US Pat. No. 9,327,299

APPARATUS AND METHOD FOR COATING SUBSTRATE

BENEQ OY, Vantaa (FI)

1. An apparatus for producing a liquid film from one or more liquid precursors onto a surface of a substrate in order to establish
a coating, said apparatus being arranged to direct an aerosol flow onto the surface of the substrate, the apparatus comprising:
an atomizing chamber into which the one or more liquid precursors are atomized;
one or more atomizers adapted to atomize one or more liquid precursors for forming the aerosol flow, the one or more atomizers
being arranged to the atomizing chamber for forming the aerosol flow into the atomizing chamber; and

a coating chamber in which the aerosol flow is deposited onto the surface of the substrate,
wherein the apparatus further comprises a homogenizing nozzle designed to homogenize the aerosol flow substantially in a direction
of the surface of the substrate prior to passing the aerosol flow into the coating chamber,

the homogenizing nozzle comprising an inlet opening for receiving the aerosol flow from the atomizing chamber and an outlet
opening for passing the aerosol flow to the coating chamber,

the homogenizing nozzle being arranged between the atomizing chamber and the coating chamber for passing the aerosol flow
from the atomizing chamber to the coating chamber, and

the homogenizing nozzle being an elongated channel arranged to extend parallel to the surface of the substrate from the inlet
opening to the outlet opening of the homogenizing nozzle, wherein the elongated channel extends an entire length from the
inlet opening to the outlet opening.

US Pat. No. 10,111,300

DISPLAY DEVICE AND A METHOD FOR MANUFACTURING SUCH DEVICE

BENEQ OY, Espoo (FI)

1. A transparent thin film electroluminescent display comprising a substrate, an active layer capable of emitting an emission spectrum of light in a wavelength range of visible light, and a viewing side surface, a narrowband reflector, said narrowband reflector and the viewing side surface being on opposite sides of the active layer, said narrowband reflector reflecting part of an ambient light entering the display through a backside surface, wherein the narrowband reflector comprises at least one layer of high-reflective index material, and at least one layer of low refractive index material.

US Pat. No. 9,683,291

APPARATUS FOR PROCESSING SURFACE OF SUBSTRATE AND NOZZLE HEAD

BENEQ OY, Espoo (FI)

14. A nozzle head for processing a surface of a substrate, the nozzle head having an output face comprising at least one first
precursor nozzle and at least one second precursor nozzle for subjecting the surface of the substrate successively to the
first and second precursor,
wherein the nozzle head further comprises nozzle head positioning mechanism provided with nozzle head support elements extending
from the nozzle head and from the level of the output face arranged to support the nozzle head in contact against a nozzle
head support surface and to move against the nozzle head support surface for providing a predetermined gap between the output
face and the nozzle head support surface.

US Pat. No. 9,393,580

SURFACE TREATMENT DEVICE AND METHOD

BENEQ OY, Vantaa (FI)

1. A surface treatment device that comprises:
a nozzle for ejecting a primary stream of combustible substance to a gaseous atmosphere in an ejection direction;
means for igniting the primary stream; and
an impermeable shield providing a planar surface that is substantially opposite to the ejection direction and has in front
of the nozzle a hole that allows passage of the primary stream; wherein

the impermeable shield is dimensioned to allow simultaneous passage of the primary stream ejected from the nozzle and a circumferential
secondary stream of gas from the ambient gaseous atmosphere via the hole, and

the impermeable shield is positioned between the nozzle and a point of ignition of the primary stream.

US Pat. No. 9,290,840

METHOD FOR FORMING AN ELECTRICALLY CONDUCTIVE OXIDE FILM, AN ELECTRICALLY CONDUCTIVE OXIDE FILM, AND USES FOR THE SAME

Beneq Oy, Vantaa (FI)

1. A method for forming an electrically conductive oxide film on a substrate, the method comprising the steps of:
(1) bringing the substrate into a reaction space, and
(2) applying a plurality of deposition cycles, each deposition cycle comprising the alternating steps of:
(i) forming a preliminary deposit on a deposition surface of the substrate by depositing a transition metal oxide on the deposition
surface and purging the reaction space, the preliminary deposit being less than one full monolayer on the deposition surface;

(ii) treating the deposition surface with an organometallic chemical comprising a first metal such that at least a portion
of the organometallic chemical reacts with at least part of the preliminary deposit, thereby forming an oxide comprising oxygen,
the first metal, and the transition metal, and purging the reaction space,

(3) repeating step (2) until a film of oxide comprising oxygen, the first metal, and the transition metal is obtained, wherein
the film comprises oxygen in the range of 40 to 80 atomic percent.

US Pat. No. 9,394,610

SOURCE AND ARRANGEMENT FOR PROCESSING A SUBSTRATE

BENEQ OY, Vantaa (FI)

1. A source for feeding one or more gaseous precursors onto a surface of a substrate in order to process the substrate by
way of subjecting the surface of the substrate being processed to alternately repetitive surface reactions of the precursors,
said source comprising
a gas feed member for feeding at least one or more precursors onto the surface of the substrate, said gas feed member being
adapted rotatable about a first rotation axis and said gas feed member being adapted to feed one or more precursors in a direction
substantially transversal to said first rotation axis, wherein

in said gas feed member is a cylindrical part comprising one or more elongated gas feed channels extending in the direction
of said first rotation axis for feeding one or more precursors in a direction substantially transversal to said first rotation
axis, and

said source comprises one or more casings provided around the gas feed member for feeding or exhausting a gas, said one or
more casing comprising a flow opening extending in the direction of the rotation axis for supplying gases to the surface of
the substrate.

US Pat. No. 9,226,362

TRANSPARENT INORGANIC THIN-FILM ELECTROLUMINESCENT DISPLAY ELEMENT AND METHOD FOR MANUFACTURING IT

Beneq Oy, Espoo (FI)

1. An inorganic, transparent thin film electroluminescent display element with a display area having at least one emissive
area and at least one non-emissive area, the display element comprising a layer structure on a substrate, said layer structure
comprising
a first conducting layer comprising transparent conductive material, having a thickness in the range 30-250 nm,
a first insulating layer comprising insulating, inorganic material,
a luminescent layer comprising zinc sulfide, having a thickness in the range 30-250 nm,
a second insulating layer comprising insulating, inorganic material,
a second conducting layer comprising transparent conductive material, having a thickness in the range 30-250 nm,
a third insulating layer comprising insulating, inorganic material having a lower refractive index than that of the second
conducting layer,
characterized in that each of said first and second conducting layers comprises at least one conductor element at the at least
one emissive area and at least one passive film element at the at least one non-emissive area.

US Pat. No. 9,803,281

NOZZLE HEAD AND APPARATUS

BENEQ Oy, Vantaa (FI)

1. A nozzle head configured to subject a surface of a substrate to successive surface reactions of at least a first precursor
and a second precursor, the nozzle head comprising:
an output face;
one or more first precursor nozzles for subjecting the surface of the substrate to the first precursor;
one or more second precursor nozzles for subjecting the surface of the substrate to the second precursor;
one or more purge gas channels arranged between the first and second precursor channels for subjecting the surface of the
substrate to a purge gas, the one or more purge gas channels separating the first and second precursor nozzles;

one or more discharge ports provided to the first and second precursor nozzles for exhausting precursors; and
a purge gas container having a gas atmosphere inside, the purge gas container being arranged around the nozzle head, wherein:
the one or more purge gas channels are arranged in passive fluid connection with a gas atmosphere surrounding the nozzle head
and including purge gas,

the first precursor nozzle is arranged to supply only the first precursor, the second precursor nozzle is arranged to supply
only the second precursor, and the purge gas channel is arranged in passive fluid connection to the gas atmosphere of the
purge gas container through conduits extending from the purge gas container to the purge gas channel for allowing purge gas
to flow from the purge gas atmosphere to the output face through the purge gas channel such that the purge gas channel separates
the first and second precursors,

the purge gas channel is arranged to extend from the output face through the nozzle head,
the first precursor nozzle includes a first open portion open to the output face,
the second precursor nozzle includes a second open portion open to the output face, and
the first open portion of the first precursor nozzle, the second open portion of the second precursor nozzle and the outlet
of the purge gas channel are arranged on the same plane on the output face.

US Pat. No. 9,726,372

BURNER NOZZLE, BURNER AND A SURFACE TREATMENT DEVICE

BENEQ OY, Vantaa (FI)

1. A burner nozzle (100) that comprises:
a nozzle body (102) that includes a slit (106), a line passage (104) to the slit opening in an outlet face surface (150);

a plurality of channels (112,114) connected to the slit (106), characterized in that

a group of first channels (112) is connected to a source of oxidizing substance (120), and a group of second channels (114) is connected to a fuel source (122);

each of the first channels (112) and second channels (114) have a circumferential passage (110) to the slit at a non-zero distance from the outlet face surface (150);

each of the first channels (112) and second channels (114) is formed to output a directed tubular flow towards a side wall of the slit (106), or towards one or more circumferential passages (110) in a side wall of the slit (106).

US Pat. No. 9,783,887

APPARATUS AND METHOD

BENEQ OY, Vantaa (FI)

1. A method for processing a surface of a substrate by exposing the surface of the substrate to alternating surface reactions
of at least a first starting material and a second starting material according to principles of atomic layer deposition method,
wherein the method includes:
arranging a deposition chamber having a space and positioning a source inside the space of the deposition chamber,
feeding on the surface of the substrate locally inside the deposition chamber a first starting material by means of a source
by moving the source inside the deposition chamber on the surface of the substrate, and

exposing the surface of the substrate processed with the first starting material to a second starting material by feeding
the second starting material independently of the movement of the source to be introduced to the space of the deposition chamber
such that the second starting material surrounds the source inside the deposition chamber.

US Pat. No. 9,708,710

ATOMIC LAYER DEPOSITION METHOD FOR COATING A SUBSTRATE SURFACE USING SUCCESSIVE SURFACE REACTIONS WITH MULTIPLE PRECURSORS

BENEQ OY, Espoo (FI)

1. A method for providing one or more coating layers on a surface of a substrate by successive surface reactions of at least
a first precursor and a second precursor according to the principles of atomic layer deposition, comprising:
supplying the first precursor from at least one first precursor nozzle and the second precursor from at least one second precursor
nozzle to the surface of the substrate;

moving the substrate relative to at least one of the first precursor nozzle and the second precursor nozzle for subjecting
the surface of the substrate to successive surface reactions of at least the first precursor and the second precursor;

subjecting one or more first limited sub-areas of the surface of the substrate to both the first precursor and the second
precursor and one or more second sub-areas of the surface of the substrate to only one precursor or to no precursors by co-operation
of supplying the first precursor and the second precursor and simultaneously moving the substrate relative to at least one
of the first precursor nozzle and the second precursor nozzle for providing one or more coating layers on the first limited
sub-areas of the surface of the substrate and leaving the second limited sub-areas without coating layers; and

moving the substrate relative to at least one of the first precursor nozzle and the second precursor nozzle such that the
movements of the first precursor nozzle and the second precursor nozzle over the surface of the substrate are overlapped only
on the first limited sub-areas over the surface of the substrate for providing one or more coating layers on the first limited
sub-areas.

US Pat. No. 10,023,957

APPARATUS AND METHOD FOR PROCESSING SUBSTRATE

BENEQ OY, Espoo (FI)

1. An apparatus for processing a surface of a substrate by subjecting the surface of a substrate to successive surface reactions of at least a first precursor and a second precursor, the apparatus comprising:a transport cylinder for transporting the substrate along at least part of the outer surface of the transport cylinder;
at least one nozzle head in fluid communication with the transport cylinder, an inner surface of at least one nozzle head having two or more precursor nozzles for subjecting the surface of the substrate to at least the first and second precursors, the nozzle head is provided as an oscillating mass; and
a moving mechanism for moving the oscillating mass in a circular oscillating movement between a first extreme position and a second extreme position via a centre position, the moving mechanism being arranged to move the nozzle head provided as the oscillating mass in circular oscillating movement around an oscillation axis between the first extreme position and the second extreme position,
wherein the moving mechanism comprises:
first driving means and second driving means to mechanically communicating with the nozzle head provided as the oscillating mass and arranged to control in co-operation the circular oscillating movement around the oscillation axis between the first and second extreme positions,
a transmission means arranged between the first and second driving means, with the transmission means frictionally engaging the outer surface of the nozzle head, and
a rod connected to the nozzle head provided as the oscillating mass for moving the nozzle head by oscillating movement using the first and second driving means,
wherein the first driving means is arranged to accelerate the nozzle head towards the first extreme position and decelerate the nozzle head towards the second extreme position with the transmission means, and the second driving means is arranged to accelerate the nozzle head towards the second extreme position and decelerate the nozzle head towards the first extreme position with the transmission means for controlling the frequency of the circular oscillating movement.

US Pat. No. 9,909,212

APPARATUS FOR PROCESSING SUBSTRATE SURFACE

BENEQ OY, Vantaa (FI)

1. An apparatus for processing a surface of a substrate by subjecting the surface of a substrate to successive surface reactions
of at least a first precursor and a second precursor, the apparatus comprising:
at least one nozzle head having two or more precursor zones for subjecting the surface of the substrate to at least the first
and second precursors;

a transport cylinder for transporting the substrate; and
a moving mechanism for moving the nozzle head in relation to the transport cylinder in oscillating movement between a first
end position and a second end position around a central axis of the transport cylinder,

wherein the nozzle head is arranged in connection with the transport cylinder such that an output face of the nozzle head
is formed to conform to a transport surface of the transport cylinder

wherein the moving mechanism is arranged to move the nozzle head in oscillating movement between the first and second end
positions around the central axis of the transport cylinder and to store at least part of the kinetic energy of the nozzle
head released in the oscillating movement of the nozzle head,

wherein the moving mechanism comprises a pendulum that swings the nozzle head in the oscillating movement between the first
and second end positions, and

wherein the pendulum is arranged to store at least part of the kinetic energy of the nozzle head into gravitational potential
energy at the first and second end positions of the oscillating movement of the nozzle head.

US Pat. No. 9,892,814

METHOD FOR FORMING AN ELECTRICALLY CONDUCTIVE OXIDE FILM, AN ELECTRICALLY CONDUCTIVE OXIDE FILM, AND USES FOR THE SAME

Beneq Oy, Vantaa (FI)

1. An electrically conductive oxide film comprising oxygen, first metal, and transition metal, wherein the film is formed
by a plurality of deposition cycles, each deposition cycle including forming a preliminary deposit of a transition metal oxide
on a deposition surface of a substrate in a reaction space and subsequently purging the reaction space, and treating the deposition
surface with an organometallic chemical comprising a first metal such that at least a portion of the organometallic chemical
reacts with at least part of the preliminary deposit and subsequently purging the reaction space, to form an oxide comprising
the oxygen, the first metal, and the transition metal; the formed preliminary deposit of the transition metal oxide being
less than one full monolayer in a single deposition cycle, the steps of forming the preliminary deposit and treating the deposition
surface being alternately repeated such that the film of electrically conductive oxide is formed on the substrate, wherein
the film comprises oxygen in the rage of 40 to 80 atomic percent, and wherein forming the preliminary deposit of transition
metal oxide comprises steps of:
a) exposing the deposition surface of the substrate in the reaction space to an oxygen-containing chemical such that at least
a portion of the oxygen containing chemical gets adsorbed onto the deposition surface, and subsequently purging the reaction
space; and

b) exposing the deposition surface of the substrate in the reaction space to a transition metal chemical such that at least
a portion of the transition metal chemical gets adsorbed onto the deposition surface, and subsequently purging the reaction
space;

and the treating the deposition surface with an organometallic chemical comprises
c) exposing the deposition surface of the substrate in the reaction space to the organometallic chemical such that at least
a portion of the organometallic chemical gets adsorbed onto the deposition surface, and subsequently purging the reaction
space, and wherein

the steps a), b), and c) are carried out in the order, first a), then b), then c), then b), and this sequence is repeated
one or more times to increase the thickness of the film, or the steps a), b), and c) are carried out in the order, first a)
and then b), this sequence is repeated one or more times, after which the step c) is carried out, and

wherein the transition metal chemical is a transition metal chloride selected from the group of titanium trichloride, titanium
tetrachloride, zirconium tetrachloride, hafnium tetrachloride, niobium pentachloride, tantalum pentachloride, molybdenum pentachloride,
and tungsten hexachloride.

US Pat. No. 9,987,642

APPARATUS AND METHOD FOR PRODUCING AEROSOL AND A FOCUSING PART

BENEQ OY, Espoo (FI)

15. A focusing part for an atomizer, which said atomizer comprises an atomizing head for producing an atomized aerosol jet from one or more liquid precursors, wherein the focusing part:is a tube formed of a choked flow part in which one or more flow restraints project from the inner surface of the tubular focusing part to change the hydrodynamic properties of the atomized aerosol jet discharged from the atomizing head into the choked flow part in a manner that reduces the average drop size of the aerosol jet, and a levelling part without projecting flow restraints on the inner surface of the tubular focusing part, wherein said levelling part has a length of at least ten times the inner diameter of the focusing part in the levelling part,
is arranged to extend directly from the atomizing head and is arranged to restrain the atomized aerosol jet for providing a punctual aerosol jet,
comprises a discharge opening for discharging the punctual aerosol jet.

US Pat. No. 10,167,551

APPARATUS, METHOD AND REACTION CHAMBER

BENEQ OY, Espoo (FI)

1. A reaction chamber for receiving one or more substrates to be processed by subjecting at least part of the substrates to successive surface reactions of at least a first precursor and a second precursor, the reaction chamber being configured to be a detachable reaction chamber and comprising:a chamber body forming a reaction space inside the reaction chamber;
a loading door provided to the chamber body for loading and unloading the one or more substrates into and from the reaction chamber;
precursor connections attached to the reaction chamber for providing a fluid connection between the reaction space of the reaction chamber and precursor system connections of a precursor system by supplying and discharging the at least first and second precursor to and from the reaction space of the reaction chamber, the precursor connections are arranged to be connected to the precursor system connections of the precursor system;
couplings provided to the precursor connections for connecting the reaction chamber in fluid connection with the precursor system; and
gas valves for closing the precursor connections in a gastight manner, wherein:
the precursor connections are provided with the gas valves arranged to hermetically seal the precursor connections and the reaction space inside the reaction chamber when the precursor connections are detached from the precursor system connections and the reaction chamber is detached from the precursor system;
the loading door comprises one or more sealing elements arranged to seal the loading door and the reaction space inside the reaction chamber hermetically in a closed position of the loading door when the reaction chamber is in the detached state, and
the precursor connections being attached to the reaction chamber and the gas valves being attached to the precursor connections when the precursor connections are detached from the precursor system connections and the reaction chamber is detached from the precursor system,
the gas valves remain coupled to the reaction chamber through the precursor connections when the reaction chamber is detached from the precursor system.

US Pat. No. 10,214,813

APPARATUS AND METHOD FOR PROVIDING A COATING TO A SURFACE OF A SUBSTRATE

BENEQ OY, Espoo (FI)

1. An apparatus for providing a coating to a surface of a substrate, the apparatus comprising:at least one ALD-coating unit in which the surface of the substrate is subjected to successive surface reactions of at least a first precursor and a second precursor according to principles of atomic layer deposition for coating the surface of the substrate;
a first reel for unwinding the substrate to be coated;
a second reel for rewinding the coated substrate;
one or more primary support structures provided on the same side of the substrate as the surface to be coated or the coated surface for forming a substrate transport path from the first reel through the at least one primary support structure to the second reel;
an interleave web in connection with each of the one or more primary support structures, said interleave web is arranged to protect the surface to be coated or the coated surface when the substrate is passing through the one or more primary support structures, said interleave web is arranged to move together with the substrate along at least part of the substrate transport path, the interleave web is arranged between each of the one or more primary support structures and the surface to be coated or the coated surface such that the surface to be coated or the coated surface is arranged to contact only with the interleave web along the substrate transport path from the first reel to the second reel; and
one or more primary interleave unwinding reels comprising the interleave web for unwinding the interleave web, said one or more primary interleave unwinding reels is arranged such that the interleave web is brought together with the substrate supplied from the first reel before or at the first primary support structure in which the interleave web is arranged between the surface to be coated and the primary support structure.

US Pat. No. 10,273,579

APPARATUS FOR PROCESSING TWO OR MORE SUBSTRATES IN A BATCH PROCESS

Beneq Oy, Espoo (FI)

1. An apparatus for processing two or more substrates in a batch process by subjecting at least part of a surface of the substrates to alternating surface reactions of at least a first and a second precursor, the apparatus comprising:a vacuum chamber defining a vacuum space,
a reaction chamber arranged inside the vacuum chamber, the reaction chamber comprising a reaction space, the reaction chamber being configured for depositing material on the surface of the substrates in the reaction space during a processing phase,
multiple substrate holders for supporting said substrates, wherein the substrate holders being installed or arranged to be installed inside the reaction chamber for processing of the substrates inside the reaction chamber during the processing phase the substrate holders are arranged on a substrate rack comprising a bottom plate and provided with a lifting means for lifting the substrate rack inside the reaction chamber, and
an actuator enabling a relative movement of one or more substrate holders in relation to each other,
wherein during a loading phase in which the substrates are loaded to the substrate holders by a loading device, at least some of the substrate holders are arranged to be vertically movable relative to each other while the substrate holders remain on the substrate rack such that the actuator is arranged to hold in place the substrate holders that are loaded and the lifting means is arranged to move the substrate holders that are unloaded away from the substrate holders that are loaded for providing space between the substrate holder being loaded and the substrate holder above it, or the actuator is arranged to move the substrate holders that are loaded away from the substrate holders that are unloaded, and the lifting means is arranged to hold in place the substrate holders that are unloaded or to move the substrate holders that are unloaded away from the substrate holders that are loaded for providing space between the substrate holder being loaded and the substrate holder above it, for enabling relative movement of the substrate holders.

US Pat. No. 10,280,508

NOZZLE HEAD AND APPARATUS FOR COATING SUBSTRATE SURFACE

BENEQ OY, Espoo (FI)

12. An apparatus for a coating process in which coating layers are provided on a surface of a substrate by successive surface reactions of precursors according to the principles of atomic layer deposition, the apparatus comprising:a nozzle head having an output face provided with one or more first precursor zones provided to the output face comprising at least two precursor nozzles arranged to supply at least a first precursor and a second precursor to the surface of the substrate for providing a first coating layer on the surface of the substrate and one or more second precursor zones provided to the output face arranged to supply at least a third precursor and a fourth precursor to the surface of the substrate for simultaneously forming a second coating layer on the surface of the substrate, the second coating layer being a different material than the first coating layer;
a precursor supply system for dosing the at least first and second precursors and the at least third and fourth precursors to the nozzle head and the precursor nozzles; and
a moving system for moving the nozzle head relative to the substrate in a relative moving direction for subjecting the surface of the substrate to successive surface reactions of the at least first and second precursors and the at least third and fourth precursors,
the output face of the nozzle head having a width extending transversely to the relative moving direction of the nozzle head and the substrate and a length extending in the relative moving direction of the nozzle head and the substrate;
wherein the one or more first precursor zones and the one or more second precursor zones are arranged at different locations on the output face of the nozzle head in the direction of the width of the output face and at different locations on the output face of the nozzle head in the direction of the length of the output face.