US Pat. No. 9,807,868

METHOD FOR MAKING CONDUCTIVE POLYMER, AND COMPOSITE FILM AND CIRCUIT BOARD HAVING THE CONDUCTIVE POLYMER

Avary Holding (Shenzhen) ...

1. A method for making a conductive polymer comprising:
mixing liquid crystal monomers, a silver complex, an initiator, and a catalytic agent to form a mixture, the liquid crystal
monomers having a mass percentage of about 42.2% to about 52.2% of a total mass of the mixture, the silver complex having
a mass percentage of about 43.1% to about 53.1% of the total mass of the mixture, the initiator having a mass percentage of
about 0.85% to about 1.35% of the total mass of the mixture, and the catalytic agent having a mass percentage of about 2.85%
to about 4.35% of the total mass of the mixture;

adding a solvent into the mixture, the mixture and the solvent being in a ratio from 3:17 to 1:3 by weight; and
heating the mixture to undergo atom transfer radical polymerization.

US Pat. No. 9,807,877

METHOD FOR MAKING A MULTILAYER FLEXIBLE PRINTED CIRCUIT BOARD

HongQiSheng Precision Ele...

1. A method for making a multilayer flexible printed circuit board comprising:
providing an inner wiring substrate and at least one single-sided copper substrate, each single-sided copper substrate comprising
an adhesive plate;

defining at least one through hole in each single-sided copper substrate;
forming an intermediate product by attaching the adhesive plate of each single-sided copper substrate onto one surface of
the inner wiring substrate to expose the inner wiring substrate through the through hole, and heating and pressing the single-sided
copper substrate together to cause the adhesive of the adhesive plate to extend towards a center of the through hole along
a direction substantially perpendicular to a center axis of the electrically conductive hole to form a stepped portion;

covering each single-sided copper substrate of the intermediate product with a dry film, wherein the dry film is further formed
over exposed inner wiring substrate, and then pressing the dry film to cause the dry film to fill gaps formed by the exposed
inner wiring substrate; and

forming an outer wiring plate by etching each single-sided copper substrate of the intermediate product, and removing the
dry film to form the multilayer flexible printed circuit board.

US Pat. No. 9,832,888

CIRCUIT BOARD AND METHOD FOR MAKING THE SAME

Avary Holding (Shenzhen) ...

1. A method of manufacturing a circuit board, comprising:
providing a substrate with double-side copper layers, wherein the substrate comprises a base layer, a first copper layer and
a second copper layer, the first copper layer and the second copper layer are formed on opposite surfaces of the base layer;

opening a through hole on the substrate, wherein the through hole comprises a first hole and a second hole communicating with
the first hole, the first hole penetrates through the base layer and the second hole penetrates through the first copper layer;
forming a wire layer by copper plating, wherein the wire layer comprises a first portion filled in the through hole and a
second portion formed on the first portion extending in a direction facing away from the base layer, the wire layer is electrically
conductive between the first copper layer and the second copper layer through the first portion; wherein the manufacturing
method of forming the wire layer is further comprising the steps of:
applying a first photosensitive film and a second photosensitive film on the opposite surfaces of the substrate, the first
photosensitive film covers the first copper layer and the open end of the through hole, the second photosensitive film covers
the second copper layer;

forming a mask pattern on the first and second photosensitive films after exposing and developing the first and second photosensitive
films, the mask pattern comprises an opening which corresponds to the open end of the through hole, the aperture diameter
of the opening is less than the aperture diameter of the through hole;
forming a wire layer corresponding to the mask pattern by copper plating, the second portion is filled in the opening; and
removing the first and second photosensitive films; and
removing the first copper layer and the second copper layer which are not covered with the wire layer by using a quick etching
treatment so as to respectively form a first wire pattern layer and a second wire pattern layer, and the first portion which
is flush with the first copper layer and not cover with the second portion.

US Pat. No. 9,820,388

PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME

Avary Holding (Shenzhen) ...

1. A PCB comprising:
a base layer;
a wiring pattern formed on a surface of the base layer; and
a protecting layer formed on the wiring pattern by printing and solidifying an ink on the wiring pattern, the ink comprising
a cycloaliphatic epoxy resin, a phenoxyl resin solution, a solvent, a hardener, and an antifoaming agent, a mass percent of
the cycloaliphatic epoxy resin being in a range of 28%-34%, a mass percent of the phenoxyl resin solution being in a range
of 10%-20%, a mass percent of the solvent being in a range of 20%-39%, a mass percent of the hardener being in a range of
22%-26%, and a mass percent of the antifoaming agent being in a range of 0.5%-1%.

US Pat. No. 9,788,437

METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD WITH ETCHING PROCESS TO PARTIALLY REMOVE CONDUCTIVE LAYER

Avary Holding (Shenzhen) ...

1. A method of manufacturing a printed circuit board comprising: providing a substrate comprising a base layer and a first
copper foil layer formed on one side of the base layer; electroplating a first conductive layer on a portion of a surface
of the first copper foil layer away from the base layer; electroplating a first surface treatment patterned layer on a portion
of a surface of the first conductive layer away from the first copper foil layer, to leave other portion of the first conductive
layer and other portion of the first copper foil layer exposed from the first surface treatment patterned layer; and etching
to remove exposed portion of the first copper foil layer and to thin exposed portion of the first conductive layer.

US Pat. No. 9,860,977

TRANSPARENT FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

HongQiSheng Precision Ele...

1. A transparent flexible printed circuit board (FPCB) comprising:
an insulating resin layer comprising a first surface and a second surface facing away from the first surface;
at least one through hole defined in the insulating resin layer through the first surface and the second surface;
a first electrically conductive wiring layer formed on the first surface;
a second electrically conductive wiring layer formed on the second surface, the first electrically conductive wiring layer
and the second electrically conductive wiring layer made of electrically conductive resin, the first electrically conductive
wiring layer and the second electrically conductive wiring layer filling in each through hole to form an electrically conductive
portion, each of the first electrically conductive wiring layer and the second electrically conductive wiring layer has a
plurality of wiring openings; and

a cover film covering each of the first electrically conductive wiring layer and the second electrically conductive wiring
layer, and further filling in the plurality of wiring openings.