the plurality
of cells;

the exhaust gas introduction cells and the exhaust gas emission cells having, in the cross section perpendicular to the longitudinal
direction of the plurality of cells, one of

a first structure such that
the exhaust gas introduction cells and the exhaust gas emission cells each have a polygonal shape, a side forming a cross
sectional shape of each of the first exhaust gas introduction cells faces one of the exhaust gas emission cells, a side forming
a cross sectional shape of each of the second exhaust as introduction cells faces one of the exhaust gas emission cells, and
the side of each of the first exhaust gas introduction cells is longer than the side of each of the second exhaust gas introduction
cells, or

the exhaust gas introduction cells and the exhaust gas emission cells each have a polygonal shape, a side forming a cross
sectional shape of each of the first exhaust gas introduction cells faces one of the exhaust gas emission cells, and none
of sides forming a cross sectional shape of each of the second exhaust gas introduction cells faces the exhaust gas emission
cells, and

a second structure such that
the exhaust gas introduction cells and the exhaust gas emission cells are each in a shape formed by a curved line,
the porous cell walls include
first porous cell walls separating the first exhaust gas introduction cells and the exhaust gas emission cells, and
second porous cell walls separating the second exhaust gas introduction cells and the exhaust gas emission cells, and
a thickness of each of the first porous cell walls is smaller than a thickness of each of the second porous cell walls.

US Pat. No. 9,613,893

WIRING SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME

IBIDEN CO., LTD., Ogaki ...

1. A wiring substrate, comprising: a first outermost conductor layer;
a first outermost insulating layer formed on the first outermost conductor layer such that the first outermost insulating
layer is covering the first outermost conductor layer;

a second outermost conductor layer formed on an opposite side of the first outermost conductor layer; a second outermost insulating
layer formed on the second outermost conductor layer such that the second outermost insulating layer is covering the second
outermost conductor layer; and

a built-in interposer device configured to connect a plurality of electronic components to be mounted in an electronic component
mounting region of the second outermost insulating layer,

wherein the first outermost insulating layer has a plurality of first openings such that the plurality of first openings is
exposing a plurality of first conductor pads comprising a plurality of portions of the first outermost conductor layer, respectively,
the second outermost insulating layer has a plurality of second openings such that the plurality of second openings is exposing
a plurality of second conductor pads comprising a plurality of portions of the second outermost conductor layer, respectively,
each of the first conductor pads has a first plating layer formed in a respective one of the first openings such that the
first plating layer is recessed with respect to an outer surface of the first outermost insulating layer, each of the second
conductor pads has a second plating layer formed in a respective one of the second openings such that the second plating layer
is formed flush with an outer surface of the second outermost insulating layer or has a bump shape protruding from the outer
surface of the second outermost insulating layer, and the plurality of second conductor pads includes a plurality of the second
conductor pads positioned to connect the electronic components through the built-in interposer device and a plurality of the
second conductor pads positioned to connect one of the electronic components.

US Pat. No. 9,506,387

ELECTRICALLY HEATED CATALYTIC CONVERTER

IBIDEN CO., LTD., Ogaki-...

1. An electrically heated catalytic converter for purifying exhaust gas, the electrically heated catalytic converter comprising:
a catalyst carrier supporting a catalyst and configured to generate heat by energization;
a case for accommodating the catalyst carrier; and
an electrical insulation mat interposed between the catalyst carrier and the case,
wherein the case comprises an outer tube disposed at the outermost side and an inner tube disposed inside the outer tube;
in a cross section upstream of the catalyst carrier taken along a plane including the central axis of the case,
the inner tube is curved at least once so as to outwardly project and then obliquely extends toward the central axis of the
case,

an insulation layer having a thickness of 100 to 200 ?m is formed in the range from an end portion of the inner tube to 10%
of the length of the inner tube from the end portion of the inner tube to an end of the catalyst carrier,

an insulation layer having a thickness of 100 to 400 ?m is formed in the range from a point immediately after 10% of the length
away from the end portion of the inner tube to 50% of the length of the inner tube from the end portion of the inner tube
to the end of the catalyst carrier, and

the insulation layer formed in the range from the end portion of the inner tube to 10% of the length is thinner than the insulation
layer formed in the range from a point immediately after 10% of the length away from the end portion of the inner tube to
50% of the length.

US Pat. No. 10,143,092

CIRCUIT SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME

IBIDEN CO., LTD., Ogaki ...

1. A circuit substrate, comprising:a core substrate comprising resin material and having a cavity formed such that the cavity is penetrating through the core substrate;
a metal block accommodated in the cavity of the core substrate and having a thickness greater than a thickness of the core substrate such that the metal block has a first surface and a second surface protruding from a first side and a second side of the core substrate respectively;
a first build-up layer laminated on the first side of the core substrate and comprising a plurality of insulating resin layers such that the first build-up layer is covering the first surface of the metal block in the cavity of the core substrate from the first side, and a first via conductor structure formed in an innermost portion of the first build-up layer such that the first via conductor structure is connected to the first surface of the metal block; and
a second build-up layer laminated on the second side of the core substrate on an opposite side with respect to the first side and comprising a plurality of insulating resin layers such that the second build-up layer is covering the second surface of the metal block in the cavity of the core substrate from the second side, and a second via conductor structure formed in an innermost portion of the second build-up layer such that the second via conductor structure is connected to the second surface of the metal block,
wherein the first build-up layer comprises an electronic component mounting structure formed on an outermost portion of the first build-up layer such that the electronic component mounting structure mounts an electronic component on the first build-up layer, the metal block is formed such that the first and second surfaces of the metal block comprise roughened surfaces in contact with respective insulating resin layers in the first and second build-up layers and that the roughened surface of the first surface has a surface roughness in a range of 1.0 ?m to 3.0 ?m in an arithmetic average roughness which is different from a surface roughness of the roughened surface of the second surface in a range of 0.1 ?m to 1.0 ?m in an arithmetic average roughness, and the first and second via conductor structures are formed such that the first via conductor structure comprises a plurality of via conductors which is greater in number than a plurality of via conductors forming the second via conductor structure.

US Pat. No. 9,706,663

PRINTED WIRING BOARD, METHOD FOR MANUFACTURING THE SAME AND SEMICONDUCTOR DEVICE

IBIDEN CO., LTD., Ogaki-...

1. A printed wiring board, comprising:
a first resin insulating layer;
a first conductor pattern comprising a plurality of first mounting pads formed on the first resin insulating layer; and
a wiring structure positioned on the first resin insulating layer and comprising a second resin insulating layer and a second
conductor pattern such that the second resin insulating layer and second conductor pattern are positioned adjacent to the
first conductor pattern and that the second conductor pattern includes a plurality of second mounting pads,

wherein the plurality of second mounting pads is embedded in the second resin insulating layer such that the second mounting
pads have mounting surfaces exposed on an exposed surface of the second resin insulating layer, and the first mounting pads
have mounting surfaces such that the mounting surfaces of the first and second mounting pads are formed on a same plane.

US Pat. No. 9,699,920

PRINTED WIRING BOARD

IBIDEN CO., LTD., Ogaki-...

1. A printed wiring board, comprising:
a first substrate comprising a plurality of first pads and a plurality of second pads such that the plurality of first pads
is positioned to mount an electronic component on the first substrate and that the plurality of second pads is positioned
to electrically connect a second substrate to the first substrate; and

a plurality of metal posts formed on the plurality of second pads, respectively, such that the plurality of metal posts is
positioned to mount the second substrate on the first substrate and that each of the metal posts has an upper surface, a lower
surface and a curved side surface forming a smallest diameter between the upper surface and the lower surface,

wherein the first substrate and the plurality of metal posts satisfy that a ratio, b/e, is in a range from 0.3 to 1.0, where
b represents a length of each of the metal posts and e represents a thickness of the first substrate.

US Pat. No. 9,610,606

METHOD FOR APPLYING SEALING MATERIAL PASTE TO PERIPHERAL SURFACE OF CERAMIC BLOCK

IBIDEN CO., LTD., Ogaki-...

1. A method of manufacturing a honeycomb structured body, comprising:
providing an application jig comprising:
a first principal surface;
a second principal surface provided on an opposite side of the first principal surface; and
an opening section penetrating from the first principal surface to the second principal surface and comprising:
a first opening section provided on the first principal surface side; and
a second opening section provided on the second principal surface side and having a substantially constant diameter from the
second principal surface toward a boundary line between the first opening section and the second opening section, the first
opening section having a diameter gradually decreasing from the first principal surface toward the boundary line;

putting a sealing material paste on a peripheral surface of a pillar-shaped ceramic block;
setting the application jig in such a manner that the first principal surface faces upward and the second principal surface
faces downward;

placing the ceramic block inside the second opening section of the application jig; and
passing the ceramic block through the opening section of the application jig so that a face defining the second opening section
spreads an entire peripheral surface of the ceramic block with the sealing material paste to manufacture a honeycomb structured
body with a peripheral sealing material layer formed on the peripheral surface of the ceramic block.

US Pat. No. 9,534,710

HEAT RELEASING PIPE

IBIDEN CO., LTD., Ogaki-...

1. A heat releasing pipe comprising:
a metal pipe having an outer circumferential surface;
a surface coating layer provided on the outer circumferential surface of the metal pipe, the surface coating layer containing
an inorganic glass base material and having concave portions and convex portions on an outer surface of the surface coating
layer, the concave portions and the convex portions being constructed using electrocoating with an electrocoating resin;

the concave portions having a virtually circular shape when seen in a direction perpendicular to the outer circumferential
surface of the metal pipe and being lower than a first reference surface, the first reference surface having an average height
of the outer surface of the surface coating layer; and

the convex portions being located on peripheral edge portions of the concave portions and surrounding the concave portions,
the convex portions being higher than the first reference surface.

US Pat. No. 9,750,136

WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

IBIDEN CO., LTD., Ogaki ...

1. A wiring board, comprising:
an insulating substrate;
a first conductor layer laminated on a first side of the insulating substrate;
a second conductor layer laminated on a second side of the insulating substrate;
a plurality of first plating posts fitted in a plurality of through holes in the insulating substrate respectively such that
the plurality of first plating posts is projecting from the first conductor layer;

a plurality of plating connecting parts connecting the second conductor layer and the first plating posts and having a plurality
of electronic component connecting portions such that the plurality of electronic component connecting portions forms an electronic
component mounting part positioned to mount an electronic component and is positioned on the plurality of through holes, respectively;
and

a plurality of second plating posts fitted in the plurality of through holes in the insulating substrate respectively such
that the plurality of second plating posts is projecting from the second conductor layer and abutting against the plurality
of first plating posts, respectively,

wherein the plurality of second plating posts has a plurality of second holes formed such that the plurality of second holes
is penetrating through the plurality of second plating posts in a thickness direction of the insulating substrate respectively,
and the plurality of plating connecting parts is formed inside the plurality of second holes, respectively.

US Pat. No. 9,693,458

PRINTED WIRING BOARD, METHOD FOR MANUFACTURING PRINTED WIRING BOARD AND PACKAGE-ON-PACKAGE

IBIDEN CO., LTD., Ogaki-...

1. A method for manufacturing a printed wiring board, comprising:
forming a resin insulation layer on an interlayer resin insulation layer such that the resin insulation layer has a plurality
of first opening portions exposing a plurality of conductive circuits formed in a central portion of the interlayer resin
insulation layer and a plurality of second opening portions exposing a plurality of conductive circuits formed in a peripheral
portion of the interlayer resin insulation layer;

forming a plurality of solder bumps in the plurality of first opening portions such that the plurality of solder bumps is
formed on the plurality of conductive circuits in the central portion of the interlayer resin insulation layer, respectively;

forming a plating resist over the solder bumps and the resin insulation layer such that the plating resist has a plurality
of resist opening portions having diameters greater than diameters of the plurality of second opening portions and exposing
the plurality of second opening portions;

forming a seed layer on the plating resist such that the seed layer is formed on the plating resist, in the resist opening
portions and on the conductive circuits exposed through the second opening portions;

applying electrolytic plating on the plating resist such that an electrolytic plating material fills the resist opening portions
and forms an electrolytic plated film on the plating resist via the seed layer and a plurality of metal posts in the resist
opening portions, respectively;

etching the electrolytic plating material such that the electrolytic plated film on the plating resist is removed and a plurality
of recess portions is formed on surfaces of the metal posts in the resist opening portions, respectively;

applying surface-treatment on the recess portions formed on the surfaces of the metal posts prior to removing of the plating
resist; and

removing the plating resist,
wherein the surface-treatment comprises forming a plurality of Ni/Pd/Au films on the recess portions of the metal posts, respectively,
or forming a plurality of Ni/Au films on the recess portions of the metal posts, respectively.

US Pat. No. 9,650,929

HONEYCOMB FILTER

IBIDEN CO., LTD., Ogaki-...

1. A honeycomb filter comprising:
a plurality of cells through which exhaust gas is to flow and which include exhaust gas introduction cells and exhaust gas
emission cells, the exhaust gas introduction cells each having an open end at an exhaust gas introduction side and a plugged
end at an exhaust gas emission side, the exhaust gas emission cells each having an open end at the exhaust gas emission side
and a plugged end at the exhaust gas introduction side, the exhaust gas introduction cells and the exhaust gas emission cells
each having a uniform cross sectional shape except for a plugged portion in a cross section perpendicular to the longitudinal
direction of the plurality of cells thoroughly from the end at the exhaust gas introduction side to the end at the exhaust
gas emission side;

porous cell walls defining rims of the plurality of cells, each of the exhaust gas emission cells being adjacently surrounded
fully by the exhaust gas introduction cells across the porous cell walls;

the exhaust gas introduction cells including first exhaust gas introduction cells and second exhaust gas introduction cells,
each of the second exhaust gas introduction cells having a cross sectional area larger than a cross sectional area of each
of the first exhaust gas introduction cells in the cross section perpendicular to the longitudinal direction of the plurality
of cells;

each of the exhaust gas emission cells having a cross sectional area equal to or larger than the cross sectional area of each
of the second exhaust gas introduction cells in the cross section perpendicular to the longitudinal direction of the plurality
of cells; and

each of the first exhaust gas introduction cells having the cross sectional area equal to or smaller than 0.7 mm2 in the cross section perpendicular to the longitudinal direction of the plurality of cells,

wherein, in the cross section perpendicular to the longitudinal direction of the plurality of cells, the exhaust gas introduction
cells and the exhaust gas emission cells each have a polygonal shape, and

wherein, in the cross section perpendicular to the longitudinal direction of the plurality of cells,
a side forming a cross sectional shape of each of the first exhaust gas introduction cells faces one of the exhaust gas emission
cells, a side forming a cross sectional shape of each of the second exhaust gas introduction cells faces one of the exhaust
gas emission cells, and the side of each of the first exhaust gas introduction cells is longer than the side of each of the
second exhaust gas introduction cells, or

a side forming a cross sectional shape of each of the first exhaust gas introduction cells faces one of the exhaust gas emission
cells, and none of sides forming a cross sectional shape of each of the second exhaust gas introduction cells faces the exhaust
gas emission cells.

US Pat. No. 9,638,084

HOLDING SEALING MATERIAL, METHOD FOR MANUFACTURING HOLDING SEALING MATERIAL, EXHAUSTED GAS PURIFYING APPARATUS, AND METHOD FOR MANUFACTURING EXHAUST GAS PURIFYING APPARATUS

IBIDEN CO., LTD., Ogaki-...

1. A holding sealing material comprising:
a one-sheet mat including inorganic fibers and comprising:
a first mat with a first side face; and
a second mat with a second side face, a part of said first side face and a part of said second side face being foldably and
integrally connected,

wherein said first mat and said second mat each have a pair of fitting portions configured to fit to each other when the holding
sealing material is wound around an exhaust gas treating body.

US Pat. No. 9,572,256

PRINTED WIRING BOARD, METHOD FOR MANUFACTURING PRINTED WIRING BOARD, AND PACKAGE-ON-PACKAGE

IBIDEN CO., LTD., Ogaki-...

1. A printed wiring board, comprising:
an uppermost interlayer resin insulating layer;
a plurality of first pads formed in a center portion of a surface of the uppermost interlayer resin insulating layer such
that the plurality of first pads is positioned to mount an IC chip on the uppermost interlayer resin insulating layer;

a plurality of second pads formed in a peripheral portion of the surface of the uppermost interlayer resin insulating layer
such that the plurality of second pads is positioned to mount a second printed wiring board on the uppermost interlayer resin
insulating layer;

a plurality of metal posts formed on the plurality of second pads, respectively, such that the plurality of metal posts is
configured to mount the second printed wiring board over the IC chip; and

a solder resist layer formed on the uppermost interlayer resin insulating layer and having a plurality of first opening portions
and a plurality of second opening portions such that the plurality of first opening portions is exposing the plurality of
first pads, respectively, and that the plurality of second opening portions is exposing the plurality of second pads, respectively,

wherein the plurality of metal posts is formed such that each of the metal posts has a diameter which is smaller than a diameter
of each of the second opening portions, and the plurality of second opening portions is formed such that the diameter of each
of the second opening portions is smaller than a diameter of each of the second pads;

each of the second pads has a concentric recess portion surrounding an end portion of a respective one of the metal posts
such that the concentric recess portion has a concentric form with respect to an axis of the respective one of the metal posts;
and

each of the metal posts comprises a seed layer and an electrolytic copper plating layer.

US Pat. No. 9,514,876

INDUCTOR DEVICE, METHOD FOR MANUFACTURING THE SAME AND PRINTED WIRING BOARD

Ibiden Co., Ltd., Ogaki-...

1. A printed wiring board, comprising:
a first insulation layer having a first penetrating hole penetrating through the insulation layer;
a magnetic core structure comprising a magnetic material filled in the first penetrating hole through the first insulation
layer such that the magnetic core structure comprising a first magnetic body layer formed in the first penetrating hole is
formed through the first insulation layer;

a conductor layer formed on the first insulation layer and including an inductor pattern such that the inductor pattern is
surrounding a circumference of the magnetic core structure; and

a second insulation layer formed on the first insulation layer such that the second insulation layer is covering the inductor
pattern of the conductor layer and a surface of the first magnetic body layer at an end of the first penetrating hole,

wherein the magnetic core structure and the inductor pattern of the conductor layer form an inductor device.

US Pat. No. 9,668,361

PRINTED WIRING BOARD

IBIDEN CO., LTD., Ogaki ...

1. A printed wiring board, comprising:
an insulative resin substrate having a penetrating hole;
a first conductive layer formed on a first surface of the insulative resin substrate;
a second conductive layer formed on a second surface of the insulative resin substrate on an opposite side with respect to
the first surface of the insulative resin substrate; and

a through-hole conductor formed in the penetrating hole of the insulative resin substrate such that the through-hole conductor
is connecting the first conductive layer and the second conductive layer,

wherein the through-hole conductor comprises a seed layer formed on an inner wall of the penetrating hole, a laminated electrolytic
plated layer formed on the seed layer and a filled electrolytic plated layer formed on the laminated electrolytic plated layer,
the laminated electrolytic plated layer is formed in the penetrating hole such that the laminated electrolytic plated layer
is closing a center portion of the penetrating hole and forming a recessed portion at an end portion of the penetrating hole,
the filled electrolytic plated layer is formed in the penetrating hole such that the filled electrolytic plated layer is filling
the recessed portion of the penetrating hole, the laminated electrolytic plated layer comprises a plurality of electrolytic
plated films such that the electrolytic plated films are laminated along the seed layer and that each of the electrolytic
plated films has a thickness which is less at an edge portion than at a center portion, and the filled electrolytic plated
layer comprises electrolytic plated crystalline particles having a particle diameter which is greater than a particle diameter
of electrolytic plated crystalline particles of the laminated electrolytic plated layer.

US Pat. No. 9,562,166

STRUCTURE AND PAINT FOR FORMING SURFACE COAT LAYER

IBIDEN CO., LTD., Ogaki-...

1. A structure comprising:
a base that is made of a metal, and has a flat portion and at least one of a bump having a width of from 0.01 to 20 mm and
an edge portion on a surface; and

a surface coat layer that is formed from an amorphous inorganic material and particles of a crystalline inorganic material,
and covers the surface of the base,

the surface coat layer including a first coat portion covering the flat portion and a second coat portion covering the at
least one of the bump and the edge portion,

the surface coat layer having a thickness ratio of the second coat portion to the first coat portion (second coat portion
thickness/first coat portion thickness) of from 0.4 to less than 1.0,

the particles of the crystalline inorganic material having an average particle size of from 0.1 to 50 ?m.

US Pat. No. 9,478,343

PRINTED WIRING BOARD

IBIDEN CO., LTD., Ogaki-...

1. A printed wiring board, comprising:
a first core substrate having an opening portion;
an inductor component accommodated in the opening portion of the first core substrate;
a first buildup layer formed on a first surface of the first core substrate and comprising an interlayer insulation layer,
a conductive layer formed on the interlayer insulation layer in the first buildup layer, and a via conductor such that the
first buildup layer is covering the inductor component and that the via conductor in the first buildup layer is connected
to the inductor component in opening portion; and

a second buildup layer formed on a second surface of the first core substrate on an opposite side with respect to the first
surface of the first core substrate and comprising an interlayer insulation layer, a conductive layer formed on the interlayer
insulation layer in the second buildup layer, and a via conductor such that the second buildup layer is covering the inductor
component and that the via conductor in the second buildup layer is connected to the inductor component in the opening portion,

wherein the inductor component has a second core substrate, a buildup layer formed on a surface of the second core substrate
and a coil layer formed on the buildup layer, and the second buildup layer is formed such that the conductive layer in the
second buildup layer has a coil layer and that the via conductor in the second buildup layer is connecting the coil layer
in the second buildup layer and the coil layer formed on the buildup layer in the inductor component.

US Pat. No. 9,743,528

METHOD FOR MANUFACTURING WIRING BOARD

IBIDEN CO., LTD., Ogaki ...

1. A method for manufacturing a wiring board, comprising:
preparing a large-sized wiring board having an effective region and a dummy region such that the large-sized wiring board
has a penetrating hole on a border of the effective region and the dummy region and an inner-hole conductive layer covering
an inner surface of the penetrating hole;

moving a rotary tool having a tip blade along a rotation axis of the rotary tool at a peripheral portion of the penetrating
hole such that the rotary tool drills a hole into the large-sized wiring board at the peripheral portion of the penetrating
hole and segments the inner-hole conductive layer into a portion in the effective region and a portion in the dummy region;
and

moving a rotary tool having a side blade in a direction perpendicular to a rotation axis of the rotary tool having the side
blade such that the dummy region is cut off from the effective region after the rotary tool having the tip blade makes the
hole in the large-sized wiring board at the peripheral portion of the penetrating hole and a wiring board comprising the effective
region of the large-sized wiring board is formed,

wherein the rotary tool having the tip blade has a shaft and a drill blade at a tip of the shaft, and the rotary tool having
the side blade has a shaft and a cutting blade on a side surface of the shaft.

US Pat. No. 9,743,534

WIRING BOARD WITH BUILT-IN ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME

IBIDEN CO., LTD., Ogaki ...

1. A wiring board with a built-in electronic component, comprising:
a substrate having a cavity;
an interlayer insulating layer formed on the substrate such that the interlayer insulating layer is covering the cavity of
the substrate;

a conductor layer formed on the interlayer insulating layer;
an electronic component accommodated in the cavity of the substrate and comprising a rectangular cuboid body and a plurality
of terminal electrodes such that each of the terminal electrodes has a metal film form formed on an outer surface of the rectangular
cuboid body; and

a plurality of via conductors formed in the interlayer insulating layer such that the plurality of via conductors is connecting
the conductor layer and the terminal electrodes of the electronic component,

wherein the electronic component has the terminal electrodes arrayed in a matrix comprising a plurality of rows and a plurality
of columns on the outer surface of the rectangular cuboid body such that adjacent terminal electrodes in a row direction and
in a column direction have opposite polarities, the conductor layer comprises a line pattern shunting a first group of the
terminal electrodes in one polarity and a solid pattern shunting a second group of the terminal electrodes in the other polarity
such that the solid pattern is insulated from the line pattern, the plurality of terminal electrodes is arrayed in the matrix
comprising two rows and at least three columns on the outer surface of the rectangular cuboid body, the conductor layer comprises
a plurality of electrode opposing portions arrayed in a plurality of rows facing the terminal electrodes arrayed in the matrix
across the interlayer insulating layer such that the plurality of via conductors is connecting the electrode opposing portions
of the conductor layer and the terminal electrodes of the electronic component, the line pattern of the conductor layer has
a triangle wave line pattern facing the first group of the terminal electrodes and connecting a group of the via conductors
formed in a zigzag pattern, and the solid pattern of the conductor layer has a frame pattern surrounding the electrode opposing
portions and the line pattern and connecting to the second group of the terminal electrodes.

US Pat. No. 9,550,175

HONEYCOMB FILTER

IBIDEN CO., LTD., Ogaki-...

1. A honeycomb filter comprising:
a plurality of cells through which exhaust gas is to flow and which include exhaust gas introduction cells and exhaust gas
emission cells, the exhaust gas introduction cells each having an open end at an exhaust gas introduction side and a plugged
end at an exhaust gas emission side, the exhaust gas emission cells each having an open end at the exhaust gas emission side
and a plugged end at the exhaust gas introduction side;

porous cell walls defining rims of the plurality of cells;
an oxidation catalyst supported inside the porous cell walls in an amount of 5 to 60 g/L;
the exhaust gas introduction cells and the exhaust gas emission cells each having a uniform cross sectional shape except for
a plugged portion in a cross section perpendicular to a longitudinal direction of the plurality of cells thoroughly from the
exhaust gas introduction side to the exhaust gas emission side;

the exhaust gas emission cells having an average cross sectional area larger than an average cross sectional area of the exhaust
gas introduction cells in the cross section perpendicular to the longitudinal direction; and

a total volume of the exhaust gas introduction cells being larger than a total volume of the exhaust gas emission cells,
wherein each of the exhaust gas emission cells is adjacently surrounded fully by the exhaust gas introduction cells across
the porous cell walls,

wherein the exhaust gas introduction cells include first exhaust gas introduction cells and second exhaust gas introduction
cells,

wherein each of the second exhaust gas introduction cells has a cross sectional area larger than a cross sectional area of
each of the first exhaust gas introduction cells in the cross section perpendicular to the longitudinal direction of the plurality
of cells,

wherein each of the exhaust gas emission cells has a cross sectional area equal to or larger than the cross sectional area
of each of the second exhaust gas introduction cells in the cross section perpendicular to the longitudinal direction of the
plurality of cells,

wherein, in the cross section perpendicular to the longitudinal direction of the plurality of cells, the exhaust gas introduction
cells and the exhaust gas emission cells each have a polygonal shape, and

wherein, in the cross section perpendicular to the longitudinal direction of the plurality of cells,
a side forming a cross sectional shape of each of the first exhaust gas introduction cells faces one of the exhaust gas emission
cells, a side forming a cross sectional shape of each of the second exhaust gas introduction cells faces one of the exhaust
gas emission cells, and the side of each of the first exhaust gas introduction cells is longer than the side of each of the
second exhaust gas introduction cells, or

a side forming a cross sectional shape of each of the first exhaust gas introduction cells faces one of the exhaust gas emission
cells, and none of sides forming a cross sectional shape of each of the second exhaust gas introduction cells faces the exhaust
gas emission cells.

US Pat. No. 9,832,878

WIRING BOARD WITH CAVITY FOR BUILT-IN ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME

IBIDEN CO., LTD., Ogaki ...

1. A wiring board with a cavity for a built-in electronic component, comprising:
a conductor layer comprising a conductor circuit layer and a plane layer; and
an insulating layer laminated on the conductor layer and having a cavity such that the cavity is forming an exposed portion
of the plane layer and configured to mount a built-in electronic component on the exposed portion of the plane layer,

wherein the insulating layer is laminated on the conductor layer such that the insulating layer is covering the conductor
circuit layer and the plane layer, and the exposed portion of the plane layer has an outer peripheral portion along an edge
portion of the cavity such that the plane layer has a recess structure formed in the outer peripheral portion of the exposed
portion in the plane layer.

US Pat. No. 9,724,634

HONEYCOMB FILTER AND METHOD FOR PRODUCING HONEYCOMB FILTER

IBIDEN CO., LTD., Ogaki-...

1. A honeycomb filter comprising:
a ceramic honeycomb substrate in which a multitude of cells through which a fluid flows are disposed in parallel in a longitudinal
direction and are separated by cell walls, each cell being sealed at an end section at either a fluid inlet side or a fluid
outlet side, and

a filter layer which, among surfaces of the cell walls, is formed on a surface of the cell walls of those cells in which the
end section at the fluid inlet side is open and the end section at the fluid outlet side is sealed by a sealing material,
wherein

a thin layer region in which a thickness of the filter layer is thinnest exists between the fluid inlet side and the fluid
outlet side, and a thickness of the filter layer decreases gradually from the fluid inlet side toward the thin layer region,
and increases gradually from the thin layer region toward the fluid outlet side.

US Pat. No. 9,711,440

WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

IBIDEN CO., LTD., Ogaki-...

1. A wiring board, comprising:
a core substrate comprising a core insulating layer and a conductor layer formed on a surface of the core insulating layer;
and

a build-up layer laminated on one side of the core substrate and comprising an inter-layer insulating layer and a conductor
layer laminated on the inter-layer insulating layer,

wherein the core substrate has an opening portion penetrating through the core insulating layer such that a surface of the
conductor layer in the core substrate is forming a bottom surface of the opening portion, the core substrate has a via conductor
formed in the opening portion and comprising plating material filling the opening portion, the conductor layer in the core
substrate comprises a metal foil and a plating film formed on the metal foil in the core substrate, the conductor layer in
the build-up layer comprises a metal foil and a plating film formed on the metal foil in the build-up layer, and the metal
foil in the core substrate has a surface in contact with the surface of the core insulating layer such that the surface of
the metal foil in the core substrate is set to have a surface roughness which is smaller than a surface roughness of a surface
of the metal foil in the build-up layer in contact with the inter-layer insulating layer.

US Pat. No. 9,661,741

PRINTED WIRING BOARD

IBIDEN CO., LTD., Ogaki ...

1. A printed wiring board, comprising:
a plurality of conductive layers;
a plurality of resin insulation layers;
a through-hole conductor penetrating through at least one of the resin insulation layers such that the through-hole conductor
has a first-surface-side land and a second-surface-side land;

a first-surface-side signal line formed on one of the resin insulation layers such that the first-surface-side signal line
is connecting the first-surface-side land and one of the conductive layers on the one of the resin insulation layers; and

a second-surface-side signal line formed on one of the resin insulation layers such that the second-surface-side signal line
is connecting the second-surface-side land and one of the conductive layers on the one of the resin insulation layers,

wherein the plurality of conductive layers includes a first-surface-side conductive layer formed over the first-surface-side
land of the through-hole conductor such that the first-surface-side conductive layer has a solid pattern having an opening
portion corresponding to the first-surface-side land and formed concentric with the first-surface-side land, and a second-surface-side
conductive layer formed over the second-surface-side land of the through-hole conductor such that the second-surface-side
conductive layer has a solid pattern having an opening portion corresponding to the second-surface-side land and formed concentric
with the second-surface-side land.

US Pat. No. 9,713,267

METHOD FOR MANUFACTURING PRINTED WIRING BOARD WITH CONDUCTIVE POST AND PRINTED WIRING BOARD WITH CONDUCTIVE POST

IBIDEN CO., LTD., Ogaki-...

1. A method for manufacturing a printed wiring board, comprising:
forming a first conductive layer on a first metallic foil provided on a carrier such that the first conductive layer includes
a mounting pattern positioned to connect an electronic component via a plurality of conductive posts;

forming on the first metallic foil a laminate structure comprising a resin insulating layer and a second metallic foil such
that the first conductive layer is embedded into a surface of the resin insulating layer;

forming a hole for a via conductor through the laminate structure such that the hole exposes the first conductive layer;
removing the carrier from the first metallic foil such that the first metallic foil is exposed;
forming a metal film on the laminate structure and the first metallic film such that the metal film is formed on the first
metallic foil, on the second metallic foil and inside the hole;

forming a plating resist film on the metal film such that the plating resist film has a pattern exposing portion of the metal
film substantially corresponding to the mounting pattern, the hole and portion of the second metallic foil for forming a second
conductive layer on the resin insulating film;

applying electroplating on the portion of the metal film exposed by the pattern of the plating resist film such that an electroplating
conductive layer is formed on the portion of the metal film not covered by the plating resist film;

removing the plating resist film from the metal film such that portion of the metal film below the plating resist film are
exposed; and

applying etching removal on the portion of the metal film exposed by the removing of the plating resist film such that portion
of the first metallic foil and second metallic foil below the portion of the metal film exposed by the removing of the plating
resist film is removed and that the plurality of conductive posts protruding from the surface of the resin insulating layer
is formed on the mounting pattern,

wherein the applying of etching removal comprises applying of etching removal such that the surface of the mounting pattern
of the first conductive layer has portions being in contact with the conductive posts and portions not being in contact with
the conductive posts and recessed with respect to the portions being in contact with the conductive posts and the surface
of the resin insulating layer, each of the conductive posts has a three layer structure comprising a metal layer formed on
the first conductive layer, a first metal film formed on the metal layer, and a second metal film formed on the first metal
film, the first conductive layer comprises an electroplating film, the metal layer is one of a copper foil and a nickel foil,
the first metal film is one of an electroless plating film and a sputter film, and the second metal film is an electroplating
film formed such that the electroplating film has a thickness which is greater than a thickness of the metal layer and a thickness
of the first metal film.

US Pat. No. 9,707,516

HONEYCOMB FILTER

IBIDEN CO., LTD., Ogaki-...

1. A honeycomb filter comprising:
a plurality of cells through which exhaust gas is to flow and which include exhaust gas introduction cells and exhaust gas
emission cells, the exhaust gas introduction cells each having an open end at an exhaust gas introduction side and a plugged
end at an exhaust gas emission side, the exhaust gas emission cells each having an open end at the exhaust gas emission side
and a plugged end at the exhaust gas introduction side;

porous cell walls defining rims of the plurality of cells;
a round cross sectional shape;
a ratio of length of the honeycomb filter to a diameter of the round cross sectional shape of less than 1.0;
the exhaust gas introduction cells and the exhaust gas emission cells each having a uniform cross sectional shape except for
a plugged portion in a cross section perpendicular to a longitudinal direction of the plurality of cells thoroughly from the
exhaust gas introduction side to the exhaust gas emission side;

the exhaust gas introduction cells including first exhaust gas introduction cells and second exhaust gas introduction cells,
each of the second exhaust gas introduction cells having a cross sectional area larger than a cross sectional area of each
of the first exhaust gas introduction cells in the cross section perpendicular to the longitudinal direction of the plurality
of cells;

each of the exhaust gas emission cells having a cross sectional area equal to or larger than the cross sectional area of each
of the second exhaust gas introduction cells in the cross section perpendicular to the longitudinal direction of the plurality
of cells; and

a total volume of the exhaust gas introduction cells being larger than a total volume of the exhaust gas emission cells,
wherein, in the cross section perpendicular to the longitudinal direction of the plurality of cells, the exhaust gas introduction
cells and the exhaust gas emission cells are each in a shape formed by a curved line,

wherein the porous cell walls include
first porous cell walls separating the first exhaust gas introduction cells and the exhaust gas emission cells, and
second porous cell walls separating the second exhaust gas introduction cells and the exhaust gas emission cells, and
wherein a thickness of each of the first porous cell walls is smaller than a thickness of each of the second porous cell walls.

US Pat. No. 9,711,439

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

IBIDEN CO., LTD., Ogaki-...

1. A printed wiring board, comprising:
an insulating layer comprising an insulating material; and
a conductor layer formed on a surface of the insulating layer and comprising a plurality of conductor pads and a plurality
of conductor patterns such that the plurality of conductor pads is positioned to connect at least one electronic component
and that the plurality of conductor patterns is formed between the conductor pads,

wherein the plurality of conductor patterns is formed such that each of the conductor patterns has a pattern width of 3 ?m
or less and that the conductor patterns have a pattern interval of 3 ?m or less between adjacent conductor patterns, and the
insulating layer has a plurality of recess portions formed on the surface between the conductor patterns at least along the
conductor patterns such that the plurality of recess portions has a depth in a range of 0.1 ?m to 2.0 ?m relative to a contact
interface at which the conductor patterns and the insulating layer are in contact with each other.

US Pat. No. 9,704,795

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

IBIDEN CO., LTD., Ogaki-...

1. A printed wiring board, comprising:
a resin insulating layer;
a first conductor layer embedded into a first surface of the resin insulating layer and comprising a plurality of wirings
such that the plurality of wirings includes a plurality of connecting portions positioned to connect an electronic component,
respectively;

a second conductor layer projecting from a second surface of the resin insulating layer on an opposite side with respect to
the first surface of the resin insulating layer;

a solder resist layer formed on the first surface of the resin insulating layer such that the solder resist layer is covering
the first conductor layer and has an opening structure exposing the connecting portions of the wirings; and

a plurality of metal posts formed on the plurality of connecting portions respectively such that each of the metal posts has
a width which is larger than a width of a respective one of the wirings having the connecting portions,

wherein the plurality of wirings is formed such that the connecting portions are positioned side by side on every other adjacent
one of the wirings.

US Pat. No. 9,656,253

ZEOLITE, METHOD FOR MANUFACTURING ZEOLITE, HONEYCOMB CATALYST, AND EXHAUST GAS PURIFYING APPARATUS

IBIDEN CO., LTD., Ogaki-...

1. A zeolite comprising:
a CHA structure;
a SiO2/Al2O3 composition ratio less than about 15;

an average particle size from about 0.1 ?m to 0.46 ?m; and
Cu supported on the zeolite.

US Pat. No. 10,219,383

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

IBIDEN CO. , LTD., Ogaki...

1. A printed wiring board, comprising:a laminate comprising a plurality of resin insulating layers and a plurality of conductor layers such that the resin insulating layers and the conductor layers are laminated alternately and that the laminate has a through hole opening to a first surface of the laminate and a component accommodating cavity configured to accommodate an electronic component and having an opening part formed on a second surface of the laminate on an opposite side with respect to the first surface,
wherein the through hole is formed through the laminate such that the through hole is extending to the component accommodating cavity, and the laminate has a resin coating formed on an inner wall surface of the through hole.