US Pat. No. 9,544,989

NETWORK COMMUNICATION DEVICE

CYNTEC CO., LTD., Hsinch...

1. A network communication device, comprising:
a circuit board;
a network connector disposed on the circuit board;
a network chip disposed on the circuit board; and
a plurality of network magnetic assemblies disposed on the circuit board and electrically connected with the network connector
and the network chip, respectively, wherein each of the network magnetic assemblies includes an Ethernet transformer and at
least one inductor, and the Ethernet transformer is electrically connected in series with the inductor via a conductive trace
of the circuit board, wherein any two adjacent Ethernet transformers are separately arranged with a gap having a second specific
length,

wherein the Ethernet transformer comprises:
a magnetic core assembly including a first magnet core and a second magnet core, wherein the first magnet core comprises a
plurality of contact pin sets;

at least one primary winding set wound around the first magnet core and electrically connected with a portion of the contact
pin sets of the first magnet core; and

at least one secondary winding set wound around the first magnet core and electrically connected with the other portion of
the contact pin sets of the first magnet core.

US Pat. No. 9,386,686

METAL CORE PRINTED CIRCUIT BOARD AND ELECTRONIC PACKAGE STRUCTURE

CYNTEC CO., LTD., Hsin-C...

9. A metal core printed circuit board, comprising a first surface and a second surface and defining at least one through hole
wherein the first surface is opposite to the second surface, the through hole extends from the first surface to the second
surface, and the metal core printed circuit board comprises:
a metal layer, disposed on the second surface of the metal core printed circuit board;
a circuit layer, disposed on the metal layer and comprising a circuit layout, wherein the circuit layer includes at least
one conducting wiring layer and a layout insulating layer to form the circuit layout, and the metal layer is disposed over
the entire bottom surface of the circuit layer;

at least one insulating layer, disposed in the at least one through hole, wherein the at least one insulating layer comprises
a plastic sheath being an expansion bolt;

at least one rivet, nailed into and secured in the expansion bolt, wherein the expansion bolt of the at least one insulating
layer is disposed between the at least one rivet and the metal layer so that the at least one rivet is electrically insulated
from the metal layer, wherein the at least one rivet is solid so as to form at least one thermal passage, and does not have
space inside it, and the at least one rivet has a top surface disposed on the first surface of the metal core printed circuit;
and

at least one connecting pin, connected to the top surface of the at least one rivet.

US Pat. No. 9,129,769

PROTECTIVE DEVICE

CYNTEC CO., LTD., Hsinch...

1. A protective device, comprising:
a substrate;
a conductive section supported by the substrate, wherein the conductive section comprises a metal element electrically connected
between first and second electrodes, wherein the metal element serves as a sacrificial structure having a melting point lower
than that of the first and second electrodes;

a bridge element spanning across the metal element in a first direction across a direction of current flow in the metal element,
wherein the bridge element extends in the first direction farther than the metal element in the first direction and facilitates
breaking of the metal element upon melting, wherein the bridge element is made of metal;

an intermediate support disposed directly below the metal element and directly above the substrate, wherein the intermediate
support has no direct physical contact with any of the first electrode and the second electrode, and wherein at least one
end of the bridge element is fixed to and in direct physical contact with the intermediate support; and

a housing disposed on the substrate and fully covering the metal element and the bridge element, wherein the metal element
and the bridge element are located below a top of the housing,

wherein the metal element is located above the first and second electrodes and under the bridge element.

US Pat. No. 9,655,253

METHOD OF FABRICATION OF ENCAPSULATED ELECTRONICS DEVICES MOUNTED ON A REDISTRIBUTION LAYER

CYNTEC CO., LTD., Hsinch...

1. A method of forming a substrateless device, the method comprising the steps of:
disposing a plurality of electronic devices on a supporting body, wherein each of at least one of the plurality of electronic
devices is a discrete passive electrical component;

forming an encapsulant to encapsulate the plurality of electronic devices;
removing the supporting body for exposing a plurality of terminals of the plurality of electronic devices, wherein a first
terminal of a first electronic device and a second terminal of a second electronic device are exposed outside the encapsulant;
and

forming at least one circuit pattern layer over the plurality of electronic devices, wherein the first terminal of the first
electronic device is electrically connected to the second terminal of the second electronic device via at least one circuit
pattern of said at least one circuit pattern layer, wherein a third electronic device is disposed in the at least one circuit
pattern layer, wherein terminals of the third electronic device are electrically connected to the at least one circuit pattern
layer.

US Pat. No. 9,136,050

MAGNETIC DEVICE AND METHOD OF MANUFACTURING THE SAME

CYNTEC CO., LTD., Hsinch...

1. A magnetic device, comprising:
a lead frame having a first portion and a second portion spaced apart from the first portion, wherein the first portion comprises
a first bottom part and a first protrusion connected to the first bottom part, and the second portion comprises a second bottom
part and a second protrusion connected to the second bottom part;

a first core body disposed on the lead frame, wherein the first core body comprises a first through opening and a second through
opening;

a coil disposed on the first core body, wherein the coil has a first terminal and a second terminal, wherein at least a part
of the first protrusion is disposed in the first through opening and is electrically connected with the first terminal, and
at least a part of the second protrusion is disposed in the second through opening and is electrically connected with the
second terminal; and

a molding body, encapsulating the coil, the first protrusion and the second protrusion of the lead frame.

US Pat. No. 9,381,573

ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF

CYNTEC Co., Ltd., Hsinch...

1. An electronic device, comprising:
a first magnetic powder;
a second magnetic powder, wherein the mean particle diameter of the first magnetic powder is larger than the mean particle
diameter of the second magnetic powder, wherein the ratio of the mean particle diameter of the first magnetic powder to the
mean particle diameter of the second magnetic powder is greater than 2, and the first magnetic powder mixes with the second
magnetic powder; and

an insulated conducting wire buried in the mixture of the first magnetic powder and the second magnetic powder, wherein the
first magnetic powder is not pre-oxidized for insulation;

wherein the mixture of the first magnetic powder and the second magnetic powder and the insulated conducting wire buried therein
are combined to form an integral magnetic body at a temperature lower than 300° C., wherein particles of the second magnetic
powder are filled in the space among particles of the first magnetic powder for increasing the density of the integral magnetic
body so as to increase the permeability of the electronic device.

US Pat. No. 9,336,978

PROTECTIVE DEVICE

CYNTEC CO., LTD., Hsinch...

1. A protective device, comprising:
a substrate;
a conductive section supported by the substrate, wherein the conductive section comprises a metal element electrically connected
between a first electrode and a second electrode, wherein the metal element serves as a sacrificial structure having a melting
point lower than that of the first electrode and the second electrode; and

a bridge element located on the metal element and facilitating breaking of the metal element upon a melting of the metal element
by absorbing the melted metal element and making the melted metal element flow away from the first electrode or the second
electrode, wherein a dimension of the bridge element in a first direction is longer than a dimension of the metal element
in the first direction, the dimension of the bridge element in a second direction is shorter than the dimension of the metal
element in the second direction, and the second direction is perpendicular to the first direction, the first direction being
defined as a direction along a longitudinal axis of the bridge element, the second direction being defined as a direction
extending from the first electrode to the second electrode.

US Pat. No. 9,455,081

METHOD OF PRODUCING AN INDUCTOR WITH A HIGH INDUCTANCE

CYNTEC Co., Ltd., Hsinch...

1. An electronic component, comprising:
at least one coil; and
a plurality of insulating layers, wherein the at least one coil is formed by a plurality of conductive layers separated by
the plurality of insulating layers, wherein the bottom conductive layer of the plurality of conductive layers comprises a
first conductive pattern of the at least one coil and a non-patterned area, wherein the bottom insulating layer of the plurality
of insulating layers is disposed on the top surface of the first conductive pattern of the at least one coil and filled into
the non-patterned area of the bottom conductive layer; and

a first magnetic glue layer, disposed under the bottom conductive layer and being in contact with the bottom surface of the
first conductive pattern of the at least one coil, wherein the plurality of insulating layers and the first magnetic glue
layer are not supported by a substrate.

US Pat. No. 9,142,426

STACK FRAME FOR ELECTRICAL CONNECTIONS AND THE METHOD TO FABRICATE THEREOF

CYNTEC CO., LTD., Hsinch...

1. A package structure, comprising:
a lead frame having a plurality of pins;
a recess in the lead frame;
a first conductive element having at least one first I/O terminal on a top surface of the first conductive element, wherein
the first conductive element is disposed in the recess, wherein the top surface of the conductive element and the top surface
of the lead frame are substantially at the same horizontal level;

an insulating layer disposed on the lead frame and the top surface of the first conductive element, wherein at least one via
is disposed in the insulating layer; and

at least one conductive pattern layer disposed over the insulating layer, wherein the at least one conductive pattern layer
comprises a plurality of electrical connections to connect with the plurality of pins and with said at least one first I/O
terminal of the first conductive element through the at least one via.

US Pat. No. 9,257,221

THROUGH-HOLE VIA INDUCTOR IN A HIGH-FREQUENCY DEVICE

CYNTEC CO., Ltd., Hsinch...

1. A high-frequency device, comprising:
a substrate, comprising a first through-hole therein;
a horizontal inductor having a first inductance, disposed on the substrate; and
a first through-hole via inductor having a second inductance, disposed in the first through-hole of the substrate, wherein
the first through-hole via inductor is formed by disposing a conductive pillar structure in the first through-hole of the
substrate, wherein the top surface of the conductive pillar structure forms a first terminal of the first through-hole via
inductor and the bottom surface of the conductive pillar structure forms a second terminal of the first through-hole via inductor,
wherein the first through-hole via inductor is not a part of a spiral coil and one of the terminals of first through-hole
via inductor is electrically connected to the horizontal inductor, wherein the second inductance of the first through-hole
via inductor is greater than the first inductance of the horizontal inductor.

US Pat. No. 9,111,954

POWER CONVERSION MODULE

CYNTEC CO., LTD., Hsinch...

1. A power conversion module, comprising:
a circuit carrier board having a plurality of pads;
a semiconductor module disposed on a first surface of the circuit carrier board; and
an inductor module having a body and a plurality of pins, wherein a first portion of each of the plurality of pins is in contact
with the body of the inductor module, and a second portion of each of the plurality of pins is respectively in contact with
and electrically connected to a corresponding pad on the circuit carrier board, wherein the semiconductor module is located
between the inductor module and the circuit carrier board, wherein a shielding layer is formed on a surface of the inductor
module facing the semiconductor module, and the shielding layer is a metallic sheet.

US Pat. No. 9,117,580

CHOKE

CYNTEC CO., LTD., Hsin-C...

1. A choke comprising:
a single-piece core made of a same material, the single-piece core having a first board, a second board, and a pillar located
between the first and second boards, a winding space being located among the first board, the second board and the pillar,

wherein the pillar has a non-circular and non-rectangular cross section along a direction substantially perpendicular to an
axial direction of the pillar, the cross section of the pillar has a first axis and a second axis intersecting with each other
at a center of the cross section of the pillar and being substantially perpendicular with each other, and

wherein a circumference of the cross section of the pillar includes two arc edges, four first substantially straight edges
substantially parallel to the first axis, and two second substantially straight edges substantially parallel to the second
axis, each of the first substantially straight edges being a joint of and in direct contact with a corresponding one of the
arc edges and a corresponding one of the second substantially straight edges.

US Pat. No. 9,481,037

ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF

CYNTEC Co., Ltd., Hsinch...

1. A method for manufacturing an electronic device, the method comprising:
providing an insulated conducting wire;
forming a mixture with the insulated conducting wire buried therein, wherein the mixture comprises: a first magnetic powder
and a second magnetic powder, wherein the mean particle diameter of the first magnetic powder is larger than the mean particle
diameter of the second magnetic powder, and the Vicker's Hardness of the first magnetic powder is greater than the Vicker's
Hardness of the second magnetic powder by a first hardness difference; and

performing a molding process on the insulated conducting wire and the mixture, wherein by means of the first hardness difference
of the first magnetic powder and the second magnetic powder, the mixture and the insulated conducting wire buried therein
are combined to form an integral magnetic body at a temperature lower than the melting point of the insulated conducting wire.

US Pat. No. 9,230,728

MAGNETIC DEVICE WITH HIGH SATURATION CURRENT AND LOW CORE LOSS

CYNTEC CO., LTD., Hsinch...

1. A magnetic device comprising:
a T-shaped magnetic core including a base and a pillar, the base having a first surface and a second surface opposite to the
first surface, the pillar being located on the first surface of the base, the second surface of the base being exposed to
outer environment as an outer surface of the magnetic device, the T-shaped magnetic core being made of an annealed soft magnetic
metal material, a core loss PCL (mW/cm3) of the T-shaped magnetic core satisfying:

0.64×f0.95×Bm2.20?PCL?7.26×f1.41×Bm1.08,

where f (kHz) represents a frequency of a magnetic field applied to the T-shaped magnetic core, and Bm (kGauss) represents the operating magnetic flux density of the magnetic field at the frequency;

a wire coil surrounding the pillar, the wire coil having two leads; and
a magnetic body fully covering the pillar, any part of the base that is located above the second surface of the base, and
any part of the wire coil that is located directly above the first surface of the base,

wherein a volume V1 of the base and a volume V2 of the pillar satisfies: V1/V2?2.093.

US Pat. No. 9,601,412

THREE-DIMENSIONAL PACKAGE STRUCTURE

CYNTEC CO., LTD., Hsinch...

1. A package structure, comprising:
at least one first electronic device, wherein the at least one first electronic device is encapsulated by a molding body comprising
a top surface, a bottom surface and a plurality of lateral surfaces connecting the top surface and the bottom surface, wherein
the molding body is made of insulating material and the top surface of the molding body is flat;

at least one conductive pattern, wherein at least one portion of the at least one conductive pattern is disposed on the top
surface of the molding body; and

a second electronic device disposed on said at least one portion of the at least one conductive pattern on the top surface
of the molding body, wherein a first lead and a second lead of the second electronic device are respectively in contact with
and electrically connected to a first portion and a second portion of said at least one portion of the at least one conductive
pattern.

US Pat. No. 9,305,687

CURRENT SENSING RESISTOR

CYNTEC CO., LTD., Hsinch...

1. A resistor device, comprising:
a resistor plate having opposite first and second surfaces;
a first metal layer including first and second portions which are disposed on the first surface of the resistor plate at opposite
first and second sides, respectively; and

a second metal layer including a first sensing pad, a second sensing pad, a first current pad and a second current pad, separate
from one another, wherein the first sensing pad and the first current pad are disposed on the first portion of the first metal
layer and the second sensing pad and the second current pad are disposed on the second portion of the first metal layer.

US Pat. No. 9,251,944

VARIABLE COUPLED INDUCTOR

CYNTEC Co., LTD., Hsinch...

1. A variable coupled inductor, comprising:
a first core having a top surface and a bottom surface, a first lateral surface and a second lateral surface opposite to the
first lateral surface, wherein the first core comprises a first protrusion, a second protrusion, a third protrusion, a first
conducting-wire groove and a second conducting-wire groove, each of which extending from the first lateral surface to the
second lateral surface on the top surface, wherein the second protrusion is disposed between the first protrusion and the
third protrusion, the first conducting-wire groove is located between the first protrusion and the second protrusion, and
the second conducting-wire groove is located between the second protrusion and the third protrusion;

a first conducting wire disposed in the first conducting-wire groove and
a second conducting wire disposed in the second conducting-wire groove, wherein the first conducting wire and the second conducting
wire are extended to wrap around the first core at two opposite sides of the second protrusion of the first core via the bottom
surface;

a second core disposed over the first core; and
a magnetic structure disposed between the second protrusion and the second core, wherein the magnetic structure comprises
a first portion and a second portion, wherein the first portion and the second portion are symmetric to each other with respect
to the central line of the second protrusion, wherein the central line extends from a first middle point of a first edge of
the second protrusion on the first lateral surface to a second middle point of a second edge of the second protrusion on the
second lateral surface, wherein the magnetic structure has a first surface area A1, and the second protrusion has a second surface area A2, wherein a first inductance L1 of the variable coupled inductor corresponds to a current I1 applied to the variable coupled inductor at a conversion point between light load and heavy load situations, and a second
inductance L2 of the variable coupled inductor corresponds to a maximum current I2 applied to the variable coupled inductor, wherein 1.21(I1/I2)?A1/A2?0.81(I1/I2)and 0.8L1?L2?0.7L1.

US Pat. No. 9,872,410

INDUCTOR

CYNTEC CO., LTD., Hsinch...

1. A package structure, comprising:
an inductive component having a bottom side, wherein the bottom side has a protrusion to form a plurality of recesses each
being formed at a corresponding corner of a periphery of the bottom side;

a conductive module, disposed under the inductive component; and
a connecting structure, wherein the connecting structure comprises a plurality of first metal parts respectively embedded
in the plurality of recesses and a plurality of second metal parts located between the inductive component and the conductive
module, wherein each of the plurality of first metal parts is in contact with a corresponding one of the plurality of second
metal parts for electrically connecting the inductive component and the conductive module.

US Pat. No. 9,420,705

CURRENT CONDUCTING ELEMENT

CYNTEC CO., LTD., (TW)

1. A current conducting element, comprising:
a substrate;
a through hole disposed through the substrate and having a first opening, wherein an area of the first opening of the through
hole is A1;

an electrode layer disposed on the substrate and a portion of the first opening being exposed from the electrode layer, wherein
an area of the portion of the first opening that is exposed from the electrode layer is A2, and A2<½A1; and

a conductor structure disposed in the through hole, a portion of the conductor structure at the first opening being exposed
from the electrode layer and the other portion of the conductor structure at the first opening being covered by and contacted
with the electrode layer, wherein the electrode layer and the conductor structure form a current conducting path.

US Pat. No. 9,251,940

INDUCTOR

CYNTEC Co., Ltd., Hsinch...

1. An inductor comprising:
a first core having a top side and a bottom side opposite to the top side, wherein the bottom side has a first protrusion
to form a first recess at a first corner of a periphery of the bottom side;

a conducting wire disposed over the top side of the first core; and
a first lead frame having a first embedded portion;
wherein the first embedded portion of the first lead frame is at least partially embedded in the first recess and is electrically
connected to the conducting wire.

US Pat. No. 9,171,818

PACKAGE STRUCTURE AND THE METHOD TO MANUFACTURE THEREOF

CYNTEC Co., Ltd., Hsinch...

1. A package structure, comprising:
a substrate comprising a first solder pad and a second solder pad thereon;
a conductive element on the substrate, wherein the conductive element has a body comprising an outer surface including a top
surface, a bottom surface, a first lateral surface and a second lateral surface, wherein the conductive element comprises
a first electrode and a second electrode, wherein the first electrode is disposed on a first portion of the outer surface
and configured from a first portion of the bottom surface, via a portion of the first lateral surface, to a first portion
of the top surface, and the second electrode is disposed on a second portion of the outer surface and configured from a second
portion of the bottom surface, via a portion of the second lateral surface, to a second portion of the top surface;

a first metallic material overlaying on the first electrode and the second electrode, wherein the first metallic material
is in contact with the first solder pad and the second solder pad to electrically connect the first solder pad and the second
solder pad to the first electrode and the second electrode, respectively;

a second metallic material overlaying on the first metallic material, wherein a first and a second portion of the second metallic
material extend respectively from a third and a fourth portion of the bottom surface of the body of the conductive element
to the substrate, wherein the third and the fourth portion of the bottom surface are between the first and the second portion
of the bottom surface of the body of the conductive element; and the first metallic material has a lower melting point than
the second metallic material.

US Pat. No. 9,148,114

MONOLITHIC POWER SPLITTER FOR DIFFERENTIAL SIGNAL

CYNTEC Co., Ltd., Hsinch...

1. A monolithic power splitter for splitting a pair of input differential signal into two pairs of output differential signals,
comprising:
a first input terminal to receive a first input signal of the pair of input differential signals;
a second input terminal to receive a second input signal of the pair of input differential signals, wherein the first input
signal and the second input signal have substantially equal amplitude and 180 degree phase difference;

a first one-by-two power splitter, comprising a first resistor network to split the first received input signal into a first
output signal and a second output signal;

a second one-by-two power, comprising a second resistor network splitter to split the second received input signal into a
third output signal and a fourth output signal; and

four output terminals to output two pairs of output differential signals, consisting of a first output terminal, a second
output terminal, a third output terminal and a fourth output terminal, wherein the first output signal, the second output
signal, the third output signal, and the fourth signal are one-to-one electrically connected to the four output terminals
respectively, wherein each pair of the two pairs of output differential signals has two output signals with substantially
equal amplitude and 180 degree phase difference.

US Pat. No. 9,451,701

ELECTRONIC PACKAGE STRUCTURE

CYNTEC Co., Ltd., Hsinch...

1. A choke, comprising:
a coil, comprising at least one winding turn of a conductive wire;
a magnetic body, wherein the coil is disposed in the magnetic body and the magnetic body comprises a contiguous portion enclosing
therein said at least one winding turn of the conductive wire of the coil and extending through a hollow space enclosed by
the coil, wherein a cavity is formed on a top surface of the magnetic body and the bottom surface of the cavity is entirely
formed by a surface of said contiguous portion of the magnetic body, wherein at least one conductive element is disposed in
the cavity, wherein said at least one winding turn of the conductive wire and said at least one conductive element are located
at two opposite sides of the bottom surface of the cavity.

US Pat. No. 9,536,841

SEMICONDUCTOR PACKAGE WITH CONFORMAL EM SHIELDING STRUCTURE AND MANUFACTURING METHOD OF SAME

CYNTEC CO., LTD., Hsinch...

8. A method for manufacturing a semiconductor package, comprising:
providing a substrate with a front side and a bottom side, wherein the substrate has a plurality of device regions thereon
and a dicing region surrounding each of the device regions, wherein a plurality of solder pads and at least one electromagnetic
(EM) shielding contact structure are formed on the bottom side, wherein the substrate comprises a conductive via, a ground
pad, and a ground layer, wherein the conductive via electrically connects the ground pad to the ground layer;

mounting a semiconductor device on the front side of the substrate;
forming a mold compound to completely cover the front side of the substrate, wherein the mold compound covers the semiconductor
device;

performing a dicing process to dice the mold compound and the substrate along the dicing region, thereby singulating a plurality
of semiconductor packages and exposing a portion of the at least one EM shielding contact structure from a sidewall of the
substrate; and

forming a conformal EM shielding layer on each of the semiconductor packages, wherein the conformal EM shielding layer covers
the mold compound and the sidewall of the substrate, and wherein the conformal EM shielding layer is in direct contact with
the exposed portion of the at least one EM shielding contact structure.

US Pat. No. 9,538,660

ELECTRONIC PACKAGE STRUCTURE

CYNTEC CO., LTD., Hsinch...

1. An electronic package structure, comprising:
a first electronic device, comprising a first discrete conductive element and a body, wherein a cavity is formed on a top
surface of the body, wherein the body comprises a first unitary portion enclosing the first discrete conductive element therein,
wherein the bottom surface of the cavity is entirely formed by a surface of said first unitary portion of the body; and

a second electronic device, disposed in the cavity, wherein the second electronic device is disposed over the bottom surface
of the cavity, and the first discrete conductive element and the second electronic device are located at two opposite sides
of the bottom surface of the cavity, wherein the electronic package structure is a DC/DC converter or a point-of-load (POL)
converter.

US Pat. No. 9,226,387

NETWORK COMMUNICATION DEVICE

CYNTEC CO., LTD., Hsinch...

1. A network communication device, comprising:
a circuit board;
a network connector disposed on the circuit board;
a network chip disposed on the circuit board; and
a plurality of network magnetic assemblies disposed on the circuit board and electrically connected with the network connector
and the network chip, respectively, wherein each of the network magnetic assemblies includes an Ethernet transformer and at
least one inductor, and the Ethernet transformer is electrically connected in series with the inductor via a conductive trace
of the circuit board, wherein a spaced distance or a path length of the conductive trace between the Ethernet transformer
and the inductor of at least one network magnetic assembly is less than a first specific length;

wherein the Ethernet transformer comprises:
a magnetic core assembly including a first magnet core and a second magnet core, wherein the first magnet core comprises a
plurality of contact pin sets;

at least one primary winding set wound around the first magnet core and electrically connected with a portion of the contact
pin sets of the first magnet core; and

at least one secondary winding set wound around the first magnet core and electrically connected with the other portion of
the contact pin sets of the first magnet core.

US Pat. No. 9,461,607

BALANCE FILTER

CYNTEC Co., Ltd., Hsinch...

1. A balance filter, comprising:
a substrate;
an input terminal to receive an input signal;
a first circuit having a first terminal electrically connected to the input terminal and a second terminal to generate a first
output signal, wherein the first circuit comprises a first through-hole via inductor substantially disposed in the substrate
and a first horizontal inductor disposed on the top surface of the substrate, wherein the first horizontal inductor is electrically
connected to the first through-hole via inductor and an inductance of the first through-hole via inductor is greater than
that of the first horizontal inductor; and

a second circuit electrically connected to the first circuit and having a third terminal to generate a second output signal,
wherein the second circuit comprises a second through-hole via inductor substantially disposed in the substrate.

US Pat. No. 9,271,398

POWER SUPPLY MODULE

CYNTEC Co., Ltd., Hsinch...

1. A power-supply module, comprising:
at least one power-supply component;
an inductor disposed over the at least one power-supply component, wherein the inductor has a magnetic body and a coil encapsulated
in the magnetic body, wherein the magnetic body encloses the coil therein and contiguously extends into the hollow space formed
by the coil, wherein the magnetic body further contiguously extends to a first lateral side of the at least one power-supply
component;

a package, wherein the at least one power-supply component and the inductor are disposed within the package, wherein the package
comprises epoxy resin to encapsulate the at least one power-supply component and the inductor; and

a first lead frame, wherein a first portion of the first lead frame is disposed between the at least one power-supply component
and the inductor inside the package, and a second portion extending from the first portion of the first lead frame is disposed
on a top or bottom surface of the package for connecting with an external circuit.

US Pat. No. 9,668,359

CIRCUIT MODULE HAVING SURFACE-MOUNT PADS ON A LATERAL SURFACE FOR CONNECTING WITH A CIRCUIT BOARD

CYNTEC CO., LTD., Hsinch...

1. A circuit module for connecting to a circuit board, wherein the circuit module comprises a substrate having a top surface,
a bottom surface and a lateral surface connecting the top surface and the bottom surface, wherein at least one electrical
component is disposed on the top surface or the bottom surface of the substrate and a plurality of surface-mount pads disposed
on the lateral surface of the substrate, wherein each of the plurality of surface-mount pads disposed on the lateral surface
of the substrate is in contact with and electrically connected to a corresponding pad disposed on the top surface of the circuit
board.

US Pat. No. 9,208,937

CHOKE HAVING A CORE WITH A PILLAR HAVING A NON-CIRCULAR AND NON-RECTANGULAR CROSS SECTION

CYNTEC CO., LTD., Hsin-c...

1. A choke comprising:
a single-piece core made of a same material, the single-piece core having two boards and a pillar located between the two
boards, a winding space being located among the two boards and the pillar,

wherein the pillar has a non-circular and non-rectangular cross section along a direction substantially perpendicular to an
axial direction of the pillar, the cross section of the pillar has a first axis and a second axis intersecting with each other
at a center of the cross section of the pillar and are substantially perpendicular with each other, the first axis is longer
than the second axis, and the cross section of the pillar is substantially symmetrical to both of the first axis and the second
axis,

wherein the first axis starts from a first point on the circumference of the cross section of the pillar and ends at a second
point on the circumference of the cross section of the pillar, the second axis starts from a third point on the circumference
of the cross section of the pillar and ends at a fourth point on the circumference of the cross section of the pillar, and
an inequality is satisfied:


wherein X represents a length of the first axis and Y represents a length of the second axis, and the first axis starts from
a first point on the circumference of the cross section of the pillar and ends at a second point on the circumference of the
cross section of the pillar, the second axis starts from a third point on the circumference of the cross section of the pillar
and ends at a fourth point on the circumference of the cross section of the pillar, each of the two boards has a pair of first
edges substantially parallel to and longer than the first axis and a pair of second edges substantially parallel to and longer
than the second axis, and an inequality is satisfied:


wherein M? represents a shortest length from the first edge to the center of the cross section of the pillar and N? represents
a shortest length from the second edge to the center of the cross section of the pillar, and

wherein the center of the cross section of the pillar and a center of each of the two boards are aligned along the axial direction
of the pillar.

US Pat. No. 9,576,710

MAGNETIC DEVICE AND METHOD OF MANUFACTURING THE SAME

CYNTEC CO., LTD., Hsinch...

1. A method for forming a magnetic device, the method comprising the steps of:
forming a lead frame comprising a first bottom part and a first protrusion connected to the first bottom part;
forming a first core body, wherein the first core body comprises a first through opening;
placing the first core body on the first bottom part of the lead frame, with at least a part of the first protrusion of the
lead frame disposed in the first through opening for electrically connecting with a first terminal of a coil on the first
core body; and

encapsulating the first protrusion of the lead frame and the coil by using a molding material.

US Pat. No. 9,734,944

ELECTRONIC PACKAGE STRUCTURE COMPRISING A MAGNETIC BODY AND AN INDUCTIVE ELEMENT AND METHOD FOR MAKING THE SAME

CYNTEC Co., Ltd., Hsinch...

1. An inductive component, comprising:
a magnetic body and a coil in the magnetic body; and
a first protrusion and a second protrusion, wherein each of the first protrusion and the second protrusion protrudes from
a bottom surface of the magnetic body, the first protrusion and the second protrusion being in contact with the magnetic body,
wherein the first protrusion comprises a first electrode disposed on the peak surface of the first protrusion, and the second
protrusion comprises a second electrode disposed on the peak surface of the second protrusion;

wherein the first electrode and the second electrode are electrically connected to a first end and a second end of the coil
via the first protrusion and the second protrusion, respectively, wherein the first electrode and the second electrode are
electrically connected to a first substrate disposed under the magnetic body, and at least one electronic device is disposed
between the magnetic body and a top surface of the first substrate, wherein there is no substrate that has a top surface located
over the at least one electronic device and is passed through by each of the first protrusion and the second protrusion.

US Pat. No. 9,514,964

STACK FRAME FOR ELECTRICAL CONNECTIONS AND THE METHOD TO FABRICATE THEREOF

CYNTEC Co., Ltd., Hsinch...

1. A method for forming a conductive structure, the method comprising the steps of:
forming a metallic frame having a plurality of metal parts, wherein each two adjacent metal parts are separated from each
other by a gap;

forming an insulating layer over the top surface of the plurality of metal parts; and
forming a conductive pattern layer on the insulating layer, wherein each of at least one of the first plurality of metal parts
is used as a metal pin, wherein a top surface of each metal pin is electrically connected to the conductive pattern layer
through a corresponding via disposed in the insulating layer and a bottom surface of each metal pin is used for electrically
connecting with an external circuit.

US Pat. No. 9,536,798

PACKAGE STRUCTURE AND THE METHOD TO FABRICATE THEREOF

CYNTEC CO., LTD., Hsinch...

1. A package structure, comprising:
a lead frame comprising a metal body and a plurality of pins insulated from each other,
wherein the metal body of the lead frame has a recess therein,
a substrate having conductive pattern layers therein;
a first conductive element having a top surface and a bottom surface, wherein a first plurality of I/O terminals are disposed
on the top surface of the first conductive element, wherein the first conductive element is disposed on the bottom surface
of the substrate with said first plurality of I/O terminals electrically connected to the substrate, wherein the substrate
is disposed over the lead frame and at least one portion of the first conductive element that includes the bottom surface
of the first conductive element is located in the recess of the lead frame; and the plurality of pins of the lead frame are
electrically connected to said first plurality of I/O terminals of the first conductive element via the conductive layers
of the substrate, wherein there is not any I/O terminal that is disposed on the bottom surface of the first conductive element
and electrically connected to the lead frame: and an insulating layer, disposed on the top surface of lead frame, wherein
said insulating layer is encompassed entirely between the outermost conductive layers of the substrate that are mounted on
the top surface of the lead frame when viewed from a plan view.

US Pat. No. 9,653,205

ELECTRODE STRUCTURE AND THE CORRESPONDING ELECTRICAL COMPONENT USING THE SAME AND THE FABRICATION METHOD THEREOF

CYNTEC CO., LTD., Hsinch...

1. An electrical component, comprising:
a body;
a conductive element disposed in the body, wherein at least one portion of a first terminal part of the conductive element
is exposed outside of the body;

a conductive and adhesive layer, overlaying on the body and covering a first portion of the terminal part of the conductive
element, wherein a second portion of the terminal part of the conductive element is not covered by the conductive and adhesive
layer; and

at least one metal layer, overlaying on the conductive and adhesive layer and covering the second portion of the terminal
part of the conductive element, wherein the at least one metal layer is electrically connected to the second portion of the
terminal part of the conductive element for electrically connecting with an external circuit.

US Pat. No. 9,728,331

METHOD FOR MAKING A CHOKE

CYNTEC CO., LTD., Hsinch...

1. A method to form a choke, comprising:
encapsulating a hollow coil without a bobbin by a molding body comprising a magnetic material;
forming a first core, wherein the first core comprises a pillar; and
disposing at least a first portion of the pillar inside the encapsulated hollow coil.

US Pat. No. 9,735,091

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

CYNTEC Co., Ltd., Hsinch...

1. A package structure, comprising:
a first lead frame, wherein the first lead frame comprises a first single-piece metal body; and
a second lead frame, comprising a second single-piece metal body and a plurality of outer leads connected to the second single-piece
metal body, wherein the second single-piece metal body is located over the first single-piece metal body;

wherein a first outer lead and a second outer lead of the second lead frame are respectively extended downward from two opposite
edges of the second single-piece metal body to two opposite lateral sides of the first single-piece metal body of the first
lead frame, wherein a first electronic device and a second electronic device are laterally disposed on the first single-piece
metal body, and the first electronic device and the second electronic device are disposed between the first single-piece metal
body and the second single-piece metal body and spaced apart from each other horizontally, wherein a bottom surface of the
first outer lead of the second lead frame and a bottom surface of a portion of the first lead frame directly below the first
electronic device are substantially at a same horizontal level, wherein heat generated by the first electronic device is dissipated
through the first single-piece metal body and the second single-piece metal body.

US Pat. No. 9,719,159

MIXED MAGNETIC POWDERS AND THE ELECTRONIC DEVICE USING THE SAME

CYNTEC CO., LTD., Hsinch...

1. A mixed magnetic powders for making a magnetic core, comprising:
a first magnetic powder;
a second magnetic powder, wherein each of the first magnetic powder and the second magnetic powder is made of amorphous alloy,
wherein the ratio of the D50 of the first magnetic powder to the D50 of the second magnetic powder is in the range of 5 to
12, wherein the first magnetic powder weighs 50 to 90 percent of the total weight of the first magnetic powder and the second
magnetic powder; and the second magnetic powder weighs 10 to 50 percent of the total weight of the first magnetic powder and
the second magnetic powder, wherein the nano-indentation hardness of each of the first magnetic powder and the second magnetic
powder is not less than 7 Gpa.

US Pat. No. 9,805,860

MAGNETIC DEVICE AND METHOD OF MANUFACTURING THE SAME

CYNTEC CO., LTD., Hsinch...

1. An inductor, comprising:
a magnetic body, wherein a first through opening is formed on a periphery of the magnetic body; and
a first lead comprising a first conductive part and a second conductive part electrically connected to the first conductive
part, wherein the first conductive part is disposed on the bottom surface of the magnetic body and a bottom surface of the
first conductive part is located under said first through opening, and at least a portion of the second conductive part is
disposed in the first through opening, wherein a conductive path is formed from a first terminal of a coil of the inductor
to the first conductive part via the second conductive part.

US Pat. No. 9,741,590

STACK FRAME FOR ELECTRICAL CONNECTIONS AND THE METHOD TO FABRICATE THEREOF

CYNTEC CO., LTD., Hsinch...

1. A package structure, comprising:
a lead frame, comprising a plurality of metal parts, wherein each meal part is made of metal and each two adjacent metal parts
are spaced apart by a vacancy;

an insulating layer, disposed over the top surface of the plurality of metal parts and filled into said vacancy; and
at least one conductive layer, disposed over the insulating layer, wherein a conductive pattern of the at least one conductive
layer is electrically connected to a metal part of the plurality of metal parts through at least one via disposed in the insulating
layer.

US Pat. No. 9,697,950

ASSEMBLED CIRCUIT AND ELECTRONIC COMPONENT

CYNTEC CO., LTD., Hsinch...

1. An electrical component, comprising:
a unitary magnetic body having a top surface, a bottom surface, and a first and a second side surface each extending from
the top surface to the bottom surface, wherein a first conductive through hole is formed on the first side surface of the
unitary magnetic body, and a second conductive through hole is formed on the second side surface; and

a coil disposed in the unitary magnetic body, wherein a first end of the coil and a second end of the coil are on the top
surface of the unitary magnetic body, wherein a first electrode and a second electrode are disposed on the bottom surface
of the unitary magnetic body, wherein the first electrode is electrically connected to the first end of the coil via the first
conductive through hole formed on the first side surface of the unitary magnetic body, and the second electrode is electrically
connected to the second end of the coil via the second conductive through hole formed on the second side surface opposite
to the first side surface of the unitary magnetic body.

US Pat. No. 9,772,459

OPTOELECTRONIC MODULE AND METHOD OF PRODUCING SAME

CYNTEC CO., LTD., Hsinch...

1. A method of producing an optoelectronic module, comprising:
providing an interposer base having a first recess and a second recess, both formed on a specified surface thereof;
filling a deformable joint material layer in the first recess and the second recess;
using a fixture to press a first optoelectronic element against the joint material layer in the first recess to couple the
first optoelectronic element to the interposer base via the joint material layer, wherein an optical signal is emitted from
or passes through a first align point at a lateral surface of the first optoelectronic element; and

using a fixture to press a second optoelectronic element in the second recess to couple the second optoelectronic element
to the interposer base via the joint material layer, wherein a second align point at a lateral surface of the second optoelectronic
element faces the lateral surface of the first optoelectronic element,

wherein a horizontal height of the first align point of the first optoelectronic element above the specified surface of the
interposer base is substantially at a same level as a horizontal height of the second align point of the second optoelectronic
element above the specified surface of the interposer base for the second optoelectronic element to couple to and receive
the optical signal from the first optoelectronic element;

wherein a top surface of the first optoelectronic element is pressed with a first fixture to be placed into the first recess
until the first fixture urges against the interposer base, and a top surface of the second optoelectronic element is pressed
with a second fixture to be placed into the second recess until the second fixture urges against the interposer base, wherein
the first fixture has a first hollow chamber for accommodating the first optoelectronic element, and the second fixture has
a second hollow chamber for accommodating the second optoelectronic element; and

wherein a difference between a first distance, which is defined as a distance from an inner surface of the first fixture in
contact with the top surface of the first optoelectronic element to the specified surface of the interposer base, and a second
distance, which is defined as a distance from the inner surface of the second fixture in contact with the top surface of the
second optoelectronic element to the specified surface of the interposer base, is substantially equal to a difference between
a first length, which is defined as a distance from the first align point to a top surface of the first optoelectronic element
and a second length, which is defined as a distance from the second align point to a top surface of the second optoelectronic
element.

US Pat. No. 9,754,713

CHOKE

CYNTEC CO., LTD., Hsinch...

1. A choke comprising: a core structure having a first board, a second board, and a pillar located between the first and second
boards, a winding space being located among the first board, the second board and the pillar, wherein the pillar has a non-circular
and non-rectangular cross section along a direction substantially perpendicular to an axial direction of the pillar, wherein
the periphery of the cross section of the pillar comprises a first substantially straight line, a first arc, a second substantially
straight line, and a second arc on four sides of the periphery, respectively, wherein the substantially straight lines are
interleaved with the arcs on the periphery of the cross section of the pillar, and wherein each arc is convex with respect
to said substantially straight lines, wherein the distance between the middle point of the first arc and the middle point
of the second arc is less than the distance between the middle point of the first substantially straight line and the middle
point of the second substantially straight line, wherein a wire comprising a plurality of winding turns is disposed in the
winding space, and each of said winding turns is wound around the first substantially straight line, the first arc, the second
substantially straight line, and the second arc.

US Pat. No. 9,704,623

MICRORESISTOR

CYNTEC CO., LTD., Hsinch...

1. A micro-resistor, comprising:
a resistor material layer;
an electrode set comprising a first electrode and a second electrode, both disposed on the same side of said resistor material
layer to define an opening which exposes said resistor material layer and space between said first electrode and said second
electrode defining an opening size of said opening; and

a first protective layer to cover said opening completely and having a coverage size along a direction parallel with said
space, wherein said micro-resistor has an electrical resistance less than 5 milliohm and the difference of said opening size
and said coverage size is less than 3100 micrometer to make the temperature coefficient of electrical resistance of said micro-resistor
not greater than 150 ppm/° C.

US Pat. No. 9,691,633

LEADFRAME AND THE METHOD TO FABRICATE THEREOF

CYNTEC CO., LTD., Hsinch...

1. A leadframe, comprising:
a first lead and a second lead;
a first conductive pillar formed on a first portion of the top surface of the first lead by disposing a first via on the first
lead, wherein at least one first conductive material is filled inside the first via to form the first conductive pillar; and

a second conductive pillar formed on a first portion of the top surface of the second lead by disposing a second via on the
second lead, wherein at least one second conductive material is filled inside the second via to form the second conductive
pillar;

wherein a second portion of the top surface of the first lead, a second portion of the top surface of the second lead, the
first conductive pillar, and the second conductive pillar form a 3D space for accommodating at least one device, wherein at
least one portion of the at least one device is disposed above the second portion of the top surface of the first lead and
below the top surface of the first conductive pillar, wherein a first terminal of the at least one device is electrically
connected to the first lead through the first conductive pillar and a second terminal of the at least one device is electrically
connected to the second lead through the second conductive pillar.

US Pat. No. 9,691,710

SEMICONDUCTOR PACKAGE WITH ANTENNA

CYNTEC CO., LTD, Hsinchu...

1. A method of manufacturing a semiconductor package with an antenna, comprising:
preparing a substrate;
disposing a semiconductor component and at least one first surface mount device (SMD) component on the substrate;
forming a mold compound on the substrate covering the semiconductor component and the at least one first SMD component;
forming at least one opening in the mold compound to expose the first SMD component after the step of forming a mold compound;
filling the at least one opening with a conductive material after the step of forming at least one opening; and
forming a conformal antenna on a top surface of the mold compound,
wherein the step of forming the at least one opening comprises forming at least one cavity extending through the at least
one first SMD component.

US Pat. No. 9,799,722

INDUCTIVE COMPONENT AND PACKAGE STRUCTURE THEREOF

CYNTEC CO., LTD., Hsinch...

1. An inductive component, comprising:
a unitary magnetic body having a top surface and a bottom surface, wherein a plurality of conductive through holes are formed
in the unitary magnetic body, wherein each conductive through hole extends from the top surface to the bottom surface of the
unitary magnetic body, and the plurality of conductive through holes are electrically connected via first conductive patterns
disposed over the top surface of the unitary magnetic body and second conductive patterns disposed over the bottom surface
of the unitary magnetic body so as to form at least one conductive path, each passing through a corresponding set of conductive
through holes, wherein each of the at least one conductive path has two terminals and a corresponding inductance, and wherein
at least one portion of a first electronic device is disposed in a first space, at least partially surrounded by the at least
one conductive path.

US Pat. No. 10,034,379

STACKED ELECTRONIC STRUCTURE

CYNTEC CO., LTD., Hsinch...

1. A stacked electronic structure, comprising:a magnetic device:
a substrate, wherein the substrate is disposed under the magnetic device; and
a first electronic device, disposed between a bottom surface of the magnetic device and a top surface of the substrate, wherein the first electronic device comprises a first terminal and a second terminal, wherein the first terminal is electrically connected to the magnetic device without using the substrate and the second terminal is electrically connected to the substrate; and
a second electronic device, disposed between a bottom surface of the magnetic device and a top surface of the substrate, wherein the second electronic device comprises a third terminal and a fourth terminal, wherein the third terminal is electrically connected to the magnetic device without using the substrate and the fourth terminal is electrically connected to the substrate.

US Pat. No. 10,012,808

OPTICAL FIBER STRIP, ACTIVE OPTICAL MODULE AND ACTIVE OPTICAL CABLE

CYNTEC CO., LTD., Hsinch...

1. An optical fiber strip comprising:a stair-shaped base element having:
a first receiving surface on a first stair of the stair-shaped base element;
a second receiving surface on a second stair of the stair-shaped base element;
a plurality of holes integrally formed and extending from the first receiving surface to a bottom surface of the stair-shaped base element; and
a first bearing surface connecting the first receiving surface and the second receiving surface;
a cover element comprising:
a first end;
a second end;
a first curved part having a first covering surface forming a first stair of the cover element at the first end;
a second curved part having a second covering surface forming a second stair of the cover element at the first end;
a second bearing surface connecting the first covering surface and the second covering surface of the cover element; and
an internal curved space between the first curved part and second curved part extending from the second end to the second bearing surface;
an adapter configured to be selectively connected to an external optical fiber array; and
an internal optical fiber array connected to the adapter and the plurality of holes passing through the internal curved space to be selectively and optically coupled to an optical-electrical conversion unit on the bottom surface of the stair-shaped base element, and configured to receive or transmit at least one optical signal from the external optical fiber array via the adapter or from the optical-electrical conversion unit via the plurality of holes, wherein a curved portion of the internal optical fiber array is located in the internal curved space for changing direction of the internal optical fiber array;
wherein at least one of the first bearing surface and the second bearing surface has a plurality of grooves forming a plurality of pathways connecting the internal curved space to the plurality of holes when the first receiving surface, the second receiving surface, the first bearing surface of the stair-shaped base element are respectively join to the first covering surface, the second covering surface, and the second bearing surface of the cover element, the internal optical fiber array is extended from the internal curved space and inserted to the plurality of holes, the internal optical fiber array is positioned according to a hole pattern of the plurality of holes in the stair-shaped base element, the internal optical fiber array is curved according to a radius of curvature of the internal curved space in the cover element, and position and a radius of curvature of the internal optical fiber array are determined by the stair-shaped base element and the cover element respectively.

US Pat. No. 10,063,098

ELECTRONIC MODULE AND METHOD FOR FORMING PACKAGE

CYNTEC CO., LTD., Hsinch...

1. An electronic module, comprising:a magnetic device, comprising a body, wherein the body comprises a top surface, a bottom surface and a lateral surface connecting the top surface and the bottom surface of the body, wherein a first electrode and a second electrode of the magnetic device are disposed on the body; and
a first substrate, having a top surface, a bottom surface and a lateral surface connecting the top surface and the bottom surface of the first substrate, wherein at least one electronic device is disposed on the top or bottom surface of the first substrate, and the top surface of the magnetic body and the bottom surface of the first substrate are placed side by side with the first electrode of the magnetic device electrically connected to the first substrate, wherein a plurality of third electrodes are disposed on the first substrate and placed along an edge of the lateral surface of the first substrate, wherein the lateral surface of the first substrate faces the top surface of a second substrate, and each of the plurality of third electrodes is physically in contact with and electrically connected to a corresponding pad on the top surface of the second substrate.

US Pat. No. 10,037,951

SEMICONDUCTOR PACKAGE WITH ANTENNA

CYNTEC CO., LTD., Hsinch...

1. A semiconductor package, comprising:a radio frequency (RF) module having a bottom and a lateral side, wherein the RF module includes a module board at the bottom;
an antenna located at the lateral side of the RF module;
an electromagnetic (EM) shield covering the RF module, wherein the EM shield includes a side wall disposed along the lateral side of the RF module, and the side wall of the EM shield is between the RF module and the antenna; and
a first mold body fixing the EM shield and the antenna such that the antenna is entirely spaced apart from the EM shield and the module board by a respective predetermined distance.

US Pat. No. 10,006,110

MIXED MAGNETIC POWDERS AND THE ELECTRONIC DEVICE USING THE SAME

CYNTEC CO., LTD., Hsinch...

1. Mixed magnetic powders for making a magnetic body, comprising:a first magnetic powder; and
a second magnetic powder, wherein each of the first magnetic powder and the second magnetic powder is made of a soft magnetic material, and the average particle diameter of the first magnetic powder is greater than that of the second magnetic powder, wherein the ratio of the D50 of the first magnetic powder to the D50 of the second magnetic powder is in the range of 5 to 12, wherein the first magnetic powder weighs 50 to 90 percent of the total weight of the first magnetic powder and the second magnetic powder, and the second magnetic powder weighs 10 to 50 percent of the total weight of the first magnetic powder and the second magnetic powder, wherein the D50 of the first magnetic powder is in the range of 17 to 36 um and the D50 of the second magnetic powder is in the range of 1.0 to 3.5 um; the D10 of the first magnetic powder is in the range of 8 to 26 um and the D10 of the second magnetic powder is in the range of 0.5 to 1.7 um; and the D90 of the first magnetic powder is in the range of 30 to 52 um and the D90 of the second magnetic powder is in the range of 2.8 to 5.6 um.

US Pat. No. 9,978,535

REDUCTION OF LEAKAGE CURRENT FROM SUPERCAPACITOR BY MODIFYING ELECTRODE MATERIAL

CYNTEC CO., LTD., Hsinch...

1. A composite material of an electrode unit, comprising:a porous electrode material including porous particles and being 50˜95 wt % of the composite material;
an electret material distributed among the porous particles of the porous electrode material for retaining charges on the electrode unit, and being greater than 0 wt % and less than 15 wt % of the composite material, wherein the electret material is selected from a group consisting of polypropylene, polycarbonate, polyethyleneterephthalate, derivatives thereof, and mixtures thereof;
a binder material binding the porous particles together and binding the electret material with the porous electrode material, and being greater than 0 wt % and less than 15 wt % of the composite material; and
an electric conduction auxiliary agent for enhancing electric conduction of the electrode unit, being greater than 0 wt % and less than 30 wt % of the composite material.

US Pat. No. 9,859,250

SUBSTRATE AND THE METHOD TO FABRICATE THEREOF

CYNTEC CO., LTD., Hsinch...

1. A substrate having a top surface, a bottom surface and a first lateral surface, said substrate comprising:
a plurality of insulating layers;
a plurality of conductive layers separated by the plurality of insulating layers, wherein the first lateral surface of the
substrate comprises at least one first portion of a first via that is in contact with at least one first conductive pattern
disposed between a first insulating layer and a second insulating layer of the plurality of insulating layers, wherein a first
conductive material is filled in the at least one first portion of the first via and exposed through the first lateral surface
of the substrate, and wherein the first lateral surface of the substrate further comprises at least one second portion of
a second via that is in contact with at least one second conductive pattern disposed inside the plurality of insulating layers,
wherein a second conductive material is filled in the at least one second portion of the second via and exposed through the
first lateral surface of the substrate;

a first lead, wherein at least one portion of the first lead is disposed on the first lateral surface of the substrate and
electrically connected to said at least one first conductive pattern via the first conductive material filled in the at least
one first portion of the first via;

a second lead, wherein at least one portion of the second lead is disposed on the first lateral surface of the substrate and
electrically connected to said at least one second conductive pattern via the second conductive material filled in the at
least one second portion of the second via; and

an electronic component, disposed over the top surface of the substrate and electrically connected to the plurality of conductive
layers.

US Pat. No. 10,062,498

COMPOSITE MAGNETIC COMPONENT

CYNTEC CO., LTD., Hsinch...

1. A composite magnetic component comprising:a magnetic flux-guiding unit having a first winding portion and a second winding portion;
a first coil structure wound around the first winding portion of the magnetic flux-guiding unit, a first magnetic flux resulting from the first coil structure and the magnetic flux-guiding unit; and
a second coil structure wound around the second winding portion of the magnetic flux-guiding unit, a second magnetic flux resulting from the second coil structure and the magnetic flux-guiding unit,
wherein the first magnetic flux and the second magnetic flux intersect at flux intersections within the magnetic flux-guiding unit, at least a portion of the first magnetic flux at the flux intersections being orthogonal to at least a portion of the second magnetic flux at the flux intersections,
wherein the magnetic flux-guiding unit comprises:
a modified H shape core having a first flange, a second flange, a bar connected between the two flanges, and a protruding part formed around the bar, the protruding part having an upper surface and a lateral surface orthogonal to each other;
a first plate horizontally placed on an upper side of a portion of the modified H shape core between the first flange and the protruding part, and covering the upper surface of the protruding part; and
a second plate vertically placed at a lateral side of another portion of the modified H shape core between the protruding part and the second flange, and covering the lateral surface of the protruding part, the second plate being orthogonal to the first plate,
wherein the first winding portion comprises a portion of the bar between the first flange and the protruding part; the second winding portion comprises another portion of the bar between the second flange and the protruding part; the first magnetic flux in the protruding part flows along a first direction and flows towards or away from the first plate through the upper surface of the protruding part along the first direction; and the second magnetic flux in the protruding part flows along a second direction orthogonal to the first direction and flows towards or away from the second plate through the lateral surface of the protruding part along the second direction,
wherein the first winding portion, the first flange and the protruding part define a first opening located at the lateral side between the first flange and the protruding part and form a first open magnetic path orthogonal to the first direction in the protruding part; and the second winding portion, the second flange and the protruding part define a second opening located at the upper side between the second flange and the protruding part and form a second open magnetic path orthogonal to the second direction in the protruding part.

US Pat. No. 9,899,131

STRUCTURE OF AN ELECTRONIC COMPONENT AND AN INDUCTOR

CYNTEC CO., LTD., Hsinch...

1. An electronic component, comprising: a body; a conductive wire disposed in the body; and a lead frame, comprising a first
lead comprising a first part, a second part and a third part, wherein a first surface of the body is disposed on the first
part of the first lead of the lead frame, the second part of the first lead of the lead frame is disposed on a second surface
of the body and the third part of the first lead of the lead frame is disposed on a third surface of the body, wherein the
first surface, the second surface and the third surface of the body are not coplanar with each other, wherein the first lead
of the lead frame is electrically connected to the conductive wire; wherein the electronic component is an inductor, wherein
the body comprises a first core and the conductive wire is wound on a winding shaft of the first core, wherein the second
part of the first lead has a protrusion protruding in a direction away from the body, wherein a first end of the conductive
wire is disposed between the protrusion of the second part of the first lead and the second part of the first lead disposed
on the second surface of the body and is electrically connected to the first lead.

US Pat. No. 9,911,715

THREE-DIMENSIONAL PACKAGE STRUCTURE AND THE METHOD TO FABRICATE THEREOF

CYNTEC CO., LTD., Hsinch...

1. A three-dimensional package structure, comprising:
a substrate having a top surface and a bottom surface;
a first plurality of discrete electronic components disposed over the bottom surface of the substrate, wherein a first discrete
electronic component and a second discrete electronic component are spaced apart by a horizontal gap therebetween; and

a connecting structure disposed over the bottom surface of the substrate for encapsulating the first plurality of discrete
electronic components, wherein the connecting structure comprises at least one insulating layer and a first plurality of conductive
patterns separated by the at least one insulating layer, wherein the first plurality of conductive patterns comprises wire
patterns and via patterns disposed in the at least one insulating layer, wherein the insulating layer is disposed on the bottom
surface of the substrate to form a substantially horizontal surface over the first plurality of discrete electronic components,
said insulating layer extending from said substantially horizontal surface in a direction towards the substrate to fill said
horizontal gap between the first and the second discrete electronic components, wherein a first conductive pattern of the
first plurality of conductive patterns is disposed on and in contact with the substantially horizontal surface, and a first
terminal of the first discrete electronic component and a second terminal of the second discrete electronic component are
electrically connected through said first conductive pattern, wherein the first plurality of conductive patterns comprise
a shielding layer disposed over the bottom surface of the substrate, wherein the substrate and the first plurality of discrete
electronic components are disposed at a same side of the shielding layer.

US Pat. No. 10,128,214

SUBSTRATE AND THE METHOD TO FABRICATE THEREOF

CYNTEC CO., LTD., Hsinch...

1. A package structure, comprising:a substrate, having a top surface, a bottom surface and a first lateral surface, said substrate comprising:
a plurality of insulating layers;
a plurality of conductive layers separated by the plurality of insulating layers;
wherein the first lateral surface of the substrate comprises at least one first portion of a first via that is in contact with a first conductive pattern of the plurality conductive layers, wherein said first conductive pattern is disposed between the top surface and the bottom surface of the substrate, wherein a first conductive material is filled in the at least one first portion of the first via, wherein the first lateral surface of the substrate further comprises at least one second portion of a second via, wherein a second conductive material is filled in the at least one second portion of the second via;
an electronic component, disposed over the top surface of the substrate and electrically connected to at least one portion of the plurality of conductive layers;
a first electrode, wherein at least one portion of the first electrode is disposed on the first lateral surface of the substrate and electrically connected to said first conductive pattern via the first conductive material filled in the at least one first portion of the first via; and
a second electrode, wherein at least one portion of the second electrode is disposed on the first lateral surface of the substrate and electrically connected to the second conductive material filled in the at least one second portion of the second via.

US Pat. No. 10,121,585

METHOD OF MANUFACTURING MAGNETIC CORE ELEMENTS

CYNTEC CO., LTD., Hsinch...

8. The method according to claim 7, wherein the legs are separated from the discrete core element by the cutting process.

US Pat. No. 9,831,023

ELECTRODE STRUCTURE AND THE CORRESPONDING ELECTRICAL COMPONENT USING THE SAME AND THE FABRICATION METHOD THEREOF

CYNTEC CO., LTD., Hsinch...

1. An electrical component, comprising:
a body;
a conductive element disposed in the body, wherein at least one portion of a terminal part of the conductive element is exposed
outside of the body;

a metal foil having an adhesive material on the bottom surface thereof, the metal foil being adhered on the body through the
adhesive material and covering a first portion of the terminal part of the conductive element, wherein a second portion of
the terminal part of the conductive element is not covered by the metal foil; and

a metal layer, overlaying on the metal foil and covering the second portion of the terminal part of the conductive element,
wherein the metal layer is electrically connected to the second portion of the terminal part of the conductive element for
electrically connecting with an external circuit.

US Pat. No. 10,068,693

MULTI-LAYER WIRING STRUCTURE, MAGNETIC ELEMENT AND MANUFACTURING METHOD THEREOF

CYNTEC CO., LTD., Hsinch...

1. A manufacturing method of a multi-layer wiring structure, comprising steps of:providing a first conductive structure and a second conductive structure, each of the first conductive structure and the second conductive structure comprising a plurality of wiring patterns and being a single conductive layer made of a metal material or an alloy material, the first conductive structure or the second conductive structure comprising a confining structure at an edge of the first conductive structure or the second conductive structure or a space between two of the wiring patterns, the first conductive structure comprising a first connection strip and the second conductive structure comprising a second connection strip, the wiring patterns of the first conductive structure having the same shape and being connected to the first connection strip, the wiring patterns of the second conductive structure having the same shape and being connected to the second connection strip;
disposing an insulating layer between the first conductive structure and the second conductive structure;
inserting a first positioning pin in a first positioning hole formed on the confining structure along a laminating direction; and
laminating the first conductive structure, the insulating layer and the second conductive structure to form the multi-layer wiring structure, wherein an entire insulating thickness between the first conductive structure and the second conductive structure is thinner than the single conductive layer of the first conductive structure or the second conductive structure after the laminating step.

US Pat. No. 9,984,996

THREE-DIMENSIONAL (3D) PACKAGE STRUCTURE WITH ELECTRONIC COMPONENTS ENCAPSULATED BY A CONNECTION STRUCTURE OVER AN INDUCTOR

CYNTEC CO., LTD., Hsinch...

14. A three-dimensional package structure, comprising:an inductor, having a top surface, a bottom surface, a first lateral surface and a second lateral surface opposite to the first lateral surface, wherein a plurality of terminals of the inductor are on the top surface;
a plurality of electronic components, disposed over the top surface of the inductor and located between the first lateral surface and the second lateral surface of the inductor; and
at least one insulating layer, disposed on the top surface of the inductor and encapsulating the plurality of electronic components, wherein a plurality of conductive patterns separated by the at least one insulating layer are disposed over the top surface of the inductor and electrically connect the plurality of electronic components and the inductor via at least one via disposed in the at least one insulating layer, wherein a first via extends from a first conductive pattern located over one of the plurality of electronic components to said one of the plurality of electronic components.

US Pat. No. 9,859,050

METHOD FOR PRODUCING MAGNETIC ELEMENT WITH TWO MAGNETIC CORES FOR INCREASING COILING SPACE AND MAGNETIC ELEMENT THEREOF

CYNTEC CO., LTD., Hsinch...

1. A magnetic element, comprising:
a first magnetic core comprising:
a first coiling body;
a first protruding portion connected to a first terminal of the first coiling body and having a first soldering surface; and
a second protruding portion connected to a second terminal of the first coiling body;
a second magnetic core comprising:
a second coiling body disposed in parallel to the first coiling body;
a third protruding portion connected to a first terminal of the second coiling body and disposed adjacent to the second protruding
portion; and

a fourth protruding portion connected to a second terminal of the second coiling body, disposed adjacent to the first protruding
portion, and having a second soldering surface in parallel to the first soldering surface;

a plurality of wires, each coiled on the first coiling body or the second coiling body;
a plurality of electrodes, each disposed on the first soldering surface of the first protruding portion or the second soldering
surface of the fourth protruding portion and configured to couple to an external system printed circuit board; and

a plurality of connection nodes, each disposed on the second protruding portion and the third protruding portion, each connection
node of the plurality of connection nodes disposed on the second protruding portion being coupled to a corresponding connection
node of the plurality of the connection nodes disposed on the third protruding portion;

wherein:
an extension direction of the first coiling body is towards away from the first soldering surface, and an extension direction
of the second coiling body is towards away from the second soldering surface;

the plurality of wires are coiled on the first coiling body along the extension direction of the first coiling body or coiled
on the second coiling body along the extension direction of the second coiling body; and

the first coiling body and the second coiling body both comprise magnetically conductive material.

US Pat. No. 9,991,041

VARIABLE COUPLED INDUCTOR

CYNTEC CO., LTD., Hsinch...

1. A variable coupled inductor, comprising:a first core having a top surface and a bottom surface, a first lateral surface and a second lateral surface opposite to the first lateral surface, wherein the first core comprises a first protrusion, a second protrusion, a third protrusion, a first conducting-wire groove and a second conducting-wire groove, each of which extending from the first lateral surface to the second lateral surface on the top surface, wherein the second protrusion is disposed between the first protrusion and the third protrusion, wherein the first conducting-wire groove is located between the first protrusion and the second protrusion, and the second conducting-wire groove is located between the second protrusion and the third protrusion;
a first conducting wire disposed in the first conducting-wire groove and
a second conducting wire disposed in the second conducting-wire groove;
a second core disposed over the first core; and
a magnetic structure disposed between the second protrusion and the second core, wherein the magnetic structure comprises a first portion and a second portion, wherein the first portion and the second portion are symmetric to each other with respect to a central line of the second protrusion, wherein the central line extends from a first middle point of a first edge of the second protrusion on the first lateral surface to a second middle point of a second edge of the second protrusion on the second lateral surface, wherein side surfaces of the second protrusion located below said magnetic structure are not used for winding a conductive wire therearound, wherein a top surface of the second protrusion is respectively lower than a top surface of the first protrusion and a top surface of the third protrusion, and a top surface of said magnetic structure is respectively higher than said top surface of the first protrusion and said top surface of the third protrusion.

US Pat. No. 10,121,583

COIL STRUCTURE AND ELECTROMAGNETIC COMPONENT USING THE SAME

CYNTEC CO., LTD, Hsinchu...

1. An electromagnetic component, comprising:a conductive structure, comprising at least one conductive layer to form a coil, wherein a conductive layer comprises a coil pattern comprising a middle trace comprising a contiguous portion extending from a first side of the conductive layer to a second side opposite to the first side of the conductive layer, a first slim trace and a second slim trace, wherein the first slim trace comprises a first end point of the coil pattern and the second slim trace comprises a second end point of the coil pattern, and each of an inner side surface of the middle trace on the first side of the conductive layer and an inner side surface of the first slim trace on the second side of the conductive layer respectively forms a corresponding part of the innermost boundary of the coil pattern, wherein the width of the middle trace is respectively greater than that of the first slim trace and the second slim trace, wherein along the winding direction of the coil pattern, the total length of the middle trace is respectively greater than that of the first slim trace comprising said first end point of the coil pattern and the second slim trace comprising said second end point of the coil pattern, wherein a portion of an outer side surface of the first slim trace and a portion of an inner side surface of the second slim trace are placed side by side on the second side of the conductive layer for matching the width of the middle trace with a total of the width of the first slim trace, the width of the second slim trace and a spacing between said two slim traces.

US Pat. No. 9,978,611

STACK FRAME FOR ELECTRICAL CONNECTIONS AND THE METHOD TO FABRICATE THEREOF

CYNTEC CO., LTD., Hsinch...

1. A package structure, comprising:a plurality of metal parts, wherein each metal part is made of metal and each two adjacent metal parts are spaced apart by a gap being filled with an insulating material that is not in a gas form;
a first insulating layer, disposed over a top or a bottom surface of the plurality of metal parts; and
at least one first conductive layer, disposed over the first insulating layer, wherein a first conductive pattern of the at least one first conductive layer is electrically connected to a first metal part of the plurality of metal parts through at least one first via disposed in the first insulating layer, wherein a unitary conductive body is formed inside the first via, and the unitary conductive body comprises a contiguous portion being in contact with two opposite sidewalls of the first via in the first insulating layer.

US Pat. No. 9,959,965

PACKAGING STRUCTURE OF A MAGNETIC DEVICE

CYNTEC CO., LTD., Hsinch...

1. An inductor comprising:a T-shaped magnetic core, being made of a material comprising an annealed soft magnetic metal material and having a base and a pillar integrally formed with the base, the base having a top side and a bottom side opposite to the top side, the pillar being located on the top side of the base, wherein a volume of the base is V1 and a volume of the pillar is V2;
a coil wound on the pillar; and
a unitary magnetic body encapsulating the pillar, the coil and a portion of the base with a bottom surface of the base being not covered by the unitary magnetic body, wherein a contiguous portion of the unitary magnetic body encapsulates a top surface of the pillar and extends into a gap between a side surface of the pillar and an inner surface of the coil, wherein a ratio of V1 to V2 (V1/V2) is configured in a pre-determined range so as to reduce the total core loss of the inductor with an equivalent permeability of the inductor being between 28.511 and 52.949, wherein V1/V2?2.533, and the total core loss of the inductor is not greater than 695.02 mW.

US Pat. No. 9,991,136

LEADFRAME AND THE METHOD TO FABRICATE THEREOF

CYNTEC CO., LTD., Hsinch...

1. An electrical component, comprising:a substrate, comprising a first portion, a second portion and at least one third portion between the first portion and the second portion, wherein a first conductive pillar is formed on the first portion of the substrate, and a second conductive pillar is formed on the second portion of the substrate, wherein the first conductive pillar, the second conductive pillar and the at least one third portion form a 3D space;
at least one device, disposed in the 3D space, wherein at least one portion of the at least one device is disposed below the top surface of the first conductive pillar and above each of the top surface of the at least one third portion and the bottom surface of the first conductive pillar, wherein the bottom surface of the first conductive pillar is on the substrate with an inner side surface of the first conductive pillar facing the second conductive pillar and an outer side surface of the first conductive pillar being opposite to said inner side surface, wherein no part of said at least one device is located outside said outer side surface of the first conductive pillar, wherein a first terminal and a second terminal of the at least one device are respectively electrically connected to the first conductive pillar and the second conductive pillar.

US Pat. No. 10,134,522

PLANAR REACTOR

CYNTEC CO., LTD., Hsinch...

1. A planar reactor comprising:a core comprising:
an upper board;
a lower board; and
a pillar located between the upper board and the lower board, a winding space being located among the upper board, the lower board and the pillar;
a coil wound around the pillar and located in the winding space;
a heat conducting member disposed at the first end of the coil extending outside at least one of the upper board and the lower board and overlapping a part of the coil from an innermost ring to an outermost ring; and
a pouring sealant covering the coil and a plurality of surfaces of the heat conducting member;
wherein the pillar and at least one of the upper board and the lower board are coplanar at a first side of the planar reactor, the pillar is sunk into the winding space from a second side of the planar reactor, the first side is opposite to the second side, a first end of the coil is exposed from the first side of the planar reactor, a second end of the coil is hidden in the winding space partially or wholly at the second side of the planar reactor, the first end is opposite to the second end.

US Pat. No. 10,144,995

MIXED MAGNETIC POWDERS AND THE ELECTRONIC DEVICE USING THE SAME

CYNTEC CO., LTD., Hsinch...

1. A magnetic powder for mixing with a corresponding magnetic powder to make a magnetic body, wherein each of said magnetic powder and said corresponding magnetic powder is made of a soft magnetic material, and the average particle diameter of said magnetic powder is greater than that of said corresponding magnetic powder, wherein the ratio of the D50 of said magnetic powder to the D50 of said corresponding magnetic powder is in the range of 5 to 12, wherein said magnetic powder weighs 50 to 90 percent of the total weight of said magnetic powder and said corresponding magnetic powder, and said corresponding magnetic powder weighs 10 to 50 percent of the total weight of said magnetic powder and said corresponding magnetic powder, wherein the D50 of said magnetic powder is in the range of 17 to 36 um, the D10 of said magnetic powder is in the range of 8 to 26 um, and the D90 of said magnetic powder is in the range of 30 to 52 um, for pairing with a corresponding D50, D10 and D90 of said corresponding magnetic powder to increase the density of the magnetic body.

US Pat. No. 10,212,817

ELECTRONIC MODULE WITH A MAGNETIC DEVICE

CYNTEC CO., LTD., Hsinch...

1. An electronic module, comprising:a magnetic device, comprising a body having a top surface, a bottom surface, a first lateral surface and a second lateral surface opposite to the first lateral surface, wherein the magnetic device comprises a first lead and a second lead, wherein the second lead is extended outside of the body from the second lateral surface; and
a substrate, having a top surface and a bottom surface, wherein at least one electronic device is disposed on the top surface or the bottom surface of the substrate, wherein the substrate and the second lead are located at a same lateral side of the body of the magnetic device with respect to the second lateral surface, wherein the second lead is extended from the second lateral surface of the body to the substrate to electrically connect the magnetic device to the substrate, wherein the first lead of the magnetic device is not in contact with the substrate and is used for connecting with an external circuit.

US Pat. No. 10,186,366

ELECTRODE STRUCTURE AND THE CORRESPONDING ELECTRICAL COMPONENT USING THE SAME AND THE FABRICATION MERHOD THEREOF

CYNTEC CO., LTD., Hsinch...

1. An electrical component, comprising: a magnetic core, wherein a first side of the magnetic core comprises a protrusion portion, a first recess and a second recess, wherein the first recess and the second recess are at two opposite sides of the protrusion portion on the first side of the magnetic core, and each of said recesses respectively has only one sidewall formed by the magnetic core, wherein each said only one sidewall is formed by a corresponding side surface of the protrusion portion, wherein a first electrode structure and a second electrode structure are respectively disposed over the first recess and the second recess, wherein each of the first electrode structure and the second electrode structure comprises a corresponding inner metal layer and a corresponding outer metal layer with a corresponding terminal of a conductive element of the electrical component being disposed therebetween, wherein said corresponding terminal of the conductive element and said corresponding inner metal layer are disposed in a corresponding recess of said recesses, wherein said corresponding terminal of the conductive element of the electrical component is electrically connected to said corresponding inner metal layer and said corresponding outer metal layer for electrically connecting with an external circuit.

US Pat. No. 10,256,118

LEAD FRAME AND THE METHOD TO FABRICATE THEREOF

CYNTEC CO., LTD., Hsinch...

1. A method to form an inductor, comprising:providing a first lead and a second lead of the inductor; and
forming a first conductive pillar and a second conductive pillar on a first portion of the first lead and a first portion of the second lead, respectively, wherein a second portion of the first lead, a second portion of the second lead, the first conductive pillar, and the second conductive pillar form a 3D space, wherein at least one portion of a coil comprising a plurality of winding turns is disposed in the 3D space with a bottom surface of the plurality of winding turns being respectively lower than a top surface of the first conductive pillar and a top surface of the second conductive pillar, and two terminal parts of the coil are electrically connected to the first lead and the second lead via the first conductive pillar and the second conductive pillar, respectively.

US Pat. No. 9,484,290

ELECTRONIC SYSTEM WITH A COMPOSITE SUBSTRATE

CYNTEC Co, Ltd., Hsinchu...

1. An electronic system with a composite substrate, comprising:
a lead frame having a chip mounting area and a plurality of metal leads arranged along a periphery of said chip mounting area,
wherein each of the plurality of metal leads is spaced from said chip mounting area by a gap;

a conductive pattern structure disposed over said lead frame and having circuitry, said conductive pattern structure bridging
the gap between each said metal lead and said chip mounting area; and

a chip, mounted on said chip mounting area of said lead frame and electrically coupling to the circuitry of said conductive
pattern structure, wherein a bottom surface of said conductive pattern structure comprises a plurality of contacts and a bottom
surface of each of the plurality of metal leads that is located below a bottom surface of said chip extends upright to a portion
of the top surface of the metal lead that is in contact with and electrically connected to a corresponding contact of said
conductive pattern structure.

US Pat. No. 10,199,153

PCB INTER-LAYER CONDUCTIVE STRUCTURE APPLICABLE TO LARGE-CURRENT PCB

CYNTEC CO., LTD, Hsinchu...

1. A process for producing an inter-layer conductive structure of a circuit board, comprising steps of:a) providing a first insulating layer, which has at least a first hole therein;
b) inserting a first electric contact material, which is formed, as a body with size and shape consistent to the first hole to minimize voids in the first hole, into the first hole of the first insulating layer to form a first conductive plug;
c) laminating a first conductive layer onto a first surface of the first insulating layer;
d) laminating a second conductive layer onto a second surface of the first insulating layer;
e) performing a first pattern-defining and etching procedure for the first conductive layer to form a first conductive structure after the laminating step c);
wherein after the laminating steps c) and d) are completed, the first conductive plug has two ends thereof in electric contact with the first conductive layer and the second conductive layer, respectively, and
f) performing a second pattern-defining and etching procedure for the second conductive layer to form a second conductive structure after the laminating step d);
wherein the performing steps e) and f) are performed simultaneously or separately, and after the performing steps e) and f), at least one of the first conductive structure and the second conductive structure partially covers the corresponding one of the two ends of the first conductive plug in contact therewith.

US Pat. No. 10,199,361

STACKED ELECTRONIC STRUCTURE

CYNTEC CO., LTD., Hsinch...

1. A stacked electronic structure, comprising:a substrate, wherein a plurality of electronic devices and a plurality of conductive pillars are disposed on and electrically connected to the substrate, wherein a molding body encapsulates the plurality of electronic devices; and
a magnetic device, disposed over the top surface of the molding body and the plurality of conductive pillars, wherein a first terminal of the magnetic device is disposed over and electrically connected to a first conductive pillar and a second terminal of the magnetic device is disposed over and electrically connected to a second conductive pillar, without using any substrate.

US Pat. No. 10,210,992

APPARATUS OF COUPLED INDUCTORS WITH BALANCED ELECTROMOTIVE FORCES

CYNTEC CO., LTD., Hsinch...

1. An apparatus of coupled inductors, comprising:a material body having a first wrapping region and a second wrapping region along an axis direction;
a first electrode and a second electrode disposed on a first terminal location along the axis direction;
a third electrode and a fourth electrode disposed on a second terminal location along the axis direction;
a first coil wrapped in the first wrapping region and comprising:
a first winding leg having a first end connected to the second electrode and a second end extending towards the second wrapping region; and
a second winding leg having a first end connected to the first winding leg and a second end extending towards the first terminal location for connecting to the first electrode; and
a second coil wrapped in the second wrapping region and comprising:
a third winding leg having a first end connected to the third electrode and a second end extending towards the first wrapping region; and
a fourth winding leg having a first end connected to the third winding leg and a second end extending towards the second terminal location for connecting to the fourth electrode;
wherein:
the first terminal location and the second terminal location are on opposite sides of the axis direction;
the first wrapping region is between the first terminal location and the second wrapping region;
the second wrapping region is between the second terminal location and the first wrapping region; and
the first coil is not wrapped in the second wrapping region.

US Pat. No. 10,217,563

METHOD OF MANUFACTURING MULTI-LAYER COIL AND MULTI-LAYER COIL DEVICE

CYNTEC CO., LTD., Hsinch...

1. A method of manufacturing a multi-layer coil comprising:providing a substrate;
forming a seed layer on the substrate, wherein the seed layer comprises a plurality of winding turns of a conductive wire, wherein each two adjacent winding turns of the conductive wire are separated by a gap; and
plating N metal layers on the seed layer to encapsulate the plurality of winding turns of the conductive wire to form a multi-layer coil with N different current densities respectively, N being a positive integer not less than 3, wherein each metal layer is in contact with a different area of the top surface of the substrate to encapsulate a corresponding winding turn of the conductive wire, wherein the current density used for plating each metal layer increases as the level of the metal layer increases, and the current density difference between each two adjacent metal layers decreases as the level of the metal layer increases.

US Pat. No. 10,204,730

ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF

CYNTEC CO., LTD., Hsinch...

1. An electronic device, comprising:a first magnetic powder;
a second magnetic powder, mixed with the first magnetic powder to form a mixture of the first magnetic powder and the second magnetic powder, wherein the mean particle diameter of the first magnetic powder is larger than the mean particle diameter of the second magnetic powder, the hardness of the first magnetic powder is greater than the hardness of the second magnetic powder by a first hardness difference; and
an insulated conducting wire buried in the mixture of the first magnetic powder and the second magnetic powder, wherein the insulated conducting wire comprises a plurality of winding turns, wherein at least two adjacent winding turns are in contact with each other;
wherein by means of the first hardness difference of the first magnetic powder and the second magnetic powder, the mixture of the first magnetic powder and the second magnetic powder and the insulated conducting wire buried therein are combined to form an integral magnetic body at a temperature lower than the melting point of the insulated conducting wire.

US Pat. No. 10,433,424

ELECTRONIC MODULE AND THE FABRICATION METHOD THEREOF

CYNTEC CO., LTD, Hsinchu...

1. An electronic module, comprising:a unitary substrate, having a top surface and a bottom surface, wherein the unitary substrate is made of a single insulating layer extending from the top surface to the bottom surface of the unitary substrate, wherein there is no horizontally-placed conductive layer that is disposed between said top surface and said bottom surface of the unitary substrate, wherein a conductive layer is disposed on the top surface of the unitary substrate;
a plurality of first discrete electronic components, embedded inside the unitary substrate and electrically connected to the conductive layer, wherein a top surface of each of the plurality of first discrete electronic components is respectively located lower than the top surface of the unitary substrate, and a bottom surface of each of the plurality of first discrete electronic components is respectively located higher than the bottom surface of the unitary substrate;
a second discrete inductor, comprising a magnetic body and a coil encapsulated in the magnetic body, wherein the magnetic body is disposed over the top surface of the unitary substrate; and
a molding body, disposed over the top surface of the unitary substrate and the plurality of first discrete electronic components to encapsulate the magnetic body of the second discrete inductor, wherein the second discrete inductor embedded in the molding body is electrically connected to a discrete electronic component of the plurality of first discrete electronic components via the conductive layer disposed on the top surface of the unitary substrate and a conductive via that is entirely disposed inside the unitary substrate.

US Pat. No. 10,297,573

THREE-DIMENSIONAL PACKAGE STRUCTURE AND THE METHOD TO FABRICATE THEREOF

CYNTEC CO., LTD., Hsinch...

1. A three-dimensional package structure, comprising:a substrate, having a top surface and a bottom surface;
a first plurality of discrete electronic components, wherein the first plurality of discrete electronic components are laterally placed and disposed over the bottom surface of the substrate; and
a first insulating layer, disposed over the bottom surface of the substrate to encapsulate the first plurality of discrete electronic components, wherein the first insulating layer forms a substantially horizontal surface over the first plurality of discrete electronic components and extended from said substantially horizontal surface in a direction towards the substrate to fill a horizontal gap between the first plurality of discrete electronic components, wherein a plurality of conductive patterns are disposed over the bottom surface of the substrate, wherein a first discrete electronic component and a second discrete electronic component of the first plurality of discrete electronic components are electrically connected via a first conductive pattern that is disposed on and in contact with the substantially horizontal surface; and
at least one second insulating layer, disposed over the first insulating layer and the first conductive pattern, wherein a plurality of surface-mount pads are disposed on the bottom surface of the at least one second insulating layer and electrically connected to at least one via disposed in the at least one second insulating layer.

US Pat. No. 10,280,490

MIXED MAGNETIC POWDERS AND THE ELECTRONIC DEVICE USING THE SAME

CYNTEC CO., LTD., Hsinch...

1. A magnetic powder for mixing with a corresponding magnetic powder to make a magnetic body, wherein each of said magnetic powder and said corresponding magnetic powder is made of a soft magnetic material, and the average particle diameter of said magnetic powder is greater than that of said corresponding magnetic powder, wherein the D50 of said magnetic powder is in the range of 17 to 36 um, the D10 of said magnetic powder is in the range of 8 to 26 um, and the D90 of said magnetic powder is in the range of 30 to 52 um, for pairing with a corresponding D50, D10 and D90 of said corresponding magnetic powder to increase the density of the magnetic body.

US Pat. No. 10,332,669

ELECTROMAGNETIC COMPONENT AND FABRICATION METHOD THEREOF

CYNTEC CO., LTD., Hsinch...

1. An electromagnetic component, comprising:a substrate;
a conductive structure on the substrate, wherein the conductive structure comprises a coil formed in a plurality of conductive layers separated by at least one insulating layer, wherein the plurality of conductive layers comprise at least three conductive layers, wherein a blind via is disposed in a first insulating layer of the at least one insulating layer to electrically connect a first conductive layer and a second conductive layer, wherein a hollow space is formed inside the coil and extended from a top surface of the conductive structure to a bottom surface of the substrate, said hollow space penetrating the plurality of conductive layers and the at least one insulating layer with an inner side surface of the coil in each of the plurality of conductive layers being exposed to the hollow space; and
a magnetic molding body, encapsulating the conductive structure and extending into the hollow space, wherein an outer surface of a first portion of the magnetic molding body disposed inside the hollow space is physically in contact with said inner side surface of the coil in each of the plurality of conductive layers.

US Pat. No. 10,373,930

PACKAGE STRUCTURE AND THE METHOD TO FABRICATE THEREOF

CYNTEC CO., LTD, Hsinchu...

1. A package structure, comprising:a first lead frame, having a top surface and a bottom surface and comprising a through-opening therein, wherein the through-opening is exposed from the top surface and the bottom surface of the first lead frame;
a first electronic device, having at least one first I/O terminal on a top surface of the first electronic device, wherein at least one portion of the first electronic device is disposed in the through-opening of the first lead frame, wherein an insulating layer is disposed on the top surface of the first electronic device and the top surface of the first lead frame and extended into spaces between the first lead frame and the first electronic device in the through-opening;
a conductive layer disposed on the insulating layer; and
a second electronic device disposed above the top surface of the first lead frame and the top surface of the first electronic device, wherein the second electronic device is electrically connected to the first electronic device through the conductive layer, wherein a conductive pattern of the conductive layer electrically connects the first I/O terminal of the first electronic device to the top surface of the first lead frame through a via that is disposed in the insulating layer and located over the top surface of the first lead frame.

US Pat. No. 10,340,074

TRANSFORMER

CYNTEC CO., LTD., Hsinch...

1. A transformer comprising:a first core having a central hole;
a second core disposed in the central hole, the second core having two flanges and a pillar located between the two flanges, a winding space being located among the two flanges and the pillar;
a plurality of electrodes disposed on the first core, each of the electrodes having a first platform and a second platform higher than the first platform, the first platform being protruded from a surface of the first core, the second platform being protruded from the first platform;
an inner winding wound around the pillar and located in the winding space, a first winding end of the inner winding being electrically connected to one of the electrodes, the inner winding comprising a first wire and a first insulating layer covering the first wire; and
an outer winding wound around the inner winding and located in the winding space, a second winding end of the outer winding being electrically connected to one of the electrodes, the outer winding comprising a second wire and a second insulating layer covering the second wire, second thickness of the second insulating layer being larger than first thickness of the first insulating layer.

US Pat. No. 10,373,894

PACKAGE STRUCTURE AND THE METHOD TO FABRICATE THEREOF

CYNTEC CO., LTD, Hsinchu...

1. A package structure, comprising:a lead frame, formed by a plurality of sub lead frames each being made of metal, wherein each two adjacent sub lead frames are spaced apart by a vacancy, wherein said vacancy is filled with insulating material, wherein a recess is formed in a sub lead frame;
a substrate, comprising conductive patterns therein; and
a first electronic device, disposed on a bottom surface of the substrate and electrically connected to at least one portion of the conductive patterns of the substrate;
wherein the substrate is disposed over the plurality of sub lead frames and said vacancy with at least one portion of the first conductive element disposed in the recess; and
wherein the first electronic device is electrically connected to the lead frame via at least one portion of the conductive patterns of the substrate, and a plurality of pads are disposed on the bottom surface of the lead frame, wherein a first conductive pattern and a second conductive pattern of the substrate are respectively electrically connected to a first pad and a second pad via a corresponding sub lead frame.

US Pat. No. 10,366,818

CHOKE HAVING A CORE WITH A PILLAR HAVING A NON-CIRCULAR AND NON-RECTANGULAR CROSS SECTION

CYNTEC CO., LTD, Hsinchu...

1. An inductor comprising: a core structure having a first board, a second board, and a pillar located between the first and second boards, a winding space being located among the first board, the second board and the pillar, wherein the pillar has a non-circular and non-rectangular cross section along a direction substantially perpendicular to an axial direction of the pillar, wherein the periphery of the cross section of the pillar comprises a first substantially straight line, a first arc, a second substantially straight line, and a second arc on four sides of the periphery, respectively, wherein the substantially straight lines are interleaved with the arcs on the periphery of the cross section of the pillar, and wherein each arc is convex with respect to said substantially straight lines, wherein a coil is disposed in the winding space and wound on the first substantially straight line, the first arc, the second substantially straight line, and the second arc, wherein the cross section of the pillar has a first axis and a second axis intersecting with each other at a center of the cross section of the pillar and being substantially perpendicular with each other, wherein the length of the first axis is greater than that of the second axis, and an inequality is satisfied:
wherein X represents the length of the first axis, and Y represents the length of the second axis;
wherein the periphery of the cross section of the pillar encloses the center of the first board, wherein each of a first edge and a third edge of the first board is substantially in parallel with the first axis, and each of a second edge and a fourth edge of the first board is substantially in parallel with the second axis, wherein an inequality is satisfied:

wherein M? represents the distance between the second edge of the first board and the center of the cross section of the pillar along the direction of the first axis, N? represents the distance between the first edge of the first board and the center of the cross section of the pillar along the direction of the second axis, wherein the distance between the second edge of the first board and the center of the cross section of the pillar along the direction of the first axis is equal to the distance between the fourth edge of the first board and the center of the cross section of the pillar along the direction of the first axis; and the distance between the first edge of the first board and the center of the cross section of the pillar along the direction of the second axis is equal to the distance between the third edge of the first board and the center of the cross section of the pillar along the direction of the second axis.

US Pat. No. 10,438,907

WIRELESS PACKAGE WITH ANTENNA CONNECTOR AND FABRICATION METHOD THEREOF

CYNTEC CO., LTD., Hsinch...

1. A wireless package, comprising:a package substrate having a top surface and a bottom surface;
at least one radio-frequency integrated circuit (RFIC) chip mounted on the top surface of the package substrate;
a first resilient connector mounted on the top surface of the package substrate, wherein the first resilient connector has a terminal bonded to a bond pad on the top surface of the package substrate, a horizontal contact portion, and an oblique support portion being integrally coupled to the horizontal contact portion and extending between the horizontal contact portion and the terminal;
a molding compound encapsulating the at least one RFIC chip, the at least one first resilient connector, and the top surface of the package substrate, wherein the horizontal contact portion further comprises an interlocking surface that is lower than a top surface of the molding compound, wherein the molding compound covers the interlocking surface, thereby forming an interlocking feature between the molding compound and the horizontal contact portion of the first resilient connector; and
an antenna directly disposed on the top surface of the molding compound and being in direct contact with a flat top surface of the horizontal contact portion, wherein the horizontal contact portion further comprises a recessed structure that is recessed into a sidewall of the horizontal contact portion to form the interlocking surface on the recessed structure.

US Pat. No. 10,438,730

CURRENT SENSING RESISTOR AND FABRICATION METHOD THEREOF

CYNTEC CO., LTD., Hsinch...

1. A current sensing resistor, comprising:a conductive body comprising a resistor portion and a pair of electrode portions, wherein the resistor portion is situated between the pair of electrode portions, and each of the pair of electrode portions has a top surface;
a receiving blind hole disposed on the top surface of each of the pair of electrode portions, wherein the receiving blind hole has a bottom; and
a detection terminal disposed on the receiving blind hole, wherein the detection terminal comprising a base fixed in the receiving blind hole and a terminal pin protruding from the top surface, and the base is above the bottom, wherein the conductive body further comprises an extrusion portion extending from each of the pair of electrode portions and the extrusion portion fixes the base in the receiving blind hole.