US Pat. No. 9,485,859

FLEXIBLE CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME

FuKui Precision Component...

1. A flexible circuit board comprising:
a first base layer;
a circuit layer coupled to a side of the first base layer and comprising a linear signal line, two grounding lines located
at two opposite sides of the linear signal line, and two hollow areas located between the linear signal line and the grounding
lines;

a second base layer; and
a bonding layer coupling the second base layer to the circuit layer and defining a first opening corresponding to the linear
signal line and communicating with the hollow areas of the circuit layer;

wherein the first opening of the bonding layer and the hollow areas of the circuit layer collectively define an air medium
layer surrounding the linear signal line.

US Pat. No. 9,615,445

FLEXIBLE CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME

FuKui Precision Component...

1. A flexible circuit board comprising:
two copper clad laminates, each comprising an insulating base and an outer circuit layer;
a circuit pattern located between the two copper clad laminates, and comprising a linear signal line, two grounding lines
located at two opposite sides of the linear signal line, and two hollow areas located between the linear signal line and the
grounding lines; and

two bonding layers, each located between the circuit pattern and a corresponding copper clad laminate, each of the boding
layers defining a slot without adhesive therein;

wherein the bonding layers are spaced from the linear signal line by the slots, the slots of the two bonding layers and the
two hollow areas of the circuit pattern cooperatively defining an air medium layer enclosing the linear signal line.

US Pat. No. 9,622,340

FLEXIBLE CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME

HongQiSheng Precision Ele...

1. A flexible circuit board comprising:
an insulating layer comprising a first face and a second face opposite to the first face;
a linear signal line located on the first face of the insulating layer;
a metal coating layer covering the linear signal line on the first face of the insulating layer, and having a thickness less
than that of the linear signal line, and an electrical conductivity larger than that of the linear signal line;

a plurality of grounding lines located on the first face of the insulating layer, and located at two opposite sides of the
linear signal line;

a circuit layer located on the second face of the insulating layer; and
an electromagnetic shielding layer covering the linear signal line and the grounding lines;
wherein the linear signal line and the grounding lines are located between the electromagnetic shielding layer and the circuit
layer.

US Pat. No. 9,693,448

FLEXIBLE CIRCUIT BOARD AND METHOD FOR MAKING THE SAME

FuKui Precision Component...

1. A flexible circuit board comprising:
a wiring layer comprising at least one signal line, two ground lines positioned at two sides of the at least one signal line,
and at least two gaps for separating the at least one signal line and the ground lines from each other, each gap comprising
two opening portions each located at positions corresponding to one end of the adjacent signal line;

two photosensitive resin layers; and
two electromagnetic interference shielding layers;
wherein the two photosensitive resin layers cover two opposite surfaces of the at least one signal line and the opening portions,
and are connected to each end of each ground line, each electromagnetic interference shielding layer covers a surface of one
photosensitive resin layer away from the signal line, portions of the two ground lines not connected to the photosensitive
resin layer, and portions of the gaps not covered by the two photosensitive resin layers, thereby causing the two electromagnetic
interference shielding layers, the two photosensitive resin layers, the signal line, and the ground lines to surround the
portions of each gap not covered by the two photosensitive resin layers and cooperatively define a receiving chamber, each
end of each receiving chamber is in air communication with one opening portion of the corresponding gap to define a cavity
with air.

US Pat. No. 9,907,167

METHOD FOR MANUFACTURING A PRINTED CIRCUIT BOARD WITH HIGH-CAPACITY COPPER CIRCUIT

Avary Holding (Shenzhen) ...

1. A method for manufacturing a printed board with high-capacity copper circuit comprising:
providing a single side cladding copper substrate, and the single side cladding copper substrate comprising a supporting sheet
and a base copper foil on the supporting sheet;

forming a first conductive trace pattern on a surface a surface of the base copper foil;
forming a first protecting layer on the first conductive trace pattern, and the first protecting layer being filled in first
gaps between the first conductive trace pattern;

removing the supporting sheet;
forming a second conductive trace pattern on another surfaces of the base copper foil, the second conductive trace pattern
and the base copper foil together form a plurality of second gaps;

etching the base copper foil exposed by the second gaps to form a base conductive trace pattern, the base conductive trace
pattern comprising a plurality of third gaps; and

laminating a second protecting layer on the second conductive trace pattern, the second protecting layer being filled in the
plurality of second gaps and the plurality of third gaps.

US Pat. No. 9,706,640

METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD

FuKui Precision Component...

1. A method for manufacturing a printed circuit board, comprising:
providing a first printed circuit substrate, the first printed circuit substrate comprising a substrate layer and a first
conductive circuit layer comprising at least one signal wire;

defining at least two first grooves in the substrate layer, any one of the at least two first grooves defined in one side
of the at least one signal wire;

providing a third copper;
defining a second groove in the third copper and then obtaining a second printed circuit substrate; and
bonding the second printed circuit substrate with the first printed circuit substrate, wherein the first groove is opposite
to the second groove, the first groove and the second groove forming a space, and the signal wire being surrounded by air
in the space.

US Pat. No. 9,807,877

METHOD FOR MAKING A MULTILAYER FLEXIBLE PRINTED CIRCUIT BOARD

HongQiSheng Precision Ele...

1. A method for making a multilayer flexible printed circuit board comprising:
providing an inner wiring substrate and at least one single-sided copper substrate, each single-sided copper substrate comprising
an adhesive plate;

defining at least one through hole in each single-sided copper substrate;
forming an intermediate product by attaching the adhesive plate of each single-sided copper substrate onto one surface of
the inner wiring substrate to expose the inner wiring substrate through the through hole, and heating and pressing the single-sided
copper substrate together to cause the adhesive of the adhesive plate to extend towards a center of the through hole along
a direction substantially perpendicular to a center axis of the electrically conductive hole to form a stepped portion;

covering each single-sided copper substrate of the intermediate product with a dry film, wherein the dry film is further formed
over exposed inner wiring substrate, and then pressing the dry film to cause the dry film to fill gaps formed by the exposed
inner wiring substrate; and

forming an outer wiring plate by etching each single-sided copper substrate of the intermediate product, and removing the
dry film to form the multilayer flexible printed circuit board.

US Pat. No. 9,832,888

CIRCUIT BOARD AND METHOD FOR MAKING THE SAME

Avary Holding (Shenzhen) ...

1. A method of manufacturing a circuit board, comprising:
providing a substrate with double-side copper layers, wherein the substrate comprises a base layer, a first copper layer and
a second copper layer, the first copper layer and the second copper layer are formed on opposite surfaces of the base layer;

opening a through hole on the substrate, wherein the through hole comprises a first hole and a second hole communicating with
the first hole, the first hole penetrates through the base layer and the second hole penetrates through the first copper layer;
forming a wire layer by copper plating, wherein the wire layer comprises a first portion filled in the through hole and a
second portion formed on the first portion extending in a direction facing away from the base layer, the wire layer is electrically
conductive between the first copper layer and the second copper layer through the first portion; wherein the manufacturing
method of forming the wire layer is further comprising the steps of:
applying a first photosensitive film and a second photosensitive film on the opposite surfaces of the substrate, the first
photosensitive film covers the first copper layer and the open end of the through hole, the second photosensitive film covers
the second copper layer;

forming a mask pattern on the first and second photosensitive films after exposing and developing the first and second photosensitive
films, the mask pattern comprises an opening which corresponds to the open end of the through hole, the aperture diameter
of the opening is less than the aperture diameter of the through hole;
forming a wire layer corresponding to the mask pattern by copper plating, the second portion is filled in the opening; and
removing the first and second photosensitive films; and
removing the first copper layer and the second copper layer which are not covered with the wire layer by using a quick etching
treatment so as to respectively form a first wire pattern layer and a second wire pattern layer, and the first portion which
is flush with the first copper layer and not cover with the second portion.

US Pat. No. 9,807,868

METHOD FOR MAKING CONDUCTIVE POLYMER, AND COMPOSITE FILM AND CIRCUIT BOARD HAVING THE CONDUCTIVE POLYMER

Avary Holding (Shenzhen) ...

1. A method for making a conductive polymer comprising:
mixing liquid crystal monomers, a silver complex, an initiator, and a catalytic agent to form a mixture, the liquid crystal
monomers having a mass percentage of about 42.2% to about 52.2% of a total mass of the mixture, the silver complex having
a mass percentage of about 43.1% to about 53.1% of the total mass of the mixture, the initiator having a mass percentage of
about 0.85% to about 1.35% of the total mass of the mixture, and the catalytic agent having a mass percentage of about 2.85%
to about 4.35% of the total mass of the mixture;

adding a solvent into the mixture, the mixture and the solvent being in a ratio from 3:17 to 1:3 by weight; and
heating the mixture to undergo atom transfer radical polymerization.

US Pat. No. 9,788,437

METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD WITH ETCHING PROCESS TO PARTIALLY REMOVE CONDUCTIVE LAYER

Avary Holding (Shenzhen) ...

1. A method of manufacturing a printed circuit board comprising: providing a substrate comprising a base layer and a first
copper foil layer formed on one side of the base layer; electroplating a first conductive layer on a portion of a surface
of the first copper foil layer away from the base layer; electroplating a first surface treatment patterned layer on a portion
of a surface of the first conductive layer away from the first copper foil layer, to leave other portion of the first conductive
layer and other portion of the first copper foil layer exposed from the first surface treatment patterned layer; and etching
to remove exposed portion of the first copper foil layer and to thin exposed portion of the first conductive layer.

US Pat. No. 9,872,393

METHOD FOR MAKING A CIRCUIT BOARD

Avary Holding (Shenzhen) ...

1. A method for making a circuit board comprising:
providing a supporting plate comprising a supporting portion and at least one first copper layer connected to at least one
surface of the supporting portion;

connecting at least one contact pad to a surface of each of the at least one first copper layer away from the supporting portion;
connecting at least one passive component to a surface of each of the at least one contact pad away from the first copper
layer;

forming a first resin layer on a portion of each of the at least one first copper layer besides the passive component;
disposing a core layer defining at least one through hole on a surface of each first resin layer away from the first copper
layer to allow the passive component to be received in the through hole, and disposing a second resin layer and a second copper
layer successively on each core layer and the passive component;

pressing the two second copper layer causing the supporting portion, the first copper layer, the contact pad, the passive
component, the first resin layer, the core layer, the second resin layer, and the second copper layer to be connected to each
other to form a first intermediate product, wherein the first resin layer and the second resin layer flows to fill gaps between
the first copper layer, the contact pad, the passive component, the core layer, and the second copper layer, thereby connecting
to each other to from a resin packing layer;

removing the supporting portion of the first intermediate product to form at least one second intermediate product;
defining a plurality of plating holes at a portion of the first copper layer and the second copper layer, and a corresponding
portion of the resin packing layer comprised in each of the at least one second intermediate product, an end of each of the
plurality of plating holes being closed by one surface of the core layer; and

forming a conductive portion in each of the plurality of plating holes which is electrically connected to the first copper
layer, the second copper layer, and the core layer; and

etching the first copper layer and the second copper layer to form a first conductive wire layer and a second conductive wire
layer.

US Pat. No. 10,104,771

METHOD FOR MAKING A CIRCUIT BOARD

Avary Holding (Shenzhen) ...

1. A method for making a circuit board comprising:providing a silver clad laminate, the silver clad laminate comprising a substrate and two silver foils attached to two opposite surfaces of the substrate, each of the two silver foils comprising a first area and a second area;
forming at least one through hole on the silver clad laminate, the through hole comprising an annular side wall, the annular side wall comprising an annular middle wall and two annular edge walls connected to two sides of the annular middle wall, the annular middle wall being a surface of the substrate, each of the two annular edge walls being a surface of a silver foil;
forming an organic conductive film on the annular middle wall;
forming a dry film pattern layer on a surface of the second area away from the substrate to obtain an intermediate product;
plating copper on the intermediate product to form a copper circuit layer on a surface of the first area away from the substrate and to form a via hole in the through hole;
removing the dry film pattern layer from the second area of the silver foil to expose the surface of the second area away from the substrate;
etching the second area of the silver foil away by an etchant and the first area defining to be a silver circuit layer, the silver circuit layer being between the substrate and the copper circuit layer, the copper circuit layer and the silver circuit layer defining a conductive circuit layer.

US Pat. No. 10,010,001

CIRCUIT BOARD AND METHOD FOR MAKING THE SAME

Avago Holding (Shenzhen) ...

1. A circuit board comprising:a substrate;
a first conductive circuit layer and a second conductive circuit layer on opposite surfaces of the substrate;
a first insulating layer on a surface of the first conductive circuit layer away from the substrate;
a second insulating layer on a surface of the second conductive circuit layer away from the substrate;
a third insulating layer on a surface of the first insulating layer away from the first conductive circuit layer;
a fourth insulating layer on a surface of the second insulating layer away from the second conductive circuit layer;
a third conductive circuit layer on a surface of the third insulating layer away from the first insulating layer;
a fourth conductive circuit layer on a surface of the fourth insulating layer away from the second insulating layer;
at least one first conductive hole electrically connecting the third conductive circuit layer, the first conductive circuit layer and the second conductive circuit layer; and
at least one second conductive hole electrically connecting the fourth conductive circuit layer, the second conductive circuit layer, and the first conductive circuit layer;
wherein each first conductive hole comprise a first conductive blind hole, and a third conductive blind hole aligned with and electrically connected to the first conductive blind hole, the first conductive blind hole passes through the first insulating layer, the first conductive circuit layer, and the substrate, the third conductive blind hole passes through the third conductive circuit layer and the third insulating layer;
wherein each second conductive hole comprises a second conductive blind hole, and a fourth conductive blind hole aligned with and electrically connected to the second conductive blind hole, the second conductive blind hole passes through the second insulating layer, the second conductive circuit layer, and the substrate, the fourth conductive blind hole passes through the fourth conductive circuit layer and the fourth insulating layer.

US Pat. No. 10,111,336

METHOD OF MAKING A FLEXIBLE PRINTED CIRCUIT BOARD

Avary Holding (Shenzhen) ...

1. A method for making a flexible printed circuit board comprising:providing a carrier comprising an insulating layer and a copper foil formed on at least one surface of the insulating layer, the copper foil having a wiring area and a non-wiring area besides the wiring area;
forming a first photoresist layer on the copper foil, the first photoresist layer having a first hollow pattern to expose the wiring area;
electroplating copper in the first hollow pattern, thereby forming a copper electroplating layer on the wiring area, the copper electroplating layer having a first portion and a second portion besides the first portion;
forming and covering a second photoresist layer on the first photoresist layer and the copper electroplating layer, the second photoresist layer having a second hollow pattern to expose at least the first portion, the second hollow pattern totally aligned with the first hollow pattern having the copper electroplating layer formed therein;
electroplating nickel in the second hollow pattern, thereby forming a nickel electroplating layer at least on the first portion;
removing the first photoresist layer and the second photoresist layer;
etching to remove the non-wiring area;
covering a cover film on the second portion, the cover film filling in gaps of the copper electroplating layer and being spaced from sidewalls of the first portion; and
chemically plating gold on a top surface of the nickel electroplating layer facing away from the first portion and the sidewalls of the first portion to form a gold chemical-plating layer, thereby forming the flexible printed circuit board.

US Pat. No. 10,117,328

FLEXIBLE CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME

Avary Holding (Shenzhen) ...

1. A flexible circuit board comprising:a first conductive substrate comprising a first insulating layer, a first signal line, a second signal line, and a plurality of first conductive posts; the first insulating layer comprising a first surface and a second surface opposite to the first surface; and the first signal line forming on the first surface, the second signal line forming on the second surface, and the first conductive posts extends through the first signal line and the first insulating layer, the first signal line being electrically connected with the second signal line via the first conductive posts;
an outer layer being formed on the first signal line; the outer layer comprising a first pad and a second pad;
a second conductive post being electrically connected the first pad and the first signal line; and
a third conductive post being electrically connected the second pad and the second signal line.

US Pat. No. 9,980,386

FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

HongQiSheng Precision Ele...

1. A method for manufacturing a flexible printed circuit board comprising:providing a first double-sided circuit substrate which comprises an electronic component, wherein the first double-sided circuit substrate further comprises a first base layer, two first conductive wiring layers formed on two opposite surfaces of the first base layer, and a first isolated layer formed on one surface of each first conductive wiring layer facing away from the first base layer, one of the first conductive wiring layers being exposed from the first isolated layer to form at least one pad, the electronic component is electrically connected to the pad;
providing a multilayer circuit substrate and defining a mounting groove in the multilayer circuit substrate, wherein multilayer circuit substrate comprises a second double-sided circuit substrate, the second double-sided circuit substrate comprises a second base layer and two second conductive wiring layers formed on two opposite surfaces of the second base layer, the multilayer circuit substrate further comprises at least one circuit substrate formed on each surface of the second double-sided circuit substrate through a build-up process, each circuit substrate comprises a second isolated layer formed on the surface of the second double-sided circuit substrate through an adhesive layer and a third conductive wiring layer formed on the second isolated layer, the mounting groove passes through each third conductive wiring layer, each second isolated layer, the adhesive layer, and the second double-sided circuit substrate, the circuit substrate defines at least one blind hole, for electrically connecting each third conductive wiring layer to the second conductive wiring layer when forming conductive material on an inner wall of the blind hole;
attaching the multilayer circuit substrate to the first double-sided circuit substrate through an adhesive layer, causing the electronic component to be received in the mounting groove, thereby forming an intermediate product; and
forming at least one conductive post in the intermediate product which electrically connects the multilayer circuit substrate to the first double-sided circuit substrate, thereby forming the flexible printed circuit board.

US Pat. No. 9,860,977

TRANSPARENT FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

HongQiSheng Precision Ele...

1. A transparent flexible printed circuit board (FPCB) comprising:
an insulating resin layer comprising a first surface and a second surface facing away from the first surface;
at least one through hole defined in the insulating resin layer through the first surface and the second surface;
a first electrically conductive wiring layer formed on the first surface;
a second electrically conductive wiring layer formed on the second surface, the first electrically conductive wiring layer
and the second electrically conductive wiring layer made of electrically conductive resin, the first electrically conductive
wiring layer and the second electrically conductive wiring layer filling in each through hole to form an electrically conductive
portion, each of the first electrically conductive wiring layer and the second electrically conductive wiring layer has a
plurality of wiring openings; and

a cover film covering each of the first electrically conductive wiring layer and the second electrically conductive wiring
layer, and further filling in the plurality of wiring openings.

US Pat. No. 9,992,858

PRINTED CIRCUIT BOARD

Avary Holding (Shenzhen) ...

1. A printed circuit board, comprising:a first printed circuit substrate, the first printed circuit substrate comprising a substrate layer and a first conductive circuit layer, the first conductive circuit layer being defined on the substrate layer, the substrate layer comprising first grooves, the first conductive circuit layer including at least one signal wire, at least one of the first grooves being defined in one side of the at least one signal wire, wherein the first printed circuit substrate further comprises a second copper layer, the first conductive circuit layer further comprising at least two ground wires, the at least two ground wires being arranged on opposite sides of the signal wire, the at least two ground wires being separate from the signal wire; wherein the substrate layer comprises conductive holes, the conductive holes being equally distributed along the at least two ground wires and electrically connecting the at least two ground wires to the second copper layer; and
a second printed circuit substrate, the second printed circuit substrate being defined on the first printed circuit substrate, the second circuit substrate comprising a third copper layer, a second groove being opened in the third copper layer, the first groove being opposite to the second groove, the first groove and the second groove forming a space, the signal wire being surrounded by air in the space, wherein the second printed circuit substrate is coupled to the first printed circuit substrate by a conductive adhesive layer, the second copper layer, and the conductive holes; the conductive adhesive layer and the third copper layer forming a shielding structure, the shielding structure surrounding the signal wire.

US Pat. No. 10,136,207

PRINTED CIRCUIT BOARD USED AS VOICE COIL, METHOD FOR MANUFACTURING THE SAME AND LOUDSPEAKER WITH THE SAME

Avary Holding (Shenzhen) ...

1. A printed circuit board used as a voice coil comprising N board units stacked over one another, where N?1, the printed circuit board having a top surface and a bottom surface opposite to the top surface, each board unit having a first electrically connecting region and a second electrically connecting region, all of the first electrically connecting regions being stacked over one another, all of the second electrically connecting regions being stacked over one another, each board unit having a first circuit structure, a base, and a second circuit structure arranged from top to bottom, in each two adjacent board units, the first electrically connecting region of the second circuit structure of an upper board unit being electrically connected in series with the first electrically connecting region of the first circuit structure of a lower board unit, in each board unit, the first circuit structure being electrically connected in series with the second circuit structure in the second electrically connecting region, each first circuit structure starting in the first electrically connecting region, spiraling around and closes to the second electrically connecting region, and ending in the second electrically connecting region, each second circuit structure starting in the second electrically connecting region, spiraling around and away from the second electrically connecting region, and ending in the first electrically connecting region, each first circuit structure and second circuit structure spiraling around the second electrically connecting region along a clockwise direction or a counterclockwise direction, starting points in the first electrically connecting regions of the first circuit structures of the board units being staggered, and starting points in the second electrically connecting regions of the second circuit structures of the board units being staggered, ending points in the second electrically connecting regions of the first circuit structures of the board units being staggered, and ending points in the first electrically connecting regions of the second circuit structures of the board units being staggered.

US Pat. No. 10,187,984

CIRCUIT BOARD AND METHOD FOR MAKING THE SAME

Avary Holding (Shenzhen) ...

1. A circuit board comprising: a substrate; at least one conductive circuit layer attached to the substrate; at least one plating film attached to a surface of each of the at least one conductive circuit layer away from the substrate, each of the at least one plating film comprises a surface away from each of the at least one conductive circuit layer, and at least one side surface connecting each of the at least one conductive circuit layer and the surface away from each of the at least one conductive circuit layer; and a covering film; wherein the circuit board defines at least one through hole, each of the at least one through hole passes through the substrate, the at least one conductive circuit layer, and each of the at least one plating film, the covering film covers an exposing surface of each of the at least one conductive circuit layer, the at least one side surface of each of the at least one plating film, and a side wall of each of the at least one through hole, wherein a portion of the surface of the substrate attached to each of the at least one conductive circuit layer is exposed through each of the at least one conductive circuit layer, the exposed portion of the surface of the substrate attached to each of the at least one conductive circuit layer is covered by the covering film.

US Pat. No. 10,205,487

WIRELESS POWER CONSORTIUM DEVICE AND METHOD FOR MANUFACTURING THE SAME

Avary Holding (Shenzhen) ...

1. A wireless power consortium device, comprising:a flexible substrate layer;
at least one first wireless power consortium (WPC) coil being formed on the flexible substrate layer;
at least one first near field communication (NFC) coil being formed on the flexible substrate layer; wherein the at least one first NFC coil surrounds the at least one first WPC coil;
at least one WPC module being formed on the flexible substrate layer, wherein each of the at least one WPC module comprises a first matching circuit and a WPC power supply chip electrically connected to the first matching circuit; and
at least one NFC module being formed on the flexible substrate layer, wherein each of the at least one NFC module comprises a second matching circuit and an NFC controlling chip electrically connected to the second matching circuit; wherein the first matching circuit and the second matching circuit are different parts of one circuit and are formed on the flexible substrate layer.

US Pat. No. 10,349,533

MULTILAYER CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

HongQiSheng Precision Ele...

1. A multilayer circuit board comprising:an inner circuit board comprising at least one first mounting region and at least one second mounting region;
at least one outer circuit board formed on the inner circuit board;
a solder mask; and
a tin layer formed on a surface of the inner circuit board connecting the at least one outer circuit board except the at least one first mounting region;
wherein the at least one outer circuit board comprises at least one first opening and at least one second opening; the at least one first mounting region is exposed from the at least one first opening, a portion of the tin layer covering the at least one second mounting region is exposed from the at least one second opening; the inner circuit board, the tin layer, and the at least one outer circuit board together form a middle structure; the solder mask covers the middle structure except the at least one first mounting region and the portion of the tin layer covering the at least one second mounting region; a treatment layer is formed on the at least one first mounting region.

US Pat. No. 10,299,367

CIRCUIT BOARD HAVING CONDUCTIVE POLYMER

Avary Holding (Shenzhen) ...

1. A circuit board comprising:a flexible board;
a composite film formed on the flexible board and defining at least one through hole, the composite film comprising:
a base layer having an active surface; and
a conductive layer formed by coated a conductive polymer on the active surface, the conductive polymer made by a mixture comprising liquid crystal monomers, a silver complex, an initiator, and a catalytic agent, and a solvent, the mixture is heated to undergo atom transfer radical polymerization; and
a copper layer covering the conductive layer and an inner wall of each of the at least one through hole, the copper layer electrically connected to the flexible substrate by the at least one through hole;
wherein the liquid crystal monomers has a mass percentage of about 42.2% to about 52.2% of a total mass of the mixture, the silver complex has a mass percentage of about 43.1% to about 53.1% of the total mass of the mixture, the initiator has a mass percentage of about 0.85% to about 1.35% of the total mass of the mixture, the catalytic agent has a mass percentage of about 2.85% to about 4.35% of the total mass of the mixture, the mixture and the solvent has a ratio selected from 3:17 to 1:3 by weight, and the silver complex in the conductive polymer is bonded to the active surface.

US Pat. No. 10,349,518

CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

HongQiSheng Precision Ele...

1. A method of manufacturing an embedded circuit board, comprising:providing a first adhesive coated copper, the first adhesive coated copper comprising a first copper layer pre-formed with at least two first positioning holes and a first adhesive layer formed on a surface of the first copper layer;
adhering at least one first electronic element on the first adhesive layer, wherein electrodes of the at least one first electronic element face their corresponding first positioning holes;
providing a second adhesive coated copper;
providing a semi-cured film, pressing the first adhesive coated copper and the second adhesive coated copper on opposite surfaces of the semi-cured film, thereby embedding the at least one first electronic element in the semi-cured film;
partially removing the first adhesive layer to form first holes for exposing electrodes of the at least one first electronic element;
electrically connecting the electrodes of the at least one first electronic element with the first copper layer.

US Pat. No. 10,321,561

FLEXIBLE PRINTED CIRCUIT BOARD, PRINTED CIRCUIT BOARD STRUCTURE AND METHOD FOR MANUFACTURING FLEXIBLE PRINTED CIRCUIT BOARD

Avary Holding (Shenzhen) ...

1. A flexible printed circuit board, comprising:a first conductive pattern layer, the first conductive pattern layer comprising a plurality of first conductive pads;
a second conductive pattern layer, the second conductive pattern layer comprising a plurality of second conductive pads;
a plurality of first through holes being defined through the flexible printed circuit board, each of the plurality of first through holes corresponding to and being defined through one first conductive pad;
a plurality of second through holes being defined through the flexible printed circuit board, each of the plurality of second through holes corresponding to and being defined through one second conductive pad;
a plurality of first conductive pillars, each of the plurality of first conductive pillars corresponding to and being received in one first through hole to electrically connect to one first conductive pad, the plurality of first conductive pillars being spaced from the second conductive pattern layer, and
a plurality of second conductive pillars, each of the plurality of second conductive pillars corresponding to and being received in one second through hole to electrically connect to one second conductive pad, the plurality of second conductive pillars being spaced from the first conductive pattern layer;
wherein the plurality of first conductive pillars and the plurality of second conductive pillars are exposed from one surface of the flexible printed circuit board to form a plurality of electrical contact pads, a plurality of first grooves and a plurality of second grooves are defined from an outer surface of the flexible printed circuit board on the second conductive pattern layer side to a surface of the second conductive pattern layer away from the first conductive pattern layer; each of the plurality of first grooves is aligned with and corresponds to one first conductive pillar, and each of the plurality of second grooves is aligned with and corresponds to one second conductive pillar.

US Pat. No. 10,405,431

FLEXIBLE PRINTED CIRCUIT BOARD

Avary Holding (Shenzhen) ...

1. A flexible printed circuit board comprising:an insulating layer;
a wiring area formed on at least one surface of the insulating layer;
a copper electroplating layer formed on and corresponding to the wiring area, the copper electroplating layer comprising a first portion and a second portion besides the first portion;
a nickel electroplating layer formed on a top surface of at least the first portion facing away from the wiring area, the nickel electroplating layer exposing sidewalls of the first portion;
a cover film formed on the second portion and filling in gaps of the copper electroplating layer; and
a gold chemical-plating layer formed on a top surface of the nickel electroplating layer facing away from the first portion and the sidewalls of the first portion.

US Pat. No. 10,285,260

FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME

Avary Holding (Shenzhen) ...

1. A method for manufacturing a flexible printed circuit board, comprising:providing a substrate comprising a base layer, a first copper layer and a second copper layer, the first copper formed at one side of the base layer, and the second copper layer formed at an opposite side of the base layer;
forming a first hole extending through the base layer and the first copper layer, a bottom of the first hole sealed by the second copper layer;
posting dry films on the first copper layer and the second copper layer;
removing part of the dry films which corresponding to the part of the first hole on the first copper layer, to expose part of the first copper layer, wherein the first hole is surrounded by the exposed first copper layer and presented with a ring shape;
reducing a thickness of the copper of the exposed first copper layer to form a second hole on the first copper layer, which is communicated with the first hole;
partial plating copper at the first and the second hole to form an annular copper ring and a conducting hole, the plated copper of the conducting hole directly contacting a surface of the second copper layer facing the base layer, a surface of the annular copper ring being at a same level with a surface of the first copper layer; and
removing the dry films, and processing the first copper layer to form a circuit layer, to form the flexible printed circuit board.

US Pat. No. 10,278,307

COOLING PLATE AND METHOD FOR MANUFACTURING THEREOF

Avary Holding (Shenzhen) ...

1. A cooling plate configured with an electronic device for heat dissipation, the cooling plate comprising:a first plate;
a second plate;
a bonding line connecting between the first plate and the second plate;
a plurality of supporting columns and a cooling liquid;
wherein the first plate, the second plate, and the bonding line together define a cavity, the plurality of supporting columns and the cooling liquid are received in the cavity; and
wherein the plurality of supporting columns connects perpendicularly with the first plate and the second plate, the cooling liquid communicates among the plurality of the supporting columns; the first plate and the plurality of supporting columns are integrated with the electronic device and are a portion of the electronic device.

US Pat. No. 10,383,223

METHOD FOR MAKING CIRCUIT BOARD

Avary Holding (Shenzhen) ...

1. A method for making a circuit board comprising:providing a copper clad laminate, the copper clad laminate comprises a substrate and at least one copper layer, the substrate comprises at least one first surface, each of the at least one copper layer is attached to one of the at least one first surface;
etching the at least one copper layer to form at least one conductive circuit layer, a portion of each of the at least one first surface is exposed through one of the at least one conductive circuit layer, each of the at least one conductive circuit layer comprises a second surface away from the substrate;
forming a dry film pattern layer, the dry film pattern layer covers the exposed portion of each of the at least one first surface, and a portion of the second surface, the other portion of the second surface not being covered by the dry film pattern layer is an exposing area;
forming at least two plating films on the exposing area, each of the at least two plating films comprises a third surface away from the second surface and at least one side surface connecting the second surface and the third surface;
removing the dry film pattern layer;
forming at least one through hole to form an intermediate product, each of the at least one through hole is located between two adjacent ones of the at least two plating films, each of the at least one through hole passes through the substrate, and the at least one conductive circuit layer;
providing at least one adhesive sheet, each of the at least one adhesive sheet comprises at least one opening, each of the at least one opening is aligned with the third surface of each of the at least two plating films; and
pressing the at least one adhesive sheet and the intermediate product, the opening exposes at least a portion of the third surface.

US Pat. No. 10,448,540

ULTRATHIN HEAT DISSIPATION STRUCTURE

Avary Holding (Shenzhen) ...

1. A heat dissipation structure comprising:a copper clad sheet comprising a plurality of containing grooves and a plurality of ribs round each containing groove, each of the plurality of containing grooves formed by stamping, the copper clad sheet comprising an insulation layer and a copper clad layer attached on the insulation layer, wherein a surface of the copper clad layer facing away from the insulation layer forms an inner surface of the plurality of containing grooves, the insulation layer follows a contour of the copper clad layer and has a same shape as that of the copper clad layer;
a plurality of bond blocks arranged on the ribs;
a cover being fixed on the copper clad sheet with the containing groove using the bond blocks, the cover sealing the plurality of containing grooves to form a plurality of a sealed cavities; and
a phase-change material contained in the sealed cavity and configured to absorb and transfer out heat generated by components.

US Pat. No. 10,365,430

METHOD FOR MANUFACTURING HIGH FREQUENCY SIGNAL TRANSMISSION STRUCTURE AND HIGH FREQUENCY SIGNAL TRANSMISSION STRUCTURE OBTAINED THEREBY

Avary Holding (Shenzhen) ...

1. A high frequency signal transmission structure comprising:a circuit layer comprising a base and a circuit structure formed on the base, the circuit structure having a transmission portion;
two dielectric layers, the circuit layer being formed between the two dielectric layers, the two dielectric layers being symmetrical about the circuit layer, each of the two dielectric layers defining a channel facing the circuit layer, the two channels being symmetrical about the circuit layer, and an inner diameter of each of the two channels gradually reducing further from the circuit layer; and
two copper plates, the circuit layer and the two dielectric layers being formed between the two copper plates, wherein a first air chamber being made by one of the two channels surrounded by the circuit layer, one of the two dielectric layers and one of the two copper plates, the transmission portion being received in the first air chamber, a second air chamber being made of the other one of the two channels surrounded by the circuit layer, the other one of the two dielectric layers and the other one of the two copper plates.

US Pat. No. 10,499,496

LENGTH- AND WIDTH-DEFORMABLE PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

Avary Holding (Shenzhen) ...

1. A method for manufacturing a length- and width-deformable printed circuit board comprising:providing an elastic base layer and defining a plurality of via holes on the elastic base layer, the elastic base layer comprising a first surface and a second surface facing away from the first surface;
forming a first conductive circuit layer by forming a metal layer on the first surface, and further forming the metal layer on an inner surface of each of the plurality of via holes to form a plurality of conductive via holes, the first conductive circuit layer comprising a plurality of first conductive circuits, the plurality of first conductive circuits comprising a plurality of first honeycomb holes, wherein the each of the plurality of conductive via holes corresponds to one of the first honeycomb holes;
providing a first elastic cover layer, the first elastic cover layer covering on the first conductive circuit layer and filling the conductive via holes and the plurality of first honeycomb holes; wherein when the length- and width-deformable printed circuit board is stretched along a first direction, the first conductive circuit is also stretched along the first direction, but the first honeycomb holes are compressed along a second direction which is perpendicular to the first direction;
forming a second conductive circuit layer by forming the metal layer on the second surface, wherein the second conductive circuit layer comprises a plurality of second conductive circuits, the plurality of second conductive circuits comprising a plurality of second honeycomb holes, each second honeycomb hole corresponding to each first honeycomb hole;
providing a second elastic cover layer, the second elastic cover layer covering the second conductive circuit layer; wherein the metal layer comprises a third surface and a fourth surface facing away from the third surface, the third surface faces away from the first surface on the same side as the first surface, and the fourth surface faces away from the second surface on the same side as the second surface; and
forming an electroplated copper layer on the third surface of the metal layer as the first conductive circuit layer, and forming the electroplated copper layer on the fourth surface of the metal layer as the second conductive circuit layer.

US Pat. No. 10,462,902

CIRCUIT BOARD AND MANUFACTURING METHOD

Avary Holding (Shenzhen) ...

1. A circuit board comprising at least two circuit board units, each of the circuit board units comprising:a baseboard having a conductive hole filled with an electrical conductor;
a cover layer arranged on the baseboard and defined at least one trench and at least one opening, wherein the at least one opening exposing out the electrical conductor; and
a circuit pattern embedded in the at least one trench and comprising a connecting portion, wherein the connecting portion is embedded in the opening and is electrically coupled to the electrical conductor; and
the at least two circuit board units are stacked, two sides of the at least one cover layer are respectively adhered to the corresponding baseboard, and two ends of the at least one connecting portion are respectively electrically coupled to the corresponding electrical conductor and electrically coupled the two adjacent circuit patterns.

US Pat. No. 10,412,841

FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

Avary Holding (Shenzhen) ...

1. A method for making a flexible printed circuit board comprising:providing an insulating laminate comprising a base layer, the base layer having two opposite surfaces, a releasing films formed on each surface of the base layer;
defining at least one first through hole in the insulating laminate, each first through hole passing through the base layer and the two releasing films;
forming a conductive paste block in each first through hole, each conductive paste block comprises a first end portion and a second end portion opposite to the first end portion, at least the first end portion protruding from the base layer;
removing the releasing films;
forming a first conductive wiring layer, an insulating layer, and a second conductive wiring layer on each surface of the base layer and in that order, the first end portion of each conductive paste block exposed from the first conductive wiring layer;
defining at least one second through hole in the insulating layer, the second through hole coaxially aligned with each conductive paste block, the second through hole positioned near the first end portion extending to the first end portion and forming a recess in the first end portion; and
forming a conductive via in each second through hole and the correspond recess.

US Pat. No. 10,492,309

PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

Avary Holding (Shenzhen) ...

1. A printed circuit board comprising:a circuit substrate, the circuit substrate comprising:
a substrate layer;
a first circuit layer, wherein the first circuit layer is formed on the substrate layer, the first circuit layer comprises a plurality of first conductive circuits;
a second circuit layer formed on the substrate layer and facing away from the first circuit layer, wherein the second circuit layer comprises a plurality of second conductive circuits; wherein a line width of each of the plurality of first conductive circuits is greater than a line width of each of the plurality of second conductive circuits;
a plurality of buffering circuits; wherein the buffering circuits electrically connect the first circuit layer to the second circuit layer, the buffering circuits cover a portion of the first circuit layer and a portion of the second circuit layer;
wherein a line width of each of the plurality of buffering circuits is greater than the line width of each of the plurality of second conductive circuits; and
a dielectric layer, the dielectric layer filling in gaps of the plurality of first conductive circuits, wherein a thickness of the dielectric layer is less than a thickness of each of the plurality of first conductive circuits.

US Pat. No. 10,555,420

CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

HongQiSheng Precision Ele...

1. A method of manufacturing a circuit board, comprising:providing a single-sided copper-clad base;
defining a plurality of grooves in the base facing away from the copper-clad side for receiving electronic elements; wherein a depth of each of the grooves is equal to a thickness of its corresponding electronic element;
fixing the electronic elements into their respective grooves;
providing a laminating member, and fitting the laminating member on the base to form an embedded body; wherein the laminating member encapsulates the electronic elements;
defining a plurality of holes in the laminating member to expose electrodes of the electronic elements; and
plating the embedded body to form an electroplated layer on the surface of the embedded body, the electroplated layer electrically connected with the electrodes of the electronic elements;
wherein top surfaces of the electrodes of each electronic element together form a top surface of the electronic element, the electrodes of each electronic element have uniform heights, top surfaces of the electronic elements are made flush with a surface of the base when the electronic elements are received in the grooves.

US Pat. No. 10,356,909

EMBEDDED CIRCUIT BOARD AND METHOD OF MAKING SAME

Avary Holding (Shenzhen) ...

1. A method of making an embedded circuit board, the method comprising:providing a flexible printed circuit board defining at least one cavity passing through the flexible printed circuit board, the flexible printed circuit board comprising a base layer, a first conductive circuit layer formed on at least one surface of the base layer, and a protective layer formed on each peripheral side of the flexible printed circuit board, the base layer and the first conductive circuit layer protruding into the cavity;
providing a fixture comprising a component and placing the flexible printed circuit board within the fixture to receive the component within the mounting slot to abut a side of the component against the first conductive circuit layer;
applying conductive material in a gap between the component and the first conductive circuit layer and solidifying the conductive material;
removing the fixture;
applying a colloid on an outer surface of each protective layer and placing a substrate on an outer surface of the colloid; and
laminating the substrate, the colloid, and the flexible printed circuit board together.

US Pat. No. 10,561,017

CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

HongQiSheng Precision Ele...

1. A method for manufacturing a circuit board comprising:providing a substrate and forming a first wiring layer on the substrate;
forming an adhesive layer on the substrate, and the first wring layer is exposed from the adhesive layer, wherein a thickness of the adhesive layer is less than a thickness of the first wiring layer, a portion of the first wiring layer is embedded in the adhesive layer, and a remaining portion of the first wiring layer protrudes from the adhesive layer;
forming a build-up structure on a side of the adhesive layer facing away from the substrate, the build-up structure covering the first wiring layer and the adhesive layer, wherein the build-up structure comprises at least one dielectric layer and at least one second wiring layer, each of the at least one dielectric layer and each of the at least one second wiring layer are alternately arranged, the at least one dielectric layer comprises an outermost dielectric layer covering the first wiring layer, and infilling in a gap of the first wiring layer protruding from the adhesive layer, the remaining portion of the first wiring layer protruding from the adhesive is embedded in the outermost dielectric layer, the at least one second wiring layer is formed on a side of the outermost dielectric layer away from the substrate, and comprises an outermost second wiring layer; andremoving the substrate and the adhesive layer, wherein the portion of the first wiring layer embedded in the adhesive layer is exposed and protruding from the outermost dielectric layer, wherein after removing the substrate and the adhesive layer, the method further comprises: forming a solder mask on the first wiring layer and the outermost second wiring layer of the build-up structure, wherein the solder mask infills in a gap of the first wiring layer protruding from the outermost dielectric layer, and infills in a whole gap of the outermost second wring layer of the build-up structure; defining at least one first opening on the solder mask adjacent to the first wiring layer and at least one second opening on the solder mask adjacent to the outermost second wring layer of the build-up structure, wherein the first wiring layer comprises at least one first connecting pad, a portion of each of the at least one first connecting pad protruding from the outermost dielectric layer is entirely exposed from the at least one first opening.

US Pat. No. 10,561,026

METHOD FOR MANUFACTURING A HIGH-CURRENT PRINTED CIRCUIT BOARD

Avary Holding (Shenzhen) ...

1. A method for manufacturing a high-current printed circuit board, comprising:providing a circuit substrate comprising a substrate layer; a first circuit layer formed on the substrate layer; and a second circuit layer formed on the substrate layer and facing away from the first circuit layer, wherein first conductive circuits are defined on the first circuit layer, second conductive circuits are defined on the second circuit layer, and a line width of each of the first conductive circuits is greater than a line width of each of the second conductive circuits;
forming via holes in the circuit substrate, wherein the via holes pass through the first circuit layer, the substrate layer, and the second circuit layer; and
forming buffering circuits by infilling electrically conductive material into the via holes, wherein the buffering circuits are electrically connected the first circuit layer to the second circuit layer;
wherein a line width of each of the buffering circuits is greater than the line width of each of the second conductive circuits, thereby an electrical current from first conductive circuits and the buffering circuits to the second conductive circuits becomes a smaller current.

US Pat. No. 10,542,627

METHOD FOR MANUFACTURING A FLEXIBLE PRINTED CIRCUIT BOARD

HongQiSheng Precision Ele...

1. A method for making a flexible printed circuit board comprising:providing a flexible substrate, the flexible substrate comprising a base layer and a first copper foil layer and a second copper foil layer both formed on opposite surfaces of the base layer;
defining at least one connecting hole in the flexible substrate, each connecting hole penetrating the first copper foil layer and the base layer;
forming a conductive pattern layer on the flexible substrate through plating with copper, the conductive pattern layer comprising a conductive pole filled in the connecting hole and a pattern line formed on a surface of the first copper foil layer away from the base layer and a surface of the second copper foil layer away from the base layer, one end of each conductive pole being positioned on a surface of the second copper foil layer facing the base layer, and the conductive poles electrically connecting the first copper foil layer and a second copper foil layer, a diameter of the conductive pole being smaller than a diameter of the connecting hole; and
performing an etching treatment on the flexible substrate to remove regions where the first copper foil layer and a second copper foil layer are not covered with the conductive pattern layer to respectively form the first copper foil layer and the second copper foil layer into a first conductive pattern layer and a second conductive pattern layer.

US Pat. No. 10,531,578

METHOD FOR MANUFACTURING A FLEXIBLE CIRCUIT BOARD INCORPORATING SUNKEN RESISTOR

HongQiSheng Precision Ele...

1. A method for manufacturing a flexible circuit board with a buried resistor comprising:providing a composite board, the composite board comprising a supporting substrate, a physical development core layer formed on the supporting substrate, and a silver halide emulsion layer formed on the physical development core layer;
exposing a portion of the silver halide emulsion layer to laser energy; wherein another portion of the silver halide emulsion layer is unexposed;
the unexposed silver halide emulsion layer being developed in a developing solution, wherein silver halide in the unexposed silver halide emulsion layer is able to form a silver complex with the developing solution and dissolve the silver halide emulsion layer, and the silver complex diffuses into the physical development core layer, the silver complex is catalyzed by the physical development core layer in the physical development core layer and causes a redox reaction, and silver particles deposit on the supporting substrate to form a silver layer;
washing the physical development core layer off of the supporting substrate to retain only the silver layer on the supporting substrate;
forming a conductive layer on the silver layer; and
etching the conductive layer to form at least one opening, wherein the opening exposes a portion of the silver layer to form a buried resistor.

US Pat. No. 10,575,406

METHOD OF MAKING FLEXIBLE CIRCUIT BOARD

Avary Holding (Shenzhen) ...

1. A method of making a flexible circuit board, the method comprising:providing a base layer;
coating a bonding solution on both of opposite sides of the base layer and drying the bonding solution to form two corresponding bonding layers, the base layer and the two bonding layers cooperatively forming a substrate;
forming a first copper layer on a surface of a first one of the bonding layers facing away from the base layer, and forming a second copper layer on a surface of a second one of the bonding layers facing away from the base layer;
etching the first copper layer to form a first signal line layer, and etching the second copper layer to form a second signal line layer; and
forming an insulating layer on a surface of each of the first signal line layer and the second signal line layer;
wherein forming the first copper layer and the second copper layer on each the surfaces of the first and the second bonding layers is solidified at 170 degrees Celsius, a time duration of solidifying the first copper layer and the second copper layer is 30 minutes, and a pressure value of forming the first copper layer and the second copper layer is 5 pascals.

US Pat. No. 10,524,057

FLEXIBLE PRINTED CIRCUIT BOARD, METHOD FOR MANUFACTURING THE SAME AND LOUDSPEAKER WITH THE SAME

Avary Holding (Shenzhen) ...

1. A flexible printed circuit board used in a loudspeaker as a dome and a holder supporting the dome having a top surface and a bottom surface opposite to the top surface, the flexible printed circuit board comprising:a dome portion being a recess depressed from the top surface to the bottom surface;
a supporting portion surrounding the dome portion and extending from ends of the dome portion;
a first covering layer with a lower opening;
a second covering layer; and
a coating layer;
wherein the flexible printed circuit board comprises at least one circuit layer, the flexible printed circuit board has an upper opening, and the upper opening is open at the supporting portion to expose a portion of the circuit layer, the first covering layer is formed on the circuit layer, and a portion of the circuit layer is exposed by the lower opening, the second covering layer is formed on the first covering layer, the coating layer is formed on the circuit layer exposed from the upper opening, the coating layer is made of conductive metal.

US Pat. No. 10,602,651

SYSTEM FOR TRACING PRINTED CIRCUIT BOARDS THROUGH MANUFACTURING STAGES

Avary Holding (Shenzhen) ...

1. A traceability system of a printed circuit board comprising at least two inner copper foil substrates, the traceability system comprising:an identification code marking device comprising:
a coding unit configured to mark an identification code on each inner copper foil substrate;
a scanning unit configured to emit X-rays after adding one of the inner copper foil substrates each time so that the X-rays pass through the newly added inner copper foil substrate to scan the identification code of the inner copper foil substrate of the previous layer, and generate an identification code graphic;
a reading unit configured to receive and parse the identification code graphic, and determine a next identification code according to a predetermined encoding rule and the parsed identification code graphic, the predetermined encoding rule being that each identification code records an identity information of the inner copper foil substrate of corresponding layer, and each identification code associated with the identification code of the identification code of the inner copper foil substrate of previous layer;
the coding unit further configured to mark determined identification code on newly added inner copper foil substrate; and
a server communicating with the identification code marking device and comprising:
a storage device that stores one or more programs and a database; and
a processor;
the one or more programs when executed by the processor, cause the processor to:
store the identity information recorded by the identification code of the inner copper foil substrate and processing information and processing information of the inner copper foil substrate in the database.