US Pat. No. 9,240,334

METHOD FOR DETACHING A SEMICONDUCTOR CHIP FROM A FOIL

Besi Switzerland AG, Cha...

4. Method for detaching semiconductor chips from a foil, the method comprising the following steps:
illuminating a semiconductor chip to be removed with light which impinges substantially perpendicularly onto the surface of
the semiconductor chip;

carrying out at least one prepeeling step, in which firstly at least one region of the semiconductor chip remains sticked
to the foil and is bent and afterwards detaches from the foil, wherein each of the at least one prepeeling steps comprises
the following steps:

initiating the prepeeling step;
repeating the two steps:
recording of an image of the semiconductor chip, and
checking whether in the image a peripheral region of the semiconductor chip is darker than a predetermined brightness value;
until the check leads to the result that no peripheral region of the semiconductor chip is darker than the predetermined brightness
value; and

at the end of the last prepeeling step grasping the semiconductor chip by a chip gripper and completing the detachment of
the semiconductor chip from the foil.

US Pat. No. 9,339,885

METHOD AND APPARATUS FOR DISPENSING FLUX-FREE SOLDER ON A SUBSTRATE

Besi Switzerland AG, Cha...

1. A method for dispensing flux-free solder onto substrate places of a substrate by means of a dispensing apparatus comprising
a dispenser head which comprises a stamp, an ultrasonic head configured to apply ultrasound to the stamp and a wire feed,
wherein the stamp has a working surface which has a recess open to a lateral surface of the stamp, wherein the wire feed feeds
the solder wire under an angle diagonally to the surface of the substrate, and wherein a heatable support heats the substrate
to a temperature above the melting temperature of the solder, the method comprising the following steps:
A) moving the dispenser head to a predetermined position above the next substrate place onto which solder is to be dispensed,
B) lowering the stamp until
B1) the working surface of the stamp touches the substrate place, or
B2) the working surface of the stamp is located at a predetermined height above the substrate place, or
B3) the working surface of the stamp touches the substrate place, and raising the stamp to a predetermined height above the
substrate place,

wherein the height mentioned in B2 and B3 is set in such a manner that the working surface of the stamp is wetted with solder
in the later following step D,

C) dispensing flux-free solder to the substrate place by:
C1) advancing the solder wire until the solder wire touches the substrate place, in such a manner that the tip of the solder
wire touches the substrate place within the recess of the stamp without the solder wire touching the stamp,

C2) further advancing of solder wire, in order to melt a predetermined quantity of solder due to the contact with the substrate,
and

C3) retracting the solder wire,
D) moving the dispenser head along a predetermined path in order to distribute the solder on the substrate place, and simultaneously
applying ultrasound to the stamp, and

E) raising the stamp, wherein
step D is carried out either after step C3 or already begins during step C2.

US Pat. No. 9,889,516

DEVICE FOR DISPENSING AND DISTRIBUTING FLUX-FREE SOLDER ON A SUBSTRATE

Besi Switzerland AG, Cha...

1. An apparatus comprising:
a writing head which is movable in three spatial directions, the writing head configured to receive a device configured to
dispense and distribute flux-free solder on a substrate, the device configured to dispense and distribute flux-free solder
comprising

an elongated tool with a tip with an opening and with a longitudinal borehole which opens into the opening of the tip of the
tool,

a tool mount with a longitudinal borehole which is provided with an annular extension,
an ultrasonic generator with a longitudinal borehole, and
a wire guide tube that bears radially in said extension,wherein
the ultrasonic generator is fixed to the tool mount and configured to generate ultrasonic waves,
the tool mount is formed as an oscillating body transmitting the ultrasonic waves generated by the ultrasonic generator to
the tool,

the tool mount is configured to fix the tool, the longitudinal boreholes of the tool mount,
the ultrasonic generator and the tool are in alignment with each other, and
the wire guide tube extends through the longitudinal boreholes of the ultrasonic generator and the tool mount, protrudes into
the longitudinal borehole of the tool up to a position above the tip of the tool and does not touch the tool.

US Pat. No. 9,721,819

METHOD FOR MOUNTING SEMICONDUCTORS PROVIDED WITH BUMPS ON SUBSTRATE LOCATIONS OF A SUBSTRATE

BESI SWITZERLAND AG, Cha...

1. A method for mounting semiconductor chips provided with bumps on substrate locations of a substrate, in which in a calibration
phase first and second geometry data are determined and in a mounting phase the following steps are carried out for each semiconductor
chip:
either: with a wafer table providing the semiconductor chip at a predetermined location;
with a pickup head of a flip apparatus removing the provided semiconductor chip and twisting the semiconductor chip by 180°
in order to provide the semiconductor chip as a flip chip;

or: with a feeding device providing the semiconductor chip as a flip chip;
with a transport head receiving the flip chip from the pickup head or the feeding device;
filling a cavity, which is arranged in a plate and formed with a transparent base, with fluxing agent, wherein the plate is
either arranged in a stationary manner or is moved after the filling of the cavity so that the cavity is situated in both
cases above a first camera, which is arranged in a stationary manner;

depositing the flip chip in the cavity, wherein the bumps face the base of the cavity;
recording an image of the flip chip with the first camera and determining an actual position of the flip chip with respect
to a machine coordinate system of a bonding head on the basis of the image and the first geometry data;

removing the flip chip from the cavity with the bonding head;
determining an actual position of the substrate location with respect to the machine coordinate system of the bonding head
by means of a second camera which is fastened to the bonding head, either by:

moving the bonding head to a position above the substrate location in which the substrate location is in the field of vision
of the second camera,

recording at least one image with the second camera, and
calculating the actual position of the substrate location on the basis of the position of the substrate location in the at
least one image and the second geometry data;

or by:
calculating the actual position of the substrate location by means of actual positions of at least two substrate markings,
wherein the actual position of each of the at least two substrate markings is determined after the feeding of a new substrate
to the support by:

moving the bonding head to a position above the substrate in which the substrate marking is in the field of vision of the
second camera,

recording an image with the second camera, and
determining the actual position of the substrate marking by means of the image and the second geometry data; and
calculating the position to be accessed by the bonding head on the basis of the determined actual position of the flip chip
and the determined actual position of the substrate location; and

moving the bonding head to the calculated position and placing the flip chip on the substrate location, wherein
the transport head and the bonding head are at least partly simultaneously in motion.

US Pat. No. 9,364,953

KINEMATIC HOLDING SYSTEM FOR A PLACEMENT HEAD OF A PLACEMENT APPARATUS

Besi Switzerland AG, Cha...

1. Kinematic holding system for a placement head of a placement apparatus for mounting electronic or optical components on
a substrate, comprising:
a placement head guide device comprising a placement head support for holding the placement head; and
a placement head alignment device for adjusting the alignment of the placement head relative to the placement head support,
wherein the placement head alignment device comprises a joint via which the placement head is supported in an inclination-adjustable
way on the placement head support, and wherein the placement head alignment device comprises at least one length-variable
holding member which is arranged at a distance from the joint between the placement head support and the placement head and
which determines a pivoting position of the placement head relative to the placement head support and whose length is changeable
during the placement operation depending on a deformation of the placement head guide device caused by a pressing force of
the placement head against the substrate in such a way that an axis error of the placement head caused by the deformation
of the placement head guide device is compensated.

US Pat. No. 9,666,460

THROUGH TYPE FURNACE FOR SUBSTRATES COMPRISING A LONGITUDINAL SLIT

Besi Switzerland AG, Cha...

1. A through-type furnace for substrates, comprising:
a furnace with a channel and
a transport system for transporting substrates through the channel,
wherein the furnace comprises one or more heating zones and one or more cooling zones,
the channel is bounded by a base, a front side wall, a rear side wall and a top part,
the base contains a plurality of first holes which are connectable to a protective gas source in order to supply protective
gas during operation,

the front side wall of the channel comprises a longitudinal slit which extends parallel to a passage direction and is bounded
by a bottom edge and an upper edge, and extends through the one or more heating zones and the one or more cooling zones,

the transport system comprises at least one clamp for transporting the substrates through the channel and the longitudinal
slit, and

the clamp is movable back and forth along the longitudinal slit of the channel and clamps the substrates outside the furnace.

US Pat. No. 9,233,389

DEVICE FOR DISPENSING ADHESIVE ON A SUBSTRATE

Besi Switzerland AG, Cha...

1. A device for dispensing adhesive on a substrate, comprising:
a writing head movable in three spatial directions, the three spatial directions including two directions extending parallel
to a surface of the substrate and one direction extending substantially perpendicularly to the surface of the substrate, the
writing head configured to receive a first dispensing nozzle and at least one second dispensing nozzle each having a tip so
that the tip of the first dispensing nozzle is fixed and the tip of the at least one second dispensing nozzle is movable substantially
in the direction extending substantially perpendicularly to the surface of the substrate, and an actuator with a pin, the
pin configured to be fixed in one of a retracted state wherein the pin is retracted and an extended state wherein the pin
is extended, wherein the device is configured to be operated in a first operating mode and a second operating mode and is
configured to perform the following steps when changing between the first operating mode and the second operating mode:

lifting the writing head,
changing the state of the pin between the retracted state and the extended state, and
lowering the writing head to a predetermined working altitude, wherein the tips of the dispensing nozzles reach a substantially
similar altitude above the substrate when the pin is in the retracted state, and wherein the tip of the at least one second
dispensing nozzle reaches a higher altitude above the substrate than the tip of the first dispensing nozzle when the pin is
in the extended state.

US Pat. No. 9,956,692

KINEMATIC HOLDING SYSTEM FOR A PLACEMENT HEAD OF A PLACEMENT APPARATUS

Besi Switzerland AG, Cha...

1. Kinematic holding system for a placement head of a placement apparatus for mounting electronic or optical components on a substrate, comprising:a placement head guide device which comprises a placement head support for holding the placement head; and
a placement head alignment device for adjusting an alignment of the placement head relative to the placement head support, wherein:
the placement head alignment device comprises a solid joint via which the placement head is supported in an inclination-adjustable way on the placement head support,
the solid joint comprises at least one solid joint element with at least one first solid joint arm which is rigidly connected to the placement head support, and at least one second solid joint arm which is rigidly connected to the placement head and elastically connected to the at least one first solid joint arm,
the at least one second solid joint arm is elastically deformable in relation to the at least one first solid joint arm depending on a deformation of the placement head guide device caused by a pressing force of the placement head against the substrate in such a way that an axis error of the placement head caused by the deformation of the placement head guide device is compensated.

US Pat. No. 10,629,465

METHOD FOR CALIBRATING A COMPONENT MOUNTING APPARATUS

BESI Switzerland AG, Ste...

1. A method for calibrating a component mounting apparatus, the component mounting apparatus comprising a bonding station and at least one bond head for placing components on mounting places of a substrate, a first camera and a second camera, wherein the mounting of the components on the mounting places of the substrate comprises the following steps:transporting the substrate to the bonding station and fixing the substrate;
determining global substrate position data characterizing the position and orientation of the substrate; and
mounting one component after the other on one mounting place of the substrate after the other with the following steps:
with the at least one bonding head picking up a component from a feed unit;
with the first camera taking an image of the component held by the bond head and determining the deviation of the actual position of the component from its target position,
calculating the actual position of the mounting place based on the global substrate position data;
calculating a correction vector to be used for the mounting place based on selected calibration data;
calculating the position to be approached by the bond head; and
moving the bond head to the calculated position and placing the component on the substrate;and wherein the calibration includes determining calibration data with the following steps:positioning a calibration plate in a holder of the bonding station and/or fixing a calibration plate to a holder of the bonding station, the calibration plate having a plurality of calibration positions distributed two-dimensionally over the calibration plate and provided with first optical markings;
executing the following steps for a number of calibration positions:
with the bond head picking up a test chip provided with second optical markings,
with the first camera taking an image of the test chip held by the bond head and determining a deviation of the actual position of the test chip from its target position,
calculating the position to be approached by the bond head for the placement of the test chip on the calibration position,
moving the bond head to the calculated position and placing the test chip on the calibration plate,
with the second camera taking an image of the test chip placed on the calibration plate,
determining a difference vector which describes a deviation of the actual position of the test chip from its target position;
assigning correction data based on at least one difference vector to the calibration position, wherein the calibration data comprise the calibration positions used and the correction data assigned thereto.

US Pat. No. 10,288,413

APPARATUS FOR MOUNTING COMPONENTS ON A SUBSTRATE

Besi Switzerland AG, (CH...

1. An apparatus for mounting components on a substrate, comprisinga support for the substrate, wherein a surface of the support defines a substrate plane,
a pick and place system with a bonding head, wherein the pick and place system is set up to take up a component with the bonding head at a take-up location and to place said component on a substrate location,
a camera for detecting a position of the component held by the bonding head and for detecting a position of the substrate location on which the component is to be mounted,
a first optical deflection system, and
a second optical deflection system,whereinthe camera has an optical axis,
the pick and place system comprises a displaceable carriage on which the first optical deflection system, the camera and the bonding head are fastened,
the second optical deflection system is arranged in a stationary manner on the apparatus, the first optical deflection system and the camera form a first image detection system for recording an image of the substrate location, wherein an object-side optical axis of the first image detection system extends at a distance from a gripping axis of the bonding head which is smaller than a distance between the gripping axis of the bonding head and the optical axis of the camera,
the first optical deflection system, the second optical deflection system and the camera form a second image detection system for recording an image of a bottom side of the component, and
the apparatus is programmed, for the recording of an image of the component, to move the carriage during the transport of the component from the take-up location to the substrate location at a predetermined height H1 above the substrate plane over the second optical deflection system, so that the bottom side of the component, during the travel over the second optical deflection system, is located in a focal plane of the camera, and
for the recording of an image of the substrate location to lift the carriage to a predetermined height H2 above the substrate plane, so that the substrate location is located in the focal plane of the camera, wherein the two heights H1 and H2 are dimensioned in such a way that the optical length of the beam path between the bottom side of the component and the camera and the optical length of the beam path between the substrate location and the camera are equally large.

US Pat. No. 10,973,158

APPARATUS AND METHOD FOR MOUNTING COMPONENTS ON A SUBSTRATE

BESI SWITZERLAND AG, Cha...

1. A method for mounting components on a substrate by means of a mounting apparatus which includes a first drive system configured to move a carrier and a second drive system configured to move a bond head with a component gripper, at least one substrate camera and at least one component camera or at least one optical deflection system which, together with the at least one substrate camera, forms the at least one component camera, and a drive attached to the bond head and configured to rotate the component gripper about an axis or a rotary drive configured to rotate the substrate about an axis, wherein the second drive system and the substrate camera(s) are attached to the carrier and the bond head or the component gripper contains at least one reference mark, the method comprising the following steps:A) with the component gripper picking up a component from a feeding unit,
B) with the first drive system moving the carrier to the component camera or the component cameras, so that the reference mark or the reference marks and the component are in the field of vision of the component camera or in the fields of vision of the component cameras,
C) take one or more images with the component camera or the component cameras,
D) determining a first correction vector describing a deviation of the actual position of the component from its set position with respect to the reference mark(s) on the basis of the image(s) taken in the previous step,
E) from the first correction vector calculating a first correction movement,
F) with the first drive system moving the carrier to a position above a substrate place of the substrate,
G) lowering the carrier to a height above the substrate at which an underside of the component held by the component gripper is at a predetermined distance above the substrate place, wherein the distance is dimensioned such that the reference mark(s) and at least one substrate mark arranged on the substrate lie in the depth of field of the substrate camera(s),
H) with the second drive system moving the bond head to a stand-by position,
I) with the substrate camera(s) taking a first image, wherein the field of view of the substrate camera or each of the fields of view of the substrate cameras contains at least one of the substrate marks,
J) with the second drive system moving the bond head to a nominal working position in which the field of view of the substrate camera or each of the fields of view of the substrate cameras contains at least one reference mark,
K) with the substrate camera(s) taking a second image,
L) determining a second correction vector describing a deviation of the actual position of the substrate place from its set position with respect to the reference mark or the reference marks, respectively, using the first and second image or the first and second images taken with the substrate camera(s),
M) from the second correction vector calculating a second correction movement,
N) executing the first and second correction movement by means of the second drive system or a third drive system enabling correction movements of the substrate and by means of the drive configured to rotate the component gripper or the rotary drive configured to rotate the substrate, and
O) lowering the carrier and/or the bond head and/or the component gripper and place the component on the substrate place.