US Pat. No. 9,293,364

ELECTROLESS PLATING APPARATUS AND ELECTROLESS PLATING METHOD

Ebara Corporation, Tokyo...

1. An electroless plating apparatus comprising:
a pre-plating treatment module including a pre-plating treatment tank for carrying out a pre-plating treatment of a plurality
of substrates, a water-cleaning tank for cleaning with water the substrates after the pre-plating treatment, and a substrate
holder for supporting the lower sides of the substrates and transporting the substrates between the tanks;

a plating module including a plating tank for carrying out electroless plating of the substrates after the pre-plating treatment,
a water-cleaning tank for cleaning with water the substrates after the electroless plating, and a substrate holder for supporting
the lower sides of the substrates and transporting the substrates between the tanks; and

an inter-module substrate transport device for gripping the substrates from above and transporting the substrates between
the pre-plating treatment module and the plating module,

wherein the pre-plating treatment tank is provided with a pre-plating treatment solution circulation line having a temperature
control function for a pre-plating treatment solution, and

the plating tank is provided with a plating solution circulation line having a filter and a temperature control function for
a plating solution, the plating solution circulation line being connected to a flushing line for flushing an interior of the
plating solution circulation line and an interior of the plating tank.

US Pat. No. 9,058,977

SUBSTRATE CLEANING APPARATUS AND SUBSTRATE CLEANING METHOD

EBARA CORPORATION, Tokyo...

1. A substrate cleaning apparatus for cleaning a surface of a substrate, comprising:
a substrate holding mechanism configured to hold and rotate the substrate;
a cleaning member having a lower-end contact surface;
a member configured to hold the cleaning member and move the cleaning member in one direction while said cleaning member is
being rotated about a vertically extending rotational axis; and

a cleaning liquid supply nozzle configured to supply a cleaning liquid to the surface of the substrate;
wherein said cleaning member is configured to scrub-clean the surface of the substrate by rubbing said lower-end contact surface
of said cleaning member against the surface of the substrate which is being rotated by the substrate holding mechanism in
a horizontal plane in the presence of the cleaning liquid;

said cleaning member has an inverted truncated-cone shape wherein the angle ? between said lower-end contact surface and a
straight line on an outer circumferential surface of said cleaning member is larger than 90° and is not more than 150°; and

said cleaning member is moved in said one direction while the rotational axis of said cleaning member is inclined in the same
direction as the moving direction of said cleaning member.

US Pat. No. 9,429,166

SEALING STRUCTURE, VACUUM PUMP MOTOR INCLUDING SAME SEALING STRUCTURE, AND VACUUM PUMP

EBARA CORPORATION, Tokyo...

1. A sealing structure for a vacuum pump motor, comprising:
a lead wire which passes through an opening formed in a motor frame, wherein the lead wire is configured to be connected to
a motor stator; and

a seal member which seals the opening, wherein
the lead wire comprises core wires and a covering which covers the core wires, wherein a seal is formed around at least part
of the core wires inside the covering, and wherein

the seal comprises a sealing treatment in which part of the covering is removed to partially integrate intermediate portions
of the core wires into a single wire assembly through soldering, the intermediate portions being any portions other than ends
of the core wires, and wherein the seal is covered by a heat-shrinkable tube via a sealing medium.

US Pat. No. 9,233,449

POLISHING METHOD, POLISHING APPARATUS AND GAN WAFER

OSAKA UNIVERSITY, Osaka ...

1. A polishing method comprising:
preparing a Ga element-containing compound semiconductor substrate, whose surface has raised portions and recessed portions;
immersing the substrate in a processing solution comprising a buffer solution containing Ga ions, a concentration of the Ga
ions being in a range of 10 ppm to 100 ppm, and the buffer solution having a pH in a range of 6 to 8;

irradiating the surface of the substrate with light or applying a bias potential to the substrate, or applying a bias potential
to the substrate while irradiating the surface of the substrate with light, thereby forming Ga oxide on the surface of the
substrate in the processing solution; and

rotating the substrate and a polishing tool with respect to each other to selectively polish and remove the Ga oxide formed
on the raised portions of the surface of the substrate,

wherein the processing solution contains oxygen dissolved therein, and
wherein the processing solution does not comprise nitrogen dissolved from any Ga element-containing compound semiconductor
substrate.

US Pat. No. 9,142,398

SUBSTRATE PROCESSING METHOD

Ebara Corporation, Tokyo...

1. A substrate processing method comprising:
pressing a substrate against a polishing surface while supplying slurry onto the polishing surface to polish the substrate
until a structure including at least a dielectric film is formed on the polished surface of the substrate;

rotating the substrate having the polished surface about a central axis thereof;
starting irradiation of the polished surface of the substrate with soft X-rays;
simultaneously with or after starting the irradiation of the polished surface of the substrate with the soft X-rays, starting
supply of pure water onto the polished surface of the substrate, wherein said irradiation with the soft X-rays and said supplying
of the pure water onto the polished surface suppresses electrostatic charge on the dielectric film;

stopping the supply of the pure water onto the polished surface of the substrate; and then
stopping the irradiation of the polished surface of the substrate with the soft X-rays.

US Pat. No. 9,376,760

PLATING APPARATUS AND METHOD OF CLEANING SUBSTRATE HOLDER

Ebara Corporation, Tokyo...

1. A plating apparatus comprising:
a plating bath configured to store a plating solution therein;
a substrate transport device configured to remove a substrate before plating from a substrate cassette and return the substrate
after plating to the substrate cassette;

a substrate holder configured to detachably hold the substrate with a sealing member sealing a peripheral portion of the substrate
and immerse the substrate in the plating solution in the plating bath;

a dummy substrate arranged in a position accessible by the substrate transport device; and
a substrate holder cleaning bath configured to immerse the substrate holder in a cleaning liquid to clean the substrate holder
when holding the dummy substrate with the sealing member sealing a peripheral portion of the dummy substrate.

US Pat. No. 9,239,056

PUMP IMPELLER AND SUBMERSIBLE PUMP HAVING SUCH PUMP IMPELLER

EBARA CORPORATION, Tokyo...

1. A non-clogging type pump impeller, comprising:
an approximately cylindrical body having an attachment boss formed on a center of a first end surface of said approximately
cylindrical body;

a suction port provided a second end surface of said approximately cylindrical body, said first end surface and said second
end surface being arranged along an axial direction;

a discharge port having an opening on a side surface of said approximately cylindrical body; and
a fluid passage provided in said approximately cylindrical body and connecting said suction port to said discharge port, said
fluid passage having a vortex shape as viewed from the axial direction,

wherein a recess is formed on said first end surface of said approximately cylindrical body so as to surround said attachment
boss, said recess being sunk in the axial direction, and

wherein said pump impeller has at least one communication hole providing fluid communication between said recess and a region
on said second end surface of said approximately cylindrical body, said region being located outside said suction port.

US Pat. No. 9,233,448

ADJUSTING A SUBSTRATE POLISHING CONDITION

Ebara Corporation, Tokyo...

1. A method for adjusting a polishing condition, said method comprising:
providing a polishing pad to polish a substrate, a top ring to hold the substrate, and a retaining ring to be arranged around
the substrate;

measuring an elastic modulus of the polishing pad; and
adjusting a pressure of the retaining ring exerted on the polishing pad based on a first relationship between a measured value
of the elastic modulus and the pressure of the retaining ring.

US Pat. No. 9,287,158

SUBSTRATE PROCESSING APPARATUS

EBARA CORPORATION, Tokyo...

1. A substrate processing method comprising:
measuring a peripheral portion of a substrate in a measurement unit to obtain a measurement value, said measuring comprising
measuring a cross-sectional shape of the peripheral portion of the substrate;

determining first polishing conditions for an upper inclined portion of a bevel portion, a lower inclined portion of the bevel
portion, and a side surface of the bevel portion, said determining the first polishing conditions being based on the measurement
value obtained by said measuring of the peripheral portion of the substrate in the measurement unit;

predicting a polished shape of the peripheral portion of the substrate by calculating an expected polishing amount based on
the cross-sectional shape of the peripheral portion of the substrate and the first polishing conditions;

judging from the predicted polishing shape whether unpolished portions of the peripheral portion of the substrate will be
produced at a first boundary between the upper inclined portion of the bevel portion and the side surface of the bevel portion
and at a second boundary between the lower inclined portion of the bevel portion and the side surface of the bevel portion;

determining based on said judging that the unpolished portions will be produced; and
determining second polishing conditions for polishing the unpolished portions of the upper inclined portion of a bevel portion,
the lower inclined portion of the bevel portion, the side surface of the bevel portion, the first boundary, and the second
boundary, the second polishing conditions including the first polishing conditions and additional polishing conditions; and

polishing the peripheral portion of the substrate based on the second polishing conditions by pressing a polishing tape held
by a polishing head against the peripheral portion of the substrate in a polishing unit.

US Pat. No. 9,194,903

SURFACE POTENTIAL MEASURING APPARATUS AND SURFACE POTENTIAL MEASURING METHOD

Ebara Corporation, Tokyo...

1. An apparatus for measuring a surface potential of an object on an underlying structure, the apparatus comprising:
a probe;
an electric potential measuring device configured to measure the surface potential through the probe;
a first support member configured to support the underlying structure;
a second support member configured to support a reference structure having the same construction as the underlying structure;
a ground wire configured to ground the first support member and the second support member;
a relatively-moving mechanism configured to move the probe and the first support member relative to each other and to move
the probe and the second support member relative to each other; and

a controller configured to control operations of the electric potential measuring device and the relatively-moving mechanism,
the controller being configured to
command the relatively-moving mechanism to move the probe and the second support member relative to each other until the probe
faces the reference structure on the second support member,

command the electric potential measuring device to measure the surface potential of the reference structure through the probe,
calibrate the electric potential measuring device such that a measured value of the surface potential of the reference structure
becomes 0,

command the relatively-moving mechanism to move the probe and the first support member relative to each other until the probe
faces the object after the calibration, and

command the electric potential measuring device to measure the surface potential of the object through the probe.

US Pat. No. 9,144,878

POLISHING APPARATUS AND WEAR DETECTION METHOD

EBARA CORPORATION, Tokyo...

8. A wear detection method of detecting wear of a polishing pad disposed in a polishing table for use in a polishing apparatus,
the wear detection method comprising:
a step of detecting, every predetermined time, a value of rotation speed of a table drive shaft for rotationally driving the
polishing table, a value of rotation torque of the table drive shaft, a value of rotation speed of a dresser drive shaft for
rotationally driving a dresser, a value of rotation torque of the dresser drive shaft, or a value of swing torque of a dresser
swing shaft for swinging the dresser;

a step of calculating a change quantity of values of rotation speed of the table drive shaft, a change quantity of values
of rotation torque of the table drive shaft, a change quantity of values of rotation speed of the dresser drive shaft, a change
quantity of values of rotation torque of the dresser drive shaft, or a change quantity of values of swing torque of the dresser
swing shaft based on the detected value(s); and

a step of determining whether or not the change quantity exceeds a predetermined value.

US Pat. No. 9,136,091

ELECTRON BEAM APPARATUS FOR INSPECTING A PATTERN ON A SAMPLE USING MULTIPLE ELECTRON BEAMS

Ebara Corporation, Tokyo...

1. An electron beam apparatus for inspecting a surface of a sample using an electron beam, comprising:
a processor for calculating coordinate errors ?x and ?y of a measured XY coordinate (x, y) of each of arbitrary reference
points on the sample surface from a calculated ideal position XY coordinate of the reference point, and an orthogonal error
of the XY coordinates based on the calculated coordinate errors ?x and ?y; and

means for compensating the measured XY coordinates (x, y) on the basis of the calculated orthogonal error upon inspecting
the sample,

wherein the calculation of the orthogonal error of the XY coordinates comprises:
recursive processing for obtaining coefficients a1˜e1 and a2˜e2 which satisfy the following Equations (1) and (2), through recursive processing,

?x=a1+b1x+c1y+d1x2+e1y2  (1)

?y=a2+b2x+c2y+d2x2+e2y2  (2); and

calculating the orthogonal error of the XY coordinates as a difference between the obtained coefficients c1 and b2.

US Pat. No. 9,108,162

SEAWATER DESALINATION SYSTEM AND ENERGY EXCHANGE CHAMBER

EBARA CORPORATION, Tokyo...

1. An energy exchange chamber for utilizing pressure energy of concentrated seawater discharged from a reverse-osmosis membrane-separation
apparatus as energy for pressurizing seawater in a seawater desalination system for producing fresh water from the seawater
by passing the seawater pressurized by a pump through said reverse-osmosis membrane-separation apparatus to separate the seawater
into fresh water and concentrated seawater, said energy exchange chamber comprising:
a cylinder configured to define a chamber therein;
a concentrated seawater port configured to introduce and discharge the concentrated seawater;
a seawater port configured to introduce and discharge the seawater,
a first flow regulator and a second flow regulator disposed adjacent to each other in said chamber so as to be spaced apart
from said concentrated seawater port, said first flow regulator and said second flow regulator being spaced apart from each
other at a certain distance; and

a third flow regulator and a fourth flow regulator disposed adjacent to each other in said chamber so as to be spaced apart
from said seawater port, said third flow regulator and said fourth flow regulator being spaced apart from each other at a
certain distance,

wherein each of said first flow regulator, said second flow regulator, said third flow regulator and said fourth flow regulator
comprises a porous plate configured to regulate a flow by a porosity of said porous plate, and said porous plate comprises
a perforated plate configured to have a plurality of holes perforated across an entire area of said porous plate.

US Pat. No. 9,434,044

POLISHING APPARATUS

Ebara Corporation, Tokyo...

1. A polishing apparatus comprising:
a polishing table having a polishing surface;
a top ring having a substrate holding surface to hold a beck surface of a substrate and a retaining ring to retain the substrate
on the substrate holding surface, the top ring being configured to hold the substrate and to press the substrate against the
polishing surface;

an imaging device configured to image an inner circumferential surface of the retaining ring; and
an image processor configured to process an image obtained by the imaging device to judge whether there is a foreign matter
on the inner circumferential surface of the retaining ring.

US Pat. No. 9,370,852

PRESSURE REGULATOR AND POLISHING APPARATUS HAVING THE PRESSURE REGULATOR

EBARA CORPORATION, Tokyo...

1. A pressure regulator comprising:
a pressure regulation valve configured to regulate a pressure of a fluid supplied from a fluid supply source;
a first pressure sensor configured to measure the pressure regulated by the pressure regulation valve;
a second pressure sensor located downstream of the first pressure sensor;
a PID controller configured to produce a corrective command value for eliminating a difference between a pressure command
value inputted from an external device and a second pressure value of the fluid measured by the second pressure sensor, the
PID controller being configured to stop producing the corrective command value from a point in time when the pressure command
value has changed until a PID control starting point and to produce the corrective command value after the PID control starting
point that represents a moment at which a preset delay time has elapsed; and

a regulator controller configured to control operation of the pressure regulation valve so as to eliminate a difference between
a first pressure value of the fluid measured by the first pressure sensor and one of the pressure command value and the corrective
command value, the regulator controller being configured to control the operation of the pressure regulation valve so as to
eliminate the difference between the pressure command value and the first pressure value from the point in time when the pressure
command value has changed until the PID control starting point, and to control the operation of the pressure regulation valve
so as to eliminate the difference between the corrective command value and the first pressure value after the PID control
starting point.

US Pat. No. 9,156,130

METHOD OF ADJUSTING PROFILE OF A POLISHING MEMBER USED IN A POLISHING APPARATUS, AND POLISHING APPARATUS

Ebara Corporation, Tokyo...

1. A method of adjusting a profile of a polishing member used in a polishing apparatus for a substrate, the method comprising:
dressing the polishing member by oscillating a dresser on the polishing member;
measuring a surface height of the polishing member at each of plural oscillation sections which are defined in advance on
the polishing member along an oscillation direction of the dresser;

calculating a difference between a current cutting rate obtained from measured values of the surface height and a target cutting
rate of the polishing member; and

correcting moving speeds of the dresser in the plural oscillation sections so as to eliminate the difference.

US Pat. No. 9,134,261

INSPECTION APPARATUS

EBARA CORPORATION, Tokyo...

1. An inspection apparatus, comprising:
beam generation means for generating any of charged particles and electromagnetic waves as a beam;
a primary optical system that guides the beam into an inspection object held on a movable stage in a working chamber and irradiates
the inspection object with the beam;

a secondary optical system that detects secondary charged particles occurring from the inspection object;
an image processing system that forms an image on the basis of the detected secondary charged particles;
a linear motor that drives the movable stage;
a Helmholtz coil that causes a magnetic field for canceling a magnetic field caused by the linear motor when the movable stage
is driven;

current detection means for detecting drive current for driving the linear motor; and
magnetic field control means for controlling an intensity of a magnetic field caused by the Helmholtz coil according to the
drive current detected by the current detection means.

US Pat. No. 9,297,088

ELECTROPLATING METHOD AND ELECTROPLATING APPARATUS FOR THROUGH-HOLE

Ebara Corporation, Tokyo...

1. An electroplating method for a through-hole, the method comprising:
immersing a substrate having a through-hole into a plating solution; and
supplying a plating current between the substrate and anodes to perform a first plating process, a second plating process,
and a third plating process successively, the anodes being arranged so as to face a front surface and a back surface of the
substrate,

wherein the first plating process is a plating process of forming a metal film with a uniform thickness in the through-hole
to reduce a diameter of the through-hole, the plating current used in the first plating process being a PR pulsed current
constituted by a forward current used in metal deposition and a reverse current used in metal dissolution which are generated
alternately,

the second plating process is a plating process of blocking up a central portion of the through-hole with the metal film using
a PR pulsed current constituted by a forward current used in metal deposition and a reverse current used in metal dissolution
which are generated alternately, a forward-current value of the PR pulsed current in the second plating process is smaller
than a value of the forward current used in metal deposition in the first plating process, and

the third plating process is a plating process of completely filling the through-hole with the metal film using a plating
current whose value is larger than the forward-current value of the PR pulsed current used in the second plating process.

US Pat. No. 9,249,562

WATER SUPPLY APPARATUS

EBARA CORPORATION, Tokyo...

1. A water supply apparatus, comprising:
a plurality of pumps;
a plurality of motors configured to drive said plurality of pumps;
a plurality of inverters each configured for variable rotational speed control of a corresponding one of said plurality of
motors; and

a first control board and a second control board each configured to control said plurality of inverters,
wherein when an abnormality occurs in said first control board, said second control board backs up said first control board
to thereby allow said water supply apparatus to continue its operations,

wherein multiple sets of power supply systems, multiple sets of signal systems, and multiple sets of control systems are connected
to said first control board and said second control board, and

wherein in at least one of said power supply systems, said signal systems, and said control systems, one of said multiple
sets has a different level of resistance to external causes from a level of resistance to the external causes of other of
said multiple sets.

US Pat. No. 9,390,986

POLISHING APPARATUS AND POLISHING METHOD

Ebara Corporation, Tokyo...

1. A polishing apparatus comprising:
a polishing table for supporting a polishing pad;
a top ring configured to apply pressures separately to zones on a back surface of a substrate to press a front surface of
the substrate against the polishing pad;

a film-thickness sensor configured to obtain a film-thickness signal that varies in accordance with a film thickness of the
substrate; and

a polishing controller configured to manipulate the pressures,
the polishing controller is configured to calculate indexes of a remaining film thickness in zones on the front surface of
the substrate, manipulate the pressures based on the indexes for controlling a distribution of the remaining film thickness,
and update at least one of control parameters using polishing data obtained during polishing of the substrate, the control
parameters being used in controlling of the distribution of the remaining film thickness, the at least one of control parameters
comprising a ratio of a changing rate of each index to corresponding one of the pressures.

US Pat. No. 9,364,786

EXHAUST GAS ABATEMENT APPARATUS

Ebara Corporation, Tokyo...

1. An apparatus for abating exhaust gas, comprising:
a vacuum pump having a discharge port;
an abatement chamber coupled to the discharge port for treating an exhaust gas discharged from the vacuum pump to make the
exhaust gas harmless is attached; and

a heat exchanger configured to heat an inert gas by using heat generated when the exhaust gas is treated to be made harmless
in the abatement part:

wherein the heat exchanger comprises a plurality of heat exchange stages, and a switch controlling a number of stages of the
plurality of heat exchange stages by which the inert gas is heated to control a temperature of the inert gas; and

wherein the inert gas heated by the heat exchanger is introduced into the vacuum pump.

US Pat. No. 9,291,155

VACUUM PUMP MOTOR AND VACUUM PUMP HAVING BALANCE RINGS

EBARA CORPORATION, Tokyo...

1. A vacuum pump motor which is coupled to a pump main shaft of a vacuum pump, comprising:
a motor rotor which is disposed directly or indirectly on the pump main shaft;
a motor stator which is fixed to a motor frame concentrically with respect to a rotating axis of the pump main shaft; and
balance rings each of which includes a first portion extending in a direction of the rotating axis of the pump main shaft,
and wherein each first portion is disposed directly or indirectly on to make contact with the pump main shaft, and wherein
the balance rings each include a second portion extending in a direction at a right angle to the rotating axis of the pump
main shaft, wherein the second portions are disposed at opposite ends of the pump main shaft, and further wherein the second
portions are spaced apart from opposite end portions of a rotor core, wherein the balance rings contain a material having
anticorrosion properties, wherein each of the balance rings has an L-shaped cross-section formed by the first portion and
the second portion, and wherein end rings are provided at opposite end portions of the rotor core such that a predetermined
gap is defined between the end rings and the first portions of the balance rings and a predetermined gap is defined between
the end rings and the second portions of the balance rings.

US Pat. No. 9,162,337

POLISHING APPARATUS

Ebara Corporation, Tokyo...

1. A polishing apparatus, comprising:
a pure water supply line configured to supply deaerated pure water into the polishing apparatus;
a gas dissolving unit coupled to the pure water supply line and configured to dissolve a gas in the deaerated pure water to
produce gas-dissolved pure water;

a gas-dissolved pure water delivery line coupled to the gas dissolving unit and configured to deliver the gas-dissolved pure
water;

an ultrasonic cleaning unit having a fluid passage coupled to the gas-dissolved pure water delivery line and configured to
impart an ultrasonic vibration energy to the gas-dissolved pure water when flowing in the fluid passage, the fluid passage
having a jet orifice oriented toward at least one of mechanisms of the polishing apparatus; and

a controller configured to control the gas dissolving unit and the ultrasonic cleaning unit.

US Pat. No. 9,089,881

METHOD AND APPARATUS FOR CLEANING SUBSTRATE

EBARA CORPORATION, Tokyo...

1. An apparatus for cleaning a rotating substrate, said apparatus comprising:
a roll-shaped cleaning member for performing a scrubbing process on a surface to be cleaned of the rotating substrate while
holding an outer circumferential surface of the roll-shaped cleaning member in contact with the surface to be cleaned of the
rotating substrate across a predetermined contact width;

a moving mechanism for moving the roll-shaped cleaning member parallel to the surface to be cleaned of the rotating substrate
in a direction perpendicular to a central axis of the roll-shaped cleaning member;

a stopper for stopping movement of the roll-shaped cleaning member at an offset cleaning position at which the roll-shaped
cleaning member performs the scrubbing process, the offset cleaning position being a position at which the central axis of
the roll-shaped cleaning member is horizontally spaced from the central axis of the rotating substrate by a distance which
is 0.14 to 0.5 times the contact width; and

a stop position adjuster for positionally adjusting the stopper.

US Pat. No. 9,469,013

METHOD AND APPARATUS FOR CONDITIONING A POLISHING PAD

Ebara Corporation, Tokyo...

1. A method of conditioning a polishing pad on a polishing table for polishing a thin film formed on a surface of a substrate,
the polishing pad to be brought into contact with the thin film to perform the polishing, said method comprising:
bringing a dresser into contact with the polishing pad, the dresser being capable of wearing down an entire surface of the
polishing pad uniformly when the dresser is moved at an identified standard moving speed, the standard moving speed being
defined as a preset moving speed of the dresser at each of a plurality of radially-extending areas of the polishing pad along
a radial direction of the polishing pad to obtain an identical wear rate over the entire surface of the polishing pad; and

conditioning the polishing pad by moving the dresser between a central part of the polishing pad and an outer circumferential
part of the polishing pad;

wherein a moving speed of the dresser at a predetermined area of the polishing pad is higher than the standard moving speed
of the dresser preset for the predetermined area of the polishing pad; and

wherein the predetermined area of the polishing pad is defined as the area of the polishing pad to be brought into contact
with a portion of the surface of the substrate whereat a polishing rate will be lower than a polishing rate of any other portion
of the surface of the substrate if the predetermined area of the polishing pad was conditioned by moving the dresser at the
standard moving speed.

US Pat. No. 9,399,274

WAFER POLISHING METHOD

Ebara Corporation, Tokyo...

1. A method of manufacturing a semiconductor, comprising:
rotating a semiconductor wafer having a bevel portion and an edge portion, the bevel portion being an outermost circumferential
portion, and the edge portion being a flat portion located radially inwardly of the bevel portion;

applying a first polishing tool against the edge portion of the semiconductor wafer to polish the edge portion; and
applying a second polishing tool against the edge portion of the semiconductor wafer to polish the edge portion, the second
polishing tool being located more inwardly than the first polishing tool with respect to a radial direction of the semiconductor
wafer,

the first polishing tool having a polishing surface more abrasive than a polishing surface of the second polishing tool.

US Pat. No. 9,381,614

PRESSURE REGULATOR, POLISHING APPARATUS HAVING THE PRESSURE REGULATOR, AND POLISHING METHOD

EBARA CORPORATION, Tokyo...

1. A pressure regulator, comprising:
a pressure-regulating valve configured to regulate pressure of a fluid supplied from a fluid supply source;
a first pressure sensor configured to measure the pressure regulated by the pressure-regulating valve;
a second pressure sensor located downstream of the first pressure sensor;
a PID controller configured to produce a correction pressure command value for eliminating a difference between a pressure
command value and a pressure value of the fluid measured by the second pressure sensor; and

a regulator controller configured to control operation of the pressure-regulating valve so as to eliminate a difference between
the correction pressure command value and a pressure value of the fluid measured by the first pressure sensor.

US Pat. No. 9,297,385

VORTEX PREVENTION DEVICE AND DOUBLE SUCTION VERTICAL PUMP HAVING SUCH VORTEX PREVENTION DEVICE

EBARA CORPORATION, Tokyo...

1. A double suction vertical pump installed in an open channel, comprising:
a rotary shaft extending in a vertical direction;
a double suction impeller secured to the rotary shaft;
a casing having a volute chamber that surrounds the double suction impeller;
an upper bell mouth having an upper suction opening;
a lower bell mouth having a lower suction opening, the upper suction opening and the lower suction opening being in fluid
communication with the volute chamber through the double suction impeller;

discharge pipes extending upwardly from the volute chamber;
a column pipe coupled to the discharge pipes; and
a vortex prevention device located above the upper bell mouth, the vortex prevention device being secured to the column pipe
or the discharge pipes.

US Pat. No. 9,165,799

SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING UNIT

EBARA CORPORATION, Tokyo...

1. A substrate processing method of processing a surface of a substrate by moving a fluid nozzle while jetting a single fluid
or a plurality of fluids from the fluid nozzle toward the surface of the rotating substrate, the substrate processing method
comprising:
determining a first time required for the fluid nozzle to move from a processing start position on the surface of the substrate
to a processing end position;

determining a length of movement of the fluid nozzle which moves along at least a part of an entire movement path from the
processing start position to the processing end position, at a movement speed V(r) which satisfies a relational expression
V(r)×r?=C (constant), where V(r) represents the movement speed of the fluid nozzle when the fluid nozzle passes through a position
corresponding to a position on the surface of the substrate at a distance r from a center of the substrate, and ? represents
a power index;

obtaining the power index a from the first time by a predetermined relational equation which represents a relation between
the first time and the power index ?;

calculating the movement speed V(r) of the fluid nozzle which satisfies the relational expression V(r)×r?=C (constant), wherein ? represents the power index obtained from the predetermined relational equation; and

processing the surface of the substrate by moving the fluid nozzle at the calculated movement speed V(r) while jetting a single
fluid or a plurality of fluids from the fluid nozzle toward the surface of the substrate as the substrate rotates.

US Pat. No. 9,142,399

SUBSTRATE CLEANING METHOD

EBARA CORPORATION, Tokyo...

1. A substrate cleaning method comprising:
carrying out primary cleaning of a surface of a substrate by scrub cleaning using a neutral or alkaline liquid chemical as
a cleaning liquid, wherein the surface of the substrate has been polished by chemical mechanical polishing after forming copper
interconnects in the surface of the substrate, and wherein a surface of the copper interconnects is exposed on the surface
of the substrate after polishing;

carrying out finish cleaning of the surface of the substrate by two-fluid jet cleaning, which cleans the surface of the substrate
in a non-contact manner, by jetting carbonated water, comprising pure water or ultrapure water containing dissolved CO2 gas, from a two-fluid nozzle toward the surface of the substrate; and

subsequently carrying out final finish cleaning of the surface of the substrate by scrub cleaning using a neutral or alkaline
liquid chemical as a cleaning liquid, and then drying the surface of the substrate.

US Pat. No. 9,388,504

PLATING APPARATUS AND PLATING METHOD

Ebara Corporation, Tokyo...

1. A plating apparatus, comprising:
a processing bath configured to store a processing liquid therein;
a substrate holder comprising a sealing member configured to hold a substrate with the sealing member, the sealing member
configured to press the substrate and to seal at least a portion of the substrate from contacting the processing liquid;

a transporter configured to immerse the substrate holder comprising the sealing member in the processing liquid stored in
the processing bath, raise the substrate holder comprising the sealing member out of the processing bath, and transport the
substrate holder comprising the sealing member in a horizontal direction;

a suction mechanism configured to suck the processing liquid remaining on the substrate held by the substrate holder; and
a moving mechanism configured to move the suction mechanism relative to the substrate holder,
the suction mechanism being mounted to the moving mechanism, the moving mechanism being mounted to the transporter, and the
transporter being configured to move the suction mechanism and the moving mechanism together with the substrate holder comprising
the sealing member in the horizontal direction while transporting the substrate holder comprising the sealing member in the
horizontal direction.

US Pat. No. 9,388,505

ELECTROCHEMICAL DEPOSITION METHOD

Ebara Corporation, Tokyo...

1. A method of forming a metal film onto a substrate, comprising:
bringing contact ends of electrical contacts into elastic contact with a circumferential surface of the substrate to press
the circumferential surface of the substrate inwardly;

holding the substrate with a substrate holder, the elastic contact between the contact ends of the electrical contacts and
the circumferential surface of the substrate being maintained throughout an entirety of the holding of the substrate;

immersing the substrate, held by the substrate holder, in a plating solution; and
supplying electric energy to the substrate via the electrical contacts to apply a voltage between the substrate and an anode
to thereby plate the substrate.

US Pat. No. 9,388,854

MAGNETIC BEARING APPARATUS AND METHOD FOR REDUCING VIBRATION CAUSED BY MAGNETIC BEARING APPARATUS

EBARA CORPORATION, Tokyo...

1. A magnetic bearing apparatus for supporting a rotational shaft, the magnetic bearing apparatus comprising:
a magnetic bearing for supporting the rotational shaft in a contactless fashion through magnetic levitation by using an electromagnetic
force which is generated by an electric current flown to an electromagnet;

a rotation sensor for detecting the rotation of the rotational shaft;
a controller for controlling the electric current flown to the electromagnet; and
at least one vibration sensor which is provided within an influential range of vibration which is generated by the rotation
of the rotational shaft, wherein

the controller controls the electric current flown to the electromagnet as follows:in a first control mode, a first electric current is flown to the electromagnet for levitating and supporting the rotational
shaft; andin a second control mode, a second electric current is flown to the electromagnet in place of the first electric current at
a first periodic timing which is detected by the rotation sensor so that vibration is reduced to a lower level than a first
vibration value detected in the first control mode in at least one of setting location of the at least one vibration sensor.

US Pat. No. 9,368,322

INSPECTION APPARATUS

EBARA CORPORATION, Tokyo...

1. An inspection apparatus, comprising:
beam generation means that generates any of charged particles and electromagnetic waves as a beam;
a primary optical system that irradiates an inspection object held in a working chamber with the beam;
a secondary optical system that detects secondary charged particles occurring from the inspection object; and
an image processing system that forms an image on the basis of the detected secondary charged particles, wherein
irradiation energy of the beam is set in an energy region where mirror electrons are emitted from the inspection object as
the secondary charged particles due to the beam irradiation,

the secondary optical system comprises a camera for detecting the secondary charged particles, a numerical aperture whose
position is adjustable along an optical axis direction and a lens that forms an image of the secondary charged particles that
have passed through the numerical aperture on an image surface of the camera, and

in the image processing system, the image is formed under an aperture imaging condition where the position of the numerical
aperture is located on an object surface to acquire an image.

US Pat. No. 9,105,444

ELECTRO-OPTICAL INSPECTION APPARATUS AND METHOD WITH DUST OR PARTICLE COLLECTION FUNCTION

EBARA CORPORATION, Tokyo...

1. An electro-optical inspection apparatus for inspecting a surface of a sample using an electron beam, the electro-optical
inspection apparatus comprising:
an electron beam source;
a primary electro-optical system comprising at least a primary lens for inducing a primary electron beam emitted from the
electron beam source;

a stage for mounting the sample thereon, the surface of the sample being irradiated with the primary electron beam induced
through the primary electro-optical system;

a secondary electro-optical system comprising at least a secondary lens and an aperture for defining a numerical aperture
(NA), and for inducing secondary electrons and mirror electrons, the secondary electrons being emitted from the sample surface
when irradiating the sample surface with the primary electron beam, and the mirror electrons being reflected from the sample
surface and a vicinity thereof when irradiating the sample surface with the primary electron beam;

a detector for detecting at least either of the secondary electrons or the mirror electrons induced through the secondary
electro-optical system;

a first power source for supplying a first voltage to the sample mounted on the stage;
an energy control means for setting an energy of the primary electron beam directed to the sample surface and an energy supplied
to the sample such that electrons directed from the sample surface to the detector are within a transition band which contains
the mirror electrons and the secondary electrons;

an aperture adjustment mechanism for adjusting a location of at least the aperture on a plane perpendicular to an axis of
the secondary electro-optical system, so that electrons from a conductive material region of the sample surface and electrons
from a nonconductive material region of the sample surface are selectively induced to the detector;

a first electrode located to surround the sample mounted on the stage, the first electrode for collecting dust or particles;
a second power source for supplying a second voltage to the first electrode, wherein the second voltage has a same polarity
as that of the first voltage and an absolute value which is equal to or larger than that of the first voltage;

a first terminal plate comprising at least two terminals, one of the at least two terminals being connected to the first power
source and another of the at least two terminals being connected to the second power source;

a cable including two electrical wires, first ends of the two electrical wires being connected to the at least two terminals
of the first terminal plate, respectively;

a box containing the first terminal plate therein, a portion of the cable, and a second electrode for collecting dust or particles
in the box, the portion of the cable contained in the box being supported to be flexibly bendable; and

a second terminal plate fixed at the stage and comprising at least two terminals connected to second ends of the two electrical
wires, the at least two terminals of the second terminal plate to supply the first and second voltages to the sample and the
first electrode, wherein a portion of the cable between the box and the second terminal plate is supported to extend linearly,
and the portion of the cable contained in the box bends or extends as the stage is moved.

US Pat. No. 9,068,814

POLISHING MONITORING METHOD, POLISHING APPARATUS AND MONITORING APPARATUS

EBARA CORPORATION, Tokyo...

1. A monitoring method for monitoring a change in thickness of a conductive film brought into sliding contact with a polishing
surface of a polishing pad using an eddy current sensor, the monitoring method comprising:
acquiring an output signal of the eddy current sensor when the eddy current sensor is facing the conductive film, the output
signal comprising two signals corresponding to a resistance component and an inductive reactance component of an impedance
of an electric circuit including a coil of the eddy current sensor;

defining the two signals as a data point on a coordinate system;
repeating said acquiring of the output signal and said defining of the data point on the coordinate system until at least
three data points are obtained;

determining a center of curvature of an arc specified by the at least three data points;
determining a reference angle of inclination of a line connecting the center of curvature and a newest data point of the at
least three data points;

after said determining of the reference angle of inclination, repeating said acquiring of the output signal and said defining
of the data point on the coordinate system;

determining a new center of curvature of an arc specified by a new set of at least three of the data points, including a newest
data point, on the coordinate system each time a new data point is defined on the coordinate system;

determining an angle of inclination of a line connecting the new center of curvature and the new data point of the new set
of at least three data points;

subtracting the reference angle of inclination from the angle of inclination to obtain an increase in the angle of inclination;
and

monitoring a change in thickness of the conductive film by monitoring a change in the increase in the angle of inclination.

US Pat. No. 9,511,476

DRESSER DISK CLEANING BRUSH, CLEANING APPARATUS, AND CLEANING METHOD

EBARA CORPORATION, Tokyo...

1. A dresser disk cleaning brush for cleaning a dresser disk, the cleaning brush comprising:
a brush body having a vertical through-hole into which a first nozzle for ejecting a cleaning fluid and a dust discharge channel
for discharging dust are provided;

a recessed groove formed on a lower surface of the cleaning brush that the lower end of the through-hole faces; and
a plurality of brushes mounted on a top surface of the brush body,
wherein the dust discharge channel has one end open to the top surface of the brush body, and the other end communicating
with the recessed groove.

US Pat. No. 9,440,327

POLISHING APPARATUS AND POLISHING METHOD

Ebara Corporation, Tokyo...

1. A polishing apparatus for polishing a substrate having a film formed thereon, said apparatus comprising:
a polishing table for supporting a polishing pad;
a table motor configured to rotate the polishing table;
a top ring configured to press the substrate against the polishing pad;
an optical sensor configured to irradiate the substrate with light and measure intensity of reflected light from the substrate;
and

a processor configured to produce, from the intensity of the reflected light, a polishing index value that varies in accordance
with a thickness of the film, the processor being configured to monitor a torque current value of the table motor and the
polishing index value and determine a polishing end point based on a point of time when the torque current value has reached
a predetermined threshold value or a point of time when a predetermined distinctive point of the polishing index value has
appeared, whichever comes first, wherein:

the processor stores therein a first detection error range determined from a difference between a predetermined target film
thickness and a film thickness when the predetermined distinctive point of the polishing index value has appeared, and a second
detection error range determined from a difference between the predetermined target film thickness and a film thickness when
the torque current value has reached the predetermined threshold value;

each of the first detection error range and the second detection error range is a detection error range obtained from historical
polishing data with respect to a substrate which is the same type as the substrate to be originally polished; and

the predetermined threshold value is set such that the second detection error range overlaps with the first detection error
range.

US Pat. No. 9,373,528

SUBSTRATE PROCESSING APPARATUS

EBARA CORPORATION, Tokyo...

1. A substrate processing apparatus comprising:
a substrate processing unit configured to process a substrate by supplying a mixed liquid to the substrate, the mixed liquid
being a liquid with a mixture of a first liquid and a second liquid, the second liquid being of a type different from the
first liquid;

a first supply pipe configured to allow the first liquid to flow therethrough;
a first flow rate regulator disposed in the first supply pipe, the first flow rate regulator having a first flow rate measurement
unit and a first flow rate regulation unit, the first flow rate measurement unit being configured to measure a flow rate of
the first liquid by a differential pressure, the first flow rate regulation unit being configured to regulate the flow rate
of the first liquid;

a second supply pipe configured to allow the second liquid to flow therethrough;
a second flow rate regulator disposed in the second supply pipe, the second flow rate regulator having a second flow rate
measurement unit and a second flow rate regulation unit, the second flow rate measurement unit being configured to measure
a flow rate of the second liquid by a differential pressure, the second flow rate regulation unit being configured to regulate
the flow rate of the second liquid;

a mixed liquid pipe configured to guide the mixed liquid to the substrate processing unit, the mixed liquid being a liquid
with a mixture of the first liquid having passed through the first flow rate regulator and the second liquid having passed
through the second flow rate regulator;

a concentration meter disposed in the mixed liquid pipe, the concentration meter being configured to measure a concentration
of the first liquid in the mixed liquid; and

a controller configured to take difference elimination measures when the difference between a conforming concentration and
a concentration measured with the concentration meter exceeds a predetermined value, the conforming concentration being a
concentration of the mixed liquid suitable for processing the substrate in the substrate processing unit.

US Pat. No. 9,308,621

METHOD AND APPARATUS FOR POLISHING A SUBSTRATE

EBARA CORPORATION, Tokyo...

1. A method of polishing a substrate by a polishing apparatus comprising a polishing table having a polishing surface, a top
ring for holding a substrate and pressing the substrate against said polishing surface, and a vertically movable mechanism
for moving said top ring in a vertical direction, wherein said top ring comprises at least one elastic membrane configured
to form a pressure chamber to be supplied with a pressurized fluid, and a top ring body for holding said membrane, said membrane
being configured to press the substrate against said polishing surface under a fluid pressure by supplying the pressurized
fluid to said pressure chamber, said method comprising:
moving said top ring body and said membrane to a first height before the substrate is pressed against said polishing surface,
wherein said first height is a height of said membrane that forms a clearance of 0.1 mm to 1.7 mm between the substrate and
said polishing surface in a state in which the substrate is attached to and held by said membrane and a lower surface of said
top ring body and an upper surface of said membrane are in contact with each other;

pressing the substrate against said polishing surface by supplying the pressurized fluid to said pressure chamber while maintaining
said top ring body at said first height;

moving said top ring body to a second height while the substrate continues to be pressed against said polishing surface, wherein
said second height is a height of said top ring body to form a clearance of 0.1 mm to 2.7 mm between said top ring body and
said membrane in a state in which the substrate is pressed against said polishing surface by said membrane; and

polishing the substrate in a state in which said top ring body is kept at the second height and the substrate is pressed against
the polishing surface.

US Pat. No. 9,272,389

POLISHING APPARATUS AND POLISHING METHOD

Ebara Corporation, Tokyo...

1. A polishing apparatus comprising:
a polishing table for supporting a polishing pad;
a table motor configured to rotate the polishing table;
a top ring configured to press a substrate against the polishing pad to polish the substrate;
a dresser configured to dress the polishing pad while oscillating on the polishing pad during polishing of the substrate;
a filtering device configured to obtain an output current signal which indicates an electric current flowing into the table
motor when the table motor is rotating the polishing table and to remove a vibration component, having a frequency corresponding
to an oscillation period of the dresser, from the output current signal of the table motor; and

a polishing monitoring device configured to monitor a progress of polishing of the substrate based on the output current signal
from which the vibration component has been removed.

US Pat. No. 9,376,758

ELECTROPLATING METHOD

EBARA CORPORATION, Tokyo...

1. An electroplating method comprising:
immersing a substrate, having vias formed in a surface, and an anode in a plating solution in a plating tank, the anode being
disposed opposite the surface of the substrate, and the plating solution containing an additive therein; and

intermittently passing a plating current at a constant current value between the substrate and the anode in such a manner
that only a supply of the plating current and a stop of the plating current are repeated, the stop being such that no current
is passed between the substrate and the anode, and such that the proportion of a current supply time during which the plating
current is supplied at the constant current value increases with the progress of plating, thereby filling a plated metal into
the vias;

wherein the constant current value of the plating current is maintained at a current value such that a current density at
the anode is in a range for suppressing a consumption of the additive.

US Pat. No. 9,340,891

PLATING METHOD AND PLATING APPARATUS

Ebara Corporation, Tokyo...

1. A method of plating a substrate while holding the substrate by a substrate holder having a first holding member and a second
holding member which has an opening, said method comprising:
holding the substrate with the substrate holder by supporting one surface of the substrate with the first holding member while
placing the second holding member in contact with other surface of the substrate, with the other surface of the substrate
exposed through the opening of the second holding member;

sealing a gap between the first holding member and the second holding member by a first protruding portion of the second holding
member while sealing a peripheral portion of the substrate by a second protruding portion of the second holding member when
the substrate is held by the substrate holder, thereby forming an internal space in the substrate holder by the first holding
member, the second holding member, and the substrate;

performing a first-stage leakage test of the substrate holder by producing a vacuum in the internal space and checking whether
pressure in the internal space reaches a predetermined vacuum pressure within a certain period of time to check a sealed state
provided by the first protruding portion and the second protruding portion;

if the substrate holder has passed the first-stage leakage test, performing a second-stage leakage test of the substrate holder,
which is holding the substrate, by closing off the internal space after producing the vacuum therein and checking whether
a change in the pressure in the internal space becomes equal to or larger than a predetermined value within a certain period
of time to further check the sealed state provided by the first protruding portion and the second protruding portion; and

plating the substrate using the substrate holder that has passed the second-stage leakage test.

US Pat. No. 9,194,826

ELECTRON BEAM APPARATUS AND SAMPLE OBSERVATION METHOD USING THE SAME

EBARA CORPORATION, Tokyo...

8. A sample observation method of observing a sample based on an acquired image, comprising:
mounting the sample on a stage;
moving the stage in a moving direction;
generating an electron beam having an irradiation area to irradiate the electron beam onto the sample; and
acquiring an image of the sample about a viewing area by detecting electrons which have been generated through irradiation
of the electron beam and have acquired structural information of the sample, wherein

the irradiation area includes a pre-charge area which precedes the viewing area in a moving direction of the sample,
a pre-charge in the pre-charge area and the detection of electrons from the viewing area are conducted simultaneously when
the stage is moving.

US Pat. No. 9,175,416

SUBSTRATE HOLDER AND PLATING APPARATUS

Ebara Corporation, Tokyo...

1. A substrate holder comprising:
a first holding member and a second holding member, both for detachably holding a substrate by holding a peripheral portion
of the substrate therebetween,

wherein the second holding member has a protruding portion which, when the substrate is held by the first holding member and
the second holding member, seals the peripheral portion of the substrate along a substrate sealing line,

wherein the first holding member has a support base, a movable base provided separately from the support base and having an
annular support surface which is able to touch the peripheral portion of the substrate for supporting the substrate,

wherein a gap is formed between the support base and the moveable base, and a thickness absorbing mechanism which, when the
substrate is held by the first holding member and the second holding member, biases the substrate on the annular support surface
toward the second holding member at positions along the substrate sealing line in order to absorb a change in the thickness
between substrates,

wherein the thickness absorbing mechanism is disposed between the support base and the movable base, and
wherein the second holding member is provided with a first contact member for contact with the peripheral portion of the substrate,
held between the first holding member and the second holding member, to supply electricity to the substrate, and the support
base of the first holding member is provided with a second contact member connected to an external power source to supply
electricity to the first contact member.

US Pat. No. 9,248,543

METHOD OF DETECTING ABNORMALITY IN POLISHING OF A SUBSTRATE AND POLISHING APPARATUS

Ebara Corporation, Tokyo...

1. A method of detecting an abnormality in polishing of an edge portion of a substrate, said method comprising:
rotating the substrate;
pressing a polishing tool against the edge portion of the substrate to polish the edge portion;
measuring a position of the polishing tool relative to a surface of the substrate;
determining an amount of polishing of the substrate from the position of the polishing tool;
calculating a polishing rate from the amount of polishing of the substrate; and
judging whether or not an abnormality in polishing of the edge portion of the substrate has occurred, the abnormality occurring
if a number of times the polishing rate goes beyond a predetermined range reaches a predetermined number.

US Pat. No. 9,156,122

METHOD AND APPARATUS FOR MONITORING A POLISHING SURFACE OF A POLISHING PAD USED IN POLISHING APPARATUS

EBARA CORPORATION, Tokyo...

1. A method of monitoring a polishing surface of a polishing pad for use in a polishing apparatus, said method comprising:
conditioning the polishing surface of the polishing pad by causing a rotating dresser to oscillate on the polishing surface;
measuring a height of the polishing surface at a measuring point while said conditioning of the polishing surface is performed;
calculating a position of the measuring point of the height on a two-dimensional surface defined on the polishing surface;
associating the calculated position of the measuring point with a measured value of the height;
repeating said measuring, said calculating, and said associating at a plurality of different points on the polishing surface
of the polishing pad to obtain a set of measured values of the height and associated positions of the measured values;

creating a height distribution of the polishing surface based on the set of measured values of the height and the associated
positions of the measured values;

creating a distribution of irregular detected points of the height of the polishing surface from the height distribution;
and

evaluating said conditioning of the polishing pad based on the distribution of the irregular detected points.

US Pat. No. 9,506,162

ELECTROCHEMICAL DEPOSITION METHOD

Ebara Corporation, Tokyo...

1. A substrate holder for detachably holding a substrate having a surface to be electroplated, said substrate holder comprising:
a fixed holding member and a movable holding member for holding a substrate therebetween, the movable holding member having
a seal portion for sealing an area surrounding a peripheral edge of the substrate when the movable holding member is pressed
against the fixed holding member; and

a springy leaf spring member, mounted to the fixed holding member, which has a free end capable of contacting a surface or
the peripheral edge of the substrate when the substrate is held between the movable holding member and the fixed holding member,
the free end being located outwardly of the peripheral edge of the substrate when the holding of the substrate between the
movable holding member and the fixed holding member is released.

US Pat. No. 9,105,445

INSPECTION SYSTEM, INSPECTION IMAGE DATA GENERATION METHOD, INSPECTION DISPLAY UNIT, DEFECT DETERMINATION METHOD, AND STORAGE MEDIUM ON WHICH INSPECTION DISPLAY PROGRAM IS RECORDED

EBARA CORPORATION, Tokyo...

1. An inspection system comprising:
a primary optical system configured to irradiate either of a charged particle and an electromagnetic wave as a beam;
a movable unit configured to hold an inspection target and move the inspection target through a position where the beam is
irradiated by the primary optical system in a predetermined direction;

a TDI sensor configured to integrate an amount of secondary charged particles in a predetermined direction through a time
delay integration to sequentially transfer the integrated amount of secondary charged particles as an integrated detection
amount, the secondary charged particles being obtained by irradiating the beam onto the inspection target while moving the
movable unit in the predetermined direction; and

a prevention module configured to prevent an arrival of the beam at the inspection target side or an arrival of the secondary
charged particles at the TDI sensor during a time period from one transfer to the following transfer after the elapse of a
predetermined length of time from the one transfer and until the following transfer.

US Pat. No. 10,071,458

CALIBRATION APPARATUS AND CALIBRATION METHOD

EBARA CORPORATION, Tokyo...

1. A calibration apparatus for use in a bevel polishing apparatus, the bevel polishing apparatus being configured to polish a bevel portion of a substrate, said calibration apparatus comprising:a load measuring device configured to measure a pressing load from a polishing pad of the bevel polishing apparatus; and
a base plate configured to be fixed on a vacuum suction table configured to hold the substrate placed thereon, the base plate having the load measuring device placed thereon.

US Pat. No. 9,808,903

METHOD OF POLISHING BACK SURFACE OF SUBSTRATE AND SUBSTRATE PROCESSING APPARATUS

EBARA CORPORATION, Tokyo...

1. A polishing method of polishing an entirety of a back surface of a substrate, comprising:
first polishing an outer circumferential region of the back surface of the substrate by placing a first polishing tool in
sliding contact with the outer circumferential region of the back surface of the substrate, while holding a center-side region
of the back surface of the substrate;

second polishing the center-side region of the back surface of the substrate by placing a second polishing tool in sliding
contact with the center-side region of the back surface of the substrate, while holding the substrate, supporting a front
side of the substrate, and rotating the second polishing tool around an axis of a rotational shaft which extends in a direction
perpendicular to the back surface of the substrate; and

inverting the substrate, said inverting being performed between said first polishing and said second polishing,
wherein the first polishing tool is placed in sliding contact with only the back surface of the substrate during the first
polishing.

US Pat. No. 9,669,515

POLISHING APPARATUS

Ebara Corporation, Tokyo...

1. A polishing apparatus for polishing a substrate, comprising:
a polishing table configured to support a polishing pad;
a carrier configured to hold the substrate and press the substrate against the polishing pad;
a dam configured to dam a liquid on the polishing pad to form a liquid film having a thickness equal to or greater than a
prescribed value, the dam being provided only in part of an area on the polishing pad and formed into an arcuately curved
shape to allow the liquid on the polishing pad to flow into the dam and to allow the liquid in the dam to be discharged to
the outside of the dam;

a light emitter configured to emit a laser beam onto the polishing pad, the light emitter having a light emission end disposed
in the liquid film formed by the dam;

a light receiver configured to receive light scattered by and bounced off the polishing pad at a plurality of angles due to
surface properties of the polishing pad, after the laser beam is emitted from the light emitter, the light receiver being
disposed in the liquid film formed by the dam; and

a processor configured to perform Fourier transform on the light received by the light receiver into a predetermined wavelength
corresponding to a reflection intensity distribution and to determine a feature quantity of the surface properties of the
pad.

US Pat. No. 9,472,441

SUBSTRATE PROCESSING APPARATUS

Ebara Corporation, Tokyo...

1. A substrate processing apparatus for gripping a peripheral portion of a substrate and rotating the substrate to process
the substrate, said substrate processing apparatus comprising:
a rotatable substrate stage having a plurality of arms extending radially; and
substrate chuck mechanisms fixed to respective distal ends of said arms and configured to grip the peripheral portion of the
substrate;

said substrate chuck mechanism comprising:
a chuck body having a substrate placing portion configured to place the peripheral portion of the substrate and a guide surface
configured to guide an outer circumferential end surface of the substrate and to position the substrate when the substrate
is placed on said substrate placing portion; and

a chuck claw rotatably supported on said chuck body and configured to hold the peripheral portion of the substrate between
said substrate placing portion and said chuck claw by turning said chuck claw inward in a closing direction,

wherein said guide surface comprises a first guide surface configured to guide the outer circumferential end surface of the
substrate which falls down by its own weight when the substrate is placed and held on said substrate placing portion, and
a second guide surface configured to guide the outer circumferential end surface of the substrate while the substrate is pressed
and moved inward along the second guide surface by turning said chuck claw inward in a closing direction when the peripheral
portion of the substrate is held between said substrate placing portion and said chuck claw by turning said chuck claw inward
in the closing direction.

US Pat. No. 9,466,512

SUBSTRATE CLEANING APPARATUS AND SUBSTRATE PROCESSING APPARATUS

EBARA CORPORATION, Tokyo...

1. A substrate cleaning apparatus comprising:
a substrate holder configured to hold and rotate a substrate;
a sponge cleaning tool to be brought into contact with a surface of the substrate;
a cleaning element provided adjacent to the substrate held by the substrate holder; and
a cleaning-tool moving mechanism configured to bring the sponge cleaning tool into contact with the cleaning element, the
cleaning element having a cleaning surface that is to come in contact with the sponge cleaning tool, and a central portion
of the cleaning surface being located at a higher position than a portion, of the cleaning surface, outside the central portion,

wherein the cleaning element has a central outlet located in the central portion of the cleaning surface, and a fluid passage
communicating with the central outlet, and

a fluid supply line, which is configured to supply fluid to the fluid passage, is coupled to the cleaning element.

US Pat. No. 9,399,277

POLISHING APPARATUS AND POLISHING METHOD

Ebara Corporation, Tokyo...

1. A polishing method comprising:
providing a first polishing head having a plurality of pressure chambers;
holding a substrate by the first polishing head;
performing first profile control polishing of the substrate by pressing the substrate against a first polishing pad by the
first polishing head;

providing a second polishing head having a plurality of pressure chambers whose arrangement is different from an arrangement
of the pressure chambers of the first polishing head;

holding the substrate, which has been polished with use of the first polishing head, by the second polishing head; and
performing second profile control polishing of the substrate by pressing the substrate against a second polishing pad by the
second polishing head.

US Pat. No. 9,401,293

POLISHING APPARATUS AND POLISHING METHOD

EBARA CORPORATION, Tokyo...

1. An apparatus for polishing a substrate having a film thereon by bringing the substrate into sliding contact with a polishing
pad, said apparatus comprising:
a polishing table for holding the polishing pad, said polishing table being configured to rotate around its own axis;
a top ring configured to rotate the substrate about its axis which is out of alignment with the axis of said polishing table
and to press a surface of the substrate against the polishing pad, said top ring including a retainer ring that can surround
the substrate;

at least one light source configured to emit light;
a first optical head disposed in said polishing table, said first optical head and said top ring being arranged to cause said
first optical head, each time said polishing table makes one revolution, to move in a first path that extends across a center
of said top ring, the first path extending from one side to an opposite side of said retainer ring in substantially a diametrical
direction of said top ring, said first optical head being configured to apply the light to multiple first measuring points
on the surface of the substrate located along the first path and receive reflected light from the multiple first measuring
points on the substrate;

a second optical head disposed in said polishing table, said second optical head and said top ring being arranged to cause
said second optical head, each time said polishing table makes one revolution, to move in a second path that extends across
only an annular region of said top ring when said first optical head is not present under said top ring, said annular region
of said top ring being located inward from an inner circumferential surface of said retainer ring and having a width in a
range of 10 mm to 20 mm, said second optical head being configured to apply the light to multiple second measuring points
on a peripheral portion of the substrate and receive reflected light from the multiple second measuring points on the substrate,
the multiple second measuring points being located along the second path at different radial distances from a center of the
substrate;

at least one spectroscope configured to measure at each of a plurality of wavelengths an intensity of the reflected light
received by said first optical head and said second optical head; and

a processor configured to produce a spectrum from the intensity of the reflected light at each of the wavelengths measured
by said spectroscope and to determine a thickness of the film of the substrate from the spectrum produced, the spectrum indicating
a relationship between intensity and wavelength of the reflected light, wherein

said top ring presses the substrate against the polishing pad at an area between the axis of said polishing table and a periphery
of said polishing table where said first optical head moves in the first path and said second optical head moves in the second
path when said first optical head is not present under said top ring.

US Pat. No. 9,393,595

ABRASIVE FILM FABRICATION METHOD AND ABRASIVE FILM

Ebara Corporation, Tokyo...

1. A method for fabricating an abrasive film, the method comprising:
preparing a base film, coating the base film with a first paint which contains no abrasive grain but contains a binder resin,
and drying the first paint to form a first layer;

coating the first layer with a second paint which contains abrasive grains and the binder resin and drying the second paint
to form a second layer; and

heating the first layer and the second layer for imidization;
wherein a coating thickness of the first paint after being dried is in a range from a thickness equal to an average grain
diameter of the abrasive grains to a thickness of three times as large as the average grain diameter.

US Pat. No. 9,368,314

INSPECTION SYSTEM BY CHARGED PARTICLE BEAM AND METHOD OF MANUFACTURING DEVICES USING THE SYSTEM

EBARA CORPORATION, Tokyo...

6. A method of inspecting a sample using an electro-optical system, comprising:
setting an inspection region on a surface of the sample and a plurality of areas of the sample surface, wherein each area
includes at least a part of the inspection region and has the same size as that of the inspection region;

storing a reference image data of the inspection region;
irradiating the areas with a primary beam in a manner of area-by-area; detecting charged particles emitted from each area
of the sample surface in response to the irradiation of the area with the primary beam, and outputting an electric signal
as image data corresponding to an intensity of the detected particles;

comparing a detected image formed from the outputted image data with a reference image formed from the reference image data,
and calculating a distance value between the detected image and the reference image, wherein the distance value corresponds
to a similarity level therebetween; and

determining that a defect exists on the predetermined inspection region if the distance values of all the areas are larger
than a predetermined threshold value, and no defects exists on the predetermined inspection region if the distance value of
one of the areas is smaller than or equal to the predetermined threshold value.

US Pat. No. 9,236,285

MOVABLE RANGE ADJUSTING MECHANISM FOR WORKPIECE CONVEYING DEVICE

EBARA CORPORATION, Tokyo...

17. A method for adjusting a holding position of a workpiece holding mechanism by means of a stopper device, the stopper device
having a male member and a female member, at least one of the male member and the female member having at least first and
second parallel surfaces located away from each other with respect to a normal direction of the first and second parallel
surfaces, the other of the male member and female member having a contact surface, and at least one of the male member and
the female member having a stopper surface defining an end position of a movable range of the workpiece holding mechanism,
the method comprising:
changing a relative engagement position of the male member and the female member of the stopper device from a first arrangement
to a second arrangement;

wherein in the first arrangement the contact surface contacts with the first parallel surface but not the second parallel
surface to define a first predefined discontinuous holding position configured for limiting a movable range of the workpiece
holding mechanism, and

wherein in the second arrangement the contact surface contacts with the second parallel surface to define a second predefined
discontinuous holding position configured for limiting a movable range of the workpiece holding mechanism.

US Pat. No. 9,188,027

RECOVERY SYSTEM USING FLUID COUPLING ON POWER GENERATING SYSTEM

EBARA CORPORATION, Tokyo...

1. A power generating system in which water is supplied to a steam generator by a feed pump to generate steam, a steam turbine
is driven by using the generated steam to generate power, the steam discharged from the steam turbine is condensed in a condenser
to form condensed water, and then the condensed water is resupplied to the steam generator by the feed pump, the power generating
system comprising:
a fluid coupling provided between said feed pump and a driving machine for driving said feed pump to transmit a torque from
said driving machine to said feed pump by a working oil which fills an impeller chamber of said fluid coupling;

wherein the condensed water supplied from said condenser is heated by the working oil which is discharged from said fluid
coupling; and

wherein the condensed water heated by the working oil is supplied to said feed pump.

US Pat. No. 10,074,510

INSPECTION SYSTEM AND INSPECTION IMAGE DATA GENERATION METHOD

EBARA CORPORATION, Tokyo...

1. An inspection system comprising:a primary optical system that has an electron source that irradiates charged particles in the form of a beam;
a current detection unit that detects an emission current value of the beam irradiated from the electron source;
an imaging unit that has an imaging element that detects an amount of secondary charged particles that are obtained by irradiating the beam on to an inspection target;
an image data generation unit that generates image data based on the results of the imaging by the imaging unit;
a correction unit that corrects the results of the imaging or the image data based on the emission current value so detected; and
a movable unit that can hold an inspection target to move the inspection target through a position where the beam is irradiated by the primary optical system, in a predetermined direction, wherein
the imaging unit comprises a TDI sensor having imaging elements that are aligned in the predetermined number of stages in a predetermined direction and configured to integrate amounts of secondary charged particles that are obtained by irradiating the beam on to the inspection target while moving the movable unit in the predetermined direction, through a time delay integration system along a predetermined direction, and
the correction unit corrects, based on a mean value of emission current values that are detected by the current detection unit during a period of integration during which amounts of secondary charged particles are integrated by the number of stages by the TDI sensor, the results of the imaging or the image data corresponding to the amounts of secondary charged particles that are integrated during the period of integration.

US Pat. No. 9,601,302

INSPECTION APPARATUS

EBARA CORPORATION, Tokyo...

1. An inspection apparatus for inspecting a sample surface using an electron beam, comprising:
an electron beam source;
a primary electron optical system that comprises a primary system lens and guides the electron beam emitted from the electron
beam source;

a stage on which a sample to be irradiated with primary electrons guided by the primary electron optical system is arranged;
a secondary electron optical system that comprises a secondary system lens and guides secondary charged particles emitted
from the surface of the sample due to irradiation with the electron beam;

a detector that detects the secondary charged particles guided by the secondary electron optical system;
a gap control plate that is arranged above the stage so as to cover the surface of the sample arranged on the stage, and internally
includes a through hole allowing the electron beam to pass therethrough; and

a cover member that is attached to a condenser lens arranged in the through hole in the secondary system lens, and blocks
a gap between the through hole and the condenser lens in view of a direction perpendicular to the gap control plate.

US Pat. No. 9,457,447

POLISHING APPARATUS AND POLISHING METHOD

EBARA CORPORATION, Tokyo...

1. An apparatus for a polishing a peripheral portion of a substrate, said apparatus comprising:
a substrate holder configured to hold the substrate and to rotate the substrate; and
a polishing unit configured to polish the peripheral portion of the substrate, said polishing unit including:
a polishing head having a pressing member configured to press a longitudinal edge of a polishing tape against the peripheral
portion of the substrate; and

a tape supply and recovery mechanism configured to supply the polishing tape to said polishing head and to recover the polishing
tape from said polishing head;

wherein said tape supply and recovery mechanism has guide rollers for supporting the polishing tape, said guide rollers being
arranged such that the longitudinal edge of the polishing tape is to contact a circular boundary between a region of the substrate
to be polished and a region of the substrate not to be polished, and such that the longitudinal edge of the polishing tape
is substantially perpendicular to a radial direction of the substrate at a pressing location where the pressing member presses
the longitudinal edge of the polishing tape against the peripheral portion of the substrate.

US Pat. No. 9,358,662

SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD, SUBSTRATE HOLDING MECHANISM, AND SUBSTRATE HOLDING METHOD

EBARA CORPORATION, Tokyo...

1. An apparatus for processing a substrate, said apparatus comprising:
a polishing section configured to polish a substrate;
a transfer mechanism configured to transfer the substrate; and
a cleaning section configured to clean and dry the polished substrate, said cleaning section having plural cleaning lines
for cleaning plural substrates,

wherein said plural cleaning lines include plural primary cleaning modules for performing a primary cleaning operation on
the substrate and plural secondary cleaning modules for performing a secondary cleaning operation on the substrate, and

wherein said plural primary cleaning modules are aligned along a vertical direction and said plural secondary cleaning modules
are aligned along a vertical direction.

US Pat. No. 9,234,624

SHAFT COUPLING GUARD AND ROTATABLE APPARATUS SYSTEM

EBARA CORPORATION, Tokyo...

1. A shaft coupling guard configured to cover a shaft coupling that couples a main shaft of a prime mover and a main shaft
of a driven apparatus as a rotatable apparatus configured to be driven by the prime mover, the shaft coupling guard comprising:
a guard main body formed so as to extend in a direction along an axis and having a tubular shape for circumferentially covering
the shaft coupling, the guard main body including a guard main body upper portion, and a guard main body lower portion configured
to be attachable to and detachable from the guard main body upper portion; and

leg portions formed integrally with the guard main body and configured to support the guard main body,
wherein the leg portions are formed integrally with the guard main body upper portion at both ends of the guard main body
upper portion opposite of the axis from each other.

US Pat. No. 9,211,629

POLISHING APPARATUS

Ebara Corporation, Tokyo...

1. A polishing apparatus comprising:
a polishing table to which a polishing pad for polishing a substrate is attached;
a liquid feeding section configured to feed a liquid to a polishing surface of the polishing pad;
a substrate holding section configured to suck and convey the substrate from the polishing surface, the substrate contacting
the polishing surface via the liquid fed by the liquid feeding section;

a control section configured to inject a fluid between the substrate and the polishing pad when the substrate is being conveyed;
a communication hole is formed in the polishing pad and in the polishing table to allow the polishing surface of the polishing
pad to communicate with a side surface or a back surface of the polishing table, and

the control section injects the fluid between the substrate and the polishing pad via the communication hole,
wherein the polishing apparatus further comprising:
a driving section configured to rotate the polishing table; and
a position detecting sensor configured to detect a rotational position of the polishing table,
wherein the control section rotates the polishing table so as to place the communication hole opposite a surface of the substrate
based on the rotational position of the polishing table detected by the position detecting sensor, and in this state, the
control section injects the fluid between the substrate and the polishing pad via the communication hole.

US Pat. No. 9,808,836

SUBSTRATE PROCESSING APPARATUS

EBARA CORPORATION, Tokyo...

1. A substrate processing apparatus for processing a substrate having a first surface and a second surface, the second surface
being an opposite surface of the first surface, the substrate processing apparatus comprising:
a scrubber configured to place at least one scrubbing member in sliding contact with the first surface of the substrate to
process the first surface, the scrubber having a plurality of deformable elastic members supporting the at least one scrubbing
member, the plurality of elastic members having top surfaces, respectively, which are spaced from each other; and

a hydrostatic support structure configured to support the second surface of the substrate via fluid without contacting the
substrate.

US Pat. No. 9,808,908

METHOD OF MONITORING A DRESSING PROCESS AND POLISHING APPARATUS

EBARA CORPORATION, Tokyo...

8. A polishing apparatus for polishing a substrate, comprising:
a polishing table configured to support a polishing pad;
a table motor configured to rotate the polishing table;
a dresser configured to dress the polishing pad;
a swing motor configured to cause the dresser to oscillate in a radial direction of the polishing pad;
a pressing device configured to press the dresser against the polishing pad; and
a pad monitoring device configured to monitor dressing of the polishing pad,
the pad monitoring device being configured to
calculate a work coefficient representing a ratio of a frictional force between the dresser and the polishing pad to a force
of pressing the dresser against the polishing pad,

monitor dressing of the polishing pad based on the work coefficient, and
determine a remaining life of the dresser based on the work coefficient.

US Pat. No. 9,666,440

POLISHING APPARATUS AND POLISHING METHOD

Ebara Corporation, Tokyo...

1. A polishing method for polishing a substrate, comprising:
rotating a stage on which the substrate is held;
feeding a liquid to a first surface of the substrate which is not held on the stage;
feeding the liquid to a second surface of the substrate which is held on the stage after a predetermined time has elapsed
since feeding of the liquid to the first surface of the substrate started; and

polishing a peripheral portion of the substrate while the liquid is being fed to the first surface and the second surface
of the substrate,

wherein the feeding of the liquid to the second surface starts during the feeding of the liquid to the first surface.

US Pat. No. 9,666,469

LIFTING DEVICE, SUBSTRATE PROCESSING APPARATUS HAVING LIFTING DEVICE, AND UNIT TRANSFERRING METHOD

EBARA CORPORATION, Tokyo...

1. A lifting device comprising:
a lifting mechanism that is provided between at least one of a plurality of units of a substrate processing apparatus and
an installation surface of the unit, and that adjusts height of the at least one unit with respect to the installation surface;

an adjustment member that is provided with an extended section extended from the lifting mechanism, and that is capable of
operating the lifting mechanism through the extended section; and

a level adjuster connected to the lifting mechanism, capable of adjusting height of the at least one unit with respect to
the installation surface by driving the lifting mechanism, wherein the adjustment member includes a level adjustment member
having a connection section connected to the level adjuster, the extended section extended from the connection section, and
an operation section provided in the extended section, the level adjustment member being capable of driving the lifting mechanism
through the level adjuster by operating the operation section, and

wherein the lifting mechanism includes: a first member and a second member that are stacked between the installation surface
and the at least one unit, and each of which has a surface facing to each other so as not to be horizontal; and a third member
provided between the first member and the second member so as to be wedge-shaped, and the level adjuster is capable of adjusting
a distance between the first member and the second member by driving the third member to be slid.

US Pat. No. 9,610,673

POLISHING METHOD AND APPARATUS

Ebara Corporation, Tokyo...

1. A polishing method for polishing a substrate, comprising:
a recipe process, being executed in accordance with a preset recipe, comprising:
a polishing step for polishing a surface of the substrate by pressing the substrate against a polishing pad on a polishing
table by a top ring;

a dressing step for dressing the polishing pad; and
a first cleaning step for removing foreign matters on said polishing pad by ejecting a cleaning fluid onto said polishing
pad, a cleaning time of said first cleaning step being preset in advance in said recipe process;

a second cleaning step for removing foreign matters on said polishing pad by ejecting a cleaning fluid onto said polishing
pad, a cleaning time of said second cleaning step being variable; and

a substrate transferring process in which the polished substrate is removed from said top ring at a substrate transferring
position, a subsequent substrate to be polished is loaded onto said top ring, and then said top ring holding the subsequent
substrate to be polished is returned to said polishing table;

wherein said second cleaning step is started after the completion of said recipe process is detected, and said second cleaning
step is terminated by detecting a position of the subsequent substrate to be polished which is undergoing said substrate transferring
process.

US Pat. No. 9,593,430

ELECTROCHEMICAL DEPOSITION METHOD

EBARA CORPORATION, Tokyo...

1. A substrate holder for holding a substrate having a surface to be electroplated, said substrate holder comprising:
a fixed holding member and a movable holding member for holding the substrate therebetween; and
a first sealing member, mounted to the movable holding member, for making pressure contact with a peripheral portion of the
substrate to seal the peripheral portion,

wherein the first sealing member is a multi-seal structure comprising at least two loop-shaped sealing portions and partition
sealing portions, the partition sealing portions extending in a width direction and arranged at locations along a circumferential
direction of the at least two loop-shaped sealing portions.

US Pat. No. 9,492,910

POLISHING METHOD

Ebara Corporation, Tokyo...

1. A polishing method using an abrasive film including a base film made of polyimide, a binder made of polyimide, and abrasive
grains held by the binder, comprising:
rotating a silicon substrate having a surface on which a silicon carbide film is formed; and
removing the silicon carbide film from a peripheral portion of the silicon substrate by pressing the abrasive film at a low
force against the silicon carbide film on the peripheral portion of the silicon substrate.

US Pat. No. 9,393,670

MEASURING METHOD OF SURFACE ROUGHNESS OF POLISHING PAD

EBARA CORPORATION, Tokyo...

1. A method for measuring a surface roughness of a polishing pad, comprising:
acquiring an image of a surface of a polishing pad by using a laser microscope;
selecting only a region which has a height of the polishing pad larger than an average height calculated from the acquired
image; and

calculating a surface roughness from only the selected region.

US Pat. No. 9,390,886

ELECTRO-OPTICAL INSPECTION APPARATUS USING ELECTRON BEAM

EBARA CORPORATION, Tokyo...

1. An electron beam apparatus, comprising:
an electron gun configured to emit a single primary electron beam;
a first deflector configured to deflect the single primary electron beam to irradiate each of a plurality of sub-visual fields
which are obtained by dividing an evaluation area on a surface of a sample;

a detection device configured to detect secondary electrons containing information on the surface of the sample in each of
the plurality of sub-visual fields to acquire information on the evaluation area, said detection device comprising a plurality
of unit detectors, each of said plurality of unit detectors including an area sensor, a bundle of optical fibers having a
first end coupled to a detection plane of said area sensor, and an FOP optically coupled to a second end of said bundle of
optical fibers and formed with a scintillator, on which a secondary electron beam of the sub-visual fields is focused,

a second deflector configured to deflect the secondary electron beam emitted from the sub-visual fields each time the single
primary electron beam is irradiated to the next sub-visual field, so as to move the secondary electron beam sequentially over
a surface of said FOP of each of said plurality of unit detectors which form said detecting device,

an electromagnetic objective lens including a lens gap beside the sample and a first axially symmetric electrode therein,
said electromagnetic objective lens being configured to form an image produced by the secondary electron beam of the sub-visual
fields substantially at the same focusing position in a state in which the sub-visual fields spaced away from the optical
axis and the sub-visual fields near the optical axis are irradiated by the single primary electron beam, by adjusting polarities
and values of voltages applied to said first axially symmetric electrode, and

two electromagnetic magnifying lenses, each of said two electromagnetic magnifying lenses including a second axially symmetric
electrode therein and being configured to correct an amount of rotation of the image to match with an arrangement of said
FOP of each of said plurality of unit detectors by adjusting polarities and values of voltages applied to said second axially
symmetric electrode,

a number of said plurality of unit detectors being set to a value approximated to t1/(t2+t3), where t1 represents a time period required to fetch a signal from one area sensor, t2 an exposure time period, and t3 a settling time period of said second deflector, and

said FOP of each of said plurality of unit detectors having optical fibers fixed in an array and polished and coated by said
scintillator.

US Pat. No. 9,362,129

POLISHING APPARATUS AND POLISHING METHOD

EBARA CORPORATION, Tokyo...

1. A polishing apparatus for polishing a substrate, comprising:
a polishing table configured to support a polishing surface;
a top ring configured to hold a substrate with an outer circumferential edge of the substrate surrounded by a retainer ring
and to press the substrate against said polishing surface, said top ring being movable between a polishing position above
said polishing table and a substrate transfer position for transferring the substrate between a substrate transfer mechanism
provided in the substrate transfer position and the top ring; and

a cleaning unit disposed between the polishing table and the substrate transfer mechanism, and located in a cleaning position
on a moving path of the top ring, the cleaning unit being configured to eject a cleaning liquid toward a lower surface of
said top ring, which is rotatable, thereby cleaning the substrate when held by said top ring together with the lower surface
of said top ring when said top ring is positioned at said cleaning position;

wherein said cleaning unit includes a first cleaning nozzle comprising a plurality of ejection ports directed upwardly and
disposed in equally spaced intervals along a circumferential direction of said first cleaning nozzle; and

wherein said plurality of ejection ports of the first cleaning nozzle being positioned directly below an inside edge of said
retainer ring and a clearance created between an outer circumferential edge of the substrate when held by said top ring and
said retainer ring which surrounds the outer circumferential edge of the substrate, when said top ring is positioned at said
cleaning position.

US Pat. No. 9,266,214

POLISHING METHOD AND POLISHING APPARATUS

Ebara Corporation, Tokyo...

25. A method of polishing a substrate having a film, the method comprising:
polishing the substrate by pressing the substrate against a polishing tool on a rotating polishing table;
irradiating the substrate with light when polishing the substrate;
calculating relative reflectance from intensity of the light reflected from the substrate;
producing spectral waveform representing relationship between the relative reflectance and wavelength of the light;
determining a thickness of the film;
performing a Fourier transform process on the spectral waveform to create a frequency spectrum;
determining whether the thickness of the film is reliable or not based on a comparison between a peak of the frequency spectrum
and a threshold value; and

determining a polishing end point of the substrate based on the thickness of the film that has been determined to be reliable.


US Pat. No. 9,242,339

POLISHING APPARATUS AND POLISHING METHOD

Ebara Corporation, Tokyo...

13. A polishing method for polishing a surface of a substrate by holding the substrate and pressing the substrate against
a polishing pad on a polishing table by a polishing head, comprising:
supplying a polishing liquid from a polishing liquid supply nozzle onto the polishing pad;
polishing the substrate by bringing the substrate in sliding contact with the polishing pad while the polishing liquid is
being present between the substrate and the polishing pad;

storing the polishing liquid on the polishing pad by damming the polishing liquid;
measuring a physical quantity representing the freshness of the stored polishing liquid;
calculating the freshness of the polishing liquid from the measured physical quantity;
controlling supply conditions of the polishing liquid and/or storage state of the polishing liquid, based on the calculated
freshness of the polishing liquid;

determining the freshness of the polishing liquid at a plurality of locations in a radial direction of the polishing pad;
and

renewing the freshness of the polishing liquid only at the location where the determined freshness of the polishing liquid
is lower than a preset threshold value.

US Pat. No. 9,206,590

WATER SUPPLY APPARATUS

EBARA CORPORATION, Tokyo...

1. A water supply apparatus, comprising:
a plurality of pumps;
a plurality of motors configured to drive said plurality of pumps;
a plurality of inverters each configured for variable rotational speed control of a corresponding one of said plurality of
motors; and

a first control board and a second control board each configured to control said plurality of inverters,
wherein when an abnormality occurs in said first control board, said second control board backs up said first control board
to thereby allow said water supply apparatus to continue its operations,

wherein each of said plurality of inverters is provided with at least two different communication ports, and
wherein said first control board is connected to said plurality of inverters in series by communication lines and said second
control board is connected to said plurality of inverters in series by different communication lines.

US Pat. No. 9,199,352

POLISHING APPARATUS, POLISHING METHOD AND PRESSING MEMBER FOR PRESSING A POLISHING TOOL

EBARA CORPORATION, Tokyo...

1. A polishing apparatus for polishing a peripheral portion of a substrate, the peripheral portion including a near-edge portion
having an annular flat surface, said polishing apparatus comprising:
a rotary holding mechanism configured to hold the substrate horizontally and to rotate the substrate;
at least one polishing head disposed near the near-edge portion of the substrate; and
a polishing-tool supply mechanism configured to supply a strip-shaped polishing tool in a radial direction of the substrate
to said at least one polishing head and collect the polishing tool from said at least one polishing head,

wherein said at least one polishing head has at least one protrusion curved along a circumferential direction of the substrate
such that a distance between said at least one protrusion and an outermost circumference of the substrate is constant throughout
an entire length of said at least one protrusion, and

wherein said at least one polishing head is configured to bring said at least one protrusion into contact with a rear surface
of the strip-shaped polishing tool to thereby press the strip-shaped polishing tool downwardly or upwardly against the near-edge
portion of the substrate.

US Pat. No. 9,144,881

POLISHING APPARATUS AND POLISHING METHOD

EBARA CORPORATION, Tokyo...

1. A polishing apparatus for polishing a substrate, comprising:
a peripheral-portion polishing unit configured to polish a peripheral portion of the substrate;
a CMP unit configured to polish a flat surface of the substrate;
a cleaning unit configured to clean the polished substrate; and
a transport system configured to transport the substrate,
the transport system being operable to transport the substrate that has been polished in one of the peripheral-portion polishing
unit and the CMP unit to the cleaning unit, and transport the substrate that has been cleaned in the cleaning unit to one
of the peripheral-portion polishing unit and the CMP unit, wherein if the substrate has been polished in the peripheral-portion
polishing unit the transport system being operable to transport the substrate from the cleaning unit to the CMP unit and if
the substrate has been polished in the CMP unit the transport system being operable to transport the substrate from the cleaning
unit to the peripheral-portion polishing unit.

US Pat. No. 9,138,854

POLISHING APPARATUS

EBARA CORPORATION, Tokyo...

6. A polishing apparatus comprising:
a substrate-holding mechanism configured to hold a substrate and rotate the substrate;
a polishing mechanism arranged above the substrate, said polishing mechanism being configured to apply a pressing force to
a polishing tool from above a flat portion of a periphery of an upper surface of the substrate to press the polishing tool
against the flat portion so as to polish the flat portion of the periphery of the upper surface;

a moving mechanism configured to move said polishing mechanism in a radial direction of the substrate held on said substrate-holding
mechanism; and

a pressing-force adjustor configured to adjust the pressing force of said polishing mechanism in accordance with a radial
position of said polishing mechanism so as to keep the pressing force constant,

wherein said substrate-holding mechanism has a substrate stage having a smaller diameter than a diameter of the substrate
and is configured to hold the substrate with the flat portion of the periphery, to be polished, lying outwardly of said substrate
stage.

US Pat. No. 9,074,994

INSPECTION METHOD AND APPARATUS OF A GLASS SUBSTRATE FOR IMPRINT

EBARA CORPORATION, Tokyo...

1. A method for inspecting a substrate with a pattern surface for imprint to be transferred to another film, the method comprising:
a first alignment step of aligning the substrate in a mini environment chamber by using a substrate alignment device after
the substrate has been transferred into the mini environment chamber; a second alignment step of aligning the substrate in
a main chamber by using a movable stage and an optical microscope after the substrate has been transferred from the mini environment
chamber into the main chamber; an electron beam irradiation step of irradiating the pattern surface of the substrate for imprint
disposed on a stage with an electron beam having a predetermined irradiation area, the substrate consisting of a glass substrate
made of a single glass material and a transmissive conductive film that transmit light, the glass substrate having the pattern
surface of a fine concave-convex configuration pattern, the transmissive conductive film being formed only on a convex part
of the fine concave-convex configuration pattern of the glass substrate so as to cover at least a whole surface of the convex
part of the concave-convex configuration pattern of the glass substrate; an electron detection step of simultaneously detecting
electrons form the pattern surface by the electron beam irradiation by means of a detection surface with a plurality of pixels;
and a defect detection step of obtaining an image of the pattern surface based on the electrons detected by the detection
surface and detecting a defect of the pattern surface, wherein the electron beam irradiation step includes a first step to
irradiate the pattern surface with a first electron beam and a second step to irradiate the pattern surface with a second
electron beam with a landing energy less than that of the first electron beam after the first step, wherein a difference between
a landing energy of the first electron beam for pre-charge and the landing energy of the second electron beam is 5 to 20 eV,
and the landing energy of the first electron beam is 0 to 40 eV, so as to obtain mirror electrons, and wherein a thickness
of the transmissive conductive film is smaller than a thickness of the convex part of the concave-convex configuration pattern
of the glass substrate.

US Pat. No. 10,030,814

COUPLING GUARD

EBARA CORPORATION, Tokyo...

1. A coupling guard for covering a coupling which couples a drive shaft of a prime mover and a rotational shaft of a rotary machine to each other, the coupling guard comprising:a guard body in a cylindrical shape, the guard body having an upper semicylindrical member and a lower semicylindrical member coupled to the upper semicylindrical member; and
a guard leg supporting the guard body,
wherein the guard body has a flange portion to which the guard leg is attached,
the guard leg includes a vertical wall parallel to a central axis of the guard body, and further includes an upper wall, a bottom wall, a left-side wall, and a right-side wall which project perpendicularly and outwardly from the vertical wall, and
the vertical wall, the upper wall, the bottom wall, the left-side wall, and the right-side wall are constituted by a single plate material.

US Pat. No. 9,561,575

ADJUSTING A SUBSTRATE POLISHING CONDITION

Ebara Corporation, Tokyo...

1. A method for adjusting a temperature of a polishing pad, said method comprising:
providing a polishing pad to polish a substrate, a top ring to hold the substrate, and a temperature adjusting mechanism to
control a temperature of the polishing pad;

measuring an elastic modulus of the polishing pad;
adjusting the temperature of the polishing pad so that a target value of the elastic modulus of the polishing pad is reached,
the target value being determined based on a relationship between a measured value of the elastic modulus of the polishing
pad and a size of a surface of the substrate; and

repeating said measuring and said adjusting until the measured value of the elastic modulus corresponds with the target value.

US Pat. No. 9,556,533

SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

EBARA CORPORATION, Tokyo...

1. A substrate processing apparatus comprising:
a control section;
a processing tank configured to hold a processing liquid;
a substrate holder configured to hold a substrate and bring the substrate into contact with the processing liquid in the processing
tank;

a plurality of inlet pipes connected to the processing tank, each of the plurality of inlet pipes comprising a mass flow controller
and being configured to be switched therebetween; and a plurality of outlet pipes connected to the processing tank, each of
the plurality of outlet pipes comprising a mass flow controller and being configured to be switched therebetween, and being
configured to create a flow of the processing liquid along a surface of the substrate in the processing tank in a second direction
different from a first direction of the flow of the processing liquid before a switching between the plurality of inlet pipes,
and the control section being configured to control each of the mass flow controllers to change a flow rate of the processing
liquid supplied by one of the plurality of inlet pipes to the surface of the substrate with time over 1 second to 10 seconds,
upon the switching between the plurality of inlet pipes or a switching between the plurality of outlet pipes; and

a pump configured to supply the processing liquid into the processing tank in a circulatory manner through the plurality of
inlet pipes and the plurality outlet pipes.

US Pat. No. 9,539,699

POLISHING METHOD

Ebara Corporation, Tokyo...

1. A polishing method comprising:
polishing a substrate by pressing the substrate against a polishing pad on a polishing table by a polishing head while moving
the polishing table and the polishing head relative to each other;

moving the polishing head, holding the substrate, to a predetermined position above a substrate transfer device;
cleaning the substrate by ejecting a cleaning fluid onto the substrate held by the polishing head located at the predetermined
position;

during cleaning of the substrate, discharging a fluid from a release nozzle located at the substrate transfer device; and
after cleaning of the substrate, releasing the substrate from the polishing head by ejecting a releasing shower from the release
nozzle into a gap between the polishing head and the substrate.

US Pat. No. 9,524,913

POLISHING METHOD AND POLISHING APPARATUS

Ebara Corporation, Tokyo...

1. A polishing method comprising:
polishing a plurality of substrates including at least one post-measurement substrate designated as a substrate whose film
thickness is to be measured after polishing and at least one non-measurement substrate designated as a substrate whose film
thickness is not measured;

measuring a film thickness of the at least one post-measurement substrate after polishing of the at least one post-measurement
substrate;

detecting that a polishing error has occurred during polishing of the at least one non-measurement substrate;
thereafter, measuring a film thickness of the at least one non-measurement substrate after polishing of the at least one non-measurement
substrate; and

determining whether re-polishing is necessary.

US Pat. No. 9,508,526

TOP OPENING-CLOSING MECHANISM AND INSPECTION APPARATUS

EBARA CORPORATION, Tokyo...

1. A vacuum magnetic shield container of an electron beam apparatus including a stage configured to hold a sample, the vacuum
magnetic shield container comprising:
an inner container including a stainless steel material; and
an outer container including a magnetic steel material different from the material of the inner container, disposed to surround
the inner container,

wherein the inner container holds a vacuum in the container, and
the outer container magnetically shields the container, the inner container and the outer container respectively have a lower
opening,

the lower openings of both containers are closed with a lower plate,
the lower plate is brought into direct contact with a lower end of the outer container, and
a sealing member is provided between an upper surface of the lower plate and a lower peripheral edge of the inner container.

US Pat. No. 9,437,507

METHOD OF CORRECTING FILM THICKNESS MEASUREMENT VALUE, FILM THICKNESS CORRECTOR AND EDDY CURRENT SENSOR

Ebara Corporation, Tokyo...

1. A method of correcting a film thickness measurement value in which a signal output from a sensor for measuring a film thickness
of a polishing target object is corrected while a process of polishing the polishing target object is being performed, the
polishing process including a first state where the sensor and the polishing target object do not face each other and a second
state where the sensor and the polishing target object face each other, the method comprising:
obtaining a first measurement signal output from the sensor in the first state;
computing a correction value on the basis of the obtained first measurement signal and a reference signal set in advance with
respect to the first measurement signal;

obtaining a second measurement signal output from the sensor in the second state; and
correcting the obtained second measurement signal on the basis of the computed correction value while the polishing process
is being performed.

US Pat. No. 9,409,277

POLISHING APPARATUS AND POLISHING METHOD

Ebara Corporation, Tokyo...

1. A polishing apparatus comprising:
a rotatable polishing table for supporting a polishing pad having a polishing surface;
an atomizer head configured to spray a cleaning fluid onto the polishing surface to clean the polishing surface; and
an atomizer cover that covers an upper surface of the atomizer head,
the atomizer cover including
a semicylindrical top plate having a semicylindrical shape, and
a first side plate and a second side plate extending downward from both lower ends of the semicylindrical top plate,
the semicylindrical top plate including
a first top plate having a vertical cross section in a shape of an arc whose radius is constant over its entire length from
a base end to a distal end of the atomizer cover, and

a second top plate having a vertical cross section in a shape of an arc whose radius decreases gradually from the base end
toward the distal end of the atomizer cover,

the first top plate and the second top plate being connected to each other at their top portions to constitute the semicylindrical
top plate.

US Pat. No. 9,406,480

TESTING APPARATUS USING CHARGED PARTICLES AND DEVICE MANUFACTURING METHOD USING THE TESTING APPARATUS

EBARA CORPORATION, Tokyo...

1. A method of compensating a position of an X stage of an X-Y stage of an electron beam apparatus during inspection of a
sample on the X-Y stage, the method comprising:
i) setting a constant target speed of the X stage;
ii) setting in response to the set target speed, a linear function with regard to time, representing target positions of the
X stage in the X direction during every X direction scanning period;

iii) measuring actual positions of the X stage in the X direction during an X direction scanning period of the inspection;
iv) calculating differences between the target positions and the measured actual positions respectively corresponding to the
target positions for the X direction scanning period;

v) calculating an average of the calculated differences;
vi) combining the averages with the corresponding target positions to form combined target positions; and
vii) using the combined target positions to adjust actual positions of the X stage during a next X direction scanning period
of the inspection.

US Pat. No. 9,302,366

METHOD AND APPARATUS FOR MONITORING A POLISHING SURFACE OF A POLISHING PAD USED IN POLISHING APPARATUS

EBARA CORPORATION, Tokyo...

1. A method of monitoring a polishing surface of a polishing pad for use in a polishing apparatus, said method comprising:
conditioning the polishing surface of the polishing pad by causing a rotating dresser to oscillate on the polishing surface;
measuring a height of the polishing surface at a measuring point while said conditioning of the polishing surface is performed;
calculating a position of the measuring point of the height on a two-dimensional surface defined on the polishing surface;
associating the calculated position of the measuring point with a measured value of the height;
repeating said measuring, said calculating, and said associating at a plurality of different points on the polishing pad to
obtain a set of measured values of the height and associated positions of the measured values;

creating a height distribution of the polishing surface based on the set of measured values of the height and the associated
positions of the measured values;

creating an X-axis profile and a Y-axis profile of the polishing pad from the height distribution based on the measured values
of the height at measuring points located in predetermined sampling regions on an X axis and a Y axis of a X-Y rotating coordinate
system defined on the two-dimensional surface;

calculating a first difference in the height of the polishing surface between an initial X-axis profile and a subsequent X-axis
profile obtained when a predetermined time has elapsed;

dividing the first difference by the predetermined time to determine an X-axis cutting rate;
calculating a second difference in the height of the polishing surface between an initial Y-axis profile and a subsequent
Y-axis profile obtained when the predetermined time has elapsed; and

dividing the second difference by the predetermined time to determine a Y-axis cutting rate.

US Pat. No. 9,269,605

SUBSTRATE GRIPPING APPARATUS

EBARA CORPORATION, Tokyo...

1. A substrate gripping apparatus, comprising:
a base;
a plurality of support posts which are supported by the base and are vertically movable relative to the base;
a lifting mechanism configured to lift the support posts; and
a substrate holder and a substrate guide member mounted to each of the support posts,
each of the support posts including a relative movement mechanism configured to move the substrate holder and the substrate
guide member relative to each other,

the relative movement mechanism being configured
to move the substrate holder in such a direction that the substrate holder releases a peripheral portion of a substrate, while
raising the substrate guide member relative to the substrate holder, when the support post moves upward, and

to move the substrate holder in such a direction that the substrate holder grips the peripheral portion of the substrate,
while lowering the substrate guide member relative to the substrate holder, when the support post moves downward.

US Pat. No. 9,216,442

GAS-LIQUID SEPARATOR AND POLISHING APPARATUS

EBARA CORPORATION, Tokyo...

1. A polishing apparatus comprising:
a polishing table having a polishing surface;
a top ring for holding a substrate and pressing the substrate against the polishing surface of the polishing table;
a processing liquid supply nozzle for supplying a processing liquid to the polishing surface of the polishing table;
a drain receiver, disposed around the polishing table, for recovering a gas-liquid two-phase flow that has been removed from
the polishing table; and

a gas-liquid separator,
the gas-liquid separator comprising:
a container having a bottom and a side portion, the bottom having a liquid discharge outlet and the side portion having a
gas discharge outlet;

a gas-liquid introduction pipe for introducing the gas-liquid two-phase flow into the container, the gas-liquid introduction
pipe extending downward from above the container and having a lower end located in an interior of the container, the gas discharge
outlet of the container being located above the lower end of the gas-liquid introduction pipe; and

a guide device disposed in the gas-liquid introduction pipe and configured so as to impart a swirling motion to the gas-liquid
two-phase flow in the gas-liquid introduction pipe.

US Pat. No. 9,190,887

MOTOR ASSEMBLY AND PUMP APPARATUS INCLUDING A COOLING FAN FOR COOLING AN INVERTER

EBARA CORPORATION, Tokyo...

1. A motor assembly comprising:
a motor configured to be coupled to a pump;
an inverter for changing a rotational speed of said motor;
a cooling fan coupled to a rotational shaft of said motor the cooling fan being located at a side of said motor opposite from
the pump;

a guide cover for guiding gas flow, generated by rotation of said cooling fan, to said inverter; and
at least two support members coupling said inverter to a side surface of said motor;
wherein said at least two support members are located on both sides of a center line, the center line connecting a central
axis of said motor to a center of said inverter as viewed from an axial direction of said motor,

wherein a space serving as a passage of the gas flow from said cooling fan is formed between said at least two support members,
wherein one of said at least two support members has a through-hole through which a power line extends,
wherein said inverter has a power switching element and a box in which said power switching element is housed, said power
switching element in said box is arranged adjacent to said passage of the gas flow, and said power switching element is located
on the center line, and

wherein an upper portion of said inverter is located radially outwardly of said cooling fan such that the gas flow, generated
by the rotation of said cooling fan, contacts said upper portion of said inverter to change a direction of movement of the
gas flow downward through the space between said at least two support members.

US Pat. No. 9,174,324

POLISHING APPARATUS WITH POLISHING HEAD COVER

Ebara Corporation, Tokyo...

1. A polishing apparatus comprising:
a polishing table configured to hold a polishing tool having a polishing surface;
a polishing head having a top ring configured to press a substrate against the polishing surface;
a polishing head cover configured to cover the polishing head;
a first cleaning liquid supply mechanism configured to supply a cleaning liquid to an outer surface of the polishing head
cover; and

a second cleaning liquid supply mechanism configured to supply a cleaning liquid to an inner surface of the polishing head
cover.

US Pat. No. 9,073,170

POLISHING APPARATUS HAVING THERMAL ENERGY MEASURING MEANS

EBARA CORPORATION, Tokyo...

1. A substrate holding apparatus for holding a substrate and pressing the substrate against a polishing surface, comprising:
an elastic membrane configured to form a substrate holding surface which is brought into contact with the substrate;
a carrier provided above said elastic membrane;
at least one pressure chamber formed between said elastic membrane and said carrier;
an infrared light detector configured to measure thermal energy from said elastic membrane; and
a measuring instrument disposed at a rear surface side of said substrate holding surface of said elastic membrane and configured
to measure thermal energy of a portion other than said elastic membrane.

US Pat. No. 9,067,296

POLISHING METHOD

EBARA CORPORATION, Tokyo...

1. A polishing method for polishing a substrate by keeping the substrate in sliding contact with a surface of a polishing
pad while supplying a polishing liquid to the surface of the polishing pad, the polishing method comprising:
determining, in advance, a first relationship between a supply flow rate of a polishing liquid and a polishing rate when a
substrate is polished without controlling a surface temperature of the polishing pad, a second relationship between a supply
flow rate of a polishing liquid and a polishing rate when a substrate is polished while controlling a surface temperature
of the polishing pad, and a third relationship between a surface temperature of the polishing pad and a supply flow rate of
the polishing liquid when a substrate is polished while controlling the surface temperature of the polishing pad;

determining from the first relationship and the second relationship a flow rate range of the polishing liquid in which the
polishing rate when the substrate is polished while controlling the surface temperature of the polishing pad is higher than
the polishing rate when the substrate is polished without controlling the surface temperature of the polishing pad;

determining from the third relationship a temperature range of the surface temperature of the polishing pad corresponding
to the determined flow rate range; and

placing a substrate in sliding contact with the surface of the polishing pad, while continuously supplying the polishing liquid
to the surface of the polishing pad at a flow rate within the determined flow rate range and while controlling the surface
temperature of the polishing pad to be within the determined temperature range.

US Pat. No. 9,649,739

POLISHING APPARATUS

EBARA CORPORATION, Tokyo...

1. A polishing apparatus comprising:
a substrate-holding mechanism configured to hold a substrate and rotate the substrate, said substrate-holding mechanism having
a substrate stage configured to contact a central portion of the substrate;

a polishing mechanism configured to press a polishing tool against a periphery of the substrate so as to polish the periphery;
and

a periphery-supporting mechanism configured to support the periphery of the substrate by ejecting a fluid toward the periphery.

US Pat. No. 9,662,761

POLISHING APPARATUS

Ebara Corporation, Tokyo...

1. A polishing apparatus comprising:
a rotatable polishing table for supporting a polishing pad;
a rotatable top ring having a pressure chamber for pressing a substrate against the polishing pad;
a pressure regulator configured to regulate a pressure of a gas in the pressure chamber;
a gas delivery line which couples the pressure regulator to the pressure chamber;
a buffer tank provided between the pressure chamber and the pressure regulator, the buffer tank being a hermetic container
having a hermetic space formed therein, a volume of the hermetic space being equal to or larger than a volume of the pressure
chamber, the buffer tank being located outside the rotatable top ring; and

a branch line which couples the buffer tank to the gas delivery line, the branch line being in communication with the hermetic
space of the buffer tank.

US Pat. No. 9,624,594

PLATING APPARATUS

Ebara Corporation, Tokyo...

1. An electroplating apparatus comprising:
a substrate holder configured to hold a substrate in a vertical position, the substrate holder including
(i) electrical contacts arranged to be able to contact the substrate,
(ii) a pair of holder hangers,
(iii) a hand lever extending between the pair of holder hangers,
(iv) external contacts provided on at least one of the pair of holder hangers, the external contacts being electrically connected
to the electrical contacts;

at least one processing bath configured to process the substrate held by the substrate holder;
a transporter configured to grip the hand lever of the substrate holder and horizontally transport the substrate holder;
at least one lifter including a pair of receivers disposed at both sides of the at least one processing bath and a pair of
elevating actuators disposed at both sides of the at least one processing bath, the pair of receivers having bottom portions,
respectively, on which the pair of holder hangers can be supported, the pair of elevating actuators being configured to vertically
move the pair of receivers between a first position at which the pair of receivers can receive the substrate holder from the
transporter and a second position at which a lower part of the substrate holder on the receiver is placed in the at least
one processing bath while the pair of holder hangers, supported by the pair of receivers, is located above the at least one
processing bath; and

a controller configured to control operations of the transporter and the at least one lifter and allow the transporter to
move horizontally after the at least one lifter has received the substrate holder from the transporter.

US Pat. No. 9,604,337

POLISHING METHOD

Ebara Corporation, Tokyo...

1. A method of polishing a substrate having a film, the method comprising:
polishing the substrate by pressing the substrate against a polishing tool on a rotating polishing table;
irradiating the substrate with light when polishing the substrate;
receiving the light reflected from the substrate;
measuring intensity of the reflected light at respective wavelength, the reflected light having wavelengths of not more than
1100 nm;

calculating relative reflectance by dividing the measured intensity of the light by predetermined reference intensity;
producing spectral waveform representing relationship between the relative reflectance and wavelength of the light;
performing a Fourier transform process on the spectral waveform to determine a thickness of the film and a corresponding strength
of frequency component; and

determining a polishing end point of the substrate based on a point in time at which the determined thickness of the film
has reached a predetermined target value.

US Pat. No. 9,602,035

DRIVING APPARATUS FOR ELECTRIC MOTOR

EBARA CORPORATION, Tokyo...

1. A driving apparatus for an electric motor, comprising:
an inverter;
a current detector configured to detect an output current of the inverter; and
a vector controller configured to transform the output current, detected by the current detector, into a torque current and
a magnetization current, and to control the torque current and the magnetization current,

wherein the vector controller comprises:
a three-to-two phase transformation section configured to transform three-phase currents, detected by the current detector,
into two-phase currents;

a stationary-to-rotational coordinate transformation section configured to transform the two-phase currents on a stationary
coordinate system, which have been transformed by the three-to-two phase transformation section, into a torque current and
a magnetization current on a rotating coordinate system;

a torque-voltage control section configured to determine a torque-voltage command value based on a deviation between a torque-current
command value and the torque current;

a magnetization-voltage output section configured to output 0 as a magnetization-voltage command value;
a rotational-to-stationary coordinate transformation section configured to transform the torque-voltage command value and
the magnetization-voltage command value on a rotating coordinate system into a torque-voltage command value and a magnetization-voltage
command value on a stationary coordinate system;

a two-to-three phase transformation section configured to transform the torque-voltage command value and the magnetization-voltage
command value, which have been transformed by the rotational-to-stationary coordinate transformation section, into three-phase
voltage command values;

a velocity calculator configured to calculate an angular velocity of a rotor of the electric motor from the magnetization
current, a magnetization-current command value, and the torque-voltage command value;

a target-torque-current determination section configured to determine the torque-current command value based on a deviation
between the angular velocity and an angular-velocity command value;

a target-output-voltage determination section configured to determine a target-output-voltage value from the angular velocity
of the rotor; and

a target-magnetization-current determination section configured to determine the magnetization-current command value based
on a deviation between the torque-voltage command value and the target-output-voltage value.

US Pat. No. 9,594,014

INSTALLATION STRUCTURE OF LENGTH METER FOR MEASURING A DISPLACEMENT OF AN OBJECT PLACED IN VACUUM

EBARA CORPORATION, Tokyo...

1. An installation structure of a length meter for measuring a displacement of an object placed in vacuum, comprising:
a vacuum chamber A having the object installed therein;
a vacuum chamber B provided separately from the vacuum chamber A, the vacuum chamber B having the length meter stored therein;
an installation base integrally mounted to a surface plate and installed on a side portion of the vacuum chamber A, the surface
plate supporting the vacuum chamber A and/or the object and

a vacuum chamber C installed under a lower surface of the installation base with the installation base interposed therebetween,
wherein the vacuum chamber B is installed on the installation base, and a side wall of the vacuum chamber B is overlapped
with a side wall of the vacuum chamber A with a first vacuum sealing portion interposed therebetween,

wherein laser light axis holes are provided at corresponding positions on the overlapping side walls of both the vacuum chambers
A and B and the first vacuum sealing portion respectively, and a laser light incident from the length meter stored in the
vacuum chamber B enters into the vacuum chamber A through the laser light axis holes, and a laser light reflected from the
object in the vacuum chamber A enters into the length meter in the vacuum chamber B through the laser light axis holes,

wherein the vacuum chamber B includes a space portion that stores the length meter, and a lower end portion of the vacuum
chamber B is joined to an upper surface of the installation base to which the length meter is fixed so as to store the length
meter on the installation base, and

wherein the vacuum chamber B is installed on the upper surface of the installation base via a third vacuum sealing portion
provided along the lower end portion of the vacuum chamber B so as to allow a displacement in a direction parallel to the
upper surface of the installation base,

a connection portion of the vacuum chamber C between the vacuum chamber C and the lower surface of the installation base is
provided to have substantially the same shape as the lower end portion of the vacuum chamber B, and a fourth vacuum sealing
portion having substantially the same vacuum sealing area as the third vacuum sealing portion of the vacuum chamber B is provided
along the connection portion, and

the vacuum chamber C is mounted to the lower surface of the installation base immediately below the vacuum chamber B via the
fourth vacuum sealing portion provided along the connection portion.

US Pat. No. 9,558,971

SUBSTRATE HOLDING APPARATUS AND SUBSTRATE CLEANING APPARATUS

Ebara Corporation, Tokyo...

1. A substrate holding apparatus comprising:
a plurality of chucks configured to hold a peripheral edge of a substrate;
at least one support member disposed below the substrate; and
an actuating device configured to bring the chucks into contact with the peripheral edge of the substrate while elevating
the support member to bring the support member into contact with a lower surface of the substrate, and configured to move
the chucks in a direction away from the peripheral edge of the substrate while lowering the support member to separate the
support member away from the lower surface of the substrate.

US Pat. No. 9,457,448

POLISHING APPARATUS AND POLISHING METHOD

EBARA CORPORATION, Tokyo...

1. An apparatus for polishing a periphery of a substrate with a polishing tape, the periphery is defined as an outside portion
of a central portion for fabricating electronic circuits, said apparatus comprising:
a rotatable substrate holder to hold and rotate the substrate;
a tape supply and recovery device having a tape supply unit, tape guides, and a tape recovery unit, for extending the polishing
tape from the tape supply unit to the tape recovery unit via the tape guides;

a pressing device having a pressing member to press the polishing tape between the tape guides against the periphery of the
rotating substrate, wherein the pressing member has a through-hole whose one end is open to a bottom surface of the pressing
member and the other end is connected to a vacuum line;

a first mechanism to move the pressing device to a position above the periphery of the rotating substrate so that an edge
of the bottom surface of the pressing member is tangential to a boundary coaxial circle of the substrate which separates the
central portion from the periphery of the substrate;

a second mechanism to move the tape supply and recovery device for locating the polishing tape between the tape guides beneath
the pressing member, and to adjust the position of a longitudinal edge of the polishing tape to an edge of the pressing member,

a liquid supply device having a liquid supply nozzle for supplying a liquid to a center of the rotating substrate to cover
a surface of the central portion of the substrate with the liquid by centrifugal force; and

a controller for controlling the first mechanism, the second mechanism, and the vacuum line to perform
adjusting the position of the polishing tape between the tape guides to the pressing member,
securing the polishing tape to the bottom surface of the pressing member by evacuating the through-hole of the pressing member
after touching an upper surface of the polishing tape with the bottom surface of the pressing member by vertically moving
the pressing member or the tape supply and recovery device, and

polishing the surface of the periphery of the substrate by lowering the pressing member with the secured polishing tape to
touch the peripheral portion of the rotating substrate so that the longitudinal edge of the polishing tape is tangential to
the boundary coaxial circle of the substrate, while a surface of the central portion of the rotating substrate is covered
by the liquid supplied from the liquid supply nozzle to prevent a debris generated by the polishing of the peripheral portion
from contacting the surface of the central portion of the substrate.

US Pat. No. 9,403,255

POLISHING APPARATUS AND POLISHING METHOD

Ebara Corporation, Tokyo...

1. A polishing apparatus for polishing a substrate by bringing the substrate into contact with a polishing surface, comprising:
a substrate holder having a substrate holding surface configured to press the substrate against the polishing surface and
further having a retaining ring arranged so as to surround the substrate, the retaining ring being configured to be tiltable
independently of the substrate holding surface,

wherein the retaining ring is brought into contact with the polishing surface during polishing of the substrate;
a rotating mechanism configured to rotate the substrate holding surface and the retaining ring together about an axis of the
substrate holder; and

at least one local load exerting mechanism configured to exert a local load on a part of the retaining ring in a direction
perpendicular to the polishing surface, the at least one local load exerting mechanism being arranged so as not to move in
accordance with the rotation of the substrate holder.

US Pat. No. 9,399,276

POLISHING APPARATUS

Ebara Corporation, Tokyo...

1. A polishing apparatus for polishing a substrate by pressing the substrate against a polishing surface on a polishing table
with a polishing head while the polishing head holding the substrate is rotated and the polishing table is rotated, comprising:
a non-contact transmission connector provided on at least one of the polishing table and the polishing head and configured
to transfer electric power or signals or to perform communication between a stationary unit and a rotating unit which face
each other in a non-contact manner;

wherein the electric power or the signals are transmitted or communication is performed between equipment provided in at least
one of the polishing table and the polishing head, and the outside of the polishing table or the polishing head through the
non-contact transmission connector; and

wherein the non-contact transmission connector comprises a light emitting unit provided in one of the stationary unit and
the rotating unit and a light receiving unit provided in the other of the stationary unit and the rotating unit; the light
emitting unit and the light receiving unit being configured to face each other.

US Pat. No. 9,248,545

SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

Ebara Corporation, Tokyo...

8. A substrate processing method for processing a substrate, comprising:
holding a first region in a lower surface of the substrate by a first substrate-holding surface of a first substrate stage;
measuring an amount of eccentricity of a center of the substrate from an axis of a second substrate stage;
aligning the center of the substrate with the axis of the second substrate stage;
lowering the first substrate stage until a second region in the lower surface of the substrate contacts a second substrate-holding
surface of the second substrate stage;

holding the second region by the second substrate-holding surface;
further lowering the first substrate stage to separate the first substrate-holding surface from the substrate;
rotating the second substrate stage about the axis of the second substrate stage to thereby rotate the substrate; and
processing the rotating substrate.

US Pat. No. 9,132,525

POLISHING APPARATUS FOR FLATTENING SURFACE OF WORKPIECE

Ebara Corporation, Tokyo...

1. A polishing apparatus for flattening a surface of a workpiece, the polishing apparatus comprising:
a polishing table;
a first electric motor configured to rotationally drive the polishing table;
a substrate holding unit configured to hold the workpiece;
a second electric motor configured to rotationally drive the substrate holding unit, at least one of the first and second
electric motors having a plurality of phase windings;

a weighting unit configured to make currents of the plurality of phase windings different from each other; and
a torque variation detecting unit configured to detect a change in a current made by the weighting unit and thereby detect
a change in torque of the at least one of the first and second electric motors, the change being generated by performing a
polishing of the workpiece.

US Pat. No. 9,108,292

METHOD OF OBTAINING A SLIDING DISTANCE DISTRIBUTION OF A DRESSER ON A POLISHING MEMBER, METHOD OF OBTAINING A SLIDING VECTOR DISTRIBUTION OF A DRESSER ON A POLISHING MEMBER, AND POLISHING APPARATUS

Ebara Corporation, Tokyo...

1. A method of obtaining a sliding-distance distribution of a dresser sliding on a polishing member for polishing a substrate,
the method comprising:
calculating a relative speed between the dresser and the polishing member at a predetermined sliding-distance calculation
point on the polishing member;

calculating an increment of a sliding distance of the dresser at the sliding-distance calculation point by multiplying the
relative speed by a contact time during which the dresser contacts the polishing member at the sliding-distance calculation
point;

correcting the increment of the sliding distance by multiplying the calculated increment of the sliding distance by at least
one correction coefficient;

updating the sliding distance by adding the corrected increment of the sliding distance to a current sliding distance at the
sliding-distance calculation point; and

producing a sliding-distance distribution of the dresser from the updated sliding distance and a position of the sliding-distance
calculation point,

wherein the at least one correction coefficient includes an unevenness correction coefficient provided for the sliding-distance
calculation point,

wherein the unevenness correction coefficient is a correction coefficient that allows a profile of the polishing member to
reflect a difference between an amount of scraped material of the polishing member in a raised portion and an amount of scraped
material of the polishing member in a recess portion, and

wherein the correcting of the increment of the sliding distance comprises correcting the increment of the sliding distance
by multiplying the increment of the sliding distance by the unevenness correction coefficient.

US Pat. No. 9,105,516

POLISHING APPARATUS AND POLISHING METHOD

EBARA CORPORATION, Tokyo...

7. A method of polishing a substrate using a substrate holder having a substrate holding surface and a pressure chamber formed
by a flexible membrane, said method comprising:
pressing the substrate against a polishing pad via pressure in the pressure chamber;
providing a relative movement between the substrate and the polishing pad to polish the substrate;
after polishing of the substrate, holding the substrate on the substrate holding surface;
transporting the substrate to a substrate transfer position;
vertically moving one of the substrate holder and a substrate separation assisting device in accordance with an amount of
descent of a contact portion between the substrate and the flexible membrane; and

ejecting a fluid from the substrate separation assisting device to the contact portion to release the substrate from the substrate
holding surface.

US Pat. No. 10,086,413

POWDER DISCHARGE SYSTEM

EBARA CORPORATION, Tokyo...

1. An exhaust gas treatment apparatus comprising:a heat treatment unit for oxidatively decomposing an exhaust gas containing silane-based gas, including at least one of silane (SiH4) and disilane (Si2H6), discharged from a semiconductor manufacturing apparatus, the heat treatment unit comprising a combustion chamber for combusting the exhaust gas and a connecting pipe connected to the combustion chamber;
an exhaust gas cleaning unit arranged at a stage subsequent to the heat treatment unit for cleaning the exhaust gas discharged from the combustion chamber with water and removing fine dust contained in the exhaust gas, the exhaust gas cleaning unit being connected to the connecting pipe of the heat treatment unit; and
a powder discharge system having a circulating water tank for collecting powder containing silica (SiO2) generated when the exhaust gas is combusted in the combustion chamber of the heat treatment unit and for supplying the water to the exhaust gas cleaning unit to clean the exhaust gas and recovering the water after cleaning the exhaust gas, the connecting pipe of the heat treatment unit extending downward into the circulating water tank and configured to lead the powder containing silica (SiO2) into the circulating water tank, the powder containing silica (SiO2) generated when the exhaust gas is combusted being accumulated on an inner surface of the combustion chamber and removed from the inner surface of the combustion chamber, and the removed powder containing silica (SiO2) being collected in the circulating water tank through the connecting pipe and deposited on a bottom of the circulating water tank;
the powder discharge system comprising:
at least two eductors provided in the circulating water tank and disposed around the connecting pipe;
each eductor comprising a nozzle configured to throttle a flow of water supplied from a pump for pumping water in the circulating water tank, a suction port configured to suck water in the circulating water tank into the eductor by utilizing a reduction of pressure generated when the flow of water is throttled by the nozzle, and a discharge port configured to eject the water sucked from the suction port together with the water discharged from the nozzle toward the bottom of the circulating water tank;
wherein the discharge port of each eductor is positioned at the same vertical position as a position of a lower end of the connecting pipe; each eductor is disposed radially outward of the connecting pipe and equally distanced from a center of the connecting pipe at a distance between D1 and 2D1 wherein an inner diameter of the connecting pipe is D1 and a spray angle of each eductor is set in a range of 30° to 70°;
a drainage port provided at an upper part of the circulating water tank and configured to discharge water in the circulating water tank to the outside of the exhaust gas treatment apparatus; and
a water level sensor configured to control a water level of the circulating water tank to form a state where the water level is lower than the suction port of each of the at least two eductors and a state where the water level is higher than the suction port of each of the at least two eductors;
when the water level is lower than the suction port of each of the at least two eductors, only the water discharged from the nozzle is ejected from each of the at least two eductors toward the bottom of the circulating water tank; and
when the water level is higher than the suction port of each of the at least two eductors, the water discharged from the nozzle and the water sucked from the suction port are ejected from each of the at least two eductors toward the bottom of the circulating water tank;
wherein the water ejected from the discharge port of each of the at least two eductors crushes the powder containing silica (SiO2) deposited on the bottom of the circulating water tank and floats the powder containing silica (SiO2), and the powder containing silica (SiO2) is discharged through the drainage port from the circulating water tank together with drainage water.

US Pat. No. 9,852,878

SURFACE PROCESSING APPARATUS

EBARA CORPORATION, Tokyo...

1. A surface processing apparatus which performs surface processing on an inspection object by irradiating the inspection
object with an electron beam in a column, comprising:
an electron source which generates the electron beam;
a lens system which controls a beam shape of the electron beam;
a stage on which the inspection object to be irradiated with the electron beam is set;
an optical microscope for checking a position to be irradiated with the electron beam, wherein a current value of the electron
beam which irradiates the inspection object is set at 10 nA to 100 A; and

a particle catcher that can adsorb particles which float in the column, wherein the particle catcher is openable and closeable
such that the particle catcher is arranged above the stage when closed and is removed from above the stage when opened.

US Pat. No. 9,731,401

METHOD AND APPARATUS FOR CONDITIONING POLISHING PAD

Ebara Corporation, Tokyo...

1. A conditioning method for adjusting surface roughness of a polishing pad by dressing the polishing pad on a polishing table
configured to polish a substrate with a dresser pressed against the polishing pad, comprising:
measuring surface roughness of the polishing pad during dressing of the polishing pad, the surface roughness being represented
by at least one of five indexes comprising arithmetical mean deviation of the roughness profile (Ra), root mean square deviation
of the roughness profile (Rq), maximum profile valley depth of the roughness profile (Rv), maximum profile peak height of
the roughness profile (Rp), and maximum height of the roughness profile (Rz);

comparing the measured surface roughness with preset target surface roughness to obtain comparison result; and
adjusting a surface temperature of the polishing pad by heating or cooling the polishing pad based on the comparison result.

US Pat. No. 9,633,898

ETCHING LIQUID, ETCHING METHOD, AND METHOD OF MANUFACTURING SOLDER BUMP

Ebara Corporation, Tokyo...

1. An etching method, comprising:
preparing a substrate on which a multilayer structure including a copper layer and a cobalt layer is formed by
applying a resist onto a copper seed layer formed on the substrate,
creating an opening in the resist,
forming a copper bump layer and the cobalt layer in the opening, and
removing the resist;
preparing an etching liquid including hydrogen peroxide and at least one acid selected from a group consisting of citric acid,
oxalic acid, malic acid, and malonic acid, the etching liquid having pH in a range of 4.3 to 5.5; and

bringing an exposed portion of the copper seed layer into contact with the etching liquid to thereby etch the exposed portion
of the copper seed layer.

US Pat. No. 9,561,573

POLISHING APPARATUS

EBARA CORPORATION, Tokyo...

1. A polishing apparatus for polishing a substrate, comprising:
a substrate holder configured to hold a substrate and to rotate the substrate;
a pressing member configured to press a polishing tool against the substrate and to form a polished portion in a surface of
the substrate;

a pressing force control mechanism configured to control a pressing force of the pressing member; and
a polishing position limiting mechanism configured to limit a depth of the polished portion to less than a thickness of the
substrate when the pressing member is pressing the polishing tool against the substrate.

US Pat. No. 9,561,577

POLISHING METHOD AND POLISHING APPARATUS

EBARA CORPORATION, Tokyo...

1. A method of polishing a substrate having a silicon layer, said method comprising:
polishing the substrate by pressing the substrate against a polishing tool on a rotating polishing table;
irradiating the substrate with only a near infrared ray having a plurality of wavelengths in a range of 800 nm to 1000 nm
when polishing the substrate;

receiving the near infrared ray reflected from the substrate;
measuring intensity of the reflected near infrared ray at respective wavelengths;
calculating relative reflectance by dividing the measured intensity of the reflected near infrared ray by predetermined reference
intensity;

producing a spectral waveform representing a relationship between the relative reflectance and wavelength of the reflected
near infrared ray;

performing a Fourier transform process on the spectral waveform to extract frequency components and corresponding strengths
of the frequency components from the spectral waveform;

converting the frequency components into thicknesses of the silicon layer using a predetermined relational expression;
producing a frequency spectrum that represents relationship between the thickness of the silicon layer and the strength of
the frequency component corresponding to the thickness of the silicon layer;

determining a thickness of the silicon layer and a corresponding strength of frequency component from a peak of the frequency
spectrum;

identifying the determined thickness of the silicon layer as a reliable measured value if the determined strength of the frequency
component is higher than a predetermined threshold value; and

determining a polishing end point of the substrate based on a point of time when the reliable measured value has reached a
predetermined target value.

US Pat. No. 9,555,517

FILM THICKNESS SIGNAL PROCESSING APPARATUS, POLISHING APPARATUS, FILM THICKNESS SIGNAL PROCESSING METHOD, AND POLISHING METHOD

Ebara Corporation, Tokyo...

23. A film thickness signal processing method comprising:
receiving film thickness data output from a film thickness sensor for detecting the film thickness of a polishing object along
a surface to be polished thereof;

identifying an effective range of the film thickness data on the basis of the received film thickness data; and
correcting the strength values of the film thickness data so as to adjust the strength values to reference strength for the
film thickness data where strength values correlated with film thicknesses fall short of the reference strength, among the
film thickness data within the identified effective range, or correcting the strength values of the film thickness data by
multiplying the strength values by a predetermined magnification greater than 1.

US Pat. No. 9,541,088

EVACUATION APPARATUS

EBARA CORPORATION, Tokyo...

1. An evacuation apparatus for evacuating a process gas in a vacuum chamber of a substrate processing apparatus for fabrication
of semiconductors or liquid crystal panels to produce a vacuum in said vacuum chamber, said evacuation apparatus comprising:
a two-stage Roots vacuum pump as a booster pump for evacuation of said vacuum chamber, said booster pump having an inlet port
connected to said vacuum chamber via a pipe, an outlet port, and a pair of two-stage Roots-type pump rotors driven by a first
motor and supported by bearings, the Roots-type pump rotors comprising an inlet-side Roots rotor as a first stage and an outlet-side
Roots rotor as a second stage, and an axial width of said inlet-side Roots rotor being larger than an axial width of said
outlet-side Roots rotor, said two-stage Roots vacuum pump is able to be started by said first motor only when a pressure of
said outlet port of said two-stage Roots vacuum pump is lowered to a predetermined pressure,

a screw vacuum pump as a main pump for evacuation of said outlet port of said two-stage Roots vacuum pump, said screw vacuum
pump having an inlet port connected to said outlet port of said two-stage Roots pump via a pipe, an outlet port, and a pair
of screw pump rotors driven by a second motor and supported by bearings, said screw vacuum pump is able to be started by said
second motor at an atmospheric pressure in said inlet port of said screw vacuum pump,

wherein said two-stage Roots vacuum pump is configured to operate at a pumping speed larger than a pumping speed of said screw
vacuum pump,

and an inert gas is supplied to said two-stage Roots vacuum pump and said screw vacuum pump so that said bearings of said
two-stage Roots vacuum pump and said screw vacuum pump are prevented from being exposed to said process gas, and a controller
for controlling each rotational speed of said first and second motors so that said screw vacuum pump starts first then said
two-stage Roots vacuum pump starts after a time period when said pressure of said outlet port of said two-stage Roots vacuum
pump is lowered to said predetermined pressure,

wherein a pumping speed of said inlet-side rotor of said booster pump is in a range of 20,000 Liters/minute to 100,000 Liters/minute,
and

a pumping-speed ratio of said inlet-side rotor to said outlet-side rotor of said booster pump is in a range of 2:1 to 10:1.

US Pat. No. 9,530,704

POLISHING APPARATUS AND WEAR DETECTION METHOD

Ebara Corporation, Tokyo...

9. A method for detecting uneven wear of a polishing pad placed on a polishing table of a polishing apparatus, the method
comprising:
providing a polishing apparatus having a polishing table with a polishing pad thereon, and a dressing head having a dressing
surface and connected to a dresser swing shaft,

rotating the polishing pad with the polishing table,
rotating the dressing surface of the dressing head,
dressing the polishing pad by pressing the rotating dressing surface of the dressing head against the rotating polishing pad,
swinging the dressing head on the polishing pad with the dresser swing shaft,
detecting by a sensor device at least one of
a rotational speed of the polishing table,
a rotational torque applied to the polishing table,
a rotational speed of the dresser head,
a rotational torque applied to the dresser head, and
a swing torque applied to the dresser swing shaft,
receiving the detected data by a controller from the sensor device,
obtaining a variation of the detected data of a predetermined period of time by the controller, and
determining by the controller whether the calculated variation exceeds a first predetermined value to detect an uneven wear
of the polishing pad.

US Pat. No. 9,522,453

POLISHING APPARATUS

EBARA CORPORATION, Tokyo...

1. A polishing apparatus for polishing a substrate by pressing the substrate against a polishing surface on a polishing table
by a top ring while rotating the top ring which holds the substrate and rotating the polishing table, the polishing apparatus
comprising:
a rotary joint comprising an inner rotary ring and an outer stationary ring, the inner rotary ring being fixed to a rotating
part of the polishing table or a rotating part of the top ring to supply a fluid into the polishing table or the top ring
and discharge the fluid from the polishing table or the top ring; and

a rotation-prevention mechanism which connects the outer stationary ring of the rotary joint with an apparatus frame to prevent
the outer stationary ring of the rotary joint from being rotated;

wherein the rotation-prevention mechanism comprises a link mechanism having at least one spherical plain bearing.

US Pat. No. 9,517,544

POLISHING APPARATUS AND POLISHING METHOD

EBARA CORPORATION, Tokyo...

1. A polishing method comprising:
rotating a substrate by a rotary holding mechanism;
polishing a first region in a periphery of the substrate by pressing a polishing tape against the first region;
polishing a second region in the periphery of the substrate by pressing the polishing tape against the second region;
during said polishing of the second region, cleaning the first region by pressing a cleaning cloth against the first region;
and

after said polishing of the second region, cleaning the second region by pressing the cleaning cloth against the second region.

US Pat. No. 9,441,787

ROTATABLE APPARATUS

EBARA CORPORATION, Tokyo...

1. A rotatable apparatus comprising:
a casing including a first casing face provided with an opening and a second casing face abutting the first casing face, the
second casing face intersecting the first casing face at angle ?1; and

a protector for closing the opening, the protector including a first protector face and a second protector face abutting the
first protector face, the second protector face intersecting the first protector face at angle ?2, wherein

the protector is configured to be fixed to only the second casing face,
the angle ?2 is larger than the angle ?1 when the protector is removed from the casing, and
the protector is configured to be attached to the casing in such a manner that the second protector face is fixed to the second
casing face, and that the first protector face is elastically deformed so that an edge part of the first protector face, which
is located on the side opposite to the second protector face, closely contacts the first casing face.

US Pat. No. 10,047,454

PLATING APPARATUS AND PLATING METHOD

EBARA CORPORATION, Tokyo...

1. A plating apparatus for plating a substrate, comprising:a rectifier for applying a DC current to the substrate; and
a plating apparatus control unit for instructing the rectifier on a value of the DC current, wherein
the plating apparatus control unit has
a setting unit for setting a current value,
a storage unit for storing a relational expression between an instructed current value on which the rectifier is instructed and an actual current value which the rectifier outputs in accordance with the instructed current value,
a calculation unit for correcting the set current value on the basis of the relational expression to calculate a corrected current value, and
an instruction unit for instructing the rectifier on the corrected current value, wherein
the plating apparatus control unit has a determination unit that determines whether or not the set current value is not more than a predetermined value,
the calculation unit is configured to correct the set current value on the basis of the relational expression to calculate the corrected current value and the instruction unit is configured to instruct the rectifier on the corrected current value when the determination unit determines that the set current value is not more than the predetermined value, and
the instruction unit is configured to instruct the rectifier on the set current value when the determination unit determines that the set current value is more than the predetermined value.

US Pat. No. 9,984,910

PLATING APPARATUS AND PLATING METHOD

EBARA CORPORATION, Tokyo...

1. A plating apparatus comprising:a table for placing a substrate holder thereon, the substrate holder capable of detachably holding a substrate;
a plating section for holding a plating solution therein for plating the substrate, held by the substrate holder, by immersing the substrate in a vertical plane in the plating solution;
a substrate holder transporter for transporting the substrate holder between the table and the plating section, the substrate holder transporter including a holding portion for holding the substrate holder; and
a substrate holder opening and closing mechanism for opening and closing the substrate holder placed on the table,
wherein the substrate holder includes
a movable supporting member having a rotatable support member, and
a fixed supporting member for gripping the substrate in cooperation with the movable supporting member, the movable supporting member being securable to the fixed supporting member, and
wherein the substrate holder opening and closing mechanism includes
a head portion for pressing the movable supporting member and configured to hold the movable supporting member, the head portion including a rotatable portion configured to rotate the movable supporting member relative to the fixed supporting member in a first direction to thereby secure the movable supporting member to the fixed supporting member, and configured to rotate the movable supporting member relative to the fixed supporting member in a second direction opposite the first direction to thereby release the movable supporting member from the fixed supporting member,
a first actuator for vertically moving the head portion, and
a second actuator for rotating the rotatable portion of the head portion,
wherein the head portion is configured to remove the movable supporting member from the fixed supporting member in a linear direction along a center axis of the movable supporting member, and
wherein the movable supporting member is removable from the fixed supporting member by the movement of the head portion caused by the first actuator, with the movable supporting member being released from the fixed supporting member.

US Pat. No. 9,833,875

POLISHING APPARATUS AND RETAINER RING CONFIGURATION

EBARA CORPORATION, Tokyo...

1. A polishing apparatus comprising:
a head body configured to press a substrate against a polishing surface while rotating the substrate;
a retainer ring disposed so as to surround the substrate and configured to press the polishing surface while rotating together
with the head body;

a rotary ring secured to the retainer ring and configured to rotate together with the retainer ring;
a stationary ring disposed on the rotary ring; and
a local-load exerting device configured to apply a local load to a part of the retainer ring through the rotary ring and the
stationary ring, the rotary ring having rollers which are in contact with the stationary ring.

US Pat. No. 9,824,903

SUBSTRATE CLEANING APPARATUS

EBARA CORPORATION, Tokyo...

1. A substrate cleaning apparatus, comprising:
a substrate holder configured to hold and rotate a substrate;
a cylindrical scrub-cleaning tool configured to come into sliding contact with a surface of the substrate;
a rotating device configured to rotate the scrub-cleaning tool about its own axis; and
a self-cleaning device configured to clean the scrub-cleaning tool,
the self-cleaning device including
a cleaning body having an inner circumferential surface that is shaped along a circumferential surface of the scrub-cleaning
tool,

at least one cleaning nozzle configured to eject a cleaning fluid toward the circumferential surface of the scrub-cleaning
tool through a gap between the circumferential surface of the scrub-cleaning tool and the inner circumferential surface of
the cleaning body, and

a blow nozzle configured to eject a gas toward the circumferential surface of the scrub-cleaning tool through the gap, the
blow nozzle being disposed downstream of the cleaning nozzle with respect to a rotational direction of the scrub-cleaning
tool.

US Pat. No. 9,719,869

LOAD MEASURING APPARATUS AND LOAD MEASURING METHOD

Ebara Corporation, Tokyo...

1. A load measuring apparatus that measures a load applied to a substrate from a roll cleaning tool of a substrate cleaning
apparatus, the load measuring apparatus comprising:
a waterproof load cell including an elongated load measuring surface having a length that is substantially equal to a diameter
of the substrate to be cleaned on which the load is being applied by the roll cleaning tool of the substrate cleaning apparatus;
and

a base plate having a recess at a center thereof that accommodates the waterproof load cell,
wherein the elongated load measuring surface of the waterproof load cell is configured to be pressed directly by the roll
cleaning tool of the substrate cleaning apparatus to be used for cleaning the substrate while a cleaning liquid is supplied
to the roll cleaning tool thereby measuring the load applied to the waterproof load cell by the roll cleaning tool.

US Pat. No. 9,687,957

SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD, SUBSTRATE HOLDING MECHANISM, AND SUBSTRATE HOLDING METHOD

Ebara Corporation, Tokyo...

1. A polishing apparatus comprising:
a wafer holder configured to hold a wafer;
a top ring comprising a top ring body and a retainer ring movable relative to the top ring body;
a ring supporter configured to support the retainer ring when the wafer is transferred from the wafer holder to the top ring
and/or when the wafer is transferred from the top ring to the wafer holder;

a polishing table configured to polish the wafer transferred to the top ring; and
a sensor configured to detect whether the wafer is present on the wafer holder,
wherein the top ring body comprises a wafer holding member configured to hold the wafer transferred from the wafer holder,
the wafer holding member being located inside the retainer ring, and

wherein a bottom face of the retainer ring moves, when the retainer ring is supported by the ring supporter, to a first position
above a second position where the wafer is to be hold by the wafer holding member when the wafer is transferred from the wafer
holder to the top ring and/or when the wafer is transferred from the top ring to the wafer holder.

US Pat. No. 9,666,455

SUBSTRATE CLEANING APPARATUS

Ebara Corporation, Tokyo...

1. A substrate cleaning apparatus comprising:
a process chamber having a substrate conveying unit therein configured to hold a substrate horizontally with its upper surface
facing upwardly and to convey the substrate in one direction;

a cleaning unit provided in the process chamber and configured to clean a surface of the substrate;
a drying unit provided in the process chamber and configured to dry the substrate, the cleaning unit and the drying unit being
arranged in series along a conveyance direction of the substrate; and

an inert gas blowing unit provided in the drying unit and configured to blow an inert gas toward front and reverse surfaces
of the substrate to dry the substrate, wherein an inert gas source supplies inert gas to the inert gas blowing unit, and a
blowing port of the inert gas blowing unit being directed to an upstream side of the conveyance direction of the substrate
to form a flow of the inert gas toward the cleaning unit,

wherein an inert gas atmosphere, produced by blowing the inert gas from the inert gas blowing unit, disperses throughout the
process chamber including the cleaning unit and the drying unit.

US Pat. No. 9,662,764

SUBSTRATE HOLDER, POLISHING APPARATUS, AND POLISHING METHOD

Ebara Corporation, Tokyo...

1. A substrate holder, comprising:
a top ring body configured to hold a flexible membrane for pressing a substrate against a polishing surface;
an inner retaining ring configured to be vertically movable independently of said top ring body and arranged around said flexible
membrane;

an inner pressing mechanism configured to press said inner retaining ring against the polishing surface;
an outer retaining ring arranged radially outwardly of said inner retaining ring and configured to vertically movable independently
of said inner retaining ring and said top ring body;

an outer pressing mechanism configured to press said outer retaining ring against the polishing surface; and
a supporting mechanism configured to receive a lateral force applied to said inner retaining ring from the substrate during
polishing of the substrate, and supporting mechanism being coupled to said outer retaining ring and supporting said outer
retaining ring tiltably with respect to said inner retaining ring.

US Pat. No. 9,573,245

POLISHING METHOD

Ebara Corporation, Tokyo...

1. A polishing method, comprising:
rotating a polishing table that supports a polishing pad;
polishing a conductive film by pressing a substrate, having the conductive film formed on a surface thereof, against the polishing
pad;

obtaining a film thickness signal, which varies in accordance with a thickness of the conductive film, with use of an eddy
current film-thickness sensor disposed in the polishing table;

determining a thickness of the polishing pad based on the film thickness signal;
determining a polishing rate of the conductive film corresponding to the determined thickness of the polishing pad;
calculating an expected amount of polishing of the conductive film to be polished at the determined polishing rate for a predetermined
polishing time;

calculating a temporary end-point film thickness by adding the expected amount of polishing to a target thickness of the conductive
film; and

terminating the polishing of the conductive film when the predetermined polishing time has elapsed from a point of time when
the thickness of the conductive film has reached the temporary end-point film thickness.

US Pat. No. 9,550,268

SUBSTRATE HOLDING APPARATUS AND POLISHING APPARATUS

Ebara Corporation, Tokyo...

1. A substrate holding apparatus for holding a substrate to be polished and pressing the substrate against a polishing pad,
said substrate holding apparatus comprising:
a top ring configured to hold the substrate and press the substrate against the polishing pad;
a vertical movement mechanism configured to vertically move said top ring;
a torque detector configured to detect a torque of said vertical movement mechanism when said top ring is being lowered or
being lifted by said vertical movement mechanism; and

a controller in which a torque of said vertical movement mechanism when said top ring is brought into contact with a surface
of the polishing pad at the time of a pad search is preset as a torque limit value, said pad search being defined as a process
in which said top ring is lowered and brought into contact with the surface of the polishing pad to determine a contact position
between the substrate held by the top ring and the polishing pad,

wherein said controller is configured to preset a reference value from a torque detected by said torque detector when said
top ring is being lowered or being lifted by said vertical movement mechanism,

wherein said controller is configured to calculate a torque correction amount from said reference value and a torque which
is detected by said torque detector when said top ring is being lowered or being lifted by said vertical movement mechanism,
after said reference value is preset, and

wherein said controller is configured to correct said torque limit value by using said torque correction amount.

US Pat. No. 9,550,271

SUBSTRATE HOLDING APPARATUS AND POLISHING APPARATUS

Ebara Corporation, Tokyo...

1. A substrate holding apparatus comprising:
a top ring body having a substrate holding surface configured to hold and press a substrate against a polishing surface;
a retaining ring configured to surround the substrate and to contact the polishing surface; and
a drive ring comprising a ring member configured to hold the retaining ring on a lower surface thereof, a central member disposed
at a central part of the top ring body and supported by the top ring body, and a connecting portion configured to connect
the ring member and the central member;

wherein the drive ring comprises a first material and a second material having a modulus of longitudinal elasticity smaller
than the first material; and

wherein the retaining ring is configured to be vertically movable and to be tiltable independently of the top ring body.

US Pat. No. 9,551,084

SN ALLOY PLATING APPARATUS AND SN ALLOY PLATING METHOD

Ebara Corporation, Tokyo...

1. An Sn alloy plating apparatus for depositing an alloy of Sn and a metal which is nobler than Sn on a surface of a substrate,
comprising:
a plating bath configured to hold therein an Sn alloy plating solution in which an insoluble anode and the substrate are to
be disposed opposite each other;

a plating-solution circulation line configured to circulate the Sn alloy plating solution in the plating bath;
a Sn supply reservoir configured to draw a part of the Sn alloy plating solution from the plating-solution circulation line,
perform electrolysis in a presence of the Sn alloy plating solution to replenish the Sn alloy plating solution with Sn ions
and an acid that stabilizes Sn ions, and return the Sn alloy plating solution that has been replenished with the Sn ions to
the plating bath; and

a dialysis unit configured to draw a part of the Sn alloy plating solution from the plating-solution circulation line, remove
the acid from the Sn alloy plating solution, and then return the Sn alloy plating solution to the plating bath,

wherein the Sn supply reservoir comprises:
an electrolytic bath including an anode chamber in which an Sn anode is disposed, a cathode chamber in which a cathode is
disposed, and an anion exchange membrane that separates the anode chamber and the cathode chamber from each other;

an electrolytic-solution supply line configured to supply an electrolytic solution, containing acid that stabilizes Sn ions,
to the cathode chamber;

an electrolytic-solution discharge line connected to the cathode chamber and configured to discharge the electrolytic solution
from the cathode chamber to an outside of the Sn alloy plating apparatus when a concentration of the acid that stabilizes
Sn ions contained in the electrolytic solution in the cathode chamber is lowered during the electrolysis;

a plating-solution introduction line configured to draw the Sn alloy plating solution from the plating-solution circulation
line and introduce the drawn Sn alloy plating solution into the anode chamber; and

a plating-solution return line configured to return the Sn alloy plating solution in the anode chamber to the plating bath.

US Pat. No. 9,533,395

METHOD AND APPARATUS FOR CONDITIONING A POLISHING PAD

EBARA CORPORATION, Tokyo...

1. A method of conditioning a polishing pad on a polishing table for polishing a thin film formed on a surface of a substrate,
the polishing pad to be brought into contact with the thin film to perform the polishing, said method comprising:
bringing a dresser into contact with the polishing pad, the dresser being capable of wearing down an entire surface of the
polishing pad uniformly when the dresser is moved at an identified standard moving speed, the standard moving speed being
defined as a moving speed of the dresser preset at each of a plurality of areas identified in a radial direction of the polishing
pad to obtain the identical wear rate over the entire surface of the polishing pad; and

conditioning the polishing pad by moving the dresser between a central part of the polishing pad and an outer circumferential
part of the polishing pad;

wherein a moving speed of the dresser at a predetermined area of the polishing pad is lower than the standard moving speed
of the dresser preset for the predetermined area of the polishing pad; and

wherein the predetermined area of the polishing pad is defined as the area of the polishing pad to be brought into contact
with a portion of the surface of the substrate whereat a polishing rate will be higher than a polishing rate of any other
portion of the surface of the substrate if the predetermined area of the polishing pad was conditioned by moving the dresser
at the standard moving speed.

US Pat. No. 9,149,903

POLISHING APPARATUS HAVING SUBSTRATE HOLDING APPARATUS

EBARA CORPORATION, Tokyo...

1. A polishing apparatus for polishing a substrate, the polishing apparatus comprising:
a polishing table having a polishing surface;
a substrate holding apparatus configured to hold the substrate and to press the substrate against said polishing surface;
and

a controller,
wherein said substrate holding apparatus comprises:
an elastic membrane configured to form a substrate holding surface which is brought into contact with the substrate;
a carrier provided above said elastic membrane;
at least one pressure chamber formed between said elastic membrane and said carrier; and
a first passage communicating with said pressure chamber,
wherein said first passage is connected to a pressure regulating mechanism configured to regulate a pressure of a pressurized
fluid to be supplied to said pressure chamber, a vacuum source configured to produce a vacuum in said pressure chamber, and
a gas source configured to supply a dry gas to said pressure chamber,

wherein said first passage is connected to said pressure regulating mechanism through a first valve, said vacuum source through
a second valve, and said gas source through a third valve,

wherein said controller performs control to close said first valve and said third valve and to open said second valve so that
the vacuum is produced in said pressure chamber to hold the substrate under vacuum, when said substrate holding apparatus
holds the substrate, and

wherein said controller performs control to close said first valve and said second valve and open said third valve so that
said first passage is connected only to said gas source and said pressure chamber, when the substrate starts to be polished
or is removed from said substrate holding apparatus.

US Pat. No. 10,032,655

SUBSTRATE CLEANING DEVICE, SUBSTRATE CLEANING APPARATUS, METHOD FOR MANUFACTURING CLEANED SUBSTRATE AND SUBSTRATE PROCESSING APPARATUS

EBARA CORPORATION, Tokyo...

1. A substrate cleaning apparatus comprising:a substrate holding part configured to hold and rotate a substrate; a sponge cleaning tool configured to come into contact with a front surface of the substrate while the sponge cleaning tool is rotating around its own central axis which extends perpendicular to the front surface of the substrate;
a chemical supply nozzle configured to supply a chemical liquid to the front surface of the substrate;
a chemical supply mechanism configured to supply the chemical liquid directly to the sponge cleaning tool: and
a chamber configured to accommodate the substrate holding part and the sponge cleaning tool:
wherein the sponge cleaning tool is configured to include first and second sponge cleaning tools:
the substrate cleaning apparatus further comprising:
a first self-cleaning unit configured to dean the first sponge cleaning tool, the first self-cleaning unit being arranged around the substrate which is held by the substrate holding part in the chamber;
a second self-cleaning unit configured to dean the second sponge cleaning tool the second self-cleaning unit being arranged around the substrate which is held by the substrate holding part in the chamber; and
a pulling-out mechanism capable of pulling out the first self-cleaning unit with the first sponge cleaning tool with respect to the chamber thereby performing a maintenance of the first sponge cleaning tool disposed outside the chamber while cleaning the substrate with the second sponge cleaning tool inside the chamber.

US Pat. No. 10,032,656

SUBSTRATE PROCESSING APPARATUS

EBARA CORPORATION, Tokyo...

1. A substrate processing apparatus for processing a substrate for use in manufacturing of a semiconductor device, comprising:a substrate holder having chucks configured to hold a peripheral portion of a substrate and rotate the substrate;
a camera configured to take an image of the substrate holder and the substrate;
a natural frequency calculator storing a database comprising relative angles between a line connecting one of the chucks to a center of the substrate and a line connecting a notch of the substrate to the center of the substrate and data of corresponding Young's modulus and corresponding Poisson's ratio, the natural frequency calculator being configured to calculate a relative angle between the line connecting one of the chucks to the center of the substrate and the line connecting the notch of the substrate to the center of the substrate from the image, determine a Young's modulus and a Poisson's ratio corresponding to the calculated relative angle, and calculate a natural frequency of the substrate from specifications inherent in the substrate including the determined Young's modulus and the determined Poisson's ratio; and
a processing controller configured to control a rotational speed of the substrate based on the natural frequency of the substrate.

US Pat. No. 9,855,638

DRESSING APPARATUS, POLISHING APPARATUS HAVING THE DRESSING APPARATUS, AND POLISHING METHOD

Ebara Corporation, Tokyo...

1. A dressing apparatus, comprising:
a dresser configured to rub against a polishing surface to dress the polishing surface that is used for polishing a substrate;
a dresser shaft that applies a load to the dresser;
at least one load-applying device configured to apply a downward load to a part of a peripheral portion of the dresser, the
at least one load-applying device including:

at least one pressing member configured to press the dresser; and
at least one pneumatic cylinder configured to move the pressing member vertically; and
an operation controller configured to control operation of the at least one load-applying device, the operation controller
including at least one gas pressure regulator configured to regulate a pressure of a compressed air supplied to the at least
one pneumatic cylinder; and

a relatively moving mechanism configured to move the load-applying device relative to the dresser, wherein the relatively
moving mechanism comprises a rotating mechanism configured to rotate the load-applying device around the dresser shaft and
wherein the rotating mechanism includes:

an annular ring gear being concentric with the dresser shaft; and
a pinion gear being in mesh with the annular ring gear.

US Pat. No. 9,849,557

COUPLING MECHANISM, SUBSTRATE POLISHING APPARATUS, METHOD OF DETERMINING POSITION OF ROTATIONAL CENTER OF COUPLING MECHANISM, PROGRAM OF DETERMINING POSITION OF ROTATIONAL CENTER OF COUPLING MECHANISM, METHOD OF DETERMINING MAXIMUM

EBARA CORPORATION, Tokyo...

13. A method of determining a position of a rotational center of a coupling mechanism which includes an upper spherical bearing
and a lower spherical bearing having a same rotational center and tiltably couples a rotating body to a drive shaft, comprising:
specifying an equation of motion for a tilting motion of a displacement portion which can tilt about the rotational center
when the rotating body is in sliding contact with a polishing pad supported by a rotating polishing table, while rotating
the rotating body;

specifying a stability condition expression for the tilting motion for preventing flutter or vibration of the rotating body,
based on the equation of motion for the tilting motion;

calculating a range of a position of the rotational center for preventing the flutter or vibration of the rotating body, based
on the stability condition expression for the tilting motion; and

determining the position of the rotational center which falls within the calculated range.

US Pat. No. 9,849,488

UNIT CONTROL PANEL, SUBSTRATE TRANSFER TEST METHOD, AND SUBSTRATE PROCESSING APPARATUS

EBARA CORPORATION, Tokyo...

1. A unit control panel provided in at least one of units of a substrate processing apparatus, the substrate processing apparatus
processing a substrate with transferring the substrate between the units assembled together, comprising
a test control section configured to perform a substrate transfer test for a unit provided with the unit control panel using
a substrate table which is installed outside the unit while the unit is not assembled together with another unit, the test
control section configured to determine whether a major failure occurs in the unit executing the substrate transfer test,

wherein the substrate transfer test is performed by:
selecting a scenario for which a transport route for the substrate is presented as a plurality of blocks;
selecting a scenario start position from which transport of the substrate is to be started by selecting any one of the blocks;
receiving the number of repetitions of the selected scenario; and
transferring the substrate based on the selected scenario and the received number of repetitions of the selected scenario.

US Pat. No. 9,835,168

CASING LINER FOR SEWAGE PUMP AND SEWAGE PUMP WITH THE SAME

EBARA CORPORATION, Tokyo...

1. A casing liner used for a sewage pump, the casing liner comprising:
a surface to face an edge of a blade of an impeller when the casing liner is assembled with the impeller into the sewage pump,
wherein

at least one groove with given width is formed in at least a part of the surface, and
the groove includes a first section with given depth, which is located on the side close to a rotational center of the impeller,
a second section smaller in depth than the first section, which is located on the side far from the rotational center of the
impeller, and a third section that is an inclined face connecting the first and second sections, the first to third sections
being arranged in a width direction of the groove,

wherein an inclination of the bottom surface of the groove changes across a boundary of the first and third sections and across
a boundary of the second and third sections.

US Pat. No. 9,786,532

SUBSTRATE PROCESSING APPARATUS AND METHOD OF TRANSFERRING A SUBSTRATE

EBARA CORPORATION, Tokyo...

1. A substrate processing apparatus, comprising:
a transferring device including a grasping section configured to grasp a substrate holder, and a transferring section configured
to transfer the substrate holder grasped by the grasping section; and

a processing bath for storing the substrate holder holding a substrate with a surface thereof oriented vertically, and processing
the substrate,

wherein the grasping section is configured to rotate the substrate holder from a vertical position to a horizontal position
upwardly away from the processing bath and grasp the substrate holder with the surface of the substrate oriented horizontally,
and

the transferring section is configured to transfer the substrate holder above the processing bath, after the grasping section
rotates the substrate holder, with the surface of the substrate oriented horizontally.

US Pat. No. 9,728,374

INSPECTION APPARATUS

EBARA CORPORATION, Tokyo...

1. A focus adjustment method used in an inspection apparatus,
the inspection apparatus comprising:
beam generation means that generates any of charged particles and electromagnetic waves as a beam;
a primary optical system that irradiates an inspection object held in a working chamber with the beam;
a secondary optical system that detects secondary charged particles occurring from the inspection object; and
an image processing system that forms an image on the basis of the detected secondary charged particles, wherein
irradiation energy of the beam is set in an energy region where mirror electrons are emitted from the inspection object as
the secondary charged particles due to the beam irradiation,

the secondary optical system comprises a camera for detecting the secondary charged particles, a numerical aperture whose
position is adjustable along an optical axis direction and a lens that forms an image of the secondary charged particles that
have passed through the numerical aperture on an image surface of the camera, and

in the image processing system, the image is formed under an aperture imaging condition where the position of the numerical
aperture is located on an object surface to acquire an image,

the focus adjustment method comprising:
imaging an image under the aperture imaging condition at a certain focus point, and
moving the focus toward a plus direction when a region of the mirror electrons in the image crushes in the longitudinal direction
and extends in the lateral direction, or moving the focus toward a minus direction when a peak of the region of the mirror
electrons in the image is split into two parts.

US Pat. No. 9,724,797

POLISHING APPARATUS

EBARA CORPORATION, Tokyo...

1. A polishing apparatus for polishing a substrate while pressing the substrate against a polishing surface, said polishing
apparatus comprising:
a top ring body configured to press the substrate against said polishing surface; and
a retainer ring assembly configured to press said polishing surface, said retainer ring assembly being provided at a peripheral
portion of said top ring body,

wherein said retainer ring assembly includes:
a rolling diaphragm having a pressure chamber formed therein;
a passage for supplying a fluid to the pressure chamber to vertically expand or contract said rolling diaphragm;
a piston connected to said rolling diaphragm;
a ring member connected to said piston, said ring member being vertically movable according to an operation of said rolling
diaphragm, said ring member being brought into contact with said polishing surface;

a cylinder housing said rolling diaphragm therein; and
a connection sheet capable of being expanded and contracted in a vertical direction, said connection sheet being connected
to an outer periphery of both said cylinder and said ring member so as to cover an outer peripheral gap between said cylinder
and said ring member.

US Pat. No. 9,707,661

POLISHING METHOD AND POLISHING APPARATUS

EBARA CORPORATION, Tokyo...

1. A polishing method comprising:
pressing a substrate against a polishing pad on a polishing table by a polishing head, which has a substrate holding surface
and a pressure chamber formed by a membrane, while moving the polishing table and the polishing head relative to each other,
thereby polishing the substrate;

opening a primary-side valve located at a primary side of a fluid storage element while keeping a secondary-side valve located
at a secondary side of the fluid storage element in a closed state, thereby storing a fluid in the fluid storage element,
the fluid having a pressure that has been regulated by a pressure regulator located on the primary side of the fluid storage
element;

closing the primary-side valve to a closed state;
opening the secondary-side valve while the primary-side valve is in the closed state to supply the fluid from the fluid storage
element into the pressure chamber, thereby inflating the membrane to form a gap between the substrate and the membrane; and

ejecting a releasing shower into the gap, thereby releasing the substrate from the polishing head.

US Pat. No. 9,687,955

POLISHING APPARATUS

EBARA CORPORATION, Tokyo...

1. A polishing apparatus comprising:
a polishing table for supporting a polishing pad;
a top ring configured to press a substrate against a polishing surface of the polishing pad;
a table rotating motor configured to rotate said polishing table about its own axis;
a top ring rotating motor configured to rotate said top ring about its own axis;
a pad-height measuring device configured to measure a height of the polishing pad; and
a diagnostic device configured to monitor the height of the polishing pad, a torque or current of said table rotating motor,
and a torque or current of said top ring rotating motor,

wherein said diagnostic device is configured to
(i) calculate an amount of wear of the polishing pad from the height of the polishing pad,
(ii) diagnose a life of the polishing pad based on all of three factors, which are (1) the amount of the wear of the polishing
pad, (2) a change in the torque or current of said table rotating motor during a period in which a plurality of substrates
have been polished, and (3) a change in the torque or current of said top ring rotating motor during the period in which the
plurality of substrates have been polished, and

(iii) provide notification that the polishing pad should be replaced when the diagnosed life of the polishing pad has reached
an end,

wherein said diagnostic device is configured to calculate an average of the torque or current of said table rotating motor
obtained each time one substrate is polished and an average of the torque or current of said top ring rotating motor obtained
each time one substrate is polished and to diagnose the life of the polishing pad based on the amount of the wear of the polishing
pad, the average of the torque or current of said table rotating motor, and the average of the torque or current of said top
ring rotating motor, and

wherein said diagnostic device is configured to judge the life of the polishing pad based on a combination of the amount of
wear of the polishing pad, and a point of time when the average of the current of said table rotating motor becomes more than
the average of the current of said top ring rotating motor.

US Pat. No. 9,687,958

WET TREATMENT APPARATUS AND SUBSTRATE TREATMENT APPARATUS PROVIDED WITH THE SAME

Ebara Corporation, Tokyo...

1. A wet treatment apparatus comprising:
a first base frame;
a second base frame separable from the first base frame and arranged adjacent to the first base frame in a lateral direction;
a first waterproofing pan installed on an upper face of the first base frame; and
a second waterproofing pan installed on an upper face of the second base frame,
wherein the first waterproofing pan has an end, the second waterproofing pan has an end extending upwardly, the end of the
first waterproofing pan and the end of the second waterproofing pan are arranged to overlap each other at least in planer
view, and the end of the first waterproofing pan is arranged in a higher position than the end of the second waterproofing
pan,

the wet treatment apparatus further comprises a structure attached to the first waterproofing pan or the second waterproofing
pan, and

the structure extends in a vertical direction, has a length longer than a gap in a vertical direction between the first waterproofing
pan and the second waterproofing pan, is configured to waterproof the gap between the first waterproofing pan and the second
waterproofing pan, and has flexibility.

US Pat. No. 9,660,496

CANNED MOTOR AND VACUUM PUMP

Ebara Corporation, Tokyo...

1. A canned motor to be coupled to a vacuum pump and used as a rotary driving source for the vacuum pump, the canned motor
comprising:
a stator core;
a rotor provided on an inner side of the stator core; and
a can provided between the stator core and the rotor, the can being configured to separate the stator core and the rotor from
each other, the can including a barrel portion having a hollow shape and extending in a direction of a rotation center axis
line of the rotor, and an opening portion for forming an opening of the barrel portion on a first side directly coupled to
the vacuum pump in the direction of the rotation center axis line,

wherein the stator core and the rotor are separated from each other in a hermetically sealed manner by the can and an O-ring
provided on an outer surface of the opening portion of the can along a circumferential direction,

the can is formed of resin,
the opening portion includes:
a first part formed to extend from the barrel portion toward the outer side of the can in the direction crossing the direction
of the rotation center axis line;

a second part formed to extend from the first part toward the first side; and
ribs formed between the first part and the second part, and
a thickness of each of the first part and the second part is equal to or larger than the thickness of the barrel portion,
and equal to or smaller than twice the thickness of the barrel portion.

US Pat. No. 9,640,384

SUBSTRATE CLEANING APPARATUS AND SUBSTRATE CLEANING METHOD

Ebara Corporation, Tokyo...

1. A substrate cleaning method, comprising:
holding and rotating a substrate;
imparting an ultrasonic vibration energy to deaerated pure water and then supplying the deaerated pure water onto a surface
of the substrate to form a film of the deaerated pure water on the surface of the substrate;

spraying a mist of deaerated pure water from at least one spray nozzle into an inert gas atmosphere to incorporate an inert
gas into the mist of deaerated pure water; and

supplying the mist of deaerated pure water that has passed through the inert gas atmosphere onto the film of the deaerated
pure water to increase a concentration of the inert gas dissolved in the film of the deaerated pure water, thereby cleaning
the surface of the substrate with the film of the deaerated pure water having the increased concentration of the inert gas.

US Pat. No. 9,632,061

EDDY CURRENT SENSOR AND POLISHING METHOD

Ebara Corporation, Tokyo...

1. An eddy current sensor disposed near a metal film or a conductive film formed on a substrate to detect an eddy current
generated in the metal film or the conductive film, said eddy current sensor comprising:
a plurality of detection coils comprising an inner detection coil and an outer detection coil spaced from each other, said
outer detection coil being configured to surround said inner detection coil; and

a plurality of exciting coils comprising an inner exciting coil and an outer exciting coil spaced from each other, said outer
exciting coil being configured to surround said inner exciting coil;

wherein said plurality of detection coils are configured to detect respective eddy currents generated in the metal film or
the conductive film; and

wherein each of said plurality of exciting coils is connected to an AC signal source and configured to generate an eddy current
in the metal film or the conductive film.

US Pat. No. 9,630,289

POLISHING METHOD INVOLVING A POLISHING MEMBER POLISHING AT ANGLE TANGENT TO THE SUBSTRATE ROTATIONAL DIRECTION

Ebara Corporation, Tokyo...

17. A polishing method, comprising:
adjusting a pressing member in a position displaced along an inner edge of the pressing member by a predetermined distance
such that an angle between the inner edge and a straight line, extending from a center of the substrate to a midpoint of the
inner edge, is not a right angle as viewed from above the substrate;

locating the pressing member at the adjusted position;
rotating the substrate; and
pressing a polishing tape against an edge portion of the substrate by the pressing member in the adjusted position to form
a horizontal surface on the edge portion of the substrate.

US Pat. No. 9,624,596

ELECTROCHEMICAL DEPOSITION METHOD

EBARA CORPORATION, Tokyo...

1. A substrate holder for holding a substrate having a surface to be electroplated, said substrate holder comprising:
a fixed holding member;
a movable holding member, the fixed holding member and the movable holding member being arranged and configured for holding
the substrate therebetween, the movable holding member having a sealing member; and

at least one pair of conductors for detecting a liquid leak, the at least one pair of conductors extending along an entire
circumference of the sealing member and being located inside the sealing member spaced a distance from the substrate while
the substrate is held between the movable holding member and the fixed holding member, the at least one pair of conductors
having open first ends and having second ends to be connected to an electric resistance measuring device, the at least one
pair of conductors being configured to short-circuit via a leaked plating solution when a plating solution leaks to a back
side of the substrate held between the movable holding member and the fixed holding member.

US Pat. No. 9,625,168

EXHAUST SYSTEM

Ebara Corporation, Tokyo...

1. An exhaust system for evacuating a chamber of a manufacturing apparatus for manufacturing semiconductor devices, liquid
crystal panels, LEDs, or solar cells comprising:
a vacuum pump apparatus configured to evacuate said chamber;
an exhaust gas treatment apparatus configured to treat an exhaust gas discharged from said chamber;
a pipe for connecting said manufacturing apparatus, said vacuum pump apparatus and said exhaust gas treatment apparatus; and
a controller configured to control said vacuum pump apparatus and/or said exhaust gas treatment apparatus;
wherein information of operation process of said manufacturing apparatus, and the kind of gas and the flow rate of the gas
supplied to said manufacturing apparatus is inputted into said controller to control said vacuum pump apparatus and/or said
exhaust gas treatment apparatus;

wherein said vacuum pump apparatus comprises a first vacuum pump having two compression stages and a second vacuum pump having
two compression stages, and a pump suction port connected to said chamber is provided in said first vacuum pump and a pump
exhaust port connected to said exhaust gas treatment apparatus is provided in said second vacuum pump;

wherein pressure at an interstage part between said two compression stages of said second vacuum pump is measured by a pressure
sensor, and said controller judges whether a process gas is introduced from said pump suction port to an interior of said
first vacuum pump or not based on a measured pressure value; and

wherein said controller is configured to predict the time when maintenance is required of said vacuum pump apparatus or said
exhaust gas treatment apparatus based at least in part on the kind of gas and quantity of the gas supplied to said manufacturing
apparatus, and to output the prediction information to said manufacturing apparatus.

US Pat. No. 9,611,563

PLATING METHOD AND PLATING APPARATUS

Ebara Corporation, Tokyo...

1. A method of plating a substrate while holding the substrate by a substrate holder having a first holding member and a second
holding member which has an opening, said method comprising:
holding the substrate with the substrate holder by supporting one surface of the substrate with the first holding member while
placing the second holding member in contact with other surface of the substrate, with the other surface of the substrate
exposed through the opening of the second holding member;

sealing a gap between the first holding member and the second holding member by a first protruding portion of the second holding
member while sealing a peripheral portion of the substrate by a second protruding portion of the second holding member when
the substrate is held by the substrate holder, thereby forming an internal space in the substrate holder by the first holding
member, the second holding member, and the substrate;

covering with a seal case the other surface of the substrate exposed through the opening;
sealing a gap between the first holding member and the seal case to form a hermetic space between the substrate holder and
the seal case; and

performing a leakage test by supplying a tracer gas into the hermetic space while evacuating air from the internal space and
checking whether the air evacuated from the internal space contains the tracer gas.

US Pat. No. 9,614,411

CANNED MOTOR AND VACUUM PUMP

Ebara Corporation, Tokyo...

1. A canned motor to be coupled to a vacuum pump and used as a rotary driving source for the vacuum pump, the canned motor
comprising:
a stator core;
a rotor provided on an inner side of the stator core; and
a non-conductive can provided between the stator core and the rotor, the non-conductive can being configured to separate the
stator core and the rotor from each other in a state in which the non-conductive can is held in contact with the stator core,
the non-conductive can being made of resin, ceramic, or composite material thereof, wherein:

the non-conductive can is bonded to the stator core with an adhesive through an underlayer formed on an outer surface of the
non-conductive can; and

the underlayer is formed of non-conductive material having a higher affinity for the adhesive than the non-conductive can.

US Pat. No. 9,579,768

METHOD AND APPARATUS FOR POLISHING A SUBSTRATE

EBARA CORPORATION, Tokyo...

1. A polishing method of polishing a surface of a substrate as an object to be polished by pressing the substrate against
a polishing pad on a polishing table while a polishing liquid is supplied onto the polishing pad, said polishing method comprising:
ejecting a gas toward the polishing pad from at least one gas ejection nozzle; and
blowing the gas onto the polishing pad by adjusting a direction of the gas ejected from said at least one gas ejection nozzle
with a gas direction adjustment plate provided near said gas ejection nozzle.

US Pat. No. 9,550,269

POLISHING DEVICE AND POLISHING METHOD

Ebara Corporation, Tokyo...

1. A polishing device that polishes a surface to be polished of an object to be polished by relatively sliding the surface
to be polished and a polishing member, comprising:
a pressing unit that presses the surface to be polished against the polishing member by pressing a back side of the surface
to be polished of the object to be polished;

a thickness measuring unit that estimates a remaining film profile of the surface to be polished of the object to be polished
during polishing of the object to be polished; and

a control unit that controls a pressing force on the back side of the surface to be polished by the pressing unit in accordance
with a measurement result by the thickness measuring unit during the polishing of the object to be polished, wherein

the control unit controls not only the pressing force by the pressing unit during the polishing of the object to be polished,
but also a periphery of the pressing unit affecting a pressing force of the surface to be polished on the polishing member
during the polishing, and

the control unit calculates a pressing force of the periphery during the polishing using a relationship of the pressing unit
and the periphery with a polishing rate of the surface to be polished whose back side is directly pressed by the pressing
unit.

US Pat. No. 9,475,167

POLISHING APPARATUS HAVING TEMPERATURE REGULATOR FOR POLISHING PAD

Ebara Corporation, Tokyo...

1. An apparatus for polishing a substrate by bringing the substrate into sliding contact with a polishing pad, said apparatus
comprising:
a polishing table configured to be rotatable about its axis and support the polishing pad;
a top ring configured to press the substrate against the polishing pad on said polishing table; and
a pad temperature regulator configured to regulate a surface temperature of the polishing pad and provided above said polishing
table,

wherein said pad temperature regulator includes
a pad contact element brought into contact with a surface of the polishing pad, and
a liquid supply system configured to supply a temperature-controlled liquid to said pad contact element,
wherein said pad contact element has a space therein and a partition that divide the space into a first liquid passage and
a second liquid passage,

wherein said first liquid passage and said second liquid passage are connected in series at a location above a central portion
of said polishing table,

wherein said first liquid passage is in communication with a liquid inlet coupled to said liquid supply system,
wherein said second liquid passage is in communication with a liquid outlet coupled to said liquid supply system,
wherein said partition extends in a radial direction of said polishing table, and
wherein plural baffles, extending substantially perpendicular to said partition and in approximately a circumferential direction
of said polishing table, are provided in each of said first liquid passage and said second liquid passage, said plural baffles
being staggered alternately to form each of said first liquid passage and said second liquid passage into a zigzag passage
that extends alternately in a rotating direction of the polishing table and in a direction against the rotating direction,

wherein said plural baffles comprise first baffles and second baffles, said first baffles being connected to said partition
and being substantially perpendicular to said partition, said second baffles being connected to a side of said pad contact
element, and

wherein said first baffles and said second baffles are staggered alternately along a radial direction of said polishing table.

US Pat. No. 9,378,997

SUBSTRATE HOLDING MECHANISM, SUBSTRATE TRANSPORTING DEVICE, AND SEMICONDUCTOR MANUFACTURING APPARATUS

EBARA CORPORATION, Tokyo...

1. A substrate holding mechanism comprising:
a substrate holding claw for holding the substrate,
wherein the substrate holding claw includes a slant face for sliding the substrate thereon, height of the slant face being
increased from the inside of a space for holding the substrate toward the outside of the space,

wherein a machining mark including at least one of a linear mark and substantially parallel marks is formed on the slant face,
and

wherein a crossing angle of a direction in which the at least one of the linear mark and the substantially parallel marks
is formed and a direction in which the substrate is slid is not less than 0 degree and not more than 45 degrees at least in
a partial region of the slant face.

US Pat. No. 9,815,171

SUBSTRATE HOLDER, POLISHING APPARATUS, POLISHING METHOD, AND RETAINING RING

EBARA CORPORATION, Tokyo...

1. A substrate holder for pressing a substrate against a polishing pad, comprising:
a top ring body configured to hold the substrate; and
a single retaining ring having an outer circumferential surface which provides a lowest part of an outermost exposed surface
of the substrate holder, the single retaining ring including a pad pressing structure in an annular shape which is to be brought
into contact with the polishing pad, the pad pressing structure having an inner circumferential surface which provides a substrate
holding surface, and the pad pressing structure having a width in a range of 3 mm to 7.5 mm.

US Pat. No. 9,782,870

POLISHING METHOD AND POLISHING APPARATUS

EBARA CORPORATION, Tokyo...

1. A polishing apparatus for polishing a substrate by pressing the substrate against a polishing pad on a polishing table,
comprising:
a top ring configured to press the substrate against the polishing pad on the polishing table; and
a pad temperature adjustment mechanism configured to adjust a surface temperature of the polishing pad radially extending
annular areas,

wherein the pad temperature adjustment mechanism comprises a plurality of pad contact members configured to be brought in
contact with the surface of the polishing pad to heat or cool the polishing pad, and arranged linearly from a central part
to an outer circumferential part of the polishing pad in a radial direction of the surface of the polishing pad and configured
to adjust the temperature in the radial direction of the polishing pad for each corresponding annular area of the polishing
pad; and

a controller configured to individually control each of the plurality of pad contact members to adjust the temperature in
the radial direction of the polishing pad for each corresponding annular area of the polishing pad wherein heated water or
cold water can be supplied to each of the plurality of pad contact members at a controlled flow rate, further comprising:

a liquid supply system comprising a liquid supply tank having a heater therein, a heated water supply line having a first
valve configured to supply heated water from the liquid supply tank to the pad contact member, a return line having a second
valve configured to return the heated water from the pad contact member to the liquid supply tank, a cold water supply line
having a third valve configured to supply cold water to the pad contact member, and a discharge line having a fourth valve
configured to discharge the heated water or the cold water from the pad contact member to the outside of the liquid supply
system,

wherein when the liquid to be supplied to at least one of the pad contact members is switched between the heated water and
the cold water, the valve switching is performed with an appropriate delay so that the cold water is supplied to the at least
one of the pad contact members after returning the heated water, remaining in the at least one of the pad contact members
and piping, to the liquid supply system or the heated water is supplied to the at least one of the pad contact members after
discharging the cold water remaining in the at least one of the pad contact members and piping.

US Pat. No. 9,708,724

ANODE UNIT AND PLATING APPARATUS HAVING SUCH ANODE UNIT

Ebara Corporation, Tokyo...

1. An anode unit comprising:
an anode;
a first feeding portion electrically connected to a central portion of the anode;
a second feeding portion located on a central axis of the anode and located away from the anode; and
arms extending radially from the second feeding portion, each of the arms being made of conductive material and being electrically
connected to a periphery of the anode, the arms being arranged at regular intervals along a circumferential direction of the
anode.

US Pat. No. 9,700,988

SUBSTRATE PROCESSING APPARATUS

Ebara Corporation, Tokyo...

1. A buff process module, comprising:
a buff table on which a substrate is mounted;
a buff head configured to hold a buff pad for applying a predetermined process to the substrate;
a buff arm that supports and swings the buff head;
a dresser for dressing the buff pad,
wherein a groove is formed on the surface of the buff pad, and a cleaning mechanism, includes an atomizer configured to supply
a high pressure cleaning fluid to remove deposit in the groove.

US Pat. No. 9,616,360

GAS-LIQUID SEPARATOR AND POLISHING APPARATUS

EBARA CORPORATION, Tokyo...

1. A polishing apparatus comprising:
a polishing table having a polishing surface;
a top ring configured to hold a substrate and press the substrate against the polishing surface;
a processing liquid supply nozzle configured to supply a processing liquid to the polishing surface;
a drain receiver disposed around the polishing table and configured to recover a gas-liquid two-phase flow that has been removed
from the polishing table, the gas-liquid two-phase flow containing the processing liquid; and

a gas-liquid separator configured to separate the gas-liquid two-phase flow, which has been recovered by the drain receiver,
into a gas and a liquid and discharging the gas and the liquid,

the gas-liquid separator including:
a gas-liquid separation tank;
a gas-liquid introduction pipe configured to introduce a the gas-liquid two-phase flow into the gas-liquid separation tank,
the gas-liquid introduction pipe extending in the gas-liquid separation tank;

a spray nozzle configured to spray pure water onto the liquid that has been separated from the gas-liquid two-phase flow and
has been collected on a bottom of the gas-liquid separation tank, the collected liquid containing the processing liquid, the
spray nozzle comprises an orifice directed vertically and downwardly toward the bottom of the liquid separation tank, wherein
the spray nozzle comprises a first nozzle having the orifice directed vertically and downwardly and a second nozzle, the second
nozzle having an orifice directed at an angle relative to the first nozzle;

a drain pipe communicating with a liquid discharge outlet provided in the bottom of the gas-liquid separation tank; and
an exhaust pipe communicating with a gas discharge outlet provided in a side wall of the gas-liquid separation tank, the gas
discharge outlet being located above a lower end of the gas-liquid introduction pipe.

US Pat. No. 9,573,241

POLISHING APPARATUS AND POLISHING METHOD

Ebara Corporation, Tokyo...

1. A polishing apparatus for polishing a substrate by bringing the substrate into sliding contact with a polishing surface,
comprising:
a polishing head including an elastic membrane for pressing the substrate against the polishing surface and a retainer ring
arranged so as to surround the substrate, the retainer ring being capable of contacting the polishing surface;

a rotating mechanism configured to rotate the polishing head about its own axis;
a rotation angle detector configured to detect a rotation angle of the polishing head; and
a polishing controller configured to periodically change a polishing condition of the substrate in synchronization with the
rotation angle of the polishing head.

US Pat. No. 10,096,492

SUBSTRATE CLEANING APPARATUS AND POLISHING APPARATUS

EBARA CORPORATION, Tokyo...

1. A substrate cleaning apparatus, comprising:a cleaning vessel for housing a substrate therein;
a substrate holder arranged in the cleaning vessel;
a chemical liquid nozzle for supplying a chemical liquid onto the substrate held by the substrate holder;
a plurality of cleaning liquid nozzles for supplying a cleaning liquid toward a hydrophilic inner surface of the cleaning vessel, the hydrophilic inner surface surrounding the substrate holder, each one of the plurality of cleaning liquid nozzles being oriented outwardly in a non-vertical direction away from the substrate holder and toward the hydrophilic inner surface; and
an oscillation mechanism for causing the plurality of cleaning liquid nozzles to oscillate,
wherein the plurality of cleaning liquid nozzles are arranged so as to form a film of the cleaning liquid on the hydrophilic inner surface such that the film surrounds an entire circumference of the substrate holder while the chemical liquid nozzle supplies the chemical liquid onto the substrate held by the substrate holder,
the hydrophilic inner surface comprises a front surface, a back surface, and two side surfaces, and
the plurality of cleaning liquid nozzles includes a first nozzle oriented toward the front surface, a second nozzle oriented toward the back surface, a third nozzle oriented toward one of the two side surfaces, and a fourth nozzle oriented toward other of the two side surfaces.

US Pat. No. 10,040,166

POLISHING APPARATUS

EBARA CORPORATION, Tokyo...

1. A top ring comprising:an upper member;
a lower member held under the upper member, the lower member being configured to press a substrate against a polishing surface;
a first elastic membrane that has an inner end and an outer end, both of the inner end and the outer end are fixed in place relative to the upper member, the first elastic membrane forming a pressure chamber;
a ring member configured to surround the lower member and the substrate, the ring member configured to press against the polishing surface according to a supply of a pressurized fluid into the pressure chamber independently of the lower member,
wherein the first elastic membrane has a bent portion, the ring member is connected to the first elastic membrane such that the bent portion folds over an upper portion of the ring member when an inner pressure in the pressure chamber decreases, and the ring member is connected to the first elastic membrane such that when the inner pressure in the pressure chamber increases the bent portion rolls out to push the ring member against the polishing surface.

US Pat. No. 10,035,239

POLISHING APPARATUS, POLISHING HEAD, AND RETAINER RING

EBARA CORPORATION, Tokyo...

1. A polishing apparatus, comprising:a polishing table for supporting a polishing pad;
a polishing head for pressing a substrate against the polishing pad; and
a head motor for rotating the polishing head,
wherein the polishing head includes:
a head body having a substrate contact surface;
a drive ring coupled to the head body; and
a retainer ring surrounding the substrate contact surface and coupled to the drive ring,
a first screw thread is formed on the drive ring,
a second screw thread, which engages with the first screw thread, is formed on the retainer ring, and
the second screw thread extends in a circumferential direction of the retainer ring; and wherein:
the drive ring includes an annular drive ring body and an annular protrusion which protrudes downwardly from a lower surface of the annular drive ring body;
an annular recess, which houses the annular protrusion therein, is formed in an upper surface of the retainer ring; and
the first screw thread is formed on a side surface of the annular protrusion, and the second screw thread is formed on a side surface of the annular recess.

US Pat. No. 9,969,046

METHOD AND APPARATUS FOR POLISHING A SUBSTRATE

EBARA CORPORATION, Tokyo...

1. A polishing apparatus for polishing a surface of a substrate, the polishing apparatus comprising:a polishing table having a polishing pad thereon;
a polishing head configured to hold the substrate and to press the substrate against the polishing pad; and
a pad temperature control device configured to control a temperature of the polishing pad, the pad temperature control device comprising:
at least one gas ejection nozzle for ejecting a gas toward the polishing pad and configured to blow the gas onto the polishing pad to control a temperature of the polishing pad; and
an atomizer having at least one nozzle for ejecting a liquid or a mixed fluid of a gas and a liquid and configured to blow the liquid or the mixed fluid onto the polishing pad to remove foreign matter from the polishing pad,
wherein the at least one gas ejection nozzle and the atomizer are integrated with each other.

US Pat. No. 9,847,263

SUBSTRATE PROCESSING METHOD INCLUDING REPROCESSING REJECTED WAFERS

EBARA CORPORATION, Tokyo...

1. A substrate processing method for performing a predetermined processing of a substrate while sequentially transporting
the substrate to a plurality of processing sections of a substrate processing apparatus provided in a fabrication plant according
to a preset recipe, the substrate processing method comprising:
processing the substrate in one of the processing sections of the substrate processing apparatus, processing results of the
substrate processing apparatus being managed by an online system provided outside the substrate processing apparatus and provided
in the fabrication plant and having a host computer and operational situation of the substrate processing apparatus being
monitored by a monitoring system which is an independent system provided outside the substrate processing apparatus and provided
in the fabrication plant;

interrupting the processing of the substrate by a processing interruption command sent from the monitoring system to the substrate
processing apparatus during processing of the substrate;

setting the substrate whose processing has been interrupted in a standby state in the substrate processing apparatus, wherein
the processing results of the substrate being interrupted are not reported from the substrate processing apparatus to the
online system;

customizing the recipe and performing reprocessing of the processing-interrupted substrate according to the customized recipe
in the substrate processing apparatus, or performing reprocessing of the processing-interrupted substrate according to a preset
recipe for reprocessing in the substrate processing apparatus; and

reporting the result of processing which has been executed according to the customized recipe or the preset recipe for reprocessing
from the substrate processing apparatus to the online system having the host computer.

US Pat. No. 9,844,794

SUBSTRATE PLATING APPARATUS AND SUBSTRATE PLATING METHOD

EBARA CORPORATION, Tokyo...

1. A substrate plating apparatus comprising:
a substrate holder configured to hold a substrate with a sealing member pressing on a peripheral portion of the substrate;
a plating bath configured to plate a surface of the substrate when the substrate, held by the substrate holder, is immersed
in a plating solution;

a cleaning bath configured to clean the substrate holder and the substrate with a cleaning liquid;
an inner shell disposed in the cleaning bath and configured to house therein the substrate holder holding the substrate, the
inner shell including a shell side plate and shell end plates disposed at both sides of the shell side plate, both of the
shell end plates being configured to open and to close and having an inner surface which has an uneven configuration that
follows an uneven exterior configuration of the substrate holder holding the substrate, one of the shell end plates having
a plurality of through-holes facing a front side of the substrate holder; and

a cleaning liquid supply conduit configured to be in communication with the plurality of through-holes and to supply a cleaning
liquid through the plurality of through-holes into the inner shell when the inner shell is in a closed state to clean the
substrate, together with the substrate holder, with the cleaning liquid.