US Pat. No. 9,907,167

METHOD FOR MANUFACTURING A PRINTED CIRCUIT BOARD WITH HIGH-CAPACITY COPPER CIRCUIT

Avary Holding (Shenzhen) ...

1. A method for manufacturing a printed board with high-capacity copper circuit comprising:
providing a single side cladding copper substrate, and the single side cladding copper substrate comprising a supporting sheet
and a base copper foil on the supporting sheet;

forming a first conductive trace pattern on a surface a surface of the base copper foil;
forming a first protecting layer on the first conductive trace pattern, and the first protecting layer being filled in first
gaps between the first conductive trace pattern;

removing the supporting sheet;
forming a second conductive trace pattern on another surfaces of the base copper foil, the second conductive trace pattern
and the base copper foil together form a plurality of second gaps;

etching the base copper foil exposed by the second gaps to form a base conductive trace pattern, the base conductive trace
pattern comprising a plurality of third gaps; and

laminating a second protecting layer on the second conductive trace pattern, the second protecting layer being filled in the
plurality of second gaps and the plurality of third gaps.

US Pat. No. 9,807,877

METHOD FOR MAKING A MULTILAYER FLEXIBLE PRINTED CIRCUIT BOARD

HongQiSheng Precision Ele...

1. A method for making a multilayer flexible printed circuit board comprising:
providing an inner wiring substrate and at least one single-sided copper substrate, each single-sided copper substrate comprising
an adhesive plate;

defining at least one through hole in each single-sided copper substrate;
forming an intermediate product by attaching the adhesive plate of each single-sided copper substrate onto one surface of
the inner wiring substrate to expose the inner wiring substrate through the through hole, and heating and pressing the single-sided
copper substrate together to cause the adhesive of the adhesive plate to extend towards a center of the through hole along
a direction substantially perpendicular to a center axis of the electrically conductive hole to form a stepped portion;

covering each single-sided copper substrate of the intermediate product with a dry film, wherein the dry film is further formed
over exposed inner wiring substrate, and then pressing the dry film to cause the dry film to fill gaps formed by the exposed
inner wiring substrate; and

forming an outer wiring plate by etching each single-sided copper substrate of the intermediate product, and removing the
dry film to form the multilayer flexible printed circuit board.

US Pat. No. 9,807,868

METHOD FOR MAKING CONDUCTIVE POLYMER, AND COMPOSITE FILM AND CIRCUIT BOARD HAVING THE CONDUCTIVE POLYMER

Avary Holding (Shenzhen) ...

1. A method for making a conductive polymer comprising:
mixing liquid crystal monomers, a silver complex, an initiator, and a catalytic agent to form a mixture, the liquid crystal
monomers having a mass percentage of about 42.2% to about 52.2% of a total mass of the mixture, the silver complex having
a mass percentage of about 43.1% to about 53.1% of the total mass of the mixture, the initiator having a mass percentage of
about 0.85% to about 1.35% of the total mass of the mixture, and the catalytic agent having a mass percentage of about 2.85%
to about 4.35% of the total mass of the mixture;

adding a solvent into the mixture, the mixture and the solvent being in a ratio from 3:17 to 1:3 by weight; and
heating the mixture to undergo atom transfer radical polymerization.

US Pat. No. 9,820,388

PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME

Avary Holding (Shenzhen) ...

1. A PCB comprising:
a base layer;
a wiring pattern formed on a surface of the base layer; and
a protecting layer formed on the wiring pattern by printing and solidifying an ink on the wiring pattern, the ink comprising
a cycloaliphatic epoxy resin, a phenoxyl resin solution, a solvent, a hardener, and an antifoaming agent, a mass percent of
the cycloaliphatic epoxy resin being in a range of 28%-34%, a mass percent of the phenoxyl resin solution being in a range
of 10%-20%, a mass percent of the solvent being in a range of 20%-39%, a mass percent of the hardener being in a range of
22%-26%, and a mass percent of the antifoaming agent being in a range of 0.5%-1%.

US Pat. No. 9,832,888

CIRCUIT BOARD AND METHOD FOR MAKING THE SAME

Avary Holding (Shenzhen) ...

1. A method of manufacturing a circuit board, comprising:
providing a substrate with double-side copper layers, wherein the substrate comprises a base layer, a first copper layer and
a second copper layer, the first copper layer and the second copper layer are formed on opposite surfaces of the base layer;

opening a through hole on the substrate, wherein the through hole comprises a first hole and a second hole communicating with
the first hole, the first hole penetrates through the base layer and the second hole penetrates through the first copper layer;
forming a wire layer by copper plating, wherein the wire layer comprises a first portion filled in the through hole and a
second portion formed on the first portion extending in a direction facing away from the base layer, the wire layer is electrically
conductive between the first copper layer and the second copper layer through the first portion; wherein the manufacturing
method of forming the wire layer is further comprising the steps of:
applying a first photosensitive film and a second photosensitive film on the opposite surfaces of the substrate, the first
photosensitive film covers the first copper layer and the open end of the through hole, the second photosensitive film covers
the second copper layer;

forming a mask pattern on the first and second photosensitive films after exposing and developing the first and second photosensitive
films, the mask pattern comprises an opening which corresponds to the open end of the through hole, the aperture diameter
of the opening is less than the aperture diameter of the through hole;
forming a wire layer corresponding to the mask pattern by copper plating, the second portion is filled in the opening; and
removing the first and second photosensitive films; and
removing the first copper layer and the second copper layer which are not covered with the wire layer by using a quick etching
treatment so as to respectively form a first wire pattern layer and a second wire pattern layer, and the first portion which
is flush with the first copper layer and not cover with the second portion.

US Pat. No. 9,788,437

METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD WITH ETCHING PROCESS TO PARTIALLY REMOVE CONDUCTIVE LAYER

Avary Holding (Shenzhen) ...

1. A method of manufacturing a printed circuit board comprising: providing a substrate comprising a base layer and a first
copper foil layer formed on one side of the base layer; electroplating a first conductive layer on a portion of a surface
of the first copper foil layer away from the base layer; electroplating a first surface treatment patterned layer on a portion
of a surface of the first conductive layer away from the first copper foil layer, to leave other portion of the first conductive
layer and other portion of the first copper foil layer exposed from the first surface treatment patterned layer; and etching
to remove exposed portion of the first copper foil layer and to thin exposed portion of the first conductive layer.

US Pat. No. 9,872,393

METHOD FOR MAKING A CIRCUIT BOARD

Avary Holding (Shenzhen) ...

1. A method for making a circuit board comprising:
providing a supporting plate comprising a supporting portion and at least one first copper layer connected to at least one
surface of the supporting portion;

connecting at least one contact pad to a surface of each of the at least one first copper layer away from the supporting portion;
connecting at least one passive component to a surface of each of the at least one contact pad away from the first copper
layer;

forming a first resin layer on a portion of each of the at least one first copper layer besides the passive component;
disposing a core layer defining at least one through hole on a surface of each first resin layer away from the first copper
layer to allow the passive component to be received in the through hole, and disposing a second resin layer and a second copper
layer successively on each core layer and the passive component;

pressing the two second copper layer causing the supporting portion, the first copper layer, the contact pad, the passive
component, the first resin layer, the core layer, the second resin layer, and the second copper layer to be connected to each
other to form a first intermediate product, wherein the first resin layer and the second resin layer flows to fill gaps between
the first copper layer, the contact pad, the passive component, the core layer, and the second copper layer, thereby connecting
to each other to from a resin packing layer;

removing the supporting portion of the first intermediate product to form at least one second intermediate product;
defining a plurality of plating holes at a portion of the first copper layer and the second copper layer, and a corresponding
portion of the resin packing layer comprised in each of the at least one second intermediate product, an end of each of the
plurality of plating holes being closed by one surface of the core layer; and

forming a conductive portion in each of the plurality of plating holes which is electrically connected to the first copper
layer, the second copper layer, and the core layer; and

etching the first copper layer and the second copper layer to form a first conductive wire layer and a second conductive wire
layer.

US Pat. No. 10,104,771

METHOD FOR MAKING A CIRCUIT BOARD

Avary Holding (Shenzhen) ...

1. A method for making a circuit board comprising:providing a silver clad laminate, the silver clad laminate comprising a substrate and two silver foils attached to two opposite surfaces of the substrate, each of the two silver foils comprising a first area and a second area;
forming at least one through hole on the silver clad laminate, the through hole comprising an annular side wall, the annular side wall comprising an annular middle wall and two annular edge walls connected to two sides of the annular middle wall, the annular middle wall being a surface of the substrate, each of the two annular edge walls being a surface of a silver foil;
forming an organic conductive film on the annular middle wall;
forming a dry film pattern layer on a surface of the second area away from the substrate to obtain an intermediate product;
plating copper on the intermediate product to form a copper circuit layer on a surface of the first area away from the substrate and to form a via hole in the through hole;
removing the dry film pattern layer from the second area of the silver foil to expose the surface of the second area away from the substrate;
etching the second area of the silver foil away by an etchant and the first area defining to be a silver circuit layer, the silver circuit layer being between the substrate and the copper circuit layer, the copper circuit layer and the silver circuit layer defining a conductive circuit layer.

US Pat. No. 9,860,977

TRANSPARENT FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

HongQiSheng Precision Ele...

1. A transparent flexible printed circuit board (FPCB) comprising:
an insulating resin layer comprising a first surface and a second surface facing away from the first surface;
at least one through hole defined in the insulating resin layer through the first surface and the second surface;
a first electrically conductive wiring layer formed on the first surface;
a second electrically conductive wiring layer formed on the second surface, the first electrically conductive wiring layer
and the second electrically conductive wiring layer made of electrically conductive resin, the first electrically conductive
wiring layer and the second electrically conductive wiring layer filling in each through hole to form an electrically conductive
portion, each of the first electrically conductive wiring layer and the second electrically conductive wiring layer has a
plurality of wiring openings; and

a cover film covering each of the first electrically conductive wiring layer and the second electrically conductive wiring
layer, and further filling in the plurality of wiring openings.

US Pat. No. 10,111,336

METHOD OF MAKING A FLEXIBLE PRINTED CIRCUIT BOARD

Avary Holding (Shenzhen) ...

1. A method for making a flexible printed circuit board comprising:providing a carrier comprising an insulating layer and a copper foil formed on at least one surface of the insulating layer, the copper foil having a wiring area and a non-wiring area besides the wiring area;
forming a first photoresist layer on the copper foil, the first photoresist layer having a first hollow pattern to expose the wiring area;
electroplating copper in the first hollow pattern, thereby forming a copper electroplating layer on the wiring area, the copper electroplating layer having a first portion and a second portion besides the first portion;
forming and covering a second photoresist layer on the first photoresist layer and the copper electroplating layer, the second photoresist layer having a second hollow pattern to expose at least the first portion, the second hollow pattern totally aligned with the first hollow pattern having the copper electroplating layer formed therein;
electroplating nickel in the second hollow pattern, thereby forming a nickel electroplating layer at least on the first portion;
removing the first photoresist layer and the second photoresist layer;
etching to remove the non-wiring area;
covering a cover film on the second portion, the cover film filling in gaps of the copper electroplating layer and being spaced from sidewalls of the first portion; and
chemically plating gold on a top surface of the nickel electroplating layer facing away from the first portion and the sidewalls of the first portion to form a gold chemical-plating layer, thereby forming the flexible printed circuit board.

US Pat. No. 10,117,328

FLEXIBLE CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME

Avary Holding (Shenzhen) ...

1. A flexible circuit board comprising:a first conductive substrate comprising a first insulating layer, a first signal line, a second signal line, and a plurality of first conductive posts; the first insulating layer comprising a first surface and a second surface opposite to the first surface; and the first signal line forming on the first surface, the second signal line forming on the second surface, and the first conductive posts extends through the first signal line and the first insulating layer, the first signal line being electrically connected with the second signal line via the first conductive posts;
an outer layer being formed on the first signal line; the outer layer comprising a first pad and a second pad;
a second conductive post being electrically connected the first pad and the first signal line; and
a third conductive post being electrically connected the second pad and the second signal line.

US Pat. No. 9,980,386

FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

HongQiSheng Precision Ele...

1. A method for manufacturing a flexible printed circuit board comprising:providing a first double-sided circuit substrate which comprises an electronic component, wherein the first double-sided circuit substrate further comprises a first base layer, two first conductive wiring layers formed on two opposite surfaces of the first base layer, and a first isolated layer formed on one surface of each first conductive wiring layer facing away from the first base layer, one of the first conductive wiring layers being exposed from the first isolated layer to form at least one pad, the electronic component is electrically connected to the pad;
providing a multilayer circuit substrate and defining a mounting groove in the multilayer circuit substrate, wherein multilayer circuit substrate comprises a second double-sided circuit substrate, the second double-sided circuit substrate comprises a second base layer and two second conductive wiring layers formed on two opposite surfaces of the second base layer, the multilayer circuit substrate further comprises at least one circuit substrate formed on each surface of the second double-sided circuit substrate through a build-up process, each circuit substrate comprises a second isolated layer formed on the surface of the second double-sided circuit substrate through an adhesive layer and a third conductive wiring layer formed on the second isolated layer, the mounting groove passes through each third conductive wiring layer, each second isolated layer, the adhesive layer, and the second double-sided circuit substrate, the circuit substrate defines at least one blind hole, for electrically connecting each third conductive wiring layer to the second conductive wiring layer when forming conductive material on an inner wall of the blind hole;
attaching the multilayer circuit substrate to the first double-sided circuit substrate through an adhesive layer, causing the electronic component to be received in the mounting groove, thereby forming an intermediate product; and
forming at least one conductive post in the intermediate product which electrically connects the multilayer circuit substrate to the first double-sided circuit substrate, thereby forming the flexible printed circuit board.

US Pat. No. 9,992,858

PRINTED CIRCUIT BOARD

Avary Holding (Shenzhen) ...

1. A printed circuit board, comprising:a first printed circuit substrate, the first printed circuit substrate comprising a substrate layer and a first conductive circuit layer, the first conductive circuit layer being defined on the substrate layer, the substrate layer comprising first grooves, the first conductive circuit layer including at least one signal wire, at least one of the first grooves being defined in one side of the at least one signal wire, wherein the first printed circuit substrate further comprises a second copper layer, the first conductive circuit layer further comprising at least two ground wires, the at least two ground wires being arranged on opposite sides of the signal wire, the at least two ground wires being separate from the signal wire; wherein the substrate layer comprises conductive holes, the conductive holes being equally distributed along the at least two ground wires and electrically connecting the at least two ground wires to the second copper layer; and
a second printed circuit substrate, the second printed circuit substrate being defined on the first printed circuit substrate, the second circuit substrate comprising a third copper layer, a second groove being opened in the third copper layer, the first groove being opposite to the second groove, the first groove and the second groove forming a space, the signal wire being surrounded by air in the space, wherein the second printed circuit substrate is coupled to the first printed circuit substrate by a conductive adhesive layer, the second copper layer, and the conductive holes; the conductive adhesive layer and the third copper layer forming a shielding structure, the shielding structure surrounding the signal wire.

US Pat. No. 10,136,207

PRINTED CIRCUIT BOARD USED AS VOICE COIL, METHOD FOR MANUFACTURING THE SAME AND LOUDSPEAKER WITH THE SAME

Avary Holding (Shenzhen) ...

1. A printed circuit board used as a voice coil comprising N board units stacked over one another, where N?1, the printed circuit board having a top surface and a bottom surface opposite to the top surface, each board unit having a first electrically connecting region and a second electrically connecting region, all of the first electrically connecting regions being stacked over one another, all of the second electrically connecting regions being stacked over one another, each board unit having a first circuit structure, a base, and a second circuit structure arranged from top to bottom, in each two adjacent board units, the first electrically connecting region of the second circuit structure of an upper board unit being electrically connected in series with the first electrically connecting region of the first circuit structure of a lower board unit, in each board unit, the first circuit structure being electrically connected in series with the second circuit structure in the second electrically connecting region, each first circuit structure starting in the first electrically connecting region, spiraling around and closes to the second electrically connecting region, and ending in the second electrically connecting region, each second circuit structure starting in the second electrically connecting region, spiraling around and away from the second electrically connecting region, and ending in the first electrically connecting region, each first circuit structure and second circuit structure spiraling around the second electrically connecting region along a clockwise direction or a counterclockwise direction, starting points in the first electrically connecting regions of the first circuit structures of the board units being staggered, and starting points in the second electrically connecting regions of the second circuit structures of the board units being staggered, ending points in the second electrically connecting regions of the first circuit structures of the board units being staggered, and ending points in the first electrically connecting regions of the second circuit structures of the board units being staggered.

US Pat. No. 10,012,454

HEAT DISSIPATION DEVICE AND METHOD FOR MANUFACTURING SAME

Avary Holding (Shenzhen) ...

1. A method for manufacturing the heat dissipation device, the method comprising:providing a first copper sheet and a second copper sheet, the first copper sheet comprises a first surface and a third surface opposite to the first surface;
processing the first surface of the first copper sheet to form a plurality of first recesses and a plurality of first cavities in the first surface of the first copper sheet, processing the third surface of the first copper sheet to form a plurality of micro-fins in the third surface of the first copper sheet a height of the microfins in the range of 3 um to 8 um, the first cavities being surrounded by the first recesses, processing the second copper sheet to form a plurality of second recesses and a plurality of second cavities in the second copper sheet, each second recess corresponding to each first recess, each second cavity corresponding to each first cavity;
providing an adhesive on each second recess of the second copper sheet;
providing a working fluid in each second cavity of the second copper sheet;
pressing the first copper sheet on the second copper sheet, and the second copper sheet is fixed with the first copper sheet by the adhesive, each of the first cavities being in communication with a second cavity, each first cavity and each second cavity together forming an airtight receiving cavity;
solidifying the adhesive.

US Pat. No. 10,187,984

CIRCUIT BOARD AND METHOD FOR MAKING THE SAME

Avary Holding (Shenzhen) ...

1. A circuit board comprising: a substrate; at least one conductive circuit layer attached to the substrate; at least one plating film attached to a surface of each of the at least one conductive circuit layer away from the substrate, each of the at least one plating film comprises a surface away from each of the at least one conductive circuit layer, and at least one side surface connecting each of the at least one conductive circuit layer and the surface away from each of the at least one conductive circuit layer; and a covering film; wherein the circuit board defines at least one through hole, each of the at least one through hole passes through the substrate, the at least one conductive circuit layer, and each of the at least one plating film, the covering film covers an exposing surface of each of the at least one conductive circuit layer, the at least one side surface of each of the at least one plating film, and a side wall of each of the at least one through hole, wherein a portion of the surface of the substrate attached to each of the at least one conductive circuit layer is exposed through each of the at least one conductive circuit layer, the exposed portion of the surface of the substrate attached to each of the at least one conductive circuit layer is covered by the covering film.

US Pat. No. 10,299,367

CIRCUIT BOARD HAVING CONDUCTIVE POLYMER

Avary Holding (Shenzhen) ...

1. A circuit board comprising:a flexible board;
a composite film formed on the flexible board and defining at least one through hole, the composite film comprising:
a base layer having an active surface; and
a conductive layer formed by coated a conductive polymer on the active surface, the conductive polymer made by a mixture comprising liquid crystal monomers, a silver complex, an initiator, and a catalytic agent, and a solvent, the mixture is heated to undergo atom transfer radical polymerization; and
a copper layer covering the conductive layer and an inner wall of each of the at least one through hole, the copper layer electrically connected to the flexible substrate by the at least one through hole;
wherein the liquid crystal monomers has a mass percentage of about 42.2% to about 52.2% of a total mass of the mixture, the silver complex has a mass percentage of about 43.1% to about 53.1% of the total mass of the mixture, the initiator has a mass percentage of about 0.85% to about 1.35% of the total mass of the mixture, the catalytic agent has a mass percentage of about 2.85% to about 4.35% of the total mass of the mixture, the mixture and the solvent has a ratio selected from 3:17 to 1:3 by weight, and the silver complex in the conductive polymer is bonded to the active surface.

US Pat. No. 10,205,487

WIRELESS POWER CONSORTIUM DEVICE AND METHOD FOR MANUFACTURING THE SAME

Avary Holding (Shenzhen) ...

1. A wireless power consortium device, comprising:a flexible substrate layer;
at least one first wireless power consortium (WPC) coil being formed on the flexible substrate layer;
at least one first near field communication (NFC) coil being formed on the flexible substrate layer; wherein the at least one first NFC coil surrounds the at least one first WPC coil;
at least one WPC module being formed on the flexible substrate layer, wherein each of the at least one WPC module comprises a first matching circuit and a WPC power supply chip electrically connected to the first matching circuit; and
at least one NFC module being formed on the flexible substrate layer, wherein each of the at least one NFC module comprises a second matching circuit and an NFC controlling chip electrically connected to the second matching circuit; wherein the first matching circuit and the second matching circuit are different parts of one circuit and are formed on the flexible substrate layer.

US Pat. No. 10,349,533

MULTILAYER CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

HongQiSheng Precision Ele...

1. A multilayer circuit board comprising:an inner circuit board comprising at least one first mounting region and at least one second mounting region;
at least one outer circuit board formed on the inner circuit board;
a solder mask; and
a tin layer formed on a surface of the inner circuit board connecting the at least one outer circuit board except the at least one first mounting region;
wherein the at least one outer circuit board comprises at least one first opening and at least one second opening; the at least one first mounting region is exposed from the at least one first opening, a portion of the tin layer covering the at least one second mounting region is exposed from the at least one second opening; the inner circuit board, the tin layer, and the at least one outer circuit board together form a middle structure; the solder mask covers the middle structure except the at least one first mounting region and the portion of the tin layer covering the at least one second mounting region; a treatment layer is formed on the at least one first mounting region.

US Pat. No. 10,349,518

CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

HongQiSheng Precision Ele...

1. A method of manufacturing an embedded circuit board, comprising:providing a first adhesive coated copper, the first adhesive coated copper comprising a first copper layer pre-formed with at least two first positioning holes and a first adhesive layer formed on a surface of the first copper layer;
adhering at least one first electronic element on the first adhesive layer, wherein electrodes of the at least one first electronic element face their corresponding first positioning holes;
providing a second adhesive coated copper;
providing a semi-cured film, pressing the first adhesive coated copper and the second adhesive coated copper on opposite surfaces of the semi-cured film, thereby embedding the at least one first electronic element in the semi-cured film;
partially removing the first adhesive layer to form first holes for exposing electrodes of the at least one first electronic element;
electrically connecting the electrodes of the at least one first electronic element with the first copper layer.

US Pat. No. 10,321,561

FLEXIBLE PRINTED CIRCUIT BOARD, PRINTED CIRCUIT BOARD STRUCTURE AND METHOD FOR MANUFACTURING FLEXIBLE PRINTED CIRCUIT BOARD

Avary Holding (Shenzhen) ...

1. A flexible printed circuit board, comprising:a first conductive pattern layer, the first conductive pattern layer comprising a plurality of first conductive pads;
a second conductive pattern layer, the second conductive pattern layer comprising a plurality of second conductive pads;
a plurality of first through holes being defined through the flexible printed circuit board, each of the plurality of first through holes corresponding to and being defined through one first conductive pad;
a plurality of second through holes being defined through the flexible printed circuit board, each of the plurality of second through holes corresponding to and being defined through one second conductive pad;
a plurality of first conductive pillars, each of the plurality of first conductive pillars corresponding to and being received in one first through hole to electrically connect to one first conductive pad, the plurality of first conductive pillars being spaced from the second conductive pattern layer, and
a plurality of second conductive pillars, each of the plurality of second conductive pillars corresponding to and being received in one second through hole to electrically connect to one second conductive pad, the plurality of second conductive pillars being spaced from the first conductive pattern layer;
wherein the plurality of first conductive pillars and the plurality of second conductive pillars are exposed from one surface of the flexible printed circuit board to form a plurality of electrical contact pads, a plurality of first grooves and a plurality of second grooves are defined from an outer surface of the flexible printed circuit board on the second conductive pattern layer side to a surface of the second conductive pattern layer away from the first conductive pattern layer; each of the plurality of first grooves is aligned with and corresponds to one first conductive pillar, and each of the plurality of second grooves is aligned with and corresponds to one second conductive pillar.

US Pat. No. 10,285,260

FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME

Avary Holding (Shenzhen) ...

1. A method for manufacturing a flexible printed circuit board, comprising:providing a substrate comprising a base layer, a first copper layer and a second copper layer, the first copper formed at one side of the base layer, and the second copper layer formed at an opposite side of the base layer;
forming a first hole extending through the base layer and the first copper layer, a bottom of the first hole sealed by the second copper layer;
posting dry films on the first copper layer and the second copper layer;
removing part of the dry films which corresponding to the part of the first hole on the first copper layer, to expose part of the first copper layer, wherein the first hole is surrounded by the exposed first copper layer and presented with a ring shape;
reducing a thickness of the copper of the exposed first copper layer to form a second hole on the first copper layer, which is communicated with the first hole;
partial plating copper at the first and the second hole to form an annular copper ring and a conducting hole, the plated copper of the conducting hole directly contacting a surface of the second copper layer facing the base layer, a surface of the annular copper ring being at a same level with a surface of the first copper layer; and
removing the dry films, and processing the first copper layer to form a circuit layer, to form the flexible printed circuit board.

US Pat. No. 10,278,307

COOLING PLATE AND METHOD FOR MANUFACTURING THEREOF

Avary Holding (Shenzhen) ...

1. A cooling plate configured with an electronic device for heat dissipation, the cooling plate comprising:a first plate;
a second plate;
a bonding line connecting between the first plate and the second plate;
a plurality of supporting columns and a cooling liquid;
wherein the first plate, the second plate, and the bonding line together define a cavity, the plurality of supporting columns and the cooling liquid are received in the cavity; and
wherein the plurality of supporting columns connects perpendicularly with the first plate and the second plate, the cooling liquid communicates among the plurality of the supporting columns; the first plate and the plurality of supporting columns are integrated with the electronic device and are a portion of the electronic device.

US Pat. No. 10,383,223

METHOD FOR MAKING CIRCUIT BOARD

Avary Holding (Shenzhen) ...

1. A method for making a circuit board comprising:providing a copper clad laminate, the copper clad laminate comprises a substrate and at least one copper layer, the substrate comprises at least one first surface, each of the at least one copper layer is attached to one of the at least one first surface;
etching the at least one copper layer to form at least one conductive circuit layer, a portion of each of the at least one first surface is exposed through one of the at least one conductive circuit layer, each of the at least one conductive circuit layer comprises a second surface away from the substrate;
forming a dry film pattern layer, the dry film pattern layer covers the exposed portion of each of the at least one first surface, and a portion of the second surface, the other portion of the second surface not being covered by the dry film pattern layer is an exposing area;
forming at least two plating films on the exposing area, each of the at least two plating films comprises a third surface away from the second surface and at least one side surface connecting the second surface and the third surface;
removing the dry film pattern layer;
forming at least one through hole to form an intermediate product, each of the at least one through hole is located between two adjacent ones of the at least two plating films, each of the at least one through hole passes through the substrate, and the at least one conductive circuit layer;
providing at least one adhesive sheet, each of the at least one adhesive sheet comprises at least one opening, each of the at least one opening is aligned with the third surface of each of the at least two plating films; and
pressing the at least one adhesive sheet and the intermediate product, the opening exposes at least a portion of the third surface.

US Pat. No. 10,365,430

METHOD FOR MANUFACTURING HIGH FREQUENCY SIGNAL TRANSMISSION STRUCTURE AND HIGH FREQUENCY SIGNAL TRANSMISSION STRUCTURE OBTAINED THEREBY

Avary Holding (Shenzhen) ...

1. A high frequency signal transmission structure comprising:a circuit layer comprising a base and a circuit structure formed on the base, the circuit structure having a transmission portion;
two dielectric layers, the circuit layer being formed between the two dielectric layers, the two dielectric layers being symmetrical about the circuit layer, each of the two dielectric layers defining a channel facing the circuit layer, the two channels being symmetrical about the circuit layer, and an inner diameter of each of the two channels gradually reducing further from the circuit layer; and
two copper plates, the circuit layer and the two dielectric layers being formed between the two copper plates, wherein a first air chamber being made by one of the two channels surrounded by the circuit layer, one of the two dielectric layers and one of the two copper plates, the transmission portion being received in the first air chamber, a second air chamber being made of the other one of the two channels surrounded by the circuit layer, the other one of the two dielectric layers and the other one of the two copper plates.

US Pat. No. 10,448,540

ULTRATHIN HEAT DISSIPATION STRUCTURE

Avary Holding (Shenzhen) ...

1. A heat dissipation structure comprising:a copper clad sheet comprising a plurality of containing grooves and a plurality of ribs round each containing groove, each of the plurality of containing grooves formed by stamping, the copper clad sheet comprising an insulation layer and a copper clad layer attached on the insulation layer, wherein a surface of the copper clad layer facing away from the insulation layer forms an inner surface of the plurality of containing grooves, the insulation layer follows a contour of the copper clad layer and has a same shape as that of the copper clad layer;
a plurality of bond blocks arranged on the ribs;
a cover being fixed on the copper clad sheet with the containing groove using the bond blocks, the cover sealing the plurality of containing grooves to form a plurality of a sealed cavities; and
a phase-change material contained in the sealed cavity and configured to absorb and transfer out heat generated by components.

US Pat. No. 10,405,431

FLEXIBLE PRINTED CIRCUIT BOARD

Avary Holding (Shenzhen) ...

1. A flexible printed circuit board comprising:an insulating layer;
a wiring area formed on at least one surface of the insulating layer;
a copper electroplating layer formed on and corresponding to the wiring area, the copper electroplating layer comprising a first portion and a second portion besides the first portion;
a nickel electroplating layer formed on a top surface of at least the first portion facing away from the wiring area, the nickel electroplating layer exposing sidewalls of the first portion;
a cover film formed on the second portion and filling in gaps of the copper electroplating layer; and
a gold chemical-plating layer formed on a top surface of the nickel electroplating layer facing away from the first portion and the sidewalls of the first portion.

US Pat. No. 10,412,841

FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

Avary Holding (Shenzhen) ...

1. A method for making a flexible printed circuit board comprising:providing an insulating laminate comprising a base layer, the base layer having two opposite surfaces, a releasing films formed on each surface of the base layer;
defining at least one first through hole in the insulating laminate, each first through hole passing through the base layer and the two releasing films;
forming a conductive paste block in each first through hole, each conductive paste block comprises a first end portion and a second end portion opposite to the first end portion, at least the first end portion protruding from the base layer;
removing the releasing films;
forming a first conductive wiring layer, an insulating layer, and a second conductive wiring layer on each surface of the base layer and in that order, the first end portion of each conductive paste block exposed from the first conductive wiring layer;
defining at least one second through hole in the insulating layer, the second through hole coaxially aligned with each conductive paste block, the second through hole positioned near the first end portion extending to the first end portion and forming a recess in the first end portion; and
forming a conductive via in each second through hole and the correspond recess.

US Pat. No. 10,412,827

METHOD OF MAKING A RIGID-FLEX CIRCUIT BOARD

QING DING PRECISION ELECT...

1. A method of making a rigid-flex circuit board, the method comprising:providing a first base layer and a second base layer, coating a photosensitive material on a surface of the first base layer and on a surface of the second base layer, and exposing the photosensitive material to form a circuit pattern;
coating a conductive material on the exposed portions of the surface of both the first base layer and the second base layer, removing the photosensitive material outside of the conductive material, and solidifying the conductive material to form a first conductive circuit layer on the first base layer and a second conductive circuit layer on the second base layer;
providing an insulating layer and laminating the insulating layer between the first base layer and the second base layer to form a core substrate, the first conductive circuit layer and the second conductive circuit layer embedded within the insulating layer;
providing a first adhesive layer, the first adhesive layer defining a first opening, and laminating the first adhesive layer to an outer surface of the first base layer, the first adhesive layer located on a surface of the first base layer opposite to the first conductive circuit layer, the first base layer exposed through the first opening;
providing and laminating a first copper film on a surface of the first adhesive layer opposite to the first base layer, forming a first outer conductive circuit layer from the first copper film, the first copper film defining an opening aligned with the first opening; and
wherein a portion of the core substrate located within the first opening is defined as a flexible board section, and the portions of the core substrate located outside of the first opening are defined as a hard board section.

US Pat. No. 10,462,902

CIRCUIT BOARD AND MANUFACTURING METHOD

Avary Holding (Shenzhen) ...

1. A circuit board comprising at least two circuit board units, each of the circuit board units comprising:a baseboard having a conductive hole filled with an electrical conductor;
a cover layer arranged on the baseboard and defined at least one trench and at least one opening, wherein the at least one opening exposing out the electrical conductor; and
a circuit pattern embedded in the at least one trench and comprising a connecting portion, wherein the connecting portion is embedded in the opening and is electrically coupled to the electrical conductor; and
the at least two circuit board units are stacked, two sides of the at least one cover layer are respectively adhered to the corresponding baseboard, and two ends of the at least one connecting portion are respectively electrically coupled to the corresponding electrical conductor and electrically coupled the two adjacent circuit patterns.