1. A jettable etchant composition, comprising:8.3 to 11.4 mol/liter of an active ingredient, wherein the active ingredient comprises a first class active ingredient and a second class active ingredient, wherein the first active ingredient is selected from the group consisting of copper (II) sulfate, gold (I) chloride, gold (III) chloride, ammonium fluoride, nitric acid, sulfuric acid, nickel (II) chloride, iron (II) chloride, iron (III) chloride, zinc (II) chloride, potassium hydroxide, sodium hydroxide, and lithium hydroxide; and
one or more of 10 to 90 wt % solvent, 0 to 10 wt % reducing agents, <1 to 20 wt % pickling agent, 0 to 5 wt % surfactant, and 0 to 5 wt % antifoam agent,
wherein the active ingredient is capable of at least one of etching and doping a surface layer; and
wherein the etchant composition is configured to be jettable and is configured to exhibit an inverse Ohnesorge number at 25° C. of between 1 and 10 at a printing orifice diameter between 20 and 60 ?m.