US Pat. No. 9,935,039

PRE-MOLDED INTEGRATED CIRCUIT PACKAGES

Carsem (M) SDN. BHD., Ip...

1. A leadframe with pre-molded cavities for use in making integrated circuit packages, the leadframe comprising:an outer frame; and
a plurality of units arranged within the outer frame, each unit of the plurality of units comprising a die pad and a plurality of leads, the die pad located near a center of the unit and the plurality of leads located around the die pad, wherein for each unit of the plurality of units a molding compound extends over:
a first portion of an upper surface of each of the plurality of leads that is located farthest from the die pad, and
an entire upper surface of the die pad, wherein a second portion of the upper surface of each of the plurality of leads that is located nearest the die pad remains exposed outside the molding compound, an upper surface of the molding compound that extends over the entire upper surface of the die pad extends upward beyond the upper surface of the plurality of leads and is entirely exposed, and a thickness of the molding compound covering the first portion of the upper surface of each of the plurality of leads is greater than a thickness of the molding compound covering the entire upper surface of the die pad.

US Pat. No. 10,147,700

FLEXIBLE WINDOW CLAMP

Carsem (M) Sdn. Bhd., Ip...

1. A window clamp for holding a leadframe during a wirebonding process, comprising:a center frame portion having a top surface, a bottom surface, and an outer edge, the outer edge extending between the top surface and the bottom surface and around a circumference of the center frame portion, wherein a plurality of windows extend from the top surface to the bottom surface through the center frame portion, and each of the plurality of windows are surrounded by an inner edge of the center frame portion, the plurality of windows arranged to expose one or more die of the leadframe when the window clamp is placed on the leadframe during the wirebonding process;
side portions each having a top surface, a bottom surface, and a side surface and each side portions arranged on an opposing side of the center frame portion, the side portions each providing a rigid structure for pressing the window clamp against the leadframe during the wirebonding process;
flexible members each extending between the side surface of each of the side portions and the outer edge of the center frame portion so that the flexible members fully isolate the side portions from the center frame portion, the flexible members allowing movement of the center frame portion in X, Y, and Z directions independent of movement of the side portions when the side portions are in contact with a clamping plate exerting a force on the side portions.

US Pat. No. 9,190,385

THIN PLASTIC LEADLESS PACKAGE WITH EXPOSED METAL DIE PADDLE

Carsem (M) SDN. BHD., Ip...

1. A method of making packages comprising:
providing a leadframe strip that includes a plurality of leadframes, each of the leadframes having a plurality of leads surrounding
a die paddle;

etching a surface of each of the leadframes to form a recessed region extending over an entire surface of the die paddle and
over a portion of each of the leads closest to the die paddle, wherein each of the leads of each leadframe has a lead tip
that is connected to the die paddle during the etching; thereafter

plating the leadframe strip to prepare the die paddle and the leads of each leadframe for die connection; thereafter
isolating each of the lead tips from the die paddle of each leadframe;
adhering a tape to a bottom side of the leadframe strip including the leads and the die paddle of each leadframe;
attaching a die to a top side of the die paddle of each leadframe;
forming ball bumps on each of the lead tips of each leadframe; and
within each leadframe, connecting the die to the ball bumps.

US Pat. No. 9,048,397

COLOR YIELD OF WHITE LEDS

Carsem (M) SDN. BHD., (M...

1. A method of manufacturing a light emitting component, the method comprising:
determining a color target for the light emitting component;
preparing a phosphor material based on the color target;
determining an initial amount of the phosphor material required to meet the color target for the light emitting component;
providing at least one light emitting die attached to a substrate;
disposing the initial amount of the phosphor material over the at least one light emitting die;
performing the steps of:
(i) comparing light emitted from the light emitting component to the color target;
(ii) if the light emitting component is above the color target, removing at least some of the initial amount of phosphor material
from the light emitting component;

(iii) if the light emitting component is below the color target, adding phosphor material to the light emitting component;
repeating steps (i) through (iii) more than once; and
curing the phosphor material disposed on the light emitting component.

US Pat. No. 9,640,517

STACKED ELECTRONIC PACKAGES

CARSEM (M) SDN. BHD., Ip...

1. A stacked electronic package, comprising: a substrate; a semiconductor die coupled to a first portion of an upper surface
of the substrate, the semiconductor die comprising an integrated circuit; a discrete electronic component coupled to a second
portion of the upper surface of the substrate, the discrete electronic component being separate from the semiconductor die,
and the first portion of the upper surface of the substrate being different from the second portion of the upper surface;
conductive straps each having sides, a top, and a bottom opposite the top, each conductive strap coupled along the bottom
to the upper surface of the substrate and spaced from the semiconductor die and the discrete electronic component, a first
one of the conductive straps disposed on a first side of the semiconductor die and a second one of the conductive straps disposed
on a second side of the semiconductor die opposite the first side, each conductive strap being separate from others of the
conductive straps and a length of at least one of the sides [of each conductive strap being greater than a width of at least
another one of the sides; an encapsulant extending over the semiconductor die, the discrete electronic component, and the
upper surface of the substrate and covering side surfaces of the substrate and the sides of the conductive straps; and a discrete
passive electronic component disposed over the semiconductor die and the discrete electronic component, each conductive strap
coupled along the top to a terminal of the discrete passive electronic component, each conductive strap extending between
the substrate and the discrete passive electronic component without extending over the semiconductor die and the discrete
electronic component, and each conductive strap including a cutout along the bottom.

US Pat. No. 9,691,688

THIN PLASTIC LEADLESS PACKAGE WITH EXPOSED METAL DIE PADDLE

CARSEM (M) SDN. BHD., Ip...

1. A method of making packages comprising:
providing a leadframe strip that includes a plurality of leadframes, each of the leadframes having a plurality of leads surrounding
a die paddle;

etching a surface of each of the leadframes to form a recessed region extending over an entire surface of the die paddle and
over a portion of each of the leads closest to the die paddle, wherein each of the leads of each leadframe has a lead tip
that is connected to the die paddle during the etching; thereafter

plating the leadframe strip to prepare the leads of each leadframe for die connection; thereafter
isolating each of the lead tips from the die paddle of each leadframe;
removing the die paddle of each leadframe;
adhering a tape to a bottom side of the leadframe strip including the leads of each leadframe; and
within each leadframe, attaching a flip chip to each of the lead tips.

US Pat. No. 10,468,319

LOW-PROFILE ELECTRONIC PACKAGE

CARSEM (M) SDN. BHD., Ip...

1. An electronic component comprising:a leadframe having a first surface positioned opposite and separated from a second surface by a leadframe thickness, and at least one aperture extending through the leadframe thickness creating an opening;
a semiconductor die having a first face disposed opposite a second face and positioned within the opening;
a dielectric material disposed within the opening and at least partially encapsulating the semiconductor die; and
an encapsulation layer disposed on the first surface of the leadframe and a first face of the semiconductor die.

US Pat. No. 11,114,367

MOLDED INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME

Carsem (M) SDN. BHD., Ip...


1. An IC package, comprising:a first leadframe, comprising:a first die pad, and
a plurality of first leads;

?a first die comprising a plurality of first bond pads, wherein the first die is attached to the first die pad of the first leadframe;
?a plurality of first bond wires, each attached to one of the first bond pads of the first die and to one of the first leads of the first leadframe;
?a first molded package body formed from a molding compound molded over each of:a portion of the first die pad of the first leadframe,
a portion of the first leads of the first leadframe,
a first portion of the first die, and
one or more of the first bond wires,

?wherein the first molded package body partially defines a first cavity, and wherein a second portion of the first die contacts neither of the first die pad and the first molded package body;
?a second die comprising a plurality of second bond pads, wherein the second die is attached to the second portion of the first die in the first cavity; and
?a plurality of second bond wires, each attached to one of the first bond pads of the first die and to one of the second bond pads of the second die; and
a second leadframe, comprising:
?a second die pad, and
?a plurality of second leads;
a third die, comprising a plurality of third bond pads, wherein the third die is attached to the second die pad of the second leadframe;
a plurality of third bond wires, each attached to one of the third bond pads of the third die and to one of the second leads of the second leadframe;
a second molded package body formed from the molding compound molded over each of:a portion of the second die pad of the second leadframe,
a portion of the second leads of the second leadframe,
a first portion of the third die, and
one or more of the third bond wires,
wherein the second molded package body partially defines a second cavity for the third die, and wherein a second portion of the third die contacts neither of the second die pad and the second molded package body;

a fourth die, comprising a plurality of fourth bond pads, wherein the fourth die is attached to the second portion of the third die; and
a plurality of fourth bond wires, each attached to one of the third bond pads of the third die and to one of the fourth bond pads of the fourth die.