US Pat. No. 10,412,866

COVER FILM

ASIA ELECTRONIC MATERIAL ...

1. A cover film, comprising:a conductive adhesive layer;
an electromagnetic shielding layer formed on the conductive adhesive layer and having a thickness of 0.01 to 25 micrometers;
an electromagnetic absorption layer formed on the electromagnetic shielding layer, wherein the electromagnetic shielding layer is sandwiched between the conductive adhesive layer and the electromagnetic absorption layer, and wherein the electromagnetic absorption layer has a thickness of from 0.1 to 25 micrometers; and
an insulating layer formed on the electromagnetic shielding layer, wherein the electromagnetic absorption layer is sandwiched between the electromagnetic shielding layer and the insulating layer.

US Pat. No. 11,116,074

COLORED THIN COVERING FILM AND MANUFACTURING METHOD

ASIA ELECTRONIC MATERIAL ...


1. A colored thin covering film, comprising:an upper detached layer;
a colored ink layer formed on the upper detached layer and having a thickness of from 1 ?m to 10 ?m;
a low dielectric glue layer formed on the colored ink layer to sandwich the colored ink layer between the upper detached layer and the low dielectric glue layer, the low dielectric glue layer having a thickness of from 3 ?m to 25 ?m for a total thickness between the colored ink layer and the low dielectric glue layer to be from 4 ?m to 35 ?m; and
a lower detached layer formed on the low dielectric glue layer to sandwich the low dielectric glue layer between the colored ink layer and the lower detached layer,
wherein the low dielectric glue layer comprises sintered silicon dioxide, polytetrafluoroethylene, a fluorine-based resin excluded from polytetrafluoroethylene, a phosphorus-based flame retardant, and a polyimide resin, with a total content of the sintered silicon dioxide, the polytetrafluoroethylene, the fluorine-based resin excluded from polytetrafluoroethylene, and the phosphorus-based flame retardant to be from 8 wt % to 50 wt % of a total solid content of the low dielectric glue layer, and the polyimide resin has a content from 40 wt % to 90 wt % of the total solid content of the low dielectric glue layer,
wherein the sintered silicon dioxide has a content from 2 wt % to 15 wt % of the total solid content of the low dielectric glue layer, the polytetrafluoroethylene has a content from 2 wt % to 10 wt % of the total solid content of the low dielectric glue layer, the fluorine-based resin excluded from polytetrafluoroethylene has a content from 2 wt % to 10 wt % of the total solid content of the low dielectric glue layer, and the phosphorus-based flame retardant has a content from 2 wt % to 15 wt % of the total solid content of the low dielectric glue layer.

US Pat. No. 10,822,529

MULTI-LAYERED ANISOTROPIC CONDUCTIVE ADHESIVE HAVING CONDUCTIVE FABRIC AND PREPARATION THEREOF

ASIA ELECTRONIC MATERIAL ...

1. A multi-layered anisotropic conductive adhesive, comprising:an upper conductive adhesive layer having a thickness of from 20 ?m to 40 ?m;
a lower conductive adhesive layer having a thickness of from 20 ?m to 40 ?m, wherein the upper conductive adhesive layer and the lower conductive adhesive layer each comprise a plurality of metal conductive particles having particle sizes in a range of form 2 ?m to 50 ?m, and wherein the plurality of metal conductive particles are composed of a mixture including a plurality of dendritic metal conductive particles, a plurality of acicular metal conductive particles and a plurality of flaky metal conductive particles, and a weight ratio of the plurality of dendritic metal conductive particles to the plurality of acicular metal conductive particles is from 1:5 to 5:1, a weight ratio of the plurality of the plurality of acicular metal conductive particles to the plurality of flaky metal conductive particles is from 1:4 to 4:1;
a conductive fabric layer having an upper side and a lower side with a thickness of from 5 ?m to 30 ?m, the conductive fabric layer being formed between the upper conductive adhesive layer and the lower conductive adhesive layer for the multi-layered anisotropic conductive adhesive to have a total thickness of 40 ?m to 60 ?m; and
a metal layer coated on at least one of the upper side and the lower side of the conductive fabric layer.