US Pat. No. 9,439,291

PHOTOSENSITIVE ELEMENT, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR PRODUCING PRINTED CIRCUIT BOARD

HITACHI CHEMICAL COMPANY,...

1. A method for forming a resist pattern, the method comprising the steps of:
(a) providing a combination of a photosensitive element and a circuit-forming board, the combination comprising
a circuit-forming board with a surface roughness (Ra) of less than 300 nm;
a support film, wherein a support film haze is 0.01-1.5% and a total number of particles with diameters of 5 ?m and larger
and aggregates with diameters of 5 ?m or larger in the support film is no greater than 5/mm2; and

a photosensitive layer derived from a photosensitive resin composition formed on the support film that comprises,
a binder polymer,
a photopolymerizable compound with an ethylenically unsaturated bond, and
a photopolymerization initiator that contains
a 2,4,5-triarylimidazole dimer, and
a pyrazoline compound represented by the following general formulas (XI) or (XII),

wherein, in the formulas (XI) or (XII), R each independently represents a C1-12 straight-chain or branched alkyl group, a
C1-10 straight-chain or branched alkoxy group or a halogen atom, a, b and c each independently represent an integer of 0 to
5, the total of a, b and c being between 1 and 6, and when the total of a, b and c is 2 or greater the multiple R groups may
be the same or different,

wherein the pyrazoline compound is 0.5 to 5.0 wt % based on a total amount of the 2,4,5-triarylimidazole dimer and the pyrazoline
compound,

and wherein the thickness T of the photosensitive layer and the absorbance A of the photosensitive layer at 365 nm satisfies
the relationship represented by the following inequality (I):

0.001?A/T?0.020  (I)

(b) laminating the photosensitive element on the circuit-forming board in the order of (1) the photosensitive layer, and then
(2) the support film,

wherein a surface of the circuit-forming board that is in contact with the photosensitive element has the surface roughness
(Ra) of less than 300 nm;

(c) exposing prescribed sections of the photosensitive layer to irradiation with active light rays through the support film
and thereby photocuring the prescribed sections on the photosensitive layer; and

(d) removing by developing the non-photocured sections of the photosensitive layer.

US Pat. No. 9,129,898

SEMICONDUCTOR ENCAPSULATION ADHESIVE COMPOSITION, SEMICONDUCTOR ENCAPSULATION FILM-LIKE ADHESIVE, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

Hitachi Chemical Company,...

6. A method for producing a semiconductor device, the method comprising the steps of:
(1) connecting semiconductor chips to a board using a semiconductor encapsulation adhesive composition; and
(2) underfilling the gaps between the semiconductor chips and the board using the semiconductor encapsulation adhesive composition,
wherein the semiconductor encapsulation adhesive composition comprises (a) an epoxy resin, (b) a curing agent, (c) an antioxidant,
wherein the antioxidant is a hindered phenol, and (d) a high molecular component with a weight-average molecular weight of
10,000 or greater.

US Pat. No. 9,115,420

THERMOELECTRIC MATERIAL FORMED OF MG2SI-BASED COMPOUND AND PRODUCTION METHOD THEREFOR

HITACHI CHEMICAL COMPANY,...

1. A thermoelectric material essentially formed of an Mg2Si-based compound represented by the chemical formula Mg2-x-y-zAlxZnyMnzSi (x?0, y?0, z?0) wherein the total amount of Al, Zn, and Mn is 0.3 at % to 5 at %.
US Pat. No. 9,133,308

RESIN COMPOSITION, AND PRINTED WIRING BOARD, LAMINATED SHEET, AND PREPREG USING SAME

HITACHI CHEMICAL COMPANY,...

1. A resin composition comprising: (a) a maleimide compound with at least two N-substituted maleimide groups per molecular
structure; (b) a silicone compound with at least one amino group per molecular structure; and (c) a compound with an amino
group and a phenolic hydroxyl group per molecular structure.

US Pat. No. 9,516,764

METHOD FOR MANUFACTURING MULTILAYER WIRING SUBSTRATE

HITACHI CHEMICAL COMPANY,...

1. A method for manufacturing a multilayer wiring substrate including:
step (1) of integrally laminating an inner layer material having an inner layer wiring formed thereon, an insulating layer,
and a metal foil for upper layer wiring, and providing, in the metal foil for upper layer wiring and the insulating layer,
a hole for via hole extending from the metal foil for upper layer wiring to reach the inner layer wiring;

step (2) of forming a base electroless plating layer in the hole for via hole and on the metal foil for upper layer wiring,
and then filling the hole for via hole by forming an electrolytic filled plating layers to form a via hole connecting the
metal foil for upper layer wiring and the inner layer wiring; and

step (3) of forming an upper layer wiring by forming, after forming the electrolytic filled plating layer, the metal foil
for upper layer wiring into a wiring,

wherein, in step (2), filling of the hole for via hole is completed by separately forming each of the electrolytic filled
plating layers and

by etching a previous electrolytic filled plating layer formed in the hole for via hole and on the metal foil for upper layer
wiring before a subsequent formation of a respective electrolytic filled plating layer.

US Pat. No. 9,372,136

AGENT FOR IMPROVING CANCER CELL ADHESIVENESS

HITACHI CHEMICAL COMPANY,...

1. A cancer cell enrichment filter comprising:
a substrate having a plurality of through holes, wherein at least a part of the substrate is coated with an agent for improving
cancer cell adhesiveness, the agent for improving cancer cell adhesiveness consisting of a polymer comprising a constitutional
unit represented by the following formula (1);


wherein (i) R1 is a hydrogen atom, R2 is an ethyl group, and m is 2 or (ii) R1 is a methyl group, R2 is a methyl group and m is 2.

US Pat. No. 9,212,298

ADHESIVE SHEET AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

HITACHI CHEMICAL COMPANY,...

1. An adhesive sheet comprising a resin composition containing: (A) a high-molecular-weight component; (B1) a thermosetting
component having a softening point of below 50° C.; (B2) a thermosetting component having a softening point of between 50°
C. and 100° C.; and (C) a phenol resin having a softening point of no higher than 100° C., the composition containing 11 to
22 mass % of the (A) high-molecular-weight component, 10 to 20 mass % of the (B1) thermosetting component having a softening
point of below 50° C., 10 to 20 mass % of the (B2) thermosetting component having a softening point of between 50° C. and
100° C. and 15 to 30 mass % of the phenol resin having a softening point of no higher than 100° C., based on 100 mass % of
the resin composition.

US Pat. No. 9,051,246

COMPOUND HAVING TRIMETHYLENE STRUCTURE, POLYMER COMPOUND CONTAINING UNIT THAT HAS TRIMETHYLENE STRUCTURE, AND REACTIVE COMPOUND HAVING TRIMETHYLENE STRUCTURE

HITACHI CHEMICAL COMPANY,...

1. A polymer compound represented by a general formula 3 shown below:

wherein each of R1 and R2 independently represents a group selected from the group consisting of a hydrogen atom, aliphatic substituents composed of
C and H, aromatic substituents composed of C and H, aliphatic substituents composed of C, H and X, wherein X represents a
hetero atom, and aromatic substituents composed of C, H and X, wherein X represents a hetero atom, Z5 represents a group selected from the group consisting of divalent aromatic rings composed of C and H, divalent aromatic rings
composed of C, H and X, wherein X represents a hetero atom, divalent groups containing an aromatic ring and a double-bonded
and/or triple-bonded conjugated structure composed of C and H, and divalent groups containing a double-bonded and/or triple-bonded
conjugated structure composed of C, H and X, wherein X represents a hetero atom,

each of Ar1 and Ar2 independently represents a group selected from the group consisting of divalent aromatic rings composed of C and H, and divalent
aromatic rings composed of C, H and X (wherein X represents a hetero atom),

n represents an integer of 2 or greater, and
R1 is a hydrogen atom, and R2 is a carbon atom having not more than 2 hydrogen atoms bonded thereto.

US Pat. No. 9,425,120

SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREFOR

HITACHI CHEMICAL COMPANY,...

1. A manufacturing method for a semiconductor device, wherein connection portions of a semiconductor chip are electrically
connected to connection portions of a wiring circuit substrate or connection portions of a plurality of semiconductor chips
are electrically connected to each other,
the method comprising:
a step of laminating a film-shaped adhesive for a semiconductor on the semiconductor chip, the adhesive for a semiconductor
comprising a compound having a group represented by the following formula (1):


wherein R1 represents an electron-donating group; and

a step of sealing at least part of the connection portions with a cured product of the adhesive for a semiconductor.

US Pat. No. 9,046,518

DETECTOR AND DETECTION METHOD

Hitachi Chemical Company,...

1. A strip-shaped detector detecting an analyte in a liquid sample, the detector comprising:
a collecting member directly collecting the liquid sample from a living organism;
a holding member including a labeling reagent binding specifically to the analyte, the labeling reagent being held in a state
where the labeling reagent can move along with the movement of the liquid sample;

a detecting member including a detection reagent capturing a complex of the analyte and the labeling reagent by binding specifically
to the analyte, and the detection reagent being immobilized;

an absorbing member being capable of absorbing the liquid sample;
a liquid-impermeable supporting member, and
an adhesive member,
wherein the collecting member, the holding member, the detecting member, and the absorbing member are arranged in order on
the liquid-impermeable supporting member in a longitudinal direction of the detector so that the liquid sample moves through
the inside of these members in the above order of the members from an upstream side to a downstream side by capillarity,

the collecting member includes a protruding portion sticking out of the liquid-impermeable supporting member at the upstream
side in the movement direction of the liquid sample, and

the adhesive member has: an adhesive face adhering to and covering an end portion of the downstream side of the detecting
member, the absorbing member, and the end portion of the downstream side of the liquid-impermeable supporting member, a non-adhesive
face at the opposite side from the adhesive face adhering to the respective members, and a pick-up portion provided at the
end portion of the downstream side of the adhesive member configured to enable a user to hold the pick-up portion to pick
up the strip-shaped detector, the pick-up portion comprising folded portions of the adhesive member folded such that adhesive
faces in the folded portions adhere to each other.

US Pat. No. 9,431,314

THERMOSETTING RESIN COMPOSITION FOR SEALING PACKING OF SEMICONDUCTOR, AND SEMICONDUCTOR DEVICE

Hitachi Chemical Company,...

1. A thermosetting resin composition for an underfilling of a semiconductor comprising, as essential components, a thermosetting
resin, a curing agent, a flux agent and two or more inorganic fillers with different mean particle sizes, wherein the inorganic
fillers include an inorganic filler with a mean particle size of no greater than 100 nm and an inorganic filler with a mean
particle size of greater than 150 nm and no greater than 500 nm; wherein:
said thermosetting resin and said flux agent are separate ingredients,
said thermosetting resin composition is in the form of a film,
said thermosetting resin contains an epoxy resin which is solid at 25° C.
wherein the inorganic filler with a mean particle size of no greater than 100 nm is surface-treated, and
wherein the inorganic filler with a mean particle size of greater than 150 nm and no greater than 500 nm is non-surface-treated.

US Pat. No. 9,052,587

CONDUCTIVE PATTERN FORMATION METHOD, CONDUCTIVE PATTERN-BEARING SUBSTRATE, AND TOUCH PANEL SENSOR

Hitachi Chemical Company,...

1. A conductive pattern formation method comprising:
a first exposure step of radiating active light in a patterned manner to a photosensitive layer including a photosensitive
resin layer provided on a substrate and a conductive film provided on a surface of the photosensitive resin layer on a side
opposite to the substrate;

a second exposure step of radiating active light, in the presence of oxygen, to some or all of the portions of the photosensitive
layer not exposed at least in the first exposure step; and

a development step of developing the photosensitive layer to form a conductive pattern following the second exposure step.

US Pat. No. 9,050,780

LAMINATE BODY, LAMINATE PLATE, MULTILAYER LAMINATE PLATE, PRINTED WIRING BOARD, AND METHOD FOR MANUFACTURE OF LAMINATE PLATE

HITACHI CHEMICAL COMPANY,...

1. A laminate body containing one or more resin composition layers and two or more glass substrate layers, wherein:
at least one layer of those one or more resin composition layers is a fiber-containing resin composition layer of a fiber-containing
resin composition that contains a thermosetting resin and a fibrous base material, and

at least one layer of those resin composition layers exists between any two layers of the glass substrate layers.
US Pat. No. 9,450,246

CARBON PARTICLES FOR NEGATIVE ELECTRODE OF LITHIUM ION SECONDARY BATTERY, NEGATIVE ELECTRODE FOR LITHIUM ION SECONDARY BATTERY, AND LITHIUM ION SECONDARY BATTERY

HITACHI CHEMICAL COMPANY,...

1. Carbon particles for a negative electrode of a lithium ion secondary battery, the carbon particles having a pore volume
of pores having a size of 2×10 to 2×104 Å, of 0.07 ml/g or less with respect to the mass of the carbon particles; having an interlayer distance d(002) of a graphite
crystal as determined by an X-ray diffraction analysis, of 3.38 Å or less; having a crystallite size Lc in the C-axis direction
of 500 Å or more; and having a degree of circularity of the particle cross-section in the range of 0.6 to 0.9.

US Pat. No. 9,334,573

LAYERED SILICATE SILVER SURFACE TREATMENT AGENT, SULFIDATION PREVENTION FILM AND LIGHT-EMITTING DEVICE WITH TREATED SILVER LAYER

HITACHI CHEMICAL COMPANY,...

1. A light-emitting device comprising a substrate having a silver-plated layer; a light-emitting diode mounted on the substrate;
a film, provided on a surface of the silver-plated layer, containing a layered silicate compound; and a transparent sealing
resin sealing the light-emitting diode, the transparent sealing resin having a composition different than a composition of
the film.
US Pat. No. 9,249,293

COMPOSITE PARTICLE, METHOD FOR PRODUCING THE SAME, AND RESIN COMPOSITION

HITACHI CHEMICAL COMPANY,...

1. A composite particle comprising:
an aluminum nitride particle;
a first coating layer that contains a-alumina and coats at least a part of a region of a surface of the aluminum nitride particle;
and

a second coating layer that contains organic matter and coats a region other than the first coating layer of the surface of
the aluminum nitride particle.

US Pat. No. 9,240,502

ELEMENT AND PHOTOVOLTAIC CELL

HITACHI CHEMICAL COMPANY,...

1. An element comprising a semiconductor substrate and an electrode disposed on the semiconductor substrate, the electrode
being a sintered product of a composition for an electrode that comprises phosphorus-containing copper alloy particles, glass
particles and a dispersing medium, and the electrode comprising a line-shaped electrode having an aspect ratio, which is defined
as electrode short length:electrode height, of from 2:1 to 250:1, and wherein the content of phosphorus in the phosphorus-containing
copper alloy particles is from 6 mass % to 8 mass %.

US Pat. No. 9,096,435

PROCESS FOR PRODUCTION OF CARBON NANOTUBE

HITACHI CHEMICAL COMPANY,...

1. A method for producing carbon nanotubes in which, using acetylene and a catalyst for producing carbon nanotubes from the
acetylene, the carbon nanotubes are synthesized on a support in a heated state, disposed in a reactor, the method comprising
a synthesis step of synthesizing the carbon nanotubes on the support on which the catalyst is supported by flowing a source
gas consisting of carbon dioxide, an inert gas and the acetylene over the support, wherein

in the source gas, a partial pressure of the acetylene is 1.33×101 to 1.33×104 Pa, a partial pressure of the carbon dioxide is 1.33×101 to 1.33×104 Pa, and a partial pressure ratio of the acetylene to the carbon dioxide (acetylene/carbon dioxide) is 0.1 or higher and less
than 0.5.

US Pat. No. 9,150,706

PHOTO CURABLE RESIN COMPOSITION, IMAGING DISPLAY DEVICE AND PRODUCTION METHOD THEREOF

HITACHI CHEMICAL COMPANY,...

1. A liquid crystal display device having a laminate structure including
an image display unit having a liquid crystal display cell,
a transparent protective plate, and
a resin layer existent between the image display unit and the transparent protective plate, wherein
the resin layer is a cured material of a photocurable resin composition containing a compound (A) having a photopolymerizable
functional group and an oil gelling agent (B).

US Pat. No. 9,173,302

CONDUCTIVE ADHESIVE FILM AND SOLAR CELL MODULE

Hitachi Chemical Company,...

1. A solar cell module comprising a plurality of photovoltaic cells connected via a plurality of wiring members, wherein each
photovoltaic cell comprises:
(a) a plurality of surface electrodes, wherein the plurality of surface electrodes are formed on a substrate comprising at
least one material selected from the group consisting of single crystalline silicon and polycrystalline silicon; and

(b) a conductive adhesive film with a thickness of t disposed to electrically connect each surface electrode to each wiring
member of the plurality of the wiring members, wherein the conductive adhesive film comprises

(i) an insulating adhesive; and
(ii) a plurality of conductive particles having a mean particle size r, wherein a ratio of t/r is in a range of 2.0-9.0 and
a content of the conductive particles is 1.7-15.6 vol % based on a total volume of the conductive adhesive film,

wherein the mean particle size r of the conductive particles is at least ten-point average surface roughness Rz of the surface
electrodes.

US Pat. No. 9,090,703

SILK FIBROIN POROUS MATERIAL AND METHOD FOR PRODUCING SAME

HITACHI CHEMICAL COMPANY,...

1. A silk fibroin porous material containing silk fibroin and a monomeric L-amino acid as components of the silk fibroin porous
material.

US Pat. No. 9,443,995

SOLAR BATTERY CELL AND SOLAR BATTERY MODULE

Hitachi Chemical Company,...

1. A solar battery cell comprising:
a plurality of linear finger electrodes arranged on a light receiving surface on a substrate in parallel,
the finger electrodes including a plurality of straight first finger electrodes and a plurality of straight second finger
electrodes extending from opposite sides to reach a TAB area which crosses the finger electrodes and which has TAB wires connected
thereto,

wherein the first finger electrodes and the second finger electrodes overlap in the extending direction of the TAB area,
wherein the first finger electrodes and the second finger electrodes are alternately provided in an extending direction of
the TAB area in the TAB area, and

wherein a portion of the first finger electrode that overlaps a portion of the second finger electrodes is physically separated
from the portion of the second finger electrode.

US Pat. No. 9,446,576

ADHESIVE AGENT, ADHESIVE MATERIAL USING THE SAME, AND METHOD OF USE THEREOF

Hitachi Chemical Company,...

1. A method of using an adhesive agent comprising:
an application step of applying a second adherend to a first adherend via an adhesive layer containing the adhesive agent;
a heating step of heating the first adherend and the second adherend under a condition such that a temperature of the adhesive
layer is 200° C. or higher; and

a peeling step of peeling the adhesive layer and the second adherend from the first adherend subjected to the heating step;
wherein the adhesive agent comprises a condensation resin having a structural unit obtained by polycondensing a polymerizable
monomer containing a monomer (A) having 2 or more carboxyl groups and a monomer (B) having 2 or more amino groups, and meeting
the following (1), (2), and (3), or the following (2) and (3):

(1) at least one selected from the group consisting of the monomer (A), an anhydride of the monomer (A), and the monomer (B)
is liquid at 25° C.;

(2) the condensation resin has a polyoxyalkanediyl group; and
(3) the monomer (A) contains an isophthalic acid; and
wherein a structure derived from the monomer (B) in the structural unit has a polyoxyalkanediyl group.

US Pat. No. 9,061,909

METHOD FOR SIMULTANEOUSLY PRODUCING CARBON NANOTUBES AND HYDROGEN, AND DEVICE FOR SIMULTANEOUSLY PRODUCING CARBON NANOTUBES AND HYDROGEN

The University of Tokyo, ...

1. A method for simultaneously producing carbon nanotubes and hydrogen, in which using a carbon source containing carbon atoms
and hydrogen atoms and being decomposed in a heated state, and a catalyst for producing carbon nonatubes and H2 from the carbon source, the carbon nanotubes are synthesized on a support in a heated state, placed in a reactor, and simultaneously,
the H2 is synthesized from the carbon source, the method comprising:
a synthesis step of flowing a source gas containing the carbon source over the support, on which the catalyst is supported,
to synthesize the carbon nanotubes on the support and simultaneously synthesize the H2 in a gas flow, wherein a feed amount of the source gas in the synthesis step is 0.01 to 100 m3/s per m3 of a reactor volume

a separation step of flowing a separation gas over the support, on which the carbon nanotubes are synthesized, to separate
the carbon nanotubes from the support into the separation gas;

a removal step of flowing an oxidizing gas over the support after the carbon nanotubes are separated, to oxidize and remove
carbon remaining on the support;

a catalyst resupport step of flowing a source gas of the catalyst over the support after the removal step; and
a catalyst carrier resupport step of a catalyst carrier of flowing a source gas of the catalyst carrier over the support after
the removal step and prior to the catalyst resupport step,

wherein the steps in the method for simultaneously producing carbon nanotubes and hydrogen are repeatedly performed by switching
the gases fed to the reactor, with the support kept in the heated state.

US Pat. No. 9,142,708

GLASS COMPOSITION AND CONDUCTIVE PASTE FOR ALUMINUM ELECTRODE WIRING, ELECTRONIC COMPONENT PROVIDED WITH THAT ALUMINUM ELECTRODE WIRING AND METHOD FOR PRODUCING THIS ELECTRONIC COMPONENT

HITACHI, LTD., Tokyo (JP...

1. A glass composition for an aluminum electrode wire consisting essentially of an oxide of vanadium (V), an oxide/oxides
of an alkaline-earth metal/alkaline-earth metals, and an oxide/oxides of an alkali metal/alkali metals, wherein
the oxide of vanadium (V) is vanadium pentoxide (V2O5), and the oxide/oxides of the alkaline-earth metal/alkaline-earth metals, represented by a chemical formula RnO, are at 20
to 40 weight %.

US Pat. No. 9,463,981

CARBON NANOTUBES AND PRODUCTION METHOD THEREOF

THE UNIVERSITY OF TOKYO, ...

1. A method of producing carbon nanotubes, comprising:
a catalyst particle forming step of heating and reducing a catalyst raw material to form catalyst particles, and
a carbon nanotube synthesizing step of flowing a raw material gas containing acetylene onto the heated catalyst particles
to synthesize carbon nanotubes,

wherein methane is flowed onto the catalyst raw material and/or the catalyst particles in both the catalyst particle forming
step and the carbon nanotube synthesizing step.

US Pat. No. 9,150,920

METHODS OF CHARACTERIZING HOST RESPONSIVENESS TO INTERFERON BY EX VIVO INDUCTION OF INTERFERON-RESPONSIVE MARKERS

HITACHI CHEMICAL CO., LTD...

1. A method for treating a subject having hepatitis with an interferon-based therapy, the method comprising:
(A) having at least a first and second sample of whole blood from said subject sent to a laboratory prior to interferon administration,
for the laboratory to perform an assay comprising the following steps (1)-(4):

(1) exposing said first sample of whole blood from said subject to interferon alpha 2b in a solvent for an amount of time
sufficient for said interferon alpha 2b to alter the expression of one or more markers whose expression is potentially altered
in response to exposure to IFN alpha 2b selected from the group consisting of TNFSF10, CXCL10, GBP, and BST2;

(2) exposing said second sample of whole blood from said subject to the solvent without said interferon alpha 2b for said
amount of time;

(3) quantifying the effect of said interferon alpha 2b as a change in expression of said one or more markers by a method comprising:
(i) isolating mRNA from said first whole blood sample,
(ii) contacting said mRNA from said first whole blood sample with a reverse transcriptase to generate a stimulated complementary
DNA (cDNA), and

(iii) contacting said stimulated cDNA with sense and antisense primers that are specific for said one or more markers and
a DNA polymerase to generate stimulated amplified DNA; and

(iv) isolating mRNA from said second whole blood sample,
(v) contacting said mRNA from said second whole blood sample with a reverse transcriptase to generate control complementary
DNA (cDNA), and

(vi) contacting said control cDNA with sense and antisense primers that are specific for said one or more markers and a DNA
polymerase to generate control amplified DNA;

(4) calculating a change in the amount of marker mRNA in said first whole blood sample compared to the amount of marker mRNA
in said second whole blood sample;

(B) treating the subject with an interferon-based therapy if the results of said assay indicate there is a difference in the
amount of marker mRNA quantified from said first blood sample as compared to said second blood sample.

US Pat. No. 9,067,906

THERMOSETTING RESIN COMPOSITION, EPOXY RESIN MOLDING MATERIAL, AND POLYVALENT CARBOXYLIC ACID CONDENSATE

Hitachi Chemical Company,...

1. A polyvalent carboxylic acid condensate comprising a component represented by the following formula (X):
(In formula (X), Rx represents a divalent group with an aliphatic hydrocarbon ring, wherein the aliphatic hydrocarbon ring is optionally substituted
with a halogen atom or a straight-chain or branched hydrocarbon group, multiple Rx groups in the same molecule can be the same or different, and n represents an integer of 1 or greater.)

US Pat. No. 9,373,432

ALCOHOLIC SOLUTION AND SINTERED MAGNET

Hitachi Chemical Company,...

1. An alcoholic solution comprising FeCo-based particles and rare earth fluoride particles mixed together,
wherein particle diameters of said FeCo-based particles are larger than particle diameters of said rare earth fluoride particles,
particle diameters of said FeCo-based particles are from 20 to 200 nm, and
particle diameters of said rare earth fluoride particles are from 1 to 50 nm,
and wherein from 1 to 90% of said rare earth fluoride particles are amorphous.

US Pat. No. 9,188,708

FILM HAVING LOW REFRACTIVE INDEX FILM AND METHOD FOR PRODUCING THE SAME, ANTI-REFLECTION FILM AND METHOD FOR PRODUCING THE SAME, COATING LIQUID SET FOR LOW REFRACTIVE INDEX FILM, SUBSTRATE HAVING MICROPARTICLE-LAMINATED THIN FILM

Hitachi Chemical Company,...

1. A method for producing a microparticle-laminated thin film-attached substrate in which a microparticle-laminated thin film
having voids is formed on a plastic substrate, the method comprising:
(A) having a plastic substrate having a coefficient of thermal expansion of 50 to 350 (ppm/K), brought into contact with or
coated thereon with any of an electrolyte polymer solution and a microparticle dispersion liquid;

(B) having the plastic substrate obtained after the contact or coating with the electrolyte polymer solution, brought into
contact with or coated thereon with a dispersion liquid of microparticles having a charge opposite to that of an electrolyte
polymer of the electrolyte polymer solution, or having the plastic substrate obtained after the contact or coating with the
microparticle dispersion liquid, brought into contact with or coated thereon with a solution of an electrolyte polymer having
a charge opposite to that of microparticles of the microparticle dispersion liquid; and

(C) binding microparticles of the microparticle dispersion liquid and adhering the microparticle-laminated thin film obtained
after the contact or coating with the electrolyte polymer solution or the microparticles to the plastic substrate by filling
voids within the microparticle-laminated thin film with an applied alcoholic silica sol product.

US Pat. No. 9,076,932

OPTICAL SEMICONDUCTOR ELEMENT MOUNTING PACKAGE, AND OPTICAL SEMICONDUCTOR DEVICE USING THE SAME

Hitachi Chemical Company,...

1. An optical semiconductor element mounting package having a recessed part that serves as an optical semiconductor element
mounting region, wherein the package is formed by integrating:
a resin molding composed of a thermosetting light-reflecting resin composition, which forms at least the side faces of the
recessed part; and

at least a pair of positive and negative lead electrodes, each of the positive and negative lead electrodes having opposed
first and second major surfaces extending continuously from an inner end to an opposite end, the pair of positive and negative
lead electrodes being disposed with their inner ends opposite each other so that inner portions of the first major surface
of the positive and negative lead electrodes form part of the bottom face of the recessed part, wherein there is no gap at
a joint face between the resin molding and the lead electrodes, the inner ends of the positive and negative lead electrodes
are separated by the resin molding composed of the thermosetting light-reflecting resin composition and at least portions
of the second major surface of the positive and negative lead electrodes are not in contact with the resin molding composed
of the thermosetting light-reflecting resin composition,

wherein the thermosetting light-reflecting resin composition includes triglycidyl isocyanurate as (A) an epoxy resin.

US Pat. No. 9,224,517

PASTE COMPOSITION FOR ELECTRODE AND PHOTOVOLTAIC CELL

HITACHI CHEMICAL COMPANY,...

1. A paste composition for an electrode, the paste composition comprising:
phosphorous-containing copper alloy particles wherein the content of phosphorous is from 6% by mass to 8% by mass;
glass particles;
a solvent; and
a resin.
US Pat. No. 9,508,980

GRAPHITE PARTICLES AND LITHIUM SECONDARY BATTERY USING THE SAME AS NEGATIVE

Hitachi Chemical Company,...

1. A graphite particle, wherein pore volume of the pores having a size falling in the range of 102 to 106 Å is 0.4 to 2.0 cc/g per weight of graphite particle, and wherein pore volume of the pores having a size falling in the range
of 1×102 to 2×104 Å is 0.08 to 0.04 cc/g per weight of graphite particle.

US Pat. No. 9,315,384

APPARATUS FOR PRODUCING NANOCARBON MATERIAL AND METHOD FOR PRODUCING NANOCARBON MATERIAL

HITACHI CHEMICAL COMPANY,...

1. A carbon nanomaterial production apparatus comprising:
a reaction tube into which raw material gas and carrier gas are supplied and accordingly in which carbon nanomaterial is grown;
a connection tube that is connected to the reaction tube and through which an aerosol-like mixture of the carbon nanomaterial
and the carrier gas passes; and

a collection tube that is connected to the connection tube and collects the carbon nanomaterial from the mixture, wherein
the collection tube includes:
a junction, connected to the connection tube, from which, while the carrier gas flows upward, the carbon nanomaterial falls
downward by gravitational sedimentation to be separated from the mixture,

a discharge section that is located above the junction with the connection tube and discharges the carrier gas contained in
the mixture to outside, and

a trapping section that is located below the junction with the connection tube and traps the carbon nanomaterial that is separated
from the mixture by gravitational sedimentation.

US Pat. No. 9,171,244

RFID TAG

HITACHI CHEMICAL COMPANY,...

1. An RFID tag comprising:
a single-layer antenna;
an IC chip having a size of 0.6 mm square or smaller which is connected to the antenna with wire bonding so as not to overlap
the antenna; and

a sealing material sealing the IC chip and the antenna, wherein
the antenna is a coil antenna arranged in a part around the IC chip and including constituent portions adjacent to each other
with a gap therebetween, the sealing material being arranged in the gap of the antenna,

the antenna has a cap shape of a mushroom in section,
a conductor interval to conductor width of the antenna is in a range of 0.2 mm to 0.2 mm to 0.05 mm to 0.05 mm, and
a resonant frequency fo of an electric circuit including an inductance L of the antenna and a capacitance C of the IC chip is equal to or close to
an operation frequency of the IC chip.

US Pat. No. 9,390,829

PASTE COMPOSITION FOR ELECTRODE AND PHOTOVOLTAIC CELL

HITACHI CHEMICAL COMPANY,...

12. A paste composition for an electrode, the paste composition comprising:
phosphorus-containing copper alloy particles;
glass particles;
a solvent; and
a resin,
wherein the content of phosphorus in the phosphorus-containing copper alloy particles is from 1% by mass to 8% by mass.

US Pat. No. 9,283,741

ADHESIVE AGENT, ADHESIVE MATERIAL USING THE SAME, AND METHOD OF USE THEREOF

Hitachi Chemical Company,...

1. A method of using an adhesive agent comprising:
an application step of applying a second adherend to a first adherend via an adhesive layer containing the adhesive agent;
a heating step of heating the first adherend and the second adherend under a condition such that a temperature of the adhesive
layer is 200° C. or higher; and

a peeling step of peeling the adhesive layer and the second adherend from the first adherend subjected to the heating step;
wherein the adhesive agent comprises a condensation resin having a structural unit obtained by polycondensing a polymerizable
monomer containing a monomer (A) having 2 or more carboxyl groups and a monomer (B) having 2 or more amino groups, and meeting
the following (1), (2), and (3), or the following (2) and (3):

(1) at least one selected from the group consisting of the monomer (A), an anhydride of the monomer (A), and the monomer (B)
is liquid at 25° C.;

(2) the condensation resin has a polyoxyalkanediyl group; and
(3) the monomer (A) contains an isophthalic acid; and
wherein a structure derived from the monomer (B) in the structural unit has a polyoxyalkanediyl group.
US Pat. No. 9,110,371

PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, METHOD FOR FORMING RESIST PATTERN AND METHOD FOR PRODUCING WIRING BOARD

HITACHI CHEMICAL COMPANY,...

9. A method of forming a resist pattern, the method comprising:
a photosensitive layer-forming step of forming a photosensitive layer on a substrate by applying the photosensitive resin
composition according to claim 1;

an exposure step of exposing at least a portion of the photosensitive layer to an active light beam to form a photo-cured
portion in the photosensitive layer; and

a development step of removing a portion other than the photo-cured portion.
US Pat. No. 9,086,105

FRICTION MATERIAL COMPOSITION, FRICTION MATERIAL USING THE SAME, AND FRICTION MEMBER

Hitachi Chemical Company,...

1. A friction material composition comprising:
a binder;
a fibrous base material;
an abrasive material;
an inorganic filler; and
an organic filler comprising cashew dust in an amount of 1 to 10 wt % relative to the amount of the friction material composition,
wherein the cashew dust is coated with a rubber in an amount of 3 to 17 wt % relative to the amount of the cashew dust,

wherein the fibrous base material comprises a cellulose fiber and an iron-based fiber, the iron-based fiber present in the
friction material composition in an amount of 2 to 10 wt %, and

wherein the abrasive material comprises an inorganic abrasive material having a Mohs hardness of 8 or higher and a particle
diameter of 1 ?m or larger in an amount of 1 wt % or less.

US Pat. No. 9,079,376

PREPREG, LAMINATE OBTAINED WITH THE SAME AND PRINTED-WIRING BOARD

Hitachi Chemical Company,...

1. A prepreg comprising a fiber substrate and a layer made of a thermosetting resin composition, wherein the layer made of
the thermosetting resin composition contains a modified silicone oil or a compound having a skeleton derived from a modified
silicone oil, and the layer made of a thermosetting resin composition has a phase separation structure, said phase separation
structure being a sea-island structure, wherein an occupying area ratio of an island portion of the sea-island structure per
unit area on an observation surface of the layer made of a thermosetting resin composition is 10% or more to 45% or less,
and wherein the thermosetting resin composition contains at least one of a cyanate resin and an unsaturated imide resin.

US Pat. No. 9,394,457

PHOTO CURABLE RESIN COMPOSITION, IMAGING DISPLAY DEVICE AND PRODUCTION METHOD THEREOF

HITACHI CHEMICAL COMPANY,...

1. A method for manufacturing an image display device comprising allowing a photocurable resin composition to intervene in
a gap between an image display unit having an image display part and a transparent protective plate and curing the photocurable
resin composition, wherein
The photocurable resin composition containing a compound (A) having a photopolymerizable functional group and an oil gelling
agent (B) is allowed to intervene in the gap and cured upon irradiation with light at lease from the side of the transparent
protective plate.

US Pat. No. 9,410,591

FRICTION MATERIAL COMPOSITION, FRICTION MATERIAL USING THE SAME, AND FRICTION MEMBER

HITACHI CHEMICAL COMPANY,...

1. A friction material composition comprising:
a binder;
a fibrous base material;
an abrasive material;
an inorganic filler; and
an organic filler,
wherein the fibrous base material comprises:
a precursor fiber of a polyacrylonitrile carbon fiber; and
an iron-based fiber in an amount of 2 to 10 wt %, and
wherein the abrasive material comprises an inorganic abrasive material having a Mohs hardness of 8 or higher and a particle
diameter of 1 ?m or larger in an amount of 1 wt % or less.

US Pat. No. 9,406,929

LITHIUM ION BATTERY

Hitachi Chemical Company,...

1. A lithium ion battery having an electrode wound group in which a positive electrode, a negative electrode, and a separator
are wound and an electrolytic solution provided in a battery container, a discharge capacity X of the battery when discharging
a voltage from 4.2 V to 2.7 V at a current of 0.5 C being 30 Ah or more and less than 100 Ah,
wherein the positive electrode has a current collector and a positive electrode composite applied to both surfaces of the
current collector,

the positive electrode composite contains a mixed active material of layered lithium nickel manganese cobalt composite oxide
(NMC) and spinel lithium manganese oxide (sp-Mn),

a density of the positive electrode composite is 2.4 g/cm3 or more and 2.7 g/cm3 or less, a porosity of the active electrode composite is 29.5% or more and 40.0% or less, and an application quantity of the
positive electrode composite is 175 g/m2 or more and 250 g/m2 or less, and

the discharge capacity X and a weight ratio Y (NMC/sp-Mn) between the layered lithium nickel manganese cobalt composite oxide
(NMC) and the spinel lithium manganese oxide (sp-Mn) satisfy a following relational expression 1:

Y

US Pat. No. 9,395,626

PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING PATTERNED CURED FILM, AND ELECTRONIC COMPONENT

HITACHI CHEMICAL COMPANY,...

1. A photosensitive resin composition, comprising:
(A) an alkali-soluble resin;
(B) a compound which generates an acid when exposed to light;
(C) a thermal crosslinking agent;
(D) an acryl resin;
(E) a nitrogen-containing aromatic compound represented by the following formula (1),

wherein R1 represents a hydrogen atom or a hydrocarbon group; R2 represents a hydrogen atom, an amino group or a phenyl group; and A and B each independently represent a nitrogen atom, or
a carbon atom and a hydrogen atom bonded thereto.

US Pat. No. 9,337,429

ORGANIC ELECTRONIC MATERIAL, INK COMPOSITION, AND ORGANIC ELECTRONIC ELEMENT

HITACHI CHEMICAL COMPANY,...

1. An ink composition comprising an organic electronic material and a solvent, the organic electronic material comprising
at least an ionic compound represented by the following general formula (1), and a charge transporting compound including
a charge transporting unit:

wherein in the general formula (1), A represents an anion, and Ra to Rc each independently represent a hydrogen atom (H), an alkyl group, or a benzyl group, provided that at least one condition
selected from the group consisting of:

(i) at least two of Ra to Rc each independently represent an alkyl group having 5 or more carbon atoms,

(ii) at least one of Ra to Rc represents a benzyl group, and

(iii) at least one of Ra to Rc represents an alkyl group having 7 or more carbon atoms,
is satisfied.
US Pat. No. 9,242,949

METHOD FOR PRODUCING ALKANEDIOL MONOGLYCIDYL ETHER (METH)ACRYLATE

HITACHI CHEMICAL COMPANY,...

1. A method for producing an alkanediol glycidyl ether (meth)acrylate, the method comprising the steps of:
subjecting a vinyloxyalkyl glycidyl ether to a devinylation reaction in the presence of an acid catalyst and water, thereby
producing an alkanediol monoglycidyl ether and acetaldehyde;

removing the acetaldehyde produced by the devinylation reaction while maintaining a reaction pressure at 50 kPa or less and
a reaction temperature at 20 to 50° C., thereby obtaining the alkanediol monoglycidyl ether; and

then performing a transesterification reaction of the alkanediol monoglycidyl ether with an alkyl(meth)acrylate.

US Pat. No. 9,614,178

ELECTRONIC COMPONENT, PROCESS FOR PRODUCING SAME, SEALING MATERIAL PASTE, AND FILLER PARTICLES

Hitachi Chemical Company,...

1. An electronic component comprising:
two substrates at least one of which is transparent;
an organic member arranged between these substrates; and
a bonding portion located onto respective outer circumferential portions of the two substrates,
wherein the bonding portion includes a low-melting glass and filler particles, the low-melting glass includes vanadium oxide,
the filler particles include a low thermally-expandable material, and an oxide containing a bivalent transition metal as a
constituent element, the oxide is dispersed in the low thermally-expandable material, and the low thermally-expandable material
has a thermal expansion coefficient of 5×10-7/° C. or less in a temperature range from 30 to 250° C.

US Pat. No. 9,252,376

COMPOSITION CAPABLE OF CHANGING ITS SOLUBILITY, HOLE TRANSPORT MATERIAL COMPOSITION, AND ORGANIC ELECTRONIC ELEMENT USING THE SAME

HITACHI CHEMICAL COMPANY,...

1. A method for changing solubility of an organic layer (I), formed by applying a composition comprising a polymer or oligomer
(A) having a repeating unit with hole transport properties and also having a thienyl group which may have a substituent, and
an initiator (B), wherein solubility of the composition is capable of being changed by applying heat, light, or both heat
and light, the method comprising a step of applying heat, light, or both heat and light to the organic layer (I),
wherein the polymer or oligomer (A) has at least one type of structure selected from the group consisting of a structure represented
by formula (Ia) shown below, and a structure represented by formula (Ib) shown below:


wherein, in formulas (Ia) and (Ib), each of R1 to R3 independently represents a hydrogen atom or an alkyl group, provided that at least one of R1 to R3 represents a hydrogen atom, and

wherein the polymer or oligomer (A) does not include an oxetane group.

US Pat. No. 9,638,979

LIGHT CONTROL FILM

HITACHI CHEMICAL COMPANY,...

1. A light control film, comprising:
two transparent electroconductive substrates; and
a light control layer sandwiched between the two transparent electroconductive substrates,
wherein the light control layer contains a resin matrix and a light control suspension dispersed in the resin matrix as droplets
having light control performance, where the light control suspension comprises a liquid dispersing medium and light control
particles having a major axis and a minor axis dispersed in the liquid dispersing medium, where a concentration of the light
control suspension, measured by observing a cross section in a thickness direction of the light control film when trisecting
the light control layer into three equal thickness parts consisting of a vicinity region to each of the transparent electroconductive
substrates, and a middle region of the light control layer to observe the existence of droplets of the light control suspension
in each of the regions, in the vicinity region to each of the transparent electroconductive substrates is smaller than that
of the light control suspension in the middle region in the thickness direction of the light control layer, and the light
control particles are configured to have their major axes arranged in a direction parallel to an electric field when an electric
field is applied, whereby light radiated into the light control film penetrates through the light control film, wherein the
light control layer contains the resin matrix as an energy cured polymeric medium from each of both major surfaces, where
the polymeric medium has a first major surface adjacent one of the two transparent electroconductive substrates and a second
major surface adjacent another of the two transparent electroconductive substrates with the light control suspension dispersed
in the polymeric medium as droplets, so that for the resin matrix the concentration of the light control suspension in the
vicinity region to each of the transparent electroconductive substrates is smaller than that of the light control suspension
in the middle region in the thickness direction of the light control layer for color evenness and adhesion with the two transparent
electro-conductive substrates.

US Pat. No. 9,309,446

PHOTOSENSITIVE ADHESIVE COMPOSITION, FILM-LIKE ADHESIVE, ADHESIVE SHEET, ADHESIVE PATTERN, SEMICONDUCTOR WAFER WITH ADHESIVE LAYER, SEMICONDUCTOR DEVICE

HITACHI CHEMICAL COMPANY,...

1. A photosensitive adhesive composition that has thermal press bondability to an adherent after being patterned by exposure
and development and enables alkali development, wherein
the composition comprises an (A) alkali-soluble polyimide resin obtained by reacting a tetracarboxylic acid dianhydride with
a diamine containing 10 mol % to 80 mol % of a phenolic hydroxyl group-containing diamine represented by formula (A-1) based
on the diamines in total and an aliphatic ether diamine represented by formula (8):



wherein R1, R2 and R3 are independently alkylene groups having 1 to 10 carbons atoms,

wherein in the above formulae b is an integer between 2 and 80, and
a storage elastic modulus at 110° C. after exposure and further heat curing is not less than 10 MPa.
US Pat. No. 9,295,981

METHOD FOR PRODUCING ESTER COMPOUND BY REACTING AN UNSATURATED ORGANIC COMPOUND AND A FORMIC ACID ESTER IN THE PRESENCE OF A CATALYST SYSTEM CONTAINING A RUTHENIUM COMPOUND, A COBALT COMPOUND AND A HALIDE SALT

HITACHI CHEMICAL COMPANY,...

1. A method for producing an ester compound, the method comprising the step of reacting an organic compound having at least
one unsaturated carbon bond in the molecule, and a formic acid ester in the presence of a catalyst system containing: a ruthenium
compound; a cobalt compound; a halide salt; and a phenolic compound.

US Pat. No. 9,215,803

EPOXY RESIN COMPOSITION AND PRE-PREG, SUPPORT-PROVIDED RESIN FILM, METALLIC FOIL CLAD LAMINATE PLATE AND MULTILAYER PRINTED CIRCUIT BOARD UTILIZING SAID COMPOSITION

HITACHI CHEMICAL COMPANY,...

1. An epoxy resin composition containing (A) a phosphorus-containing curing agent and (B) an epoxy resin, wherein the phosphorus-containing
curing agent (A) is a phosphorus compound represented by the following Chemical Formula (1); an organic group represented
by R in Chemical Formula (1) has at least one structure selected from structures represented by the following Chemical Formulas
(2), (3) and (4) and has two or more phenolic hydroxyl groups; and the organic group has a molecular weight of 190 or more,
wherein in Chemical Formulas (2), (3) and (4) * shows a part bonded directly to a phosphorus atom in Chemical Formula (1):

US Pat. No. 9,441,693

NON-ASBESTOS FRICTION MATERIAL COMPOSITION, AND FRICTION MATERIAL AND FRICTION MEMBER USING SAME

HITACHI CHEMICAL COMPANY,...

1. A non-asbestos frictional material composition containing a binder, an organic filler, an inorganic filler, and a fiber
base material, wherein a content of the fiber base material is 5-20 mass % of the non-asbestos frictional material composition,
the fiber base material comprises wollastonite in a content of 1-6 mass % of the non-asbestos frictional material composition;
the organic filler comprises cashew dust in a content of 5.0-10.0 mass % of the non-asbestos frictional material composition;
the inorganic filler comprises mica in a content of 1-6 mass % of the non-asbestos frictional material composition; the content
of the inorganic filler other than the mica falls within the range of 60-80 mass % of the non-asbestos frictional material
composition; and the non-asbestos frictional material composition comprises no copper and no metal fiber.

US Pat. No. 9,297,859

BATTERY-STATE MONITORING SYSTEM

Hitachi Chemical Company,...

1. A battery-state monitoring system which monitors a state of each of a plurality of storage batteries in an equipment provided
with an assembled battery composed of the storage batteries connected in series and a power generation facility utilizing
natural energy, the system comprising:
a current detecting unit which detects a current in each of the storage batteries;
a state measuring unit which measures a temperature, a voltage, and internal resistance of each of the storage batteries,
the internal resistance being measured by using at least two or more kinds of frequencies including at least a first frequency
of lower than 200 Hz and a second frequency of 200 Hz or higher to lower than 2000 Hz; and

a prime monitoring unit which acquires measurement data from the state measuring unit corresponding to each of the storage
batteries and issues an instruction related to an operation to the current detecting unit and the state measuring unit,

wherein the prime monitoring unit estimates degradation of each of the storage batteries based on at least one or more values
of the temperature, the voltage, and the internal resistance measured by the state measuring unit and a DC resistance of each
of the storage batteries obtained from a ratio between a change in a current value detected by the current detecting unit
and a change in a voltage value measured by the state measuring unit during discharging and charging of each of the storage
batteries, and the prime monitoring unit applies a constant current from the state measuring unit to the storage battery whose
voltage is higher than a predetermined value, thereby decreasing the voltage.

US Pat. No. 9,265,145

VARNISH, PREPREG, FILM WITH RESIN, METAL FOIL-CLAD LAMINATE, AND PRINTED CIRCUIT BOARD

HITACHI CHEMICAL COMPANY,...

1. A varnish produced through reaction between a compound having an amino group and a resin having a plurality of epoxy groups,
and having a polycyclic structure, wherein a portion of the plurality of the epoxy groups of the resin is caused to react
with the amino group of the compound in a solvent, wherein the reaction forms a reaction product, and wherein the reaction
product has a weight average molecular weight in the range of 800 to 4000,
wherein the varnish is produced through reaction between the compound having the amino group and said resin, and between a
compound having a phenolic hydroxyl group and said resin, wherein another portion of the plurality of the epoxy groups of
the resin is caused to react with the phenolic hydroxyl group of the compound in the solvent, and

wherein an amount of the compound having the phenolic hydroxyl group is 0.01 to 100 equivalents on the basis of 1 equivalent
of the compound having the amino group.

US Pat. No. 9,122,026

OPTICAL WAVEGUIDE, OPTO-ELECTRIC HYBRID BOARD, AND OPTICAL MODULE

HITACHI CHEMICAL COMPANY,...

1. An optical module comprising an optical waveguide and a connector connected with the above optical waveguide, wherein the
above optical waveguide comprises a waveguide structure of a lower cladding layer, a patternized core layer and an upper cladding
layer; a striking part for positioning is formed of the waveguide structure and is provided at one end part of the waveguide
structure; an optical path turning mirror face is formed of the lower cladding layer, the patternized core layer and the upper
cladding layer of the waveguide structure, and is provided in the one end part of the waveguide structure, in a position inside
of said striking part; an inner wall part, which is brought into contact with the striking part in connecting the optical
waveguide to determine a position of the optical waveguide, is provided in the above connector; and the above connector further
comprises a cage member and a fixing member,
wherein the optical waveguide is provided on the cage member, and the fixing member is positioned overlying the cage member
so as to fix the optical waveguide on the cage member by pressing the fixing member on the optical waveguide, when the optical
waveguide is positioned on the cage member,

wherein the optical module further comprimises a base material, the optical waveguide and the striking part being provided
on the base material, and wherein the base material includes a tip part which extends beyond the striking part and away from
the optical waveguide, and

wherein the fixing member rotates around a rotation shaft from a first position where the fixing member does not press on
the optical waveguide, to a second position where the fixing member presses on the optical waveguide, when the optical waveguide
is positioned on the cage member: and wherein the fixing member is positioned such that when the fixing member rotates from
said first position to said second position, said fixing member presses the tip part downward while pulling the tip part by
the rotation.

US Pat. No. 9,123,734

SEMICONDUCTOR-ENCAPSULATING ADHESIVE, SEMICONDUCTOR-ENCAPSULATING FILM-FORM ADHESIVE, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE

Hitachi Chemical Company,...

1. A method for producing a semiconductor device equipped with a semiconductor chip having a bump and a substrate having a
metal interconnect, comprising a connection step of:
(1) arranging the semiconductor chip and the substrate such that the bump and the metal interconnect face each other with
a semiconductor-encapsulating adhesive interposed therebetween, the semiconductor-encapsulating adhesive comprising

(a) an epoxy resin, and
(b) a compound formed of an organic acid reactive with an epoxy resin and a curing accelerator, wherein the compound is formed
prior to use in the semiconductor-encapsulating adhesive; and

(2) heating the semiconductor chip and the substrate while pressing the semiconductor chip and the substrate in the facing
direction thereof, to cure the semiconductor-encapsulating adhesive and to electrically connect the bump and the metal interconnect.

US Pat. No. 9,076,833

TAPE FOR PROCESSING WAFER, METHOD FOR MANUFACTURING TAPE FOR PROCESSING WAFER, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

Hitachi Chemical Company,...

1. A wafer processing tape having a pasting region to be pasted to a wafer ring used when processing a semiconductor wafer,
the wafer processing tape comprising:
a release substrate that constitutes a base of the tape;
an adhesive layer provided on one surface of the release substrate so as to correspond to a planar shape of the semiconductor
wafer;

a tacky material layer provided so as to cover the adhesive layer; and
a base material film provided so as to cover the tacky material layer, wherein
regions of the tacky material layer and the base material film which protrude outward from the adhesive layer serve as the
pasting region to the wafer ring,

a notched part defining a flap protruding toward the center of the adhesive layer, as seen in a plan view, is formed in the
pasting region to a depth that reaches the release substrate from the base material film side, and

the notched part is spaced inwardly from an outer perimeter of the pasting region in the plan view,
the flap acting to inhibit removal of the pasting region from the wafer ring when portions of the pasting region adjacent
to the flap are peeled from the wafer ring.

US Pat. No. 9,328,135

METHOD FOR PRODUCING POROUS SILK FIBROIN MATERIAL

Hitachi Chemical Company,...

1. A method for producing a porous silk fibroin material, comprising steps of:
freezing a silk fibroin solution containing a silk fibroin aqueous solution having an aliphatic carboxylic acid added thereto,
without gelling the silk fibroin; and then melting the frozen solution, thereby providing a porous material.

US Pat. No. 9,470,283

NON-ASBESTOS FRICTION MATERIAL COMPOSITION

HITACHI CHEMICAL COMPANY,...

1. A non-asbestos frictional material composition comprising a binder, an organic filler, an inorganic filler, and a fiber
substrate, wherein, in the non-asbestos frictional material composition, content of a copper is 5% or less by mass as a copper
element, content of a metal fiber other than a copper fiber and a copper alloy fiber is 0.5% or less by mass, and a titanate
salt and antimony trisulfide are comprised therein with content of the titanate salt being in the range of 13 to 35% by mass.

US Pat. No. 9,447,306

CMP POLISHING FLUID, METHOD FOR MANUFACTURING SAME, METHOD FOR MANUFACTURING COMPOSITE PARTICLE, AND METHOD FOR POLISHING BASE MATERIAL

HITACHI CHEMICAL COMPANY,...

1. A CMP polishing liquid comprising:
water; and
an abrasive particle, wherein
the abrasive particle comprises a composite particle having a core including a first particle, and a second particle provided
on the core, wherein the second particle has a diameter of 0.1 to 100 nm,

the first particle contains silica,
the second particle is a cerium hydroxide particle, and
pH of the CMP polishing liquid is equal to or lower than 9.5.

US Pat. No. 9,404,535

SLIDING BEARING ASSEMBLY

HITACHI CHEMICAL COMPANY,...

1. A sliding bearing assembly for joints of construction equipment, comprising at least:
a shaft; and
a bush made of an iron-based sintered material configured to function as a sliding bearing,
wherein the bush has an overall composition consisting of, by mass %, 0.1 to 10% of Cu, 0.2 to 1.2% of C, 0.03 to 0.9% of
Mn, 0.36 to 1.68% of S, and the balance of Fe and inevitable impurities, and

a matrix having a metal structure comprising: (i) a martensite structure as a primary structure, (ii) pores dispersed in the
matrix, and (iii) sulfide particles precipitated and dispersed in the matrix mainly consisting of iron sulfide, in which

a content of the sulfide particles in the matrix is 1 to 7 volume % of the matrix.

US Pat. No. 9,228,100

LIQUID COMPOSITION, AND RESISTOR FILM, RESISTOR ELEMENT AND CIRCUIT BOARD USING SAME

HITACHI CHEMICAL COMPANY,...

1. A liquid composition comprising
(a) an epoxy resin,
(b) carbon black particles,
(c) carbon nanotubes, the carbon nanotubes having an outer diameter of 3 nm or greater and a length greater than or equal
to 100 nm and less than or equal to 15 ?m,

(d) a solvent with a vapor pressure of less than 1.34×103 Pa at 25° C., and

(e) having a viscosity allowing for discharge from an ink-jet apparatus,
wherein the content of the (c) carbon nanotubes is 0.1 to 10 parts by mass with respect to 100 parts by solid mass of the
(b) carbon black particles.

US Pat. No. 9,161,442

PHOTOSENSITIVE CONDUCTIVE FILM, METHOD FOR FORMING CONDUCTIVE FILM, METHOD FOR FORMING CONDUCTIVE PATTERN, AND CONDUCTIVE FILM SUBSTRATE

Hitachi Chemical Company,...

1. A conductive film substrate comprising a substrate, and a conductive pattern consisting of (a) a cured resin layer, having
a predetermined pattern, formed on the substrate, and (b) a conductive layer containing a conductive fiber and having a predetermined
pattern, formed on the cured resin layer having the predetermined pattern, wherein the predetermined pattern of the conductive
layer is a same predetermined pattern as the predetermined pattern of the cured resin layer.

US Pat. No. 9,075,307

PHOTOSENSITIVE RESIN COMPOSITION FOR PROTECTIVE FILM OF PRINTED WIRING BOARD FOR SEMICONDUCTOR PACKAGE

HITACHI CHEMICAL COMPANY,...

9. A photosensitive resin composition for a protective film of a printed wiring board for a semiconductor package, the photosensitive
resin composition comprising:
(A) an acid-modified vinyl group-containing epoxy resin;
(B) a phenol compound, wherein the phenol compound is a compound represented by formula (1) or formula (10),

wherein, in formula (1), R1 represents a C1-C5 alkyl group, m represents an integer of 1-4, n represents 3 and A is a trivalent organic group represented by formula (2),
a plurality of R1 groups may be the same or different,


wherein, in formula (10), R3, R4, R5 and R6 each independently represent a C1-C5 alkyl group, and Z represents hydrogen or an organic group represented by formula (11),


wherein, in formula (11), R7 and R8 each independently represent a C1-C5 alkyl group;

(C) a compound having at least one ethylenically unsaturated group in each molecule;
(D) a photopolymerization initiator; and
(E) inorganic fine particles including barium sulfate,wherein the content of the phenol compound is 1.3-3 mass % based on the total solid mass of the photosensitive resin composition,
wherein the (A) acid-modified vinyl group-containing epoxy resin is a resin obtained by reacting a saturated or unsaturated
group-containing polybasic acid anhydride (c) with a resin obtained by reacting a vinyl group-containing monocarboxylic acid
(b) with at least one type of epoxy resin (a) selected from the group consisting of novolac-type epoxy resins represented
by the following formula (4), bisphenol-type epoxy resins represented by the following formula (5), salicylaldehyde-type epoxy
resins represented by the following formula (6) and bisphenol-type novolac resins having a repeating unit represented by the
following formula (7) or (8)

wherein in formula (4), R11 represents hydrogen or a methyl group, Y1 represents hydrogen or a glycidyl group, and n1 represents an integer of 1 or greater; a plurality of R11 and Y1 may be the same or different; however at least one Y1 represents a glycidyl group;
wherein in formula (5), R12 represents hydrogen or a methyl group, Y2 represents hydrogen or a glycidyl group, and n2 represents an integer of 1 or greater; a plurality of R12 may be the same or different; when n2 is 2 or greater, a plurality of Y2 may be the same or different;
wherein in formula (6), Y3 represents hydrogen or a glycidyl group, and n3 represents an integer of 1 or greater; a plurality of Y3 may be the same or different, and however at least one Y3 represents a glycidyl group;
wherein in formula (7), R13 represents hydrogen or a methyl group, and Y4 and Y5 each independently represent hydrogen or a glycidyl group; the two R13 may be the same or different; however at least one of Y4 and Y5 represents a glycidyl group;
wherein in formula (8), R14 represents hydrogen or a methyl group, and Y6 and Y7 each independently represent hydrogen or a glycidyl group; the two R14 may be the same or different; however at least one of Y6 and Y7 represents a glycidyl group.

US Pat. No. 9,069,128

OPTO-ELECTRIC COMBINED CIRCUIT BOARD AND ELECTRONIC DEVICES

HITACHI CHEMICAL COMPANY,...

1. An opto-electric combined circuit board in which an optical waveguide film provided with a core part and a clad is bonded
to a flexible electric wiring board, the opto-electric combined circuit board having a bending part, wherein the flexible
electric wiring board has a plurality of electric wirings, one of the electric wirings being closest to the core part, with
the core part and the electric wiring closest to the core part not overlapping, in a projection plane obtained by observing
the opto-electric combined circuit board from a vertical direction with respect to a surface of the wiring board on which
the plurality of electric wirings extend, in the bending part, and wherein the core part of the optical waveguide film and
the electric wiring closest to the core part overlapping in said projection plane in a part other than the bending part.

US Pat. No. 9,502,709

TERMINAL STRUCTURE FOR SECONDARY BATTERY AND SECONDARY BATTERY

Hitachi Chemical Company,...

1. A terminal structure for a secondary battery including an electrode group including a plurality of electrodes each having
a tab and stacked via a separator, the terminal structure comprising:
a terminal including a terminal portion and a terminal body portion; and
at least one pressing member attached to the terminal body portion using two or more fasteners each including a bolt and a
nut, and configured to hold a stacked current collecting plate group in a sandwiched manner between the pressing member and
the terminal body portion, the stacked current collecting plate group being formed by stacking a plurality of current collecting
plates to which the tabs of the electrodes of the same polarity are welded, wherein:

the two or more fasteners are provided such that the bolts extend in a stacking direction of the current collecting plates
in the stacked current collecting plate group and one or more of the fasteners are located in each of two attachment regions
spaced apart at a predetermined interval;

the terminal body portion has at least one opposed surface that faces the pressing member;
the pressing member has an opposed surface that faces the terminal body portion; and
at least one of the opposed surface of the terminal body portion and the opposed surface of the pressing member has a projecting
surface to project toward the other of the opposed surfaces of the terminal body portion and the pressing member in a region
located between the two attachment regions. a terminal including a terminal portion and a terminal body portion;

the projecting surface is provided on one of the opposed surfaces of the terminal body portion and the pressing member;
a projecting length of the projecting surface from a non-projecting surface of the one of the opposed surfaces of the terminal
body portion and the pressing member is 0.1 mm to 0.5 mm;

the projecting surface has an area that is 60% to 80% of an area of the opposed surfaces of the terminal body portion and
the pressing member;

the projecting surface is a continuous surface;
the plurality of current collecting plates are each formed with through holes through which the bolts pass;
the at least one opposed surface of the terminal body portion comprises two opposed surfaces of the terminal body portion
that are opposite to each other in the stacking direction;

the at least one pressing member comprises two pressing members respectively provided to face the two opposed surfaces of
the terminal body portion;

a predetermined number of the plurality of tabs of the plurality of electrodes of the same polarity in the electrode group
are welded to each of the plurality of current collecting plates, and the plurality of current collecting plates are divided
into two groups and stacked to constitute two stacked current collecting plate groups;

one of the stacked current collecting plate groups is held in a sandwiched manner between one of the opposed surfaces of the
terminal body portion and one of the pressing members, and the remaining one of the stacked current collecting plate groups
is held in a sandwiched manner between the remaining one of the opposed surfaces of the terminal body portion and the remaining
one of the pressing members;

the terminal body portion is formed with a plurality of through holes that each open in the two surfaces of the terminal body
portion;

the two pressing members are each formed with a plurality of through holes aligned with the plurality of through holes formed
in the terminal body portion;

the bolts having threaded portions at both ends are disposed to pass through the through holes formed in the terminal body
portion and the through holes formed in the pressing members; and

the nuts are screwed with both ends of the bolts;
the at least one pressing member is formed from aluminum, titanium, iron, nickel, copper, zinc, silver, cadmium, or tin, and
have a thickness of 5 mm to 7 mm in the stacking direction; and

the at least one pressing member, the stacked current collecting plate groups, and the terminal portion are welded to each
other.

US Pat. No. 9,488,912

METHOD OF FORMING PROTECTIVE FILM FOR TOUCH PANEL ELECTRODE, PHOTOSENSITIVE RESIN COMPOSITION AND PHOTOSENSITIVE ELEMENT, AND METHOD OF MANUFACTURING TOUCH PANEL

HITACHI CHEMICAL COMPANY,...

1. A method for forming a protective coat on an electrode for a touch panel, wherein a photosensitive layer comprising a photosensitive
resin composition containing a binder polymer having a carboxyl group and an acid value of 30 to 120 mgKOH/g, a photopolymerizable
compound having at least three ethylenic unsaturated groups, a photopolymerization initiator, and one or more compounds selected
from the group consisting of benzotriazole, 1H-benzotriazole-1-acetonitrile, benzotriazole-5-carboxylic acid, 1H-benzotriazole-1-methanol,
carboxybenzotriazole, triazole compounds containing mercapto groups, triazole compounds containing amino groups, thiadiazole
compounds and tetrazole compounds is formed on a base material having an electrode for a touch panel, prescribed sections
of the photosensitive layer are cured by irradiation with active light rays and then the sections other than the prescribed
sections are removed, to form a protective coat comprising the cured sections of the photosensitive layer covering all or
a portion of the electrode.
US Pat. No. 9,458,496

METHOD OF CHARACTERIZING VASCULAR DISEASES

HITACHI CHEMICAL COMPANY,...

1. A method for administering a medication to a human patient having a vascular disease, the method comprising:
(A) having a first sample of a biological fluid from the patient sent to a laboratory, wherein said sample comprises vesicles
comprising RNA, for the laboratory to perform an assay comprising the following steps (1)-(8):

(1) capturing vesicles from said sample, wherein said capturing comprises:
(a) loading at least a portion of said first sample of biological fluid into a sample loading region of a vesicle capture
device;

(b) passing said sample from said sample loading region through a vesicle-capture material in said vesicle capture device,
said vesicle-capture material comprising a plurality of layers of glassfiber, thereby producing a supernatant,

wherein said plurality of layers of glassfiber comprises at least a first layer and a second layer of glassfiber, and
wherein said first layer of glassfiber is configured to capture material from said sample that is about 1.6 microns or greater
in diameter, and wherein said second layer of glassfiber is configured to capture vesicles having a minimum size from about
0.6 microns to about 0.8 microns in diameter, and having a maximum size of less than 1.6 microns; and

(c) passing said supernatant to a sample receiving region of said vesicle capture device,
wherein said passings result in capture of said vesicles from said sample on or in said vesicle-capture material, thereby
capturing said vesicles;

(2) lysing said captured vesicles to release said RNA from said captured vesicles, wherein said RNA from said captured vesicles
comprises a first, vascular disease-specific RNA and a second, endothelial cell-specific RNA, wherein said first RNA and said
second RNA are different, and wherein said vascular disease is selected from the group consisting of atherosclerosis, hypertension,
adhesion-medicated cardiovascular disease, and hypercholesterolemia;

(3) quantifying said first RNA from said sample by a method selected from the group consisting of reverse-transcription polymerase
chain reaction (RT-PCR), real-time RT-PCR, northern blotting, fluorescence activated cell sorting, ELISA, and mass spectrometry;

(4) comparing the quantity of said first RNA from said sample to the quantity of a corresponding first RNA from healthy subjects;
(5) determining a difference between the quantity of said first RNA from said sample as compared to the quantity of said corresponding
first RNA from said healthy subjects, wherein the said difference indicates a diseased state in said patient;

(6) quantifying said second RNA from said sample by a method selected from the group consisting of reverse-transcription polymerase
chain reaction (RT-PCR), real-time RT-PCR, northern blotting, fluorescence activated cell sorting, ELISA, and mass spectrometry;

(7) comparing the quantity of said second RNA from said sample to the quantity of a corresponding second RNA from subjects
without said vascular disease;

(8) determining that there is a greater quantity of said second RNA as compared to the quantity of said corresponding second
RNA from said subjects without said vascular disease, wherein said greater quantity indicates that said patient has said vascular
disease; and

(B) administering a medication for treatment of said vascular disease to said patient.

US Pat. No. 9,123,835

CONNECTED STRUCTURE AND METHOD FOR MANUFACTURE THEREOF

Hitachi Chemical Company,...

1. A method for electrically connecting a surface electrode of a solar battery cell and a wiring member via a conductive adhesive
film, wherein the method comprises the steps of:
(a) providing the conductive adhesive film comprising an insulating adhesive and conductive particles, the conductive adhesive
film having a thickness t; and

(b) connecting the surface electrode of the solar battery cell and the wiring member via the conducting adhesive film, wherein
a ten point height of roughness profile and maximum height of a surface of the surface electrode connected with the conductive
adhesive film are Rz and Ry, respectively, and an average particle diameter r of the conductive particles is greater than
the ten point height of roughness profile Rz, and a difference between the average particle diameter r and the ten point height
of roughness profile Rz, r?Rz, is greater than or equal to 1 ?m, and r?Rz is less than or equal to Rz,

wherein the surface electrode of the solar battery cell is a surface electrode formed using silver glass paste,
wherein the film thickness t is greater than the maximum height Ry by 1 ?m or more,
wherein the surface electrode is an electrode provided on a surface of one or more wafers selected from the group consisting
of a monocrystalline silicon wafer, and a polycrystalline silicon wafer, and wherein the ten point average surface roughness
Rz of the surface electrodes is at least 10 ?m, and a maximum height Ry of the surface electrodes is at least 14 ?m.

US Pat. No. 9,387,608

THERMOSETTING RESIN COMPOSITION FOR LIGHT REFLECTION, METHOD FOR MANUFACTURING THE RESIN COMPOSITION AND OPTICAL SEMICONDUCTOR ELEMENT MOUNTING SUBSTRATE AND OPTICAL SEMICONDUCTOR DEVICE USING THE RESIN COMPOSITION

HITACHI CHEMICAL COMPANY,...

1. A thermosetting resin composition for light reflection, comprising a thermosetting component and a white pigment (E), wherein:
the thermosetting resin composition has a property of light reflectance at a wavelength of 350 nm to 800 nm, after thermal
curing, which is not lower than 80%, and wherein:

the thermosetting component contains an epoxy resin (A) and a curing agent (B) containing an acid anhydride;
said white pigment (E) includes a mixture of inorganic hollow particles and at least one selected from the group consisting
of alumina, magnesium oxide, antimony oxide, titanium oxide, and zirconium oxide; and

wherein the inorganic hollow particles are made of at least one selected from the group consisting of sodium silicate glass,
aluminosilicate glass, sodium borosilicate soda glass and Shirasu glass;

the thermosetting resin composition comprises a kneaded product obtained under a condition where constituent components are
kneaded at a kneading temperature of 20 to 100° C. for a kneading time of 10 to 30 minutes; and

said kneaded product is aged at 0 to 30° C. for 1 to 72 hours after the kneading.
US Pat. No. 9,293,344

CMP POLISHING SLURRY AND METHOD OF POLISHING SUBSTRATE

HITACHI CHEMICAL COMPANY,...

1. A CMP polishing slurry comprising cerium oxide particles, a dispersant, a water-soluble polymer and water,
wherein the water-soluble polymer is a polymer that has a cationic azo compound bound to its terminal,
wherein the water-soluble polymer is a polymer obtained by radical polymerization of a monomer containing at least one of
a carboxylic acid having an unsaturated double bond and the salt thereof by using at least one polymerization initiator

selected from the group consisting of
2,2?-azobis[2-(5-methyl-2-imidazolin-2-yl)propane] hydrochloride,
2,2?-azobis[2-(2-imidazolin-2-yl)propane],
2,2?-azobis[2-(2-imidazolin-2-yl)propane] hydrochloride,
2,2?-azobis[2-(2-imidazolin-2-yl)propane] sulfate hydrate,
2,2?-azobis[2-(3,4,5,6-tetrahydropyrimidin-2-yl)propane] hydrochloride,
2,2?-azobis{2-[1-(2-hydroxyethyl)-2-imidazolin-2-yl] propane } hydrochloride,
2,2?-azobis(2-amidino propane) hydrochloride, and
2,2?-azobis(2-methylpropionamidoxime), and salts thereof.

US Pat. No. 9,247,652

ADHESIVE COMPOSITION, ELECTRONIC-COMPONENT-MOUNTED SUBSTRATE AND SEMICONDUCTOR DEVICE USING THE ADHESIVE COMPOSITION

HITACHI CHEMICAL COMPANY,...

1. An adhesive composition, comprising electroconductive particles (A) and a binder component (B),
wherein the electroconductive particles (A) comprise a metal (a1) having a melting point equal to or higher than a reflow
temperature and containing no lead, and a metal (a2) having a melting point lower than the reflow temperature and containing
no lead, and

the binder component (B) comprises a thermosetting resin composition (b1) and an aliphatic dihydroxycarboxylic acid (b2),
wherein the thermosetting resin composition (b1) comprises an epoxy resin, and
the aliphatic dihydroxycarboxylic acid (b2) is an aliphatic dihydroxycarboxylic acid represented by the following general
formula (1):


wherein R1 is an alkyl group which may have a substituent, and n and m are each an integer of 0 to 5, and

wherein the content of the aliphatic dihydroxycarboxylic acid (b2) is 0.1 part or more by weight and 20 parts or less by weight
for 100 parts by weight of the metal (a2) having the melting point lower than the reflow temperature and containing no lead.

US Pat. No. 9,163,162

POLISHING AGENT, POLISHING AGENT SET AND METHOD FOR POLISHING BASE

HITACHI CHEMICAL COMPANY,...

1. A polishing agent, containing:
a liquid medium;
an abrasive grain including a hydroxide of a tetravalent metal element;
a polymer compound having an aromatic ring and a polyoxyalkylene chain; and
a cationic polymer, wherein
a weight average molecular weight of the polymer compound is 1000 or more.

US Pat. No. 9,101,061

LAMINATE BODY, LAMINATE PLATE, MULTILAYER LAMINATE PLATE, PRINTED WIRING BOARD, AND METHOD FOR MANUFACTURE OF LAMINATE PLATE

HITACHI CHEMICAL COMPANY,...

1. A laminate body containing at least one resin composition layer and at least one glass substrate layer, wherein the resin
composition layer comprises a resin composition containing a thermosetting resin and an inorganic filler, the glass substrate
layer accounts for from 10 to 95% by volume of the entire laminate body, and the at least one glass substrate layer consists
of glass material.

US Pat. No. 9,482,946

PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT USING SAME, METHOD FOR FORMING PARTITION WALL OF IMAGE DISPLAY DEVICE, AND METHOD FOR MANUFACTURING IMAGE DISPLAY DEVICE

HITACHI CHEMICAL COMPANY,...

1. A photosensitive element for forming a partition wall of an image display device, comprising:
a support film;
a photosensitive resin composition layer including
(A) a binder polymer;
(B) a photopolymerizable compound;
(C) a photopolymerization initiator;
(D) an inorganic black pigment;
(E) a surfactant; and
(F) a mercapto group-containing compound,
wherein the (B) photopolymerizable compound contains a photopolymerizable compound having at least one unsaturated group and
an isocyanuric ring structure in a molecule, formed on the support film; and

a protective film formed on the photosensitive resin composition layer,
wherein the photosensitive resin composition layer has a thickness of 10 ?m to 100 ?m, and
wherein a dye content of the photosensitive layer is less than 0.1 parts by mass.

US Pat. No. 9,648,759

MULTILAYER WIRING BOARD AND METHOD FOR MANUFACTURING SAME

HITACHI CHEMICAL COMPANY,...

1. A multilayer wiring board comprising:
a laminate formed by integrally laminating an inner layer material with an inner layer wiring pattern formed thereon, an insulating
layer, and a metal foil for an upper layer wiring pattern;

a hole for interlayer connection penetrating the metal foil for an upper layer wiring pattern and the insulating layer of
the laminate;

an overhang of the metal foil for an upper layer wiring pattern formed at an opening of the hole for interlayer connection;
lower space formed between the overhang of the metal foil and an inside wall of the hole for interlayer connection; and
interlayer connection in which the hole for interlayer connection is filled with electrolytic filling plating layers,
wherein the electrolytic filling plating layers that fill the hole for interlayer connection are formed as at least two or
more layers,

wherein the lower space between the overhang of the metal foil for an upper layer wiring pattern formed at the opening of
the hole for interlayer connection and the inside wall of the hole for interlayer connection is filled with any electrolytic
filling plating layer except for an outermost layer of the two or more layers of electrolytic filling plating layers, and

a maximum diameter in the inside of the interlayer connection formed by any electrolytic filling plating layer except for
an outermost layer is equal to or larger than a minimum diameter of the opening.

US Pat. No. 9,306,214

LITHIUM ION BATTERY

Hitachi Chemical Company,...

1. A lithium ion battery having an electrode wound group in which a positive electrode, a negative electrode, and a separator
are wound and an electrolytic solution provided in a battery container, a discharge capacity X of the battery being 30 Ah
or more and 125 Ah or less,
wherein the positive electrode has a current collector and a positive electrode composite applied to both surfaces of the
current collector,

the positive electrode composite contains a mixed active material of layered lithium nickel manganese cobalt composite oxide
(NMC) and olivine lithium iron phosphate (LFP),

a density of the positive electrode composite is 2.0 g/cm3 or more and 2.6 g/cm3 or less, and an application quantity of the positive electrode composite is 100 g/m2 or more and 200 g/m2 or less, and

the discharge capacity X and a weight ratio Y (NMC/LFP) between the layered lithium nickel manganese cobalt composite oxide
(NMC) and the olivine lithium iron phosphate (LFP) satisfy:

Y
US Pat. No. 9,394,265

METHOD FOR PRODUCING ALKYLDIOL MONOGLYCIDYL ETHER

HITACHI CHEMICAL COMPANY,...

1. A method for producing a monoglycidyl ether of an alkylene dial or alkenylene diol, comprising the steps of:
reacting a vinyl ether-containing alcohol with an epihalohydrin, to form a vinyl ether-containing glycidyl ether,
subjecting the vinyl ether-containing glycidyl ether to a devinylation reaction in the presence of an acid catalyst and water,
removing acetaldehyde produced by the devinylation reaction while maintaining a reaction pressure of 50kPa or less and a reaction
temperature of 20 to 50° C, and

further conducting an acetal decomposition reaction by adding an acid aqueous solution,
wherein the vinyl ether-containing alcohol is represented by the following formula (I):
CH2?CH—O—R—OH  Formula (I)

wherein R represents a straight chain or alicyclic alkylene group having a carbon number of 2 to 20, or a straight chain or
alicyclic alkenylene group having a carbon number of 2 to 20.

US Pat. No. 9,299,573

POLISHING METHOD

HITACHI CHEMICAL COMPANY,...

1. A polishing method comprising the steps of:
preparing a substrate which has silicon nitride as a stopper, a wiring metal and an insulating material, and has at least
a portion of the wiring metal and at least a portion of the insulating material parallel to a direction of a surface subjected
to polishing;

supplying a CMP slurry in between the surface subjected to polishing and a polishing pad, and thereby polishing the wiring
metal and the insulating material that are positioned parallel to the direction of the surface subjected to polishing; and

stopping polishing, after the silicon nitride is exposed and before the silicon nitride is completely removed,
wherein the CMP slurry contains:
(A) a copolymer of (a) a monomer that is anionic and does not contain a hydrophobic substituent, and (b) a monomer containing
a hydrophobic substituent;

(B) an abrasive grain comprising silica or modification products of the silica;
(C) an acid;
(D) an oxidizing agent; and
(E) a liquid medium,
the component (B) has a zeta potential of +10 mV or more in the CMP slurry,
the component (A) has a copolymerization ratio between (a) and (b), wherein ((a):(b)) is 25:75 to 75:25 as a molar ratio,
and

a pH is 5.0 or less.

US Pat. No. 9,190,309

TAPE FOR PROCESSING WAFER, METHOD FOR MANUFACTURING TAPE FOR PROCESSING

Hitachi Chemical Company,...

1. A method of manufacturing a semiconductor device, the method comprising:
preparing a wafer processing tape having a pasting region to be pasted to a wafer ring used when processing a semiconductor
wafer,

the wafer processing tape comprising:
a release substrate that constitutes a base of the tape;
an adhesive layer provided on one surface of the release substrate so as to correspond to a planar shape of the semiconductor
wafer;

a tacky material layer provided so as to cover the adhesive layer; and
a base material film provided so as to cover the tacky material layer, wherein
regions of the tacky material layer and the base material film which protrude outward from the adhesive layer serve as the
pasting region to the wafer ring,

a notched part defining a flap protruding toward the center of the adhesive layer, as seen in a plan view, is formed in the
pasting region to a depth that reaches the release substrate from the base material film side, and

the notched part is spaced inwardly from an outer perimeter of the pasting region in the plan view,
the flap acting to inhibit removal of the pasting region from the wafer ring when portions of the pasting region adjacent
to the flap are peeled from the wafer ring;

fixing a film laminate obtained by peeling off the release substrate from the wafer processing tape to one surface of the
semiconductor wafer via the adhesive layer;

fixing the wafer ring to the pasting region via the tacky material layer in the pasting region of the film laminate; and
dicing the semiconductor wafer while supplying cooling water to a dicing blade.
US Pat. No. 9,165,777

POLISHING AGENT AND METHOD FOR POLISHING SUBSTRATE USING THE POLISHING AGENT

HITACHI CHEMICAL COMPANY,...

1. A polishing agent comprising: water; tetravalent metal hydroxide particles; and an additive,
wherein the additive is a cationic polymer that includes at least one selected from the group consisting of polymers of groups
(1) and (2) below, and derivatives thereof:

(1) a polymer which is a polymerization product of monomers consisting of at least one amine-containing monomer selected from
the group consisting of allylamine, diallylamine and vinylamine, and

(2) a polymer which is a polymerization product of monomers consisting of at least one amine-containing monomer selected from
the group consisting of allylamine, diallylamine and vinylamine, and at least one monomer compound selected from the group
consisting of sulfur dioxide, maleic acid, fumaric acid and acrylamide.

US Pat. No. 9,073,045

CARBON NANO-TUBE MANFUACTURING METHOD AND CARBON NANO-TUBE MANUFACTURING APPARATUS

Hitachi Chemical Company,...

1. A method for producing carbon nanotubes wherein a carbon source that contains carbon and is decomposed when heated and
a catalyst that serves as a catalyst for production of carbon nanotubes from the carbon source, are used to synthesize the
carbon nanotubes on a heated support placed in a reactor, the method comprising:
a catalyst loading step in which the catalyst starting material, as the starting material for the catalyst, is distributed
over the support to load the catalyst onto the support, wherein the catalyst comprises a carrier layer and catalyst particles,
the catalyst particles being loaded on the support via the carrier layer,

a synthesis step in which the carbon source is distributed over the support to synthesize the carbon nanotubes on the support,
and

a separating step in which a separating gas stream is distributed over the support to separate the carbon nanotubes from the
support,

wherein the catalyst loading step, the synthesis step and the separating step are carried out while keeping the support in
a heated state in said reactor, and by switching supply of the catalyst starting material, the carbon source and the separating
gas stream to said reactor, and

wherein the support is made of alumina, and the carrier layer is made of an Al2O3—SiO2 complex oxide.

US Pat. No. 9,574,833

THERMAL CONDUCTIVE SHEET, METHOD OF PRODUCING THERMAL CONDUCTIVE SHEET AND HEAT RELEASING DEVICE

HITACHI CHEMICAL COMPANY,...

1. A thermal conductive sheet comprising:
a base sheet that comprises a binder component that exhibits elasticity at room temperature and a graphite powder that has
anisotropy, the graphite powder being oriented in a thickness direction; and

a metal foil that has a thickness of from 1 to 30% of a thickness of the base sheet, the metal foil being positioned on one
surface of the base sheet.

US Pat. No. 9,464,682

NON-ASBESTOS FRICTION MATERIAL COMPOSITION, AND FRICTION MATERIAL AND FRICTION MEMBER USING SAME

HITACHI CHEMICAL COMPANY,...

1. A non-asbestos frictional material composition containing a binder, an organic filler, an inorganic filler, and a fiber
base material, comprising: copper in a content of 5 mass % or less as a copper element; a metal fiber other than a copper
fiber and a copper alloy fiber in a content of 0.5 mass % or less; and both iron powder and tin powder as the inorganic filler
in a total content of 1-12 mass %.

US Pat. No. 9,554,456

LAYERED BODY WITH SUPPORT SUBSTRATE, METHOD FOR FABRICATING SAME, AND METHOD FOR FABRICATING MULTI-LAYER WIRING SUBSTRATE

HITACHI CHEMICAL COMPANY,...

1. A layered body with a support substrate, the layered body being on the support substrate and comprising:
metal foil B arranged on the support substrate;
an insulating layer B arranged on the metal foil B;
metal foil C arranged on the insulating layer B;
a non-through hole for a product and non-through holes for an alignment mark that penetrate the metal foil C and the insulating
layer B and reach the metal foil B; and

the alignment mark of a dot pattern in which the non-through holes for the alignment mark are filled by plating and gathered
and arranged in an individually independent state.

US Pat. No. 9,459,323

BATTERY-STATE MONITORING SYSTEM

Hitachi Chemical Company,...

1. A battery-state monitoring system which monitors a state of each of a plurality of storage batteries connected in series
and constituting an assembled battery incorporated in an equipment, the system comprising:
a current detecting device which detects a current in each of the storage batteries; and
a state measuring device which measures a temperature, a voltage, and internal resistance of each of the storage batteries,
the internal resistance being measured by using at least two or more kinds of frequencies including at least a first frequency
of lower than 200 Hz and a second frequency of 200 Hz or higher to lower than 2000 Hz,

wherein degradation of each of the storage batteries is estimated based on at least one or more values of the temperature,
the voltage, and the internal resistance measured by the state measuring device and a DC resistance of each of the storage
batteries obtained from a ratio between a change in a current value detected by the current detecting device and a change
in a voltage value measured by the state measuring device during discharging of each of the storage batteries;

wherein the state measuring device measures and records a temperature and a voltage regularly at a given time interval, and
when a state where a voltage drop from a normal voltage value by a given threshold or more has continued for a given time
is detected, the state measuring device protects measurement data of the voltage obtained in a given time range before and
after a point of time of the detection so as not to be lost.

US Pat. No. 9,455,359

SOLAR BATTERY CELL, SOLAR BATTERY MODULE AND METHOD OF MAKING SOLAR BATTERY MODULE

HITACHI CHEMICAL COMPANY,...

1. A solar battery cell comprising a substrate, a plurality of finger electrodes formed on a light receiving surface of the
substrate and a back surface electrode substantially covering a back surface of the substrate, the back surface electrode
to be connected to a plurality of finger electrodes on an adjacent cell by applying a first TAB wire via a conductive adhesive
directly in contact with the back surface electrode,
wherein a portion of the back surface of the substrate is exposed at a position corresponding to a position on the light receiving
surface where a second TAB wire is to be applied, and the exposed portion constitutes an alignment marking of the back surface
indicative of a position where the first TAB wire is to be applied.

US Pat. No. 9,346,978

SLURRY, POLISHING-SOLUTION SET, POLISHING SOLUTION, SUBSTRATE POLISHING METHOD, AND SUBSTRATE

HITACHI CHEMICAL COMPANY,...

1. A slurry comprising:
an abrasive grain; and
water, wherein
the abrasive grain includes a hydroxide of a tetravalent metal element, produces absorbance of 1.00 or more for light having
a wavelength of 400 nm in an aqueous dispersion having a content of the abrasive grain adjusted to 1.0 mass %, and produces
light transmittance of 50%/cm or more for light having a wavelength of 500 nm in an aqueous dispersion having a content of
the abrasive grain adjusted to 1.0 mass %, and

a difference between a NO3? concentration of an aqueous dispersion having a content of the abrasive grain adjusted to 1.0 mass % and a NO3? concentration after retaining the aqueous dispersion at 60° C. for 72 hours is 200 ppm or less.

US Pat. No. 9,346,977

ABRASIVE, ABRASIVE SET, AND METHOD FOR ABRADING SUBSTRATE

HITACHI CHEMICAL COMPANY,...

1. A polishing agent comprising:
water,
an abrasive grain containing a hydroxide of a tetravalent metal element, and
a glycerin compound,
the glycerin compound being at least one compound represented by general formula (II) below:
wherein, in formula (II), n represents an integer of 2 or greater, and R1, R2 and multiple R3 each independently represent hydrogen atom, a group represented by general formula (III) below or a group represented by general
formula (IV) below;and wherein the case where R1, R2 and multiple R3 are all hydrogen atom is excluded;
wherein, in formula (III), p represents an integer of 1 or greater
and wherein, in formula (IV), q represents an integer of 1 or greater.

US Pat. No. 9,318,346

CMP POLISHING LIQUID AND POLISHING METHOD

HITACHI CHEMICAL COMPANY,...

2. A polishing method comprising:
a mixing step of mixing a CMP polishing liquid concentrate with a diluting liquid, an additive liquid, or both of the diluting
liquid and the additive liquid to prepare a CMP polishing liquid at a 3-fold dilution or a higher; and

a polishing step of removing at least a part of a barrier conductive film and a part of an interlayer dielectric by supplying
the CMP polishing liquid, wherein the CMP polishing liquid comprises a medium and silica particles as an abrasive grain dispersed
into the medium, wherein:

(A2) the silica particles have a silanol group density of less than 5.0/nm2 and are not subjected to any surface treatment;

(B2) a biaxial average primary particle diameter when arbitrary 20 silica particles are selected from an image obtained by
scanning electron microscope observation is 60 nm or less; and

(C2) an association degree of the silica particles is 1.20 or less or from 1.40 to 1.80.

US Pat. No. 10,076,044

METHOD FOR MANUFACTURING MULTILAYER WIRING SUBSTRATE

HITACHI CHEMICAL COMPANY,...

1. A method for manufacturing a multilayer wiring board, comprising:(1) a step of integrally laminating an inner layer material with an inner layer wiring pattern formed thereon, an insulating layer, and a metal foil for an upper layer wiring pattern, and providing the metal foil for an upper layer wiring pattern and the insulating layer with a hole for a via hole from the metal foil for an upper layer wiring pattern to the inner layer wiring pattern, an overhang of the metal foil for an upper layer wiring pattern formed at an opening of the hole for a via hole, and lower space formed between the overhang of the metal foil and an inside wall of the hole for a via hole by using a conformal method or a direct laser method;
(2) a step of forming a base electroless plating layer within the hole for a via hole and on the metal foil for an upper layer wiring pattern, and then forming a via hole that connects the metal foil for an upper layer wiring pattern and the inner layer wiring pattern, by forming electrolytic filling plating layers; and
(3) a step of wiring the metal foil for an upper layer wiring pattern after the formation of the electrolytic filling plating layers to form the upper layer wiring pattern,
wherein the formation of the electrolytic filling plating layers in the step (2) is carried out by repeating change in electric current density of temporarily decreasing the electric current density of electrolytic filling plating in the middle of the electrolytic filling plating, and then increasing it again, two or more times before the electrolytic filling plating layers block the opening of the hole for a via hole.

US Pat. No. 9,323,108

LIQUID CURABLE RESIN COMPOSITION, METHOD FOR MANUFACTURING IMAGE DISPLAY DEVICE USING SAME, AND IMAGE DISPLAY DEVICE

HITACHI CHEMICAL COMPANY,...

1. A liquid curable resin comprising
(A) a polymer component containing (A1) a polymer having an ethylenically unsaturated bond in a molecule thereof:
(B) a low-molecular weight monomer having one ethylenically unsaturated group in a molecule thereof; and
(C) a polymerization initiator, wherein
the component (B) contains a compound represented by the follwing general formula (I):
wherein R1 represents a hydrogen atom or a methyl group: R2 represents an alkyl group having 4 or more carbon atoms: and n represents a number of from 15 to 20, and the content of the
component (A) is from 60 to 95% by mass, the of the component (B) is from 5 to 40% by mass, and the content of the component
(C) is from 0.01 to 5% by mass, relative to the total amount of the whole components in the liquid curable composition, and
wherein the component (A1) is a urethane polymer having a (meth)acryloyl group.

US Pat. No. 9,457,406

COPPER METAL FILM, METHOD FOR PRODUCING SAME, COPPER METAL PATTERN, CONDUCTIVE WIRING LINE USING THE COPPER METAL PATTERN, COPPER METAL BUMP, HEAT CONDUCTION PATH, BONDING MATERIAL, AND LIQUID COMPOSITION

HITACHI CHEMICAL COMPANY,...

1. A method for producing a copper metal film, comprising: producing gaseous formic acid by converting liquid formic acid
to gaseous formic acid, and treating a copper-based particle deposition layer containing both copper oxide and a metallic
transition metal or alloy, or a transition metal complex containing a metal element, with the gaseous formic acid converted
from liquid formic acid, the gaseous formic acid being heated to 120° C. or higher, wherein a ratio of copper oxide to the
metallic transition metal or alloy or the transition metal complex containing a metal element in the copper-based particle
deposition layer is 9:1 to 100,000:1.

US Pat. No. 9,442,251

OPTICAL WAVEGUIDE WITH MIRROR, OPTICAL FIBER CONNECTOR, AND MANUFACTURING METHOD THEREOF

HITACHI CHEMICAL COMPANY,...

1. An optical waveguide with mirror, comprising:
a lower clad layer;
a core pattern formed above the lower clad layer;
a mirror formed on an inclined surface of the core pattern;
an upper clad layer covering a part other than the mirror on the core pattern; and
an opening with an approximate pillar shape, the opening being formed in the upper clad layer,
wherein the mirror is formed in the opening,
wherein inner walls of the opening are not provided on the same plane as the inclined surface, and
wherein a part of a side surface of the core pattern adjacent the mirror is exposed in the opening.

US Pat. No. 9,603,244

THERMOSETTING RESIN COMPOSITION AND PREPREG AND LAMINATE OBTAINED WITH THE SAME

HITACHI CHEMICAL COMPANY,...

1. A thermosetting resin composition comprising:
(A) a curing agent having an acidic substituent and an unsaturated maleimide group which is produced by reacting (a-1) a maleimide
compound having at least two N-substituted maleimide groups in a molecule with (a-2) an amine compound having an acidic substituent
represented by the following Formula (1) in an organic solvent, a use amount of the organic solvent being 10 to 1000 parts
by mass per 100 parts by mass of the sum of the maleimide compound (a-1) and the amine compound (a-2),

(B) a 6-substituted guanamine compound represented by the following Formula (2) and/or dicyandiamide,
(C) a copolymer resin comprising (c-1) a monomer unit represented by the following Formula (3) and (c-2) a monomer unit represented
by the following Formula (4), and

(D) an epoxy resin having at least two epoxy groups in a molecule:

wherein R1 each represents independently an acidic substituent selected from a hydroxyl group, a carboxy group and a sulfonic acid group;
R2 each represents independently a hydrogen atom, an aliphatic hydrocarbon group having 1 to 5 carbon atoms or a halogen atom;
x is an integer of 1 to 5, and y is an integer of 0 to 4; and a sum of x and y is 5;


wherein R3 represents phenyl, methyl, allyl, butyl, methoxy or benzyloxy;


wherein R4 and R5 each represent independently a hydrogen atom, a halogen atom, a hydrocarbon group having 1 to 5 carbon atoms, a phenyl group
or a substituted phenyl group;


wherein the curing agent (A) comprises a compound represented by the following Formula (5) or the following Formula (6):

wherein R1, R2, x and y represent the same ones as in Formula (1); R6 each represents independently a hydrogen atom, an aliphatic hydrocarbon group having 1 to 5 carbon atoms or a halogen atom;


wherein R1, R2, x and y represent the same ones as in Formula (1); R7 and R8 each represents independently a hydrogen atom, an aliphatic hydrocarbon group having 1 to 5 carbon atoms or a halogen atom;
and A is an alkylene group, an alkylidene group, an ether group, a sulfonyl group or a group represented by the following
Formula (7):


and the organic solvent.

US Pat. No. 9,406,834

MATERIAL FOR FORMING PASSIVATION FILM FOR SEMICONDUCTOR SUBSTRATE, PASSIVATION FILM FOR SEMICONDUCTOR SUBSTRATE AND METHOD OF PRODUCING THE SAME, AND PHOTOVOLTAIC CELL ELEMENT AND METHOD OF PRODUCING THE SAME

Hitachi Chemical Company,...

1. A method for passivating a semiconductor substrate, comprising: forming a passivation film on the semiconductor substrate,
the passivation film being formed from a material comprising a polymer compound having an anionic group or a cationic group,
wherein the anionic group is selected from the group consisting of a sulfonic acid group, a phosphoric acid group, and a phosphonic
acid group.

US Pat. No. 9,235,121

PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE FILM, PERMANENT RESIST AND METHOD FOR PRODUCING PERMANENT RESIST

HITACHI CHEMICAL COMPANY,...

10. A method for producing a permanent resist comprising:
a step of forming a photosensitive layer comprising the photosensitive resin composition according to claim 1 on a substrate;
a step of irradiating the photosensitive layer with an active ray in a pattern; and
a step of developing the photosensitive layer to form a permanent resist.

US Pat. No. 9,076,832

WAFER PROCESSING TAPE, METHOD OF MANUFACTURING WAFER PROCESSING TAPE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

Hitachi Chemical Company,...

1. A wafer processing tape having a pasting region to be pasted to a wafer ring used when processing a semiconductor wafer,
the wafer processing tape comprising:
a release base material constituting a base of the tape;
an adhesive layer provided on one surface of the release base material so as to correspond to a planar shape of the semiconductor
wafer;

a tacky material layer provided so as to cover the adhesive layer; and
a base material film provided so as to cover the tacky material layer,
wherein:
in a plan view, regions of the tacky material layer and the base material film protruding outward from the adhesive layer
serve as the pasting region to the wafer ring,

in the plan view, at least one notched part is formed entirely outside the adhesive layer, in the base material film and the
tacky material layer in the pasting region, to a depth reaching the release base material from the side of the base material
film, the notched part being spaced inwardly from an outer perimeter of the pasting region, and

in the plan view, a part of the tacky material layer and the base material film in the pasting region is partitioned by the
notched part into:

(a) a first portion nearer than the notched part to the center of the adhesive layer, and
(b) a second portion more distant than the notched part from the center of the adhesive layer but continuous with the first
portion around the notched part, and having a flap bounded by the notched part so as to be embraced by the notched part and
to protrude toward the center of the adhesive layer.

US Pat. No. 9,568,061

BRAKE PAD FOR YAW CONTROL, AND BRAKE MEMBER

HITACHI CHEMICAL COMPANY,...

1. A brake pad for yaw control comprising:
twenty to sixty sheet-shaped fluororesin fiber assemblies, each sheet-shaped fluororesin fiber assembly having a matrix resin
infiltrated into a fluororesin fiber assembly, the sheet-shaped fluororesin fiber assemblies being laminated.

US Pat. No. 9,397,381

ELECTROMAGNETIC COUPLING STRUCTURE, MULTILAYERED TRANSMISSION LINE PLATE, METHOD FOR PRODUCING ELECTROMAGNETIC COUPLING STRUCTURE, AND METHOD FOR PRODUCING MULTILAYERED TRANSMISSION LINE PLATE

HITACHI CHEMICAL COMPANY,...

1. An electromagnetic coupling structure used in a frequency band of a microwave zone, the electromagnetic coupling structure
comprising:
a laminated body that is laminated with an inner dielectric layer interposed between inner conductive layers that are a plurality
of ground layers;

one pair of outer dielectric layers that face each other with the laminated body interposed between the outer dielectric layers;
and

one pair of outer conductive layers that face each other with the one pair of outer dielectric layers interposed between the
outer conductive layers,

wherein each one of the one pair of outer conductive layers includes a wiring portion and a conductive patch portion disposed
at a front end of the wiring portion,

the conductive patch portion has a portion longer than a width of the wiring portion in a direction perpendicular to an extending
direction of the wiring portion,

a hole passing through the inner dielectric layer and the inner conductive layers that are the plurality of ground layers
is formed in the laminated body, and

a tube-shaped metal film formed on an inner wall of the hole electrically connecting the inner conductive layers that are
a plurality of ground layers, whereby the one pair of outer conductive layers are electromagnetically coupled.

US Pat. No. 9,556,061

LEAD-FREE LOW-MELTING GLASS COMPOSITION, LOW-TEMPERATURE SEALING GLASS FRIT, LOW-TEMPERATURE SEALING GLASS PASTE, CONDUCTIVE MATERIAL, AND CONDUCTIVE GLASS PASTE CONTAINING GLASS COMPOSITION, AND GLASS-SEALED COMPONENT AND ELECTRIC

HITACHI CHEMICAL COMPANY,...

1. A lead-free low-melting glass composition comprising:
a principal component; and
an additional component,
the principal component comprising vanadium oxide, tellurium oxide and silver oxide, and
the additional component comprising at least one substance selected from the group consisting of yttrium oxide and lanthanoid
oxides,

wherein the additional component comprises 0.1 to 3.0 mole percent oxide.

US Pat. No. 9,327,418

ADHESIVE FILM

HITACHI CHEMICAL COMPANY,...

1. An adhesive film comprising:
an adhesive layer; and
a first base material and a second base material sandwiching the adhesive layer;
wherein outer edges of the first base material and the second base material extend outward beyond the outer edge of the adhesive
layer,

a notch is formed on the adhesive layer side of the first base material, along the outer edge of the adhesive layer,
the first base material has a thickness greater than the second base material,
an average notch depth is between 5 ?m and 45 ?m,
a standard deviation for the notch depth is no greater than 15 ?m, and wherein a peel strength between the first base material
and the adhesive layer is higher than a peel strength between the second base material and the adhesive layer.

US Pat. No. 9,348,223

METHOD FOR FORMING RESIN CURED FILM PATTERN, PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, METHOD FOR PRODUCING TOUCH PANEL, AND RESIN CURED FILM

HITACHI CHEMICAL COMPANY,...

1. A method for forming a resin cured film pattern comprising
a first step in which on a base material configured for use in a touch panel there is formed a transparent photosensitive
layer composed of a transparent photosensitive resin composition comprising a binder polymer with a carboxyl group having
an acid value of 75 mgKOH/g or greater, a photopolymerizable compound and a photopolymerization initiator,

a second step in which prescribed sections of the transparent photosensitive layer are cured by irradiation with active light
rays, and

a third step in which the sections of the transparent photosensitive layer other than the prescribed sections are removed
to form a transparent cured film pattern of the prescribed sections of the transparent photosensitive layer,
wherein the transparent photosensitive resin composition comprises an oxime ester compound and/or a phosphine oxide compound
as the photopolymerization initiator, and wherein the transparent photosensitive layer has a minimum visible light transmittance
of 85% or greater at 400 to 700 nm.
US Pat. No. 9,550,940

ETCHING MATERIAL

Hitachi Chemical Company,...

1. An etching material comprising:
(i) at least one boron compound selected from a group consisting of a Lewis acid that comprises, in a structure of the Lewis
acid, boron and a halogen that is bonded to the boron, a salt of the Lewis acid, and a compound that generates the Lewis acid;
and

(ii) a compound that is a non-volatile liquid at 250° C. and dissolves the boron compound,
wherein the boron compound has a melting point of 250° C. or lower and is non-volatile, and
wherein the boron compound is one or more selected from the group consisting of triphenylcarbenium tetrafluoroborate, tetrafluoroborate
tropylium, tetrafluoroborate-di-n-butylammonium, tetrafluoroborate trimethyloxonium, tetrafluoroborate triethyloxonium, 1-ethyl-2,3-dimethylimidazolium
tetrafluoroborate, 1-butyl-1-methylpyrrolidinium tetrafluoroborate, potassium methyltrifluoroborate, potassium 4-iodophenyltrifluoroborate,
potassium (4-methyl-1-piperadinyl)methyltrifluoroborate, tricyclopentylphosphine tetrafluoroborate, boron trifluoride monoethylamine
complex, potassium pyridine-3-trifluoroborate, nitronium tetrafluoroborate, boron triiodide, tris(pentafluorophenyl)boran,
and lithium tetrakis(pentafluorophenyl)borate ethyl ether complex.

US Pat. No. 9,496,509

ORGANIC ELECTRONIC MATERIAL, INK COMPOSITION, AND ORGANIC ELECTRONIC ELEMENT

HITACHI CHEMICAL COMPANY,...

1. An organic electronic material comprising at least an ionic compound represented by the following general formula (1),
and a charge transporting compound including a charge transporting unit:
in the general formula (1), Ar represents an aryl group or a heteroaryl group, Ra to Rb each independently represent a hydrogen atom (H), an alkyl group, a benzyl group, an aryl group, or a heteroaryl group, Ar,
Ra and Rb may be linked to each other to form a ring, at least one of Ra to Rb is any of a hydrogen atom (H), an alkyl group, and a benzyl group, and A represents an anion, wherein the anion is represented
by the following formulas (1b) to (5b):
in the general formulas (1b) to (5b), Y1 to Y6 each independently represent a divalent linking group; R1 to R16 each independently represent an electron attractive organic substituent, R1 to R16 may further have substituents and hetero atoms therein, and R2 and R3, R4 to R6, R7 to R10, or R11 to R16 may be each linked to form a ring or a polymer; and E1, E2, E3, E4, and E5 respectively represent an oxygen atom, a nitrogen atom, a carbon atom, a boron atom or a gallium atom, and a phosphorus atom
or an antimony atom.
US Pat. No. 9,403,977

PHOTOSENSITIVE RESIN COMPOSITION AND PHOTOSENSITIVE FILM USING SAME

HITACHI CHEMICAL COMPANY,...

1. A positive-type photosensitive resin composition, comprising:
(A) a modified novolac-type phenol resin having an unsaturated hydrocarbon group;
(B) a novolac-type phenol resin obtained from metacresol and paracresol;
(C) a novolac-type phenol resin obtained from orthocresol;
(D) a compound generating an acid by light; and
(E) a polybasic acid or a polybasic acid anhydride,
wherein a content of the polybasic acid or a polybasic acid anhydride is lower than 40 parts by mass per 100 parts by mass
of a total amount of the modified novolac-type phenol resin having an unsaturated hydrocarbon group, the novolac-type phenol
resin obtained from metacresol and paracresol, the novolac-type phenol resin obtained from orthocresol and the compound generating
an acid by light.

US Pat. No. 9,525,114

OPTICAL SEMICONDUCTOR DEVICE

HITACHI CHEMICAL COMPANY,...

1. An optical semiconductor device comprising:
a substrate that has a silver plating layer formed on a surface;
a light emitting diode that is bonded to the silver plating layer;
a light reflecting portion that surrounds the light emitting diode;
a transparent sealing portion that is filled into the light reflecting portion and seals the light emitting diode; and
a clay film that coats the silver plating layer, wherein a thickness of the clay film is 0.05 ?m to 1 ?m, and
wherein the transparent sealing portion and the light reflecting portion are bonded to each other.

US Pat. No. 9,349,931

RESIN COMPOSITION, RESIN SHEET, CURED RESIN SHEET, RESIN SHEET LAMINATE, CURED RESIN SHEET LAMINATE AND METHOD FOR PRODUCING SAME, SEMICONDUCTOR DEVICE AND LED DEVICE

Hitachi Chemical Company,...

1. A resin composition comprising
an epoxy resin monomer,
a novolac resin containing a compound having a structural unit represented by general Formula (I), and
a filler, in which a particle size distribution of the filler, measured using laser diffractometry, has peaks in the respective
ranges of from 0.01 ?m to less than 1 ?m, from 1 ?m to less than 10 ?m, and from 10 ?m to 100 ?m, and the filler having particle
sizes of from 10 ?m to 100 ?m contains boron nitride particles;


wherein in the general Formula (I), R1 represents an alkyl group, an aryl group, or an aralkyl group; each of R2 and R3 independently represents a hydrogen atom, an alkyl group, aryl group, or an aralkyl group; m represents a number from 0 to
2; and n represents a number from 1 to 7.

US Pat. No. 9,673,362

OPTICAL SEMICONDUCTOR ELEMENT MOUNTING PACKAGE, AND OPTICAL SEMICONDUCTOR DEVICE USING THE SAME

HITACHI CHEMICAL COMPANY,...

1. An optical semiconductor element mounting package having a recessed part that serves as an optical semiconductor element
mounting region, wherein the package is formed by integrating:
a resin molding composed of a thermosetting light-reflecting resin composition, which forms at least the side faces of the
recessed part; and

at least a pair of positive and negative lead electrodes, each of the positive and negative lead electrodes having opposed
first and second major surfaces extending continuously from an inner end to an opposite end, the pair of positive and negative
lead electrodes being disposed with their inner ends opposite each other so that inner portions of the first major surface
of the positive and negative lead electrodes form part of the bottom face of the recessed part, wherein there is no gap at
a joint face between the resin molding and the lead electrodes, the inner ends of the positive and negative lead electrodes
are separated by the thermosetting light-reflecting resin composition and at least portions of the second major surface of
the positive and negative lead electrodes are not in contact with the thermosetting light-reflecting resin composition.

US Pat. No. 9,553,335

LEAD-ACID BATTERY

HITACHI CHEMICAL COMPANY,...

1. A lead-acid battery having a configuration in which a group of plates formed by stacking negative plates where a negative
active material is filled in a negative collector and positive plates where a positive active material is filled in a positive
collector by way of a separator is contained together with an electrolyte in a container, wherein
the negative active material contains a flake graphite and a condensate of bisphenols and aminobenzene sulfonic acid in the
negative active material, and

the average primary particle diameter of the flake graphite is 100 ?m or more and 220 ?m or less.

US Pat. No. 9,782,749

ALUMINUM SILICATE, METAL ION ADSORBENT, AND METHOD FOR PRODUCING SAME

HITACHI CHEMICAL COMPANY,...

1. An aluminum silicate, having:
an element ratio of Si and Al, represented by Si/Al, of from 0.3 to 1.0 by molar ratio;
a peak at approximately 3 pmm in a 27Al-NMR spectrum;

a peak at approximately ?78 ppm and a peak at approximately ?85 ppm in a 29Si-NMR spectrum;

peaks at approximately 2?=26.9°, 18.8°, 20.3°, 27.8°, 40.3°, 40.6° and 53.3° in a powder X-ray diffraction spectrum in which
a CuK? ray is used as an X-ray source; and

an area ratio of peak A and peak B, represented by peak B/peak A, of from 2.0 to 9.0, wherein peak A is at approximately ?78
ppm and peak B is at approximately ?85 ppm, in a 29Si-NMR spectrum.

US Pat. No. 9,754,710

POWDER MAGNETIC CORE, METHOD OF MANUFACTURING POWDER COMPACT FOR MAGNETIC CORE, DIE AND DIE ASSEMBLY FOR MANUFACTURING POWDER MAGNETIC CORE, AND DIE LUBRICATING COMPOSITION FOR MANUFACTURING POWDER MAGNETIC CORE

Hitachi Chemical Company,...

1. A powder magnetic core, being configured of a powder compact that a soft magnetic powder is compacted at a density ratio
of 91% or more than 91%, the powder compact comprising, on an extrusion-sliding surface:
a surface layer portion having a structure where molybdenum disulfide particles and insulating ceramic particles are interposed
between particles of the soft magnetic powder,

wherein the insulating ceramic particles are composed of at least one ceramic selected from the group consisting of oxide
ceramics, nitride ceramics, carbide ceramics, carbonitride ceramics and oxynitride ceramics, wherein the nitride ceramics
are at least one selected from the group consisting of aluminum nitride, titanium nitride and silicon nitride.

US Pat. No. 9,625,814

PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE FILM, RIB PATTERN FORMATION METHOD, HOLLOW STRUCTURE AND FORMATION METHOD FOR SAME, AND ELECTRONIC COMPONENT

Hitachi Chemical Company,...

1. A photosensitive resin composition containing (A) a photopolymerizable compound having at least one ethylenically unsaturated
group, (B) a photopolymerization initiator, and (C) an inorganic filler,
wherein the photopolymerizable compound (A) having at least one ethylenically unsaturated group comprises an acrylate compound
or a methacrylate compound containing a urethane bond, and

the inorganic filler (C) comprises at least one filler selected from the group consisting of silica, alumina, titanium oxide,
zirconia, talc, mica, boron nitride, kaolin and barium sulfate, having an average aspect ratio of 30 to 100 and a volume average
particle diameter of 5 to 50 ?m, and having a tabular form.

US Pat. No. 9,620,865

ANTENNA BEAM SCAN MODULE, AND COMMUNICATION APPARATUS USING THE SAME

Hitachi Chemical Company,...

1. An antenna beam scan module comprising:
a Rotman lens that has a plurality of beam ports and a plurality of antenna ports and distributes and combines electric power
of signals input and output to the antenna ports;

a plurality of antenna elements that input and output radio waves to the antenna ports;
a plurality of variable amplifiers that modulate magnitudes of the signals input to the beam ports;
a plurality of relative phase detectors that detect a plurality of relative phase differences between the signals input to
the adjacent beam ports;

a plurality of phase shifters that offset the relative phase differences between the signals supplied to the adjacent beam
ports on the basis of the relative phase differences detected by the relative phase detectors; and

a plurality of switches that select routes of the signals supplied to the beam ports through the variable amplifiers,
wherein the phase shifters are arranged on alternate routes through which the signals are supplied to the plurality of beam
ports.

US Pat. No. 9,553,269

MATERIAL FOR ORGANIC ELECTRONICS, ORGANIC ELECTRONIC ELEMENT, ORGANIC ELECTROLUMINESCENT ELEMENT, DISPLAY ELEMENT USING ORGANIC ELECTROLUMINESCENT ELEMENT, ILLUMINATING DEVICE, AND DISPLAY DEVICE

HITACHI CHEMICAL COMPANY,...

1. A material for organic electronics, comprising at least a first compound, the first compound being an ionic compound, and
a second compound having a charge transporting unit (hereinafter, referred to as charge transporting compound),
wherein the ionic compound is composed of a counter cation and a counter anion, and the counter cation is any one kind or
two or more kinds selected from H+, a carbocation, a nitrogen cation, an oxygen cation, and a cation having a transition metal.

US Pat. No. 9,385,378

METHOD FOR MANUFACTURING LEAD-ACID BATTERY

Hitachi Chemical Company,...

1. A method for manufacturing a lead-acid battery, the method comprising:
manufacturing at least one negative plate comprising a current collector;
manufacturing at least one positive plate comprising a current collector, the manufacture of the at least one positive plate
comprising:

preparing a cutting machine including a first cutting die disposed on a cutting base and having one or more elongated concave
portions, and a second cutting die having one or more elongated convex portions corresponding to the one or more elongated
concave portions;

placing on the first cutting die a lead alloy sheet including a portion where the current collecting portion is to be, or
has been, formed and a portion where one or more current collecting lug parts are to be formed such that a direction in which
the portion where the one or more current collecting lug parts are to be formed extends away from the portion where the current
collecting portion is to be, or has been, formed coincides with a direction in which the one or more concave portions extend;
and

moving the second cutting die toward the first cutting die to form the one or more current collecting lug parts by cutting
the lead alloy sheet, and at the same time pressing the one or more convex portions into the one or more concave portions
to form one or more elongated depressions and one or more elongated protrusions on and in each of the one or more current
collecting lug parts;

providing a plate group comprising the at least one negative plate and the at least one positive plate;
forming a strap coupled to the at least one positive plate by a cast-on strap casting method comprising immersing a portion
of the one or more elongated protrusions of the one or more lug parts of the at least one positive plate into molten lead
before the molten lead solidifies.

US Pat. No. 9,859,044

POWDER MAGNETIC CORE AND REACTOR USING THE SAME

HITACHI CHEMICAL COMPANY,...

1. A powder magnetic core comprising:
soft magnetic powder particles, and
layered gaps between the soft magnetic powder particles,
wherein the layered gaps were formed by pores generated in compacting the soft magnetic powder particles, and
the powder magnetic core has a density ratio of 90 to 95%, and when observing a cross section thereof, the layered gaps having
thicknesses of 1 to 3 ?m and widths of 20 to 200 ?m.

US Pat. No. 9,650,528

LIQUID COMPOSITION, AND RESISTOR FILM, RESISTOR ELEMENT AND CIRCUIT BOARD

HITACHI CHEMICAL COMPANY,...

1. A liquid composition comprising
(a1) a diol with a molecular weight of 40 or greater and less than 1000 and/or a resin containing the diol as a backbone,
the (a1) diol with a molecular weight of 40 or greater and less than 1000 and/or a resin containing the diol as a backbone
including (a2) an epoxy resin with a molecular weight of between 200 and 50,000, comprising a diol with a molecular weight
of 40 or greater and less than 1000 in the backbone,

(b) carbon black particles, and
(c) carbon nanotubes, wherein the outer diameter of the (c) carbon nanotubes is 3 nm or greater and the length is equal to
or greater than 100 nm and less than or equal to 15 ?m.

US Pat. No. 9,583,714

MATERIAL FOR ORGANIC ELECTRONICS, ORGANIC ELECTRONIC ELEMENT, ORGANIC ELECTROLUMINESCENT ELEMENT, DISPLAY ELEMENT USING ORGANIC ELECTROLUMINESCENT ELEMENT, ILLUMINATING DEVICE, AND DISPLAY DEVICE

HITACHI CHEMICAL COMPANY,...

1. A material for organic electronics, comprising at least a first compound, the first compound being an ionic compound, and
a second compound having a charge transporting unit (hereinafter, referred to as charge transporting compound),
wherein the ionic compound is composed of a counter cation and a counter anion, and the counter cation is any one kind or
two or more kinds selected from H+, a carbocation, a nitrogen cation, an oxygen cation, and a cation having a transition metal.

US Pat. No. 9,537,101

COMPOSITION CAPABLE OF CHANGING ITS SOLUBILITY, HOLE TRANSPORT MATERIAL COMPOSITION, AND ORGANIC ELECTRONIC ELEMENT USING THE SAME

HITACHI CHEMICAL COMPANY,...

1. A composition comprising a polymer or oligomer (A) having a unit with hole transport properties and also having a thienyl
group which may have a substituent, and an initiator (B), wherein solubility of the composition is capable of being changed
by applying heat, light, or both heat and light, and wherein the polymer or oligomer (A) has at least one type of structure
selected from the group consisting of a structure represented by formula (Ia) shown below, and a structure represented by
formula (Ib) shown below:

wherein, in formulas (Ia) and (Ib), each of R1 to R3 independently represents a hydrogen atom or an alkyl group, provided that at least one of R1 to R3 represents a hydrogen atom.

US Pat. No. 9,513,434

OPTICAL WAVEGUIDE AND MANUFACTURING METHOD THEREOF

HITACHI CHEMICAL COMPANY,...

1. A method of producing an optical waveguide comprising: a lower clad layer, a core layer, an upper clad layer, a substrate,
and a mirror, the lower clad layer, the core layer, and the upper clad layer being sequentially laminated to the substrate,
the mirror being formed on the core layer, wherein the substrate has an opening, the maximum diameter of the opening is larger
than that of luminous flux reflected by the mirror, and the maximum diameter of the opening is 240 ?m or less, and a pillar-shaped
transparent member projecting from the opening beyond the back surface direction of the substrate, the method comprising:
a step (A) of laminating a transparent resin layer A formed of a transparent resin a to one surface of a substrate having
an opening and filling at least a part of the opening on the substrate with a transparent resin a while laminating a transparent
resin layer B formed of a transparent resin b to the back surface of the substrate; a step (B) of exposing the opening from
the transparent resin layer A formed surface side to light-cure the transparent resin b on and in the opening; and a step
(C) of developing and removing the transparent resin layer B as the uncured part after the step (B) to form a pillar-shaped
transparent member.
US Pat. No. 9,661,763

STRUCTURE CONTAINING CONDUCTOR CIRCUIT, METHOD FOR MANUFACTURING SAME, AND HEAT-CURABLE RESIN COMPOSITION

HITACHI CHEMICAL COMPANY,...

1. A method for manufacturing a structure containing a conductor circuit on a surface of a support and a heat-curable resin
layer as an insulating layer having at least one opening through which the conductor circuit is exposed so that a wiring portion
may be formed in the opening connected to the conductor circuit, the method comprising:
a first photosensitive resin layer formation process for forming a first photosensitive resin layer to cover the conductor
circuit on the support;

a first patterning process for patterning the first photosensitive resin layer by performing an exposure process and a developing
process on the first photosensitive resin layer;

a heat-curable resin layer formation process for forming a heat-curable resin layer on the support to cover the pattern of
the first photosensitive resin layer;

a heat-curing process for heat-curing the heat-curable resin layer as a process immediately after the heat-curable resin layer
formation process,

a material removal process for removing a portion of the heat-curable resin layer to expose a predetermined place of the pattern
of the first photosensitive resin layer from the heat-curable resin layer, wherein the material removal process comprises
performing removal of a portion of the heat-curable resin layer after the heat curing by performing plasma processing; and

an opening formation process for removing the first photosensitive resin layer exposed from the heat-curable resin layer by
a desmearing process to form an opening through the heat-curable resin layer exposing the conductor circuit.

US Pat. No. 9,608,184

OPTICAL SEMICONDUCTOR ELEMENT MOUNTING PACKAGE, AND OPTICAL SEMICONDUCTOR DEVICE USING THE SAME

HITACHI CHEMICAL COMPANY,...

1. An optical semiconductor element mounting package having a recessed part that serves as an optical semiconductor element
mounting region, wherein the package is formed by integrating:
a resin molding composed of a thermosetting light-reflecting resin composition, which forms at least the side faces of the
recessed part; and

at least a pair of positive and negative lead electrodes, each of the positive and negative lead electrodes having opposed
first and second major surfaces extending continuously from an inner end to an opposite end, the pair of positive and negative
lead electrodes being disposed with their inner ends opposite each other so that main faces of inner portions of the first
major surface of the positive and negative lead electrodes form part of the bottom face of the recessed part, the inner ends
of the positive and negative lead electrodes being separated by the thermosetting light-reflecting resin composition, and
at least portions of the second major surface of the positive and negative lead electrodes not being in contact with the thermosetting
light-reflecting resin composition;

wherein there is no gap at a joint face between the resin molding and the lead electrodes,
wherein the thermosetting light-reflecting resin composition includes components: (A) an epoxy resin; (B) a curing agent;
(C) a curing accelerator; (D) an inorganic filler; (E) a white pigment; and (F) a coupling agent, and is a resin composition
whose optical reflectivity at a wavelength of 350 to 800 nm is at least 80% and which can be press molded at normal temperature
(0 to 35° C.), and

wherein the white pigment (E) is inorganic hollow particles.
US Pat. No. 9,464,683

NON-ASBESTOS FRICTION-MATERIAL COMPOSITION, AND FRICTION MATERIAL AND FRICTION MEMBER USING SAME

Hitachi Chemical Company,...

1. A non-asbestos frictional material composition containing:
a binder comprising an acrylic elastomer-dispersed phenol resin in an amount of 7-15 mass %;
an organic filler;
an inorganic filler comprising at least one of CaO and Ca(OH)2 in an amount of 1-5 mass %; and

a fiber base material comprising copper in an amount of 0.5 mass % or less as a copper element and a metal other than copper
and copper alloy in an amount of 0.5 mass % or less.

US Pat. No. 9,728,787

CURRENT COLLECTING STRUCTURE FOR SECONDARY BATTERY AND SECONDARY BATTERY

HITACHI CHEMICAL COMPANY,...

1. A current collecting structure for a secondary battery including an electrode group including a plurality of electrodes
each having a tab and stacked via a separator, the current collecting structure comprising:
a plurality of current collecting plates to which the tabs of the electrodes of the same polarity are welded; and
a terminal including a terminal body portion to which the current collecting plates are attached, and a terminal portion,
the plurality of current collecting plates each including a fixed portion and a welded portion onto which the tabs are welded
in an overlapping manner, wherein the fixed portions of the current collecting plates are stacked to form a current collecting
plate stacking portion to be fixed to the terminal body portion,

the plurality of current collecting plates being each bent so as to form a bent portion having a predetermined angle between
the fixed portion and the welded portion, wherein:

the plurality of current collecting plates are divided into a first divided group located closer to the terminal body portion
and a second divided group located farther from the terminal body portion;

the welded portion of each current collecting plate belonging to the first divided group is bent toward the terminal body
portion between the fixed portion and the welded portion, and predetermined angle for the bent portions of the current collecting
plates belonging to the first divided group is determined such that the predetermined angle of the bent portion of one of
two adjacent current collecting plates that is located closer to the terminal body portion is smaller than the predetermined
angle of the bent portion of the other current collecting plate that is located farther from the terminal body portion; and

the welded portion of each current collecting plate belonging to the second divided group is bent away from the terminal body
portion between the fixed portion and the welded portion, and the predetermined angle for the bent portions of the current
collecting plates belonging to the second divided group is determined such that the predetermined angle of the bent portion
of one of two adjacent current collecting plates that is located closer to the terminal body portion is larger than the predetermined
angle of the bent portion of the other current collecting plate that is located farther from the terminal body portion.

US Pat. No. 9,714,262

COMPOSITION FOR FORMING PASSIVATION LAYER, SEMICONDUCTOR SUBSTRATE HAVING PASSIVATION LAYER, METHOD OF PRODUCING SEMICONDUCTOR SUBSTRATE HAVING PASSIVATION LAYER, PHOTOVOLTAIC CELL ELEMENT, METHOD OF PRODUCING PHOTOVOLTAIC CELL ELE

Hitachi Chemical Company,...

1. A composition for forming a passivation layer, comprising a compound represented by the following Formula (I) and a compound
represented by the following Formula (II):
M(OR1)m  (I)


wherein, in Formula (I) and Formula (II),
M comprises at least one metal element selected from the group consisting of Nb, Ta, V, Y and Hf,
each R1 independently represents an alkyl group having from 1 to 8 carbon atoms or an aryl group having from 6 to 14 carbon atoms,

m represents an integer from 1 to 5,
each R2 independently represents an alkyl group having from 1 to 8 carbon atoms,

n represents an integer from 1 to 3,
each of X2 and X3 independently represents an oxygen atom or a methylene group, and

each of R3, R4 and R5 independently represents a hydrogen atom or an alkyl group having from 1 to 8 carbon atoms,

wherein the weight/weight ratio of the compound represented by Formula (I) and the compound represented by Formula (II) is
from 50/50 to 90/10 and having a fixed charge density of from ?7.8×109 to ?8.3×1011.

US Pat. No. 9,634,210

OPTICAL SEMICONDUCTOR DEVICE PRODUCTION METHOD AND OPTICAL SEMICONDUCTOR DEVICE

HITACHI CHEMICAL COMPANY,...

1. A production method for an optical semiconductor device including a substrate having a silver plating layer formed on a
surface and a light emitting diode bonded to the silver plating layer, the production method comprising:
a film formation step of forming a clay film covering the silver plating layer, wherein, in the film formation step, after
a clay diluted solution obtained by diluting clay with a solvent from the surface side of the substrate is applied to the
silver plating layer, the clay diluted solution is dried and the clay film is formed; and

a connection step of electricity connection the light emitting diode and the silver plating layer covered with the clay film
by wire bonding, after the film formation step.

US Pat. No. 9,515,353

NON-AQUEOUS ELECTROLYTE BATTERY

NTT FACILITIES, INC., To...

1. A non-aqueous electrolyte battery comprising a positive electrode mixture including a positive electrode active material
applied to a collector and a negative electrode plate comprising a negative electrode mixture including a negative electrode
active material applied to a collector disposed via a porous separator, and a flame retardant layer containing a phosphazene
compound as a flame retardant and a binder having ionic conductivity provided at one side or both sides of the positive electrode
plate, wherein the flame retardant is contained at a percentage of 10 wt % or more and 20 wt % or less to the positive electrode
mixture, the binder is a polyether-based polymer compound, and the flame retardant layer contains the flame retardant at a
percentage ranging from 50 wt % to 91 wt % and the binder at a percentage ranging from 9 wt % to 50 wt %, respectively.
US Pat. No. 10,125,237

HEAT RADIATION SHEET AND HEAT RADIATION DEVICE

HITACHI CHEMICAL COMPANY,...

1. A heat radiation sheet, wherein anisotropic graphite powder is oriented into a specified direction in a binder component comprising each of: (A) a thermoplastic rubber component selected from the group consisting of an acrylic rubber, ethylene-propylene rubber, butyl rubber, styrene butadiene rubber and NBR; (B) an uncured thermosetting rubber component including both (a) a carboxyl-group-modified solid synthetic rubber that is a solid at normal temperature and has a weight-average molecular weight within the range of 150,000 to 500,000, and (b) a carboxyl-group-modified liquid synthetic rubber that is a liquid at normal temperature and has a weight-average molecular weight within the range of 30,000 to 90,000; and (C) a thermosetting rubber curing agent, which is an epoxy-group-containing compound configured to be reacted with the uncured thermosetting rubber component (B), wherein the orientation in the specified direction is an orientation in the thickness direction of the heat radiation sheet, and wherein the uncured thermosetting rubber component (B) is capable of being cured by the thermosetting rubber curing agent (C) to form a cured composition.

US Pat. No. 10,085,336

MULTILAYER WIRING BOARD

HITACHI CHEMICAL COMPANY,...

1. A multilayer wiring board comprising:a core material having an insulating layer, a first ground pattern disposed on one side of the insulating layer, and a strip line disposed on the other side of the insulating layer;
a prepreg disposed on the strip line of the core material, the prepreg comprising a reinforcement material and an insulating resin impregnated in the reinforcement material; and
a second ground pattern disposed on the prepreg,
wherein the insulating layer of the core material comprises a high frequency-adaptive base material, and the prepreg comprises a general-purpose base material, and
wherein a relative permittivity after curing and a dielectric loss tangent of the general-purpose base material of the prepreg are respectively higher than a relative permittivity after curing and a dielectric loss tangent of the high frequency-adaptive base material.

US Pat. No. 9,837,572

SOLAR CELL MODULE AND METHOD OF MANUFACTURING THEREOF

HITACHI CHEMICAL COMPANY,...

1. A method of manufacturing a solar cell module comprising: a step (A) of applying a conductive adhesive composition comprising
conductive particles (a) having metal, a thermosetting resin (b), and a flux activator (c) comprising aliphatic dihydroxycarboxylic
acid onto electrodes of solar battery cells, the aliphatic dihydroxycarboxylic acid being represented by the following general
formula:
wherein R5 represents an alkyl group having 1 to 5 carbon atoms, and n and m independently represent an integer from 0 to 5;
a step (B) of disposing wiring members so as to face with electrodes of the solar battery cells with the applied conductive
adhesive composition interposed therebetween;

a step (C) of heating the solar battery cells with the wiring members obtained in the step (B); and
a step (D) of laminating sealing resins onto both surfaces of the solar battery cells with the wiring members obtained in
the step (C), further laminating protection glass onto a light-receiving surface of the solar battery cell and a protection
film onto a rear surface of the solar battery cell, and performing heating,

wherein a heating temperature in the step (C) is 140 to 180° C., and a melting point of the metal in the conductive particles
(a) is equal to or lower than the heating temperature in the step (C).

US Pat. No. 9,803,111

ADHESIVE FOR SEMICONDUCTOR, FLUXING AGENT, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE

HITACHI CHEMICAL COMPANY,...

1. An adhesive for a semiconductor, comprising an epoxy resin in an amount of 5 to 75% by mass based on the total amount of
the adhesive, a curing agent, a phenoxy resin, at least one compound selected from a group consisting of methylsuccinic acid,
2-methylglutaric acid, 2-methyladipic acid, 2-methylpimelic acid, and 2-methylsuberic acid in an amount of 0.5 to 10% by mass
based on the total amount of the adhesive, and resin fillers,
wherein a mass ratio of the content of the epoxy resin to the content of the phenoxy resin is 0.01 to 5.
US Pat. No. 9,719,129

METHODS FOR ISOLATING VESICLES FROM BIOLOGICAL FLUIDS

HITACHI CHEMICAL CO., LTD...

1. A method of isolating vesicles from biological fluid, comprising:
(a) obtaining a biological fluid sample comprising vesicles having a diameter of less than 0.5 micrometers;
(b) loading at least a portion of said biological fluid sample into a sample loading region of a vesicle capture device, said
portion of said biological fluid sample comprising blood plasma and vesicles having a diameter of less than 0.5 micrometers;

(c) passing said portion of said biological fluid sample from said sample loading region through a vesicle-capture material
in said vesicle capture device, said vesicle-capture material comprising at least a first layer and a second layer, both of
glassfiber, at least a portion of said vesicles having a diameter of less than 0.5 micrometers adsorbing to and being retained
by the vesicle-capture material, thereby producing a supernatant,

wherein said first layer is closer to said sample loading region than said second layer,
wherein said first layer has a porosity configured to capture material that is 1.6 micrometers or greater in diameter, wherein
said second layer has a porosity configured to capture material that is 0.6 micrometers to 0.8 micrometers or greater in diameter;
and

(d) passing said supernatant to a sample receiving region of said vesicle capture device, thereby isolating vesicles from
the biological fluid sample.

US Pat. No. 9,633,848

PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING PATTERNED CURED FILM, SEMICONDUCTOR ELEMENT AND ELECTRONIC DEVICE

HITACHI CHEMICAL COMPANY,...

1. A photosensitive resin composition, comprising:
(A) an alkali-soluble resin having a structural unit represented by the following formula (1):
wherein R1 represents a hydrogen atom or a methyl group; R2 represents an alkyl group having 1 to 10 carbon atoms, an aryl group having 6 to 10 carbon atoms or an alkoxy group having
1 to 10 carbon atoms; and a represents an integer of 0 to 3, b represents an integer of 1 to 3, and a total of a and b is
5 or less;
(B) a compound that generates an acid by light;
(C) a thermal crosslinking agent; and
(D) an acryl resin having a structural unit represented by the following formula (2) and a structural unit represented by
the following formula (3):

wherein R3 represents a hydrogen atom or a methyl group; and R4 represents a hydroxyalkyl group having 2 to 20 carbon atoms;
wherein R5 represents a hydrogen atom or a methyl group; and R6 represents a monovalent organic group having a primary, secondary or tertiary amino group wherein the photosensitive resin
has a haze value of less than 7%.
US Pat. No. 9,614,216

NEGATIVE ELECTRODE MATERIAL FOR LITHIUM ION SECONDARY BATTERY, METHOD FOR MANUFACTURING SAME, NEGATIVE ELECTRODE FOR LITHIUM ION SECONDARY BATTERY, AND LITHIUM ION SECONDARY BATTERY

HITACHI CHEMICAL COMPANY,...

1. A negative electrode material for a lithium ion secondary battery, the material comprising a composite particle of a first
particle comprising a carbonic substance A and a second particle comprising silicon atoms, the first particle and the second
particle combined by a carbonic substance B different from the carbonic substance A,
wherein the first particle comprises a graphite particle having pores formed by assembling or binding a plurality of flat-shaped
particles in such a manner that orientation planes thereof are nonparallel to each other, and

wherein, when a cross-section of the composite particle is observed with respect to:
a content of the silicon atoms included in a core region in a circle, the circle having a center thereof on a midpoint of
a major axis constituting a maximum length of the composite particle, and having a radius of ? of the length of a minor axis
that orthogonally intersects the major axis at the midpoint thereof, and

a content of the silicon atoms in a rim region of the composite particle, which extends from a circumference of the composite
particle to a depth of ? of the length of the minor axis,

a ratio of the content of the silicon atoms in the rim region to the content of the silicon atoms in the core region is 2
or higher.

US Pat. No. 9,597,682

DEVICES AND METHODS FOR CAPTURING TARGET MOLECULES

HITACHI CHEMICAL COMPANY ...

1. A system for capturing vesicles from a biological fluid sample obtained from a subject, comprising:
(i) a vesicle capture device, comprising:
(a) a first body having an inlet, an outlet, and an interior volume between the inlet and the outlet;
(b) a second body having an inlet, an outlet, an interior volume between the inlet and the outlet, a filter material positioned
within the interior volume of the second body, and in fluid communication with said first body,

wherein one of the inlet of the second body and the outlet of the first body comprises a pin, wherein the other of the inlet
of the second body and the outlet of the first body comprises a channel sized to receive the pin, the channel having a longitudinal
portion substantially perpendicular to a transverse portion,

wherein the first body and the second body are reversibly connected by an interaction of the pin and the channel; and
(ii) a receiving vessel having an interior cavity,
wherein the interior cavity of the receiving vessel is dimensioned to reversibly enclose both the first and the second body
and to receive the biological fluid sample after it is passed from the interior volume of the first body, through the filter
material, through the interior volume of the second body and out of the outlet of the second body.

US Pat. No. 9,519,109

SUBSTRATE WITH LENS AND PRODUCTION METHOD THEREFOR, AND OPTICAL WAVEGUIDE WITH LENS

HITACHI CHEMICAL COMPANY,...

1. A method of producing a substrate with a lens, comprising:
a first of forming a columnar member on one surface of a substrate wherein the substrate comprises a substrate comprising
a through hole, and

wherein the first step comprises:
laminating a photosensitive resin composition for forming a columnar member from the one surface side of the substrate, and
at the same time, filling the through hole, and laminating a resin composition for forming a transparent member from another
surface side of the substrate, and at the same time, filling the through hole;

exposing and curing a portion of the photosensitive resin composition for forming a columnar member, which matches with the
through hole, and photocuring or thermosetting the resin composition for forming a transparent member; and

developing and removing an uncured portion of the photosensitive resin composition for forming a columnar member to form the
columnar member protruding from an inside of the through hole toward an outside of the one surface of the substrate;

a second step of laminating, on the one surface side of the substrate, a photosensitive resin composition for forming a lens
member to arrange the photosensitive resin composition for forming a lens member on the columnar member and on the substrate,
and curing by exposure the photosensitive resin composition for forming a lens member on the columnar member to form a lens
member on the columnar member; and

a third step of heating the columnar member for forming a lens member to cause dripping thereof, thereby forming an upper
surface thereof into a convex lens surface.

US Pat. No. 9,877,808

MEMBRANE FOR INDUCING REGENERATION OF BONE/TISSUE, AND METHOD FOR PRODUCING SAME

HITACHI CHEMICAL COMPANY,...

1. A membrane for guided regeneration of bone and tissue comprising a non-bioabsorbable organic base material and a new bone
formation guide layer on one or both sides of the non-bioabsorbable organic base material, the new bone formation guide layer
containing a hydrophilic polymer and calcium phosphate, and having a thickness of 10 to 200 ?m,
wherein the non-bioabsorbable organic base material comprises at least one of polyethylene terephthalate, polyethylene, polystyrene,
polyvinyl chloride, polycarbonate, polyamide, polymethyl methacrylate, epoxy resin or urethane resin, wherein the proportion
of the contents of the hydrophilic polymer and the calcium phosphate in the new bone formation guide layer is 40:60 to 10:90
as the mass ratio.

US Pat. No. 9,862,866

ELECTRICALLY CONDUCTIVE ADHESIVE COMPOSITION, CONNECTION STRUCTURE, SOLAR BATTERY MODULE, AND METHOD FOR PRODUCING SAME

HITACHI CHEMICAL COMPANY,...

1. An electrically conductive adhesive composition, comprising:
electrically conductive particles containing a metal of which melting point is 220° C. or less;
a thermosetting resin; and
a thermal cationic polymerization initiator,
wherein a combination ratio of the content of components of the electrically conductive adhesive composition other than the
electrically conductive particles to the content of the electrically conductive particles is 5/95 to 50/50 in terms of the
solid content ratio by mass.

US Pat. No. 9,735,409

LEAD ACID BATTERY

Hitachi Chemical Company,...

1. A flooded-type lead acid battery comprising:
a plate group including:
a negative plate having negative active material filled in a negative electrode current collector; and
a positive plate having positive active material filled in a positive electrode current collector,
the negative plate and the positive plate being stacked on each other through a separator and accommodated in a battery container
together with an electrolyte, the flooded-type lead acid battery being discharged to a load in partially charged state,

wherein, during use under a partial state of charge, the negative plate is contacted with, throughout a plate surface, a nonwoven
fabric formed of at least one fiber material selected from a material group consisting of glass, pulp, and polyolefin, not
integrated with the plate, and

the negative plate contacted with the nonwoven fabric is accommodated in an envelope separator formed of a microporous synthetic
resin sheet.

US Pat. No. 9,639,189

CONDUCTIVE PATTERN FORMATION METHOD, CONDUCTIVE PATTERN-BEARING SUBSTRATE, AND TOUCH PANEL SENSOR

HITACHI CHEMICAL COMPANY,...

1. A conductive film substrate comprising:
a. a substrate; and
b. a cured resin layer on the substrate, the cured resin layer comprising a first surface opposite the substrate, the first
surface having a portion including a conductive film and a portion without a conductive film, wherein the portion of the cured
resin layer including the conductive film comprises a cured portion projecting from the cured resin layer, the cured portion
projecting the from the cured resin layer abutting the conductive film.

US Pat. No. 9,728,341

ELECTRONIC COMPONENT, METHOD FOR PRODUCING SAME, AND SEALING MATERIAL PASTE USED IN SAME

Hitachi Chemical Company,...

1. A sealing material paste comprising:
a low melting glass;
a resin binder; and
a solvent,
wherein the low melting glass contains vanadium oxide, tellurium oxide, iron oxide and phosphorous oxide, and satisfies the
following relations (1) and (2) in terms of oxides:

V2O5+TeO2+Fe2O3+P2O5?90 (mass %)  (1)

V2O5>TeO2>Fe2O3>P2O5 (mass %)  (2).

US Pat. No. 10,000,679

PHENOLIC RESIN COMPOSITION

Hitachi Chemical Company,...

16. An electric component comprising a heat conductive material, the heat conductive material comprising:a phenolic resin composition, containing:
an epoxy resin curing agent that comprises a hydroxybenzene derivative represented by the following Formula (I) and a phenol resin having at least one partial structure selected from the group consisting of the following Formulae (IIa), (IIb), (IIc) and (IId); and
an epoxy resin:

wherein each of R1, R2, R3, R4 and R5 independently represents a hydroxy group, a hydrogen atom, or an alkyl group having from 1 to 8 carbon atoms; and at least two of R1, R2, R3, R4 and R5 are hydroxy groups;

wherein each of m and n independently represents a positive number; and each Ar independently represents at least one group selected from the group consisting of the following Formulae (IIIa) and (IIIb); and

wherein R11 represents a hydrogen atom or a hydroxy group; each of R12 and R13 independently represents a hydrogen atom or an alkyl group having from 1 to 8 carbon atoms; and R14 represents a hydrogen atom or a hydroxy group,
wherein a content of the hydroxybenzene derivative is from 30% by mass to 80% by mass with respect to a total mass of the epoxy resin curing agent.

US Pat. No. 9,983,456

LIGHT CONTROL FILM

HITACHI CHEMICAL COMPANY,...

1. A light control film, comprising: two transparent electroconductive resin substrates; and a light control layer sandwiched between the two transparent electroconductive resin substrates, the light control layer comprising: a resin matrix; and a light control suspension dispersed in the resin matrix,wherein at least one of the transparent electroconductive resin substrates has, on the light control layer side thereof, a primer layer, and
the primer layer is made of a film comprising a material containing a urethane acrylate containing a pentaerythritol skeleton.

US Pat. No. 9,660,156

OPTICAL SEMICONDUCTOR ELEMENT MOUNTING PACKAGE, AND OPTICAL SEMICONDUCTOR DEVICE USING THE SAME

Hitachi Chemical Company,...

1. An optical semiconductor element mounting package having a recessed part that serves as an optical semiconductor element
mounting region, wherein the package is formed by integrating:
a resin molding composed of a thermosetting light-reflecting resin composition, which forms at least side faces of the recessed
part; and

at least a pair of positive and negative lead electrodes disposed opposite each other, at least portions of main faces of
opposing ends of the lead electrodes forming a part of a bottom face of the recessed part, wherein

corners of the opposing ends of the lead electrodes at which rear faces and side faces of the lead electrodes intersect are
curved, and corners of the opposing ends of the lead electrodes at which the side faces and the main faces of the lead electrodes
intersect are built up to an acute angle, and

there is no gap at a joint face between the resin molding and the lead electrodes.

US Pat. No. 10,165,691

METHOD FOR MANUFACTURING MULTILAYER WIRING SUBSTRATE

HITACHI CHEMICAL COMPANY,...

1. A method for manufacturing a multilayer wiring board, comprising:(1) a step of integrally laminating an inner layer material with an inner layer wiring pattern formed thereon, an insulating layer, and a metal foil for an upper layer wiring pattern, and forming a hole for a via hole in the metal foil and the insulating layer, the hole being formed from the metal foil to the inner layer wiring pattern, an overhang of the metal foil being formed at an opening of the hole and a lower space being formed between the overhang and an inside wall of the hole;
(2) a step of forming a base electroless plating layer within the hole and on the metal foil, then filling in the hole by forming electrolytic filling plating material, and thus forming a via hole that connects the metal foil and the inner layer wiring pattern; and
(3) a step of forming an upper layer wiring pattern on the insulating layer after the formation of the electrolytic filling plating material,
wherein the filling-in of the hole by the formation of the electrolytic filling plating material in step (2) is carried out by temporarily decreasing an electric current density and then increasing the electric current density while performing electrolytic filling plating, and
wherein temporarily decreasing the electric current density occurs when the electrolytic filling plating material fills the lower space between the overhang of the metal foil and the inside wall of the hole, and a thickness of an electrolytic filling plating material deposited on a bottom face of the hole is equal to or smaller than a thickness of the electrolytic filling plating material deposited on the inside wall of the hole and on the metal foil.
US Pat. No. 10,030,172

ABRASIVE, ABRASIVE SET, AND METHOD FOR POLISHING SUBSTRATE

HITACHI CHEMICAL COMPANY,...

1. A method for polishing a base comprising an insulating material and a stopper material, comprising a step of polishing a surface to be polished of a base using a polishing agent comprising:a fluid medium;
abrasive grains containing a hydroxide of a tetravalent metal element;
a first additive;
a second additive; and
a third additive,
wherein:
the first additive is at least one selected from the group consisting of a compound having a polyoxyalkylene chain and a vinyl alcohol polymer;
the second additive is a cationic polymer;
the third additive is an amino group-containing sulfonic acid compound;
the insulating material contains silicon dioxide; and
the stopper material contains polysilicon.
US Pat. No. 9,790,542

METHODS FOR ISOLATION OF BIOMARKERS FROM VESICLES

HITACHI CHEMICAL CO., LTD...

1. A method of isolating a biomarker from biological fluid, comprising:
(a) obtaining a biological fluid sample comprising vesicles comprising at least one biomarker;
(b) loading at least a portion of said biological fluid sample into a sample loading region of a vesicle capture device;
(c) passing said portion of said biological fluid sample from said sample loading region through a vesicle-capture material
disposed within said vesicle capture device, said vesicle-capture material comprising at least a first layer and a second
layer, both of glassfiber,

wherein said first layer is closer to said sample loading region than is said second layer,
wherein said first layer has a porosity configured to capture material that is 1.6 microns or greater in diameter,
wherein the second layer has a porosity configured to capture material that is about 0.6 microns to about 0.8 microns or greater
in diameter,

wherein said passing results in capture of said vesicles from said biological fluid sample on or in both of said first and
second layers;

(d) removing non-vesicle material from said device;
(e) passing a lysis agent in a buffer from said sample loading region through said first layer and then subsequently through
said second layer of said vesicle-capture material, thereby lysing said captured vesicles in or on both of said first and
second layers with the lysis agent in the buffer to create a lysate comprising a first material from vesicles captured in
or on said first layer, said lysate further comprising a second material from vesicles captured in or on said second layer;
and

(f) collecting the lysate from both of said first and second layers into a single receiving region, thereby isolating a biomarker
from said vesicles.

US Pat. No. 9,656,353

REFLOW FILM, SOLDER BUMP FORMATION METHOD, SOLDER JOINT FORMATION METHOD, AND SEMICONDUCTOR DEVICE

HITACHI CHEMICAL COMPANY,...

1. A reflow film comprising a polyvinyl alcohol having an average polymerization degree from 100 to 1,000 which is dissolvable
in a solvent, solder particles, wherein the solder particles are dispersed in the film, and a low-molecular weight alcohol
having a boiling point of 100° C. or higher, a molecular weight of 500 or less, and which dissolves or disperses in water,
in an amount of 20 to 300 parts by mass with respect to 100 parts by mass of the polyvinyl alcohol.

US Pat. No. 9,662,649

DEVICES AND METHODS FOR CAPTURING TARGET MOLECULES

HITACHI CHEMICAL COMPANY ...

1. A system for capturing vesicles from a biological fluid sample obtained from a subject, comprising:
(i) a vesicle capture device, comprising:
(a) a first body having an inlet, an outlet, and an interior volume between the inlet and the outlet;
(b) a second body having an inlet, an outlet, an interior volume between the inlet and the outlet, a filter material positioned
within the interior volume of the second body, and in fluid communication with said first body,

wherein one of the inlet of the second body and the outlet of the first body comprises a pin, wherein the other of the inlet
of the second body and the outlet of the first body comprises a channel sized to receive the pin, the channel having a longitudinal
portion substantially perpendicular to a transverse portion,

wherein the first body and the second body are reversibly connected by an interaction of the pin and the channel; and
(ii) a receiving vessel having an interior cavity,
wherein the interior cavity of the receiving vessel is dimensioned to reversibly enclose both the first and the second body
and to receive the biological fluid sample after it is passed from the interior volume of the first body, through the filter
material, through the interior volume of the second body and out of the outlet of the second body.

US Pat. No. 9,863,493

NON-ASBESTOS FRICTION MATERIAL COMPOSITION, FRICTION MATERIAL USING SAME, AND FRICTION MEMBER

HITACHI CHEMICAL COMPANY,...

1. A non-asbestos frictional material composition, comprising:
a binder;
an organic filler comprising:
cashew dust in a content of 1.5-4.5 mass % of the total mass of the composition;
an inorganic filler comprising:
zirconium oxide with a particle size of 30 ?m or less in a content of 30-45 mass % of the total mass of the composition, and
not containing zirconium oxide with a particle size of more than 30 ?m; and

a fiber base material, comprising:
an aramid fiber;
a mineral fiber;
copper in a content of 5 mass % or less of the total mass of the composition as a copper element; and
a metal fiber other than a copper fiber and a copper alloy fiber in a content of 0.5 mass % or less of the total mass of the
composition,

wherein the content of the fiber base material is 5-10 mass % of the total mass of the composition.

US Pat. No. 9,837,560

SOLAR BATTERY CELL, SOLAR BATTERY MODULE, METHOD OF MAKING SOLAR BATTERY CELL AND METHOD OF MAKING SOLAR BATTERY MODULE

HITACHI CHEMICAL COMPANY,...

1. A solar battery module, comprising:
a plurality of solar battery cells, each of the plurality of solar battery cells comprising:
a plurality of finger electrodes arranged on a light receiving surface of a photovoltaic substrate, said light receiving surface
having a region of predetermined width on which a conductive adhesive is applied;

said region being provided with an alignment marking indicating a position where the adhesive is to be applied over the surface,
said alignment marking being disposed in portions of both the inside and the outside of said region in a widthwise direction
of said region;

said alignment marking being a straight line orthogonal to a direction in which said finger electrodes extend and having a
cross-dimension in a widthwise direction of said region that is less than said predetermined width, and said alignment marking
having a line width smaller than a line width of each of the finger electrodes; and

a TAB wire positioned along the alignment marking on one of the plurality of solar battery cells and connected to the finger
electrodes of said one of the plurality of solar battery cells via said conductive adhesive, and further connected to a back
surface electrode formed on a back surface of another of the plurality of solar battery cells.

US Pat. No. 9,744,591

IRON BASE SINTERED SLIDING MEMBER AND METHOD FOR PRODUCING SAME

HITACHI CHEMICAL COMPANY,...

1. An iron-based sintered sliding member comprising:
S: 3.24 to 8.10 mass %,
Cu as an optional element: 20 mass % or less,
Ni and Mo as optional elements: 13 mass % or less, respectively, and
remainder: Fe and inevitable impurities, as an overall composition,
wherein the metallic structure of the iron-based sintered sliding member comprises a ferrite base in which sulfide particles,
of which iron sulfide is in the majority, are precipitated and uniformly dispersed, and pores,

wherein the sulfide particles are dispersed at a ratio of 15 to 30 vol % versus the base, and
wherein the iron sulfide is generated from the eutectic liquid phase of Fe—S sintering.

US Pat. No. 9,660,131

METHOD FOR CONNECTING CONDUCTOR, MEMBER FOR CONNECTING CONDUCTOR, CONNECTING STRUCTURE AND SOLAR CELL MODULE

HITACHI CHEMICAL COMPANY,...

1. A method of manufacturing a solar cell module comprising a structure with connected solar cells, wherein the method comprises
the steps of:
(a) providing an electric conductor connecting member comprising a metal foil that has a first adhesive layer on a front side
of the metal foil and a second adhesive layer on a back side of the metal foil, wherein neither adhesive layer is a solder
layer;

(b) arranging a first part of the electric conductor connecting member on a surface electrode of a first solar cell in the
order of (1) metal foil, (2) first adhesive layer, and (3) surface electrode of the first solar cell;

(c) hot pressing the first part of the electric conductor connecting member and the surface electrode of the first solar cell
so that the metal foil of the first part of the electric conductor connecting member and the surface electrode of the first
solar cell are electrically connected and bonded together;

(d) arranging a second part of the electric conductor connecting member on a surface electrode of a second solar cell in the
order of (1) metal foil, (2) second adhesive layer, and (3) surface electrode of the second solar cell; and

(e) hot pressing the second part of the electric conductor connecting member and the surface electrode of the second solar
cell so that the metal foil of the second part of the electric conductor connecting member and the surface electrode of the
second solar cell are electrically connected and bonded together,

wherein a ten-point height of roughness profile Rz1 (?m) on a surface of the surface electrode of the first solar cell facing
the metal foil and a ten-point height of roughness profile Rz2 (?m) on a surface of the surface electrode of the second solar
cell facing the metal foil are between 2 ?m and 30 ?m, and

wherein the surface electrodes of the first solar cell and the second solar cell are bus electrodes,
wherein a thickness of the first adhesive layer and the second adhesive layer satisfies the condition specified by the following
formula (1),

0.8?t/Rz?1.5  (1),

wherein in formula (1), t represents the thickness (?m) of the first adhesive layer and the second adhesive layer, and Rz
represents a ten-point height of roughness profile (?m) of a surface of the surface electrode of the first solar cell facing
the first adhesive layer and a surface of the surface electrode of the second solar cell facing the second adhesive layer.

US Pat. No. 9,631,669

OIL-IMPREGNATED SINTERED BEARING AND PRODUCTION METHOD THEREFOR

HITACHI CHEMICAL COMPANY,...

1. An oil-impregnated sintered bearing made of an iron-copper sintered alloy consisting essentially of, by mass %, 10 to 59%
of Cu, 0.5 to 3% of Sn, and the balance of Fe and inevitable impurities,
the oil-impregnated sintered bearing including pores in a matrix of the iron-copper sintered alloy at a total of not less
than 800 per mm2,

the oil-impregnated sintered bearing having an inner circumferential surface at which the pores are exposed at 20 to 50% by
area ratio,

the oil-impregnated sintered bearing exhibiting a pore size distribution in which the number of pores with circle-equivalent
diameters of greater than 100 ?m is not more than 0.5% with respect to the total number of pores, the number of pores with
circle-equivalent diameters of greater than 80 ?m and not greater than 100 ?m is not more than 0.1% with respect to the total
number of pores, the number of pores with circle-equivalent diameters of greater than 60 ?m and not greater than 80 ?m is
0.5 to 1.5% with respect to the total number of pores, the number of pores with circle-equivalent diameters of greater than
40 ?m and not greater than 60 ?m is 0.8 to 3% with respect to the total number of pores, and the remainder of the pores are
pores with circle-equivalent diameters of less than 40 ?m.

US Pat. No. 9,982,563

SINTERED ALLOY AND MANUFACTURING METHOD THEREOF

HITACHI CHEMICAL COMPANY,...

1. A method for manufacturing a sintered alloy, comprising the steps of:preparing an iron alloy powder A consisting of, in percentage by mass, Cr: 25 to 45, Ni: 5 to 15, Si: 1.0 to 3.0, C: 0.5 to 4.0 and a balance of Fe plus unavoidable impurities;
preparing an iron alloy powder B consisting of, in percentage by mass, Cr: 12 to 25, Ni: 5 to 15 and a balance of Fe plus unavoidable impurities;
preparing an iron-phosphorus powder consisting of, in percentage by mass, P:10 to 30 and the balance of Fe plus unavoidable impurities or P: 5 to 25 and a balance of Cu plus unavoidable impurities, a nickel powder, a copper powder or a copper alloy powder, and graphite powder;
forming a raw material powder, consisting of, in percentage by mass, Cr: 10.37 to 39.73, Ni: 5.10 to 24.89, Si: 0.14 to 2.52, Cu: 1.0 to 10.0, P: 0.1 to 1.5, C: 0.18 to 3.20 and a balance of Fe plus unavoidable impurities by mixing the iron alloy powder A with the iron alloy powder B so that a ratio of the iron alloy powder A to the total of the iron alloy powder A and the iron alloy powder B is within a range of 20 to 80 mass %, and adding the iron-phosphorus powder, the nickel powder, the copper powder or copper alloy powder, and the graphite powder;
pressing the raw material powder to obtain a compact; and sintering the compact.

US Pat. No. 9,962,887

METHOD OF MANUFACTURING FIBER SUBSTRATE AND METHOD OF MANUFACTURING RESIN ROTATOR

Hitachi Chemical Company,...

1. A method of manufacturing a fiber substrate comprising the steps of:preparing slurry by dispersing short fibers in a dispersion medium; pouring the slurry into a cylindrical mold from above the cylindrical mold, the slurry being directed to a slurry diffusion member disposed at the center of the cylindrical mold and having an upward pointing conical or pyramidal shape;
pouring the dispersion medium that is the same as the dispersion medium used to prepare the slurry, the dispersion medium consisting essentially of organic solvent, onto the slurry diffusion member from above the slurry diffusion member to cause the short fibers adhering to the slurry diffusion member to fall down, after the step of pouring the slurry; and
discharging the dispersion medium from the cylindrical mold to accumulate the short fibers in the cylindrical mold to obtain a fiber aggregate.

US Pat. No. 9,822,293

SUGAR ALCOHOL MICROCAPSULE, SLURRY, AND RESIN MOLDED ARTICLE

HITACHI CHEMICAL COMPANY,...

1. A sugar alcohol microcapsule obtained by mixing particles that include molten sugar alcohol and are dispersed in an oil
phase with a material that reacts with the particles, and encapsulating the sugar alcohol,
wherein the particles further include at least one selected from the group consisting of an amine compound and a water-soluble
epoxy compound.

US Pat. No. 9,786,463

ELECTRONIC COMPONENT, CONDUCTIVE PASTE, AND METHOD FOR MANUFACTURING AN ELECTRONIC COMPONENT

HITACHI, LTD., Tokyo (JP...

1. An electronic component, comprising:
an electrode wire containing a plurality of particles formed from aluminum (Al) or a plurality of particles formed from an
alloy containing aluminum, and an oxide for fixing the particles to a substrate,

wherein the oxide contains a glass phase,
wherein a chemical compound layer containing vanadium and aluminum is formed on a surface of the particles,
wherein the glass phase has a transition point lower than or equal to 290° C. and comprises vanadium, and
wherein the vanadium in the chemical compound layer and the glass phase contains vanadium atoms of different valences and
at least 60 percent of the vanadium atoms have a valence of 4 or less.

US Pat. No. 9,781,836

THERMOSETTING RESIN COMPOSITION, METHOD FOR FORMING PROTECTIVE FILM FOR FLEXIBLE WIRING BOARD, AND FLEXIBLE WIRING BOARD

HITACHI CHEMICAL COMPANY,...

1. A thermosetting resin composition comprising:
a polyurethane resin comprising a constitutional unit derived from an alicyclic diol in an amount of 0.1 to 30 mass % of the
total mass polyurethane resin, the polyurethane resin having an acid value of 10 to 31 mgKOH/g; and

a curing agent comprising an epoxy resin,
wherein the polyurethane resin has been synthesized by:
reacting a diol including an alicyclic diol or a polycarbonatediol having a constitutional unit derived from an alicyclic
diol with a polyisocyanate having an isocyanate group to obtain a polyisocyanate having a urethane linkage, and reacting the
polyisocyanatel having the urethane linkage with an acid anhydride; or

reacting a diol including an alicyclic diol or a polycarbonatediol having a constitutional unit derived from an alicyclic
diol and a dihydroxy compound having a carboxyl group with a polyisocyanate having an isocyanate group.

US Pat. No. 9,709,887

PHOTOSENSITIVE CONDUCTIVE FILM

HITACHI CHEMICAL COMPANY,...

1. A photosensitive conductive film, comprising:
a support film; and
a photosensitive layer provided on the support film, wherein
the photosensitive layer contains a plurality of conductive fibers, and
an average value of shortest distances between each of the conductive fibers and a surface at the side of the support film
of the photosensitive layer is 0.1 to 50 nm.

US Pat. No. 9,711,976

LEAD STORAGE BATTERY SYSTEM

HITACHI CHEMICAL COMPANY,...

1. A lead storage battery system capable of controlling charge and discharge of a lead storage battery bank that includes
a single or a plurality of lead storage batteries or a plurality of lead storage battery modules connected in parallel, each
of the lead storage battery module including the lead storage batteries connected in series,
the lead storage battery state comprising;
an individual battery state measurement unit that measures battery states including current, voltage and temperature of the
individual lead storage batteries or the individual lead storage battery modules;

a state-of-charge model storage unit that accumulates state-of-charge models representing a correlation between the battery
state and a state of charge;

a state-of-charge estimation unit that estimates individual states of charge from the state of charge models and the battery
states, the individual states of charge being state of charge of the respective lead storage batteries or lead storage battery
modules;

a state-of-charge variation range determination unit that calculates a state-of-charge maximum value and a state-of-charge
minimum value;

an equalization-charging management unit that controls performance of an equalization charge on the lead storage battery bank;
a usable state-of-charge range adjustment unit that restricts the state-of-charge maximum value and the state-of-charge minimum
value into a narrower restricted range in consideration of an influence of degradation of the lead storage batteries or the
lead storage battery modules;

an equalization-charging planning unit that makes a plan to perform the equalization charging when the state-of-charge maximum
value and the state-of-charge minimum value go out of the restricted range;

an equalization-charging schedule notification unit that notifies a schedule of the equalization charge; and
an equalization-charging management unit that performs the equalization charge in accordance with the plan made the equalization-charging
planning unit,

wherein the state-of-charge maximum value is a maximum value of the individual states of charge the state-of-charge minimum
value is a minimum value of the individual states of charge and the equalization-charging management unit performs the equalization
charge so that the state-of-charge maximum value falls within a range lower than an overcharge region and the state-of-charge
minimum value falls within a range higher than a sulfation region, and

wherein the state-of-charge variation range determination unit calculates an average value and a variation of the individual
states of charge, the state-of-charge maximum value is a sum of the average value and half of the variation, and the state-of-charge
minimum value is a difference between the average value and half of the variation.

US Pat. No. 9,692,032

RECHARGEABLE BATTERY

HITACHI CHEMICAL COMPANY,...

1. A rechargeable battery comprising:
an electrode group comprising a plurality of negative electrode collectors, each negative electrode collector having a negative
active material layer formed on a surface, and a plurality of positive electrode collectors, each positive electrode collector
having a positive active material layer formed on a surface, alternately disposed in a layered manner into a strip shape with
a separator configured to retain an electrolyte interposed between adjacent negative and positive electrode collectors, a
plurality of negative electrode plate tabs formed at ends of the plurality of negative electrode collectors, and a plurality
of positive electrode plate tabs formed at ends of the plurality of positive electrode collectors;

a plurality of negative collecting plates joined to the plurality of negative electrode plate tabs and plurality of positive
collecting plates joined to the plurality of positive electrode plate tabs; and

a negative terminal base portion having a through-hole for a bolt and a positive terminal base portion having a through-hole
for a bolt;

wherein a plurality of the negative collecting plates are joined together and to the negative terminal base portion with pressing
plates by a bolt, the bolt having a bolt flange and a bolt shaft portion, a portion of the bolt shaft portion passing through
the through-hole of the negative terminal base, and at least one nut, and wherein a plurality of the positive collecting plates
are joined together and to the positive terminal base portion with pressing plates by a bolt, the bolt having a bolt flange
and a bolt shaft portion, a portion of the bolt shaft portion passing through the through-hole of the positive terminal base,
and at least one nut;

wherein the negative and positive collecting plates comprise a metal, and
wherein the pressing plates comprise a metal or a resin.
US Pat. No. 9,829,791

PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, SEMICONDUCTOR DEVICE AND METHOD FOR FORMING RESIST PATTERN

HITACHI CHEMICAL COMPANY,...

1. A photosensitive resin composition comprising:
a component (A): a resin having a phenolic hydroxyl group;
a component (B): an aliphatic compound having two or more functional groups, the functional groups being one or more groups
selected from an acryloyloxy group, a methacryloyloxy group, a glycidyloxy group and a hydroxyl group;

a component (C): a photosensitive acid generator comprising an onium salt compound, a halogen-containing compound, a sulfone
compound, a sulfonimide compound, or a diazomethane compound; and

a component (D): an inorganic filler having an average particle diameter of 100 nm or less.
US Pat. No. 9,796,828

EPOXY RESIN COMPOSITION AND ELECTRONIC COMPONENT DEVICE

HITACHI CHEMICAL COMPANY,...

1. An epoxy resin composition, comprising an epoxy resin, a curing agent, a curing accelerator, an inorganic filler, and a
carboxylic acid compound that satisfies at least one selected from the group consisting of:
A: having at least one carboxy group and at least three hydroxy groups; and
B: having a structure in which two carboxy groups are condensed by dehydration.

US Pat. No. 9,668,345

MULTILAYER WIRING BOARD WITH METAL FOIL WIRING LAYER, WIRE WIRING LAYER, AND INTERLAYER CONDUCTION HOLE

HITACHI CHEMICAL COMPANY,...

1. A multilayer wiring board comprising:
a first metal foil wiring layer that has at least two or more layers of metal foil wiring lines, including a metal foil wiring
line positioned on a surface of the first metal foil wiring layer and a plurality of metal foil wiring lines in an inner layer
of the first metal foil wiring layer, and is arranged on a mounting surface side for mounting a surface mount type component;

a wire wiring layer that is arranged on an opposite side of the mounting surface, and in which an insulation coating wire
is wired; and

a first interlayer conduction hole that has a conduction part which electrically connects the metal foil wiring line positioned
on a surface of the first metal foil wiring layer to at least one of the metal foil wiring lines in an inner layer of the
first metal foil wiring layer and the insulation coating wire of the wire wiring layer,

wherein a hole diameter of the first interlayer conduction hole varies in a board thickness direction of the multilayer wiring
board.

US Pat. No. 10,002,987

CONNECTING STRUCTURE AND SOLAR CELL MODULE

HITACHI CHEMICAL COMPANY,...

1. A solar cell module comprising:solar cells having a plurality of electrodes on a front side and a rear side, wherein the electrodes have a surface roughness that creates a plurality of protrusions with a maximum height Ry;
a plurality of connecting structures, wherein each connecting structure comprises a conductive connecting member hot pressed to a part of two of the plurality of electrodes, thereby electrically connecting each electrode to another electrode of the plurality of electrodes,
wherein each connective connecting member comprises a metal foil with a first side and a second side, a first adhesive layer covering the entire first side of the metal foil, and a second adhesive layer covering the entire second side of the metal foil, except for a plurality of parts wherein the plurality of protrusions on the first and second sides of the electrodes directly contact the metal foil,
wherein each electrode and the metal foil are bonded together by a cured product of the first or second adhesive layer, thereby electrically connecting each electrodes with another electrode of the plurality of electrodes in series, or in parallel, or in series and in parallel, and
wherein the cured product of the adhesive includes conductive particles, and a maximum particle size rmax (pm) of the conductive particles is no greater than the maximum height Ry on the surface of the electrodes.

US Pat. No. 9,911,543

CAPACITOR

HITACHI CHEMICAL COMPANY,...

1. A capacitor comprising:
an electrode group unit including:
a wound electrode group formed by winding a stacked member around a cylindrical axial core, the stacked member being formed
by stacking an electrode having one of positive and negative polarities and formed of an elongated current collector having
an active material layer formed thereon such that a first welded portion is left on one width-direction end of the electrode
having the one of the polarities, a separator, and an electrode having the other of the polarities and formed of an elongated
current collector having an active material layer formed thereon such that a second welded portion is left on the other width-direction
end of the electrode having the other of the polarities;

a first current collecting member supported by one end of the axial core and welded to the first welded portion of the electrode
having the one of the polarities and included in the wound electrode group, and

a second current collecting member supported by the other end of the axial core and welded to the second welded portion of
the electrode having the other of the polarities and included in the wound electrode group;

an electrically conductive bottomed cylindrical container having an opening portion at one end thereof and configured to contain
the electrode group unit therein; and

an electrically conductive lid member electrically insulated from the container and configured to block the opening portion
of the container, wherein:

the first current collecting member is electrically connected to the container;
the second current collecting member is electrically connected to the lid member;
the first current collecting member includes:
a protruded portion protruded in a direction away from the axial core and fitted with the one end of the axial core,
a first welding portion located on an outer side of the protruded portion and extending outward in a radial direction of the
axial core to be welded to the first welded portion of the electrode having the one of the polarities, and

at least one slit extending across the protruded portion and the first welding portion and penetrating the protruded portion
and the first welding portion in a thickness direction;

the at least one slit includes one slit passing through a center of the protruded portion and extending entirely across the
protruded portion such that both ends of the one slit reach the first welding portion;

the first welding portion of the first current collecting member includes a plurality of first elongated projecting portions
for welding, the plurality of first elongated projecting portions projecting toward the wound electrode group, opening toward
a bottom portion of the container, and being formed at equal intervals in a circumferential direction about the protruded
portion;

the plurality of first elongated projecting portions are formed to extend between the protruded portion and an outer periphery
of the first welding portion;

two of the plurality of first elongated projecting portions are disposed on an extension line of the slit, and the two first
elongated projecting portions are shorter than the rest of the plurality of first elongated projecting portions;

the plurality of first elongated projecting portions are welded to the first welded portion by laser welding;
a pair of recessed portions are formed at the one end of the axial core to penetrate the axial core in the radial direction
of the axial core, open toward the protruded portion, and oppose each other in the radial direction;

the pair of recessed portions coincide with the slit when the one end of the axial core is fitted with the protruded portion;
the second current collecting member includes:
a through hole to be fitted with the other end of the axial core,
a second welding portion located on an outer side of the through hole and extending outward in the radial direction of the
axial core to be welded to the second welded portion of the electrode having the other of the polarities, and

a tab having two ends, one of the two ends being integrally provided with the second welding portion and the other of the
two ends being electrically connected to the lid member;

at least one elongated projection is formed in the vicinity of the one end of the tab to extend in a width direction of the
tab, projects toward the wound electrode group, and opens toward the lid member;

the second welding portion of the second current collecting member includes a recessed portion extending from an outermost
periphery of the second welding portion toward the through hole and penetrating the second welding portion in a thickness
direction; and

the one end of the tab is integrally provided with a bottom portion of the recessed portion;
the second welding portion of the second current collecting member includes a plurality of second elongated projecting portions
for welding, the plurality of second elongated projecting portions projecting toward the wound electrode group, opening toward
the lid member, and being formed at intervals in a circumferential direction about the through hole; and

the plurality of second elongated projecting portions are formed to extend between the through hole and an outer periphery
of the second welding portion;

the plurality of second elongated projecting portions are terminated before the outermost periphery;
the through hole is defined by being surrounded by a pair of parallel edge portions and a pair of arcuate edge portions connecting
both ends of the pair of parallel edge portions; and

the plurality of second elongated projecting portions are welded to the second welded portion by laser welding.

US Pat. No. 9,745,411

RESIN COMPOSITION, RESIN SHEET, CURED RESIN SHEET, RESIN SHEET STRUCTURE, CURED RESIN SHEET STRUCTURE, METHOD FOR PRODUCING CURED RESIN SHEET STRUCTURE, SEMICONDUCTOR DEVICE, AND LED DEVICE

Hitachi Chemical Company,...

1. A resin composition comprising an epoxy resin monomer, a novolac resin including a compound having a structural unit represented
by the following Formula (I), and a filler;
wherein the filler has at least 4 peaks in a particle size distribution measured by laser diffractometry, wherein four of
the peaks are present respectively in ranges of not less than 0.01 ?m and less than 1 ?m, not less than 1 ?m and less than
10 ?m, from 10 ?m to 50 ?m, and from 20 ?m to 100 ?m, and wherein a peak present in a range of from 10 ?m to 50 ?m includes
an aluminum oxide particle, and a peak present in a range of from 20 ?m to 100 ?m includes a boron nitride particle,


wherein in Formula (I), R1 represents an alkyl group, an aryl group or an aralkyl group; each of R2 and R3 independently represents a hydrogen atom, an alkyl group, an aryl group or an aralkyl group; m represents a number from 0
to 2; n represents a number from 1 to 7; and in a case in which m is 2, the two R1s may be the same or different.

US Pat. No. 9,971,244

PHOTOSENSITIVE ELEMENT, PHOTOSENSITIVE ELEMENT ROLL, METHOD FOR PRODUCING RESIST PATTERN, AND ELECTRONIC COMPONENT

HITACHI CHEMICAL COMPANY,...

2. A photosensitive element, comprising:a support film;
a polypropylene film; and
a photosensitive layer arranged between the support film and the polypropylene film, wherein
the polypropylene film has a first surface at a side of the photosensitive layer and a second surface at an opposite side to the first surface, and
a maximum height Rmax of the first surface and the second surface is 0.5 ?m or less.

US Pat. No. 9,966,269

POLISHING LIQUID FOR CMP, POLISHING LIQUID SET FOR CMP, AND POLISHING METHOD

HITACHI CHEMICAL COMPANY,...

1. A polishing liquid for CMP comprising cerium oxide particles and water, whereina powder X-ray diffraction chart of the cerium oxide particles includes a main peak appearing within a range from 2?=27.000 to 29.980°,
the main peak is a peak of cerium oxide,
a half-value width of the main peak is from 0.26 to 0.36°,
an average particle size of the cerium oxide particles is at least 130 nm but less than 175 nm, and
a number of cerium oxide particles having a particle size of 1.15 ?m or greater is not more than 5,000×103 particles/mL.

US Pat. No. 9,873,771

FILM-LIKE EPOXY RESIN COMPOSITION, METHOD OF PRODUCING FILM-LIKE EPOXY RESIN COMPOSITION, AND METHOD OF PRODUCING SEMICONDUCTOR DEVICE

HITACHI CHEMICAL COMPANY,...

1. A film-like epoxy resin composition comprising:
an epoxy resin (A);
a curing agent (B);
a cure accelerator (C);
an inorganic filler (D); and
an organic solvent (E), andsatisfying all the following requirements (1) to (4):
(1) at least one of the epoxy resin (A) and the curing agent (B) contains a component being a liquid at 25° C. in an amount
of 30% by mass or more based on the total mass of the epoxy resin (A) and the curing agent (B);

(2) a content of a volatile portion that volatilizes by being heated at 180° C. for 10 minutes is 0.2% to 1.5% by mass based
on the total amount of the epoxy resin composition;

(3) a minimum melt viscosity in temperature rising from 40° C. to 200° C. is 800 Pa·s or less; and
(4) a film thickness is 50 to 500 ?m.

US Pat. No. 9,817,499

CONDUCTIVE PATTERN FORMATION METHOD, CONDUCTIVE PATTERN-BEARING SUBSTRATE, AND TOUCH PANEL SENSOR

HITACHI CHEMICAL COMPANY,...

8. A conductive film substrate comprising:
a. a substrate; and
b. a cured resin layer on the substrate, the cured resin layer comprising a first surface opposite the substrate, the first
surface having a portion including a conductive film and a portion without a conductive film, wherein the conductive film
comprises conductive fiber, and

wherein a minimum optical transmittance of the conductive film substrate in a wavelength band of 450 to 650 nm is 80% or higher.

US Pat. No. 10,194,525

MULTILAYER WIRING BOARD, AND METHOD FOR MANUFACTURING MULTILAYER WIRING BOARD

HITACHI CHEMICAL COMPANY,...

1. A multilayer wiring board comprising:an odd number of wiring layers comprising:
a first wiring layer consisting essentially of a metal foil;
a first insulating layer disposed on the first wiring layer;
a central wiring layer disposed on the first insulating layer opposite the first wiring layer, the central wiring layer comprising:
a first side;
a second side opposite the first side;
a metal foil layer; and
a plating layer comprising a first interlayer connection, the first interlayer connection having a cross-sectionally trapezoidal shape comprising a taper penetrating the first insulating layer to establish interlayer connection between the central wiring layer and the first wiring layer,
wherein the metal foil layer of the central wiring layer is thinner than the first wiring layer;
a second insulating layer disposed on the central wiring layer opposite the first insulating layer;
a second wiring layer disposed on-the second insulating layer opposite the central wiring layer, the second wiring layer comprising:
a metal foil layer; and
a plating layer comprising a second interlayer connection, the second interlayer connection having a cross-sectionally trapezoidal shape comprising a taper penetrating the second insulating layer to establish interlayer connection between the central wiring layer and the second wiring layer,
wherein the first interlayer connection is disposed so as to connect to the first side of the central wiring layer and the second interlayer connection is disposed so as to connect to the second side of the central wiring layer, and direction of the tapers of the cross-sectionally trapezoidal shapes of the first and second interlayer connections are identical,
a third insulating layer disposed on the first wiring layer of the odd number of wiring layers opposite the first insulating layer of the odd number of wiring layers; and
a third wiring layer disposed on the third insulating layer opposite the first wiring layer of the odd number of wiring layers,
a third interlayer connection having a cross-sectionally trapezoidal shape comprising a taper penetrating the third insulating layer to establish interlayer connection between the first wiring layer of the odd number of wiring layers and the third wiring layer, wherein the third interlayer connection penetrates the third wiring layer,
wherein the direction of the taper of the cross-sectionally trapezoidal shapes of each of the first and second interlayer connections and a direction of the taper of the cross-sectionally trapezoidal shape of the third interlayer connection are opposite each other,
a fourth insulating layer disposed on the second wiring layer of the odd number of wiring layers opposite the second insulating layer; and
a fourth wiring layer disposed on the fourth insulating layer opposite the second wiring layer of the odd number of wiring layers, and
a fourth interlayer connection having a cross-sectionally trapezoidal shape comprising a taper penetrating the fourth insulating layer to establish interlayer connection between the second wiring layer of the odd number of wiring layers and the fourth wiring layer,
wherein the direction of the taper of the cross-sectionally trapezoidal shapes of each of the first and second interlayer connects and a direction of the taper of the cross-sectionally trapezoidal shape of the fourth interlayer connection are identical, and
wherein each outermost layer of the multilayer wiring board is a wiring layer including a circuit pattern.