US Pat. No. 9,155,208

CONDUCTIVE CONNECTION STRUCTURE FOR CONDUCTIVE WIRING LAYER OF FLEXIBLE CIRCUIT BOARD

Advanced Flexible Circuit...

1. A conductive connection structure for a conductive wiring layer of a flexible circuit board, wherein the flexible circuit
board comprises:
a conductive wiring layer, which has a first surface and a second surface, the conductive wiring layer comprising a perforation
zone formed at a predetermined location, the second surface of the conductive wiring layer comprising an exposed zone defined
thereon at a location adjacent to the perforation zone;

a first covering layer, which is formed on the first surface of the conductive wiring layer; and
a second covering layer, which is formed on the second surface of the conductive wiring layer;
a first through hole, which extends through the first covering layer and the conductive wiring layer, the first through hole
being formed at a location corresponding to the perforation zone of the conductive wiring layer;

a second through hole, which extends through the second covering layer, the second through hole being formed at a location
corresponding to the exposed zone of the second surface of the conductive wiring layer and intercommunicating with the first
through hole, the second through hole having a bore diameter that is greater than a bore diameter of the first through hole,
so that the exposed zone of the second surface of the conductive wiring layer is not covered by the second covering layer;
and

a first conductive paste layer, which is formed on a surface of the first covering layer and filled in the first through hole
to form a pillar portion in the first through hole;

wherein the pillar portion has a bottom end forming a curved cap, and the exposed zone of the second surface of the conductive
wiring layer is at least partially covered by the curved cap.

US Pat. No. 9,313,890

ATTENUATION REDUCTION STRUCTURE FOR HIGH FREQUENCY SIGNAL CONTACT PADS OF CIRCUIT BOARD

Advanced Flexible Circuit...

1. An attenuation reduction structure for a circuit board having a wiring mounting surface and a grounding line mounting surface,
a contact pad mounting section being defined on the wiring mounting surface of the circuit board, comprising:
a plurality of high frequency signal contact pads formed on the contact pad mounting section to be adjacent to and insulatively
isolated from each other;

at least one high frequency signal line formed on the wiring mounting surface of the circuit board and electrically connected
to the high frequency signal contact pads; and

a grounding layer, which is formed on the grounding line mounting surface of the circuit board, the grounding layer and the
high frequency signal lines having a reference thickness therebetween;

wherein the circuit board has an expanded thickness between the high frequency signal contact pads and the grounding layer
and the expanded thickness is greater than the reference thickness.

US Pat. No. 9,386,692

POWER SUPPLY PATH STRUCTURE OF FLEXIBLE CIRCUIT BOARD

Advanced Flexible Circuit...

1. A power supply path structure of a flexible circuit board, comprising:
a first flexible circuit board comprising a first connection section, a first opposite connection section, and a first extension
section connected between the first connection section and the first opposite connection section and extending in an extension
section, wherein the first flexible circuit board has a first surface comprising at least one first connection pad formed
thereon in the first connection section and at least one first opposite connection pad formed thereon in the first opposite
connection section and the first connection pad and the first opposite connection pad are electrically connected to each other
through a first power supply path extending across the first extension section; and

a second flexible circuit board comprising a second connection section, a second opposite connection section, and a second
extension section connected between the second connection section and the second opposite connection section, wherein the
second flexible circuit board has a second surface comprising at least one second connection pad formed thereon in the second
connection section and at least one s econd opposite connection pad formed thereon in the second opposite connection section
and the second connection pad and the second opposite connection pad are electrically connected to each other through a second
power supply path extending across the second extension section;

wherein the second flexible circuit board is arranged to correspond to and is stacked on the first flexible circuit board;
the second connection pad of the second flexible circuit board corresponds to the first connection pad of the first flexible
circuit board and the second connection pad is electrically connected through a first electric conduction structure with the
first connection pad;

the second opposite connection pad of the second flexible circuit board corresponds to the first opposite connection pad of
the first flexible circuit board and the second opposite connection pad is electrically connected through a second electric
conduction structure with the first opposite connection pad; and

the first power supply path and the second power supply path form a parallel-connected power supply path for the flexible
circuit board.

US Pat. No. 9,398,692

INTERCONNECTING CONDUCTION STRUCTURE FOR ELECTRICALLY CONNECTING CONDUCTIVE TRACES OF FLEXIBLE CIRCUIT BOARDS

Advanced Flexible Circuit...

1. An interconnecting conduction structure for conductive traces of a lapped flexible circuit board, comprising:
a first flexible circuit board, which includes a first substrate, the first substrate defining a first stacking section and
having at least one first solder pad formed in the first stacking section;

a second flexible circuit board, which includes a second substrate, the second substrate defining a second stacking section
and having at least one second solder pad formed in the second stacking section;

at least one through opening is formed in the second stacking section of the second flexible circuit board, the through opening
being formed by a hole extending through the second solder pad and a hole extending through the second substrate, wherein
a diameter of the hole extending through the second substrate is greater than a diameter of the hole extending through the
second solder pad, and a portion of the second solder pad overlays the hole extending through the second substrate; wherein
the second stacking section of the second flexible circuit board is set overlapping the first stacking section of the first
flexible circuit board and the through opening corresponds in position to the first solder pad of the first flexible circuit
board;

an interconnecting conduction member filled in the through-opening to electrically connect the second solder pad of the second
flexible circuit board to the first solder pad of the first flexible circuit board, the interconnecting conduction member
surrounds the portion of the second solder pad overlaying the hole extending through the second substrate; and,

an insulation layer formed on the first substrate, the insulation layer having a hole formed therethrough corresponding in
position to the through opening, a diameter of the hole extending through the insulation layer being greater than the diameter
of the hole extending through the second substrate, the interconnecting conduction member filling the hole in the insulation
layer.

US Pat. No. 9,468,099

CONTACT PAD CONNECTION STRUCTURE FOR CONNECTING CONDUCTOR ASSEMBLY AND FLEXIBLE CIRCUIT BOARD

Advanced Flexible Circuit...

1. A contact pad connection structure comprising:
a conductor assembly connected to a flexible circuit board;
the conductor assembly including a plurality of conductor lines spaced from each other, each of the conductor lines having
an exposed conductor extended therefrom;

the flexible circuit board including a substrate and a plurality of contact pads formed on a top surface of the substrate
and spaced from each other by spacing zones defined between the contact pads;

wherein the top surface of the substrate includes a plurality of elevation pads respectively set in the spacing zones in such
a way that each of the elevation pads has a height above a top contact surface of the contact pads;

wherein the exposed conductors of the conductor assembly are respectively set in contact with the top contact surfaces of
the contact pads and a solder material is applied to solder and fix the exposed conductors respectively in position on the
top contact surfaces of the contact pads; and

wherein the flexible circuit board further includes an insulation cover layer covering the top surface of the substrate thereof
and the conductor lines of the conductor assembly with at least a portion of the top contact surfaces of the contact pads
exposed.

US Pat. No. 9,468,101

MICROVIA STRUCTURE OF FLEXIBLE CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

Advanced Flexible Circuit...

1. A microvia structure of a flexible circuit board having a dielectric layer, a first conductive layer, and a second conductive
layer, wherein the first conductive layer and the second conductive layer are respectively formed on a first surface and a
second surface of the dielectric layer, comprising:
a first through hole formed in the first conductive layer which has a bottom surface and defines a first exposed zone on a
surface that is opposite to the bottom surface in a circumferential area adjacent to the first through hole;

a second through hole formed in the second conductive layer which has a top surface and defines a second exposed zone on the
top surface in a circumferential area adjacent to the second through hole, the second through hole corresponding to the first
through hole of the first conductive layer and the second through hole having a diameter greater than a diameter of the first
through hole;

a dielectric layer through hole formed in the dielectric layer, corresponding to the second through hole of the second conductive
layer so as to expose the first exposed zone of the first conductive layer;

a conductive paste layer filled in the second through hole of the second conductive layer, the dielectric layer through hole
of the dielectric layer, and the first through hole of the first conductive layer in such a way that the conductive paste
layer covers and electrically contacts the first exposed zone of the first conductive layer, the second exposed zone of the
second conductive layer, and a third exposed zone defined on the bottom surface of the first conductive layer about the first
through hole; and

a first insulation layer set on and covering the bottom surface of the first conductive layer, wherein a lower protective
layer is interposed between the bottom surface of the first conductive layer and the first insulation layer.

US Pat. No. 9,462,679

ATTENUATION REDUCTION GROUNDING PATTERN STRUCTURE FOR CONNECTION PADS OF FLEXIBLE CIRCUIT BOARD

Advanced Flexible Circuit...

1. An attenuation reduction grounding pattern structure for connection pads of a flexible circuit board, the flexible circuit
board comprising:
a substrate, which includes a first end, a second end, and an extension section located between the first end and the second
end and extending in an extension direction, the substrate having a surface forming a component surface and an opposite surface
forming a grounding surface;

at least a pair of high frequency connection pads, which are arranged on a connection pad laying zone defined by the component
surface of the substrate to be adjacent to and insulated from each other and being adjacent to the first end of the substrate;

at least a pair of differential mode signal lines, which are arranged on the extension section of the substrate to be adjacent
to and insulated from each other and are respectively connected to the adjacent high frequency connection pads, the at least
a pair of differential mode signal lines carrying at least one the high frequency differential mode signal, an area of connection
between the differential mode signal lines and the high frequency connection pads being defined as a transition zone;

the grounding surface of the substrate forming a grounding layer;
wherein the grounding layer includes an attenuation reduction grounding pattern structure formed at a location corresponding
to the transition zone, the attenuation reduction grounding pattern structure including:

a hollowed area, which corresponds to the connection pad laying zone, the hollowed area covering the transition zone; and
a protruded portion, which extends a predetermined length in a protrusion direction from the grounding layer toward the high
frequency connection pads and along the adjacent high frequency connection pads to reach the transition zone;

wherein the protruded portion includes a gradually reduced width so that the protruded portion has a large width connected
to the grounding layer and an increasingly reduced width in the extension direction toward the high frequency connection pads.

US Pat. No. 9,462,685

METHOD FOR PENETRATING A FLEXIBLE CIRCUIT BOARD

Advanced Flexible Circuit...

1. A method for penetrating a flexible circuit board through a bore of a hinge assembly, the flexible circuit board comprising
a first end, a second end, and an extension section extending in an extension direction between the first end and the second
end, the extension section comprising a cluster structure, the cluster structure comprising a plurality of cluster lines formed
by applying a plurality of cutting lines to cut the flexible circuit board in the extension direction, the first end of the
flexible circuit board comprising a terminal distribution section and a connection section, wherein the terminal distribution
section has a first surface and a second surface and the connection section is connected between the terminal distribution
section and the extension section, the method comprising the following steps:
(a) forming a pre-folding line between the terminal distribution section and the connection section of the first end of the
flexible circuit board, said pre-folding line being parallel to a long dimension of the connection section and a long dimension
of the terminal distribution section;

(b) with the pre-folding line as a center line, folding the connection section toward the first surface of the terminal distribution
section to make the connection section adjacent to the terminal distribution section, wherein the long dimension of the connection
section remains parallel to the long dimension of the terminal distribution section after said folding;

(c) rolling the connection section in a direction toward the terminal distribution section so as to make the resulting combination
of the connection section and the terminal distribution section form a rolled body, in which the resulting combination forms
a quasi-elliptical cylinder shape; and

(d) putting the rolled body through the bore of the hinge assembly to have the rolled body completely extending through the
bore of the hinge assembly, whereby the extension section of the flexible circuit board is positioned in the bore of the hinge
assembly and the first end and the second end are respectively located at opposite sides of the bore of the hinge assembly.

US Pat. No. 9,252,510

SOLDERING STRUCTURE FOR MOUNTING CONNECTOR ON FLEXIBLE CIRCUIT BOARD

Advanced Flexible Circuit...

1. A soldering structure for mounting at least one connector on a flexible circuit board, wherein:
the connector comprises a connector body and a plurality of SMD pins and a plurality of solder-dipping pins formed on the
connector body;

the flexible circuit board comprises a first end, a second end, at least one first extension section extending in an extension
direction between the first end and the second end, and a plurality of conductor lines formed on the first extension section,
the flexible circuit board comprising a component surface and a reinforcement bonding surface, the component surface comprising
a plurality of SMD soldering zones and a plurality of solder-dipping pin holes that are close to the SMD soldering zones formed
thereon, the reinforcement bonding surface forming an insulation covering layer which does not cover the solder-dipping pin
holes; and

the soldering structure comprising:
a reinforcement plate, which comprises a bonding surface and a soldering surface, wherein the bonding surface is mounted to
the reinforcement bonding surface of the flexible circuit board;

a plurality of through holes, which is formed in the reinforcement plate to respectively correspond to the solder-dipping
pin holes of the flexible circuit board; and

an adhesive material layer, which is interposed between the insulation covering layer of the flexible circuit board and the
bonding surface of the reinforcement plate, the adhesive material layer comprising a plurality of holes corresponding to the
through holes;

wherein the SMD pins of the connector are respectively soldered to the SMD soldering zones of the flexible circuit board and
the solder-dipping pins of the connector are inserted from the component surface of the flexible circuit board through the
solder-dipping pin holes of the flexible circuit board, the holes of the adhesive material layer, and the through holes of
the reinforcement plate, respectively, to the soldering surface of the reinforcement plate to allow the solder-dipping pins
of the connector to be soldered by a solder material to the through holes of the reinforcement plate;

wherein:
the solder-dipping pin holes of the flexible circuit board each have an inner circumferential surface on which a first conductive
layer is formed, the first conductive layer comprising an extended portion formed on the reinforcement bonding surface; and

the through holes of the reinforcement plate each have an inner circumferential surface on which a second conductive layer
is formed, the second conductive layer comprising an extended portion formed on the bonding surface of the reinforcement plate;

with the adhesive material layer bonded between the insulation covering layer and the bonding surface of the reinforcement
plate, the extended portion of the first conductive layer and the extended portion of the second conductive layer form therebetween
a solder filling gap, whereby the solder material is allowed to flow along the solder-dipping pin of the connector and the
through hole of the reinforcement plate to fill in the solder filling gap.

US Pat. No. 9,433,086

FLEXIBLE CIRCUIT BOARD WITH TEAR PROTECTION STRUCTURE

Advanced Flexible Circuit...

1. A flexible circuit board comprising:
a first connection section extending in a first connection direction, a second connection section extending in a second connection
direction, and an extension section connecting between the first connection section and the second connection section, the
extension section extending in an extension direction, the extension section including a plurality of conductor lines extending
in the extension direction, the extension section including at least a slit line formed therein, the slit line having an intermediate
portion extending in the extension direction between two terminal end portions;

wherein at least one of the terminal end portions of the slit line of the flexible circuit board includes a stress-diverting
cut segment extending therefrom in a cutting direction, the cutting direction being angularly directed to be transverse with
respect to both the extension direction and a corresponding one of the first connection direction and the second connection
direction, the stress-diverting cut segment being of substantially same width as the intermediate portion of the slit line
to form a tear protection structure for the flexible circuit board to divert stress away from the slit line, the flexible
circuit board having an outer edge with a notch formed therein at a location corresponding to the slit line and spaced therefrom,
the extension section of the flexible circuit board being foldable about the slit line and the notch for folding the flexible
circuit board.

US Pat. No. 9,204,561

METHOD OF MANUFACTURING A STRUCTURE OF VIA HOLE OF ELECTRICAL CIRCUIT BOARD

Advanced Flexible Circuit...

1. A method for manufacturing an electrical circuit board, comprising the following steps:
(a) manufacturing a carrier board, the carrier board being a flexible circuit board, the carrier board comprising a first
substrate, which has a substrate upper surface and a substrate lower surface, the substrate upper surface comprising at least
one upper circuit trace;

(b) forming an upper adhesive layer on the upper circuit trace;
(c) forming an upper adhesive layer opening zone in a portion of the upper adhesive layer that exposes a portion of the upper
circuit trace thus forming an upper circuit trace exposed zone;

(d) filling an etching resisting layer in the upper adhesive layer opening zone;
(e) forming an upper conductor layer on the upper adhesive layer and the etching resisting layer, the upper conductor layer
showing a first height difference with respect to the upper circuit trace exposed zone of the upper circuit trace in a vertical
direction;

(f) forming a lower conductor layer on the substrate lower surface of the carrier board, the lower conductor layer having
a lower conductor layer bottom surface;

(g) forming at least one through hole, which extends in the vertical direction through the upper conductor layer, the upper
adhesive layer, the upper circuit trace, the first substrate and the lower conductor layer and forms a hole wall surface,
the through hole having a circumferential zone defining a through hole local zone;

(h) forming a conductive cover section to cover the hole wall surface of the through hole, the upper conductor layer, and
the lower conductor layer bottom surface of the lower conductor layer so as to have the upper conductor layer, the upper circuit
trace, and the lower conductor layer to electrically connect with each other through the conductive cover section; and

(i) removing a portion of the conductive cover section that is outside the through hole local zone and a portion of the upper
conductor layer that is outside the through hole local zone.

US Pat. No. 9,225,134

PENETRATION AND ASSEMBLY STRUCTURE FOR FLEXIBLE CIRCUIT BOARD WITH HINGE ASSEMBLY

Advanced Flexible Circuit...

1. A flexible circuit board having a structure for penetration and assembly through a bore of a hinge assembly, the flexible
circuit board comprising:
a first end;
a second end; and
an extension section extending in an extension direction and arranged between the first end and the second end;
the first end of the flexible circuit board including:
a terminal distribution section having a plurality of isolated conductive terminals;
a connection section extending from an edge of the terminal distribution section to define a planar surface therewith, wherein
the connection section is connected between the terminal distribution section and the extension section; and

an extended sheet attached at an attaching section on the planar surface, the extended sheet including a wing extending from
the attaching section to form a flexible flap structure covering a portion of the planar surface and terminating beyond a
peripheral edge of the connection section;

wherein a rolled body is formed by folding the connection section along a pre-folding line towards the terminal distribution
section, and wrapping the wing about the connection section and the terminal distribution section;

the rolled body being thereby configured to pass through the bore of the hinge assembly for guiding the extension section
of the flexible circuit board through the bore of the hinge assembly and dispose the first and second ends emerging from opposite
ends of the bore of the hinge assembly; the wing of the extended sheet being unwrapped to release the connection and terminal
distribution sections to a flat and expanded condition.

US Pat. No. 9,271,392

RIGID FLEXIBLE CIRCUIT BOARD WITH IMPEDANCE CONTROL

Advanced Flexible Circuit...

1. A circuit board with an impedance control structure, comprising:
at least one flexible circuit board, which defines a stacking section and an extension section, the extension section extending
from an end of the stacking section, the flexible circuit board comprising:

a flexible-board substrate, which extends in an extension direction and comprises an upper surface and a lower surface;
a plurality of first flexible-board differential mode signal lines, which is formed on the upper surface of the flexible-board
substrate and extends in the extension direction from the stacking section to the extension section;

at least one first flexible-board grounding line, which is formed on the upper surface of the flexible-board substrate and
extends in the extension direction;

and a first flexible-board insulation layer, which is formed on the upper surface of the flexible-board substrate and covers
the first flexible-board differential mode signal lines and the first flexible-board grounding line; and

at least one first rigid circuit board, comprising:
a first rigid-board substrate, which comprises an upper surface and a lower surface, the lower surface corresponding to and
stacked on the stacking section of the flexible circuit board;

a plurality of first rigid-board differential mode signal lines, which is formed on the upper surface of the first rigid-board
substrate and extends in the extension direction;

a first shielding layer, which is formed on the first flexible-board insulation layer of the flexible circuit board and corresponds
to the extension section of the flexible circuit board, the first shielding layer being connected through at least one first
via hole to the first flexible-board grounding line; and

a first impedance control structure, which is formed on the first shielding layer and corresponds to the first flexible-board
differential mode signal lines of the flexible circuit board, whereby the first impedance control structure controls impedance
of the first flexible-board differential mode signal lines; and

wherein: the lower surface of the first rigid-board substrate of the first rigid circuit board comprises an extended grounding
section formed thereon, the extended grounding section extending beyond an end of the first rigid-board substrate that laces
the extension section to form an extended section; and the first shielding layer has at least one portion adjacent the extended
section to cover and electrically connect with the extended section.

US Pat. No. 9,173,284

FLEXIBLE CIRCUIT BOARD WITH PLANARIZED COVER LAYER STRUCTURE

Advanced Flexible Circuit...

1. A flexible circuit board with a planarized cover layer structure, comprising:
a substrate, which comprises a first surface and a second surface;
a conductor layer, which is bonded to the first surface of the substrate, the conductor layer comprising a plurality of extended
conductive signal lines, the conductive signal lines being spaced from each other by a predetermined distance so as to define
a separation area between adjacent ones of the conductive signal lines;

a first adhesive layer, which is formed on a surface of the conductor layer;
an insulation cover layer, which is laminated through the first adhesive layer on the surface of the conductor layer; and
a first metal layer disposed on the insulation cover layer;
wherein the separation areas between the conductive signal lines of the conductor layer are respectively formed with a filling
layer, whereby the filling layer provides the first adhesive layer with a planarization height in the separation areas and
the planarization height is substantially equal to height of the conductive signal lines.

US Pat. No. 9,913,369

CIRCUIT BOARD STRUCTURE WITH SELECTIVELY CORRESPONDING GROUND LAYERS

Advanced Flexible Circuit...

1. A circuit board structure, comprising:
a substrate extending in an extension direction and including a conductor-laying surface and a grounding surface;
a first ground layer formed on the grounding surface of the substrate;
a plurality of spaced conductor wires arranged on the conductor-laying surface, the plurality of conductor wires being selectively
classified and divided into a first group of conductor wires and a second group of conductor wires respectively extending
along a plurality of laying paths, the first and second groups of conductor wires being disposed in substantially coplanar
arrangement on the conductor-laying surface of the substrate;

a second ground layer located below the first ground layer;
a dielectric layer arranged between the first ground layer and the second ground layer to define a ground layer height difference
between the first ground layer and the second ground layer;

wherein the first-group conductor wires are arranged to electromagnetically couple to the first ground layer, the second-group
conductor wires are arranged to electromagnetically couple to the second ground layer, and the first ground layer defining
a plurality of non-electromagnetic shield areas interposed between adjacent grounding segments extend along the laying path
of the second-group conductor wires, the second-group conductor wires electromagnetically coupling to the second ground layer
through the non-electromagnetic shield areas respectively.

US Pat. No. 9,072,192

COMPOSITE FLEXIBLE CIRCUIT PLANAR CABLE

Advanced Flexible Circuit...

1. A composite flexible circuit planar cable, comprising:
a flat cable, having a first end, a second end, and a plurality of parallel and non-jumping conductor lines extending and
laid in the form of a flat cable between the first end and the second end;

a first section, having a flat cable connection end, an external connection end, and a first plurality of conductive lines
extending and laid between the flat cable connection end and the external connection end, the flat cable connection end of
the first section being connected to the first end of the flat cable and electrically connected to the conductor lines extending
to the first end of the flat cable, each of said first plurality of conductive lines being positioned to define a first arrangement
of said first plurality of conductive lines with said parallel and non jumping conductor lines; and

a second section, having a flat cable connection end, an external connection end, and a second plurality of conductive lines
extending and laid between the flat cable connection end and the external connection end, the flat cable connection end of
the second section being connected to the second end of the flat cable and electrically connected to the conductor lines extending
to the second end of the flat cable, each of said second plurality of conductive lines being positioned to define a second
arrangement of said second plurality of conductive lines with said parallel and non-jumping conductor lines, said first arrangement
being different from said second arrangement, wherein the first section comprises at least one jumping line, the jumping line
interchangeably connecting a selected first conductive line of the first section to another selected conductive line of said
flat cable;

wherein the plurality of conductor lines of the flat cable comprise at least a pair of differential signal conductor lines,
the first plurality of conductive lines of the first section comprising first differential signal lines corresponding to the
differential signal conductor lines, the second plurality of conductive lines of the second section comprising second differential
signal lines corresponding to the differential signal conductor lines; and

wherein the plurality of conductor lines of the flat cable comprises at least one grounding line, the first plurality of conductive
lines of the first section comprising a first grounding conductive line corresponding to the grounding line, the second plurality
of conductive lines of the second section comprising a second grounding conductive line corresponding to the grounding line.

US Pat. No. 9,077,168

DIFFERENTIAL MODE SIGNAL TRANSMISSION MODULE

Advanced Flexible Circuit...

1. A differential mode signal transmission module for transmitting a differential mode signal, comprising:
a first section having an external connection end and an extension connection end, wherein:
the external connection end having plurality of differential mode signal transmission terminals, each of the differential
mode signal transmission terminals having a grounding terminal, a first differential mode signal terminal, and a second differential
mode signal terminal;

the extension connection end having a corresponding plurality of counterpart differential mode signal transmission terminals,
each counterpart terminal having corresponding first and second differential mode signal terminals, the extension connection
end further having a certain number of collective grounding points;

at least one first conductive connection line formed on a surface of the first section, the at least one first conductive
connection line connecting at least a portion of the plurality of grounding terminals from the external connection end of
the first section to at least one of the certain number of the collective grounding points formed at the extension connection
end of the first section, the certain number of collective grounding points being fewer than a total number of the differential
mode signal transmission terminals at the external connection end of the first section;

an extension section having a first end coupled to the extension connection end of the first section and an opposing second
end, and a plurality of parallel conductor wires extending in an extension direction between corresponding first signal terminals
at the first end and second signal terminals at the second end, the first signal terminals being connected to corresponding
said first differential mode signal terminals, said second differential mode signal terminals, and said collective grounding
points of the extension connection end of the first section; and

a second section coupled to the second end of the extension section, the second section having an external connection end
and an extension connection end, wherein:

the extension connection end of the second section having a plurality of counterpart differential mode signal transmission
terminals corresponding to the counterpart differential mode signal transmission terminals of the extension connection end
of the first section, each terminal having corresponding first and second differential mode signal terminals, the extension
connection end of the second section further having a number of collective grounding points equal to the certain number of
collective grounding points of the extension connection end of the first section, wherein the second signal terminals of the
extension section are connected to corresponding said first differential mode signal terminals, said second differential mode
signal terminals, and said collective grounding points formed on the extension connection end of the second section;

the external connection end of the second section having a plurality of differential mode signal transmission terminals corresponding
to the plurality of differential mode signal transmission terminals of the external connection end of the first section, each
of the differential mode signal transmission terminals of the external connection end of the second section having a grounding
terminal, a first differential mode signal terminal, and a second differential mode signal terminal;

at least one second conductive connection line formed on a surface of the second section, the at least one second conductive
connection line connecting at least one of the collective grounding points formed at the extension connection end of the second
section to at least a portion of the plurality of grounding terminals in the external connection end of the second section,
the number of collective grounding points being fewer than a total number of the differential mode signal transmission terminals
at the external connection end of the second section.

US Pat. No. 9,942,984

ATTENUATION REDUCTION STRUCTURE FOR FLEXIBLE CIRCUIT BOARD

Advanced Flexible Circuit...

1. A flexible circuit board, comprising:a dielectric layer having a top surface;
a plurality of pairs of signal lines disposed for high-frequency applications adjacent to and insulated from each other, the signal lines being formed on the top surface of the dielectric layer;
an insulation layer formed on the plurality of pairs of signal lines and the top surface of the dielectric layer;
a plurality of conductive paste coating zones formed on the insulation layer and respectively corresponding to the plurality of pairs of signal lines;
an anisotropic conductive film formed on the insulation layer and the conductive paste coating zones, made of different material composition from the conductive paste coating zones and including an insulation resin material containing a plurality of conductive particles therein; and
a shielding layer formed on the anisotropic conductive film to span contiguously over the pairs of signal lines;
wherein the conductive paste coating zones are disposed in embedded manner within the anisotropic conductive film, regions of the anisotropic conductive film thereby extending between the conductive paste coating zones and the shielding layer to establish an electrical connection between the conductive paste coating zones and the shielding layer in a vertical direction therethrough.

US Pat. No. 9,578,747

STRUCTURE OF VIA HOLE OF ELECTRICAL CIRCUIT BOARD

Advanced Flexible Circuit...

1. An electrical circuit board, comprising: a carrier board, which is a flexible circuit board, the carrier board including
a first substrate, which has a substrate upper surface and a substrate lower surface, the substrate upper surface including
at least one upper circuit trace; an upper adhesive layer, which is formed on at least a partial area of the upper circuit
trace, an upper adhesive layer opening zone is formed in a portion of the upper adhesive layer thus forming an upper circuit
trace exposed zone; an etching resisting layer, which is filled in the upper adhesive layer opening zone; an upper conductor
layer, which is formed on the upper adhesive layer and the etching resisting layer, the upper conductor layer showing a first
height difference with respect to the upper circuit trace exposed zone in a vertical direction; a lower adhesive layer, which
is formed on at least a partial area of the lower circuit trace, a portion of the lower circuit trace that is not covered
by the lower adhesive layer forming a lower circuit trace exposed zone, the lower adhesive layer including a lower adhesive
layer opening zone corresponding to the lower circuit trace exposed zone; a lower conductor layer, which is formed on the
substrate lower surface of the carrier board, the lower conductor layer having a lower conductor layer bottom surface; at
least one through hole, which extends in the vertical direction through the upper conductor layer, the upper adhesive layer,
the upper circuit trace, the first substrate, and the lower conductor layer and forms a hole wall surface, the through hole
having a circumferential zone defining a through hole local zone; and a conductive cover section, which covers the hole wall
surface of the through hole, a portion of the upper conductor layer top surface of the upper conductor layer in the through
hole local zone, and the lower conductor layer bottom surface of the lower conductor layer, a portion of the conductive cover
section that is outside the through hole local zone, and a portion of the upper conductor layer that is outside the through
hole local zone being removed.

US Pat. No. 9,577,304

ATTENUATION REDUCTION STRUCTURE FOR HIGH FREQUENCY SIGNAL CONNECTION PADS OF CIRCUIT BOARD WITH INSERTION COMPONENT

Advanced Flexible Circuit...

1. An attenuation reduction structure for high-frequency connection pads of a circuit board with an insertion component, wherein:
the circuit board comprises a substrate, the substrate comprising a lower surface, an upper surface, a first end, a second
end, and an extension section connected between the first end and the second end, the extension section extending in an extension
direction;

at least one pair of lower connection pads are formed on a lower surface of the substrate to be adjacent to and spaced from
each other;

at least one pair of upper connection pads are formed in a via arrangement zone defined in an upper surface to the substrate
to be adjacent to and spaced from each other and respectively corresponding to the lower connection pads;

at least one pair of differential mode signal lines are formed on the extension section of the substrate to be adjacent to
and spaced from each other and respectively connected to the adjacent upper connection pads, the at least one pair of differential
mode signal lines transmitting at least one high-frequency differential mode signal, a site where the differential mode signal
lines and the upper connection pads are connected to each other being defined as a transition zone;

a plurality of vias is arranged in the via arrangement zone, the vias respectively extending through and connected to the
upper connection pads and the lower connection pads; and

the insertion component comprises a component body and a plurality of insertion pins extending from the component body;
characterized in that:
the lower surface of the substrate comprises a first metal layer formed thereon, the first metal layer comprising an attenuation
reduction grounding pattern structure formed at a location corresponding to the transition zone, the attenuation reduction
grounding pattern structure comprising:

a hollow area, which corresponds to the via arrangement zone, the hollow area covering the transition zone; and
at least one pair of protruded portions, which extends from the first metal layer in a direction toward the lower connection
pads so as to extend a predetermined length to the transition zone and respectively correspond to the differential mode signal
lines.

US Pat. No. 9,775,249

FLEXIBLE CIRCUIT BOARD COMBINED WITH CARRIER BOARD AND MANUFACTURING METHOD THEREOF

Advanced Flexible Circuit...

1. A method for manufacturing a flexible circuit board, comprising the following steps:
(a) providing a first carrier board comprising:
a first thick copper layer;
a first thin copper layer, which has a top surface and a bottom surface; and
a first release layer, which is formed between the first thick copper layer and the top surface of the first thin copper layer;
(b) providing a flexible circuit substrate, which has a first surface and a second surface, wherein the second surface of
the flexible circuit substrate comprises a bottom copper layer formed thereon;

(c) bonding the first surface of the flexible circuit substrate to the bottom surface of the first thin copper layer of the
first carrier board with a first adhesive layer;

(d) forming at least one through hole extending through the first thick copper layer, the first release layer, the first thin
copper layer, the first adhesive layer, the flexible circuit substrate, and the bottom copper layer, the through hole having
a hole wall surface; and

(e) forming a first electroplating layer on a top surface of the first thick copper layer, the hole wall surface, and a bottom
surface of the bottom copper layer.

US Pat. No. 10,219,379

STACKED FLEXIBLE PRINTED CIRCUIT BOARD ASSEMBLY WITH SIDE CONNECTION SECTION

Advanced Flexible Circuit...

1. A stacked flexible printed circuit board assembly, comprising:a first flexible printed circuit board including a first plugging section and a first extension section extending from the first plugging section in an extension direction, the first plugging section including a first bonding surface and a first exposed surface, the first flexible printed circuit board being delimited with a first outer side edge and a first inner side edge;
a plurality of first circuit traces arranged in the extension direction on the first extension section of the first flexible printed circuit board;
a plurality of first contact pads arranged in a manner of being spaced from each other on the first plugging section of the first flexible printed circuit board and are located on the first exposed surface and connected to the plurality of first circuit traces;
a second flexible printed circuit board including a second plugging section and a second extension section extending from the second plugging section in the extension direction, the first extension section of the first flexible printed circuit board and the second extension section of the second flexible printed circuit board being stacked and enclosed with an enclosure protection layer, the second plugging section including a second bonding surface and a second exposed surface, the second plugging section being a plugging terminal section located adjacent to the second flexible printed circuit board, the second flexible printed circuit board being delimited with a second outer side edge and a second inner side edge;
a plurality of second circuit traces arranged in the extension direction on the second extension section of the second flexible printed circuit board;
a plurality of second contact pads arranged in a manner of being spaced from each other on the second plugging section of the second flexible printed circuit board and are located on the second exposed surface and connected to the plurality of second circuit traces;
a curved connection section integrally connected to and between the first inner side edge of the first flexible printed circuit board and the second inner side edge of the second flexible printed circuit board, the first bonding surface of the first flexible printed circuit board being folded in a direction toward and stacked on the second bonding surface of the second flexible printed circuit board so that the curved connection section forms a curved continuous surface and the plurality of first contact pads of the first flexible printed circuit board respectively correspond to the plurality of second contact pads of the second flexible printed circuit board; and
a height adjustment layer, which is combined between the first bonding surface of the first flexible printed circuit board and the second bonding surface of the second flexible printed circuit board.