US Pat. No. 10,123,453

ELECTRONIC APPARATUS COOLING SYSTEM

EXASCALER INC., Tokyo (J...

1. A cooling system for directly cooling a plurality of electronic apparatuses through immersion into cooling liquid, the cooling system comprising:a cooling tank having an open space defined by a bottom wall and side walls;
a plurality of storage sections defined by a plurality of inner partitioning walls provided within the cooling tank to divide the open space, the storage sections being for storing at least one electronic apparatus in each of the storage sections, the plurality of storage sections arranged in a two-dimensional array; and
an inflow opening and an outflow opening for the cooling liquid that are formed at each of the of storage sections;
wherein the inflow opening is formed at a bottom portion or a side surface of each of the storage sections and wherein the outflow opening is formed in a vicinity of the liquid level of the cooling liquid flowing through each of the storage sections, and
the outflow opening and/or the inflow opening is formed at a position where the plurality of inner partitioning walls defining each storage section intersect with one another.

US Pat. No. 10,123,454

ELECTRONIC-DEVICE COOLING SYSTEM

EXASCALER INC., Tokyo (J...

1. A cooling system for directly cooling an electronic device through immersion in a cooling liquid, the cooling system comprising:a boiling cooling device thermally connected to at least one heating element possessed by the electronic device and enclosing a first cooling liquid having a boiling point T1;
a cooling tank containing a second cooling liquid having a boiling point T2 (T2=T1 or T2>T1) being the same as the boiling point T1 of the first cooling liquid or being higher than the boiling point T1 of the first cooling liquid wherein the boiling cooling device and the electronic device are immersed in the second cooling liquid to be cooled directly; and
a first heat exchanger enclosing a third refrigerant having a boiling point T3 (T3=T1 or T3

US Pat. No. 10,194,559

ELECTRONIC APPARATUS AND COOLING SYSTEM FOR ELECTRONIC APPARATUS

EXASCALER INC., Tokyo (J...

1. An electronic apparatus which is directly cooled through immersion in a cooling liquid filled in a cooling system, in which:the electronic apparatus is stored in each of a plurality of arrayed storage sections of the cooling system;
the cooling system includes a cooling tank having an open space defined by a bottom wall and side walls, the plurality of storage sections defined by dividing the open space with a plurality of inner partitioning walls arranged in the cooling tank, and an inflow opening and an outflow opening for the cooling liquid that are formed at each of the plurality of arrayed storage sections;
the inflow opening is formed in a bottom portion or a side surface of the storage sections, and the outflow opening is formed in a vicinity of the liquid level of the cooling liquid which circulates through a respective one of the storage sections;
the electronic apparatus comprising:
a first board having a first surface on which at least one processor is mounted, and a second surface opposite the first surface;
a second board having a third surface that faces the second surface of the first board;
a flow channel formed as a gap between the second surface of the first board and the third surface of the second board; and
a plurality of spacers and a plurality of screws for retaining the gap, wherein each of the screws penetrates through the first board, the second board, and the spacers for fixation,
wherein:
the first board or the second board includes at least one connector,
the connector is electrically coupled with a power source line or a signal line provided for a pair of board retainers which retain any one or both of the first board and the second board in the respective one of the storage sections.

US Pat. No. 10,306,799

ELECTRONIC DEVICE FOR LIQUID IMMERSION COOLING AND COOLING SYSTEM USING THE SAME

EXASCALER INC., Tokyo (J...

1. An electronic device that is immersed in a coolant filled in a cooling apparatus, and directly cooled, the electronic device being configured to be housed in each of a plurality of housing parts of the cooling apparatus, the electronic device comprising:a metal board held with a pair of board retainers disposed in the housing part; and
one or more substrate groups attached to a first surface of the metal board and a second surface opposite the first surface, wherein the substrate group includes one or more first circuit boards, each including a plurality of sockets for mounting a plurality of processors and main memories on one surface of a substrate, and a component for interconnecting the processors, a second circuit board including a mother board component which includes at least a chipset for controlling the main memory, but does not include the sockets for mounting the processors and the main memories, and the component for interconnecting the processors, a connector for electrically connecting between the one or more first circuit boards and the second circuit board, and a flow channel formed in a gap between a surface opposite the one surface of the one or more first circuit boards, and one surface of the second circuit board, which faces the surface opposite the one surface of the one or more first circuit boards.