US Pat. No. 9,781,839

ATTACHING WIRE TO A LAYER OF ADHESIVE

Automated Assembly Corpor...

1. A method of attaching wire to an exposed surface of an adhesive layer, comprising:
guiding wire from a wire source through a payout head and through a foot of a write head, the foot having a surface facing
the adhesive layer and a first portion of the wire extending from the foot toward the adhesive layer;

positioning the write head such that a gap between the surface of the foot and the exposed surface of the adhesive layer is
greater than a diameter of the wire, and the first portion of the wire extends toward the exposed surface of the adhesive
layer and contacts a first site of the adhesive layer when positioning is complete;

moving the write head in a motion parallel to the adhesive layer, wherein the first portion of the wire extending toward the
exposed surface of the adhesive layer adheres to the adhesive layer; and

pulling the wire from the wire source by the payout head as the write head is moving and maintaining slack in a second portion
of the wire between the payout head and the write head as the wire is attached to the exposed surface of the adhesive layer.

US Pat. No. 9,151,454

MODULAR LED LIGHTING APPARATUS

Automated Assembly Corpor...

1. A lighting module, comprising:
a light emitting diode (LED) panel including a plurality of LEDs and two or more conductive contacts;
a boxlike member having a base and sidewalls, the sidewalls having passages that provide ingress to and egress from the boxlike
member for power wires;

one or more mounting members attached to the boxlike member and to which the LED panel is removably attached; and
a circuit board disposed in the boxlike member, the circuit board including:
two or more insertion force connectors for connecting to power wires; and
two or more board connectors that engage the conductive contacts of the LED panel and electrically couple the conductive contacts
of the LED panel to the insertion force connectors.

US Pat. No. 9,814,142

ELECTRONIC DEVICES WIRE BONDED TO SUBSTRATE THROUGH AN ADHESIVE LAYER AND METHOD OF MAKING THE SAME

Automated Assembly Corpor...

1. A circuit arrangement, comprising:
a substrate having first bond pads coupled to a pattern of conductors, wherein the first bond pads and the pattern of conductors
are disposed on a first surface of the substrate;

a first layer of adhesive disposed directly on the first surface of the substrate and the pattern of conductors, the first
layer of adhesive having openings at the first bond pads, opposing first and second surfaces, and the openings extending from
the first surface of the first layer of adhesive to the second surface of the first layer of adhesive;

an electronic device having opposing first and second surfaces, the electronic device attached to the first surface of the
substrate by the first surface of the electronic device in contact with the first layer of adhesive, and the second surface
of the electronic device having second bond pads;

bond wires connected at the first bond pads through the openings in the first layer of adhesive and connected at the second
bond pads, wherein portions of the bond wires are disposed directly on the first layer of adhesive; and

a second layer of adhesive disposed directly on the electronic device, bond wires, and first layer of adhesive and covering
the openings in the first layer of adhesive.

US Pat. No. 9,565,752

WIRE BONDED ELECTRONIC DEVICES TO ROUND WIRE

Automated Assembly Corpor...

1. A circuit arrangement, comprising:
a substrate;
an electronic device attached to the substrate;
first and second cross wires attached to the substrate and disposed proximate the electronic device;
one or more wire segments attached to the substrate and having first and second portions attached at a third portion of the
first cross wire and at a fourth portion of the second cross wire, respectively;

wherein the first and second cross wires and the one or more wire segments are round wires having round cross sections, the
first portion and the third portion have flat areas of contact, and the second and fourth portions have flat areas of contact;

a first bond wire connected to the electronic device and to the first portion of the one or more wire segments; and
a second bond wire connected to the electronic device and to the second portion of the one or more wire segments.

US Pat. No. 9,379,289

LEDS ON ADHESIVE TRANSFER TAPE

Automated Assembly Corpor...

1. A lighting arrangement, comprising:
adhesive transfer tape that includes an adhesive layer having opposing first and second adhesive surfaces, and at least one
release liner, wherein the at least one release liner is directly adhered to both the first and second adhesive surfaces and
separable from both the first and second adhesive surfaces of the adhesive layer;

power wires adhered directly to the second adhesive surface and including a first power wire and a second power wire; and
a plurality of light emitting diodes (LEDs) disposed on the second adhesive surface and coupled to the first power wire and
the second power wire.

US Pat. No. 9,652,705

RFID TAG ON FLEXIBLE SUBSTRATE ARRANGEMENT

Automated Assembly Corpor...

1. An RFID tag, comprising:
a flexible substrate having a first surface;
a strap having a first surface, a second surface, and first and second terminals exposed on the first surface of the strap,
the strap attached to the flexible substrate with the second surface of the strap attached to the first surface of the substrate;

an RFID integrated circuit (IC) mounted on the strap and electrically coupled to the first and second terminals;
an antenna attached to the first surface of the flexible substrate and attached at and electrically connected to the first
and second terminals on the first surface of the strap.

US Pat. No. 9,128,222

LED LIGHTING APPARATUS

Automated Assembly Corpor...

1. A lighting apparatus, comprising:
a light-diffusive plate having opposing first and second faces bounded by one or more sides, the light-diffusive plate having
a plurality of disruptions on the first face and a first channel in at least a portion of a first side of the one or more
sides and between the first and second faces of the light-diffusive plate;

a first cover having first and second surfaces and disposed over the first channel with the first surface facing the first
side of the light-diffusive plate; and

a plurality of light-emitting diodes (LEDs) disposed on the first surface of the first cover and within the first channel,
the LEDs electrically coupled with wiring integrated with the first cover, wherein light emitted from the LEDs and directed
at the side having the first channel is transmitted within the light-diffusive plate by total internal reflection and scattered
by the plurality of disruptions.

US Pat. No. 9,431,363

WIRE BONDED IC COMPONENTS TO ROUND WIRE

Automated Assembly Corpor...

1. A circuit arrangement, comprising:
a substrate;
an integrated circuit (IC) component attached to the substrate;
one or more round wire segments attached to the substrate, the one or more round wire segments having first and second portions
for connecting to the IC component, and each of the first and second portions having a respective planar landing area extending
longitudinally along the one or more round wire segments;

wherein each of the one or more round wire segments has a round cross section; and
bond wires directly connected to the respective planar landing areas and to the IC component.

US Pat. No. 9,900,992

WIRE BONDED ELECTRONIC DEVICES TO ROUND WIRE

Automated Assembly Corpor...

1. A circuit arrangement, comprising:
adhesive transfer tape having a layer of pressure sensitive adhesive (PSA) having a first major surface and a second major
surface opposite the first major surface;

one or more metal foil pads attached directly to the second major surface of the layer of PSA;
electrically conductive round wire attached directly to the second major surface of the layer of PSA, the electrically conductive
round wire having a round cross-section, wherein one or more portions of the electrically conductive round wire is directly
connected to the one or more metal foil pads with one or more weld joints, respectively; and

an electronic device attached directly on the second major surface of the layer of PSA and electrically connected to the one
or more portions of the electrically conductive round wire by one or more bond wires, respectively.

US Pat. No. 9,595,501

WIRE BONDED ELECTRONIC DEVICES TO ROUND WIRE

Automated Assembly Corpor...

1. A circuit arrangement, comprising:
a flexible substrate having first and second major surfaces, the first major surface opposite the second major surface;
a first layer of pressure sensitive adhesive (PSA) having a third major surface and a fourth major surface, the third major
surface opposite the fourth major surface, and the fourth major surface directly adhered to the first major surface of the
flexible substrate;

one or more metal foil pads attached directly on the third major surface of the first layer of PSA layer;
electrically conductive round wire attached directly on the third major surface of the first layer of PSA, the wire having
a round cross-section and one or more portions directly connected to the one or more metal foil pads with one or more weld
joints, respectively; and

an electronic device attached directly on the third major surface of the first layer of PSA and electrically connected to
the one or more portions of the round wire by one or more bond wires, respectively.

US Pat. No. 9,606,285

LED LIGHTING APPARATUS HAVING ELECTRICALLY CONDUCTIVE SHEETS COUPLED TO LEDS ON AN LED CARRIER

Automated Assembly Corpor...

1. A lighting apparatus, comprising:
a light-diffusive plate having opposing first and second faces bounded by one or more sides;
a first electrically conductive sheet disposed on the first face of the light-diffusive plate;
a first electrically insulative sheet disposed on the first electrically conductive sheet;
a second electrically conductive sheet disposed on the first electrically insulative sheet;
a first plurality of light-emitting diodes (LEDs) having light emitting portions that face a portion of the light-diffusive
plate, the first plurality of LEDs electrically coupled to the first electrically conductive sheet and to the second electrically
conductive sheet; and

a first LED carrier attached to the light-diffusive plate, wherein the first plurality of LEDs is disposed on a first portion
of the LED carrier and the light emitting portions of the LEDs face a first side of the one or more sides of the light-diffusive
plate, and the first LED carrier has a second portion having first terminals and second terminals coupled to the plurality
of LEDs;

wherein:
the light-diffusive plate has a plurality of disruptions on the first face of the opposing faces;
the first electrically conductive sheet is electrically coupled to the first terminals; and
the second electrically conductive sheet is electrically coupled to the second terminals.

US Pat. No. 9,897,292

SOLID-STATE LIGHTING ELEMENTS ON ADHESIVE TRANSFER TAPE

Automated Assembly Corpor...

1. A lighting arrangement, comprising:
adhesive transfer tape that includes an adhesive layer having opposing first and second adhesive surfaces, and at least one
release liner, wherein the at least one release liner is directly adhered to both the first and second adhesive surfaces and
separable from both the first and second adhesive surfaces of the adhesive layer;

a first power wire having a circular cross-section and directly adhered to the second adhesive surface;
a second power wire having a circular cross-section and directly adhered to the second adhesive surface,
wherein a portion of the second adhesive surface is between an exterior surface of the first power wire and an exterior surface
of the second power wire; and

a plurality of solid state lighting (SSL) elements disposed on the second adhesive surface and coupled to the first and second
power wires.

US Pat. No. 9,870,529

TRANSPONDER WIRE BONDED TO ROUND WIRE ON ADHESIVE TAPE HAVING A WATER-SOLUBLE BACKING

Automated Assembly Corpor...

1. A circuit arrangement, comprising:
a water soluble backing having first and second major surfaces, the first major surface opposite the second major surface;
a layer of pressure sensitive adhesive (PSA) having a third major surface and a fourth major surface, the third major surface
opposite the fourth major surface, and the fourth major surface directly adhered to the first major surface of the water soluble
backing;

one or more metal foil pads attached directly on the third major surface of the layer of PSA;
electrically conductive round wire attached directly on the third major surface of the layer of PSA, the wire having a round
cross-section and one or more portions directly connected to the one or more metal foil pads with one or more weld joints,
respectively; and

an RF transponder attached directly on the third major surface of the layer of PSA and electrically connected to the one or
more portions of the round wire by one or more bond wires, respectively.

US Pat. No. 9,989,223

LED LIGHTING APPARATUS WITH LEDS AND WIRES ATTACHED TO METAL SHEET MEMBER BY ADHESIVE

Automated Assembly Corpor...

12. The A lighting apparatus, comprising:a support structure having a sheet metal member, the sheet metal member having a first surface;
an adhesive layer directly attached to the first surface of the sheet metal member;
a plurality of light-emitting diode (LED) components directly attached to a second surface of the adhesive layer;
a plurality of wires attached to the sheet metal member by the adhesive layer and coupled to the plurality of LED components for providing power to the LED components,
wherein the plurality of wires have circular cross-sections and portions for connecting to the plurality of LED components, and each portion of a wire has a respective planar landing area extending longitudinally along the wire, and the lighting apparatus further comprising:
bond wires directly connected to the respective planar landing areas and to the plurality of LED components, wherein each of the plurality of wires directly contacts at least three of the bond wires.

US Pat. No. 10,172,240

WIRE BONDED ELECTRONIC DEVICES TO ROUND WIRE

Automated Assembly Corpor...

9. A method of making a circuit arrangement, comprising:picking and placing first and second metal foil pads on a flexible substrate;
attaching the first and second metal foil pads to the flexible substrate by a first layer of pressure-sensitive adhesive (PSA) on the flexible substrate;
attaching an electronic device to the flexible substrate by the first layer of PSA proximate the first and second metal foil pads;
attaching one or more wire segments of electrically conductive wire to the flexible substrate by the first layer of PSA, the one or more wire segments having a round cross section and first and second portions disposed over the first and second metal foil pads, respectively;
welding the first and second portions of the one or more wire segments to the first and second metal foil pads, respectively; and
wire bonding the electronic device to the first and second metal foil pads making first and second wire bond joints between first and second bond wires and the first and second metal foil pads, respectively.

US Pat. No. 10,168,463

SOLID-STATE LIGHTING APPARATUS

Automated Assembly Corpor...

1. A lighting apparatus, comprising:a solid light-diffusive panel having opposing first and second faces and two or more side portions, wherein at least one of the side portions has a curved surface and a third surface, wherein the third surface is parallel to the first and second faces;
a plurality of SSL elements disposed proximate the third surface of the at least one side portion and arranged to emit light orthogonal to the third surface and into the at least one side portion;
a first reflector disposed on the curved surface of the at least one side portion and having a reflective surface arranged to reflect light from the plurality of SSL elements into the solid light-diffusive panel, wherein the light reflected from the first reflector is internally reflected in the solid light-diffusive panel;
a plurality of disruptions formed on the second face of the solid light-diffusive panel and arranged to disperse internally reflected light; and
a second reflector disposed on the second face of the solid light-diffusive panel and arranged to reflect light emitted from the second face into the solid light-diffusive panel,
wherein a cross-section of the at least one side portion is a partial ellipse, and the plurality of SSL elements are disposed at foci of partial ellipses at a plurality of cross-sections of the at least one side portion.

US Pat. No. 10,169,697

RADIO FREQUENCY TAG HAVING INTEGRATED AND SUPPLEMENTAL ANTENNA ELEMENTS

Automated Assembly Corpor...

1. A radio frequency (RF) tag, comprising:a substrate;
an integrated circuit (IC) package disposed on the substrate and having an integrated antenna element coupled to circuitry of the IC package; and
an external antenna element of round wire having at least one half turn disposed against two or more surfaces of the IC package, wherein the external antenna element is inductively coupled to the integrated antenna element, and the IC package laterally supports the at least one half turn of the external antenna element.

US Pat. No. 10,169,698

RF TRANSPONDER ON ADHESIVE TRANSFER TAPE

Automated Assembly Corpor...

1. A transponder arrangement, comprising:adhesive transfer tape that includes an adhesive layer having opposing first and second adhesive surfaces and at least one release liner, wherein the at least one release liner is separable from the adhesive layer and directly adhered to the first and second adhesive surfaces;
an antenna having wire adhered directly to the second adhesive surface; and
an RF transponder disposed on the second adhesive surface and coupled to the antenna.

US Pat. No. 10,168,037

SSL LIGHTING APPARATUS

Automated Assembly Corpor...

1. A lighting apparatus, comprising:a first electrically conductive net of a polyhedron;
a first dielectric net of the polyhedron, the first dielectric net disposed on the first electrically conductive net;
a second electrically conductive net of the polyhedron, the second electrically conductive net disposed on the first dielectric net; and
a plurality of solid-state lighting (SSL) elements electrically coupled to the first electrically conductive net and to the second electrically conductive net; and
wherein the first electrically conductive net, first dielectric net, and second electrically conductive net have bends that configure the first electrically conductive net, first dielectric net, and second electrically conductive net in a shape of the polyhedron.

US Pat. No. 10,168,038

SOLID STATE LIGHTING (SSL) APPARATUS HAVING ELECTRICALLY CONDUCTIVE SHEETS COUPLED TO SOLID STATE LIGHTING ON AN SSL ELEMENT CARRIER

Automated Assembly Corpor...

1. A lighting apparatus, comprising:a light-diffusive plate having opposing first and second faces bounded by one or more sides;
a first electrically conductive sheet disposed on the first face of the light-diffusive plate;
a first electrically insulative sheet disposed on the first electrically conductive sheet;
a second electrically conductive sheet disposed on the first electrically insulative sheet; and
a first plurality of solid-state lighting (SSL) elements having light emitting portions that face a portion of the light-diffusive plate, the first plurality of SSL elements electrically coupled to the first electrically conductive sheet and to the second electrically conductive sheet;
a first SSL element carrier attached to the light-diffusive plate, wherein the first plurality of SSL elements is disposed on a first portion of the SSL element carrier and the light emitting portions of the SSL elements face a first side of the one or more sides of the light-diffusive plate, and the first SSL element carrier has a second portion having first terminals and second terminals coupled to the plurality of SSL elements;
wherein:
the light-diffusive plate has a plurality of disruptions on the first face of the opposing faces;
the first electrically conductive sheet is electrically coupled to the first terminals; and
the second electrically conductive sheet is electrically coupled to the second terminals.

US Pat. No. 10,171,133

TRANSPONDER ARRANGEMENT

Automated Assembly Corpor...

1. A transponder arrangement, comprising:a substrate having a first surface and an opposing second surface;
a radio frequency (RF) transponder disposed on the first surface of the substrate and having a first connection pad and a second connection pad;
a first antenna element disposed on the first surface of the substrate and connected to the first connection pad;
a second antenna element disposed on the first surface of the substrate and connected to the second connection pad; and
a third antenna element disposed on the second surface of the substrate and inductively coupled to the first and second antenna elements.