US Pat. No. 10,082,256

METHOD OF MAKING LED LIGHT BULB WITH THERMAL RADIATION FILAMENTS

BGT MATERIALS LIMITED, M...

1. A method of making a LED light bulb with thermal radiation filaments comprising steps of:A. providing a substrate which includes multiple conductive portions formed on two ends of the substrate respectively so as to electrically connect with an electronic circuit;
B. molding LED chips, wires, and phosphors on a front face of the substrate so as to produce a LED filament sheet;
C. forming a thermal radiation dissipation film on a back face of the substrate before or after producing the LED filament sheet;
D. cutting the substrate into the thermal radiation filaments, wherein each of the thermal radiation filaments has a part of the thermal radiation dissipation film, a part of the LED filament sheet, and parts of the multiple conductive portions respectively; and
E. fixing the thermal radiation filaments into the LED light bulb.

US Pat. No. 10,561,025

METHOD OF MANUFACTURING POLYMER PRINTED CIRCUIT BOARD

BGT MATERIALS LIMITED, M...

1. A method of manufacturing a polymer printed circuit board comprising in a sequential order steps of:A. providing a material layer consisting of a polymer film;
B. forming circuit pattern on the material layer, wherein the circuit pattern is comprised of laser induced graphene (LIG), and the laser induced graphene is porous;
C. depositing metal nanoparticles on the LIG of the circuit pattern so that the metal nanoparticles on the LIG of the circuit pattern is used as a metal seed of a meta layer formed on the LIG of the circuit pattern;
D. pressing the circuit pattern on which the metal nanoparticles are deposited; and
E. forming the metal layer on the LIG of the circuit pattern by using the metal seed, thus producing the polymer printed circuit board.

US Pat. No. 10,283,683

FILAMENT STRUCTURE AND LED LIGHT BULB HAVING THE SAME

BGT Materials Limited, (...

1. An LED filament comprising:a light transmissive substrate, at least one LED chip connected on a front face of the substrate, a first electrode pin and a second electrode pin which are arranged on two sides of the substrate respectively and are serially connected with the at least one LED chip, a light emitting layer formed on a back face or the front face of the substrate, and a phosphor layer formed on the front face of the substrate;
wherein the phosphor layer packages the at least one LED chip, and the first electrode pin and the second electrode pin expose outside the phosphor layer;
wherein the light emitting layer is made of electromagnetic wave material of different radiation waves, the at least one LED chip produces excitation light source to excite the phosphor layer to illumine lights, and a part of the excitation light source of the at least one LED chip excites the light emitting layer to illuminate the lights after passing through the substrate, wherein the part of the excitation light source of the at least one LED chip excites phosphors of the light emitting layer to illuminate the lights toward the back face of the LED filament or the light emitting layer absorbs visible lights converted from infrared lights.

US Pat. No. 10,281,129

FILAMENT STRUCTURE OF LED LIGHT BULB

BGT Materials Limited, (...

1. A light-emitting diode (LED) light bulb comprising: a screw base, a transparent housing, at least one filament support, and at least one LED filament;the transparent housing being hollow and including an opening, and the screw base including a positive terminal and a negative terminal which are electrically connected with an external power supply so as to supply driving power to the at least one LED filament, wherein each of the at least one filament support includes a first metal post electrically connected with the positive terminal of the screw base and includes a second metal post electrically connected with the negative terminal so as to transmit the driving power;
wherein the at least one LED filament includes a substrate, a first electrode pin and a second electrode pin which are arranged on two sides of the substrate respectively, a thermal radiation coating formed on a back face of the substrate, at least one LED chip molded on a front face of the substrate, a wire, and a fluorescent;
wherein the at least one LED chip is electrically connected with the first electrode pin and the second electrode pin in a series connecting manner by using the wire, wherein the first electrode pin is electrically connected with the first metal post, and the second electrode pin is electrically connected with the second metal post so that an LED drive circuit is defined;
wherein the at least one LED filament and the at least one filament support are accommodated in the transparent housing, and the screw base is housed into the opening of the transparent housing, and the opening is closed.

US Pat. No. 9,563,837

HYBRID TAG AND METHOD OF MAKING ANTENNA THEREOF

BGT MATERIALS LIMITED, M...

1. A hybrid tag being employed to magnetic system and radio frequency system and comprising:
an IC chip and an antenna electrically connected with the IC chip;
wherein the IC chip includes a memory storage unit configured to store digital data;
wherein the antenna is made of mixture composition in a printing manner, and the mixture composition includes electrically
conductive material for electromagnetic signals, magnetic material for magnetic signals, dispersant and adhesive, wherein
the hybrid tag responds magnetic waves within low frequency (LF) range and responds radio frequency signals within high frequency
(HF) range, ultra high frequency (UHF) range, and microwave range.

US Pat. No. 10,318,857

PRINTED RFID SENSOR TAG

BGT Materials Limited, M...

1. A printed RFID sensor tag comprising: a substrate, a RFID sensor arranged on a top of the substrate, and a protective layer covering the RFID sensor;the RFID sensor including a RFID sensing antenna and a chip adhered on the RFID sensing antenna, wherein the RFID sensing antenna is partially or totally made of conductive sensing ink/glue printed on the top of the substrate, and the conductive sensing ink/glue consists of conductive ink/glue and multiple sensing materials;
wherein the RFID sensing antenna includes a first part, a second part, and a sensing part, wherein a first distal segment of the first part separates from a second distal segment of the second part so as to produce an open circuit between the first distal segment of the first part and the second distal segment of the second part, wherein a chip adheres on a connection portion of the first part and the second part, the sensing part is coupled with the first segment of the first part and the second segment of the second part; the first part and the second part are made of conductive ink/glue, and the sensing part are made of conductive sensing ink/glue, wherein the sensing part is a normal open circuit and changes to a closed circuit after being influenced by multiple sensed targets.